Organopolysiloxane, organopolysiloxane composition and cured product thereof, organopolysiloxane for near-infrared waveguide, organopolysiloxane composition for near-infrared waveguide, cured product for near-infrared

Abstract

The present invention provides an organopolysiloxane having a specific structure, an organic group containing a polymerizable alkenyl group, and a Q unit silicon (SiO4 / 2), or a nonlinear organopolysiloxane having a specific structure, an organic group containing a polymerizable alkenyl group, and not having an aromatic structure.

Description

Technical Field

[0001] This invention relates to organopolysiloxanes, organopolysiloxane compositions and their cured forms, organopolysiloxanes for near-infrared waveguides, organopolysiloxane compositions for near-infrared waveguides, cured forms for near-infrared waveguides, near-infrared waveguides and near-infrared light transmission components, and methods for manufacturing near-infrared waveguides. Background Technology

[0002] In recent years, the demand for higher speeds, larger capacities, and lower power consumption in communication / signal transmission has been increasing. Even in the internal wiring of devices, the technology of using light to replace the traditional electrical signal transmission has attracted much attention. Such short-range optical communication technology is called optical interconnect. As a component, it involves replacing a portion of the electrical wiring formed by copper on a printed circuit board with optical wiring formed by optical fibers or optical waveguides.

[0003] The development of optoelectronic composite substrates as described above is actively underway, particularly in data center equipment where there is a demand for optical waveguides that can be connected to near-infrared single-mode silica fibers. To achieve microfabrication through photolithography, heat resistance to withstand reflow soldering during installation, low transmission loss in the near-infrared wavelength range of 700–2500 nm, and reduced connection loss due to reflections at the silica fiber / waveguide interface, the material used to fabricate the waveguide must have a refractive index of approximately 1.4–1.5 at near-infrared wavelengths, similar to the core-forming material of the near-infrared single-mode silica fiber. Furthermore, in the case of single-mode waveguides, where the refractive index difference between the core material and the cladding material is approximately 0.01–0.02, the cladding material surrounding the core material must also have a refractive index of approximately 1.4–1.5 at near-infrared wavelengths, similar to the core-forming material of the near-infrared single-mode silica fiber.

[0004] As material candidates that meet these requirements, organopolysiloxanes with reactive groups can be listed, but it is difficult to achieve both heat resistance after curing and a refractive index of about 1.4 to 1.5 at near-infrared wavelengths.

[0005] For example, Patent Document 1 discloses an organopolysiloxane with an aromatic ring structure, the cured resin of which exhibits excellent heat resistance. However, the organopolysiloxane disclosed in Patent Document 1 adjusts the refractive index by changing the ratio of aliphatic hydrocarbon groups to aromatic hydrocarbon groups, and achieves excellent heat resistance of the cured resin by having an aromatic ring structure. However, it is impossible to obtain a substance that maintains heat resistance and has a refractive index of less than 1.5.

[0006] Furthermore, Patent Document 2 discloses an organopolysiloxane containing fluorine atoms, suggesting that by adjusting the amount of fluorine atoms introduced, the refractive index after curing can be controlled between 1.463 and 1.467. However, there is a possibility of deterioration in heat resistance, and consequently, deterioration in adhesion to the substrate.

[0007] Existing technical documents

[0008] Patent documents

[0009] Patent Document 1: Japanese Patent Application Publication No. 2005-163009

[0010] Patent Document 2: International Publication No. 2001 / 004186 Summary of the Invention

[0011] The problem that the invention aims to solve

[0012] To address the aforementioned problems, the present invention provides an organopolysiloxane having a polymerizable alkenyl group, wherein the organopolysiloxane is suitable for use as a core material and for a cladding material surrounding the core material, possessing micro-processability obtained by photolithography, heat resistance to withstand reflow soldering processes during assembly, and the ability to reduce connection losses caused by reflections at the quartz fiber / waveguide interface. Furthermore, a method for manufacturing a near-infrared waveguide comprising one or more layers of a cured product containing the organopolysiloxane is provided.

[0013] Solution for solving the problem

[0014] The inventors conducted in-depth research to solve the aforementioned problems and discovered that organopolysiloxanes with specific structures and compositions can solve the problems of this application. This invention is based on the aforementioned insights.

