Microphone and electronic equipment
By designing the adapter channel structure in the microphone, the problem of insufficient assembly flexibility when integrating the microphone with the pressure sensor is solved, realizing the miniaturization and flexible design of the microphone and simplifying the assembly process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GOERTEK MICROELECTRONICS CO LTD
- Filing Date
- 2025-12-31
- Publication Date
- 2026-04-21
AI Technical Summary
In existing technologies, the integration of microphones and pressure sensors offers limited assembly flexibility and makes it difficult to meet the requirements of miniaturization designs.
Design a microphone structure in which an adapter has a channel with the central axes of a first opening and a second opening offset from each other, communicates with the front cavity through a sound hole, and is electrically connected to a circuit board to achieve connection with external electronic components and reduce additional connection structures.
It improves the flexibility and miniaturization of microphone assembly, simplifies assembly steps, and enhances the stability of connections with external electronic components.
Smart Images
Figure CN121908203A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic equipment technology, and more specifically, to a microphone and an electronic device. Background Technology
[0002] In related technologies, microphones and pressure sensors have become standard features in smart hardware such as mobile phones and smartwatches. To reduce assembly space and the number of air passages, pressure sensors are typically integrated into the microphone. During assembly, the microphone's sound holes correspond to the sound holes on the circuit board; currently, however, sound holes are usually created on the microphone's substrate, resulting in limited assembly flexibility.
[0003] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention
[0004] One object of the present invention is to provide a new technical solution for microphones.
[0005] According to a first aspect of the present invention, a microphone is provided. The microphone includes: The first circuit board has a first sound hole; An acoustic-electric module is installed on the first circuit board, and the acoustic-electric module corresponds to the first acoustic hole; An adapter is electrically connected to the first circuit board. The adapter has a first channel with a first opening and a second opening that are opposite to each other. The central axes of the first opening and the second opening are offset from each other. The first opening communicates with the first sound hole.
[0006] Optionally, one end of the adapter is electrically connected to the end of the first circuit board away from the acoustic-electric module, and the other end of the adapter is adapted to be electrically connected to the second circuit board.
[0007] Optionally, the adapter has a first solder joint at the end facing the first circuit board.
[0008] Optionally, the adapter has a second soldering part at the end opposite to the first circuit board.
[0009] Optionally, the adapter is at least partially embedded within the first circuit board.
[0010] Optionally, the adapter includes a first adapter layer and a second adapter layer. The first adapter layer has a first through hole, and the second adapter layer has a second through hole. The first through hole and the second through hole are connected, and the central axes of the first through hole and the second through hole are offset from each other.
[0011] Optionally, the adapter further includes a third adapter layer, the third adapter layer having a third through hole, the first adapter layer and the second adapter layer being respectively connected to opposite sides of the third adapter layer, and the third through hole communicating with the first through hole and the second through hole respectively.
[0012] Optionally, the adapter is integrally formed.
[0013] According to a second aspect of this application, a microphone is provided. The microphone includes: The substrate has a first acoustic hole; An acoustic-electric module is mounted on the substrate, and the acoustic-electric module has a front cavity; An adapter is embedded in the substrate. The adapter has a first channel with a first opening and a second opening that are opposite to each other. The central axes of the first opening and the second opening are offset from each other. The first opening communicates with the front cavity through the first acoustic hole.
[0014] Optionally, the inner wall of the first acoustic hole is provided with a boss, and the adapter is disposed on the boss.
[0015] According to a third aspect of this application, an electronic device is provided. This electronic device includes the microphone described in the above embodiments.
[0016] One technical advantage of this application is that the adapter has a first channel with a first opening and a second opening at opposite ends. The first opening communicates with the front cavity through a first sound hole, and the second sound hole is suitable for communicating with the external space. The central axes of the first and second openings are offset from each other, which helps to improve the flexibility of microphone assembly. The adapter is electrically connected to a first circuit board, which can be electrically connected to external electronic components through the adapter, thus eliminating the need for additional connection structures and further improving the flexibility of microphone assembly.
[0017] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description
[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.
[0019] Figure 1 This is a schematic diagram of the structure of a microphone according to an embodiment of this application.
[0020] Figure 2 This is a schematic diagram of the structure of an adapter according to an embodiment of this application.
[0021] Figure 3This is a schematic diagram of the structure of the first adapter layer of an adapter according to an embodiment of this application.
[0022] Figure 4 This is a schematic diagram of the structure of the second adapter layer of an adapter according to an embodiment of this application.
