Negative-pressure drip-proof PCB (Printed Circuit Board) tin stripping liquid filling and sealing device and filling process

Abstract

The invention relates to the technical field of tin stripping liquid filling, in particular to a negative-pressure drip-proof PCB tin stripping liquid filling and sealing device and a filling process, the negative-pressure drip-proof PCB tin stripping liquid filling and sealing device comprises a lifting plate and a fixing rod fixedly mounted on the lifting plate, and a fixing disc is fixed to the end of the fixing rod; the clamping and rotating mechanism is arranged on the lifting plate, a limiting wheel and symmetrically arranged clamping plates are connected to the clamping and rotating mechanism, and the clamping and rotating mechanism can drive the limiting wheel to move and control the clamping plates to move close to each other or away from each other; the pumping mechanism is arranged on the fixing disc, a conveying pipe is connected to the pumping mechanism, and a follow-up rotating assembly matched with the limiting wheel is arranged on the pumping mechanism; the negative pressure suction mechanism is arranged on the pumping mechanism and connected with the conveying pipe, and after the tin stripping liquid is conveyed, negative pressure is controlled to be formed in the conveying pipe through the negative pressure suction mechanism, so that it is ensured that the residual tin stripping liquid in the conveying pipe does not leak.

Description

Technical Field

[0001] This invention relates to the field of PCB tin stripping solution filling technology, specifically a negative pressure anti-drip PCB tin stripping solution filling and sealing device and filling process. Background Technology

[0002] Tin stripping solution, also known as tin stripping liquid, tin stripping agent, tin remover, or etching solution, is a professional tin stripping agent used in the chemical industry. This product is a single-component, peroxide-free, fluorine-free, and complexing agent-free high-efficiency tin and lead stripping solution.

[0003] The principle of solder stripping solution is to immerse the circuit board in the solution to peel off the coating and tin layer on the surface. Solder stripping solution is suitable for removing lead-tin soldering materials, solder from old faulty circuit boards, and copper, silver and other impurities attached to the surface.

[0004] When producing solder stripping solution, it is necessary to fill and seal the solution. The existing filling method is to place the tank under the filling equipment and add the solder stripping solution into the tank through the filling equipment. However, after filling, there may be some solder stripping solution remaining in the filling pipe of the filling equipment. Under the action of gravity, the stripping solution will drip out of the pipe, causing damage to the external environment and wasting the solder stripping solution. Summary of the Invention

[0005] The purpose of this invention is to provide a negative pressure anti-drip PCB solder stripping solution filling and sealing device and filling process to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A negative pressure, anti-drip PCB solder stripping solution filling and sealing device, comprising:

[0008] A lifting plate, and a fixing rod fixedly installed on the lifting plate, wherein a fixing plate is fixed to the end of the fixing rod;

[0009] Also includes:

[0010] A clamping and rotating mechanism is provided on the lifting plate. The clamping and rotating mechanism is connected to a limit wheel and clamping plates arranged symmetrically. The clamping and rotating mechanism can drive the limit wheel to move and control the clamping plates to move closer or further apart from each other.

[0011] A pumping mechanism is mounted on the fixed plate. A delivery pipe is connected to the pumping mechanism. A follower rotating component that cooperates with the limiting wheel is mounted on the pumping mechanism. The follower rotating component can move when the limiting wheel moves so as to deliver the solution into the delivery pipe through the pumping mechanism.

[0012] A negative pressure suction mechanism is installed on the pumping mechanism and connected to the conveying pipe. The negative pressure suction mechanism can operate after the material is fed through the conveying pipe and adjust the conveying pipe to a negative pressure state.

[0013] As a further embodiment of the present invention: the clamping and rotating mechanism includes a rotating sleeve rotatably mounted on the lifting plate, a rotating plate fixed at the end of the rotating sleeve, and a plurality of support rods equidistantly distributed in a circle fixed on the rotating plate, and a sliding component provided on the support rods.

[0014] As a further embodiment of the present invention: the sliding assembly includes a support plate fixedly installed at the end of the support rod, the support plate being rotatably connected to the limiting wheel, the support plate having grooves on both sides, a sliding block being slidably installed in the groove, the sliding block being fixedly connected to the clamping plate, and a pushing structure connected to the sliding block being provided on the support rod.

