Display circuit board, electronic device, and method of driving electronic device

Abstract

A display circuit board, an electronic device, and a method of driving the electronic device are provided. The display circuit board includes a memory and an auxiliary processor configured to read the stress table from the memory and decode the stress table, output a second image obtained by compensating the first image based on the stress table, generate new stress data of one slice based on a gradation of the second image, and output the new stress data of the one slice. Generating second cumulative stress data by summing the first cumulative stress data read from the stress table and the new stress data, encoding the second cumulative stress data such that the encoded second cumulative stress data has a data size equal to or less than a target size, and storing the encoded second accumulated stress data in the memory.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2024-0143260, filed on October 18, 2024, and all benefits derived therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] One or more embodiments relate to a display circuit board, an electronic device including the display circuit board, and a method of driving the electronic device, and more specifically, to a display circuit board, an electronic device, and a method of driving the electronic device for displaying high-quality images. Background Technology

[0003] The electronic device may include a display panel for displaying information processed by the electronic device. The display panel may include sub-pixels that emit green, red, and blue light respectively. Each sub-pixel may include a display element such as a light-emitting diode, as well as transistors and capacitors for controlling the display element.

[0004] As the display panel's driving time increases, the degradation characteristics of each sub-pixel may differ. Consequently, brightness differences between sub-pixels may occur, and ghosting or other effects may be noticeable to the user. Summary of the Invention

[0005] To compensate for afterimages, the electronic device can generate cumulative stress data for the display panel and adjust the brightness of sub-pixels based on this data. In this case, excessive data truncation may occur during data processing to reduce the amount of cumulative stress data.

[0006] One or more embodiments include a display board, electronic device, and driving electronic device for displaying high-quality images by reducing data truncation during afterimage compensation. However, the embodiments are exemplary and do not limit the scope of this disclosure.

[0007] Additional aspects will be set forth in part in the description below and will be apparent in part from the description, or may be understood by practice of the presented embodiments.

[0008] According to one or more embodiments, the display circuit board includes: an auxiliary processor that: reads a stress table from a memory and decodes the stress table; outputs a second image obtained by compensating a first image based on the stress table; generates new stress data for a slice based on the grayscale of the second image; generates second cumulative stress data by summing the first cumulative stress data read from the stress table and the new stress data; encodes the second cumulative stress data such that the encoded second cumulative stress data has a data size equal to or less than a target size; and stores the encoded second cumulative stress data in the memory.

[0009] In one embodiment, when encoding the second cumulative stress data, the auxiliary processor can estimate the predicted value of the current stress element by using a function of the previous stress element.

[0010] In one embodiment, the auxiliary processor may re-encode the second cumulative stress data by using a second prediction method different from the first prediction method, based on the determination that the data size of the second cumulative stress data encoded using the first prediction method is greater than the target size.

[0011] In one embodiment, the auxiliary processor may increase the quantization level and re-encode the second cumulative stress data by using the first prediction method, based on the determination that the data size of the second cumulative stress data after recoding using the second prediction method is greater than the target size.

[0012] In an embodiment, the size of a slice can be determined such that the second cumulative stress data is repeatedly encoded a specific number of times during a frame.

[0013] In an embodiment, one of the first prediction method and the second prediction method may include estimating the function values ​​of three stress elements adjacent to the current stress element as predicted values, and the other of the first prediction method and the second prediction method may include estimating a value that has a high similarity to the value of the current stress element from two stress elements adjacent to the current stress element as predicted values.

[0014] In an embodiment, the second cumulative stress data may include bits indicating the prediction method used in the first and second prediction methods.

[0015] In one embodiment, the auxiliary processor can generate second accumulated stress data by further adding jitter data to the first accumulated stress data and the new stress data.

[0016] In one embodiment, the auxiliary processor can update the stress table of a slice during a frame.

[0017] In one embodiment, the auxiliary processor can group multiple sub-pixels into blocks and store the average stress of the sub-pixels belonging to a block as a new stress element for that block.

[0018] In one embodiment, the auxiliary processor may encode the second accumulated stress data using an entropy coding method.

[0019] According to one or more embodiments, an electronic device includes: a display panel; and a display circuit board including an auxiliary processor, wherein the auxiliary processor reads a stress table from a memory and decodes the stress table, outputs a second image obtained by compensating a first image based on the stress table, generates new stress data for a slice based on the grayscale of the second image, generates second cumulative stress data by summing the first cumulative stress data read from the stress table and the new stress data, encodes the second cumulative stress data such that the encoded second cumulative stress data has a data size equal to or less than a target size, and stores the encoded second cumulative stress data in the memory.

[0020] According to one or more embodiments, a method for driving an electronic device includes: reading a stress table from a memory and decoding the stress table; outputting a second image obtained by compensating a first image based on the stress table; generating new stress data for a slice based on the grayscale of the second image; generating second cumulative stress data by summing the first cumulative stress data read from the stress table with the new stress data; encoding the second cumulative stress data such that the encoded second cumulative stress data has a data size equal to or less than a target size; and storing the encoded second cumulative stress data in a memory.

[0021] In an embodiment, encoding the second cumulative stress data may include: encoding the second cumulative stress data using a first prediction method; comparing the data size of the second cumulative stress data encoded using the first prediction method with a target size; and re-encoding the second cumulative stress data using a second prediction method different from the first prediction method based on the determination that the data size of the second cumulative stress data encoded using the first prediction method is greater than the target size.

[0022] In an embodiment, the encoding of the second cumulative stress data may further include: comparing the data size of the second cumulative stress data after re-encoding using the second prediction method with a target size; and based on determining that the data size of the second cumulative stress data after re-encoding using the second prediction method is greater than the target size, increasing the quantization level and re-encoding the second cumulative stress data using the first prediction method.

[0023] In an embodiment, one of the first prediction method and the second prediction method may include estimating the function values ​​of three stress elements adjacent to the current stress element as predicted values, and the other of the first prediction method and the second prediction method may include estimating a value that has a high similarity to the value of the current stress element from two stress elements adjacent to the current stress element as predicted values.

[0024] In an embodiment, the generation of the second cumulative stress data may further include adding jitter data to the first cumulative stress data and the new stress data.

[0025] In this embodiment, the stress table can be updated per frame for one slice.

[0026] In one embodiment, generating new stress data may include: grouping multiple sub-pixels into blocks; and storing the average stress of the sub-pixels belonging to a block as a new stress element for that block.

[0027] In an embodiment, a block may include 2×2 adjacent sub-pixels.

[0028] In this embodiment, the second cumulative stress data can be encoded using an entropy coding method.

[0029] Other aspects, features, and advantages of this disclosure will become more apparent from the accompanying drawings, claims, and detailed description.