[0015] That is, the present invention relates to the following.

[0016] (1) An organopolysiloxane, represented by the following general formula [1].

[0017] (R) 1 R 2 R 3 SiO 1 / 2 ) M1 (R) 4 R 5 R 6 SiO 1 / 2 ) M2

[0018] (R) 7 R 8 SiO 2 / 2 ) D1 (R) 9 R 6SiO 2 / 2 ) D2

[0019] (R) 10 SiO 3 / 2 ) T1 (R) 6 SiO 3 / 2 ) T2 (SiO) 4 / 2 ) Q

[0020] (O) 1 / 2 R 11 ) Y1 (O) 1 / 2 R 6 ) Y2 ...[1]

[0021] In the above formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms.

[0022] R 1 ~R 3 R 7 R 8 R 10 and R 11 It does not contain polymeric alkenyl groups.

[0023] R 6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other.

[0024] 0≤M1,D1,T1,Y1,Y2,

[0025] 0 <Q、

[0026] 0 <M2+D2+T2≤0.25、

[0027] 0.05 <Y1、

[0028] M1+M2+D1+D2+T1+T2+Q=1].

[0029] (2) A non-linear organopolysiloxane, represented by the following general formula

[21] , and without an aromatic structure.

[0030] (R) 2-1 R 2-2 R 2-3 SiO 1 / 2 ) M1 (R) 2-4 R2-5 R 2-6 SiO 1 / 2 ) M2

[0031] (R) 2-7 R 2-8 SiO 2 / 2 ) D1 (R) 2-9 R 2-6 SiO 2 / 2 ) D2

[0032] (R) 2-10 SiO 3 / 2 ) T1 (R) 2-6 SiO 3 / 2 ) T2 (SiO) 4 / 2 ) Q1

[0033] (O) 1 / 2 R 2-11 ) Y1 (O) 1 / 2 R 2-6 ) Y2 ……[twenty one]

[0034] In the above formula

[21] , R 2-1 ~R 2-5 R 2-7 ~R 2-11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms.

[0035] R 2-1 ~R 2-3 R 2-7 R 2-8 R 2-10 and R 2-11 It does not contain polymeric alkenyl groups.

[0036] R 2-6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other.

[0037] 0≤M1,D1,T1,Y1,Y2,

[0038] 0 <M2+D2+T2≤0.25、

[0039] 0.05 <Y1、

[0040] M1+M2+D1+D2+T1+T2+Q=1].

[0041] (3) The organopolysiloxane according to item (1) or (2) above, wherein, in formula [1] or formula

[21] , 0.12 <M2+D2+T2≤0.25。

[0042] (4) The organopolysiloxane according to any one of the above items (1) to (3), wherein Y1 ≤ 0.25 in the formula [1] or formula

[21] .

[0043] (5) An organopolysiloxane according to any one of the above items (2) to (4), wherein, in the formula

[21] , 0 <Q。

[0044] (6) The organopolysiloxane according to any one of the above items (1) to (5), wherein in the formula [1] or formula

[21] , 0.04 ≤ Q.

[0045] (7) The organopolysiloxane according to any one of the above items (1) to (6), wherein in the formula [1] or formula

[21] , M1+M2<0.50.

[0046] (8) The organopolysiloxane according to any one of (1), (3) to (7) above does not have an aromatic structure.

[0047] (9) An organopolysiloxane according to any one of the above items (1) to (8), wherein, in formula [1] or formula

[21] , the R 6 Or R 2-6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5].

[0048] [Chemical Formula 1]

[0049]

[0050] (In the above formula, X is a divalent organic group, optionally containing a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom that is the end of X and directly bonded to silicon is a carbon atom. When X is bonded to an oxygen atom that is directly bonded to silicon, the atom that is the end of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bonded bond.)

[0051] (10) The organopolysiloxane according to any one of items (1) to (9) above, wherein the R 6 Or R 2-6 It is (meth)acryloyloxypropyl.

[0052] (11) An organopolysiloxane composition comprising an organopolysiloxane according to any one of items (1) to (10) above and at least a polymerization initiator.

[0053] (12) A cured product formed by curing an organopolysiloxane composition according to item (11) above.

[0054] (13) A near-infrared waveguide made using an organopolysiloxane composition according to item (11) above.

