Sound box mainboard function test equipment and test method

Abstract

According to the sound box mainboard function test equipment and the test method, the structure is compact, function testing can be carried out on intelligent sound box equipment, the test functions are rich, and batch production testing is achieved. The system comprises a test substrate, the test substrate is in communication connection with an upper computer through a switch, the test substrate is connected with a wireless interface board through a signal interface board, and the wireless interface board is connected with a tested sound box mainboard; the test substrate comprises a main control module, and the main control module is connected with a first data acquisition and recording module, a second data acquisition and recording module, a high-speed digital acquisition module, a multipath signal switch switching module, a digital multimeter module, a power supply module, a Type-C protocol module and an I2C expansion chip circuit. The method is applied to the technical field of sound box mainboard measurement.

Description

Technical Field

[0001] This invention relates to the technical field of speaker motherboard measurement, and in particular to a speaker motherboard functional testing device and testing method. Background Technology

[0002] The smart speaker industry is developing rapidly, with numerous brands releasing their products, especially in the home. Smart speakers are not only used for entertainment but also integrate with various smart home applications, bringing great convenience to people's lives. In the electronic equipment testing industry, the main functions and performance of smart speakers are tested to ensure their high-quality performance.

[0003] However, in existing technologies, some speaker motherboard measurement solutions have low functional test coverage; insufficient automation in testing, resulting in limited testing efficiency and requiring increased investment in manual testing; inadequate audio testing, with missing or incomplete testing of interfaces such as GPIO / I2C; and, in addition, the data collection, management, and analysis throughout the entire testing process are scattered and limited, hindering subsequent data analysis and improvement.

[0004] For example, Chinese patent CN201440729U discloses a speaker testing device. A first analog output interface outputs an audio signal to a power amplifier, which then drives the speaker to produce sound. A microphone picks up the sound emitted by the speaker and inputs it to a microprocessor via a first analog input interface. The microprocessor then feeds back the signal to a computer via a USB interface, thus completing the sampling of the speaker's audio signal. A second analog output interface outputs an audio signal to a second analog input interface (i.e., the second analog output interface and the second analog input interface are directly shorted) as a reference audio signal. The second analog input interface inputs an audio signal to the microprocessor, which then feeds back the signal to the computer via a USB interface, thus completing the sampling of the reference audio signal. The speaker's state is determined by comparing the audio signal of the speaker under test with the reference audio signal, and the speaker's state is adjusted according to the user's requirements until the user's requirements are met. However, this testing method has the drawback of relatively limited testing functions. The degree of audio testing is insufficient, and interface testing such as GPIO / I2C is missing or incomplete. Data collection, management, and analysis throughout the entire testing process are relatively scattered, which has limitations and is not conducive to subsequent data analysis and improvement. Therefore, it is necessary to provide a speaker motherboard functional testing device and testing method that is compact in structure, capable of performing functional tests on smart speaker devices, has rich testing functions, and enables mass production testing. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a speaker motherboard functional testing device and testing method. It has a compact structure, can perform functional testing on smart speaker devices, has rich testing functions, and can realize mass production testing.

[0006] The technical solution adopted in this invention is as follows: This invention includes a test substrate, which is connected to a host computer via a switch. The test substrate is connected to a wireless interface board via a signal interface board, and the wireless interface board is connected to the motherboard of the speaker under test. The test substrate includes a main control module, which is connected to a first data acquisition and recording module, a second data acquisition and recording module, a high-speed digital acquisition module, a multi-channel signal switch switching module, a digital multimeter module, a power supply module, a Type-C protocol module, and an I2C expansion chip circuit. The first data acquisition and recording module and the second data acquisition and recording module are both used for high-precision DC voltage measurement and rapid recording of input voltage data from two channels. The high-speed digital acquisition module is used for real-time waveform sampling and storage, acquiring the voltage peak-to-peak value Vpp and the voltage RMS value Vrms. The multi-channel signal switch switching module is used to switch the power sequence related signals transmitted from the motherboard of the speaker under test.

[0007] As can be seen from the above solution, this application is applicable to the functional testing of smart speaker motherboards, and tests the communication, audio, and load-bearing functions of smart speakers. Large-scale production testing of specific speaker motherboards has been carried out at the factory, and the results have been verified in production practice. It can perform functional testing on smart speaker devices, with rich testing functions, and realizes mass production testing.

