Electronic device
By driving the target component to adjust the position of the power module through the driver module, the problem of physical power failure and reset caused by the failure of the logic power failure function was solved, realizing hard restart and reducing the consumption of costs and human resources.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LENOVO (BEIJING) LTD
- Filing Date
- 2025-12-31
- Publication Date
- 2026-04-21
AI Technical Summary
In cases where the server's logical power-off function fails or is not available, existing technologies require service personnel to perform physical power-off and reset operations on-site, leading to increased human resources and costs.
By driving the target component through the drive module to adjust the position change of the power module, it can be physically separated from or connected to the motherboard, thereby realizing the hard reboot of the motherboard by the power module. This includes using drive components composed of air pumps, cylinders, motors, etc., to control the physical power-off and reset of the power module and the motherboard.
It enables physical power-off and reset operations when the logic power-off function fails, reducing the cost and manpower of on-site operations and improving the user experience.
Smart Images
Figure CN121900595A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic technology, and in particular to an electronic device. Background Technology
[0002] Electronic devices can include servers, computers, etc. Taking servers as an example, when the XCC (Basic Management Controller) fails to control the server's logic power-off function, service personnel need to go to the site to perform physical power-off and reset operations, which causes great difficulties for remote management and maintenance of servers. Some servers lack important remote management functions, which will bring unnecessary manpower and cost to on-site operations. Summary of the Invention
[0003] The purpose of this application is to provide an electronic device.
[0004] This application provides an electronic device, including: Motherboard; Power module; The drive module includes the target component; The drive module adjusts the position of the power module relative to the motherboard by driving the target component; With the power module in the first position relative to the motherboard, the power module and the motherboard are physically separated, and the motherboard is in the first electrical state. When the power module is in the second position relative to the motherboard, the power module is physically connected to the motherboard, and the motherboard is in a second electrical state, which is different from the first electrical state.
[0005] In some embodiments, the drive module is used to control the target component to work according to the first control signal, so as to adjust the power module to move a first distance along the first direction, so that the power module is in a first position relative to the motherboard; The drive module is used to control the target component to work according to the second control signal, so as to adjust the power module to move a second distance along the second direction, so that the power module is in a second position relative to the motherboard; wherein the second distance is the same as the first distance, and the first direction is opposite to the second direction.
[0006] In some embodiments, the motherboard is provided with a first connector; The power module is equipped with a second connector that is compatible with the first connector; When the first connector and the second connector are physically separated, the power module is in a non-powered state, so that the motherboard is in the first power state; With the first connector and the second connector physically connected, the power module supplies power to the motherboard, so that the motherboard is in the second power state.
[0007] In some embodiments, the driver module further includes: The control board is equipped with a driver interface; The driver components are connected to the driver interface and the target component, respectively. The control board is used to control the drive components to move the target components through the drive interface, so as to adjust the position of the power module relative to the motherboard.
[0008] In some embodiments, the driving component includes a first driving element; the first driving element is connected to a first interface of the driving interface; The control board controls the movement of the first driving component through the first interface, and the first driving component drives the target component to extend or retract.
[0009] In some embodiments, the driving component includes a second driving element; the second driving element is connected to a second interface of the driving interface; The control board controls the rotation of the second drive component through the second interface, and the second drive component drives the target component to rotate clockwise or counterclockwise.
[0010] In some embodiments, the power module is provided with a connection platform; The target component is equipped with a connecting part that is compatible with the connecting platform. The control board controls the drive assembly to move the target component through the drive interface, so that the connecting part and the connecting platform can switch between a connected state and a disconnected state. With the power module in the first position relative to the motherboard, the connecting part and the connecting platform are in a connected state. With the power module in the second position relative to the motherboard, the connection part and the connection platform are not connected.
[0011] In some embodiments, a housing is also included; The motherboard is fixedly connected to the chassis; The drive module is connected to the motherboard and / or the enclosure, and the drive module and the motherboard are located on the same side of the power supply module. The power module is connected to the enclosure via a sliding component, and the power module switches between a first position and a second position relative to the motherboard.
[0012] In some embodiments, the drive module further includes a power supply module; The driver module is connected to the motherboard and its position relative to the motherboard is fixed. The motherboard is in the first power state, and the power supply module supplies power to the driver module; The motherboard is in the second power state, and the power module supplies power to the motherboard and driver module.
[0013] In some embodiments, the number of power modules is one or more; the number of drive modules is one or more; and there is a one-to-one correspondence between power modules and drive modules. One or more drive modules are used to synchronously control the operation of target components, thereby synchronously controlling changes in the position of one or more power modules. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a driver module provided in an embodiment of this application; Figure 3 A schematic diagram illustrating the physical separation of a power module and a motherboard, provided as an embodiment of this application; Figure 4 for Figure 3 Enlarged view of the area within the dashed circle; Figure 5 A schematic diagram illustrating the physical connection between a power module and a motherboard, provided in an embodiment of this application; Figure 6 for Figure 5 Enlarged view of the area within the dashed circle; Figure 7 A schematic diagram of an electronic device provided in an embodiment of this application; Figure 8 A schematic diagram from another perspective of the electronic device provided in an embodiment of this application; Explanation of reference numerals in the attached diagram: 10-Power supply module, 11-Second connector, 12-Connecting platform; 20-Drive module, 21-Control board, 22-First sub-drive component, 23-Second sub-drive component, 24-Second drive component, 25-Target component, 26-Connecting part, 27-Power supply module, 28-Fixing frame; 30 - Motherboard, 31 - First connector, 32 - Motherboard connector. Detailed Implementation
[0015] Various embodiments and features of this application are described herein with reference to the accompanying drawings.
[0016] It should be understood that various modifications can be made to the embodiments described herein. Therefore, the above description should not be considered as limiting, but merely as an example of embodiments. Other modifications within the scope and spirit of this application will be apparent to those skilled in the art.
[0017] The accompanying drawings, which are included in and form part of this specification, illustrate embodiments of the present application and, together with the general description of the present application given above and the detailed description of the embodiments given below, serve to explain the principles of the present application.
