Coil electronic component

By setting low-permeability glass spacers and support members between the coils of the array-type inductor, the problem of large coil inductance deviation is solved, and the resonant frequency stability and inductance characteristics of the circuit are improved.

CN121905680APending Publication Date: 2026-04-21SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SAMSUNG ELECTRO MECHANICS CO LTD
Filing Date
2025-06-09
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

In existing array-type inductors, the inductance deviation between coils is relatively large, which affects circuit design and performance, especially in high-frequency circuits.

Method used

Spacing is provided between the coils, made of glass material with a lower permeability than the main material, to reduce inductance deviation, and the coils are supported by support members to ensure the connection of the coil pattern.

Benefits of technology

It effectively reduces the inductance deviation between coils, improves the stability of the circuit's resonant frequency and inductance characteristics, reduces the deviation of the coupling coefficient, and improves the design reliability of the circuit.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present disclosure provides a coil electronic component including: a body including a magnetic material; four or more coils embedded in the main body; and a spacer portion including a glass material and disposed in at least one of regions between adjacent ones of the four or more coils.
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Description

Technical Field

[0001] This disclosure relates to a coil electronic assembly. Background Technology

[0002] An inductor (a type of coil electronic component) is a typical passive component used in electronic circuits, together with resistors and capacitors, to remove noise. It also utilizes electromagnetic properties in combination with capacitors to provide resonant circuits, filter circuits, etc., for amplifying signals in a specific frequency band.

[0003] Furthermore, as the demand for high-performance electronic devices increases, their power consumption is also rising. This increased power consumption necessitates higher switching frequencies for power management integrated circuits (PMICs) or DC-DC converters used in the power circuits of electronic devices, resulting in higher output currents and a greater use of power inductors to stabilize the output current of PMICs or DC-DC converters.

[0004] There is also an increasing demand for array inductors, which offer the advantage of reduced installation area. Array inductors consist of multiple coils that are adjacent to each other, with inductance deviations between the coils. Summary of the Invention

[0005] This disclosure provides a coil electronics assembly that can reduce inductance deviation between coils.

[0006] However, the purpose of this disclosure is not limited to the foregoing and may be extended in various ways within the spirit and scope of this disclosure.

[0007] This disclosure provides a coil electronic assembly comprising: a body comprising a magnetic material; four or more coils embedded in the body; and a spacer comprising a glass material and disposed in at least one region between adjacent coils of the four or more coils.

[0008] The spacer may include a surface flush with the outer surface of the body.

[0009] The four or more coils may include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other. The spacers may include at least one of a first spacer, a second spacer, and a third spacer. The first spacer may be located in a first region between the first coil and the second coil. The second spacer may be located in a second region between the second coil and the third coil. The third spacer may be located in a third region between the third coil and the fourth coil.

[0010] Each of the first, second, and third spacers may include a surface flush with the outer surface of the body.

[0011] The first spacer, the second spacer, and the third spacer may all be spaced apart from the outer surface of the main body.

[0012] The four or more coils may include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and the spacers may include: a first spacer disposed in a first region between the first coil and the second coil; and a third spacer disposed in a third region between the third coil and the fourth coil, and each of the first spacer and the third spacer may include a surface flush with the outer surface of the body.

[0013] The four or more coils may include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and the spacer may include: a first spacer disposed in a first region between the first coil and the second coil; and a third spacer disposed in a third region between the third coil and the fourth coil, and both the first spacer and the third spacer may be spaced apart from the outer surface of the body.

[0014] The four or more coils may include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and the spacer may be disposed in a second region between the second coil and the third coil, and may include a surface flush with the outer surface of the body.

[0015] The four or more coils may include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and the spacer may be disposed in a second region between the second coil and the third coil, and may be spaced apart from the outer surface of the body.

[0016] The coil electronic assembly may further include a first support member, a second support member, a third support member, and a fourth support member embedded in the body and spaced apart from each other. The four or more coils may include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other. The first coil may be disposed on the first support member, the second coil may be disposed on the second support member, the third coil may be disposed on the third support member, and the fourth coil may be disposed on the fourth support member.

[0017] The first coil may include two coil patterns respectively disposed on one and another opposing surface of the first support member and connected to each other by a through hole through the first support member; the second coil may include two coil patterns respectively disposed on one and another opposing surface of the second support member and connected to each other by a through hole through the second support member; the third coil may include two coil patterns respectively disposed on one and another opposing surface of the third support member and connected to each other by a through hole through the third support member; and the fourth coil may include two coil patterns respectively disposed on one and another opposing surface of the fourth support member and connected to each other by a through hole through the fourth support member.

[0018] The body may be a stack of multiple magnetic sheets therein, and the four or more coils may include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and each of the first coil, the second coil, the third coil, and the fourth coil may include multiple conductor patterns disposed on the multiple magnetic sheets and connected to each other.

[0019] The four or more coils may include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and each of the first coil, the second coil, the third coil, and the fourth coil may include at least one turn of wire.

[0020] The main body may include a first core penetrating the first coil, a second core penetrating the second coil, a third core penetrating the third coil, and a fourth core penetrating the fourth coil.

[0021] The coil electronics may further include an insulating film disposed on the surface of the at least one turn of wire.

[0022] The relative permeability of the spacer can be greater than or equal to 1 and less than or equal to 3.

[0023] The coil electronics may further include: a plurality of external electrodes disposed outside the body and connected to the four or more coils.

[0024] The plurality of external electrodes may include metal.

[0025] The plurality of external electrodes may include metal and glass.

[0026] The coil electronics may further include a surface insulating layer covering a portion of the surface of the body.

[0027] This disclosure also provides a coil electronic assembly comprising: a body including a plurality of magnetic sheets stacked together; a plurality of coils embedded in the body, wherein each respective coil of the plurality of coils includes a plurality of respective conductor patterns disposed on the plurality of magnetic sheets and electrically connected to each other, and for each respective coil of the plurality of coils, at least three conductor patterns of the plurality of respective conductor patterns are different in shape from each other; and one or more spacers, each comprising a glass material and disposed in a region between adjacent coils of the plurality of coils.

[0028] The multiple coils may have the same shape.

[0029] The plurality of coils may include a first coil, a second coil, a third coil, and a fourth coil, and the one or more spacing portions may include a first spacing portion disposed between the first coil and the second coil, a second spacing portion disposed between the second coil and the third coil, and a third spacing portion disposed between the third coil and the fourth coil.

[0030] The plurality of corresponding conductor patterns may include: a first conductor pattern, generally J-shaped, with the ends of the first conductor pattern exposed on the surface of the body; a second conductor pattern, generally U-shaped; and a third conductor pattern, generally C-shaped.

