Heat dissipation type embedded chip for new energy management and control

Abstract

The invention discloses a heat dissipation type embedded chip for new energy management and control, which comprises a circuit board, a fan, a filter mechanism, a chip, a heat conducting plate, a heat dissipation plate, an elastic block, a power connection mechanism and a fixing mechanism, and is characterized in that the fan is fixedly mounted in the circuit board, the filter mechanism is arranged on the circuit board, the chip is slidably connected in the circuit board, and the elastic block is arranged on the chip. A heat conduction plate is adhered to the chip, a heat dissipation plate is fixedly connected to the heat conduction plate, an elastic block is fixedly connected to the circuit board, the elastic block is in contact with the chip, a power connection mechanism is arranged on the circuit board, and a fixing mechanism is arranged on the circuit board. The invention relates to a heat dissipation type embedded chip for new energy management and control. The heat dissipation type embedded chip has the advantages of being good in chip heat dissipation effect, stable in chip power connection and convenient to install.

Description

Technical Field

[0001] This invention belongs to the field of embedded chip technology, specifically a heat-dissipating embedded chip for new energy management. Background Technology

[0002] The remote control system for new energy vehicles includes temperature sensors, controllers, vehicle terminals, cloud servers, and mobile terminals. Temperature sensors acquire temperature data from inside or outside the vehicle and transmit it to the vehicle terminal. The vehicle terminal preprocesses the data and then transmits it to the cloud server via a wireless network. The cloud server processes the data and transmits the result to the mobile terminal. The mobile terminal then sends the command information to the air conditioning controller to control the temperature inside the new energy vehicle. Utility model patent CN216146518U discloses an embedded DSP control chip, including an integrated circuit board. The integrated circuit board has multiple leads on its top, with a cover plate at one end of each lead. A DSP control chip is located at the bottom of the cover plate. Inside the DSP control chip is a chip body with multiple pins fixedly connected to its outer periphery. These pins are symmetrically and evenly arranged. The chip body also has pads fixedly connected to one end of each pin. A die layer is located on top of the pads, and a semiconductor layer is located on top of the die layer. A plastic layer is fixedly bonded to the outer periphery of the semiconductor layer. This patent not only avoids the inconvenience of installation and disassembly caused by soldering by embedding the DSP control chip on the integrated circuit board, but also improves the stability of the embedded installation structure by securing the DSP control chip to the integrated circuit board using the cover plate. However, in the prior art, embedded chips used for new energy management suffer from inconvenient heat dissipation during prolonged use, affecting their lifespan. Furthermore, the overall installation and disassembly of the device are inconvenient, and the connection stability between the chip's contacts and the circuit board contacts cannot be guaranteed after chip installation. Therefore, improvements are needed. Summary of the Invention

[0003] The purpose of this invention is to provide a heat-dissipating embedded chip for new energy management in order to solve the above-mentioned problems, thereby solving the problems mentioned in the background art.

[0004] To address the above problems, the present invention provides a technical solution:

[0005] A heat-dissipating embedded chip for new energy management includes a circuit board, a fan, a filter mechanism, a chip, a heat-conducting plate, a heat sink, an elastic block, a power-connecting mechanism, and a fixing mechanism. The fan is fixedly installed inside the circuit board, the filter mechanism is provided on the circuit board, the chip is slidably connected inside the circuit board, the heat-conducting plate is bonded to the chip, the heat sink is fixedly connected to the heat-conducting plate, the elastic block is fixedly connected to the circuit board and contacts the chip, the power-connecting mechanism is provided on the circuit board, and the fixing mechanism is provided on the circuit board.

[0006] Preferably, the filtration mechanism includes a support, a filter screen, a limiting pin, a spring, a support shaft, a stop rod, a retaining ring, and a torsion spring. The support and the circuit board are fixedly connected. The filter screen is slidably connected to the outer side of the support, and the limiting pin is slidably connected to the inner side of the filter screen. The limiting pin and the support are connected by threads. A spring is fixedly connected to the filter screen. The support shaft is welded to the support. A stop rod is mounted on the outer side of the support shaft via a bearing. A retaining ring is fixedly sleeved on the outer side of the support shaft. A torsion spring is provided on the outer side of the support shaft. By setting up the filtration mechanism, dust is filtered.

[0007] Preferably, one end of the torsion spring is welded to the retaining ring, and the other end of the torsion spring is welded to the retaining rod. By providing the torsion spring, the retaining rod can be easily reset.

[0008] Preferably, the power-connecting mechanism includes contacts, a connecting rod, a contact piece, a guide rod, a limiting plate, and a spring. The circuit board has contacts, the connecting rod is slidably connected to the chip, a contact piece is welded to the connecting rod and contacts the contacts, the guide rod is welded to the contact piece and slidably connected to the chip, a limiting plate is welded to the connecting rod and slidably connected to the chip, and a spring is provided on the outer side of the connecting rod. By configuring this power-connecting mechanism, the power connection between the chip and the circuit board is stable.