[0018] These and other features of this application will become apparent from the following description of preferred forms of embodiments given as non-limiting examples, with reference to the accompanying drawings.
[0019] It should also be understood that although this application has been described with reference to some specific examples, those skilled in the art can certainly implement many other equivalent forms of this application.
[0020] The above and other aspects, features and advantages of this application will become more apparent when taken in conjunction with the accompanying drawings and in view of the following detailed description.
[0021] Specific embodiments of this application are described thereafter with reference to the accompanying drawings; however, it should be understood that the claimed embodiments are merely examples of this application, which can be implemented in various ways. Well-known and / or repeated functions and structures are not described in detail to avoid unnecessary or redundant details that could obscure the application. Therefore, the specific structural and functional details claimed herein are not intended to be limiting, but merely serve as the basis and representative basis for the claims to teach those skilled in the art to use this application in a variety of substantially any suitable detailed structures.
[0022] This specification may use the phrases “in one embodiment,” “in another embodiment,” “in yet another embodiment,” or “in other embodiments,” all of which may refer to one or more of the same or different embodiments according to this application.
[0023] This application provides an electronic device, combined with... Figures 1 to 8 As shown, the electronic device may include a motherboard 30, a power module 10, and a drive module 20. The drive module 20 includes a target component 25; The drive module 20 adjusts the position of the power module 10 relative to the motherboard 30 by driving the target component 25; When the power module 10 is in the first position relative to the motherboard 30, the power module 10 and the motherboard 30 are physically separated, and the motherboard 30 is in the first electrical state. When the power module 10 is in the second position relative to the motherboard 30, the power module 10 is physically connected to the motherboard 30, and the motherboard 30 is in a second electrical state, which is different from the first electrical state.
[0024] This embodiment of the application adds a driving module 20 to drive the target component 25, thereby adjusting the position of the power module 10 relative to the motherboard 30. This allows the power module 10 to not supply power to the motherboard 30 when physically separated from it, placing the motherboard 30 in a first power state. When physically connected, the power module 10 resumes power supply to the motherboard 30, placing it in a second power state, thus achieving a hard reboot of the motherboard 30 by the power module 10. This embodiment of the application serves as an alternative solution, enabling physical power-off and reset operations when the logical power-off function of an electronic device fails. This reduces the cost for engineers to physically power off and reset the device on-site and analyze the problem, minimizing unnecessary human resources and costs. Furthermore, in cases where some electronic devices do not support logical power-off functions, this embodiment of the application provides an alternative solution for physical power-off and reset, eliminating the need for service personnel to perform on-site physical power-off and reset operations. This embodiment of the application reduces costs while improving the user experience.
[0025] The power module 10 can be a PSU (Power Supply Unit) module. The PSU module is used to convert alternating current (AC) into low-voltage direct current (DC) that can be used by electronic devices (such as computers, servers, etc.) to power the electronic devices. For example, the PSU module converts 220V AC into low-voltage DC such as +12V, +5V, and +3.3V to power the electronic devices.
[0026] The motherboard 30 is a core hardware component of electronic devices. It is the core circuit board that connects and supports the processor, memory, storage and other components.
[0027] The drive module 20 can be a drive assembly composed of an air pump, cylinder, motor, etc., used to drive the target component 25 to move or shift, thereby changing the position of the power module 10 and achieving physical separation and connection between the power module 10 and the motherboard 30. The drive module 20 may or may not be mounted on the motherboard 30, as long as it can drive the target component 25 to adjust the position of the power module 10 and achieve physical separation and connection between the power module 10 and the motherboard 30. This application does not impose specific limitations.
[0028] The target component 25 can be a push rod, suction cup, snap-fit, or other structure, designed for the movable connection of the power module 10. The target component 25 can move under the drive of the drive module 20, pushing the power module 10 along a first or second direction, thereby changing the position of the power module 10 relative to the motherboard 30, and thus achieving physical separation and connection between the power module 10 and the motherboard 30.
[0029] The first position can be understood as the position of the power module 10 when it is physically separated from the motherboard 30 and when it does not supply power to the motherboard 30. The second position can be understood as the position of the power module 10 when it is physically connected to the motherboard 30 and when it supplies power to the motherboard 30.
[0030] For example, suppose the power module 10 is in the second position relative to the motherboard 30. At this time, the power module 10 is physically connected to the motherboard 30 and the power module 10 supplies power to the motherboard 30. If the electronic device's logic power-off function fails or the electronic device itself does not have a logic power-off function, a control signal can be sent from the motherboard 30 or other electronic devices to the drive module 20 to control the drive module 20 to work, so that the power module 10 and the motherboard 30 are physically separated.
[0031] Based on the received control signal, the drive module 20 controls the target component 20 to move or move, thereby pushing the power module 10 to move along the first direction. When the power module 10 moves to the first position, the power module 10 is physically separated from the motherboard 30, and the power module 10 does not supply power to the motherboard 30. At this time, the motherboard 30 is in the first power state, thereby realizing the physical power cut-off of the motherboard 30 by the power module 10.
[0032] The power module 10 is in the first position relative to the motherboard 30. At this time, the power module 10 is physically separated from the motherboard 30 and does not supply power to the motherboard 30. The drive module 20 controls the target component 25 to move or move based on the received control signal, pulling the power module 10 back so that the power module 10 moves in the second direction, which is the opposite of the first direction. When the power module 10 moves to the second position, the power module 10 restores the physical connection with the motherboard 30 and resumes supplying power to the motherboard 30. At this time, the motherboard 30 is in the second power state, thereby realizing the hard reboot of the motherboard 30 by the power module 10.
[0033] The embodiments of this application can physically power off and reset the motherboard when the electronic device fails to power off logically or does not have a logical power-off function, without requiring engineers to physically power off and reset the motherboard on-site, thus reducing human resources and cost.
[0034] In some embodiments, combined with Figure 1 , Figure 2 , Figure 3 and Figure 5As shown, the drive module 20 is used to control the target component 25 to work according to the first control signal, so as to adjust the power module 10 to move a first distance along the first direction, so that the power module 10 is in a first position relative to the motherboard 30; the drive module 20 is used to control the target component 25 to work according to the second control signal, so as to adjust the power module 10 to move a second distance along the second direction, so that the power module 10 is in a second position relative to the motherboard 30; wherein, the second distance is the same as the first distance, and the first direction is opposite to the second direction.