[0030] These general and specific embodiments can be implemented using systems, methods, computer programs, or combinations thereof. Attached Figure Description

[0031] The above and other aspects, features and advantages of certain embodiments will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 This is a perspective view of an electronic device according to an embodiment;

[0033] Figure 2 This is an exploded perspective view of an electronic device according to an embodiment;

[0034] Figure 3 This is a block diagram illustrating an electronic device according to an embodiment;

[0035] Figure 4 This is a schematic block diagram illustrating a data conversion circuit according to an embodiment;

[0036] Figure 5 This is a schematic block diagram illustrating an encoder and decoder according to an embodiment;

[0037] Figure 6 This is a flowchart schematically illustrating the operation of the bit rate controller according to an embodiment;

[0038] Figure 7 It is a schematic diagram illustrating the stress elements of the second cumulative stress data; and

[0039] Figure 8 and Figure 9This is a schematic diagram illustrating a display panel according to an embodiment. Detailed Implementation

[0040] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein the same reference numerals always refer to the same elements. In this respect, present embodiments may take different forms and should not be construed as limited to the description set forth herein. Accordingly, embodiments are described herein with reference to the accompanying drawings to explain aspects of this description. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout the disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0041] Because this disclosure allows for various modifications and numerous embodiments, certain embodiments will be illustrated in the accompanying drawings and described in the detailed description. The effects and features of this disclosure and methods of implementation thereof will be elucidated with reference to the embodiments described in detail herein with reference to the accompanying drawings. However, this disclosure is not limited to the following embodiments and can be implemented in various forms.

[0042] In the following description, embodiments will be described in detail with reference to the accompanying drawings, wherein the same or corresponding elements are indicated by the same reference numerals throughout, and repeated descriptions thereof are omitted.

[0043] While terms such as "first" or "second" may be used to describe various components, these components should not be limited by such terms. These terms are used only to distinguish one component from another.

[0044] As used herein, the singular forms “a” and “the (said)” are intended to also include the plural forms, unless the context clearly indicates otherwise.

[0045] It will be understood that the terms “comprising” and “having” are intended to indicate the presence of a feature or element described in the specification, and not to exclude the possibility that one or more other features or elements may be present or added.

[0046] It will be further understood that when a layer, region, or component is referred to as being "on" another layer, region, or component, it can be directly on that other layer, region, or component, or indirectly on that other layer, region, or component, wherein the intermediary layer, region, or component is located between it and that other layer, region, or component.

[0047] In this specification, it will be understood that when a layer, region, or component is referred to as being "connected" to another layer, region, or component, it can be "directly connected" to that other layer, region, or component, or it can be "indirectly connected" to that other layer, region, or component, wherein the other layer, region, or component is located between it and the other layer, region, or component. In an example where a layer, region, or component is referred to as being "electrically connected" to another layer, region, or component, it can be directly electrically connected to that other layer, region, or component, or it can be indirectly electrically connected to that other layer, region, or component, wherein an intermediary layer, region, or component is located between it and the other layer, region, or component.

[0048] This document uses "A and / or B" to select only A, only B, or both A and B. It also uses "at least one of A and B" to select only A, only B, or both A and B.

[0049] In this specification, the x, y, and z directions are not limited to directions along the three axes of a Cartesian coordinate system, and can be interpreted in a broader sense. For example, the x, y, and z directions can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0050] When an embodiment can be implemented differently, the specific order of steps may differ from the order described. For example, two consecutively described steps may be performed substantially simultaneously or in the reverse order of their description.

[0051] As used herein, the term "substantially" means approximately or actually. The term "substantially simultaneous" means approximately or actually simultaneous. The term "substantially equal" means approximately or actually equal. The term "substantially identical" means approximately or actually identical. The term "substantially perpendicular" means approximately or actually perpendicular. The term "substantially parallel" means approximately or actually parallel.

[0052] For ease of illustration, the dimensions of components in the accompanying drawings may be exaggerated or reduced. For example, because the dimensions and thicknesses of components in the drawings are arbitrarily illustrated for ease of illustration, this disclosure is not limited thereto.

[0053] Figure 1 This is a perspective view illustrating an electronic device according to an embodiment. Figure 2 This is an exploded perspective view illustrating an electronic device according to an embodiment.

[0054] refer to Figure 1 and Figure 2The electronic device 1 according to the embodiment is a device for displaying moving or still images, and can be used not only in portable electronic devices such as mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, or ultra-mobile PCs (UMPCs), but also in any of a variety of devices such as televisions, laptops, monitors, billboards, or Internet of Things (IoT) devices. The electronic device 1 according to the embodiment can be used in wearable devices such as smartwatches, watch phones, glasses displays, or head-mounted displays (HMDs). The electronic device 1 according to the embodiment can be used as a central information display (CID) located on the instrument panel, center dashboard, or dashboard of a vehicle, an interior mirror display replacing the side mirrors of the vehicle, or a display located on the back of the front seats of a vehicle for the entertainment of rear-seat passengers.

[0055] For ease of description, the electronic device 1 according to the embodiment is Figure 1 and Figure 2 The electronic device 1 according to the embodiment may include a cover window 70, a display panel 10, a data driver 1430, a display circuit board 30, a component 40, a bracket 60, a main circuit board 50, a battery 80, and a lower cover 90.

[0056] In the instruction manual, "left," "right," "up," and "down" in the plan view refer to the directions when viewing the display panel 10 in a direction perpendicular to the display panel 10. For example, "left" refers to the -x direction, "right" refers to the +x direction, "up" refers to the +y direction, and "down" refers to the -y direction.

[0057] Electronic device 1 can have a rectangular shape in a plan view. For example, as shown... Figure 1 As shown, the electronic device 1 can have a rectangular planar shape, which has a shorter side in a first direction (x-direction) and a longer side in a second direction (y-direction). The corner where the shorter side in the first direction (x-direction) and the longer side in the second direction (y-direction) intersect each other can have an arc shape containing a specific curvature, or it can be formed at a right angle. The planar shape of the electronic device 1 is not limited to a rectangular shape, and can be other polygonal shapes, elliptical shapes, or irregular shapes.

[0058] The cover window 70 can be disposed on the display panel 10 and cover the top surface of the display panel 10. Accordingly, the cover window 70 can protect the top surface of the display panel 10.

[0059] The cover window 70 may include a transmissive cover portion DA70 corresponding to the display panel 10 and a light-shielding cover portion NDA70 surrounding the transmissive cover portion DA70. The light-shielding cover portion NDA70 may include an opaque material (e.g., a colored opaque material) for blocking light. The light-shielding cover portion NDA70 may include a pattern that can be displayed to the user when no image is displayed.

[0060] The display panel 10 can be positioned below the cover window 70. The display panel 10 can overlap with the transmissive cover portion DA70 of the cover window 70.

[0061] Display panel 10 includes a display area DA. The display area DA for displaying images may include an area (hereinafter referred to as the component area) that transmits light emitted from a component 40 disposed below display panel 10. Component 40 may include an external module such as a sensor or camera that uses visible light, infrared light, or sound.

[0062] Display panel 10 may be a light-emitting display panel including light-emitting diodes (LEDs). The LEDs may include organic light-emitting diodes (OLEDs) containing an organic emitting layer. In some embodiments, the LEDs may be inorganic light-emitting diodes comprising inorganic materials. Inorganic light-emitting diodes may include PN junction diodes comprising inorganic semiconductor materials.