[0008] In a preferred embodiment, the signal interface board includes an audio measurement module, a signal switching board, and an electronic load board. The audio measurement module and the electronic load board are both connected to the main control module, and the signal switching board is connected to the digital multimeter module and the power supply module.

[0009] In a preferred embodiment, the test substrate further includes an I / O expansion chip, a digital-to-analog converter, and a memory, all of which are connected to the main control module.

[0010] In a preferred embodiment, the host computer interacts with the switch via a USB hub, the switch is connected to the main control module, the switch communicates with the electrical control board via a network port, the electrical control board controls the entry, exit, up, and down movements of the test equipment, and the electrical control board is connected to a front panel light display module.

[0011] A preferred embodiment is that the testing method includes audio signal testing, frequency signal testing, and load signal testing, wherein the audio signal testing includes the following steps: Step A1: The motherboard of the speaker under test outputs a specific audio signal, and a simulated speaker inductive load is set on the signal interface board; Step A2: By selecting the control, provide 2-ohm and 8-ohm loads. After the audio signal passes through the load, the measurement signal is output from its sensing line and further connected to the selection path of the signal interface board. Step A3: After passing through the common-mode filter circuit, the DC component of the audio signal is measured; the DC component signal passes through the 1 / 5 voltage divider path of the signal interface board and finally enters the digital multimeter module for voltage reading; Step A4: The other path is for measuring the AC component of the audio signal. After signal switching path selection, it will finally enter the audio measurement module for parameter measurement. The parameters include signal-to-noise ratio, total harmonic distortion, total harmonic distortion plus noise, peak-to-peak voltage, and RMS voltage.

[0012] In a preferred embodiment, the wireless interface board includes a comparator, and the frequency signal test includes the following steps: Step B1: The motherboard of the speaker under test is powered on and outputs three 32KHz frequency signals, namely PMU2FM_CLK32K_1V8, PMU2WL_CLK32K_1V8, and PMU2R1P_CLK32K. Step B2: Select the 8-to-1 switch and the comparator on the wireless interface board to select one frequency signal each time; Step B3: Select the corresponding electronic switch path on the signal interface board; Step B4: The main control module reads the corresponding frequency commands: “freq_meter.open()”, “freq_meter.start_measure(1000, 125000000, 3)”, and “freq_meter.measure_frequency("LP")”. Step B5: When the frequency is within the range, the 32kHz test displays PASS; when the frequency is outside the range, the 32kHz test displays FAIL.

[0013] A preferred embodiment is that the loaded signal test includes the following steps: Step C1: The motherboard of the speaker under test is powered on, and the PPHV voltage of the motherboard of the speaker under test rises to 16V; Step C2: Disconnect the current extraction path of the signal interface board; Step C3: The main control module sends the command "luggage.set_CC(1000)" via the I2C bus to control the electronic load board to set the load current to 1A; Step C4: The main control module sends the instruction "luggage.Read_curr()" via the SPI bus to control the electronic load board to read back the load current; Step C5: When the load current is within the range, the current test displays PASS; when the load current is outside the range, the current test displays FAIL. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the present invention; Figure 2 This is a flowchart of the audio signal test; Figure 3 This is a flowchart of the frequency signal test; Figure 4 This is a flowchart of the load signal test. Detailed Implementation

[0015] like Figures 1 to 2 As shown, in this embodiment, the present invention includes a test substrate 1, which is connected to a host computer 3 via a switch 2. The test substrate 1 is connected to a wireless interface board 5 via a signal interface board 4, and the wireless interface board 5 is connected to the motherboard 6 of the speaker under test. The test substrate 1 includes a main control module 7, which is connected to a first data acquisition and recording module 8, a second data acquisition and recording module 9, a high-speed digital acquisition module 10, a multi-channel signal switch switching module 11, a digital multimeter module 12, a power supply module 13, a Type-C protocol module 14, and an I2C expansion chip circuit 15. The first data acquisition and recording module 8 and the second data acquisition and recording module 9 are both used for high-precision DC voltage measurement and rapid recording of the input voltage data of two channels. The high-speed digital acquisition module 10 is used for real-time waveform sampling and storage, acquiring the voltage peak-to-peak value Vpp and the voltage effective value Vrms. The multi-channel signal switch switching module 11 is used to switch the power sequence related signals transmitted from the motherboard 6 of the speaker under test.