[0055] (14) A near-infrared waveguide having a core and a cladding, wherein the core and the cladding are made using an organopolysiloxane composition according to item (11) above.

[0056] (15) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (13) above.

[0057] (16) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (14) above.

[0058] (17) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0059] Step (i-1): A first curable polymer composition is coated on the surface of a substrate to form a first polymer layer;

[0060] Step (i-2) involves irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and

[0061] In step (i-3), the non-exposed areas of the partially exposed layer are removed using a solvent to form a patterned core.

[0062] The first curable polymer composition is an organopolysiloxane composition according to item (11) above.

[0063] (18) The near-infrared waveguide manufacturing method according to item (17) above further comprises:

[0064] Step (i-4): Coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and

[0065] In step (i-5), the second polymer layer is cured to form the upper cladding layer.

[0066] (19) The method for manufacturing a near-infrared waveguide according to item (18) above, wherein the second curable polymer composition is an organopolysiloxane composition according to item (11) above.

[0067] (20) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0068] Step (ii-1): A third curable polymer composition is coated on the surface of the substrate to form a third polymer layer;

[0069] Step (ii-2) involves irradiating at least one selected region in the third polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0070] In step (ii-3), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core;

[0071] Step (ii-4): Coating the substrate surface and the core with a fourth curable polymer composition to form a fourth polymer layer; and

[0072] In step (ii-5), the fourth polymer layer is cured to form the upper coating.

[0073] At least one of the third curable polymer composition and the fourth curable polymer composition is an organopolysiloxane composition according to item (11) above.

[0074] (21) The method for manufacturing a near-infrared waveguide according to item (20) above, wherein the third curable polymer composition and the fourth curable polymer composition are both organopolysiloxane compositions according to item (11) above.

[0075] (22) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0076] Step (iii-1): A fifth curable polymer composition is coated on the surface of the substrate to form a fifth polymer layer;

[0077] Step (iii-2) involves curing the fifth polymer layer to form the lower cladding layer;

[0078] Step (iii-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer;

[0079] Step (iii-4) involves irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and

[0080] In step (iii-5), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core.

[0081] At least one of the fifth curable polymer composition and the sixth curable polymer composition is an organopolysiloxane composition according to item (11) above.

[0082] (23) The method for manufacturing a near-infrared waveguide according to item (22) above, wherein the fifth curable polymer composition and the sixth curable polymer composition are both organopolysiloxane compositions according to item (11) above.

[0083] (24) A method for manufacturing a near-infrared optical waveguide, comprising the following steps in sequence:

[0084] Step (iv-1): A fifth curable polymer composition is coated on the substrate surface to form a fifth polymer layer;

[0085] Step (iv-2) involves curing the fifth polymer layer to form the lower cladding layer;

[0086] Step (iv-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer;

[0087] Step (iv-4) involves irradiating at least one selected region in the sixth polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0088] Step (iv-5) involves removing the non-exposed areas of the partially exposed layer using a solvent to form a patterned core;

[0089] Step (iv-6): Coating the lower cladding and the core with a seventh curable polymer composition to form a seventh polymer layer; and

[0090] In step (iv-7), the seventh polymer layer is cured to form the upper cladding layer.

[0091] At least one of the fifth, sixth, and seventh curable polymer compositions is an organopolysiloxane composition according to item (11) above.

[0092] (25) The method for manufacturing a near-infrared waveguide according to item (24) above, wherein the fifth curable polymer composition, the sixth curable polymer composition and the seventh curable polymer composition are all organopolysiloxane compositions according to item (11) above.

[0093] (26) An organopolysiloxane for near-infrared optical waveguides, having an organic group comprising a polymerizable alkenyl group and a Q-unit silicon (SiO2)4 / 2 It does not have an aromatic structure.

[0094] (27) The near-infrared waveguide organopolysiloxane described in the above item (26) is represented by the following general formula [1].

[0095] (R) 1 R 2 R 3 SiO 1 / 2 ) M1 (R) 4 R 5 R 6 SiO 1 / 2 ) M2

[0096] (R) 7 R 8 SiO 2 / 2 ) D1 (R) 9 R 6 SiO 2 / 2 ) D2

[0097] (R) 10 SiO 3 / 2 ) T1 (R) 6 SiO 3 / 2 ) T2 (SiO) 4 / 2 ) Q

[0098] (O) 1 / 2 R 11 ) Y1 (O) 1 / 2 R 6 ) Y2 ...[1]

[0099] In the above formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms.