[0015] As a further embodiment of the present invention: the pushing structure includes a cylinder fixedly mounted on the rotating plate, a sliding sleeve slidably mounted on the support rod and fixedly connected to the output end of the cylinder, and connecting rods hinged to the sliding block on both sides of the sliding sleeve.

[0016] As a further embodiment of the present invention: the pumping mechanism includes receiving rods fixedly installed on the fixed plate and arranged symmetrically, a piston cylinder is fixedly attached to the end of the receiving rod, the piston cylinder is fixedly connected to the conveying pipe, a rotating rod is rotatably installed on the fixed plate and passes through the piston cylinder, and a guide assembly connected to the rotating rod is provided inside the piston cylinder.

[0017] As a further embodiment of the present invention: the guide assembly includes an annular spiral groove formed on the rotating rod, a guide column symmetrically arranged is fixed inside the piston cylinder, a piston disc slidably mounted on the guide column and slidably connected to the rotating rod, and a first limiting block slidably connected to the annular spiral groove is fixed on the inner wall of the piston disc.

[0018] As a further embodiment of the present invention: the follower rotation assembly includes a first movable sleeve slidably mounted on the rotating rod, a movable plate slidably connected to the receiving rod is fixed on the first movable sleeve, a limiting plate cooperating with the limiting wheel is fixed on the movable plate, and a first spring abutting against the movable plate is sleeved on the receiving rod;

[0019] It also includes a guide groove formed on the rotating rod, and a second limiting block that is slidably connected to the guide groove is fixed on the inner wall of the first movable sleeve.

[0020] As a further embodiment of the present invention: the negative pressure suction mechanism includes a hollow tube fixedly installed on the delivery pipe, a sealing disc slidably installed inside the hollow tube, a push rod fixed to the side wall of the sealing disc penetrating the hollow tube, a receiving plate fixed to the end of the push rod, and a guide component connected to the receiving plate provided on the rotating rod.

[0021] As a further embodiment of the present invention: the guiding component includes a limiting groove formed on the rotating rod, a second movable sleeve is slidably mounted on the rotating rod, the second movable sleeve is fixedly connected to the receiving plate, a third limiting block is fixed on the inner wall of the second movable sleeve and slidably connected to the limiting groove, and a second spring is sleeved on the rotating rod and abuts against the receiving plate.

[0022] A negative pressure anti-drip PCB solder stripping solution filling process includes the following steps:

[0023] Step 1: Place the container for removing solder between the clamping plates. Under the action of the clamping rotation mechanism, control the clamping plates to move towards each other to fix the container.

[0024] Step 2: The clamping and rotating mechanism will also drive the tank to move downwards towards the delivery pipe via the clamping plate, and drive the limit wheel to move;

[0025] Step 3: When the limit wheel moves to the position that engages with the follow-up rotating component, it drives the pumping mechanism to move, so that the solder stripping solution is transported into the tank through the delivery pipe;

[0026] Step 4: After the solder stripping solution is delivered, the pumping mechanism will also drive the negative pressure suction mechanism to create negative pressure inside the delivery pipe, ensuring that the residual solder stripping solution inside the delivery pipe will not drip.

[0027] Compared with the prior art, the beneficial effects of the present invention are as follows: After the solder stripping solution is transported, the present application can automatically control the formation of negative pressure in the transport pipe to ensure that the solder stripping solution does not drip. When the clamping and rotating mechanism moves, it can control the two clamping plates to move toward each other to clamp the can. After clamping, under the action of the clamping and rotating mechanism, the can moves to the position that matches the transport pipe. The clamping and rotating mechanism also drives the limit wheel to move. When the limit wheel matches the follower rotating component, it drives the follower rotating component to move, thereby driving the pumping mechanism to move to transport the solder stripping solution into the can through the transport pipe. After the solder stripping solution is transported, under the action of the negative pressure suction mechanism, the solder stripping solution remaining in the transport pipe is suctioned by negative pressure to ensure that the solder stripping solution does not drip. Attached Figure Description

[0028] Figure 1 A schematic diagram of one embodiment of a negative pressure anti-drip PCB solder stripping solution filling and sealing device.