[0031] The plurality of corresponding conductor patterns may further include: a fourth conductor pattern in a generally inverted U shape; a fifth conductor pattern in a generally inverted C shape; a sixth conductor pattern that is generally the same as the second conductor pattern; a seventh conductor pattern that is generally the same as the third conductor pattern; an eighth conductor pattern that is generally the same as the fourth conductor pattern; and a ninth conductor pattern in a generally inverted J shape, the end of the ninth conductor pattern being exposed on the opposing surface of the body, the opposing surface of the body being opposite to the surface of the body.

[0032] The plurality of corresponding conductor patterns may include nine or more conductor patterns.

[0033] The main body may further include two additional magnetic sheets, wherein the plurality of magnetic sheets are disposed between the two additional magnetic sheets.

[0034] This disclosure also provides a coil electronic assembly comprising: a body comprising a magnetic material; three or more coils embedded in the body; and a spacer comprising a glass material and disposed in at least one region between adjacent coils of the three or more coils.

[0035] According to this disclosure, a coil electronics assembly capable of reducing inductance deviation between multiple coils arranged adjacent to each other can be provided. Attached Figure Description

[0036] Figure 1 A perspective view of a coil electronics assembly according to an embodiment is shown schematically.

[0037] Figure 2 It shows Figure 1 A top view of the coil electronic components.

[0038] Figure 3 It shows along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0039] Figure 4 It shows Figure 1 A schematic diagram of the flow of magnetic flux in the coil electronic components.

[0040] Figure 5 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0041] Figure 6 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0042] Figure 7 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0043] Figure 8 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0044] Figure 9 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0045] Figure 10 A perspective view of a coil electronics assembly according to another embodiment is schematically shown.

[0046] Figure 11 It shows Figure 10 A top view of the coil electronic components.

[0047] Figure 12 It shows Figure 10 An exploded perspective view of the main body of the coil electronic component.

[0048] Figure 13 It shows along Figure 11 A schematic cross-sectional view taken from line II-II'.

[0049] Figure 14A perspective view of a coil electronics assembly according to another embodiment is schematically shown.

[0050] Figure 15 It shows along Figure 14 A schematic cross-sectional view taken from line III-III'. Detailed Implementation

[0051] In the following description, the present disclosure will be described more fully with reference to the accompanying drawings, which illustrate embodiments of the present disclosure. The drawings and description are to be considered illustrative rather than restrictive in nature. Throughout the specification, the same reference numerals denote the same elements. Furthermore, in the drawings, some components are exaggerated, omitted, or simplified, and the dimensions of the individual components do not perfectly reflect their actual dimensions.

[0052] The accompanying drawings are provided merely to facilitate understanding of the embodiments disclosed in this specification, and the drawings are not to be construed as limiting the spirit of the disclosure in this specification. Rather, it should be understood that this disclosure includes all variations, equivalents, and alternatives that do not depart from the technical spirit of this disclosure.

[0053] Ordinal terms such as first, second, etc., can be used to describe various elements, but elements are not limited by these terms. These terms are only used to distinguish one constituent element from another.

[0054] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element, or there may be an intermediate element present. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element present. Furthermore, in the specification, the terms "on" or "above" mean that it is disposed on or below the target portion, and do not necessarily mean that it is disposed on the upper side of the target portion based on a direction opposite to the direction of gravity.

[0055] Throughout this specification, it should be understood that the terms “comprising,” “including,” “having,” or “construction” indicate the presence of the features, quantities, steps, operations, constituent elements, parts, or combinations thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, constituent elements, parts, or combinations thereof. Therefore, unless expressly stated to the contrary, the word “comprising” and variations such as “including” or “containing” will be understood to imply the inclusion of the stated elements, but not the exclusion of any other elements.

[0056] Furthermore, throughout the specification, the phrase "in plan view" or "on a plane" indicates the target portion as viewed from the top, and the phrase "in section view" or "on a section" indicates the section formed by vertically cutting the target portion as viewed from the side.

[0057] Furthermore, throughout the specification, the term "connection" can mean not only a direct connection between two or more elements, but also an indirect connection between two or more elements through other elements; it can mean not only a physical connection, but also an electrical connection; and it can also mean a situation where two or more elements are called by different names according to their location and / or function, but are one entity.

[0058] Figure 1 A perspective view of a coil electronics assembly according to an embodiment is schematically shown. Figure 2 It shows Figure 1 A top plan view of the coil electronics assembly, and Figure 3 It shows along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0059] Reference Figure 1 , Figure 2 and Figure 3 According to the embodiment, the coil electronics 1000 corresponds to an array-type inductor, which includes a plurality of coils 111, 112, 113 and 114 spaced apart from each other.

[0060] The coil electronics assembly 1000 includes a first coil 111, a second coil 112, a third coil 113, and a fourth coil 114, but this embodiment is not limited thereto. For example, if desired, the coil electronics assembly 1000 of this disclosure may include four or more coils or fewer than four coils (e.g., three coils).

[0061] The coil electronics assembly 1000 includes a main body 100, a plurality of external electrodes 121, 122, 123, 124, 125, 126, 127 and 128 disposed on the outer surface of the main body 100, a plurality of coils 111, 112, 113 and 114 embedded in the main body 100, and a spacer 200.

[0062] The main body 100 may have a generally rectangular hexahedral shape, but this embodiment is not limited to this. Due to the shrinkage of magnetic powder or the like during sintering, the main body 100 may not have a perfect rectangular hexahedral shape, but may have a generally rectangular hexahedral shape. For example, the main body 100 may have a generally rectangular hexahedral shape, for example, the corners or vertices may have a rounded shape.

[0063] In this embodiment, for better understanding and ease of description, the two opposing surfaces of the main body 100 in the length direction (L-axis direction) are respectively defined as the first surface S1 and the second surface S2, the two opposing surfaces of the main body 100 in the width direction (W-axis direction) are respectively defined as the third surface S3 and the fourth surface S4, and the two opposing surfaces of the main body 100 in the thickness direction (T-axis direction) are respectively defined as the fifth surface S5 and the sixth surface S6.

[0064] The length of the coil electronics component 1000 can be expressed as: the maximum length of a plurality of line segments connected to the two outermost boundary lines of the coil electronics component 1000 that are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction) at the center of the coil electronics component 1000 in the width direction (W-axis direction) and in the length direction (L-axis direction). Alternatively, the length of the coil electronics component 1000 can be expressed as the minimum length of a plurality of line segments connected to the two outermost boundary lines of the coil electronics component 1000 that are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction) in the cross-sectional photograph. Optionally, the length of the coil electronics 1000 may represent the arithmetic mean of the lengths of at least two of a plurality of line segments that connect the two outermost boundary lines of the coil electronics 1000 shown in the cross-sectional photograph above and are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction).