[0035] Optionally, the drive module 20 controls the target component 25 to extend according to the first control signal, pushing out the power module 10 so that the power module 10 moves a first distance in a first direction, physically separating the power module 10 from the motherboard 30. The power module 10 does not supply power to the motherboard 30, and the motherboard 30 is in a first electrical state. The drive module 20 controls the target component 25 to retract according to the second control signal, pulling back the power module 10 so that the power module 10 moves a second distance in a second direction, physically connecting the power module 10 to the motherboard 30. The power module 10 resumes supplying power to the motherboard 30, and the motherboard 30 is in a second electrical state. The second distance is the same as the first distance, and the first direction is opposite to the second direction. By controlling the extension and retraction of the target component 25 through the drive module 20, the power module 10 and motherboard 30 are physically separated and physically connected, thereby achieving hardware ejection and reset of the power module 10, realizing a hard reboot of the motherboard 30 by the power module 10, without affecting the disassembly of the power module 10.
[0036] The first and second control signals can be control signals from the motherboard 30. For example, the driver module 20 can be mounted on and connected to the motherboard 30. The first and second control signals can be transmitted to the driver module 20 based on the controller of the motherboard 30, so that the driver module 20 controls the target component 25 according to the first and second control signals. Alternatively, they can be control signals from the driver module 20 itself. For example, if the driver module 20 has a controller, the first and second control signals can be transmitted and controlled based on the controller of the driver module 20.
[0037] The purpose of using the same second distance as the first distance is to ensure that after the power module 10 is pushed out a certain distance and physically separated from the motherboard 30, it is pulled back by the same distance, thus maintaining a physical connection with the motherboard 30. This allows the power module 10 to resume power supply to the motherboard 30, achieving a hardware hard reboot of the motherboard 30. If the second distance differs from the first distance (e.g., the second distance is shorter than the first distance), the power module 10 may not be able to physically connect with the motherboard 30, preventing power supply to the motherboard 30 from being restored and thus hindering the hardware hard reboot of the motherboard 30. This embodiment of the application enables a hard reboot of the motherboard 30 by the power module 10 without affecting the disassembly of the power module 10.
[0038] In some embodiments, combined with Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, the motherboard 30 is provided with a first connector 31; the power module 10 is provided with a second connector 11 that is adapted to the first connector 31. like Figure 3 and Figure 4 As shown, when the first connector 31 and the second connector 11 are physically separated, the power module 10 is in a non-powered state, so that the motherboard 30 is in a first power state; like Figure 5 and Figure 6 As shown, when the first connector 31 and the second connector 11 are physically connected, the power module 10 supplies power to the motherboard 30 so that the motherboard 30 is in the second power state.
[0039] Optionally, both the first connector 31 and the second connector 11 are gold finger connectors.
[0040] like Figure 7 and Figure 8 As shown, Figure 7 From a frontal view, the area within the box represents the first connector 31 of the motherboard 30 and the second connector 11 of the power module 10. Figure 8 From the rear view, the arrow points to the first connector 31 of the power module 10.
[0041] Of course, the first connector 31 and the second connector 11 can also be other connectors, for example, one is a conductive spring and the other is a conductive contact, or both are conductive contacts.
[0042] For example, the first connector 31 is a conductive spring, and the second connector 11 is a conductive contact, such as a groove-shaped conductive contact. A conductive spring is a thin metal component that utilizes elastic deformation to achieve a specific function. Specifically, assuming the power module 10 is in the second position relative to the motherboard 30, the power module 10 is physically connected to the motherboard 30, supplying power to the motherboard 30. If the electronic device's logic power-off function fails or the electronic device itself lacks a logic power-off function, a control signal can be sent from the motherboard 30 or other electronic devices to the drive module 20 to control the drive module 20 to operate, thus physically separating the power module 10 from the motherboard 30. Based on the received control signal, the drive module 20 controls the target component 20 to move, thereby pushing the power module 10 to move along the first direction. Since the conductive spring can provide a reset force, the drive module needs to provide a relatively large force to control the target component 25 to extend, pushing the power module 10 out, thus physically separating the power module 10 from the motherboard 30. When the power module 10 moves to the first position, the power module 10 is physically separated from the motherboard 30, and the power module 10 does not supply power to the motherboard 30. At this time, the motherboard 30 is in the first power state, thus realizing the physical power cut-off of the motherboard 30 by the power module 10.
[0043] The power module 10 is in the first position relative to the motherboard 30. At this time, the power module 10 is physically separated from the motherboard 30 and does not supply power to the motherboard 30. The drive module 20 controls the target component 25 to move or move based on the received control signal, pulling the power module 10 back so that the power module 10 moves in the second direction, which is the opposite of the first direction. Since the conductive spring can provide a reset force, the drive module only needs to provide a small force to control the target component 25 to retract and pull the power module 10 back, so that the power module 10 is physically connected to the motherboard 30. The power module 10 resumes supplying power to the motherboard 30. At this time, the motherboard 30 is in the second power state, thus realizing the hard reboot of the motherboard 30 by the power module 10.
[0044] For example, the first connector 31 and the second connector 11 can both be conductive contacts, such as groove-shaped conductive contacts. In this way, the drive module 20 needs to provide the same force to control the ejection and reset of the power module 10, which makes it easier for the drive module 20 to control the movement or motion of the target component 25, thereby controlling the ejection and reset of the power module 10, and making the physical connection and physical separation between the power module 10 and the motherboard 30 more stable.
[0045] In some embodiments, see Figure 2 As shown, the drive module 20 also includes a control board 21 and a drive assembly.
[0046] Control board 21 is equipped with a drive interface (such as...) Figure 2(The positions that B and C point to in the text). The drive components are connected to the drive interface and the target component 25, respectively. The control board 21 is used to control the drive components to move the target component 25 through the drive interface, so as to adjust the position of the power module 10 relative to the motherboard 30.
