Communication structure
By setting a reflective structure and an optical adhesive layer in the optical communication component, with an included angle of 60 to 90 degrees, an optical fiber structure is formed, which solves the problem of increased power consumption when increasing the optical signal intensity of the optical communication component, and realizes efficient optical signal transmission and low power consumption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- AU OPTRONICS CORP
- Filing Date
- 2026-01-28
- Publication Date
- 2026-04-21
AI Technical Summary
In order to increase the optical signal strength, existing optical communication components need to increase the number of light sources, which leads to increased power consumption. The key issue is how to increase the optical signal strength and reduce power consumption without increasing the number of light sources.
A reflective structure surrounds the light-emitting element, with the angle between the normal vector of the reflective structure and the normal vector of the substrate being 60 to 90 degrees. Combined with a highly reflective metal material and an optical adhesive layer, an optical fiber structure is formed to improve the light signal intensity and reduce crosstalk. The reflective structure and the optical fiber structure are manufactured using PECVD and etching techniques.
It achieved a 1.8-fold increase in optical signal intensity, reduced power consumption, and lowered manufacturing costs without requiring an increase in the number of light sources.
Smart Images
Figure CN121908721A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a communication structure. Background Technology
[0002] Currently, the main approach to handling varying optical signal intensity requirements in optical communication components is to adjust the number of signal sources. However, when higher optical signal intensity is needed, increasing the number of signal sources also leads to higher power consumption. Therefore, improving optical signal intensity while simultaneously reducing power consumption is a crucial process step in refining the structure of optical communication components. Summary of the Invention
[0003] This invention provides a communication structure with good optical signal strength and low power consumption.
[0004] According to an embodiment of the present invention, a communication structure is provided. The communication structure includes a substrate, a reflective structure, and a plurality of light-emitting elements. The plurality of light-emitting elements are disposed on the substrate. The reflective structure is disposed on the substrate and surrounds each of the plurality of light-emitting elements. The reflective structure includes a first surface, the normal vector of the first surface forming an angle with the normal vector of the substrate, the angle being within the range of 60 to 90 degrees.
[0005] In one embodiment of the aforementioned communication structure, a photoresist layer is further included, disposed between each of the plurality of light-emitting elements and the reflective structure, and covering each of the plurality of light-emitting elements.
[0006] In one embodiment of the aforementioned communication structure, a plurality of optical fiber structures and an optical adhesive layer are further included. The optical fiber structures are disposed on the photoresist layer, and the optical adhesive layer is located between the optical fiber structures and the photoresist layer.
[0007] In one embodiment of the aforementioned communication structure, the optical fiber structure includes a central layer, which is configured for each of the plurality of light-emitting elements.
[0008] In one embodiment of the aforementioned communication structure, the optical fiber structure includes a central layer, which is disposed corresponding to the plurality of light-emitting elements.
[0009] In one embodiment of the aforementioned communication structure, the optical fiber structure further includes a cladding layer surrounding the central layer, and the refractive index of the cladding layer is less than the refractive index of the central layer.
[0010] In one embodiment of the aforementioned communication structure, the reflective structure includes a first reflective structure and a second reflective structure, the first reflective structure being disposed on the second reflective structure, and the first reflective structure and the second reflective structure comprising different materials.
[0011] Based on the above, a reflective structure is disposed on the substrate and surrounds the light-emitting element. The reflective structure includes a first surface, and the normal vector of the first surface forms an angle with the normal vector of the substrate, with the angle falling within the range of 60 to 90 degrees. In this way, the communication structure can provide better light signal intensity and lower power consumption. Attached Figure Description
[0012] Figure 1A This is a top view schematic diagram of a communication structure according to an embodiment of the present invention.
[0013] Figure 1B Showing along Figure 1A A magnified view of a portion of the central area, region A.
[0014] Figure 1C Showing along Figure 1A The cross-sectional diagram is shown by line I-I' in the figure.
[0015] Figure 1D It is a graph showing the relationship between light intensity and angle.
[0016] Figure 2 This is a schematic cross-sectional view of a communication structure according to another embodiment of the present invention.