[0100] R 1 ~R 3 R 7 R 8 R 10 and R 11 It does not contain polymeric alkenyl groups.

[0101] R 6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other.

[0102] 0≤M1,D1,T1,Y1,Y2,

[0103] 0 <Q、0<M2+D2+T2、

[0104] M1+M2+D1+D2+T1+T2+Q=1].

[0105] (28) The near-infrared waveguide organopolysiloxane according to the above item (27), wherein, in the formula [1], 0 <M2+D2+T2≤0.25。

[0106] (29) The near-infrared waveguide organopolysiloxane according to the above item (27) or (28), wherein in the formula [1], 0.02≤Y1≤0.25.

[0107] (30) The near-infrared waveguide organopolysiloxane according to any one of the above items (27) to (29), wherein, in the formula [1], 0.04≤Q.

[0108] (31) The near-infrared waveguide organopolysiloxane according to any one of the above items (27) to (30), wherein, in the formula [1], M1+M2<0.50.

[0109] (32) An organopolysiloxane for near-infrared waveguides according to any one of the above items (27) to (31), wherein, in formula [1], the R 6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5].

[0110] [Chemical Formula 2]

[0111]

[0112] (Where, X is a divalent organic group that optionally includes a branched structure and / or a cyclic structure. Furthermore, when a silicon atom is bonded to X, the atom that is the terminal of X and directly bonded to silicon is a carbon atom. Furthermore, when an oxygen atom directly bonded to silicon is bonded to X, the atom that is the terminal of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bonded bond.)

[0113] (33) An organopolysiloxane for near-infrared waveguides according to any one of the above items (27) to (32), wherein the R 6 It is (meth)acryloyloxypropyl.

[0114] (34) An organopolysiloxane composition for near-infrared waveguides, comprising an organopolysiloxane for near-infrared waveguides according to any one of items (26) to (33) above and at least a polymerization initiator.

[0115] (35) A cured material for near-infrared waveguides, which is cured from an organopolysiloxane composition for near-infrared waveguides according to item (34) above.

[0116] (36) A near-infrared waveguide made using an organopolysiloxane composition for near-infrared waveguides according to item (34) above.

[0117] (37) A near-infrared waveguide having a core and a cladding, wherein the core and the cladding are made using an organopolysiloxane composition for near-infrared waveguides according to item (34) above.

[0118] (38) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (36) above.

[0119] (39) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (37) above.

[0120] (40) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0121] Step (i-1): A first curable polymer composition is coated on the surface of a substrate to form a first polymer layer;

[0122] Step (i-2) involves irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and

[0123] In step (i-3), the non-exposed areas of the partially exposed layer are removed using a solvent to form a patterned core.

[0124] The first curable polymer composition is an organopolysiloxane composition for near-infrared waveguides as described in item (34) above.

[0125] (41) The near-infrared waveguide manufacturing method according to item (40) above further comprises:

[0126] Step (i-4): Coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and

[0127] In step (i-5), the second polymer layer is cured to form the upper cladding layer.

[0128] (42) The method for manufacturing a near-infrared waveguide according to item (41) above, wherein the second curable polymer composition is an organopolysiloxane composition for a near-infrared waveguide according to item (34) above.

[0129] (43) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0130] Step (ii-1): A third curable polymer composition is coated on the surface of the substrate to form a third polymer layer;

[0131] Step (ii-2) involves irradiating at least one selected region in the third polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0132] In step (ii-3), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core;

[0133] Step (ii-4): Coating the substrate surface and the core with a fourth curable polymer composition to form a fourth polymer layer; and

[0134] In step (ii-5), the fourth polymer layer is cured to form the upper coating.

[0135] At least one of the third curable polymer composition and the fourth curable polymer composition is an organopolysiloxane composition for near-infrared waveguides according to the above item (34).

[0136] (44) The method for manufacturing a near-infrared waveguide according to item (43) above, wherein the third curable polymer composition and the fourth curable polymer composition are organopolysiloxane compositions for near-infrared waveguides according to item (34) above.