[0023] Figure 5 This is a schematic diagram of the structure of the third adapter layer of an adapter according to an embodiment of this application.
[0024] Figure 6 This is a schematic diagram of the structure of a microphone according to another embodiment of this application.
[0025] Figure label: 1. First circuit board; 11. First acoustic hole; 12. Boss; 2. Acoustic module; 21. Front cavity; 3. Adapter; 31. First adapter layer; 311. First through hole; 32. Second adapter layer; 321. Second through hole; 33. Third adapter layer; 331. Third through hole; 34. First welding part; 35. Second welding part; 36. First channel; 361. First opening; 362. Second opening; 4. Pressure sensor; 5. Housing; 6. Second circuit board; 61. Second acoustic hole; 7. Substrate. Detailed Implementation
[0026] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the invention.
[0027] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.
[0028] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0029] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0030] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0031] According to one embodiment of this application, a microphone is provided. Figure 1 and Figure 2As shown, the microphone includes a first circuit board 1, an acoustic module 2, and an adapter 3. The first circuit board 1 has a first sound hole 11. The acoustic module 2 is mounted on the first circuit board 1 and has a front cavity 21. The adapter 3 is electrically connected to the first circuit board 1 and has a first channel 36. The first channel 36 has a first opening 361 and a second opening 362 that are oppositely disposed, and the central axes of the first opening 361 and the second opening 362 are offset from each other. The first opening 361 communicates with the front cavity 21 through the first sound hole 11.
[0032] In this example, the adapter 3 has a first channel 36, with a first opening 361 and a second opening 362 at opposite ends. The first opening 361 communicates with the front cavity 21 through the first sound hole 11, and the second sound hole 61 is suitable for communication with the external space. The central axes of the first opening 361 and the second opening 362 are offset from each other, which helps to improve the flexibility of microphone assembly. The adapter 3 is electrically connected to the first circuit board 1, and the first circuit board 1 can be electrically connected to external electronic components through the adapter 3, thus eliminating the need for additional connection structures and further improving the flexibility of microphone assembly.
[0033] It should be noted that the acoustic-electric module 2 may include a MEMS chip, which is mounted on the first circuit board 1 and has a front cavity 21. The front cavity 21 corresponds to the first sound hole 11. The adapter 3 is connected to the first circuit board 1, and the first channel 36 can communicate with the front cavity 21 through the first sound hole 11. External sound signals can enter the first channel 36 through the second opening 362, and then enter the front cavity 21 through the first opening 361. The acoustic-electric module 2 can receive the sound signal and convert it into an electrical signal.
[0034] like Figure 1 As shown, in this example, the microphone also includes a housing 5. The open end of the housing 5 is soldered to the first circuit board 1. The housing 5 and the first circuit board 1 surround to form an inner cavity. The acoustic module 2 is mounted on the first circuit board 1 and is located in the inner cavity. The acoustic module 2 is electrically connected to the first circuit board 1. The first circuit board 1 has a first sound hole 11 through it along its thickness direction, and the front cavity 21 of the acoustic module 2 corresponds to the first sound hole 11. One end of the adapter 3 is connected to the end of the first circuit board 1 opposite to the acoustic module 2, and the first opening 361 corresponds to the first sound hole 11, that is, the first opening 361 communicates with the first sound hole 11.
[0035] like Figure 1As shown, in this example, the central axes of the first opening 361 and the second opening 362 of the first channel 36 are offset from each other. For example, the inner diameters of the first opening 361 and the second opening 362 are the same, and the central axes of the first opening 361 and the second opening 362 do not coincide. The second opening 362 can serve as the inlet of the microphone's sound hole. By adjusting the position of the second opening 362 of the adapter 3, the inlet position of the microphone's sound hole can be adjusted, which is beneficial to improving the flexibility of microphone assembly. For example, when it is necessary to set the inlet of the microphone's sound hole in the middle, the first sound hole 11 can be set at an off-center position, while the second opening 362 can be set in the middle, thereby meeting the design requirements. At the same time, it can also make the structure of the acoustic module 2 and other electronic components in the cavity more compact, which is beneficial to the miniaturization design of the microphone.
[0036] For example, such as Figure 1 As shown, the first channel 36 can be bent so that the first opening 361 and the second opening 362 are staggered. Alternatively, the first channel 36 can also be bent, with its direction following a curve, so that the first opening 361 and the second opening 362 are staggered. Alternatively, the first channel 36 can also be a straight channel, with the first channel 36 inclined relative to the first circuit board 1, that is, the angle between the first channel 36 and the first circuit board 1 is greater than 0° and less than 90°. Of course, the specific configuration of the first channel 36 can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.