[0017] In the attached figures, the following labels are used:
[0018] 100A, 100B: Communication Structure
[0019] 110:Substrate
[0020] 121, 123, 125: Driving array layer
[0021] 126: Fill layer
[0022] 130: Reflective layer
[0023] 142: Photoresist layer
[0024] 144, 146: Reflective structures
[0025] 144S1: First surface
[0026] 144S2: Second Surface
[0027] 150: Optical adhesive layer
[0028] 160: Fiber Optic Structure
[0029] 162: Covering layer
[0030] 164: Central Layer
[0031] 166: Sealant layer
[0032] 170: Light-emitting element
[0033] E1, E2: Electrodes
[0034] O: Opening
[0035] θ: included angle
[0036] D1: First Direction
[0037] D2: Second Direction
[0038] D3: Third direction Detailed Implementation
[0039] Figure 1A This is a top view schematic diagram of a communication structure according to an embodiment of the present invention. Figure 1B Showing along Figure 1A A magnified view of a portion of the central area, region A. Figure 1C Showing along Figure 1A The cross-sectional diagram is shown by line I-I' in the diagram. Please also refer to... Figures 1A to 1C .
[0040] A communication structure 100A includes a substrate 110, a reflective layer 130, a reflective structure 144, and light-emitting elements 170. The reflective layer 130 is disposed on the substrate 110 and includes multiple openings O. Multiple light-emitting elements 170 are disposed within the multiple openings O of the reflective layer 130. Multiple reflective structures 144 are disposed on the substrate 110 and surround the multiple light-emitting elements 170. Each reflective structure 144 includes a first surface 144S1 and a second surface 144S2, wherein the normal vector of the first surface 144S1 or the second surface 144S2 forms an angle θ with the normal vector of the substrate 110, and the angle θ falls within the range of 60 to 90 degrees.
[0041] The substrate 110 also includes a driving array structure, which includes a driving array layer 121, a driving array layer 123 and a driving array layer 125. The multiple light-emitting elements 170 on the driving array layer 125 are electrically independent of each other. The driving array structure can drive the light-emitting elements 170 to control the light-emitting elements 170 to emit light.
[0042] The communication structure 100A also includes a photoresist layer 142, which is disposed between the light-emitting element 170 and the reflective structure 144 and covers the light-emitting element 170.
[0043] Please refer to Figure 1B The reflective structure 144 is made of a highly reflective metal, such as copper or silver. The reflective structure 144 and one of the electrodes of the light-emitting element 170, such as electrode E1 or electrode E2, are electrically linked, which can reduce the power consumption and improve the heat dissipation of the communication structure 100A.
[0044] The communication structure 100A also includes an optical fiber structure 160 and an optical adhesive layer 150. The optical fiber structure 160 includes a central layer 164, which is disposed corresponding to the light-emitting element 170. A reflective structure 144 is disposed around the light-emitting element 170, which can effectively increase the light signal of the light-emitting element 170 to be introduced into the optical fiber structure 160, thereby effectively reducing optical crosstalk. The height of the reflective structure 144 along the third direction D3 is, for example, 15 micrometers. The optical fiber structure 160 is disposed on the photoresist layer 142, and the optical adhesive layer 150 is located between the optical fiber structure 160 and the photoresist layer 142.
[0045] In some embodiments, the central layer 164 of the optical fiber structure 160 may be provided with multiple light-emitting elements 170 simultaneously, which may further increase the light signal intensity within the optical fiber structure 160, but is not limited thereto.
[0046] The optical fiber structure 160 also includes a cladding layer 162 surrounding the central layer 164, and a sealant layer 166 disposed between the cladding layers 162. The refractive index of the cladding layer 162 is less than that of the central layer 164.
[0047] In some embodiments, the refractive index of the optical adhesive layer 150 may be, for example, n3, the refractive index of the central layer 164 may be, for example, n4, and the refractive index of the coating layer 162 may be, for example, n5. The relationship between the above refractive indices can satisfy the relationship 2.4>n3= n4>1.4>n5.