[0137] (45) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0138] Step (iii-1): A fifth curable polymer composition is coated on the surface of the substrate to form a fifth polymer layer;

[0139] Step (iii-2) involves curing the fifth polymer layer to form the lower cladding layer;

[0140] Step (iii-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer;

[0141] Step (iii-4) involves irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and

[0142] In step (iii-5), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core.

[0143] At least one of the fifth curable polymer composition and the sixth curable polymer composition is an organopolysiloxane composition for near-infrared waveguides according to the above item (34).

[0144] (46) The method for manufacturing a near-infrared waveguide according to item (45) above, wherein the fifth curable polymer composition and the sixth curable polymer composition are organopolysiloxane compositions for near-infrared waveguides according to item (34) above.

[0145] (47) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0146] Step (iv-1): A fifth curable polymer composition is coated on the substrate surface to form a fifth polymer layer;

[0147] Step (iv-2) involves curing the fifth polymer layer to form the lower cladding layer;

[0148] Step (iv-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer;

[0149] Step (iv-4) involves irradiating at least one selected region in the sixth polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0150] Step (iv-5) involves removing the non-exposed areas of the partially exposed layer using a solvent to form a patterned core;

[0151] Step (iv-6): Coating the lower cladding and the core with a seventh curable polymer composition to form a seventh polymer layer; and

[0152] In step (iv-7), the seventh polymer layer is cured to form the upper cladding layer.

[0153] At least one of the fifth, sixth, and seventh curable polymer compositions is an organopolysiloxane composition for near-infrared waveguides according to the above item (34).

[0154] (48) The method for manufacturing a near-infrared waveguide according to item (47) above, wherein the fifth curable polymer composition, the sixth curable polymer composition and the seventh curable polymer composition are all organopolysiloxane compositions for near-infrared waveguides according to item (34) above.

[0155] Invention Effects

[0156] According to the present invention, an organopolysiloxane having a polymerizable alkenyl group can be provided, the organopolysiloxane being suitable for a core material having micro-processability obtained by photolithography, heat resistance to withstand reflow soldering during installation, and the ability to reduce connection loss caused by reflection at the interface of a quartz fiber / waveguide, and for a cladding material around the core material. Attached Figure Description

[0157] Figure 1 This is a schematic cross-sectional view of an optical waveguide with a core formed on a substrate.

[0158] Figure 2 This is a schematic cross-sectional view of an optical waveguide with a core and an upper cladding formed on a substrate.

[0159] Figure 3 This is a schematic cross-sectional view of an optical waveguide with a lower cladding and a core formed on a substrate.

[0160] Figure 4 This is a schematic cross-sectional view of an optical waveguide having a lower cladding, a core, and an upper cladding formed on a substrate. Detailed Implementation

[0161] The present invention will now be described in detail. It should be noted that the following description is merely one example of an embodiment of the present invention, and the present invention is not limited to these examples as long as it does not depart from its spirit.

[0162] Furthermore, in this invention, "(meth)acryloyl" refers to "either or both of acryloyl and methacryloyl".

[0163] In this invention, the numerical range represented by “~” refers to the range that includes the values ​​recorded before and after “~” as the lower limit and upper limit.

[0164] [Organopolysiloxane]

[0165] Hereinafter, a first embodiment and a second embodiment of the organopolysiloxane of the present invention are described. It should be noted that the first embodiment and the second embodiment are sometimes collectively referred to as "the two embodiments".

[0166] <Option 1>

[0167] In the first aspect of the present invention (hereinafter, sometimes simply referred to as the first aspect), the organopolysiloxane is an organic group having an organic group comprising a polymerizable alkenyl group and a Q-unit silicon (SiO2). 4 / 2 ( ) substances used to form near-infrared optical waveguides.

[0168] By incorporating polymerizable alkenyl groups into the structure of the organopolysiloxane, a cured product can be readily obtained using a polymerization initiator. Furthermore, by having Q-unit silicon, the refractive index of the cured product at near-infrared wavelengths can be set to 1.4–1.5, further improving heat resistance and reflow soldering resistance. It is surprising that these effects can be achieved by including a silicon Q-unit structure containing multi-branched components that, if introduced, would promote gelation during synthesis and are therefore generally avoided.