[0063] The display panel 10 can be a rigid display panel that is not easily bent, or a flexible display panel that is easily bent, folded, or rolled. For example, the display panel 10 can be a foldable display panel that can be folded and unfolded, a curved display panel with a curved display surface, a curved display panel in which the portion other than the display surface is bent, a rollable display panel that can be rolled or unfolded, or a stretchable display panel that can be stretched.

[0064] The display panel 10 can be a transparent display panel, allowing objects or backgrounds disposed on the bottom surface of the display panel 10 to be viewed from the top surface of the display panel 10. Alternatively, the display panel 10 can be a reflective display panel capable of reflecting objects or backgrounds on the top surface of the display panel 10.

[0065] The data driver 1430 can be mounted as an integrated circuit (IC) on the display panel 10. In another embodiment, the data driver 1430 can be disposed on the display circuit board 30.

[0066] The display circuit board 30 can be attached to one side of the display panel 10. The display circuit board 30 can be a flexible printed circuit board (FPCB) that can be bent, a rigid printed circuit board (PCB) that is not easily bent, or a composite printed circuit board that includes both rigid and flexible printed circuit boards.

[0067] In one embodiment, the touch sensor driver may be disposed on the display circuit board 30. The touch sensor driver may be formed as an IC. The touch sensor driver may be attached to the display circuit board 30. The touch sensor driver may be electrically connected to the touch electrodes of the touch screen layer of the display panel 10 via the display circuit board 30. In some embodiments, the touch sensor driver may be integrated with the data driver 1430.

[0068] The touchscreen layer of the display panel 10 can detect user touch input using at least one of various touch methods, such as resistive or capacitive methods. In an example where the touchscreen layer of the display panel 10 detects user touch input using a capacitive method, the touch sensor driver can apply a drive signal to the drive electrode in the touch electrode and determine whether the user has touched the screen by detecting the voltage charged by the mutual capacitance between the drive electrode and the sensing electrode via the sensing electrode in the touch electrode. User touch can include contact touch and proximity touch. Contact touch refers to an object, such as a user's finger or pen, directly contacting the cover window 70 disposed on the touchscreen layer. Proximity touch refers to an object, such as a user's finger or pen, being near the cover window 70 (e.g., hovering). The touch sensor driver can transmit sensor data to the main processor 1110 based on the detected voltage, and the main processor 1110 can calculate the touch coordinates of the touch input by analyzing the sensor data.

[0069] In this embodiment, an auxiliary processor 1120 and a scan driver 1420 (see [link to documentation]) are used to drive the pixels of the display panel 10. Figure 3 The auxiliary processor 1120 and data driver 1430 may be disposed on the display circuit board 30. In another embodiment, the auxiliary processor 1120 may be included in the display circuit board 30.

[0070] A support bracket 60 for the display panel 10 may be disposed below the display panel 10. The support bracket 60 may include plastic, metal, or both plastic and metal. A first camera hole CMH1 into which the camera module 1710 is inserted, a battery hole BH in which the battery 80 is disposed, and a cable hole CAH through which the cable connected to the display circuit board 30 passes may be formed in the support bracket 60. A component hole CPH overlapping with the display panel 10 may be formed in the support bracket 60. The component hole CPH may overlap with the component 40 of the main circuit board 50 in the third direction (z-direction). In one embodiment, the display area DA of the display panel 10 may overlap with the component 40 of the main circuit board 50 in the third direction (z-direction). In another embodiment, the component hole CPH may not be formed in the support bracket 60.

[0071] In an embodiment, component 40 may include first to fourth components 41, 42, 43, and 44 overlapping the display panel 10. The first to fourth components 41, 42, 43, and 44 may be provided as a proximity sensor, an illumination sensor, an iris sensor, a facial recognition sensor, or a camera (or image sensor), respectively. An infrared proximity sensor can detect objects near the top surface of the electronic device 1, and an illumination sensor can detect the brightness of light incident on the top surface of the electronic device 1. In some aspects, an iris sensor can capture an image of the iris of a person located above the top surface of the electronic device 1, and a camera can capture an image of an object located above the top surface of the electronic device 1. Component 40 is not limited to proximity sensors, illumination sensors, iris sensors, facial recognition sensors, and cameras, and various modules can be arranged.

[0072] The main circuit board 50 and the battery 80 can be positioned below the bracket 60. The main circuit board 50 can be a rigid printed circuit board or a flexible printed circuit board.

[0073] The main circuit board 50 may include a main processor 1110, a camera module 1710, a main connector 55, and a component 40. The main processor 1110 may be formed as an IC. The camera module 1710 may be disposed on both the top and bottom surfaces of the main circuit board 50, and each of the main processor 1110 and the main connector 55 may be disposed on either the top or bottom surface of the main circuit board 50.

[0074] Camera module 1710 processes image frames, such as still images or moving images, obtained by an image sensor in camera mode, and outputs the image frames to main processor 1110. Camera module 1710 may include at least one of a camera sensor (e.g., CCD or CMOS), a photoelectric sensor (or image sensor), and a laser sensor. Camera module 1710 may be connected to the image sensor in component 40 and can process images input through the image sensor.

[0075] The cable passing through the cable hole CAH of the bracket 60 can be connected to the main connector 55, and thus the main circuit board 50 can be electrically connected to the display circuit board 30.

[0076] The lower cover 90 can form the appearance of the electronic device 1, and an opening exposing a portion of the display panel 10 can be formed in the front surface of the lower cover 90. The lower cover 90 has an open shape corresponding to the surface of the display panel 10 and can be assembled to the display panel 10. The lower cover 90 can be disposed opposite to the cover window 70, with the display panel 10 between the lower cover 90 and the cover window 70. The lower cover 90 can be disposed below the main circuit board 50 and the battery 80. The lower cover 90 can be fastened and fixed to the bracket 60. The lower cover 90 can form the appearance of the bottom surface of the electronic device 1. The lower cover 90 can include plastic, metal, or both plastic and metal.

[0077] A second camera hole CMH2, exposing the bottom surface of the camera module 1710, can be formed in the lower cover 90. The position of the camera module 1710 and the corresponding positions of the first camera hole CMH1 and the second camera hole CMH2 are not limited to... Figure 2 The position shown in the diagram can be changed in various ways.

[0078] Figure 3 This is a block diagram illustrating an electronic device according to an embodiment.

[0079] refer to Figure 3 Electronic device 1 may include a processor 1100, a memory 1200, an input module 1300, a display module 1400, a power module 1500, an internal module 1600, and an external module 1700. According to embodiments, in electronic device 1, at least one of the components described as included in electronic device 1 may be omitted, or one or more other components may be added. According to embodiments, some of the components described as included in electronic device 1 (e.g., internal module 1600) may be integrated into another component (e.g., display module 1400).