[0029] Figure 2 This is a schematic diagram of the structure of a negative pressure anti-drip PCB solder stripping solution filling and sealing device from another angle in one embodiment.

[0030] Figure 3 A schematic diagram of the clamping and rotating mechanism in one embodiment of a negative pressure anti-drip PCB solder stripping solution filling and sealing device.

[0031] Figure 4 This is a schematic diagram showing the connection relationship between a portion of the pumping mechanism, a portion of the follow-up rotating component, and a portion of the negative pressure suction mechanism in one embodiment of a negative pressure anti-drip PCB solder stripping solution filling and sealing device.

[0032] Figure 5 for Figure 4 A schematic diagram of the half-section structure.

[0033] Figure 6 This is a schematic diagram of a portion of the clamping and rotating mechanism in one embodiment of a negative pressure anti-drip PCB solder stripping solution filling and sealing device.

[0034] Figure 7 An exploded view of part of the clamping and rotating mechanism in one embodiment of a negative pressure anti-drip PCB solder stripping solution filling and sealing device.

[0035] Figure 8 A schematic diagram of the rotating rod in one embodiment of a negative pressure anti-drip PCB solder stripping solution filling and sealing device.

[0036] Figure 9 for Figure 8 A magnified schematic diagram of the structure at point A in the middle.

[0037] Figure 10 This is a schematic diagram of the structure of a rotating rod at another angle in one embodiment of a negative pressure anti-drip PCB solder stripping solution filling and sealing device.

[0038] Figure 11 This is an exploded structural diagram of part of the negative pressure suction mechanism and part of the follow-up rotating component in one embodiment of a negative pressure anti-drip PCB solder stripping solution filling and sealing device.

[0039] In the diagram: 1. Lifting plate; 2. Rotating sleeve; 3. Rotating plate; 4. Support rod; 5. Sliding sleeve; 6. Support plate; 601. Slide groove; 7. Sliding block; 8. Clamping plate; 9. Cylinder; 10. Connecting rod; 11. Limiting wheel; 12. Fixed rod; 13. Fixed plate; 14. Rotating rod; 1401. First straight groove; 1402. First spiral groove; 1403. Second straight groove; 1404. Second spiral groove; 1405. First annular groove; 1406. Third spiral groove; 1407. 1408. Annular groove; 1409. Vertical groove; 1401. Annular spiral groove; 15. Piston cylinder; 16. Guide column; 17. Piston disc; 1701. First limiting block; 18. Receiving rod; 19. Movable plate; 20. First spring; 21. First movable sleeve; 2101. Second limiting block; 22. Limiting plate; 23. Conveying pipe; 24. Hollow pipe; 25. Sealing disc; 26. Push rod; 27. Second movable sleeve; 2701. Third limiting block; 28. Receiving plate; 29. ​​Second spring. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] Furthermore, elements in this invention are referred to as being "fixed to" or "set on" another element, which may be directly on the other element or may also include an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or may also include an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0042] Please see Figures 1-11 In this embodiment of the invention, a negative pressure anti-drip PCB solder stripping solution filling and sealing device includes:

[0043] A lifting plate 1 and a fixing rod 12 fixedly installed on the lifting plate 1, wherein a fixing plate 13 is fixed to the end of the fixing rod 12;

[0044] Also includes:

[0045] Please see Figures 1-3 , Figure 6 , Figure 7A clamping and rotating mechanism is disposed on the lifting plate 1. A limiting wheel 11 and symmetrically arranged clamping plates 8 are connected to the clamping and rotating mechanism. The clamping and rotating mechanism can drive the limiting wheel 11 to move and control the clamping plates 8 to move closer or further apart. The clamping and rotating mechanism includes a rotating sleeve 2 rotatably mounted on the lifting plate 1. A rotating plate 3 is fixed to the end of the rotating sleeve 2. Multiple support rods 4 are fixed on the rotating plate 3 at equal intervals around the circumference. A sliding assembly is disposed on each support rod 4, wherein the sliding assembly includes components fixedly mounted on the support rods. The support plate 6 at the end of the 4 is rotatably connected to the limiting wheel 11. The support plate 6 has a sliding groove 601 on both sides. A sliding block 7 is slidably installed in the sliding groove 601. The sliding block 7 is fixedly connected to the clamping plate 8. The support rod 4 is provided with a pushing structure connected to the sliding block 7. The aforementioned pushing structure includes a cylinder 9 fixedly installed on the rotating plate 3. A sliding sleeve 5 is slidably installed on the support rod 4 and fixedly connected to the output end of the cylinder 9. The sliding sleeve 5 is hinged to the sliding block 7 on both sides.