[0169] Since it would lead to an increase in the refractive index of the cured product, the organopolysiloxane of this first embodiment is preferably free of aromatic structures.

[0170] <Second Option>

[0171] In the second aspect of the present invention (hereinafter, sometimes simply referred to as the second aspect), the organopolysiloxane is a substance having an organic group containing a polymerizable alkenyl group and not having an aromatic structure, used to form a near-infrared optical waveguide.

[0172] By including polymerizable alkenyl groups in the structure of the organopolysiloxane, a cured product can be easily obtained using a polymerization initiator. Furthermore, by lacking an aromatic structure, the refractive index of the cured product at near-infrared wavelengths can be set to 1.40–1.48.

[0173] Furthermore, the refractive index of the cured material at near-infrared wavelengths can be maintained between 1.40 and 1.48, and its heat resistance is improved, giving it reflow solderability. Therefore, the organopolysiloxane of the present invention preferably has Q-unit silicon (SiO2). 4 / 2 ).

[0174] The organopolysiloxane of this first scheme is represented by the following formula [1].

[0175] (R) 1 R 2 R 3 SiO 1 / 2 ) M1 (R) 4 R 5 R 6 SiO 1 / 2 ) M2

[0176] (R) 7 R 8 SiO 2 / 2 ) D1 (R)9 R 6 SiO 2 / 2 ) D2

[0177] (R) 10 SiO 3 / 2 ) T1 (R) 6 SiO 3 / 2 ) T2 (SiO) 4 / 2 ) Q

[0178] (O) 1 / 2 R 11 ) Y1 (O) 1 / 2 R 6 ) Y2 ...[1]

[0179] In the above formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms.

[0180] R 1 ~R 3 R 7 R 8 R 10 and R 11 It does not contain polymeric alkenyl groups.

[0181] On the other hand, R 6 It is one or more organic groups containing a polymeric alkenyl group, which may optionally be the same as or different from each other.

[0182] The organopolysiloxane of this second scheme is a non-linear organopolysiloxane without an aromatic structure, represented by the following general formula

[21] .

[0183] (R) 2-1 R 2-2 R 2-3 SiO 1 / 2 ) M1 (R) 2-4 R 2-5 R 2-6 SiO 1 / 2 ) M2

[0184] (R) 2-7 R 2-8 SiO 2 / 2 ) D1 (R) 2-9 R2-6 SiO 2 / 2 ) D2

[0185] (R) 2-10 SiO 3 / 2 ) T1 (R) 2-6 SiO 3 / 2 ) T2 (SiO) 4 / 2 ) Q

[0186] (O) 1 / 2 R 2-11 ) Y1 (O) 1 / 2 R 2-6 ) Y2 ……[twenty one]

[0187] In the above formula

[21] , R 2-1 ~R 2-5 R 2-7 ~R 2-11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups or hydrogen atoms, and does not have an aromatic structure.

[0188] R 2-1 ~R 2-3 R 2-7 R 2-8 R 2-10 and R 2-11 It does not contain polymeric alkenyl groups.

[0189] R 2-6 It is an organic group that does not have an aromatic structure and contains one or more polymeric alkenyl groups, which may be the same as or different from each other.

[0190] In this second embodiment, the organopolysiloxane is non-linear. This means that at least one of the T-units and Q-units is present.

[0191] The coefficients in Equation [1] or Equation

[21] represent the following values ​​respectively.

[0192] 0≤M1,D1,T1,Y1,Y2,

[0193] 0 <M2+D2+T2≤0.25、

[0194] 0.05 <Y1、

[0195] M1+M2+D1+D2+T1+T2+Q=1,

[0196] In formula [1], 0 <Q。

[0197] In General Formula [1] or Formula

[21] , the coefficients M1, M2, D1, D2, T1, T2, and Q represent the proportions of the respective structures (on a molar basis) when M1 + M2 + D1 + D2 + T1 + T2 + Q = 1.

[0198] In General Formula [1] or Formula

[21] , the coefficients Y1 and Y2 represent the relative content ratios of (O 1 / 2 R 11 ), and (O 1 / 2R 6 ) when M1 + M2 + D1 + D2 + T1 + T2 + Q = 1.