[0065] The thickness of the coil electronic component 1000 can be represented as the maximum length of a plurality of line segments parallel to the thickness direction (T-axis), connected to the two outermost boundary lines of the coil electronic component 1000 opposite to each other in the thickness direction (T-axis) at the center of the coil electronic component 1000 in the width direction (W-axis direction). Alternatively, the thickness of the coil electronic component 1000 can be represented as the minimum length of a plurality of line segments parallel to the thickness direction (T-axis) connected to the two outermost boundary lines of the coil electronic component 1000 opposite to each other in the thickness direction (T-axis) as shown in the cross-sectional photograph. Optionally, the thickness of the coil electronics 1000 may be represented as the arithmetic mean of the lengths of at least two of a plurality of line segments that are opposite each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction) of the coil electronics 1000 shown in the cross-sectional photograph above.

[0066] The width of the coil electronics component 1000 can be represented as: the maximum length of a plurality of line segments connected to the two opposing boundary lines of the coil electronics component 1000 in the width direction (W-axis direction) and parallel to the width direction (W-axis direction) in an optical microscope or scanning electron microscope (SEM) photograph of a cross-section of the coil electronics component 1000 at its center in the thickness direction (T-axis direction) and in the length direction (L-axis direction) - width direction (W-axis direction). Alternatively, the width of the coil electronics component 1000 can be represented as the minimum length of a plurality of line segments connected to the two opposing outermost boundary lines of the coil electronics component 1000 in the width direction (W-axis direction) and parallel to the width direction (W-axis direction) in the cross-sectional photograph. Optionally, the width of the coil electronics 1000 may represent the arithmetic mean of the lengths of at least two of a plurality of line segments that connect the two outermost boundary lines of the coil electronics 1000 shown in the cross-sectional photograph above and are opposite to each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction).

[0067] The length, width, and thickness of the coil electronics assembly 1000 can each be measured using a micrometer measurement method. In this method, a micrometer with gage repeatability and reproducibility (R&R) can be used to measure the length by setting a zero point, inserting the coil electronics assembly 1000 according to this embodiment between the tips of the micrometer, and rotating the measuring rod of the micrometer. When measuring the length of the coil electronics assembly 1000 using this micrometer method, the length can represent a single measurement or the arithmetic mean of multiple measurements. This is equally applicable to the measurement of the width and thickness of the coil electronics assembly 1000.

[0068] Multiple coils 111, 112, 113 and 114 spaced apart from each other in the longitudinal direction (L-axis direction), a spacer 200, and a first support member 131, a second support member 132, a third support member 133 and a fourth support member 134 may be provided in the main body 100.

[0069] Multiple coils 111, 112, 113, and 114 may have substantially the same shape. Here, the disclosure that multiple coils have the same shape or substantially the same shape means that the line width, thickness, and number of turns of the coil patterns of each coil are substantially the same. Figures 1 to 3 In this embodiment, for ease of description, the number of coil turns is expressed as approximately 1.5 turns, but this embodiment is not limited to this and can be appropriately selected by those skilled in the art considering electrical characteristics (such as the required inductance and DC resistance (Rdc)).

[0070] The main body 100 constitutes the shape of the coil electronics assembly 1000 and is the space that forms or provides the magnetic circuit when current is applied to the first coil 111, the second coil 112, the third coil 113 and the fourth coil 114 by the multiple external electrodes 121, 122, 123, 124, 125, 126, 127 and 128. The magnetic circuit is the path through which the magnetic flux generated by the first coil 111, the second coil 112, the third coil 113 and the fourth coil 114 passes.

[0071] The main body 100 surrounds and encloses the first coil 111, the second coil 112, the third coil 113, and the fourth coil 114, as well as the first support member 131, the second support member 132, the third support member 133, and the fourth support member 134, and includes magnetic material. For example, the main body 100 includes magnetic particles, and there may be insulating material between the magnetic particles.

[0072] The magnetic material may include first metallic magnetic particles, second metallic magnetic particles with a particle size smaller than the first metallic magnetic particles, and third metallic magnetic particles with a particle size smaller than the second metallic magnetic particles. The average particle size D of the first metallic magnetic particles... 50 The average particle size D of the second metallic magnetic particles can be greater than or equal to 5 μm and less than or equal to 30 μm. 50 The particle size can be greater than or equal to 1 μm and less than or equal to 5 μm, and the average particle size D of the third metallic magnetic particles is... 50 It can be greater than or equal to 0.05 μm and less than or equal to 0.5 μm.

[0073] Magnetic particles can be ferrite particles or metallic magnetic particles that exhibit magnetic properties.

[0074] Ferrite particles may include, for example, at least one of spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites), garnet-type ferrites (such as yttrium (Y)-based ferrites) and Li-based ferrites.

[0075] The metallic magnetic particles can be composed of two or more types of metallic magnetic particles with specific different compositions, and may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic particles may be at least one of pure iron, Fe-Si based alloys, Fe-Si-Al based alloys, Fe-Ni based alloys, Fe-Ni-Mo based alloys, Fe-Ni-Mo-Cu based alloys, Fe-Co based alloys, Fe-Ni-Co based alloys, Fe-Cr based alloys, Fe-Cr-Si based alloys, Fe-Si-Cu-Nb based alloys, Fe-Ni-Cr based alloys, and Fe-Cr-Al based alloys. Here, different compositions of the metallic magnetic particles may mean different amounts of the contained elements.

[0076] The metallic magnetic particles can be amorphous or crystalline. For example, the metallic magnetic particles can be Fe-Si-B-Cr based amorphous alloys, but this embodiment is not limited thereto. The metallic magnetic particles can have an average particle size in the range of about 0.1 μm to about 30 μm, but are not limited thereto.

[0077] In this disclosure, the average particle size can be represented by D 90 D 50 Particle size distribution, expressed as such. Particle size distribution is well known to those skilled in the art; it is an index indicating the proportion of particles of a certain size (particle diameter) within a group of particles to be measured. D 50 (The particle size corresponding to 50% of the cumulative volume of the particle size distribution) refers to the average particle size.

[0078] Metallic magnetic particles can be two or more different types of metallic magnetic particles. Here, different types of metallic magnetic particles mean that the metallic magnetic particles are distinguishable from each other in at least one aspect of average particle size, composition, component ratio, crystallinity, and shape.