[0016] The wireless interface board 5 primarily receives signals from the probe module and performs preliminary processing on these signals. The wireless interface board 5 connects to the signal interface board 4 via a board-to-board connector, further introducing the signals to the signal interface board 4 for more detailed and complex processing. The signal interface board 4 receives the signals from the wireless interface board 5 and performs further processing. This board contains various signal processing and switching circuits. The test substrate 1 is the core component of the entire test system's data processing.

[0017] The first data acquisition and recording module 8 and the second data acquisition and recording module 9 are used for high-precision DC voltage measurement, capable of simultaneously and quickly recording input voltage data from two channels, with an input signal voltage range of <5V. The high-speed digital acquisition module 10 is used for real-time waveform sampling and storage, capable of acquiring voltage peak-to-peak value (Vpp), voltage RMS value (Vrms), frequency measurement, and other applications requiring signal analysis. This module has a sampling rate of up to 40Msps and a resolution of 12bit. The multi-channel signal switching module 11 is mainly used to switch power sequence-related signals from the motherboard 6 of the speaker under test, with an input signal voltage range of <5V. The I2C expansion chip circuit 15 is mainly used to expand the I2C bus, supporting the expansion of a single I2C circuit to 8 I2C channels. The digital multimeter module 12 is used for measuring parameters such as voltage and current. The power module 13 is a programmable power module with an input voltage range of 22.8 ~ 25.2V (24V ± 5%), an input current of 0 ~ 4.5A, an output voltage of 1.5 ~ 20V, and an output current of 0 ~ 5A. The power module 13 is primarily used to power the motherboard 6 of the speaker under test. The Type-C protocol module 14, combined with the power module 13, can function as a configurable USB PD charger / power supply / receiver, and can achieve USB power delivery protocol communication via a configuration channel (i.e., the CC line), including charging protocol negotiation and the transmission of customized manufacturer-defined messages.

[0018] like Figure 1 As shown, in this embodiment, the signal interface board 4 includes an audio measurement module 16, a signal switching board 17, and an electronic load board 18. The audio measurement module 16 and the electronic load board 18 are both connected to the main control module 7, and the signal switching board 17 is connected to the digital multimeter module 12 and the power supply module 13.

[0019] The audio measurement module 16 provides one uplink and one downlink. In the uplink test, the module generates an audio tone and sends it to the motherboard 6 of the speaker under test. In the downlink, the module receives an analog tone generated by the motherboard 6 of the speaker under test, digitizes it, and further performs analysis such as signal-to-noise ratio and total harmonic distortion. The signal switching board 17 can switch up to 64 voltage rails. The module's circuitry consists of three hardware connections: 1 / 5 voltage divider (channels 0-7), 1 / 2 voltage divider (channels 8-15), and no voltage divider (channels 16-63). In practical applications, the connections can be adjusted according to different voltage levels. The electronic load board 18 is mainly used to perform load tests on the relevant voltage rails of the speaker motherboard 6 under test, checking the load-carrying capacity of the relevant voltage rails of the speaker motherboard 6 under test. This module supports three modes: constant resistance, constant voltage, and constant current. In this test system, the constant current mode is mainly used. In constant current mode, the constant current range is up to 4A (60W), and the current setting accuracy is + / - (0.1% + 0.5mA).

[0020] like Figure 1 As shown, in this embodiment, the test substrate 1 further includes an IO expansion chip 19, a digital-to-analog converter 20, and a memory 21, all of which are connected to the main control module 7.

[0021] The I / O expansion chip 19 is applied to various board modules of this system for bit control of corresponding board devices, such as relays, MOSFETs, and electronic switches (MUX). The digital-to-analog converter 20, combined with the comparator circuit (ADCMP602BRMZ), is mainly used to set the comparison reference for frequency measurement and for signal shaping. The memory 21 is widely used in various board modules of this system for storing information of each board module, including board serial number information and calibration coefficient storage.

[0022] like Figure 1 As shown, in this embodiment, the host computer 3 interacts with the switch 2 through the USB hub 22. The switch 2 is connected to the main control module 7. The switch 2 communicates with the electrical control board 24 through the network port. The electrical control board 24 controls the entry, exit, up, and down movements of the test equipment. The electrical control board 24 is connected to the front panel light panel display module 25.