[0037] In this example, the adapter 3 has built-in wiring. One end of the adapter 3 is electrically connected to the first circuit board 1, and the other end can be electrically connected to other electronic components, thereby enabling the first circuit board 1 to be electrically connected to an external circuit through the adapter 3. For example, the other end of the adapter 3 can be electrically connected to the second circuit board 6. The adapter 3 can be made of the same material as the circuit board to facilitate wiring.
[0038] The first circuit board 1 can be a PCB board, which can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.
[0039] In one example, such as Figure 1 and Figure 2 As shown, one end of the adapter 3 is electrically connected to the end of the first circuit board 1 that is away from the acoustic-electric module 2, and the other end of the adapter 3 is adapted to be electrically connected to the second circuit board 6.
[0040] In this example, the two opposite ends of the adapter 3 are a first end and a second end, respectively. A first channel 36 extends from the first end to the second end. The first end has a first opening 361, and the second end has a second opening 362. The first end can connect to the end of the first circuit board 1 opposite to the acoustic module 2, and the first opening 361 corresponds to the first sound hole 11. The adapter 3 is sealed to the first circuit board 1, thereby enabling a sealed connection between the first channel 36 and the first sound hole 11.
[0041] like Figure 1 As shown, in this example, the second end of the adapter 3 is adapted to be electrically connected to the second circuit board 6. The adapter 3 is located between the first circuit board 1 and the second circuit board 6, and the first circuit board 1 can be electrically connected to the second circuit board 6 via the adapter 3. For example, the second circuit board 6 has a second sound hole 61, the second end of which can be connected to the second circuit board 6, and the second opening 362 corresponds to the second sound hole 61. The adapter 3 and the second circuit board 6 are sealed together, thereby enabling a sealed connection between the first channel 36 and the second sound hole 61.
[0042] The second circuit board 6 can be an FPC board, which can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.
[0043] In one example, such as Figure 4 As shown, the adapter 3 has a first soldering part 34 at one end facing the first circuit board 1.
[0044] In this example, the adapter 3 can be soldered to the first circuit board 1 via the first soldering part 34. The first soldering part 34 can be a solder ring, which is positioned around the first opening 361. A corresponding solder ring is provided at the end of the first circuit board 1 facing the adapter 3, and the solder ring is positioned around the first acoustic hole 11. The first soldering part 34 of the adapter 3 can be sealed to the solder ring of the first circuit board 1 using solder paste, thereby achieving a sealed soldering.
[0045] In one example, such as Figure 3 As shown, the adapter 3 has a second welding part 35 at the end opposite to the first circuit board 1.
[0046] In this example, the adapter 3 has a second welding part 35 at the end opposite to the first welding part 34. The adapter 3 can be welded to the second circuit board 6 via the second welding part 35. The second welding part 35 can be a solder ring, which surrounds the second opening 362. A corresponding solder ring is provided at the end of the second circuit board 6 facing the adapter 3, surrounding the second acoustic hole 61. The second welding part 35 of the adapter 3 can be sealed to the solder ring of the second circuit board 6 using solder paste, thereby achieving a sealed weld.
[0047] In this example, the material of the adapter 3 can be the same as that of the first circuit board 1, so that it can match the CTE (Coefficient of Thermal Expansion) of the first circuit board 1 or the second circuit board 6, thereby improving the welding quality between the adapter 3 and the first circuit board 1 or the second circuit board 6.
[0048] In one example, the adapter 3 is at least partially embedded within the first circuit board 1. Partially embedding the adapter 3 within the first circuit board 1 saves space and facilitates miniaturization of the microphone.
[0049] In this example, the adapter 3 can be partially embedded within the first acoustic hole 11. For example, the first opening 361 is located within the first acoustic hole 11. The adapter 3 can be sealed to the inner wall of the first acoustic hole 11.
[0050] In one example, such as Figures 2 to 4 As shown, the adapter 3 includes a first adapter layer 31 and a second adapter layer 32. The first adapter layer 31 is provided with a first through hole 311, and the second adapter layer 32 is provided with a second through hole 321. The first through hole 311 and the second through hole 321 are connected, and the central axes of the first through hole 311 and the second through hole 321 are offset from each other.