[0079] The insulating material may include at least one of epoxy resin, polyimide, and liquid crystal polymer, but is not limited thereto.

[0080] Coils 111, 112, 113, and 114 are embedded in the main body 100 to exhibit the characteristics of the coil electronics 1000. For example, when the coil electronics 1000 of this embodiment is used as a power inductor, when current is applied to coils 111, 112, 113, and 114, the coils can be used to stabilize the power supply of the electronic device by storing energy in the form of a magnetic field and maintaining the output voltage.

[0081] Starting with the first coil 111, which is closest to the first surface S1 of the main body 100, the second coil 112, the third coil 113, and the fourth coil 114 are arranged sequentially in the length direction (L-axis direction). Therefore, the fourth coil 114 is set to be closest to the second surface S2 of the main body 100, and the second coil 112 and the third coil 113 are arranged between the first coil 111 and the fourth coil 114.

[0082] The corresponding winding axes of the first coil 111, the second coil 112, the third coil 113, and the fourth coil 114 can be parallel to the thickness direction (T-axis direction) of the main body 100.

[0083] The first coil 111 is connected to the first external electrode 121 and the second external electrode 122, which are spaced apart from each other in the width direction (W-axis direction) of the body 100. The second coil 112 is connected to the third external electrode 123 and the fourth external electrode 124, which are also spaced apart from each other in the width direction (W-axis direction) of the body 100.

[0084] The third coil 113 is connected to the fifth external electrode 125 and the sixth external electrode 126, which are spaced apart from each other in the width direction (W-axis direction) of the body 100. The fourth coil 114 is connected to the seventh external electrode 127 and the eighth external electrode 128, which are spaced apart from each other in the width direction (W-axis direction) of the body 100.

[0085] The first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 extend from the third surface S3 or the fourth surface S4 of the body 100 to cover a portion of the fifth surface S5 and a portion of the sixth surface S6, but this embodiment is not limited thereto. Specifically, the first external electrode 121, the third external electrode 123, the fifth external electrode 125, and the seventh external electrode 127 extend from the third surface S3 of the body 100 to cover a portion of the fifth surface S5 and a portion of the sixth surface S6, and the second external electrode 122, the fourth external electrode 124, the sixth external electrode 126, and the eighth external electrode 128 extend from the fourth surface S4 of the body 100 to cover a portion of the fifth surface S5 and a portion of the sixth surface S6, but this embodiment is not limited thereto. For example, the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 may be disposed only on the third surface S3 or the fourth surface S4 of the body 100, or may extend from the third surface S3 or the fourth surface S4 to cover only a portion of the sixth surface S6.

[0086] For example, the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 may include, but are not limited to, conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof.

[0087] As another example, the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 may comprise a conductive metal and glass. The conductive metal may be, for example, at least one of copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The glass composition included in the external electrodes may be a mixture of oxides. The glass composition may include, for example, silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, alkaline earth metal oxide, or combinations thereof. Here, transition metals can be selected from zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni); alkali metals can be selected from lithium (Li), sodium (Na), and potassium (K); and alkaline earth metals can be selected from magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba). The method of forming the external electrode is not particularly limited. For example, the external electrode can be formed by immersing the body in a conductive paste containing a conductive metal and glass, or by printing the conductive paste onto the surface of the body (e.g., by screen printing or gravure printing). Furthermore, various other methods can be used to form the external electrode, such as coating the surface of the body with conductive paste or transferring a dry film formed by drying the conductive paste onto the body.

[0088] Reference Figure 3 The first coil 111 is disposed on the first support member 131. The first coil 111 includes an upper coil 111a disposed on the upper surface 131a of the first support member 131 and a lower coil 111b disposed on the lower surface 131b of the first support member 131. The upper coil 111a and the lower coil 111b are connected to each other through a first through hole V1 penetrating the first support member 131.

[0089] The first support member 131 may be made of an insulating material including thermosetting insulating resins (such as epoxy resins), thermoplastic insulating resins (such as polyimide), or photosensitive insulating resins, or may be formed using an insulating material prepared by impregnating an insulating resin with a reinforcing material (such as glass fiber or inorganic filler). For example, the support member may be made of an insulating material such as a prepreg, Ajinomoto laminate (ABF), FR-4, bismaleimide triazine (BT) film, or photosensitive dielectric (PID) film, but this embodiment is not limited thereto.

[0090] As an inorganic filler, at least one selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0091] Each of the first coil 111 and the first via V1 may be made of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but this embodiment is not limited thereto.

[0092] An insulating film IF may be disposed between the first coil 111 and the body 100. The insulating film IF may be formed along the surface of the first support member 131 and the surface of the first coil 111. The insulating film IF is not present in the portions of the first support member 131 and the first coil 111 connected to the first external electrode 121 and the second external electrode 122. The insulating film IF serves to insulate the first coil 111 from the body 100 and may include known insulating materials such as parylene. Any insulating material may be used to form the insulating film IF, and there are no particular limitations. For example, the insulating film IF may be formed using polyurethane resin, polyester resin, epoxy resin, or polyamide-imide resin. The insulating film IF may be formed by methods such as vapor deposition, but is not limited thereto. For example, the insulating film IF may be formed by stacking insulating films on both surfaces of the first support member 131.

[0093] The second coil 112 includes an upper coil 112a and a lower coil 112b connected to each other through a second through-hole V2 passing through the second support member 132; the third coil 113 includes an upper coil 113a and a lower coil 113b connected to each other through a third through-hole V3 passing through the third support member 133; and the fourth coil 114 includes an upper coil 114a and a lower coil 114b connected to each other through a fourth through-hole V4 passing through the fourth support member 134. The second coil 112, the third coil 113, and the fourth coil 114 differ from the first coil 111 only in their positions, therefore redundant descriptions of them will be omitted.

[0094] In addition, the surface insulating layer 900 may be disposed on the fifth surface S5 and the sixth surface S6 of the main body 100.

[0095] The surface insulating layer 900 includes a first insulating layer 910 and a second insulating layer 920. The first insulating layer 910 is disposed on the fifth surface S5 of the body 100, and the second insulating layer 920 is disposed on the sixth surface S6 of the body 100.

[0096] The surface insulating layer 900 can partially cover the fifth surface S5 and the sixth surface S6 of the main body 100. That is, the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 are disposed on a portion of the fifth surface S5 and a portion of the sixth surface S6 of the main body 100, and the surface insulating layer 900 does not cover the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128.

[0097] In other embodiments, the surface insulating layer 900 may also be disposed on at least one of the first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 of the body 100.

[0098] The surface insulating layer 900 can prevent leakage current between the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127 and the eighth external electrode 128.