[0046] In detail, the clamping plates 8 are symmetrically arranged, and there are four sets, which are used to clamp and transport the cans between two clamping plates 8, transport the clamped cans to the filling position, transport the filled cans to the sealing equipment, and transport the sealed cans to the storage position. Taking the initial clamping of the cans as an example, in the initial state, under the action of the cylinder 9, the sliding sleeve 5 is located at the end of its stroke away from the rotating plate 3, thereby controlling the distance between the two sliding blocks 7 to be the maximum through the connecting rod 10, and the sliding blocks 7 are located at the end of their stroke on one side of the slide groove 601, so that the distance between the two clamping plates 8 is the maximum. When the cans to be filled are transported between the two clamping plates 8, at this time... When cylinder 9 operates, it drives the sliding sleeve 5 to move away from the support plate 6. This, in turn, controls the two sliding blocks 7 to move along the length of the slide groove 601 and towards each other via connecting rod 10, thereby reducing the distance between the two clamping plates 8. Once the two clamping plates 8 have fixed the can, cylinder 9 stops operating. At this point, under the action of an external motor, the rotating sleeve 2 is controlled to rotate, thereby driving the rotating plate 3 to move. The rotating plate 3 also controls the support plate 6 to move via support rod 4, so that the clamped can is transported to the filling position via the clamping plates 8. When the rotating sleeve 2 rotates a quarter turn, the can is just below the filling position, and the can can be filled.

[0047] Preferably, after filling is completed, the rotating sleeve 2 rotates another quarter turn to transport the can to the sealing equipment for sealing. After sealing is completed, the rotating sleeve 2 rotates another quarter turn to transport the can to the transfer equipment. Under the action of the transfer equipment, the filled and sealed can is transferred to the subsequent processing position. After the rotating sleeve 2 rotates one turn, the clamping plate 8 returns to the initial position. Repeating the above steps can achieve the purpose of automated operation of filling, sealing and transferring the tin stripping solution. The sealing equipment and the transfer equipment are both applications of existing technology and will not be described in detail in this application.

[0048] Please see Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figures 8-11 A pumping mechanism is mounted on the fixed disk 13. A delivery pipe 23 is connected to the pumping mechanism. The pumping mechanism includes a receiving rod 18 fixedly mounted on the fixed disk 13 and arranged symmetrically. A piston cylinder 15 is fixed to the end of the receiving rod 18. The piston cylinder 15 is fixedly connected to the delivery pipe 23. A rotating rod 14 is rotatably mounted on the fixed disk 13, passing through the piston cylinder 15. A guide assembly connected to the rotating rod 14 is provided inside the piston cylinder 15. The guide assembly includes an annular spiral groove 1409 formed on the rotating rod 14. A guide column 16 arranged symmetrically is fixed inside the piston cylinder 15. A piston disk 17 slidably mounted on the guide column 16 and slidably connected to the rotating rod 14 is slidably mounted on the guide column 16. A first limiting block 1701 slidably connected to the annular spiral groove 1409 is fixed to the inner wall of the piston disk 17.