[0051] In this example, the adapter 3 can be composed of multiple layers, including a first adapter layer 31 and a second adapter layer 32. The first adapter layer 31 has a first through hole 311, and the second adapter layer 32 has a second through hole 321, which communicate with each other. The first adapter layer 31 and the second adapter layer 32 are located at opposite ends of the adapter 3. The opening of the second through hole 321 is a first opening 361, and a first welding part 34 is disposed on the second adapter layer 32. The opening of the first through hole 311 is a second opening 362, and a second welding part 35 is disposed on the first adapter layer 31. The central axes of the first through hole 311 and the second through hole 321 are offset from each other, thereby allowing the central axes of the first opening 361 and the second opening 362 to be offset from each other.
[0052] In one example, such as Figure 2 and Figure 5 As shown, the adapter 3 also includes a third adapter layer 33, which has a third through hole 331. The first adapter layer 31 and the second adapter layer 32 are respectively connected to opposite sides of the third adapter layer 33, and the third through hole 331 communicates with the first through hole 311 and the second through hole 321 respectively.
[0053] In this example, the third transition layer 33 can be located between the first transition layer 31 and the second transition layer 32. The third transition layer 33 is provided with a third through hole 331, through which the first through hole 311 and the second through hole 321 are connected. The first through hole 311, the third through hole 331 and the second through hole 321 form a first channel 36.
[0054] It should be noted that the first transition layer 31, the second transition layer 32 and the third transition layer 33 can be stacked together by a pressing process to achieve a sealed connection of the three transition layers, so as to ensure the sealing of the first channel 36.
[0055] It should also be noted that multiple third transition layers 33 can be provided, thereby allowing adjustment of the shape and length of the first channel 36 of the transition piece 3.
[0056] In this example, the adapter 3 is integrally molded, which simplifies the overall assembly process of the microphone. Of course, those skilled in the art can determine the specific molding method of the adapter 3 according to the actual situation, and no specific limitation is made here.
[0057] like Figure 1 As shown, in this example, a pressure sensor 4 is also connected to the first circuit board 1. The pressure sensor 4 is located inside the microphone cavity. The pressure sensor 4 is electrically connected to the first circuit board 1. Of course, other types of electronic components can also be placed inside the cavity, as can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.
[0058] According to another embodiment of this application, a microphone is provided. Figure 6 As shown, the microphone includes a substrate 7 with a first sound hole 11. An acoustic module 2 is mounted on the substrate 7 and has a front cavity 21. An adapter 3 is embedded in the substrate 7 and has a first channel 36. The first channel 36 has a first opening 361 and a second opening 362 that are oppositely disposed. The central axes of the first opening 361 and the second opening 362 are offset from each other. The first opening 361 communicates with the front cavity 21 through the first sound hole 11.
[0059] In this example, the adapter 3 has a first channel 36, with a first opening 361 and a second opening 362 at opposite ends. The first opening 361 communicates with the front cavity 21 through the first sound hole 11, and the second sound hole 61 is suitable for communication with the external space. The central axes of the first opening 361 and the second opening 362 are offset from each other, which helps to improve the flexibility of microphone assembly. The adapter 3 is embedded in the substrate 7, which saves the space occupied by the adapter 3 and is conducive to the miniaturization design of the microphone.
[0060] In this example, the adapter 3 can be embedded within the first acoustic hole 11, with the outer wall of the adapter 3 sealingly connected to the inner wall of the first acoustic hole 11. The first opening 361 can be located inside the first acoustic hole 11. Alternatively, the first opening 361 can be flush with the end face of the first acoustic hole 11, allowing the acoustic module 2 to be mounted on one side of the substrate 7 and on the adapter 3 on the other side. Alternatively, the acoustic module 2 can be entirely mounted on the substrate 7.
[0061] In one example, such as Figure 6 As shown, the inner wall of the first sound hole 11 is provided with a boss 12, and the adapter 3 is provided on the boss 12.
[0062] In this example, a boss 12 extends from the inner wall of the first acoustic hole 11 towards the center. That is, the substrate 7 has a groove, the adapter 3 is embedded in the groove, and the bottom wall of the groove has a through hole that communicates with the first channel 36. The adapter 3 is located on the boss 12, thereby improving the stability of the adapter 3 assembly. For example, one end of the adapter 3 can be sealed and welded to the boss 12.
