Electronic device

Abstract

The invention relates to an electronic device, which comprises a shell, a circuit unit and an n-shaped buffer element, wherein the circuit unit and the n-shaped buffer element are arranged in the shell. The buffer element is arranged in the shell and is provided with a groove, and the circuit unit is embedded in the groove.

Description

Technical Field

[0001] This invention relates to an electronic device. More specifically, this invention relates to an electronic device having a buffer element. Background Technology

[0002] Given that power adapters or function boxes used for signal conversion are often damaged by accidental drops, resulting in damage to their internal components (such as integrated circuits, electrolytic capacitors, or varistors), improving the shock and drop resistance of electronic devices to overcome the aforementioned known problems has become an important challenge for researchers in this field. Summary of the Invention

[0003] In view of the aforementioned problems in conventional technology, one embodiment of the present invention provides an electronic device including a housing, a circuit unit disposed within the housing, and a U-shaped buffer element. The buffer element is disposed within the housing and has a recess, wherein the circuit unit is embedded in the recess.

[0004] In one embodiment, the aforementioned circuit unit is rectangular, and the aforementioned buffer element shields one short side of the aforementioned circuit unit.

[0005] In one embodiment, the aforementioned electronic device further includes a plurality of locking fasteners, and the aforementioned buffer element also has two through holes and two protrusions protruding toward the aforementioned circuit unit, wherein the aforementioned through holes respectively penetrate the aforementioned protrusions, and the aforementioned locking fasteners respectively pass through the aforementioned through holes, for locking the buffer element onto the aforementioned housing.

[0006] In one embodiment, the aforementioned circuit unit has a length L in a first axial direction, and the outer edge of the aforementioned protrusion of the aforementioned buffer element and the aforementioned through hole are separated by a first distance DS1 in the aforementioned first axial direction, wherein the ratio of DS1 / L is between 0.02 and 0.03, and the aforementioned first axial direction is perpendicular to the aforementioned short side.

[0007] In one embodiment, the aforementioned circuit unit has a width W in a second axial direction, and the outer edge of the aforementioned protrusion of the aforementioned buffer element and the aforementioned through hole are separated by a second distance DS2 in the aforementioned second axial direction, wherein the ratio of DS2 / W is between 0.06 and 0.07, and the aforementioned second axial direction is perpendicular to the aforementioned first axial direction.

[0008] In one embodiment, a first height difference is formed on a lower surface of the aforementioned circuit unit and the aforementioned buffer element in a third axis, and a second height difference is formed on an upper surface of the aforementioned circuit unit and the aforementioned buffer element in the aforementioned third axis, wherein the aforementioned first height difference and the aforementioned second height difference are between 2.5 mm and 3.5 mm, and the aforementioned third axis is perpendicular to the aforementioned first and second axes.

[0009] In one embodiment, the aforementioned buffer element further has an extension extending toward a first axis, the extension abutting the aforementioned protrusion and contacting the aforementioned circuit unit, wherein the aforementioned first axis is perpendicular to the aforementioned short side.

[0010] In one embodiment, the aforementioned circuit unit has a length L in the aforementioned first axial direction, and the aforementioned extension has a length DL in the aforementioned first axial direction, wherein the ratio of DL / L is between 0.01 and 0.03.

[0011] In one embodiment, the aforementioned circuit unit forms two arc-shaped recessed structures that are embedded in the aforementioned groove of the aforementioned buffer element and respectively correspond to the aforementioned protrusion.

[0012] In one embodiment, the aforementioned cushioning element contains thermoplastic elastomer (TPE), thermoplastic polyurethane (TPU), silicone, synthetic rubber, or foam material. Attached Figure Description

[0013] Figure 1 An exploded view showing an embodiment of an electronic device 100 of the present invention;

[0014] Figure 2 A top view showing the circuit unit P and buffer elements 31 and 32 installed inside the housing 20 of the electronic device 100;

[0015] Figure 3 A schematic diagram showing the circuit unit P embedded inside buffer elements 31 and 32;

[0016] Figure 4 A partial schematic diagram showing the combination of circuit unit P and buffer element 31;

[0017] Figure 5 Indicates along Figure 4 A sectional view of line segment A1-A2 in the diagram;

[0018] Figure 6 A cross-sectional view showing the buffer element 31;

[0019] Figure 7 express Figure 2 A partial enlarged view of circuit unit P, buffer element 31, and locking fastener S in region B;

[0020] Figure 8 This is a schematic diagram showing the buffer elements 31, 32 and the rib 21 separated by a distance according to another embodiment of the present invention.