[0049] It should be noted that the annular spiral groove 1409 is composed of two spirally arranged grooves, and the two spirally arranged grooves are connected end to end. In the initial state, the limiting wheel 11 is separated from the follower rotating assembly, so that the piston disc 17 is located at the end of its stroke towards the lifting plate 1, so that the first limiting block 1701 is located at the end of the stroke of the annular spiral groove 1409 away from the top of the piston cylinder 15. The piston cylinder 15 is also connected to a conduit for absorbing the solder stripping solution, and two one-way valves are installed on the piston cylinder 15, which are connected to the conduit and the delivery pipe 23 respectively. When it is necessary to pump the solder stripping solution, the limiting wheel 11 will rotate around the rotating sleeve 2, and when the limiting wheel 11 cooperates with the follower rotating assembly, it drives the rotating rod 14 to rotate. The rotating rod 14 will drive the annular spiral groove 1409 to move, so as to control the piston disc 17 along the guide post 16. The guide post 16 guides the piston disc 17 to prevent it from shifting during movement. As the piston disc 17 moves, the pressure inside the piston cylinder 15 decreases, allowing the solder stripping solution to be drawn into the piston cylinder 15 through the conduit. When the limiting wheel 11 moves to the position where it separates from the follower rotating component, the can just moves below the delivery pipe 23. The rotating rod 14 rotates half a turn, and the first limiting block 1701 moves to the end of its stroke on the other side of the annular spiral groove 1409. At this time, under the action of the follower rotating component, the rotating rod 14 continues to rotate and controls the piston disc 17 to move toward the initial position, so as to deliver the solder stripping solution in the piston cylinder 15 to the can through the delivery pipe 23. When the rotating rod 14 rotates half a turn again, the piston disc 17 resets, and the solder stripping solution filling is completed. Repeat the above steps to achieve the effect of automatically filling the solder stripping solution.

[0050] Please see Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figures 8-11 The pumping mechanism is equipped with a follower rotating assembly that cooperates with the limiting wheel 11. The follower rotating assembly can move when the limiting wheel 11 moves to transport the solution into the delivery pipe 23 through the pumping mechanism. The follower rotating assembly includes a first movable sleeve 21 slidably mounted on the rotating rod 14. A movable plate 19 that is slidably connected to the receiving rod 18 is fixed on the first movable sleeve 21. A limiting plate 22 that cooperates with the limiting wheel 11 is fixed on the movable plate 19. A first spring 20 that abuts against the movable plate 19 is sleeved on the receiving rod 18. The pumping mechanism also includes a guide groove formed on the rotating rod 14. A second limiting block 2101 that is slidably connected to the guide groove is fixed on the inner wall of the first movable sleeve 21.

[0051] Furthermore, the guide groove can be divided into four sections: a first straight groove 1401, a first spiral groove 1402, a second straight groove 1403, and a second spiral groove 1404. The first straight groove 1401, the first spiral groove 1402, the second straight groove 1403, and the second spiral groove 1404 are sequentially connected end-to-end. The first spiral groove 1402 and the second spiral groove 1404 each have half a turn. The limiting plate 22 is arc-shaped, with one end inclined and the other end vertical. Initially, the limiting wheel 11 and the limiting plate 22 are separated, and the first spring 20 is compressed, causing the movable plate 19 to be located at the end of its stroke away from the piston cylinder 15, so as to control the second limiting block 2 through the first movable sleeve 21. Position 101 is located at the connection point between the first straight groove 1401 and the first spiral groove 1402. At this time, the piston disc 17 is at the end of its stroke towards the lifting plate 1. When it is necessary to fill the solder stripping solution, the can needs to be controlled to move below the delivery pipe 23. At this time, the clamping plate 8 will drive the can to move, and at the same time, the limiting wheel 11 will rotate around the rotating sleeve 2. When the limiting wheel 11 moves to the position where it abuts against the inclined surface of the limiting plate 22, it drives the limiting plate 22 to move away from the lifting plate 1, thereby driving the movable plate 19 to move along the length direction of the receiving rod 18 and compressing the first spring 20. The movable plate 19 will also drive the second limiting block 2101 to move along the length direction of the first straight groove 1401 through the first movable sleeve 21. When the second limiting block 2101 disengages from the first straight groove 1401 and enters the first spiral groove 1402, the rotating rod 14 will rotate to control the piston disc 17 to move away from the lifting plate 1 via the annular spiral groove 1409 and the first limiting block 1701. When the movable plate 19 rises to its maximum height, the second limiting block 2101 moves to the position where the first spiral groove 1402 and the second straight groove 1403 are connected. The rotating rod 14 rotates just half a turn, and the first limiting block 1701 also moves to the end of its stroke on one side of the annular spiral groove 1409. As the clamping plate 8 continues to move, when the tank moves directly below the conveying pipe 23, the rotating sleeve 2 stops rotating, and the limiting wheel 11 separates from the limiting plate 22. At this time, the first spring 20 springs back. The piston rod 14 releases its force and drives the movable plate 19 to move toward the initial position, thereby causing the second limiting block 2101 to move along the length direction of the second straight groove 1403. When the second limiting block 2101 disengages from the second straight groove 1403 and enters the second spiral groove 1404, the rotating rod 14 continues to rotate. Under the action of the annular spiral groove 1409 and the first limiting block 1701, the piston disc 17 moves toward the initial position to transport the solder stripping solution to the tank through the conveying pipe 23. When the second limiting block 2101 returns to the position where the first straight groove 1401 and the second spiral groove 1404 are connected, the solder stripping solution is transported. The rotating rod 14 rotates one revolution. The above steps are repeated to achieve the effect of automatically transporting the solder stripping solution according to the position of the tank.