[0080] The processor 1100 can control another component (e.g., hardware or software component) connected to the electronic device 1 by executing software, and can perform various data processing or calculations. According to an embodiment, as at least part of data processing or calculation, the processor 1100 can store commands or data received from another component (e.g., input module 1300, sensor module 1610, or communication module 1730) in volatile memory 1210, can process commands or data stored in volatile memory 1210, and can store result data in non-volatile memory 1220.

[0081] Processor 1100 may include a main processor 1110 and an auxiliary processor 1120. Main processor 1110 may include at least one of a central processing unit (CPU) 1111 and an application processor (AP). Main processor 1110 may further include at least one of a graphics processing unit (GPU) 1112, a communication processor (CP), and an image signal processor (ISP). Main processor 1110 may further include a neural processing unit (NPU) 1113. The NPU is a processor specifically designed to process artificial intelligence (AI) models, and the AI ​​models can be generated through machine learning. The AI ​​model may include multiple layers of artificial neural networks. The artificial neural networks may be, but are not limited to, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or combinations thereof. In addition to or as an alternative to hardware architectures, AI models may include software architectures. Of the described processing units and processors, at least two may be integrated into a single unit (e.g., a single chip), or each may be implemented as a separate unit (e.g., multiple chips).

[0082] The auxiliary processor 1120 may include a controller 1121. The controller 1121 may include interface conversion circuitry and timing control circuitry. The controller 1121 receives image signals from the main processor 1110, converts the data format of the image signals to conform to the interface specifications of the display module 1400, and outputs the image data. The controller 1121 may output various control signals that support driving the display module 1400.

[0083] The auxiliary processor 1120 may further include data processing circuitry, such as a data conversion circuit 1122, a gamma correction circuit 1123, and a rendering circuit 1124. The data conversion circuit 1122 may receive image data from the controller 1121 and may compensate the image data to display the image at the desired brightness according to the characteristics of the electronic device 1 or the user's settings, or may convert the image data to reduce power consumption or compensate for afterimages.

[0084] Display panel 10 may include multiple pixels. Each pixel may include sub-pixels that emit green, red, and blue light respectively. Each sub-pixel may include a display element such as a light-emitting diode (LED) and transistors and capacitors for driving the display element. LEDs may degrade due to stress accumulated during driving. This stress may be proportional to the pixel's driving time, temperature, brightness, driving current, and voltage. In areas where a specific image is continuously displayed, such as a status bar, afterimages may remain due to the degradation of sub-pixels in display panel 10, even when the output image changes. To reduce these afterimages and provide a high-quality image, data conversion circuit 1122 can track the stress of sub-pixels and adjust the brightness of sub-pixels according to a preset degradation modeling curve.

[0085] The gamma correction circuit 1123 can convert image data or a gamma reference voltage so that the image displayed on the electronic device 1 has the desired gamma characteristics. The rendering circuit 1124 can receive image data from the controller 1121 and can render the image data by taking into account the pixel arrangement applied to the display panel 10 of the electronic device 1. At least one of the data conversion circuit 1122, the gamma correction circuit 1123, and the rendering circuit 1124 can be integrated into another component (e.g., the main processor 1110 or the controller 1121).

[0086] The memory 1200 may store various data used by at least one component of the electronic device 1 (e.g., processor 1100 or sensor module 1610), as well as input or output data of commands associated with the various data. The memory 1200 may include at least one of volatile memory 1210 and non-volatile memory 1220.

[0087] The input module 1300 can receive commands or data from outside the electronic device 1 (e.g., a user or external electronic device 2000) to be used in components of the electronic device 1 (e.g., processor 1100, sensor module 1610, or voice output module 1630).

[0088] The input module 1300 may include a first input module 1310 to which commands or data are input from a user and a second input module 1320 to which commands or data are input from an external electronic device 2000.

[0089] The first input module 1310 may include a microphone, mouse, keyboard, or pen (e.g., a passive or active pen). The first input module 1310 may include mechanical input devices or touch input devices, such as buttons, dome switches, scroll wheels, or scroll wheel switches located on the rear or side surface of the electronic device 1. The touch input device may include a touchscreen layer of the display panel 10.

[0090] The second input module 1320 can be connected, wired or wirelessly, to various types of external electronic devices 2000 connected to the electronic device 1. According to embodiments, the second input module 1320 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, or an audio interface. The second input module 1320 may include connectors (e.g., HDMI connector, USB connector, SD card connector, or audio connector (e.g., headphone connector)) for physically connecting the electronic device 1 to the external electronic device 2000. In response to the external electronic device 2000 being connected to the second input module 1320, the electronic device 1 can perform appropriate controls associated with the connected external electronic device 2000.

[0091] Display module 1400 provides information to the user visually. Display module 1400 may include display panel 10, scan driver 1420, and data driver 1430.

[0092] Display panel 10 displays (outputs) information processed by electronic device 1. Display panel 10 can display execution screen information of an application driven by electronic device 1 or user interface (UI) or graphical user interface (GUI) information based on the execution screen information.

[0093] The scan driver 1420 can be mounted as a driver chip on the display panel 10. Alternatively, the scan driver 1420 can be formed directly on the display panel 10. For example, the scan driver 1420 may include an amorphous silicon thin-film transistor (TFT) gate driver circuit (ASG), a low-temperature polycrystalline silicon (LTPS) TFT gate driver circuit, or an oxide semiconductor TFT gate driver circuit (OSG) integrated into the display panel 10. The scan driver 1420 receives control signals from the controller 1121 and outputs scan signals to the display panel 10 in response to the control signals.

[0094] The data driver 1430 receives a control signal from the controller 1121, converts the image data into a data voltage that is an analog voltage in response to the control signal, and then outputs the data voltage to the display panel 10.

[0095] The power module 1500 supplies power to the components of the electronic device 1. The power module 1500 may include a battery 80 charged with the power supply voltage (see [link to battery description]). Figure 2In some aspects, the power module 1500 may include a connection port, which may be included in a second input module 1320 for connecting an external charger for powering the battery 80 to charge the battery 80. Alternatively, the power module 1500 may include a wireless power transmitting / receiving component for wirelessly charging the battery 80. The wireless power transmitting / receiving component may include multiple antenna radiators in the form of coils. The power module 1500 may include a power management integrated circuit (PMIC). The PMIC supplies optimized power to each of the components of the electronic device 1.

[0096] The electronic device 1 may further include an internal module 1600 and an external module 1700. The internal module 1600 may include a sensor module 1610, an antenna module 1620, and a sound output module 1630. The external module 1700 may include a camera module 1710, an optical module 1720, and a communication module 1730.

[0097] Sensor module 1610 may include a touch sensor driver and touch electrodes of the touchscreen layer of display panel 10. Sensor module 1610 can detect input from a user's body part or pen input and can generate an electrical signal or data value corresponding to the input. Sensor module 1610 may include at least one of fingerprint sensor 1611, input sensor 1612, and digitizer 1613.