[0009] Preferably, one end of the spring is welded to the limiting plate, and the other end of the spring is welded to the chip. By setting the spring, the limiting plate is pulled downwards.

[0010] Preferably, the fixing mechanism includes a side plate, a sliding plate, a slider, a top block, a compression spring, a groove, a screw, a square rod, a pressure plate, and a rubber pad. The side plate is soldered onto the circuit board, a sliding plate is slidably connected to the side plate, a slider is soldered onto the sliding plate, the slider and the side plate are slidably connected, a top block is slidably connected inside the slider, a compression spring is provided inside the slider, a groove is formed on the side plate, a top block is slidably connected inside the groove, a screw is installed inside the sliding plate via a bearing, a square rod is slidably connected inside the sliding plate, the square rod and the screw are connected by a thread, and a pressure plate is soldered onto the square rod. The chip is mounted by this fixing mechanism.

[0011] Preferably, one end of the compression spring is welded to the top block, and the other end of the compression spring is welded to the slider. By setting the compression spring, the top block is pressed tightly into the groove.

[0012] Preferably, a rubber pad is adhered to the pressure plate, and the rubber pad contacts the chip. By providing the rubber pad, damage to the chip by the pressure plate is avoided.

[0013] The beneficial effects of this invention are as follows: This invention relates to a heat-dissipating embedded chip for new energy management, which features good heat dissipation, stable power connection, and convenient installation. In practical use, compared with traditional heat-dissipating embedded chips for new energy management, this heat-dissipating embedded chip for new energy management has the following beneficial effects:

[0014] First, by setting up structures such as a fan, support, filter, limit pin, spring, support shaft, stop bar, retaining ring, torsion spring, heat sink, and elastic block, the fan blows air onto the chip, and the heat conduction plate and heat sink conduct heat to the chip, making the chip dissipate heat more quickly. The filter filters dust, preventing dust from accumulating on the power connection mechanism. At the same time, the fan blades on the fan strike the stop bar, causing the stop bar to rotate and collide with the spring, causing the filter to vibrate and preventing the filter from clogging.

[0015] Secondly, by setting up structures such as contacts, connecting rods, contact pieces, guide rods, limiting plates, and springs, the springs act on the limiting plates, pressing the contact pieces firmly onto the contacts, ensuring stable power connection between the chip and the circuit board, and preventing unstable contact and contact piece connections from affecting chip use.

[0016] Finally, by setting up structures such as side plates, sliding plates, sliders, top blocks, compression springs, grooves, screws, square rods, pressure plates, and rubber pads, the sliding plate slides inside the side plate, and the screws and square rods rotate to make threaded movements, thereby causing the pressure plate to press the rubber pad onto the chip, thus pressing the chip firmly into the circuit board and making chip installation convenient. Attached Figure Description

[0017] For ease of explanation, the present invention will be described in detail below with reference to specific embodiments and accompanying drawings.

[0018] Figure 1 This is a perspective view of the overall structure of the present invention;

[0019] Figure 2 For the present invention Figure 1 A front sectional view;

[0020] Figure 3 For the present invention Figure 2 Enlarged view of point A in the image;

[0021] Figure 4 For the present invention Figure 2Enlarged view of point B in the image;

[0022] Figure 5 For the present invention Figure 2 Enlarged view of point C in the image;

[0023] Figure 6 For the present invention Figure 2 Schematic diagram of the fixed mechanism in the middle;

[0024] Figure 7 For the present invention Figure 6 Enlarged view of point D in the image.

[0025] In the diagram: 1. Circuit board; 2. Fan; 3. Filter mechanism; 4. Chip; 5. Heat-conducting plate; 6. Heat sink; 7. Elastic block; 8. Power connection mechanism; 9. Fixing mechanism; 31. Support; 32. Filter screen; 33. Limiting pin; 34. Spring; 35. Support shaft; 36. Stop bar; 37. Retaining ring; 38. Torsion spring; 81. Contact point; 82. Connecting rod; 83. Contact piece; 84. Guide rod; 85. Limiting plate; 86. Spring; 91. Side plate; 92. Slide plate; 93. Slider; 94. Top block; 95. Compression spring; 96. Groove; 97. Screw; 98. Square rod; 99. Pressure plate; 910. Rubber pad. Detailed Implementation

[0026] like Figure 1-7 As shown, the specific implementation adopts the following technical solution:

[0027] Example:

[0028] A heat-dissipating embedded chip for new energy management includes a circuit board 1, a fan 2, a filter mechanism 3, a chip 4, a heat-conducting plate 5, a heat sink 6, an elastic block 7, a power-connecting mechanism 8, and a fixing mechanism 9. The fan 2 is fixedly installed inside the circuit board 1. The filter mechanism 3 is provided on the circuit board 1. The chip 4 is slidably connected inside the circuit board 1. The heat-conducting plate 5 is adhered to the chip 4. The heat sink 6 is fixedly connected to the heat-conducting plate 5. The elastic block 7 is fixedly connected to the circuit board 1 and contacts the chip 4. The power-connecting mechanism 8 and the fixing mechanism 9 are provided on the circuit board 1.