[0023] The host computer 3 interacts with the switch 2 through the USB hub 22, issuing commands and acquiring data. Simultaneously, it communicates with the electrical control board 24 via the network port, controlling the entry, exit, up, and down movements of the test equipment. Furthermore, it simultaneously controls the front panel light display module 25, displaying the operating status (yellow or blue light), test pass (green light), and test failure (red light) of multiple operating channels.

[0024] In this embodiment, the power supply board is powered by 220V AC power from the mains (110VAC optional) as the energy source for the entire system. After passing through the switching power supply, various DC power supplies such as +24V / +12V / -12V / +5V can be obtained, and connected to the test equipment board through the power bridge board to enable the board to work normally.

[0025] In this embodiment, the wireless interface board 5 is connected to the motherboard 6 of the speaker under test via a probe module; the main function of the probe module is to extract various test signals from the smart speaker and connect these signals to the wireless interface board 5.

[0026] like Figures 1 to 4 As shown, in this embodiment, the testing method includes audio signal testing, frequency signal testing, and load signal testing. The audio signal testing includes the following steps: Step A1: The motherboard 6 of the speaker under test outputs a specific audio signal, and a simulated speaker inductive load is set on the signal interface board 4; Step A2: By selecting the control, provide 2-ohm and 8-ohm loads. After the audio signal passes through the load, the measurement signal is output from its sensing line and further connected to the selection path of the signal interface board 4. Step A3: After passing through the common-mode filter circuit, the DC component of the audio signal is measured; the DC component signal passes through the 1 / 5 voltage divider path of the signal interface board 4 and finally enters the digital multimeter module 12 for voltage reading. Step A4: The other path is the measurement of the AC component of the audio signal. After the signal switching path selection, it will finally enter the audio measurement module 16 for parameter measurement. The parameters include signal-to-noise ratio, total harmonic distortion, total harmonic distortion plus noise, voltage peak-to-peak value, and voltage RMS value.

[0027] like Figures 1 to 4 As shown, in this embodiment, the wireless interface board 5 includes a comparator 26, and the frequency signal test includes the following steps: Step B1: The motherboard 6 of the speaker under test is powered on and outputs three 32KHz frequency signals, namely PMU2FM_CLK32K_1V8, PMU2WL_CLK32K_1V8, and PMU2R1P_CLK32K. Step B2: Select the 8-to-1 switch and the comparator 26 on the wireless interface board 5 to select one frequency signal each time; Step B3: Select the corresponding electronic switch path on the signal interface board 4; Step B4: The main control module 7 reads the corresponding frequency commands: “freq_meter.open()”, “freq_meter.start_measure(1000, 125000000, 3)”, and “freq_meter.measure_frequency("LP")”. Step B5: When the frequency is within the range, the 32kHz test displays PASS; when the frequency is outside the range, the 32kHz test displays FAIL.

[0028] like Figures 1 to 2 As shown, in this embodiment, the load signal test includes the following steps: Step C1: The motherboard 6 of the speaker under test is powered on, and the PPHV voltage of the motherboard 6 of the speaker under test rises to 16V; Step C2: Disconnect the current extraction path of the signal interface board 4; Step C3: The main control module 7 sends the command "luggage.set_CC(1000)" via the I2C bus to control the electronic load board 18 to set a load current of 1A; Step C4: The main control module 7 sends the instruction "luggage.Read_curr()" via the SPI bus to control the electronic load board 18 to read back the load current; Step C5: When the load current is within the range, the current test displays PASS; when the load current is outside the range, the current test displays FAIL.

[0029] In this embodiment, the testing method also includes USB signal testing. The motherboard 6 of the speaker under test has multiple USB 2.0 signals, all of which need to be tested for communication. After being switched and selected by the USB Switch circuit on the wireless interface board 5, the USB 2.0 signal is further connected to the signal interface board 4. After selection and control, it is connected to the computer via a USB cable to complete the relevant communication tests with the computer.

[0030] In this embodiment, the test method also includes a product wake-up signal test. After the product is working normally, the signal will output a 1.2V level. After passing through a buffer and level conversion on the wireless interface board 5, a 3.3V level signal will be output. This signal will be used for switching and logic gate control of the signal interface board 4. This is a safety setting. Only when the product is working normally can the relevant circuits perform the next enable control and other work.

[0031] In this embodiment, the test method also includes a low-voltage power sequence signal test. This part of the signal is mainly generated by the LDO circuit of the wireless interface board 5, which generates 3.3V, 1.8V, and 1.2V low-voltage power supplies to pull up the relevant signals of the motherboard 6 of the speaker under test, so that the product can enter a specific working mode.