[0098] The fingerprint sensor 1611 can generate data values ​​corresponding to a user's fingerprint. The fingerprint sensor 1611 can include any of an optical fingerprint sensor and a capacitive fingerprint sensor.

[0099] The input sensor 1612 can generate data values ​​corresponding to the coordinate information of input from a user's body part or a pen. The input sensor 1612 generates the amount of capacitance change caused by the input as a data value. The input sensor 1612 can detect input from a passive pen, or it can send data to and receive data from an active pen.

[0100] The input sensor 1612 can measure biosignals related to biometric information such as blood pressure, water content, or body fat. In an example where a user touches a part of his / her body to the sensor layer or sensing panel and does not move it for a specific period of time, the input sensor 1612 can detect biosignals based on changes in the electric field caused by the body part and can output the information desired by the user to the display module 1400.

[0101] The digitizer 1613 can generate data values ​​corresponding to the coordinate information of the pen input. The digitizer 1613 generates the electromagnetic change caused by the input as a data value. The digitizer 1613 can detect input from a passive pen, or it can send data to and receive data from an active pen.

[0102] In an embodiment, at least one of the fingerprint sensor 1611, the input sensor 1612, and the digitizer 1613 may be embedded in the display panel 10. For example, at least one of the fingerprint sensor 1611, the input sensor 1612, and the digitizer 1613 may be formed by a process that is sequential with the process of forming the pixel circuitry and the light-emitting diodes of the display panel 10. Accordingly, the display panel 10 may serve as one of the input modules 1300 that provide an input interface between the electronic device 1 and the user, and may also serve as one of the display modules 1400 that provide an output interface between the electronic device 1 and the user.

[0103] In another embodiment, at least two of the fingerprint sensor 1611, input sensor 1612, and digitizer 1613 can be integrated into a single sensing panel using the same process. The sensing panel can be disposed between the display panel 10 and a cover window 70 disposed above the display panel 10 (see...). Figure 2 (between), but this disclosure is not limited thereto.

[0104] Antenna module 1620 may include one or more antennas for transmitting or receiving signals or power to or from an external source. According to an embodiment, communication module 1730 may transmit signals to or receive signals from an external electronic device via an antenna suitable for a communication method. The antenna configuration of antenna module 1620 may be integrated into a component of input sensor 1612 or display module 1400 (e.g., display panel 10).

[0105] The sound output module 1630 is a device for outputting sound signals to the outside of the electronic device 1, and can output sound data received from the communication module 1730 or stored in the memory 1200 in call signal receiving mode, call mode or recording mode, voice recognition mode or broadcast receiving mode. The sound output module 1630 can output sound signals related to the functions performed in the electronic device 1 (e.g., call signal receiving sound or message receiving sound). The sound output module 1630 may include a receiver and a speaker. At least one of the receiver and speaker may be a sound generating device attached to the bottom of the display panel 10 and outputting sound by vibrating the display panel 10. The sound generating device may be a piezoelectric element or piezoelectric actuator that contracts or expands according to an electrical signal, or it may be an exciter that generates magnetic force by using a voice coil to vibrate the display panel 10.

[0106] Camera module 1710 can capture still images and moving images. According to embodiments, camera module 1710 may include one or more lenses, an image sensor, or an image signal processor. Camera module 1710 may further include an infrared camera for measuring the presence or absence of a user, the user's position, and the user's gaze.

[0107] The light module 1720 can output signals to notify of events or provide light for acquiring images by using light from a light source. Examples of events may include message reception, call signal reception, missed calls, alarms, calendar notifications, email reception, and battery charging capacity information notifications. The light module 1720 may include a light-emitting diode or a xenon lamp. The light module 1720 can emit monochromatic or multicolor light onto the front or rear surface of the electronic device 1. The light module 1720 can interact with the camera module 1710 or operate independently.

[0108] Communication module 1730 can support the establishment of a wired or wireless communication channel between electronic device 1 and external electronic device 2000, and the performance of communication through the established communication channel. Communication module 1730 may include one or both of the following: a wireless communication module, such as a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module; and a wired communication module, such as a local area network (LAN) communication module or a power line communication module. Communication module 1730 can transmit and receive wireless signals via the Internet using at least one of Wireless LAN (WLAN), Wi-Fi, Wi-Fi Direct, and Digital Living Network Alliance (DLNA). In some aspects, communication module 1730 can use Bluetooth. ® The communication module 1730 of various types described herein can be implemented as a single chip or as a discrete chip. It supports short-range communication using at least one of the following: Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee, Near Field Communication (NFC), Wi-Fi, Wi-Fi Direct, and Wireless Universal Serial Bus (USB).

[0109] Electronic device 1 outputs various information through display module 1400 within the operating system. In an example where processor 1100 executes an application stored in memory 1200, display module 1400 provides the application information to the user through display panel 10.

[0110] Based on the input image received from the input module 1300 or the sensor module 1610, the processor 1100 outputs commands or data to the display module 1400, the sound output module 1630, the camera module 1710, or the optical module 1720. For example, the processor 1100 can generate image data corresponding to the input data and output the image data to the display module 1400, or it can generate command data corresponding to the input data and output the command data to the camera module 1710 or the optical module 1720. In an example where no input data is received from the input module 1300 for a specific time period, the processor 1100 can switch the operating mode of the electronic device 1 to a low-power mode or a sleep mode to reduce the power consumed by the electronic device 1.

[0111] Processor 1100 receives external input via input module 1300 or sensor module 1610 and executes an application corresponding to the external input. In the example where the user selects a camera icon displayed on display panel 10, processor 1100 receives user input via input sensor 1612 and activates camera module 1710. Processor 1100 transmits image data corresponding to the image captured by camera module 1710 to display module 1400. Display module 1400 can display the image corresponding to the captured image via display panel 10.

[0112] In another example, when personal information authentication is performed in display module 1400, fingerprint sensor 1611 obtains the input fingerprint information as input data. Processor 1100 compares the input data obtained by fingerprint sensor 1611 with authentication information stored in memory 1200 and executes the application based on the comparison result. Display module 1400 can display the information executed according to the application logic via display panel 10.

[0113] In another example, when a music stream icon displayed on display module 1400 is selected, processor 1100 receives user input via input sensor 1612 and activates the music stream application stored in memory 1200. In an example where a music execution command is entered into the music stream application, processor 1100 activates sound output module 1630 and provides the user with sound information corresponding to the music execution command.

[0114] Some of the components can be connected to each other via peripheral communication methods (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), mobile industrial processor interface (MIPI), or hyperpath interconnect (UPI) link) to exchange signals (e.g., commands or data). In an embodiment, the main processor 1110 can transmit image signals to the auxiliary processor 1120 via MIPI.

[0115] Figure 4 This is a block diagram schematically illustrating a data conversion circuit according to an embodiment.