[0047] In this embodiment, the control board 21 controls the drive component to move the target component 25, thereby adjusting the position of the power module 10 relative to the motherboard 30 to change, thereby realizing the ejection and reset of the power module 10 in hardware, and realizing the hard reboot of the motherboard 30 by the power module 10.
[0048] For example, the control board 21 controls the drive component to extend the target component 25 via the drive interface according to the first control signal, pushing out the power module 10 so that the power module 10 moves a first distance in a first direction, physically separating the power module 10 from the motherboard 30. The power module 10 does not supply power to the motherboard 30, and the motherboard 30 is in a first electrical state. The control board 21 controls the drive component to retract the target component 25 via the drive interface according to the first control signal, pulling back the power module 10 so that the power module 10 moves a second distance in a second direction, physically connecting the power module 10 to the motherboard 30. The power module 10 resumes supplying power to the motherboard 30, and the motherboard 30 is in a second electrical state. The second distance is the same as the first distance, and the first direction is opposite to the second direction. By controlling the extension and retraction of the target component 25 through the drive module 20, the power module 10 and the motherboard 30 are physically separated and physically connected, thereby realizing the hardware ejection and reset of the power module 10, achieving a hard reboot of the motherboard 30 by the power module 10.
[0049] In some embodiments, the driving component includes a first driving element; the first driving element is connected to a first interface of the driving interface; The control board 21 controls the movement of the first driving component through the first interface, which causes the target component 25 to extend or retract. For example, the first driving component may include a cylinder. The control board 21 controls the cylinder to inflate or compress via the first interface in a pneumatic manner to control the extension or retraction of the target component 25, thereby controlling the ejection and reset of the power module 10.
[0050] Optionally, the first driving component may include a first sub-driving component and a second sub-driving component. The first sub-driving component may be an air pump, hydraulic pump, oil pump, etc., and the second sub-driving component may be a cylinder, etc. For example, the target component 25 may be a push rod. The first sub-driving component provides an air source to the second sub-driving component. There may be one first sub-driving component. The second sub-driving component is used to inflate or compress the air according to the air source provided by the first sub-driving component, thereby controlling the target component 25 to move along a first direction or along a second direction. There may be two second sub-driving components, which are located on both sides of the first sub-driving component and connected to it respectively. The combined use of the two sub-driving components can provide a larger driving force, significantly enhancing the reliability and stability of achieving physical separation and physical connection. Specifically, taking the first sub-drive component as an air pump, the second sub-drive component as a cylinder, and the target component 25 as a push rod as an example, the cylinders are symmetrically arranged on both sides of the air pump. The air pump is connected to the cylinders on both sides. The air pump can be connected to the first interface on the control board 21 through a cable. The control board 21 outputs a control signal to the air pump through the first interface, so that the air pump provides air source to the cylinders on both sides synchronously. The cylinders on both sides are simultaneously inflated or compressed according to the air source provided by the air pump, thereby driving the push rods on both sides to extend or retract synchronously, thereby controlling the power module 10 to be smoothly ejected and reset, realizing the physical separation and physical connection between the power module 10 and the main board 30.
[0051] In this embodiment, the control board 21 controls the movement of the first driving component through the first interface. The first driving component drives the target component 25 to extend or retract, thereby enabling the power module 10 to be physically separated and physically connected with the motherboard 30, thus realizing the ejection and reset of the power module 10 in hardware, and realizing the hard reboot of the power module 10.
[0052] In other embodiments, the driving component includes a second driving element 24; the second driving element 24 is connected to a second interface of the driving interface; The control board 21 controls the rotation of the second drive component 24 through the second interface, and the second drive component 24 drives the target component 25 to rotate clockwise or counterclockwise.
[0053] Optionally, the second drive element 24 can be a motor.
[0054] Specifically, taking the second driving component 24 as a motor and the target component 25 as a push rod as an example, the motor is connected to the second interface on the control board 21 through a cable. The control board 21 outputs control signals to the motor through the second interface, so that the motor works to drive the push rod on the motor to extend or retract, thereby controlling the power module 10 to be pushed out and reset, realizing the physical separation and physical connection between the power module 10 and the main board 30.
[0055] In this embodiment, the control board 21 controls the rotation of the second driving component 24 through the second interface. The second driving component 24 drives the target component 25 to rotate clockwise or counterclockwise, causing the target component 25 to shift. This allows the power module 10 to physically separate from and physically connect to the motherboard 30, thereby achieving hardware ejection and reset of the power module 10, and realizing a hard reboot of the power module 10. The target component 25 can be a threaded screw. The clockwise and counterclockwise rotation of the screw corresponds to the direction of movement of the power module 10, which can be determined according to the mechanical structure of the screw. For example, clockwise rotation of the screw corresponds to the power module 10 moving along a first direction, corresponding to the physical separation of the power module 10 from the motherboard 30; counterclockwise rotation of the screw corresponds to the power module 10 moving along a second direction, corresponding to the physical connection of the power module 10 from the motherboard 30. Alternatively, the screw can rotate clockwise to move the power module 10 along the second direction, thus physically connecting the power module 10 to the motherboard 30; or the screw can rotate counterclockwise to move the power module 10 along the first direction, thus physically separating the power module 10 from the motherboard 30.
[0056] By driving the target component 25 to rotate clockwise or counterclockwise by a motor, the displacement of the target component 25 can be controlled with higher precision, thereby enabling more accurate control of the power module 10 to be ejected and reset, and realizing the physical separation and physical connection between the power module 10 and the motherboard 30.
[0057] By using a combination of air pump and cylinder to control the displacement of the target component 25, it is possible to control the ejection and reset of the power module 10 more quickly, thereby achieving physical separation and physical connection between the power module 10 and the motherboard 30.
[0058] In yet other embodiments, participants Figure 2 As shown, the drive assembly includes a first sub-drive component 22, a second sub-drive component 23, and a second drive component 24. The first sub-drive component 22 and the second sub-drive component 23 are connected, and the second sub-drive component 23 is connected to the second drive component 24.
[0059] Optionally, the first sub-drive component 22 can be an air pump, hydraulic pump, oil pump, etc., the second sub-drive component 23 can be a cylinder, the second drive component 24 can be a motor, and the target component 25 can be a push rod.