[0063] For example, the boss 12 is located on the side of the first acoustic hole 11 away from the acoustic module 2. The boss 12 has a through hole, and the adapter 3 is disposed on the boss 12, with its second opening 362 corresponding to the through hole of the boss 12. The front cavity 21 corresponds to the first opening 361. Alternatively, the boss 12 is located on the side of the first acoustic hole 11 closer to the acoustic module 2. The boss 12 has a through hole, and the adapter 3 is disposed on the boss 12, with its first opening 361 corresponding to the through hole of the boss 12, and the front cavity 21 corresponding to the through hole of the boss 12. Those skilled in the art can determine the specific configuration based on actual conditions; no specific limitations are made here.
[0064] It should be noted that the substrate 7 can be the first circuit board 1. The acoustic-electric module 2 is mounted on the first circuit board 1 and electrically connected to it. The end of the first circuit board 1 facing away from the acoustic-electric module 2 is electrically connected to the second circuit board 6. The second circuit board 6 can be soldered to the first circuit board 1. The adapter 3 is embedded in the first circuit board 1 and soldered to it. The material of the adapter 3 can be the same as that of the first circuit board 1, so that it can match the CTE (Coefficient of Thermal Expansion) of the first circuit board 1, thereby improving the soldering quality between the adapter 3 and the first circuit board 1.
[0065] It should be noted that the acoustic-electric module 2 may include a MEMS chip, which is mounted on the first circuit board 1 and has a front cavity 21. The front cavity 21 corresponds to the first sound hole 11. The adapter 3 is embedded in the substrate 7, and the first channel 36 can communicate with the front cavity 21 through the first sound hole 11. External sound signals can enter the first channel 36 through the second opening 362, and then enter the front cavity 21 through the first opening 361. The acoustic-electric module 2 can receive the sound signal and convert it into an electrical signal.
[0066] like Figure 6 As shown, in this example, the microphone also includes a housing 5. The open end of the housing 5 is soldered to the substrate 7. The housing 5 and the substrate 7 surround to form an inner cavity. The acoustic module 2 is mounted on the substrate 7 and is located in the inner cavity. The substrate 7 has a first sound hole 11 through it along the thickness direction, and the front cavity 21 of the acoustic module 2 corresponds to the first sound hole 11.
[0067] like Figure 6 As shown, in this example, the central axes of the first opening 361 and the second opening 362 of the first channel 36 are offset from each other. For example, the inner diameters of the first opening 361 and the second opening 362 are the same, and the central axes of the first opening 361 and the second opening 362 do not coincide. The second opening 362 can serve as the inlet of the microphone's sound hole. By adjusting the position of the second opening 362 of the adapter 3, the inlet position of the microphone's sound hole can be adjusted, which is beneficial to improving the flexibility of microphone assembly. For example, when it is necessary to set the inlet of the microphone's sound hole in the middle, the first sound hole 11 can be set at an off-center position, while the second opening 362 can be set in the middle, thereby meeting the design requirements. At the same time, it can also make the structure of the acoustic module 2 and other electronic components in the cavity more compact, which is beneficial to the miniaturization design of the microphone.
[0068] For example, such as Figure 6 As shown, the first channel 36 can be bent so that the first opening 361 and the second opening 362 are staggered. Alternatively, the first channel 36 can also be bent, with its direction following a curve, so that the first opening 361 and the second opening 362 are staggered. Alternatively, the first channel 36 can also be inclined relative to the first circuit board 1, that is, the angle between the first channel 36 and the first circuit board 1 is greater than 0° and less than 90°. Of course, the specific configuration of the first channel 36 can be determined by those skilled in the art according to the actual situation, and is not specifically limited here.
[0069] In one example, such as Figures 2 to 4As shown, the adapter 3 includes a first adapter layer 31 and a second adapter layer 32. The first adapter layer 31 is provided with a first through hole 311, and the second adapter layer 32 is provided with a second through hole 321. The first through hole 311 and the second through hole 321 are connected, and the central axes of the first through hole 311 and the second through hole 321 are offset from each other.
[0070] In this example, the adapter 3 can be composed of multiple layers, including a first adapter layer 31 and a second adapter layer 32. The first adapter layer 31 has a first through hole 311, and the second adapter layer 32 has a second through hole 321, which communicate with each other. The first adapter layer 31 and the second adapter layer 32 are located at opposite ends of the adapter 3. The opening of the second through hole 321 is a first opening 361, and the opening of the first through hole 311 is a second opening 362. The central axes of the first through hole 311 and the second through hole 321 are offset from each other, thereby allowing the central axes of the first opening 361 and the second opening 362 to be offset from each other.