[0116] refer to Figure 4 The data conversion circuit 1122 may include a compensation circuit 210, a stress conversion circuit 220, a summing circuit 230, an extraction circuit 240, an encoder 250, a memory control circuit 270, and a decoder 260. This is because the data conversion circuit 1122 is included in the auxiliary processor 1120 (see...). Figure 2 Therefore, the operation of the data conversion circuit 1122 or the operation of the components constituting the data conversion circuit 1122 can be represented as the operation of the auxiliary processor 1120. The auxiliary processor 1120 can be disposed on the display circuit board 30 (see...). Figure 2 )superior.

[0117] Memory 1200 (see) Figure 3 At least a portion of the memory 1200 used by the auxiliary processor 1120, as well as input or output data of commands related to the various data, may be stored on the display circuit board 30.

[0118] The memory 1200 can store a stress table. The stress table can be a table of stress elements that respectively indicate the cumulative stress received by each sub-pixel of the display panel 10. The cumulative stress of each sub-pixel can be proportional to the driving time, temperature, brightness, driving current and voltage of that sub-pixel, and the stress elements can be values ​​used to estimate the cumulative stress of the corresponding sub-pixel.

[0119] Whenever a new image is displayed on the display panel 10, at least a portion of the stress table can be updated. In an example where a first image IMGi (input image) is input, the data conversion circuit 1122 can output a second image IMGo (output image) obtained by compensating for afterimages, and the stress table can be updated by summing the new stress and cumulative stress of the subpixels caused by the output of the second image IMGo.

[0120] In this embodiment, the data conversion circuit 1122 can update one slice per frame. In the specification, a slice refers to a unit obtained by dividing a stress table into specific dimensions. In an example where the stress table has dimensions of 480 × 270 and one slice comprises four rows, the stress table can be divided into 68 slices. One slice may correspond to an area in the display panel 10 that has a generally quadrilateral shape.

[0121] Stress tables can be encoded (or decoded) in slices, enabling the design of highly complex compression techniques with small logical dimensions. In some aspects, when a portion of the stress data is corrupted, only the slice to which that data belongs is lost, thus preventing errors from propagating throughout the stress table.

[0122] The memory control circuit 270 can read the stress table from the memory 1200 and transmit it to the decoder 260. The decoder 260 can decode the stress table and output the decoded stress table to the compensation circuit 210. The compensation circuit 210 can output the second image IMGo, which is obtained by compensating the first image IMGi based on the stress table. The compensation circuit 210 can adjust the brightness (or grayscale) of sub-pixels based on the stress table and a preset degradation modeling curve.

[0123] The stress conversion circuit 220 can sample (e.g., generate) the stress received by each sub-pixel of the display panel 10 due to the display of the second image IMGo. In this case, the stress conversion circuit 220 can generate new stress data for one slice per frame. Hereinafter, the slice updated when new stress data is generated in the current frame is referred to as the current slice. In an embodiment, the stress conversion circuit 220 can generate new stress data for the current slice based on the grayscale of the second image IMGo.

[0124] In an embodiment, the stress conversion circuit 220 can reduce the size of the new stress data by averaging the stress of adjacent sub-pixels. For example, the stress conversion circuit 220 can group multiple sub-pixels into blocks, calculate the average stress of the sub-pixels belonging to the block, and store the average value as a new stress element for that block.

[0125] The description of sampling new stress data in this document may include generating data representing stress or acquiring data samples representing stress. For example, the description of sampling new stress data in this document may include modeling or calculating the amount of force corresponding to elements (e.g., slices, subpixels) described in this document. In some examples, the description of sampling new stress data in this document may include generating or calculating stress data based on element (e.g., slices, subpixels) sampling.

[0126] Afterimage compensation can be performed for each color of a sub-pixel. In other words, adjacent sub-pixels emitting the same color of light can be grouped into a block, and new stress data can be calculated. For example, stress conversion circuit 220 can group adjacent red sub-pixels into block R, calculate the average stress of the sub-pixels belonging to block R, and store the average stress as a new stress element for block R. Similarly, stress conversion circuit 220 can group adjacent green sub-pixels into block G and blue sub-pixels into block B, and calculate new stress elements for blocks G and B.

[0127] An element of the stress table can be a function of the stress of sub-pixels included in a block. In an embodiment, a block may include 2×2 adjacent sub-pixels. In an embodiment, the stress conversion circuit 220 may omit the step of averaging the stress of sub-pixels on a block-by-block basis and may sample the stress of each sub-pixel as new stress data.

[0128] Extraction circuit 240 can read first cumulative stress data (or previous cumulative stress data of the current slice) including stress elements from stress table decoded by decoder 260, and can transmit the first cumulative stress data to summing circuit 230.

[0129] The summing circuit 230 generates second cumulative stress data by summing the first cumulative stress data read from the stress table and the new stress data. In an embodiment, the summing circuit 230 can generate the second cumulative stress data by further adding jitter data to the first cumulative stress data and the new stress data. The jitter data may include artificially generated noise to prevent false contour lines or Mach phenomena caused by data compression. The summing circuit 230 can compensate for truncation errors caused by data compression by adding jitter data.

[0130] Encoder 250 can encode the second accumulated stress data output from summing circuit 230 such that the encoded second accumulated stress data has a data size (used bits) equal to or less than the target size (target bits). Encoder 250 can use a prediction method that estimates the predicted value of the current stress element by using a function of previous stress elements. Encoder 250 can use any of at least two prediction methods and can compress the second accumulated stress data by using an entropy coding method. Entropy coding methods can include Huffman coding and arithmetic coding methods. The encoded second accumulated stress data can include bits indicating the prediction method used.

[0131] In response to determining that the data size of the encoded second cumulative stress data is greater than the target size, encoder 250 can re-encode the second cumulative stress data using a prediction method different from the previously used prediction method. In response to determining that the data size of the encoded second cumulative stress data is still greater than the target size, encoder 250 can reduce the encoding accuracy and re-encode the second cumulative stress data by changing the prediction method. Encoder 250 can iteratively control the data size of the encoded second cumulative stress data to be equal to or less than the target size.

[0132] In response to the determination that the data size of the encoded second cumulative stress data is equal to or less than the target size, the encoded second cumulative stress data can be stored in the memory 1200 via the memory control circuit 270. Accordingly, the current slice of the stress table can be updated.

[0133] Figure 5 This is a schematic block diagram illustrating the encoder and decoder according to an embodiment. Figure 6 This is a flowchart schematically illustrating the operation of a bit rate controller according to an embodiment. Figure 7 This is a schematic diagram illustrating the stress elements of the second cumulative stress data.

[0134] refer to Figure 5 and Figure 6 The encoder 250 may include a prediction-quantizer 251, an entropy encoder 252, and a bit rate controller 253, and the decoder 260 may include an entropy decoder 261 and a scaler 262.

[0135] First, the memory control circuit 270 can read the stress table from the memory 1200 and transmit it to the decoder 260, which can then decode the stress table. The entropy decoder 261 can decode the stress table using an entropy coding method. The scaler 262 can restore the quantized values ​​to continuous values ​​and can reconstruct data lost or transformed due to compression. For example, the scaler 262 can reconstruct the data by combining the predicted value of each stress element with the residual.