[0099] For example, the surface insulating layer 900 may include thermoplastic resins (such as polystyrene resins, vinyl acetate resins, polyester resins, polyethylene resins, polypropylene resins, polyamide resins, rubber resins, acrylic resins, etc.), thermosetting resins (such as phenolic resins, epoxy resins, polyurethane resins, melamine resins, alkyd resins), photosensitive resins, parylene, SiO2, etc. x or SiN x .

[0100] The surface insulating layer 900 can be formed by processes such as screen printing, pad printing, dipping, and inkjet printing. For example, the surface insulating layer 900 can be formed by applying a liquid insulating resin to the surface of the body 100, or by stacking an insulating film such as a dry film on the surface of the body 100, or by a thin film process such as vapor deposition. When the surface insulating layer 900 is formed using an insulating film, the insulating film can be an Ajinomoto stacked film (ABF) or a polyimide film that does not contain a photosensitive insulating resin.

[0101] When four coils are arranged in an array, such as in this embodiment, interference may occur between the coils, altering the inductance characteristics of the coil electronics.

[0102] Because the second coil 112 and the third coil 113 are positioned between the first coil 111 and the fourth coil 114, the inductance of the second coil 112 and the third coil 113 can be significantly increased under the influence of the magnetic flux generated by the first coil 111 and the fourth coil 114. In this case, the inductance deviation between the coils may increase. As the inductance deviation increases, i.e., as the deviation of the coupling coefficient increases, leakage inductance exists, which may affect the resonant frequency, potentially leading to difficulties in circuit design.

[0103] According to this embodiment, inductance deviation can be reduced by providing a spacing portion 200 with a lower permeability than that of the main body 100 between coils 111, 112, 113 and 114.

[0104] For example, the relative permeability of the spacer 200 may have a value close to 1, for example, a value greater than or equal to 1 and less than or equal to 3.

[0105] The spacer portion 200 may be made of glass. For example, the spacer portion 200 may include B2O3-SiO2-based glass, Al2O3-SiO2-based glass, etc., but this embodiment is not limited to this.

[0106] If the relative permeability of the spacer 200 is lower than that of the main body 100, magnetic flux will have difficulty passing through the spacer 200. This can be used to reduce the mutual inductance of adjacent coils. In addition, in the direction of the winding axis of four or more coils, the spacer 200 may be closer to the outer surface of the main body than the four or more coils.

[0107] Figure 4 It shows Figure 1 A schematic diagram of the flow of magnetic flux in the coil electronic components.

[0108] Reference Figure 4 The magnetic fluxes generated by the first coil 111 and the second coil 112 are magnetic flux Ma, magnetic flux Mb, magnetic flux Mc and magnetic flux Md.

[0109] Magnetic flux Ma passes through the magnetic circuit surrounding the first coil 111, and magnetic flux Mb passes through the magnetic circuit surrounding the second coil 112.

[0110] Magnetic flux Mc passes through the magnetic circuit surrounding both the first coil 111 and the second coil 112. Magnetic flux Md passes through the magnetic circuit surrounding the first coil 111, the second coil 112, and the third coil 113 (see...). Figure 3 ) and the fourth coil 114 (see Figure 3The magnetic circuit of magnetic flux Mc and magnetic flux Md is reduced due to the first interval 210. Since the first interval 210 is provided in the magnetic circuit through which magnetic flux Mc and magnetic flux Md pass, magnetic flux Mc and magnetic flux Md are reduced due to the first interval 210.

[0111] As described above, according to this embodiment, the magnetic flux across different coils (e.g., magnetic flux Mc and magnetic flux Md) is reduced due to the spacing 200. The magnetic flux affecting the innermost second coil 112 and third coil 113 among the four coils 111, 112, 113, and 114 is also reduced. Compared to the case where no spacing is provided between the coils, in this embodiment, the rate of increase in inductance of the second coil 112 and the third coil 113 relative to the inductance of the first coil 111 is relatively reduced.

[0112] Reference Figure 3 The spacer 200 may be disposed in at least one of the first region R1 between the first coil 111 and the second coil 112, the second region R2 between the second coil 112 and the third coil 113, and the third region R3 between the third coil 113 and the fourth coil 114.

[0113] For example, the spacer 200 may include a first spacer 210, a second spacer 220, and a third spacer 230.

[0114] The first spacer 210 is disposed in the first region R1 between the first coil 111 and the second coil 112.

[0115] The second spacer 220 is provided in the second region R2 between the second coil 112 and the third coil 113.

[0116] The third interval 230 is provided in the third region R3 between the third coil 113 and the fourth coil 114.

[0117] Reference Figure 2 and Figure 3 The first spacer 210 may have a generally plate-like shape. For example, the first spacer 210 may include a first main surface 211, a second main surface 212, a first side surface 213, a second side surface 214, a third side surface 215, and a fourth side surface 216.

[0118] The first main surface 211 faces the first coil 111, and the second main surface 212 faces the second coil 112. The first main surface 211 and the second main surface 212 are opposite to each other in the length direction (L-axis direction).

[0119] The first side surface 213 and the second side surface 214 are opposite to each other in the width direction (W-axis direction), and the third side surface 215 and the fourth side surface 216 are opposite to each other in the thickness direction (T-axis direction).

[0120] The first side surface 213 can be flush with the third surface S3 of the main body 100, and the second side surface 214 can be flush with the fourth surface S4 of the main body 100.

[0121] The third side surface 215 can be flush with the fifth surface S5 of the main body 100, and the fourth side surface 216 can be flush with the sixth surface S6 of the main body 100.

[0122] The second spacer 220 may have a generally plate-like shape. For example, the second spacer 220 may include a first main surface 221, a second main surface 222, a first side surface 223, a second side surface 224, a third side surface 225, and a fourth side surface 226.

[0123] The third spacer 230 may have a generally plate-like shape. For example, the third spacer 230 may include a first main surface 231, a second main surface 232, a first side surface 233, a second side surface 234, a third side surface 235, and a fourth side surface 236.

[0124] Apart from their positions, the second spacer 220 and the third spacer 230 have the same structure as the first spacer 210, so redundant descriptions of them will be omitted.

[0125] Figure 5 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0126] Reference Figure 5 The spacer 1200 includes a first spacer 1210, a second spacer 1220 and a third spacer 1230.

[0127] The first spacer 1210, the second spacer 1220 and the third spacer 1230 are all spaced apart from the outer surface of the main body 100 and are disposed inside the main body 100.

[0128] The remaining components and Figure 1 The corresponding components of the coil electronic assembly shown are identical, therefore redundant descriptions of them will be omitted.