[0071] In one example, such as Figure 2 and Figure 5 As shown, the adapter 3 also includes a third adapter layer 33, which has a third through hole 331. The first adapter layer 31 and the second adapter layer 32 are respectively connected to opposite sides of the third adapter layer 33, and the third through hole 331 communicates with the first through hole 311 and the second through hole 321 respectively.
[0072] In this example, the third transition layer 33 can be located between the first transition layer 31 and the second transition layer 32. The third transition layer 33 is provided with a third through hole 331, through which the first through hole 311 and the second through hole 321 are connected. The first through hole 311, the third through hole 331 and the second through hole 321 form a first channel 36.
[0073] It should be noted that the first transition layer 31, the second transition layer 32 and the third transition layer 33 can be stacked together by a pressing process to achieve a sealed connection of the three transition layers, so as to ensure the sealing of the first channel 36.
[0074] It should also be noted that multiple third transition layers 33 can be provided, thereby allowing adjustment of the shape and length of the first channel 36 of the transition piece 3.
[0075] In this example, the adapter 3 is integrally molded, which simplifies the overall assembly process of the microphone. Of course, those skilled in the art can determine the specific molding method of the adapter 3 according to the actual situation, and no specific limitation is made here.
[0076] like Figure 6As shown, in this example, a pressure sensor 4 is also connected to the first circuit board 1. The pressure sensor 4 is located inside the microphone cavity. The pressure sensor 4 is electrically connected to the first circuit board 1. Of course, other types of electronic components can also be placed inside the cavity, as can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.
[0077] According to another embodiment of this application, an electronic device is provided. This electronic device includes the microphone described in the above embodiments. The electronic device can be a smart device such as headphones, a mobile phone, or a smart bracelet; those skilled in the art can determine the appropriate device based on the specific circumstances, and no specific limitations are made herein.
[0078] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.
[0079] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims
1. A microphone, characterized in that, include: The first circuit board (1) is provided with a first sound hole (11); An acoustic-electric module (2) is mounted on the first circuit board (1), and the acoustic-electric module (2) has a front cavity (21). The adapter (3) is electrically connected to the first circuit board (1). The adapter (3) is provided with a first channel (36). The first channel (36) has a first opening (361) and a second opening (362) arranged opposite to each other. The central axes of the first opening (361) and the second opening (362) are offset from each other. The first opening (361) is connected to the front cavity (21) through the first sound hole (11).
2. The microphone according to claim 1, characterized in that, One end of the adapter (3) is electrically connected to the end of the first circuit board (1) away from the acoustic-electric module (2), and the other end of the adapter (3) is adapted to be electrically connected to the second circuit board (6).
3. The microphone according to claim 2, characterized in that, The adapter (3) has a first soldering part (34) at one end facing the first circuit board (1).
4. The microphone according to claim 1, characterized in that, The adapter (3) has a second welding part (35) at the end opposite to the first circuit board (1).
5. The microphone according to claim 1, characterized in that, The adapter (3) is at least partially embedded in the first circuit board (1).
6. The microphone according to claim 1, characterized in that, The adapter (3) includes a first adapter layer (31) and a second adapter layer (32). The first adapter layer (31) has a first through hole (311), and the second adapter layer (32) has a second through hole (321). The first through hole (311) and the second through hole (321) are connected, and the central axes of the first through hole (311) and the second through hole (321) are offset from each other.
7. The microphone according to claim 6, characterized in that, The adapter (3) further includes a third adapter layer (33), which has a third through hole (331). The first adapter layer (31) and the second adapter layer (32) are respectively connected to opposite sides of the third adapter layer (33), and the third through hole (331) is connected to the first through hole (311) and the second through hole (321) respectively.
8. The microphone according to claim 1, characterized in that, The adapter (3) is integrally formed.
9. A microphone, characterized in that, include: The substrate (7) is provided with a first acoustic hole (11); An acoustic-electric module (2) is mounted on the substrate (7), and the acoustic-electric module (2) has a front cavity (21). The adapter (3) is embedded in the substrate (7). The adapter (3) has a first channel (36). The first channel (36) has a first opening (361) and a second opening (362) that are arranged opposite to each other. The central axes of the first opening (361) and the second opening (362) are offset from each other. The first opening (361) is connected to the front cavity (21) through the first sound hole (11).
10. The microphone according to claim 9, characterized in that, The inner wall of the first sound hole (11) is provided with a boss (12), and the adapter (3) is provided on the boss (12).
11. An electronic device, characterized in that, Includes the microphone as described in any one of claims 1 to 10.