[0136] Extraction circuit 240 can read first cumulative stress data, including stress elements of the current slice, from the stress table decoded by decoder 260, and can transmit the first cumulative stress data to summing circuit 230.

[0137] The summing circuit 230 can receive new stress data for the current slice generated by the stress conversion circuit 220, and can generate second cumulative stress data by summing the new stress data and the first cumulative stress data. In an embodiment, the summing circuit 230 can compensate for truncation errors caused by data compression by summing the first cumulative stress data, the new stress data, and jitter data. The summing circuit 230 can output the second cumulative stress data to the encoder 250.

[0138] The prediction-quantizer 251 can reduce the size of the second cumulative stress data by using a prediction method that generates predicted values ​​for the current stress elements, employing a function of the previous stress elements. The prediction-quantizer 251 can process the second cumulative stress data by using any of at least two prediction methods. In some aspects, the prediction-quantizer 251 can quantize the second cumulative stress data to reduce its size.

[0139] In an embodiment, the prediction-quantizer 251 may use a median adaptive prediction method. For example, refer to Figure 7 The predicted value (p) of the current stress element s can be expressed as a function value based on the three stress elements adjacent to the current stress element s (e.g., the left element a, the top element b, and the diagonal element c). The predicted value (p) of the current stress element s can be estimated based on the left element a, the top element b, and the diagonal element c (e.g., median(a, b, (a+bc))).

[0140] The predictor-quantizer 251 can use a selective reference prediction method. The predicted value (p) of the current stress element s can be estimated by identifying the stress element with a value that has a high similarity to the value of the current stress element s from two stress elements (e.g., left element a and upper element b) set adjacent to the current stress element s. In the example where the absolute value of the difference between the left element a and the current stress element s (abs(as)) is greater than the absolute value of the difference between the upper element b and the current stress element s (abs(bs)), the predicted value (p) of the current stress element s can be estimated as the value of the upper element b.

[0141] Each of stress element a, stress element b, and stress element c can indicate the cumulative stress (stress value) associated with the corresponding sub-pixel of the display panel 10.

[0142] The selective reference prediction method can be represented by the following algorithm, as shown in Equation 1.

[0143] [Equation 1]

[0144] If (abs(as) > abs(bs))

[0145] p = b, direction = 1;

[0146] else

[0147] p = a, direction = 0.

[0148] Selective reference prediction methods include using additional bits to store the direction of the selected stress element that indicates which of the previously estimated stress elements a and b is the predicted value for the current stress element s. In this case, the direction of the selected stress element can be stored using a run-length encoding method, thereby reducing the size of the second accumulated stress data.

[0149] Entropy encoder 252 can encode the second accumulated stress data processed by prediction-quantizer 251 using an entropy encoding method. The entropy encoding method may include encoding the data using probabilities and statistics, and the probabilities and statistics used may be included in the bitstream of the encoded second accumulated stress data. In an embodiment, a portion of the encoded second accumulated stress data may be encoded using a run-length encoding method.

[0150] The bit rate controller 253 can compare the data size of the encoded second accumulated stress data with the target size. When the data size is equal to or less than the target size (i.e., the bit rate controller 253 determines that the data size is equal to or less than the target size through comparison), the encoded second accumulated stress data can be output to the memory control circuit 270. Conversely, when the data size is greater than the target size (i.e., the bit rate controller 253 determines that the data size is greater than the target size through comparison), the second accumulated stress data can be re-encoded using a prediction method different from the previous prediction method. In the following text, reference will be made to... Figure 6 Describes the iterative operation of encoder 250 performed by bit rate controller 253.

[0151] First, encoder 250 can process and encode the second accumulated stress data using a first prediction method (step S110). Prediction-quantizer 251 can process and quantize the second accumulated stress data transmitted from summing circuit 230 using the first prediction method. Entropy encoder 252 can encode the second accumulated stress data processed using the first prediction method using an entropy encoding method.

[0152] The bit rate controller 253 compares the data size of the encoded second accumulated stress data with the target size (step S120). In an example where the data size of the encoded second accumulated stress data is equal to or less than the target size, the encoder 250 outputs the encoded second accumulated stress data to the memory control circuit 270, stores the second accumulated stress data in the memory 1200, and ends the stress update of the current slice.

[0153] When the size of the encoded second accumulated stress data is larger than the target size, encoder 250 re-encodes the second accumulated stress data using a second prediction method different from the first prediction method (step S130). Prediction-quantizer 251 processes and quantizes the second accumulated stress data transmitted from summing circuit 230 using the second prediction method. In an example where the first prediction method is a median adaptive prediction method, the second prediction method can be a selective reference prediction method. In an example where the first prediction method is a selective reference prediction method, the second prediction method can be a median adaptive prediction method. Entropy encoder 252 can re-encode the second accumulated stress data processed using the second prediction method by using an entropy encoding method.

[0154] The bit rate controller 253 compares the data size of the second accumulated stress data, which has been re-encoded using the second prediction method, with the target size (step S140). In an example where the data size of the re-encoded second accumulated stress data is equal to or less than the target size, the encoder 250 outputs the re-encoded second accumulated stress data to the memory control circuit 270, stores the second accumulated stress data in the memory 1200, and ends the stress update for the current slice.

[0155] When the data size of the re-encoded second accumulated stress data is larger than the target size, encoder 250 controls the encoding accuracy (step S150). For example, encoder 250 can reduce the accuracy and increase the quantization level of prediction-quantizer 251, and can use the updated quantization level of prediction-quantizer 251 to re-encode the second accumulated stress data by reusing the first prediction method (step S110). Encoder 250 can refer to the references in this document. Figure 6 The described steps are iterated until the size of the encoded second cumulative stress data is equal to or less than the target size. The number of iterations for encoder 250 can vary for each slice.

[0156] The size of the slice can be determined based on the complexity of the encoding algorithm and the target number of iterations. The target number of iterations can be the maximum number of encoding operations performed until the data size of the second accumulated stress data is equal to or less than the target size. Typically, when the encoder 250 reduces the encoding precision by two levels, the data size of the encoded second accumulated stress data can be equal to or less than the target size. In this case, the target number of iterations can be, but is not limited to, 6.

[0157] When using the same encoding algorithm, the size of the slice and the time period associated with encoding the second cumulative stress data once (e.g., the time period required to encode the second cumulative stress data once) can be proportional to each other. Because the data conversion circuit 1122 updates the stress table of one slice per frame, the size of the slice is determined such that the second cumulative stress data is repeatedly encoded a specific number of times during a frame (target iteration number).

[0158] Figure 8 and Figure 9 This is a schematic diagram illustrating a display panel according to an embodiment.

[0159] The stress table can be divided into multiple slices, and can be encoded and decoded on a slice-by-slice basis. Each slice can correspond to an area with a generally quadrilateral shape in the display panel 10.

[0160] For example, the first slice of the stress table may include stress elements for estimating the cumulative stress of sub-pixels Ps belonging to the first slice region Slice1 of the display panel 10. Each of the slice regions Slice 1, Slice 2, ... and Slice 6 may have a constant size.