[0032] In this embodiment, the testing method also includes power sequence signal testing. According to testing requirements, the behavior of power sequence signals needs to be monitored during the power-on and power-off cycles and when entering relevant operating modes of the motherboard 6 under test. These signals are first connected to the Power Sequence Reserve Connector (a connector for easy signal routing during debugging) of the wireless interface board 5, and simultaneously connected to the signal interface board 4. The relevant path selection circuit of the signal interface board 4 switches and selects signals according to control logic. Further, the selected signals are connected to the test substrate, where they are divided by 1 / 6, and finally connected to the data acquisition and recording module 1 / 2 and the high-speed digital acquisition module. Specifically, for the high-speed digital acquisition module, the front end also passes through a multi-channel signal switching module, allowing for up to 40 signal switching channels. The choice between using the data acquisition and recording module 1 / 2 and the high-speed digital acquisition module depends on the specific testing requirements; for signals requiring high response speed, the high-speed digital acquisition module is typically selected. The acquired signal data is recorded locally on the computer. Using relevant software, this data can be converted into graphical files, allowing for a visual observation of the signal changes.

[0033] In this embodiment, the test method further includes current measurement signal testing. The speaker motherboard 6 under test requires measurement of multiple current signals (this test only requires measurement of 3 channels). First, the current sampling signal from the speaker motherboard 6 under test reaches the MUX (ADG1409) circuit of the signal interface board 4. After passing through the instrumentation operational amplifier, the differential signal is converted into a single-ended voltage signal, which is then read by the digital multimeter module. Note that the instrumentation operational amplifier can be set to select the amplification factor (which can be set to x1, x10, x100, x1000) according to actual needs. In addition, the instrumentation operational amplifier has a reference voltage circuit, which can be used to select whether to boost the voltage according to the actual situation.

[0034] In this embodiment, the testing method further includes voltage measurement signal testing. This testing system requires measuring a relatively large number of various voltage rails. Up to six voltage rails are connected to a 1 / 5 voltage divider, eight to a 1 / 2 voltage divider, and nineteen to a channel without a voltage divider. After being connected to the signal switching board, these voltages undergo switching and selection before finally being connected to a digital multimeter module for individual voltage measurement. In this embodiment, the testing method further includes a voltage bus signal test, where the signal line is the main power supply line of the speaker motherboard 6 under test. The speaker motherboard 6 under test uses a Type-C interface, and with the cooperation of the CC line and the power module, the power module will output the corresponding voltage to the speaker motherboard 6 under test according to the protocol.

[0035] In this embodiment, the test method also includes pull-up / pull-down signal testing. When the motherboard 6 of the speaker under test needs to enter a certain working mode, it needs to pull up or pull down its relevant signals. This part of the control is mainly controlled by the MOSFET switching circuit of the 1.2V or 1.8V power supply of the wireless interface board 5.

[0036] In this embodiment, the testing method further includes serial communication signal testing. The speaker motherboard 6 under test in this testing system requires serial communication circuit testing. Since the serial communication signal level output by the speaker motherboard 6 under test is 1.2V, a 1.2V to 1.8V level conversion needs to be performed on the wireless interface board 5 to match the signal level of the backend main control board. After level matching, the master-slave communication test between the main control board and the speaker motherboard 6 under test can be performed.

[0037] In this embodiment, the testing method further includes a light source sensing signal test. The speaker motherboard 6 under test has a light source sensing function, which needs to be tested. In this testing system, an independent lamp source board is designed. The control terminal of the lamp source board originates from the lamp source driving circuit of the signal interface board 4 and the control circuit of the test substrate. The main control board can indirectly control the brightness of the lamp source board by controlling the output voltage of the DAC and the comparator circuit, simulating changes in the light source. The speaker motherboard 6 under test detects the change in the light source and provides corresponding feedback.

[0038] Although the embodiments of the present invention are described with reference to actual solutions, they do not constitute a limitation on the meaning of the present invention. Modifications to the embodiments and combinations with other solutions based on this specification will be obvious to those skilled in the art.