[0060] In this embodiment, the control board 21 controls the supply of air to the first sub-drive unit 22 via the first interface, thereby controlling the second sub-drive unit 24 to inflate or compress the air, thus driving the target unit 25 to extend or retract. The control board 21 also controls the rotation of the second drive unit 24 via the second interface C, causing the target unit 25 to rotate clockwise or counterclockwise. This physically separates and connects the power module 10 to the motherboard 30, enabling the power module 10 to be ejected and reset in hardware, achieving a hard reboot of the power module 10. This embodiment, through the combined use of three drive units, provides greater driving force, further enhancing the reliability and stability of the physical separation and connection.
[0061] Specifically, taking an air pump as the first sub-drive component, a cylinder as the second sub-drive component, a motor as the second drive component 24, and a screw as the target component 25 as an example, the following explanation is provided. The air pump is connected to the cylinder. The air pump can be connected to the first interface on the control board 21 via a cable, and the motor can be connected to the second interface on the control board 21 via a cable. The control board 21 outputs control signals to the air pump through the first interface and to the motor through the second interface. The cylinder inflates or compresses air according to the air source provided by the air pump, and works with the motor to control the screw to rotate, jointly controlling the extension or retraction of the screw. Specifically, when the power module 10 and the main board 30 are physically separated, the motor can be controlled to drive the screw to rotate to its position first, and then the cylinder can be controlled to drive the screw to extend, pushing out the power module 10. Alternatively, the cylinder can be controlled to drive the screw to extend first, pushing out the power module 10, and then the motor can be controlled to drive the screw to rotate to its position. With the power module 10 physically connected to the motherboard 30, the screw is first retracted to physically connect the power module 10 to the motherboard 30. Then, the screw is further retracted to separate the screw from the power module 10. This allows the power module 10 to be ejected and reset, achieving both physical separation and connection between the power module 10 and the motherboard 30, without affecting the disassembly of the power module 10.
[0062] For example, suppose the power module 10 is in the second position relative to the motherboard 30. At this time, the power module 10 is physically connected to the motherboard 30 and the power module 10 supplies power to the motherboard 30. If the electronic device's logic power-off function fails or the electronic device itself does not have a logic power-off function, a control signal can be sent from the motherboard 30 or other electronic devices to the drive module 20 to control the drive module 20 to work, so that the power module 10 and the motherboard 30 are physically separated.
[0063] Based on the received control signal, the control board 21 of the drive module 20 controls the air pump to provide air to the cylinder through the first interface and controls the motor to rotate through the second interface. The cylinder is inflated according to the air source provided by the air pump and, together with the motor, drives the screw to rotate clockwise, jointly controlling the screw to extend and quickly push the power module 10 out in the first direction. When the power module 10 moves to the first position, the power module 10 is physically separated from the motherboard 30, and the power module 10 does not supply power to the motherboard 30. At this time, the motherboard 30 is in the first power state, thereby realizing the physical power cut-off of the motherboard 30 by the power module 10.
[0064] The power module 10 is in the first position relative to the motherboard 30. At this time, the power module 10 is physically separated from the motherboard 30, and the power module 10 does not supply power to the motherboard 30. Based on the received control signal, the control board 21 of the drive module 20 controls the air pump to provide air to the cylinder through the first interface, and controls the motor to rotate through the second interface. The cylinder compresses the air supplied by the air pump, and works with the motor to drive the screw to rotate counterclockwise, jointly controlling the screw to retract and quickly pull the power module 10 back along the second direction, which is the opposite of the first direction. When the power module 10 moves to the second position, the power module 10 restores its physical connection with the motherboard 30, and the power module 10 resumes supplying power to the motherboard 30. At this time, the motherboard 30 is in the second power state, thus realizing the hard reboot of the motherboard 30 by the power module 10.
[0065] This application embodiment uses a combination of air pump, cylinder and motor to drive the power supply module 10 and the motherboard 30 to achieve physical separation and physical connection, providing greater driving force and further enhancing the reliability and stability of achieving physical separation and physical connection.
[0066] In some embodiments, combined with Figure 1 and Figure 2 As shown, the power module 10 is equipped with a connection platform 12; The target component 25 is provided with a connecting part 26 that is adapted to the connecting platform 12. The control board 21 controls the drive component to move the target component 25 through the drive interface, so that the connecting part 26 and the connecting platform 12 switch between a connected state and a disconnected state. When the power module 10 is in the first position relative to the motherboard 30, the connecting part 26 is connected to the connecting platform 12. When the power module 10 is in the second position relative to the motherboard 30, the connecting part 26 and the connecting platform 12 are not connected.
[0067] Optionally, the drive module 20 controls the target component 25 to extend according to the first control signal, pushing out the power module 10 so that the power module 10 moves a first distance in the first direction, so that the power module 10 is in a first position relative to the motherboard 30, the connecting part 26 of the target component 25 is connected to the connecting platform 12 of the power module 10, the power module 10 is physically separated from the motherboard 30, the power module 10 does not supply power to the motherboard 30, and the motherboard 30 is in a first electrical state.
[0068] The drive module 20 controls the target component 25 to retract according to the second control signal, pulling the power module 10 back so that the power module 10 moves a second distance in the second direction, so that the power module 10 is in a second position relative to the motherboard 30. The connecting part 26 of the target component 25 and the connecting platform 12 of the power module 10 are in a non-connected state. The power module 10 is physically connected to the motherboard 30, and the power module 10 resumes to supply power to the motherboard 30. The motherboard 30 is in the second power state.
[0069] The second distance is the same as the first distance, and the first direction is opposite to the second direction.
[0070] In this embodiment, the drive module 20 controls the extension and retraction of the target component 25 to push out and pull back the power module 10, thereby achieving physical separation and connection between the power module 10 and the motherboard 30. When the power module 10 is in the first position relative to the motherboard 30, the power module 10 is physically separated from the motherboard 30, and the connecting part 26 of the target component 25 is connected to the connecting platform 12 of the power module 10. This facilitates pulling back the power module 10 to restore power supply to the motherboard 30 when needed. When the power module 10 is in the second position relative to the motherboard 30, the power module 10 is physically connected to the motherboard 30, and the connecting part 26 of the target component 25 is not connected to the connecting platform 12 of the power module 10. This ensures that when personnel go to the site to plug and unplug the power module 10 to achieve physical power disconnection, it will not cause any interference to the drive module 20.