[0161] In an embodiment, such as Figure 8 As shown, the width of each of the slice regions Slice 1, Slice 2, ..., and Slice 6 in the first direction (x-direction) can be the same as the width of the display panel 10. The height of each of the slice regions Slice 1, Slice 2, ..., and Slice 6 can include a specific number of sub-pixel rows. For example, the height of each of the slice regions Slice 1, Slice 2, ..., and Slice 6 can correspond to 4 rows, and the width of each of the slice regions Slice 1, Slice 2, ..., and Slice 6 can correspond to 24 columns. The display panel 10 can be divided into 6 slice regions, and the stress table can include 6 slices corresponding to the 6 slice regions.

[0162] In an embodiment, such as Figure 9As shown, the width of each of the slice regions Slice 1, Slice 2, ..., and Slice 12 in the first direction (x-direction) may differ from the width of the display panel 10. For example, the height of each of the slice regions Slice 1, Slice 2, ..., and Slice 12 may correspond to 4 rows, and the width of each of the slice regions Slice 1, Slice 2, ..., and Slice 12 may correspond to 12 columns. The display panel 10 may be divided into 12 slice regions, and the stress table may include 12 slices corresponding to the 12 slice regions. The size of the slices is determined such that the second cumulative stress data is repeatedly encoded a specific number of times (target iteration number) during a frame.

[0163] Multiple adjacent sub-pixels Ps (e.g., 2×2 adjacent sub-pixels Ps) can be grouped into a block BL. Stress can be tracked and stored on a block BL basis. For example, the average stress of the sub-pixels Ps belonging to a block BL can be stored as a stress element of the block BL. Each slice can include stress elements of the block BL contained within the corresponding slice region.

[0164] Although for the sake of explanation, in Figure 8 and Figure 9 The display panel 10 includes 24×24 subpixels Ps, but this disclosure is not limited thereto. The display panel 10 may include more subpixels Ps and sliced ​​areas.

[0165] According to the embodiments described herein, methods can be provided for display circuit boards, electronic devices, and driving electronic devices that can display high-quality images by reducing data truncation during afterimage compensation. However, the scope of this disclosure is not limited to this effect.

[0166] It should be understood that the embodiments described herein are to be considered in a descriptive sense and not for limiting purposes. The description of features or aspects in each embodiment should typically be considered as other similar features or aspects that may be used in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various modifications of form and detail may be made therein without departing from the spirit and scope as defined by the claims.

Claims

1. A display circuit board, comprising: Auxiliary processor, the auxiliary processor: Read the stress table from the memory and decode the stress table. The output is a second image obtained by compensating the first image based on the stress table. A new stress data for a slice is generated based on the grayscale of the second image. The second cumulative stress data is generated by summing the first cumulative stress data read from the stress table with the new stress data. The second accumulated stress data is encoded such that the encoded second accumulated stress data has a data size equal to or smaller than the target size, and The encoded second accumulated stress data is stored in the memory.

2. The display circuit board according to claim 1, wherein, When encoding the second accumulated stress data, the auxiliary processor estimates the predicted value of the current stress element by using a function of the previous stress element.

3. The display circuit board according to claim 2, wherein, The auxiliary processor, based on the determination that the data size of the second cumulative stress data encoded using the first prediction method is greater than the target size, re-encodes the second cumulative stress data using a second prediction method different from the first prediction method.

4. The display circuit board according to claim 3, wherein, The auxiliary processor, based on the determination that the data size of the second cumulative stress data re-encoded using the second prediction method is greater than the target size, increases the quantization level and re-encodes the second cumulative stress data using the first prediction method.

5. The display circuit board according to claim 4, wherein, The size of the slice is determined such that the second cumulative stress data is repeatedly encoded a specific number of times during a frame.

6. The display circuit board according to claim 3, wherein: One of the first prediction method and the second prediction method includes estimating the function values ​​of three stress elements adjacent to the current stress element as the predicted value, and Another of the first prediction method and the second prediction method includes estimating a value that has a high similarity to the value of the current stress element from two stress elements adjacent to the current stress element as the predicted value.

7. The display circuit board according to claim 3, wherein, The second cumulative stress data includes bits indicating the prediction method used in the first and second prediction methods.

8. The display circuit board according to claim 1, wherein, The auxiliary processor generates the second accumulated stress data by further adding jitter data to the first accumulated stress data and the new stress data.

9. The display circuit board according to claim 1, wherein, The auxiliary processor updates the stress table of one slice during a frame.

10. The display circuit board according to claim 1, wherein, The auxiliary processor: Group multiple sub-pixels into blocks; and The average stress of the sub-pixels belonging to the block is stored as a new stress element of the block.

11. The display circuit board according to claim 1, wherein, The auxiliary processor encodes the second accumulated stress data using an entropy coding method.

12. An electronic device comprising: Display panel; as well as The display circuit board according to any one of claims 1 to 11.

13. A method for driving an electronic device, the method comprising: Read the stress table from the memory and decode the stress table; Output a second image obtained by compensating the first image based on the stress table; A new stress data for a slice is generated based on the grayscale of the second image; The second cumulative stress data is generated by summing the first cumulative stress data read from the stress table with the new stress data. The second accumulated stress data is encoded so that the encoded second accumulated stress data has a data size equal to or smaller than the target size; as well as The encoded second accumulated stress data is stored in the memory.

14. The method according to claim 13, wherein, The encoding of the second cumulative stress data includes: The second cumulative stress data is encoded using a first prediction method; The data size of the second accumulated stress data encoded using the first prediction method is compared with the target size; and Based on the determination that the data size of the second cumulative stress data encoded using the first prediction method is greater than the target size, the second cumulative stress data is re-encoded using a second prediction method different from the first prediction method.

15. The method according to claim 14, wherein, The encoding of the second cumulative stress data further includes: The data size of the second accumulated stress data, re-encoded using the second prediction method, is compared with the target size; and Based on the determination that the data size of the second cumulative stress data recoded using the second prediction method is greater than the target size, the quantization level is increased and the second cumulative stress data is recoded using the first prediction method.

16. The method of claim 14, wherein: One of the first prediction method and the second prediction method includes estimating the function values ​​of three stress elements adjacent to the current stress element as predicted values, and Another of the first prediction method and the second prediction method includes estimating a value that has a high similarity to the value of the current stress element from two stress elements adjacent to the current stress element as the predicted value.

17. The method according to claim 13, wherein, The generation of the second cumulative stress data further includes adding jitter data to the first cumulative stress data and the new stress data.

18. The method according to claim 13, wherein, The stress table is updated for one slice per frame.

19. The method according to claim 13, wherein, The generation of the new stress data includes: Grouping multiple sub-pixels into blocks; and The average stress of the sub-pixels belonging to the block is stored as a new stress element of the block.

20. The method according to any one of claims 13 to 19, wherein, The second cumulative stress data is encoded using an entropy coding method.

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