[0021] [Symbol Explanation]

[0022] 100: Electronic devices

[0023] 10: Top Cover

[0024] 20: Shell

[0025] 21: Convex Rib

[0026] 22: Outer edge

[0027] 301: Lower surface

[0028] 302: Upper surface

[0029] 31: Buffer element

[0030] 311: Through hole

[0031] 312: Groove

[0032] 313: Extension

[0033] 32: Buffer element

[0034] 321: Through hole

[0035] 322: Groove

[0036] 323: Extension

[0037] C1: Protrusion

[0038] C2: Protrusion

[0039] D1: First height difference

[0040] D2: Second elevation difference

[0041] DE: Depth

[0042] DL: Length

[0043] DS1: First distance

[0044] DS2: Second distance

[0045] DW: Width

[0046] E: Electronic components

[0047] L: Length

[0048] P: Circuit unit

[0049] P1: Depressed structure

[0050] P2: Depressed structure

[0051] S: Locking firmware

[0052] T1: Thickness

[0053] T2: Thickness

[0054] W: Width Detailed Implementation

[0055] The following describes an electronic device according to embodiments of the present invention. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the invention in particular ways and are not intended to limit the scope of the invention.

[0056] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant technology and the context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0057] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used in the embodiments are for illustrative purposes and not for limiting the present invention.

[0058] Please refer to the following first: Figure 1 , 2 3, of which Figure 1 An exploded view showing an embodiment of the electronic device 100 of the present invention. Figure 2 This is a top view showing the circuit unit P and buffer elements 31 and 32 installed inside the housing 20 of the electronic device 100. Figure 3 This is a schematic diagram showing the circuit unit P embedded inside buffer elements 31 and 32.

[0059] like Figure 1 , 2 As shown in Figures 1 and 3, an electronic device 100 according to an embodiment of the present invention mainly includes a top cover 10, a housing 20, and a circuit unit P and buffer elements 31 and 32 fixed inside the aforementioned housing 20.

[0060] For example, the aforementioned electronic device 100 may be a power adapter for connecting a charging gun, or a function box for signal conversion. In this embodiment, the aforementioned circuit unit P includes a generally rectangular printed circuit board (PCB), and a plurality of electronic components E are provided on the surface of the aforementioned circuit unit P for performing electrical signal conversion processing, wherein the aforementioned electronic components E may include integrated circuit components, electrolytic capacitors, voltage-dependent resistors (VDRs), or other passive components.

[0061] from Figures 1-3 As can be seen, the aforementioned buffer elements 31 and 32 have a U-shaped structure and are located on the opposite side of the circuit unit P. During assembly, the short sides of the circuit unit P can be first embedded into the grooves 312 and 322 of the buffer elements 31 and 32, respectively. Figure 1 Then, fasteners S (e.g., screws) can be passed through the through holes 311 and 321 on the buffer elements 31 and 32 to allow the buffer elements 31 and 32 and the circuit unit P to be stably locked inside the housing 20, wherein the two short sides of the circuit unit P will be shielded by the buffer elements 31 and 32 after assembly.

[0062] It should be understood that the aforementioned through holes 311 and 321 are protrusions C1 and C2 that pass through the buffer elements 31 and 32 respectively. The aforementioned protrusions C1 and C2 are located at the corners of the buffer elements 31 and 32 and protrude in the direction of the circuit unit P. In addition, the outer edge of the protrusions C1 and C2 is formed with an arc-shaped surface. The aforementioned extensions 313 and 323 are respectively adjacent to the aforementioned protrusions C1 and C2.

[0063] Since the aforementioned circuit unit P is sandwiched between two buffer elements 31 and 32, rather than being directly fixed to the housing 20, when the electronic device 100 is subjected to an external impact or falls, the circuit unit P located inside the housing 20 will be buffered and protected by the buffer elements 31 and 32, thereby preventing damage to its structure or function.

[0064] For example, the aforementioned cushioning elements 31 and 32 may contain thermoplastic elastomer (TPE), thermoplastic polyurethane (TPU), silicone rubber, synthetic rubber, or foaming material.