Claims

1. A speaker motherboard function testing device, comprising a test board (1), wherein the test board (1) is communicatively connected to a host computer (3) via a switch (2), characterized in that: The test substrate (1) is connected to the wireless interface board (5) via the signal interface board (4), and the wireless interface board (5) is connected to the motherboard (6) of the speaker under test. The test substrate (1) includes a main control module (7), which is connected to a first data acquisition and recording module (8), a second data acquisition and recording module (9), a high-speed digital acquisition module (10), a multi-channel signal switch switching module (11), a digital multimeter module (12), a power supply module (13), a Type-C protocol module (14), and an I2C expansion chip circuit (15). The first data acquisition and recording module (8) and the second data acquisition and recording module (9) are used for high-precision DC voltage measurement and to quickly record the input voltage data of the two channels. The high-speed digital acquisition module (10) is used for real-time waveform sampling and storage, and to acquire the voltage peak-to-peak value Vpp and the voltage effective value Vrms. The multi-channel signal switch switching module (11) is used to switch the power sequence related signals transmitted from the motherboard (6) of the speaker under test.

2. The speaker motherboard function testing device according to claim 1, characterized in that, The signal interface board (4) includes an audio measurement module (16), a signal switching board (17), and an electronic load board (18). The audio measurement module (16) and the electronic load board (18) are both connected to the main control module (7), and the signal switching board (17) is connected to the digital multimeter module (12) and the power supply module (13).

3. The speaker motherboard functional testing device according to claim 1, characterized in that, The test substrate (1) also includes an IO expansion chip (19), a digital-to-analog converter (20), and a memory (21), all of which are connected to the main control module (7).

4. The speaker motherboard functional testing device according to claim 1, characterized in that, The host computer (3) interacts with the switch (2) through the USB hub (22). The switch (2) is connected to the main control module (7). The switch (2) communicates with the electrical control board (24) through the network port. The electrical control board (24) controls the entry, exit, up and down movements of the test equipment. The electrical control board (24) is connected to the front panel light panel display module (25).

5. A testing method comprising the speaker motherboard function testing equipment as described in claim 2, characterized in that, The testing method includes audio signal testing, frequency signal testing, and load signal testing. The audio signal testing includes the following steps: Step A1: The speaker motherboard (6) under test outputs a specific audio signal and sets a simulated speaker inductive load on the signal interface board (4); Step A2: By selecting the control, provide 2-ohm and 8-ohm loads. After the audio signal passes through the load, the measurement signal is output from its sensing line and further connected to the selection path of the signal interface board (4). Step A3: After passing through the common-mode filter circuit, the DC component of the audio signal is measured; the DC component signal passes through the 1 / 5 voltage divider path of the signal interface board (4) and finally enters the digital multimeter module (12) for voltage reading; Step A4: The other path is the measurement of the AC component of the audio signal. After the signal switching path selection, it will finally enter the audio measurement module (16) for parameter measurement. The parameters include signal-to-noise ratio, total harmonic distortion, total harmonic distortion plus noise, voltage peak-to-peak value, and voltage RMS value.

6. The test method according to claim 5, characterized in that, The wireless interface board (5) includes a comparator (26), and the frequency signal test includes the following steps: Step B1: The motherboard (6) of the speaker under test is powered on and outputs three 32KHz frequency signals, namely PMU2FM_CLK32K_1V8, PMU2WL_CLK32K_1V8, and PMU2R1P_CLK32K. Step B2: Select the 8-to-1 switch and the comparator (26) on the wireless interface board (5) to select one frequency signal each time; Step B3: Select the corresponding electronic switch path on the signal interface board (4); Step B4: The main control module (7) reads the corresponding frequency command, "freq_meter.open()", "freq_meter.start_measure(1000, 125000000, 3)", "freq_meter.measure_frequency("LP")"; Step B5: When the frequency is within the range, the 32kHz test displays PASS; when the frequency is outside the range, the 32kHz test displays FAIL.

7. The test method according to claim 5, characterized in that, The loaded signal test includes the following steps: Step C1: The speaker motherboard (6) under test is powered on, and the PPHV voltage of the speaker motherboard (6) under test rises to 16V; Step C2: Cut off the current extraction path of the signal interface board (4); Step C3: The main control module (7) sends the instruction "luggage.set_CC(1000)" via the I2C bus to control the electronic load board (18) to set the load current to 1A; Step C4: The main control module (7) sends the instruction "luggage.Read_curr()" through the SPI bus to control the electronic load board (18) to read back the load current; Step C5: When the load current is within the range, the current test displays PASS; when the load current is outside the range, the current test displays FAIL.

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