[0052] Preferably, during the solder stripping process, as the first spring 20 releases its elasticity, the rotation speed of the rotating rod 14 gradually decreases, which slows down the movement speed of the piston disc 17. This achieves a faster solder stripping rate in the initial state, and a gradual decrease in the solder stripping rate as the amount of solder increases, in order to prevent the solder stripping from overflowing due to the impact caused by the increase in the amount of solder stripping in the tank.

[0053] Please see Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figures 8-11 A negative pressure suction mechanism is installed on the pumping mechanism and connected to the conveying pipe 23. The negative pressure suction mechanism can operate after the material is fed through the conveying pipe 23 and adjust the conveying pipe 23 to a negative pressure state. The negative pressure suction mechanism includes a hollow tube 24 fixedly installed on the conveying pipe 23. A sealing disc 25 is slidably installed inside the hollow tube 24. A push rod 26 that penetrates the hollow tube 24 is fixed to the side wall of the sealing disc 25. A receiving plate 28 is fixed to the end of the push rod 26. A guide assembly connected to the receiving plate 28 is provided on the rotating rod 14. The guide assembly includes a limiting groove opened on the rotating rod 14. A second movable sleeve 27 is slidably installed on the rotating rod 14. The second movable sleeve 27 is fixedly connected to the receiving plate 28. A third limiting block 2701 that is slidably connected to the limiting groove is fixed to the inner wall of the second movable sleeve 27. A second spring 29 that abuts against the receiving plate 28 is sleeved on the rotating rod 14.

[0054] Furthermore, the limiting groove can be divided into four sections: a first annular groove 1405, a third spiral groove 1406, a second annular groove 1407, and a vertical groove 1408. The first annular groove 1405, the third spiral groove 1406, the second annular groove 1407, and the vertical groove 1408 are connected to each other sequentially. In the initial state, the second limiting block 2101 is located at the connection position between the first vertical groove 1401 and the second spiral groove 1404, and the second spring 29 is in a compressed state, so that the third limiting block 2701 is located at the connection position between the vertical groove 1408 and the first annular groove 1405, so that the receiving plate 28 is located away from the piston cylinder 15. At the end of the stroke, the receiving plate 28 will control the sealing plate 25 to be located away from the conveying pipe 23 via the push rod 26, so that a negative pressure is formed in the hollow tube 24 to draw the solder stripping solution remaining in the conveying pipe 23 into the hollow tube 24. When the rotating rod 14 rotates, it drives the first annular groove 1405 to move, so that the third limiting block 2701 slides along the first annular groove 1405. When the second limiting block 2101 enters the second spiral groove 1404, under the action of the piston plate 17, the solder stripping solution is transported to the tank through the conveying pipe 23. At this time, the third limiting block 2701 disengages from the first annular groove 1405 and enters the second spiral groove 24. Within the triple spiral groove 1406, the second movable sleeve 27 moves toward the piston cylinder 15 to compress the second spring 29. The second movable sleeve 27 also drives the receiving plate 28 to move, thereby driving the sealing disc 25 toward the conveying pipe 23 via the push rod 26, thus conveying the solder stripping solution in the hollow tube 24 into the conveying pipe 23. When the third limiting block 2701 disengages from the third spiral groove 1406 and enters the second annular groove 1407, the sealing disc 25 moves to the end of its stroke. At this time, the solder stripping solution is about to be conveyed. When the second limiting block 2101 moves to the connection position between the third spiral groove 1406 and the first straight groove 1401... When the solder stripping solution is delivered, the third limiting block 2701 moves to the position where the second annular groove 1407 and the vertical groove 1408 are connected. The second spring 29 is released elastically and drives the receiving plate 28 to reset. The push rod 26 controls the sealing plate 25 to move away from the delivery pipe 23, thereby sucking the solder stripping solution remaining in the delivery pipe 23 into the hollow tube 24, ensuring that the solder stripping solution will not drip. When the third limiting block 2701 returns to the position where the vertical groove 1408 and the first annular groove 1405 are connected, the remaining solder stripping solution is absorbed. The above steps are repeated to ensure that the solder stripping solution will not drip after the delivery is completed.