[0048] Figure 1D This is a graph showing the relationship between light intensity and angle. When a single light-emitting element 170 is combined with the reflective structure 144 and the optical adhesive layer 150, the light signal intensity at the center of the fiber optic structure 160 can be increased by, for example, by 1.8 times compared to the light signal intensity when a single light-emitting element 170 is only combined with the center of the optical adhesive layer 150. Therefore, if it is necessary to further increase the light signal intensity within the fiber optic structure 160, multiple light-emitting elements 170 can be simultaneously disposed in the central layer 164 of the fiber optic structure 160.
[0049] A method for manufacturing a communication structure 100A includes the following steps:
[0050] A driving array structure is formed on the substrate 110, including a driving array layer 121, a driving array layer 123 and a driving array layer 125. The driving array layer 125 contains a plurality of electrically independent light-emitting elements 170. The light-emitting elements 170 have electrodes E1 and E2 that are electrically connected to the driving array structure. The driving array structure can therefore drive the light-emitting elements 170 to control the light-emitting elements 170 to emit light.
[0051] A reflective layer 130 is disposed on the driving array layer 125. The reflective layer 130 includes multiple openings O. The light-emitting element 170 is disposed in the opening O. A photoresist layer 142 is formed by photolithography and etching technology. The photoresist layer 142 is disposed in relation to the light-emitting element 170 and covers the light-emitting element 170, so that the light-emitting element 170 is protected by the photoresist layer 142.
[0052] Using plasma-enhanced chemical vapor deposition (PECVD) technology, a silver metal layer is sputtered on the surface of substrate 110, and a seed layer is sputtered on the silver metal layer. Then, electrochemical deposition is performed until the silver metal is completely filled into the photoresist layer 142 to form a reflective structure 144.
[0053] In the photoresist layer 142, electrodes E1 and E2 connecting the light-emitting element 170 can be formed using either electroless nickel immersion gold (ENIG) or thermal evaporation coating. Thermal evaporation coating typically uses tin as the evaporation source.
[0054] Multiple light-emitting elements 170 are formed on the driving array layer 125. The light-emitting elements 170 can be transferred and disposed in the opening O of the reflective layer 130 and electrically connected to the pixel driving circuit of the driving array structure through a mass transfer process, such as stamp bonding or laser bonding.
[0055] After the light-emitting element 170 is successfully implanted, in order to ensure the long-term stability of the light-emitting element 170, an underfill process is performed on the bottom of the light-emitting element 170 using a special filler material. A filler layer 126 containing a high reflectivity material is injected into the tiny gaps between the bottom of the light-emitting element 170 and the driving array layer 125 and driving array layer 123 until it is completely filled and flattened, so as to improve the light emission efficiency of the light-emitting element 170.
[0056] An optical adhesive layer 150 is filled between the photoresist layer 142 and the optical fiber structure 160 to encapsulate and fix the photoresist layer 142 and the optical fiber structure 160, thus completing the manufacturing process of the communication structure 100A. This process significantly improves the optical signal strength of the communication structure and reduces its power consumption. Furthermore, since it eliminates the need to increase the number of light sources, the manufacturing cost of the communication structure can be reduced simultaneously.
[0057] Figure 2This is a schematic cross-sectional view of a communication structure according to another embodiment of the present invention.
[0058] A communication structure 100B includes a substrate 110, a reflective layer 130, a reflective structure 144, and light-emitting elements 170. The reflective layer 130 is disposed on the substrate 110 and includes multiple openings O. Multiple light-emitting elements 170 are disposed within the multiple openings O of the reflective layer 130. Multiple reflective structures 144 are disposed on the substrate 110 and surround the multiple light-emitting elements 170. Each reflective structure 144 includes a first surface 144S1, and the normal vector of the first surface 144S1 forms an angle θ with the normal vector of the substrate 110, with the angle θ falling within the range of 60 to 90 degrees.
[0059] The communication structure 100B also includes a photoresist layer 142 disposed between the light-emitting elements 170. The reflective structure 144 is disposed around the light-emitting elements 170, which can effectively increase the light signal of the light-emitting elements 170 to be introduced into the fiber optic structure 160, thereby effectively reducing optical crosstalk.
[0060] The manufacturing method of communication structure 100B is similar to that of communication structure 100A. The main difference is that the reflective structure 144 of communication structure 100B also includes a reflective structure 146.