[0065] On the other hand, from Figure 1 , 2 As can be seen, an elongated rib 21 extending in the X-axis direction (first axial direction) is formed inside the housing 20. During the assembly of the electronic device 100, the aforementioned rib 21 extends into the upper cover 10 so that the upper cover 10 and the housing 20 can be positioned and tightly joined together.

[0066] Furthermore, the extensions 313 and 323 of the aforementioned buffer elements 31 and 32 are adjacent to the aforementioned rib 21, and the extensions 313 and 323 of the aforementioned buffer elements 31 and 32 and the rib 21 of the housing 20 are adjacent to the outer edge 22 of the housing 20.

[0067] from Figure 3 As can be seen, the circuit unit P is embedded in the buffer elements 31 and 32, and is approximately rectangular. The circuit unit P has a length L in the first axis (X-axis direction) and a width W in the second axis (Y-axis direction), wherein the aforementioned second axis is perpendicular to the aforementioned first axis.

[0068] It should be understood that an arc-shaped recessed structure P1 is formed at the two corners on the right side of the circuit unit P. The aforementioned recessed structure P1 is embedded in the groove 312 of the buffer element 31 and corresponds to the protrusion C1 of the aforementioned buffer element 31. In addition, an arc-shaped recessed structure P2 is formed at the two corners on the left side of the circuit unit P. The aforementioned recessed structure P2 is embedded in the groove 312 of the buffer element 31 and corresponds to the protrusion C2 of the aforementioned buffer element 32. The fastener S passes through the buffer elements 31 and 32 and is fixed to the housing 20. The position of the aforementioned fastener S is adjacent to the aforementioned recessed structures P1 and P2.

[0069] Please refer to the following as well. Figure 4 , 5 6, of which Figure 4 This is a partial schematic diagram showing the combination of circuit unit P and buffer element 31. Figure 5 Indicates along Figure 4 A sectional view of line segment A1-A2 in the diagram. Figure 6 This is a cross-sectional view of the buffer element 31.

[0070] like Figure 4 , 5As shown in Figure 6, after assembly, the circuit unit P in this embodiment will be embedded in the groove 312 of the buffer element 31. The outer edge of the protrusion C1 of the buffer element 31 and the through hole 311 (or the locking fastener S) of the buffer element 31 are separated by a first distance DS1 in the first axial direction (X-axis direction), and the groove 312 has a depth DE in the first axial direction (X-axis direction). In this embodiment, the first distance DS1 is greater than 3mm, and the first distance DS1 is greater than the depth DE, that is, the circuit unit P will not contact the locking fastener S.

[0071] Specifically, the ratio (DS1 / L) of the aforementioned first distance DS1 to the length L of the circuit unit P in the first axial direction (X-axis direction) is approximately between 0.02 and 0.03.

[0072] On the other hand, from Figure 5 , 6 As can be seen, the lower surface 301 of the aforementioned circuit unit P and buffer element 31 forms a first height difference D1 in the third axial direction (Z-axis direction), and the upper surface 302 of the circuit unit P and buffer element 31 forms a second height difference D2 in the aforementioned third axial direction (Z-axis direction), wherein the range of the aforementioned first height difference D1 and second height difference D2 is approximately between 2.5mm and 3.5mm.

[0073] In this embodiment, the thickness T1 of the aforementioned buffer element 31 in the third axial direction (Z-axis direction) is approximately 7.7 mm, the thickness T2 of the circuit unit P in the third axial direction (Z-axis direction) is approximately 1.7 mm, the length DL of the extension 313 of the aforementioned buffer element 31 in the first axial direction (X-axis direction) is greater than or equal to 3 mm (e.g., 5 mm), and the aforementioned first height difference D1 and second height difference D2 are approximately equal (e.g., both are 3 mm).

[0074] It should be understood that the aforementioned buffer element 32 may have the same structure as the buffer element 31. However, the dimensions of the aforementioned buffer elements 31, 32 and circuit unit P can still be adjusted according to actual design requirements. In addition, the buffer element 31 may be provided only on one side of the circuit unit P and the buffer element 32 may be omitted. Therefore, it is not limited to the embodiments disclosed in this invention.

[0075] On the other hand, the ratio (DL / L) of the length DL of the extension 313 to the length L of the circuit unit P is approximately between 0.01 and 0.03. By forming the extension 313 on the buffer element 31, the contact area between the circuit unit P and the buffer element 31 can be effectively increased, while the circuit unit P can be prevented from directly colliding with the housing 20 and causing damage.