[0055] A negative pressure anti-drip PCB solder stripping solution filling process includes the following steps:

[0056] Step 1: Place the container for removing solder between the clamping plates 8. Under the action of the clamping and rotating mechanism, control the clamping plates 8 to move toward each other to fix the container.

[0057] Step 2: The clamping and rotating mechanism will also drive the tank to move downwards toward the conveying pipe 23 via the clamping plate 8, and drive the limit wheel 11 to move;

[0058] Step 3: When the limit wheel 11 moves to the position that engages with the follow-up rotating component, it drives the pumping mechanism to move, so that the solder stripping solution is delivered into the tank through the delivery pipe 23;

[0059] Step 4: After the solder stripping solution is delivered, the pumping mechanism will also drive the negative pressure suction mechanism to create a negative pressure inside the delivery pipe 23, ensuring that the residual solder stripping solution inside the delivery pipe 23 will not drip.

[0060] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0061] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A negative pressure anti-drip PCB solder stripping solution filling and sealing device, comprising: A lifting plate (1) and a fixing rod (12) fixedly installed on the lifting plate (1), with a fixing plate (13) fixed at the end of the fixing rod (12). Its characteristic is that it further includes: A clamping and rotating mechanism is provided on the lifting plate (1). The clamping and rotating mechanism is connected to a limiting wheel (11) and a clamping plate (8) arranged symmetrically. The clamping and rotating mechanism can drive the limiting wheel (11) to move and control the clamping plates (8) to move closer or further away from each other. A pumping mechanism is provided on the fixed plate (13). A delivery pipe (23) is connected to the pumping mechanism. A follower rotation component that cooperates with the limiting wheel (11) is provided on the pumping mechanism. The follower rotation component can move when the limiting wheel (11) moves so as to deliver the solution into the delivery pipe (23) through the pumping mechanism. A negative pressure suction mechanism is installed on the pumping mechanism and connected to the conveying pipe (23). The negative pressure suction mechanism can operate after the material is fed through the conveying pipe (23) and adjust the conveying pipe (23) to be in a negative pressure state.

2. The negative pressure anti-drip PCB solder stripping solution filling and sealing device according to claim 1, characterized in that, The clamping and rotating mechanism includes a rotating sleeve (2) rotatably mounted on the lifting plate (1), a rotating plate (3) fixed at the end of the rotating sleeve (2), and a plurality of support rods (4) circumferentially distributed on the rotating plate (3), and a sliding component provided on the support rods (4).

3. The negative pressure anti-drip PCB solder stripping solution filling and sealing device according to claim 2, characterized in that, The sliding assembly includes a support plate (6) fixedly installed at the end of the support rod (4), the support plate (6) being rotatably connected to the limiting wheel (11), and the support plate (6) having grooves (601) on both sides, with a sliding block (7) slidably installed in the groove (601), the sliding block (7) being fixedly connected to the clamping plate (8), and a pushing structure connected to the sliding block (7) being provided on the support rod (4).