[0029] The filter mechanism 3 includes a support 31, a filter screen 32, a limiting pin 33, a spring 34, a support shaft 35, a stop rod 36, a retaining ring 37, and a torsion spring 38. The support 31 is fixedly connected to the circuit board 1. The filter screen 32 is slidably connected to the outer side of the support 31, and the limiting pin 33 is slidably connected inside the filter screen 32. The limiting pin 33 and the support 31 are connected by threads. The spring 34 is fixedly connected to the filter screen 32. The support shaft 35 is welded to the support 31. The stop rod 36 is mounted on the outer side of the support shaft 35 via a bearing. The retaining ring 37 is fixedly sleeved on the outer side of the support shaft 35. The torsion spring 38 is provided on the outer side of the support shaft 35. By setting up the filter mechanism 3, dust is filtered.

[0030] One end of the torsion spring 38 is welded to the retaining ring 37, and the other end of the torsion spring 38 is welded to the stop rod 36. By providing the torsion spring 38, the stop rod 36 can be easily reset.

[0031] The power connection mechanism 8 includes a contact 81, a connecting rod 82, a contact piece 83, a guide rod 84, a limiting plate 85, and a spring 86. The circuit board 1 has the contact 81. The connecting rod 82 is slidably connected to the chip 4. The contact piece 83 is welded to the connecting rod 82 and contacts the contact 81. The guide rod 84 is welded to the contact piece 83 and slidably connected to the chip 4. The limiting plate 85 is welded to the connecting rod 82 and slidably connected to the chip 4. A spring 86 is located on the outer side of the connecting rod 82. By setting up the power connection mechanism 8, the power connection between the chip 4 and the circuit board 1 is stable.

[0032] One end of the spring 86 is welded to the limiting plate 85, and the other end of the spring 86 is welded to the chip 4. By setting the spring 86, the limiting plate 85 is pulled downwards.

[0033] The fixing mechanism 9 includes a side plate 91, a sliding plate 92, a slider 93, a top block 94, a compression spring 95, a groove 96, a screw 97, a square rod 98, a pressure plate 99, and a rubber pad 910. The side plate 91 is soldered onto the circuit board 1. The sliding plate 92 is slidably connected to the side plate 91. The slider 93 is soldered onto the sliding plate 92 and is slidably connected to the side plate 91. The top block 94 is slidably connected inside the slider 93, and a compression spring 95 is installed inside the slider 93. The side plate 91 has a groove 96, and the top block 94 is slidably connected inside the groove 96. The screw 97 is installed inside the sliding plate 92 via a bearing. The square rod 98 is slidably connected inside the sliding plate 92, and the square rod 98 and the screw 97 are connected by a thread. A pressure plate 99 is soldered onto the square rod 98. The chip 4 is installed by setting up the fixing mechanism 9.

[0034] One end of the compression spring 95 is welded to the top block 94, and the other end of the compression spring 95 is welded to the slider 93. By setting the compression spring 95, the top block 94 is pressed tightly into the groove 96.

[0035] A rubber pad 910 is adhered to the pressure plate 99, and the rubber pad 910 contacts the chip 4. The rubber pad 910 prevents the pressure plate 99 from damaging the chip 4.

[0036] The invention is used as follows: When in use, chip 4 is slid into circuit board 1, and elastic block 7 limits chip 4. At this time, spring 86 acts on limiting plate 85, pressing contact 83 onto contact point 81, ensuring stable power connection between chip 4 and circuit board 1, and preventing unstable connection between contact point 81 and contact 83 from affecting chip 4's use. Then, slide plate 92 slides on side plate 91. During this process, top block 94 and groove 96 are misaligned, compressing spring 95 until slide plate 92 stops sliding. At this point, top block 94 and another groove 96 are aligned, and spring 95 resets, allowing top block 94 to enter groove 96. The slider 93 is stopped, and then the screw 97 is rotated. The screw 97 rotates and the square rod 98 makes a threaded motion, which causes the pressure plate 99 to press the rubber pad 910 onto the chip 4, so that the chip 4 is pressed into the circuit board 1, making the chip 4 easy to install. Then the fan 2 is started, and the fan blows air onto the chip 4. The heat conduction plate 5 and the heat sink 6 conduct heat to the chip 4, making the chip 4 dissipate heat more quickly. The filter screen 32 filters the dust to prevent dust from accumulating in the power connection mechanism 8. At the same time, the fan blades on the fan 2 hit the baffle 36, causing the baffle 36 to rotate and collide with the spring 34, which makes the filter screen 32 vibrate and prevent the filter screen 32 from clogging.