[0129] Figure 6 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0130] Reference Figure 6 The spacer 2200 includes a first spacer 2210 and a third spacer 2230.

[0131] No other spacing portion is provided between the first spacing portion 2210 and the third spacing portion 2230. That is, no spacing portion is provided between the second coil 112 and the third coil 113.

[0132] The remaining components and Figure 1 The corresponding components of the coil electronic assembly shown are identical, therefore redundant descriptions of them will be omitted.

[0133] Figure 7 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0134] Reference Figure 7 The spacer 3200 includes a first spacer 3210 and a third spacer 3230.

[0135] The first spacer portion 3210 and the third spacer portion 3230 are spaced apart from the outer surface of the main body 100 and are disposed within the main body 100.

[0136] The remaining components and Figure 6 The corresponding components of the coil electronics shown are identical, so their redundant descriptions will be omitted.

[0137] Figure 8 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0138] Reference Figure 8 An interval 4200 is provided between the second coil 112 and the third coil 113. No interval is provided between the first coil 111 and the second coil 112, or between the third coil 113 and the fourth coil 114.

[0139] The remaining components and Figure 1 The corresponding components of the coil electronic assembly shown are identical, therefore redundant descriptions of them will be omitted.

[0140] Figure 9 A cross-sectional view of a coil electronics assembly according to another embodiment is shown schematically.

[0141] Reference Figure 9 An interval 5200 is provided between the second coil 112 and the third coil 113. No interval is provided between the first coil 111 and the second coil 112, or between the third coil 113 and the fourth coil 114.

[0142] The spacer portion 5200 is spaced apart from the outer surface of the main body 100 and is disposed within the main body 100.

[0143] The remaining components and Figure 8 The corresponding components of the coil electronic assembly shown are identical, therefore redundant descriptions of them will be omitted.

[0144] Figure 10 A perspective view of a coil electronics assembly according to another embodiment is schematically shown.

[0145] Figure 11 It shows Figure 10 Top view of the coil electronic components. Figure 12 It shows Figure 10 An exploded perspective view of the main body of the coil electronic component, and Figure 13 It shows along Figure 11 A schematic cross-sectional view taken from line II-II'.

[0146] Reference Figure 10 , Figure 11 and Figure 13 The coil electronics assembly 4000 includes a main body 3100, a first external electrode 3121, a second external electrode 3122, a third external electrode 3123, a fourth external electrode 3124, a fifth external electrode 3125, a sixth external electrode 3126, a seventh external electrode 3127 and an eighth external electrode 3128 disposed on the outer surface of the main body 3100, a plurality of coils 3111, 3112, 3113 and 3114 embedded in the main body 3100, and a spacer portion 6200.

[0147] The first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114 are embedded in the main body 3100. The winding axis of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114 can be parallel to the thickness direction (T-axis direction) of the main body 3100.

[0148] The spacer 6200 includes a first spacer 6210, a second spacer 6220, and a third spacer 6230.

[0149] The first spacing portion 6210 is disposed between the first coil 3111 and the second coil 3112, the second spacing portion 6220 is disposed between the second coil 3112 and the third coil 3113, and the third spacing portion 6230 is disposed between the third coil 3113 and the fourth coil 3114.

[0150] Reference Figure 12The main body 3100 can be a laminate made by stacking multiple magnetic sheets 3141, 3142, 3143, 3144, 3145, 3146, 3147, 3148 and 3149 and multiple magnetic sheets 3150 and 3151 in the thickness direction (T-axis direction). The magnetic sheets 3111a to 3111i include a portion of the first coil 3111, a portion of the second coil 3112a to 3112i include a portion of the second coil 3112, a portion of the third coil 3113a to 3113i include a portion of the third coil 3113, and a portion of the fourth coil 3114a to 3114i include a portion of the fourth coil 3114. No conductor patterns are provided on the multiple magnetic sheets 3150 and 3151.

[0151] Multiple generally J-shaped conductor patterns 3111a, 3112a, 3113a and 3114a are formed on the magnetic sheet 3141. One end of each of the conductor patterns 3111a, 3112a, 3113a and 3114a extends from the edge of the magnetic sheet 3141 to be exposed from the fourth surface S4 of the body 3100.

[0152] Multiple conductor patterns 3111b, 3112b, 3113b, and 3114b are formed on the magnetic sheet 3142 and are electrically connected to the corresponding conductor patterns 3111a, 3112a, 3113a, and 3114a. The conductor patterns 3111b, 3112b, 3113b, and 3114b correspond to approximately three-quarter turns of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114, respectively, and are generally U-shaped.

[0153] Multiple conductor patterns 3111c, 3112c, 3113c, and 3114c are formed on the magnetic sheet 3143 and are electrically connected to the corresponding conductor patterns 3111b, 3112b, 3113b, and 3114b. The conductor patterns 3111c, 3112c, 3113c, and 3114c correspond to approximately three-quarters of the turns of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114, respectively, and are generally C-shaped.

[0154] Multiple conductor patterns 3111d, 3112d, 3113d, and 3114d are formed on the magnetic sheet 3144 and are electrically connected to the corresponding conductor patterns 3111c, 3112c, 3113c, and 3114c. The conductor patterns 3111d, 3112d, 3113d, and 3114d correspond to approximately three-quarter turns of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114, respectively, and are generally U-shaped (e.g., inverted U-shaped).

[0155] Multiple conductor patterns 3111e, 3112e, 3113e, and 3114e electrically connected to corresponding conductor patterns 3111d, 3112d, 3113d, and 3114d are formed on the magnetic sheet 3145. The conductor patterns 3111e, 3112e, 3113e, and 3114e correspond to approximately 3 / 4 turns of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114, respectively, and are generally C-shaped (e.g., inverted C-shaped).

[0156] Multiple conductor patterns 3111f, 3112f, 3113f, and 3114f are formed on the magnetic sheet 3146 and are electrically connected to the corresponding conductor patterns 3111e, 3112e, 3113e, and 3114e. The conductor patterns 3111f, 3112f, 3113f, and 3114f have the same structure as the conductor patterns 3111b, 3112b, 3113b, and 3114b.

[0157] Multiple conductor patterns 3111g, 3112g, 3113g, and 3114g are formed on the magnetic sheet 3147 and are electrically connected to the corresponding conductor patterns 3111f, 3112f, 3113f, and 3114f. The conductor patterns 3111g, 3112g, 3113g, and 3114g have the same structure as the aforementioned conductor patterns 3111c, 3112c, 3113c, and 3114c.