[0071] Optionally, the fit between the connecting part 26 of the target component 25 and the connecting platform 12 of the power module 10 can be a fit between an adsorption component and a suction cup, a fit between a magnetic component and a magnet, a fit between a hook and a buckle, a fit between a thread and a screw, etc. The driving target component 25 can be a gear rack or a threaded screw, etc.
[0072] In some embodiments, the connecting portion 26 of the target component 25 has an external thread, and the connecting platform 12 of the power module 10 has an internal thread. The external thread of the connecting portion 26 is adapted to the internal thread of the connecting platform 12. The connecting portion 26 of the target component 25 and the connecting platform 12 of the power module 10 achieve physical separation and physical connection between the power module 10 and the motherboard 30 through the mutual cooperation of the external and internal threads, and switch between the connecting portion 26 and the connecting platform 12 in a connected state and a disconnected state.
[0073] For example, the target part 25 is a screw, and the screw has a rotating thread, that is, the connecting part 26 of the target part 25 has a rotating thread, and the connecting table 12 is provided with a threaded hole.
[0074] Assume the initial state is: the power module 10 is in the second position relative to the motherboard 30, and the power module 10 is physically connected to the motherboard 30.
[0075] The drive module 20 first controls the motor to drive the screw to rotate clockwise, the rotating thread engaging with the threaded hole to rotate the screw into position, and the rotating thread and threaded hole are tightened and fixed. At this time, the connecting part 26 and the connecting platform 12 are in a connected state. Then, the drive module 20 controls the screw to rotate clockwise further, pushing out the power module 10. When the power module 10 moves to the first position, the power module 10 is physically separated from the motherboard 30.
[0076] Alternatively, the drive module 20 first controls the cylinder to extend the screw, pushing out the power module. When the power module 10 moves to the first position, the power module 10 is physically separated from the motherboard 30. Then, the drive module 20 controls the motor to rotate the screw clockwise, and the rotating thread engages with the threaded hole, so that the screw rotates into place and the rotating thread and threaded hole are tightened and fixed. At this time, the connecting part 26 and the connecting platform 12 are in a connected state.
[0077] The drive module 20 controls the motor to drive the screw to rotate counterclockwise, pulling the power module 10 back. When the power module 10 moves to the second position, the power module 10 is physically connected to the motherboard 30.
[0078] The drive module 20 controls the motor to drive the screw to rotate further counterclockwise, and the rotating thread separates from the threaded hole, that is, the connecting part 26 separates from the connecting platform 12. At this time, the connecting part 26 and the connecting platform 12 are in an unconnected state, thereby ensuring that the power module 10 is detachable and completing the switching of the connecting part 26 and the connecting platform 12 from the connected state to the unconnected state.
[0079] For example, target part 25 is a push rod, the connecting part 26 of the push rod is a suction cup, and the connecting platform 12 is an adsorption component.
[0080] Assume the initial state is as follows: the power module 10 is in the second position relative to the motherboard 30, and at this time the power module 10 and the motherboard 30 are physically connected.
[0081] The drive module 20 first controls the top rod to extend, so that the suction cup and the adsorption component of the power module 10 are pressed together. At this time, the connecting part 26 and the connecting platform 12 are in a connected state.
[0082] Then, the drive module 20 controls the push rod to extend further, pushing out the power module 10. The suction cup adheres to the power module 10 during the pushing process. When the power module 10 moves to the first position, the power module 10 is physically separated from the motherboard 30.
[0083] The drive module 20 controls the top rod to retract, pulling the power module 10 back. The suction cup is attracted during the process of pulling the power module 10 back. When the power module 10 moves to the second position, the power module 10 is physically connected to the motherboard 30. At this time, the connecting part 26 and the connecting platform 12 are still connected.
[0084] The drive module 20 controls the push rod to retract further. When the driving force for the push rod to retract is greater than the adsorption force, the connecting part 26 separates from the connecting platform 12. At this time, the connecting part 26 and the connecting platform 12 are in an unconnected state, thereby ensuring that the power module 10 is detachable and completing the switching of the connecting part 26 and the connecting platform 12 from the connected state to the unconnected state.
[0085] In this embodiment, firstly, by employing a threaded connection, the distance the power module moves can be better controlled. The displacement is obtained by multiplying the number of rotations of the target component 25 by the thread pitch. Therefore, by controlling the number of rotations of the target component 25, the distance the power module moves can be more precisely controlled. Secondly, the threaded connection enables the power module to be ejected and pulled back with relatively strong force. Thirdly, the threaded connection better ensures the connection between the target component 25 and the power module 10. When the drive module 30 controls the target component 25 to retract, it pulls the power module 10 back, physically connecting the power module 10 to the motherboard 30, allowing the power module 10 to resume power supply to the motherboard 30, thus achieving a hard reboot of the power module 10.
[0086] In some embodiments, the electronic device also includes a housing; The motherboard 30 is fixedly connected to the chassis; The drive module 20 is connected to the motherboard 30 and / or the enclosure, and the drive module 20 and the motherboard 30 are located on the same side of the power module 10. The power module 10 is connected to the housing via a sliding component, and the power module 10 switches between a first position and a second position relative to the motherboard 30.
[0087] Optionally, the sliding component may include a slide rail, a slider, etc.
[0088] For example, the drive module 20 controls the target component 25 to extend according to the first control signal, and pushes the power module 10 out through the sliding component, so that the power module 10 is physically separated from the motherboard 30. The power module 10 is in a first position relative to the motherboard 30, and the power module 10 does not supply power to the motherboard 30, and the motherboard 30 is in a first electrical state. The drive module 20 controls the target component 25 to retract according to the second control signal, and pulls the power module 10 back through the sliding component, so that the power module 10 is physically connected to the motherboard 30, and the power module 10 is in a second position relative to the motherboard 30. The power module 10 resumes supplying power to the motherboard 30, and the motherboard 30 is in a second electrical state.