[0037] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the present invention. Various changes and modifications can be made to the present invention without departing from its spirit and scope. All such changes and modifications fall within the scope of the present invention as claimed, which is defined by the appended claims and their equivalents.

Claims

1. A heat-dissipating embedded chip for new energy management, comprising a circuit board (1), a fan (2), a filter mechanism (3), a chip (4), a heat-conducting plate (5), a heat sink (6), an elastic block (7), a power connection mechanism (8), and a fixing mechanism (9), characterized in that: A fan (2) is fixedly installed inside the circuit board (1). A filter mechanism (3) is provided on the circuit board (1). A chip (4) is slidably connected inside the circuit board (1). A heat-conducting plate (5) is attached to the chip (4). A heat sink (6) is fixedly connected to the heat-conducting plate (5). An elastic block (7) is fixedly connected to the circuit board (1). The elastic block (7) is in contact with the chip (4). A power-connecting mechanism (8) is provided on the circuit board (1). A fixing mechanism (9) is provided on the circuit board (1).

2. The heat-dissipating embedded chip for new energy management and control according to claim 1, characterized in that: The filtering mechanism (3) includes a support (31), a filter screen (32), a limiting pin (33), a spring (34), a support shaft (35), a stop bar (36), a retaining ring (37), and a torsion spring (38). The support (31) is fixedly connected to the circuit board (1). The filter screen (32) is slidably connected to the outside of the support (31). The limiting pin (33) is slidably connected inside the filter screen (32). The limiting pin (33) and the support (31) are connected by threads. The spring (34) is fixedly connected to the filter screen (32). The support shaft (35) is welded to the support (31). The stop bar (36) is installed on the outside of the support shaft (35) through a bearing. The retaining ring (37) is fixedly sleeved on the outside of the support shaft (35). The torsion spring (38) is provided on the outside of the support shaft (35).

3. A heat-dissipating embedded chip for new energy management and control according to claim 2, characterized in that: One end of the torsion spring (38) is welded to the retaining ring (37), and the other end of the torsion spring (38) is welded to the retaining rod (36).

4. A heat-dissipating embedded chip for new energy management and control according to claim 1, characterized in that: The power receiving mechanism (8) includes a contact (81), a connecting rod (82), a contact piece (83), a guide rod (84), a limiting plate (85), and a spring (86). The circuit board (1) is provided with a contact (81). The connecting rod (82) is slidably connected inside the chip (4). A contact piece (83) is welded on the connecting rod (82). The contact piece (83) contacts the contact (81). A guide rod (84) is welded on the contact piece (83). The guide rod (84) is slidably connected to the chip (4). A limiting plate (85) is welded on the connecting rod (82). The limiting plate (85) is slidably connected to the chip (4). A spring (86) is provided on the outside of the connecting rod (82).

5. A heat-dissipating embedded chip for new energy management and control according to claim 4, characterized in that: One end of the spring (86) is welded to the limiting plate (85), and the other end of the spring (86) is welded to the chip (4).

6. A heat-dissipating embedded chip for new energy management and control according to claim 1, characterized in that: The fixing mechanism (9) includes a side plate (91), a sliding plate (92), a slider (93), a top block (94), a compression spring (95), a groove (96), a screw (97), a square rod (98), a pressure plate (99), and a rubber pad (910). The side plate (91) is soldered onto the circuit board (1). The sliding plate (92) is slidably connected to the side plate (91). The slider (93) is soldered onto the sliding plate (92). The slider (93) and the side plate (91) are slidably connected. A top block (94) is slidably connected inside the slider (93), a compression spring (95) is provided inside the slider (93), a groove (96) is provided on the side plate (91), a top block (94) is slidably connected inside the groove (96), a screw (97) is installed inside the slide plate (92) through a bearing, a square rod (98) is slidably connected inside the slide plate (92), the square rod (98) and the screw (97) are connected by threads, and a pressure plate (99) is welded on the square rod (98).

7. A heat-dissipating embedded chip for new energy management and control according to claim 6, characterized in that: One end of the compression spring (95) is welded to the top block (94), and the other end of the compression spring (95) is welded to the slider (93).

8. A heat-dissipating embedded chip for new energy management and control according to claim 6, characterized in that: A rubber pad (910) is bonded to the pressure plate (99), and the rubber pad (910) is in contact with the chip (4).

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