[0158] Multiple conductor patterns 3111h, 3112h, 3113h, and 3114h are formed on the magnetic sheet 3148 and are electrically connected to the corresponding conductor patterns 3111g, 3112g, 3113g, and 3114g. The conductor patterns 3111h, 3112h, 3113h, and 3114h have the same structure as the aforementioned conductor patterns 3111d, 3112d, 3113d, and 3114d.

[0159] Multiple generally J-shaped (e.g., inverted J-shaped) conductor patterns 3111i, 3112i, 3113i, and 3114i are formed on the magnetic sheet 3149 and electrically connected to corresponding conductor patterns 3111h, 3112h, 3113h, and 3114h. One end of each of the conductor patterns 3111i, 3112i, 3113i, and 3114i extends from the edge of the magnetic sheet 3149 to be exposed from the third surface S3 of the body 3100. Furthermore, electrical connections between conductor patterns on different magnetic sheets are made via through holes (not shown) formed in the magnetic sheets.

[0160] By stacking multiple magnetic sheets 3141, 3142, 3143, 3144, 3145, 3146, 3147, 3148, and 3149 on which conductor patterns 3111a to 3111i, 3112a to 3112i, 3113a to 3113i, and 3114a to 3114i are disposed, a body 3100 encapsulating a first coil 3111, a second coil 3112, a third coil 3113, and a fourth coil 3114 can be formed. The spacer 6200 can be formed by cutting a groove between any two adjacent coils of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114, and then filling the groove with glass. However, this embodiment is not limited to this, and therefore the spacer can be formed in various other ways.

[0161] A magnetic sheet 3150 without a conductor pattern is stacked on top of the magnetic sheet 3141. The magnetic sheet 3150 protects the conductor patterns 3111a, 3112a, 3113a, and 3114a on the magnetic sheet 3141. Additionally, another magnetic sheet 3151 without a conductor pattern is disposed below the magnetic sheet 3149.

[0162] The quantity of magnetic sheets described above is merely an example, and this embodiment is not limited thereto.

[0163] In addition to the components described above, the remaining components and Figure 1 The corresponding components of the coil electronic assembly shown are identical, therefore repeated descriptions of them will be omitted.

[0164] Figure 14 A perspective view of a coil electronics assembly according to another embodiment is schematically shown, and Figure 15 It shows along Figure 14 A schematic cross-sectional view taken from line III-III'.

[0165] Reference Figure 14 and Figure 15The coil electronics assembly 5000 includes a main body 4100, a first external electrode 4121, a second external electrode 4122, a third external electrode 4123, a fourth external electrode 4124, a fifth external electrode 4125, a sixth external electrode 4126, a seventh external electrode 4127 and an eighth external electrode 4128 disposed on the outer surface of the main body 4100, a plurality of coils 4111, 4112, 4113 and 4114 embedded in the main body 4100, and a spacer portion 7200.

[0166] The first coil 4111, the second coil 4112, the third coil 4113, and the fourth coil 4114 are embedded in the body 4100. The body 4100 may include a first core 4410 passing through the first coil 4111, a second core 4420 passing through the second coil 4112, a third core 4430 passing through the third coil 4113, and a fourth core 4440 passing through the fourth coil 4114.

[0167] The first coil 4111 includes at least one turn of wire. An insulating film IF may be disposed on the surface of the first coil 4111.

[0168] The second coil 4112, the third coil 4113, and the fourth coil 4114 differ from the first coil 4111 only in their positions, so redundant descriptions of them will be omitted.

[0169] The spacer 7200 includes a first spacer 7210, a second spacer 7220, and a third spacer 7230.

[0170] The first spacing portion 7210 is disposed between the first coil 4111 and the second coil 4112, the second spacing portion 7220 is disposed between the second coil 4112 and the third coil 4113, and the third spacing portion 7230 is disposed between the third coil 4113 and the fourth coil 4114.

[0171] In addition, a surface insulating layer 4900 is provided on the fifth surface S5 and the sixth surface S6 of the main body 4100.

[0172] The surface insulating layer 4900 includes a first insulating layer 4910 and a second insulating layer 4920. The first insulating layer 4910 is disposed on the fifth surface S5 of the body 4100, and the second insulating layer 4920 is disposed on the sixth surface S6 of the body 4100.

[0173] The remaining components and Figure 1 The components of the coil electronic assembly shown are identical, so a repeated description of it will be omitted.

[0174] [Preparation Example: Fabrication of Coil Electronic Components] (Example) Manufacture a coil electronic component having four coils spaced apart and embedded in a body and glass spacers disposed between the coils, the relative permeability of the body being 36 and the relative permeability of the spacers being 1.

[0175] (Comparative example) The comparative example is the same as the example, except that the coil electronics do not include the spacer section.

[0176] [Experimental Example: Performance of Coil Electronic Components] After manufacturing fifty (50) coil electronic assemblies according to the example and comparative examples, the inductances of the first, second, third, and fourth coils were measured, and the rate of increase in the inductance of the second, third, and fourth coils was calculated based on the inductance of the first coil. The rate of increase in the inductance of the second coil was calculated by subtracting the inductance of the first coil from the inductance of the second coil and dividing the resulting value by the inductance of the first coil. The rate of increase in the inductance of the third coil and the rate of increase in the inductance of the fourth coil were calculated using the same method. The results are summarized in Table 1.

[0177] (Table 1)

[0178] Referring to Table 1, the inductance increase rate of the second coil and the third coil of the coil electronic assembly according to the example is 1.44%, and the inductance increase rate of the fourth coil is 0.60%. On the other hand, the inductance increase rates of the second coil and the third coil of the coil electronic assembly according to the comparative example are 5.96% and 5.94%, respectively, and the inductance increase rate of the fourth coil is 1.76%.

[0179] In the coil electronic assembly according to the example, the deviation between the inductances of the first and fourth coils and the inductances of the second and third coils is relatively small. However, in the coil electronic assembly according to the comparative example, the deviation between the inductances of the first and fourth coils and the inductances of the second and third coils is large. Since the coil electronic assembly according to the comparative example does not include a spacer, the inductances of the second and third coils are determined to increase due to interference from the cross flux between the different coils.

[0180] While this disclosure has been described in conjunction with embodiments now considered practical, it should be understood that this disclosure is not limited to the disclosed embodiments, but is intended to cover various modifications and equivalents included within the spirit and scope of the appended claims.

Claims

1. A coil electronic assembly, comprising: The main body includes magnetic materials; Four or more coils are embedded in the main body; as well as The spacer portion comprises a glass material and is disposed in at least one region between adjacent coils in the four or more coils.