[0089] The enclosure can be an electronic equipment cabinet, which is used to assemble and install motherboards, various plug-ins, boxes, electronic components, devices and mechanical parts and components to form an integrated installation box.
[0090] Specifically, the sliding component can be disposed on the bottom surface of the housing, and the power module 10 can be disposed on the slide rail, which is arranged parallel to the first and second directions. The power module 10 can move on the slide rail. The drive module 20 controls the target component 20 to move or move on the slide rail, thereby pushing the power module 10 to move on the slide rail along the first or second direction, so that the power module 10 is physically separated from or physically connected to the motherboard 30, thereby realizing the physical power cut-off or power supply of the motherboard 30 by the power module 10.
[0091] In this embodiment, the power module 10 is pushed out and pulled back by the sliding component, which can more conveniently realize the physical separation and physical connection between the power module 10 and the motherboard 30, so that the power module 10 can switch between the first position and the second position relative to the motherboard 30, thereby realizing the hard reboot of the power module 10.
[0092] In some embodiments, see Figure 1 , Figure 2 , Figure 7 and Figure 8 As shown, the drive module 20 also includes a power supply module 27; The driver module 20 is connected to the motherboard 30 and its position relative to the motherboard 30 is fixed; optionally, the driver module 20 can be set on the motherboard 30.
[0093] When the power module 10 is in the first position relative to the motherboard 30, the power module 10 and the motherboard 30 are physically separated. The power module 10 does not supply power to the motherboard 30, the motherboard 30 is in the first power state, and the power supply module 27 supplies power to the driver module 20.
[0094] When the power module 10 is in the second position relative to the motherboard 30, the power module 10 is physically connected to the motherboard 30, the power module 10 resumes power supply to the motherboard 30, the motherboard 30 is in the second power state, and the power module 10 supplies power to the motherboard 30 and the driver module 20.
[0095] Optionally, see Figure 1 and Figure 2 As shown, the control board 21 is also provided with a third interface A, through which the control board 21 is connected to the power supply module 27.
[0096] Optionally, the power supply module 27 can be a battery, such as a high-energy-density lithium battery. The battery's capacity is sufficient to power the target component 25 for 2-3 cycles of pushing out and pulling back the power module 10, controlled by the drive module 20. When the power module 10 is physically separated from the motherboard 30, the drive module 20 is powered by the battery. When the power module 10 is physically connected to the motherboard 30, the power module 10 powers both the motherboard 30 and the drive module 20, and also charges the battery.
[0097] Optionally, combined Figure 1 , Figure 2 and Figure 7 As shown, the motherboard 30 also includes a motherboard connector 32, and the control board 21 is provided with a fourth interface D. The motherboard connector 32 is connected to the fourth interface D.
[0098] The motherboard 30 is connected to the control board 21 of the driver module 20 via the motherboard connector 32 and the fourth interface D.
[0099] When the power module 10 is physically separated from the motherboard 30, the drive module 20 is powered by the power supply module 27. When the power module 10 is physically connected to the motherboard 30, the power module 10 powers the motherboard 30, and powers the control board 21 through the motherboard connector 32 and the fourth interface D, and charges the battery.
[0100] Optionally, combined Figure 1 , Figure 2 and Figure 7 As shown, the drive module 20 also includes a mounting bracket 28, which is connected to the motherboard 30 and is used to fix the drive module 20 on the motherboard 30.
[0101] In some embodiments, the number of power modules 10 is one or more; the number of drive modules 20 is one or more; and there is a one-to-one correspondence between the power modules 10 and the drive modules 20. One or more drive modules 20 are used to synchronously control the operation of the target component 25 so as to synchronously control the position changes of one or more power modules 10.
[0102] Optionally, one or more drive modules 20, based on received control signals, synchronously control the target component 25 to extend, and synchronously push out one or more power modules 10, so that the power modules 10 move a first distance in a first direction, the power modules 10 are in a first position relative to the motherboard 30, the power modules 10 are physically separated from the motherboard 30, the power modules 10 do not supply power to the motherboard 30, and the motherboard 30 is in a first electrical state.
[0103] One or more drive modules 20, based on received control signals, synchronously control the retraction of the target component 25, pulling back one or more power modules 10 synchronously, so that the power modules 10 move a second distance along a second direction. The power modules 10 are in a second position relative to the motherboard 30, physically connected to the motherboard 30, and the power modules 10 resume supplying power to the motherboard 30, placing the motherboard 30 in a second electrical state. The second distance is the same as the first distance, and the first direction is opposite to the second direction.
[0104] The first position can be understood as the position of the power module 10 when it is physically separated from the motherboard 30 and when it does not supply power to the motherboard 30. The second position can be understood as the position of the power module 10 when it is physically connected to the motherboard 30 and when it supplies power to the motherboard 30.
[0105] The first direction is the direction in which the power module 10 moves, controlled by the drive module 20 to extend the target component 25, thereby pushing the power module 10 out. The second direction is the direction in which the power module 10 moves, controlled by the drive module 20 to retract the target component 25, thereby pulling the power module 10 back. The first direction and the second direction are exactly opposite.
[0106] The first distance refers to the distance the power module 10 moves along the first direction, and the second distance refers to the distance the power module 10 moves along the second direction. The first distance and the second distance are equal, and the directions in which the power module 10 moves the first distance and the directions in which the power module 10 moves the second distance are opposite.
[0107] For example, the first distance and the second distance are 5cm. The drive module 20 controls the target component 25 to extend, pushing the power module 10 out by 5cm, so that the second connector 11 of the power module 10 is physically separated from the first connector 31 of the motherboard 30. The drive module 20 controls the target component 25 to retract, pulling the power module 10 back by 5cm, so that the second connector 11 of the power module 10 is physically connected to the first connector 31 of the motherboard 30.
[0108] Furthermore, the drive module 20 controls the target component 25 to extend, pushing the power module 10 out by 10cm, making it easier to pick up and remove the power module 10.