4. The negative pressure anti-drip PCB solder stripping solution filling and sealing device according to claim 3, characterized in that, The pushing structure includes a cylinder (9) fixedly installed on the rotating plate (3), a sliding sleeve (5) fixedly connected to the output end of the cylinder (9) is slidably installed on the support rod (4), and connecting rods (10) hinged to the sliding block (7) on both sides of the sliding sleeve (5).

5. A negative pressure anti-drip PCB solder stripping solution filling and sealing device according to claim 1, characterized in that, The pumping mechanism includes a receiving rod (18) fixedly installed on the fixed plate (13) and arranged symmetrically. A piston cylinder (15) is fixed at the end of the receiving rod (18). The piston cylinder (15) is fixedly connected to the conveying pipe (23). A rotating rod (14) that passes through the piston cylinder (15) is rotatably installed on the fixed plate (13). A guide assembly connected to the rotating rod (14) is provided inside the piston cylinder (15).

6. A negative pressure anti-drip PCB solder stripping solution filling and sealing device according to claim 5, characterized in that, The guide assembly includes an annular spiral groove (1409) formed on the rotating rod (14), and a guide post (16) arranged symmetrically is fixed inside the piston cylinder (15). A piston disc (17) that is slidably connected to the rotating rod (14) is slidably mounted on the guide post (16), and a first limiting block (1701) that is slidably connected to the annular spiral groove (1409) is fixed on the inner wall of the piston disc (17).

7. A negative pressure anti-drip PCB solder stripping solution filling and sealing device according to claim 5, characterized in that, The follower rotation assembly includes a first movable sleeve (21) slidably mounted on the rotating rod (14), a movable plate (19) fixed on the first movable sleeve (21) and slidably connected to the receiving rod (18), a limiting plate (22) cooperating with the limiting wheel (11) fixed on the movable plate (19), and a first spring (20) sleeved on the receiving rod (18) and abutting against the movable plate (19). It also includes a guide groove formed on the rotating rod (14), and a second limiting block (2101) is fixed on the inner wall of the first movable sleeve (21) and slidably connected to the guide groove.

8. A negative pressure anti-drip PCB solder stripping solution filling and sealing device according to claim 5, characterized in that, The negative pressure suction mechanism includes a hollow tube (24) fixedly installed on the delivery pipe (23), a sealing disc (25) is slidably installed inside the hollow tube (24), a push rod (26) is fixed to the side wall of the sealing disc (25) and passes through the hollow tube (24), a receiving plate (28) is fixed to the end of the push rod (26), and a guide assembly connected to the receiving plate (28) is provided on the rotating rod (14).

9. A negative pressure anti-drip PCB solder stripping solution filling and sealing device according to claim 8, characterized in that, The guiding assembly includes a limiting groove formed on the rotating rod (14), a second movable sleeve (27) is slidably mounted on the rotating rod (14), the second movable sleeve (27) is fixedly connected to the receiving plate (28), a third limiting block (2701) is fixed on the inner wall of the second movable sleeve (27) and slidably connected to the limiting groove, and a second spring (29) is sleeved on the rotating rod (14) and abuts against the receiving plate (28).

10. A negative pressure anti-drip PCB solder stripping solution filling process, employing the negative pressure anti-drip PCB solder stripping solution filling and sealing device as described in any one of claims 1-9, characterized in that, Includes the following steps: Step 1: Place the container for removing the solder between the clamping plates (8). Under the action of the clamping rotation mechanism, control the clamping plates (8) to move toward each other to fix the container. Step 2: The clamping and rotating mechanism will also drive the tank to move downward toward the conveying pipe (23) through the clamping plate (8), and drive the limit wheel (11) to move; Step 3: When the limit wheel (11) moves to the position that engages with the follow-up rotating component, it drives the pumping mechanism to move, so that the solder stripping solution is transported into the tank through the delivery pipe (23); Step 4: After the solder stripping solution is delivered, the pumping mechanism will also drive the negative pressure suction mechanism to move, so that a negative pressure is formed in the delivery pipe (23) to ensure that the residual solder stripping solution in the delivery pipe (23) will not drip.

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