2. The coil electronic assembly according to claim 1, wherein, The spacer includes a surface flush with the outer surface of the body.

3. The coil electronic assembly according to claim 1, wherein, The four or more coils include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other. The spacer portion includes at least one of a first spacer portion, a second spacer portion, and a third spacer portion. The first spacing portion is disposed in the first region between the first coil and the second coil. The second spacing portion is disposed in the second region between the second coil and the third coil, and, The third spacer is disposed in the third region between the third coil and the fourth coil.

4. The coil electronic assembly according to claim 3, wherein, Each of the first, second, and third spacers includes a surface flush with the outer surface of the body.

5. The coil electronic assembly according to claim 3, wherein, The first spacer, the second spacer, and the third spacer are all spaced apart from the outer surface of the main body.

6. The coil electronic assembly according to claim 1, wherein, The four or more coils include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and The spacer portion includes: A first spacing portion is disposed in a first region between the first coil and the second coil; and The third spacer is disposed in the third region between the third coil and the fourth coil. Each of the first and third spacers includes a surface flush with the outer surface of the body.

7. The coil electronic assembly according to claim 1, wherein, The four or more coils include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and The spacer portion includes: A first spacing portion is disposed in a first region between the first coil and the second coil; and The third spacer is disposed in the third region between the third coil and the fourth coil. Both the first spacer and the third spacer are spaced apart from the outer surface of the main body.

8. The coil electronic assembly according to claim 1, wherein, The four or more coils include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and The spacer portion is disposed in a second region between the second coil and the third coil, and includes a surface flush with the outer surface of the body.

9. The coil electronic assembly according to claim 1, wherein, The four or more coils include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and The spacer portion is disposed in a second region between the second coil and the third coil, and is spaced apart from the outer surface of the body.

10. The coil electronic assembly of claim 1, further comprising a first support member, a second support member, a third support member, and a fourth support member embedded in the body and spaced apart from each other. in, The four or more coils include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other. The first coil is mounted on the first support member. The second coil is mounted on the second support member. The third coil is disposed on the third support member, and The fourth coil is mounted on the fourth support member.

11. The coil electronics assembly according to claim 10, wherein, The first coil comprises two coil patterns respectively disposed on one and another opposing surface of the first support member and connected to each other by a through-hole penetrating the first support member. The second coil comprises two coil patterns respectively disposed on one and another opposing surface of the second support member and connected to each other by a through-hole penetrating the second support member. The third coil comprises two coil patterns respectively disposed on one and another opposing surface of the third support member and connected to each other by a through-hole penetrating the third support member. The fourth coil comprises two coil patterns respectively disposed on one and another surface opposite to each other on the fourth support member and connected to each other by a through hole through the fourth support member.

12. The coil electronics assembly according to claim 1, wherein, The main body is a laminate comprising multiple magnetic sheets stacked together. The four or more coils include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and Each of the first coil, the second coil, the third coil, and the fourth coil includes a plurality of conductor patterns disposed on the plurality of magnetic sheets and connected to each other.

13. The coil electronics assembly according to claim 1, wherein, The four or more coils include a first coil, a second coil, a third coil, and a fourth coil spaced apart from each other, and Each of the first coil, the second coil, the third coil, and the fourth coil includes at least one turn of wire.

14. The coil electronics assembly according to claim 13, wherein, The main body includes a first core penetrating the first coil, a second core penetrating the second coil, a third core penetrating the third coil, and a fourth core penetrating the fourth coil.

15. The coil electronics assembly of claim 13, further comprising: An insulating film is disposed on the surface of the at least one turn of the conductor.

16. The coil electronics assembly according to claim 1, wherein, The relative permeability of the spacer is greater than or equal to 1 and less than or equal to 3.

17. The coil electronic assembly according to claim 1, further comprising: Multiple external electrodes are disposed outside the main body and connected to the four or more coils.

18. The coil electronics assembly according to claim 17, wherein, The plurality of external electrodes comprise metal.

19. The coil electronics assembly according to claim 18, wherein, The plurality of external electrodes also include glass.

20. The coil electronic assembly according to claim 1, further comprising: A surface insulating layer that covers a portion of the surface of the body.

21. A coil electronic assembly, comprising: The main body consists of multiple magnetic sheets stacked together; Multiple coils are embedded in the body, wherein each corresponding coil includes multiple corresponding conductor patterns disposed on the multiple magnetic sheets and electrically connected to each other, and for each corresponding coil, at least three conductor patterns of the multiple corresponding conductor patterns are different in shape from each other. One or more spacers, each comprising glass material, are disposed in the region between adjacent coils of the plurality of coils.

22. The coil electronics assembly according to claim 21, wherein, The multiple coils have the same shape.

23. The coil electronics assembly according to claim 21, wherein, The plurality of coils includes a first coil, a second coil, a third coil, and a fourth coil, and The one or more spacing portions include a first spacing portion disposed between the first coil and the second coil, a second spacing portion disposed between the second coil and the third coil, and a third spacing portion disposed between the third coil and the fourth coil.

24. The coil electronics assembly according to claim 21, wherein, The plurality of corresponding conductor patterns include: The first conductor pattern is J-shaped, with its ends exposed on the surface of the body; The second conductor pattern is U-shaped; and The third conductor pattern is C-shaped.

25. The coil electronics assembly according to claim 24, wherein, The plurality of corresponding conductor patterns also include: The fourth conductor pattern is an inverted U-shape; The fifth conductor pattern is an inverted C shape; The sixth conductor pattern is the same as the second conductor pattern; The seventh conductor pattern is the same as the third conductor pattern; The eighth conductor pattern is the same as the fourth conductor pattern; and The ninth conductor pattern is in the shape of an inverted J, and the end of the ninth conductor pattern is exposed on the opposite surface of the body, the opposite surface of the body being opposite to the surface of the body.

26. The coil electronics assembly according to claim 21, wherein, The plurality of corresponding conductor patterns includes nine or more conductor patterns.

27. The coil electronics assembly according to claim 21, wherein, The main body also includes two additional magnetic sheets, wherein the plurality of magnetic sheets are disposed between the two additional magnetic sheets.

28. A coil electronic assembly, comprising: The main body includes magnetic materials; Three or more coils are embedded in the main body; as well as The spacer portion comprises a glass material and is disposed in at least one region between adjacent coils in the three or more coils.

29. The coil electronics assembly according to claim 28, wherein, The relative permeability of the spacer is greater than or equal to 1 and less than or equal to 3.

30. The coil electronics assembly according to claim 28, wherein, In the direction of the winding axis of the three or more coils, the spacer portion is closer to the outer surface of the body in that direction than the three or more coils.