[0076] Please see again Figure 7 ,in Figure 7 express Figure 2 A partial enlarged view of circuit unit P, buffer element 31, and locking device S in region B.

[0077] from Figure 7 As can be seen from the above, the outer edge of the protrusion C1 of the aforementioned buffer element 31 and the through hole 311 of the buffer element 31 are separated by a second distance DS2 in the second axial direction (Y-axis direction), wherein the aforementioned second distance DS2 is greater than or equal to 3mm.

[0078] In this embodiment, the ratio (DS2 / W) of the aforementioned second distance DS2 to the width W of the circuit unit P in the second axial direction (Y-axis direction) is approximately between 0.06 and 0.07, and the width of the extension 313 is greater than or equal to 3 mm.

[0079] Figure 8 This is a schematic diagram showing the buffer elements 31, 32 and the rib 21 separated by a distance according to another embodiment of the present invention.

[0080] like Figure 8 As shown, in another embodiment of the present invention, the aforementioned buffer elements 31 and 32 may not contact the aforementioned rib 21, that is, there may be a distance between the extensions 313 and 323 of the buffer elements 31 and 32 and the rib 21 of the housing 20.

[0081] In summary, by providing a buffer element on the short side of the circuit unit, the present invention can effectively prevent damage to the internal components of the electronic device when it is accidentally dropped or struck by a foreign object, thereby significantly improving the reliability and safety of the electronic device.

[0082] While the embodiments and advantages of the present invention have been disclosed above, it should be understood that anyone skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material composition, apparatus, methods, and steps described in the specific embodiments of the specification. Anyone skilled in the art can understand from the disclosure of the present invention that current or future developed processes, machines, manufacturing, material composition, apparatus, methods, and steps can be used according to the present invention as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing, material composition, apparatus, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of the various claims and embodiments.

[0083] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. An electronic device, characterized in that, include: A shell; A circuit unit is disposed within the housing; as well as A U-shaped buffer element is disposed within the housing and has a groove in which the circuit unit is embedded.

2. The electronic device as claimed in claim 1, characterized in that, The circuit unit is rectangular, and the buffer element shields one short side of the circuit unit.

3. The electronic device as claimed in claim 2, characterized in that, The electronic device also includes a plurality of locking fasteners, and the buffer element has two through holes and two protrusions protruding toward the circuit unit, wherein the two through holes pass through the two protrusions respectively, and the plurality of locking fasteners pass through the two through holes respectively, for locking the buffer element to the housing.

4. The electronic device as claimed in claim 3, characterized in that, The circuit unit has a length L in a first axial direction, and the outer edge of the protrusion of the buffer element and the through hole are separated by a first distance DS1 in the first axial direction, wherein the ratio of DS1 / L is between 0.02 and 0.03, and the first axial direction is perpendicular to the short side.

5. The electronic device as claimed in claim 4, characterized in that, The circuit unit has a width W in a second axis, and the outer edge of the protrusion of the buffer element and the through hole are separated by a second distance DS2 in the second axis, wherein the ratio of DS2 / W is between 0.06 and 0.07, and the second axis is perpendicular to the first axis.

6. The electronic device as claimed in claim 5, characterized in that, The lower surface of the circuit unit and the buffer element forms a first height difference in a third axis, and the upper surface of the circuit unit and the buffer element forms a second height difference in the third axis, wherein the first height difference and the second height difference are between 2.5 mm and 3.5 mm, and the third axis is perpendicular to the first and second axes.

7. The electronic device as claimed in claim 3, characterized in that, The buffer element also has an extension extending toward a first axis that is adjacent to the protrusion and contacts the circuit unit, wherein the first axis is perpendicular to the short side.

8. The electronic device as claimed in claim 7, characterized in that, The circuit unit has a length L in the first axis, and the extension has a length DL in the first axis, wherein the ratio of DL / L is between 0.01 and 0.

03.

9. The electronic device as claimed in claim 3, characterized in that, The circuit unit has two arc-shaped recessed structures that are embedded in the groove of the buffer element and correspond to the two protrusions respectively.

10. The electronic device as claimed in claim 1, characterized in that, The cushioning element contains thermoplastic elastomers, thermoplastic polyurethanes, silicone, synthetic rubber, or foam materials.

Images