[0061] A method for manufacturing a communication structure 100B includes the following steps:
[0062] A driving array structure is formed on the substrate 110, including a driving array layer 121, a driving array layer 123 and a driving array layer 125. A reflective layer 130 is disposed on the driving array layer 125. The reflective layer 130 includes a plurality of openings O. The light-emitting element 170 is disposed in the openings O. A photoresist layer 142 is formed by photolithography and etching technology. The photoresist layer 142 is disposed in relation to the light-emitting element 170 and covers the light-emitting element 170, so that the light-emitting element 170 is protected by the photoresist layer 142.
[0063] Using plasma-enhanced chemical vapor deposition (PECVD) technology, a copper metal layer is sputtered on the surface of substrate 110, and a seed layer is sputtered on the copper metal layer. Then, electrochemical deposition is performed. After the copper metal layer reaches a certain height, a reflective structure 146 is first formed. Then, silver metal is electrochemically deposited until the silver metal completely fills the space between the photoresist layers 142 to form a reflective structure 144.
[0064] In this embodiment, the light-emitting element 170 is transferred and disposed in the opening O of the reflective layer 130 through a mass transfer process, which can be achieved by stamp bonding or laser bonding technology. The light-emitting element 170 is electrically connected to the pixel driving circuit of the driving array structure. The driving array structure can drive the light-emitting element 170 to control the light-emitting element 170 to emit light.
[0065] After the light-emitting element 170 is successfully implanted, in order to ensure the long-term stability of the light-emitting element 170, an underfill process is performed on the bottom of the light-emitting element 170 using a special filler material. A filler layer 126 containing a high reflectivity material is injected into the tiny gaps between the bottom of the light-emitting element 170 and the driving array layer 125 and driving array layer 123 until it is completely filled and flattened.
[0066] The functions of the passivation layer structure on the surface of the communication structure include: environmental barrier: effectively isolating moisture, oxygen and other external contaminants to prevent component degradation; electrical insulation: providing electrical isolation between components to prevent leakage or short circuits; and physical protection: protecting the underlying precision structure from mechanical damage during subsequent packaging processes.
[0067] The above process can significantly improve the optical signal intensity of the communication structure and reduce its power consumption. In addition, since there is no need to increase the number of light sources, the manufacturing cost of the communication structure can be reduced at the same time.
[0068] In summary, in the embodiments of the present invention, the light-emitting element is disposed within a plurality of openings in the reflective layer. A reflective structure is disposed on the substrate and surrounds the light-emitting element. The reflective structure includes a first surface, the normal vector of the first surface forming an angle θ with the normal vector of the substrate, and the angle θ falling within the range of 60 to 90 degrees. This allows the communication structure to provide better light signal intensity and lower power consumption.
Claims
1. A communication structure, characterized in that, include: One substrate; Multiple light-emitting elements are disposed on the substrate; as well as A reflective structure is disposed on the substrate and surrounds each of the plurality of light-emitting elements. The reflective structure includes a first surface, wherein a normal vector of the first surface and a normal vector of the substrate have an angle between the two surfaces, and the angle falls within the range of 60 to 90 degrees.
2. The communication structure as described in claim 1, characterized in that, It also includes a photoresist layer disposed between each of the plurality of light-emitting elements and the reflective structure and covering each of the plurality of light-emitting elements.
3. The communication structure as described in claim 2, characterized in that, It also includes multiple optical fiber structures and an optical adhesive layer, wherein the optical fiber structures are disposed on the photoresist layer and the optical adhesive layer is located between the optical fiber structures and the photoresist layer.
4. The communication structure as described in claim 3, characterized in that, The optical fiber structure includes a central layer, which is configured for each of the plurality of light-emitting elements.
5. The communication structure as described in claim 3, characterized in that, The optical fiber structure includes a central layer, which is configured to correspond to the plurality of light-emitting elements.
6. The communication structure as described in claim 4, characterized in that, The optical fiber structure further includes a cladding layer surrounding the central layer, and the refractive index of the cladding layer is less than that of the central layer.
7. The communication structure as described in claim 1, characterized in that, The reflective structure includes a first reflective structure and a second reflective structure, wherein the first reflective structure is disposed on the second reflective structure, and the first reflective structure and the second reflective structure are made of different materials.