[0109] For example, when only one power module 10 supplies power to the electronic device, the number of drive modules 20 is also one. The drive module 20 controls the target component 25 to extend or retract based on the received control signal, pushing out or pulling back the power module 10, so that the power module 10 is physically separated or physically connected to the motherboard 30.
[0110] For example, when multiple power modules 10 supply power to electronic devices, the number of drive modules 20 is also correspondingly multiple. Each power module 10 corresponds to one drive module 10, meaning each power module 10 has a corresponding drive module 10. Based on received control signals, the multiple drive modules 20 synchronously control multiple target components 25 to extend or retract, synchronously pushing out or pulling back multiple power modules 10. This allows multiple power modules 10 to be synchronously physically separated or connected to the motherboard 30, thereby enabling the synchronous physical separation or connection of batch power modules 10 to the motherboard 30.
[0111] This application embodiment uses a batch control drive module 20 to achieve synchronous physical separation or synchronous physical connection between batch power modules 10 and motherboard 30. In cases where batch power supply replacement or batch disassembly / reassembly is required in production and after-sales, this application embodiment can greatly improve efficiency and enhance user experience.
[0112] In a specific application scenario, taking an electronic device as a server as an example, multiple power modules 10 supply power to the motherboard 30. Normally, the basic management controller controls the server's logical power-off. When the basic management controller's power-off function fails, it outputs a control signal to each drive module 20. Based on this control signal, each drive module 20 controls the target component 25 to extend, pushing out the power module 10 so that it moves a first distance in a first direction, physically separating the power module 10 from the motherboard 30. The power module 10 no longer supplies power to the motherboard 30, and the motherboard 30 is in the first powered state. After a preset interval, the target component 25 retracts, pulling the power module 10 back so that it moves a second distance in a second direction, physically connecting the power module 10 to the motherboard 30. The power module 10 resumes supplying power to the motherboard 30, and the motherboard 30 is in the second powered state. The second distance is the same as the first distance, and the first and second directions are opposite. The target component 25 is extended and retracted by the drive module 20, thereby driving each power module 10 to physically separate and connect with the motherboard 30, thus realizing the hardware ejection and reset of the batch power modules 10, and realizing the hard reboot of the batch power modules 10.
[0113] In another specific application scenario, multiple power modules 10 supply power to the motherboard 30. Each driver module 20 may also include a communication module. External devices send control signals to each driver module 20 wirelessly. Based on the received control signals, each driver module 20 synchronously controls the target component 25 to extend or retract, so that each power module 10 is synchronously physically separated or synchronously physically connected to the motherboard 30. This enables the hardware ejection and reset of the batch power modules 10, achieving a hard reboot of the batch power modules 10.
[0114] The above embodiments are merely exemplary embodiments of this application and are not intended to limit this application. The scope of protection of this application is defined by the claims. Those skilled in the art can make various modifications or equivalent substitutions to this application within its substance and scope of protection, and such modifications or equivalent substitutions should also be considered to fall within the scope of protection of this application.
Claims
1. An electronic device, comprising: Motherboard; Power module; The drive module includes the target component; The drive module adjusts the position of the power module relative to the motherboard by driving the target component. When the power module is in a first position relative to the motherboard, the power module is physically separated from the motherboard, and the motherboard is in a first electrical state; When the power module is in a second position relative to the motherboard, the power module is physically connected to the motherboard, and the motherboard is in a second electrical state, which is different from the first electrical state.
2. The electronic device according to claim 1, The drive module is used to control the target component to work according to the first control signal, so as to adjust the power module to move a first distance along the first direction, so that the power module is in a first position relative to the motherboard; The drive module is used to control the target component to operate according to the second control signal, so as to adjust the power module to move a second distance along the second direction, so that the power module is in a second position relative to the motherboard; wherein... The second distance is the same as the first distance, and the first direction is opposite to the second direction.
3. The electronic device according to claim 1, The motherboard is provided with a first connector; The power module is provided with a second connector that is compatible with the first connector. When the first connector and the second connector are physically separated, the power module is in a non-powered state, so that the motherboard is in a first power state; When the first connector and the second connector are physically connected, the power module supplies power to the motherboard to put the motherboard into a second electrical state.
4. The electronic device according to claim 1, wherein the driving module further comprises: The control board is equipped with a driver interface; The driving components are connected to the driving interface and the target component, respectively. The control board is used to control the drive component to move the target component through the drive interface, so as to adjust the position of the power module relative to the motherboard.
5. The electronic device according to claim 4, wherein the driving component includes a first driving element; the first driving element is connected to a first interface of the driving interface; The control board controls the movement of the first driving component through the first interface, and the first driving component drives the target component to extend or retract.
6. The electronic device according to claim 4 or 5, wherein the driving component includes a second driving member; the second driving member is connected to a second interface of the driving interface; The control board controls the rotation of the second drive component through the second interface, and the second drive component drives the target component to rotate clockwise or counterclockwise.
7. The electronic device according to claim 4, wherein the power module is provided with a connection platform; The target component is provided with a connecting part adapted to the connecting platform. The control board controls the driving component to move the target component through the driving interface, so that the connecting part and the connecting platform switch between a connected state and a disconnected state. When the power module is in the first position relative to the motherboard, the connecting part is connected to the connecting platform; When the power module is in the second position relative to the motherboard, the connection part is not connected to the connection platform.
8. The electronic device according to claim 1, further comprising a housing; The motherboard is fixedly connected to the housing; The drive module is connected to the motherboard and / or the enclosure, and the drive module and the motherboard are located on the same side of the power module; The power module is connected to the housing via a sliding component, and the power module switches between the first position and the second position relative to the motherboard.
9. The electronic device according to claim 1, wherein the driving module further comprises a power supply module; The drive module is connected to the motherboard and its position relative to the motherboard is fixed. The motherboard is in the first electrical state, and the power supply module supplies power to the driver module; The motherboard is in a second electrical state, and the power module supplies power to the motherboard and the driver module.
10. The electronic device according to claim 1, wherein the number of power supply modules is one or more; the number of drive modules is one or more; and the power supply modules and the drive modules correspond one-to-one. One or more of the drive modules are used to synchronously control the operation of the target component, so as to synchronously control the position of one or more of the power modules to change.