[0199] In General Formula [1] or Formula

[21] , the coefficients M1 and M2 represent the proportion of the so-called M-unit silicon (SiO 1 / 2 ) with one oxygen atom bonded to the silicon atom (hereinafter sometimes only referred to as "M-unit"). Similarly, D1 and D2 represent the proportion of the D-unit silicon (SiO 2 / 2 ) with two oxygen atoms bonded to the silicon atom (hereinafter sometimes only referred to as "D-unit"), T1 and T2 represent the proportion of the T-unit silicon (SiO 3 / 2 ) with three oxygen atoms bonded to the silicon atom (hereinafter sometimes only referred to as "T-unit"), and Q represents the proportion of the Q-unit silicon (SiO 4 / 2 ) with four oxygen atoms bonded to the silicon atom (hereinafter sometimes only referred to as "Q-unit").

[0200] M2, D2, and T2 respectively represent the proportions of the M-unit, D-unit, and T-unit in which an organic group containing a polymerizable alkenyl group, i.e., R 6 or R 2-6 , is bonded to the silicon atom.

[0201] Y1 represents the content ratio of an alkoxy group or a silanol group bonded to silicon, and Y2 represents the content ratio of an organic group containing a polymerizable alkenyl group bonded to silicon.

[0202] 0 ≤ M1, 0 ≤ D1, 0 ≤ T1, 0 ≤ Y1, 0 ≤ Y2 mean that M1, D1, T1, Y1, and Y2 are each 0 or more and can also be 0, that is, it means that this structural unit may not be present.

[0203] 0 < M2 + D2 + T2 means that the organopolysiloxane of the present invention has at least any one of the M-unit, D-unit, and T-unit in which an organic group containing a polymerizable alkenyl group, i.e., R 6 or R 2-6 , is bonded to the silicon atom.

[0204] <Q unit>

[0205] Q-unit silicon (SiO 4 / 2( ) is a structural unit that is essential in this first aspect and not essential in this second aspect.

[0206] The Q unit is the form in which silicon is most oxidized. By being included in the structure of the organopolysiloxane, the heat resistance of the cured product can be improved. In addition, the Q unit is also included in quartz. By using the organopolysiloxane composition having the Q unit described later, a cured product having a refractive index close to that of the core material of a near-infrared single-mode quartz fiber can be obtained.

[0207] In this first aspect, the coefficient Q representing the content ratio of the Q unit is greater than 0, preferably 0.04 or more, more preferably 0.10 or more, and further preferably 0.30 or more. <000788>

[0208] In this second aspect, the coefficient Q representing the content ratio of the Q unit is preferably 0 or more, more preferably 0.04 or more, further preferably 0.25 or more, still further preferably 0.30 or more, still further preferably 0.35 or more, and may also be greater than 0.38.

[0209] On the other hand, when there are many Q units, it will become solid, or the viscosity will increase and the operability will decrease. Therefore, the upper limit of the coefficient Q in both aspects is usually 0.65 or less, more preferably 0.6 or less, and further preferably 0.45 or less.

[0210] As described above, the Q unit in this first aspect is preferably 0 < Q ≤ 0.65, more preferably 0.04 ≤ Q ≤ 0.6, and further preferably 0.04 ≤ Q ≤ 0.45. The Q unit in this second aspect is preferably 0 ≤ Q ≤ 0.65, more preferably 0.04 ≤ Q ≤ 0.6, and further preferably 0.04 ≤ Q ≤ 0.45.

[0211] <M2 + D2 + T2>

[0212] In the organopolysiloxane of both aspects, if 0 < M2 + D2 + T2, the organopolysiloxane contains a polymerizable vinyl group, and a cured product can be easily obtained using a composition containing a polymerization initiator described later. If the content ratio of the polymerizable vinyl group is too small, poor curing may sometimes occur during the production of the cured product, and in addition, the compatibility with other components added to the organopolysiloxane composition described later will deteriorate. From the above viewpoints, it is preferably 0.10 ≤ M2 + D2 + T2, and more preferably 0.12 ≤ M2 + D2 + T2.

[0213] In the present invention, regarding the upper limit of M2 + D2 + T2, as described below, there are two implementation modes in both aspects.

[0214] In the first embodiment, from the viewpoints of microfabrication properties, heat resistance, and the effect of reducing connection loss caused by reflection at the quartz-based optical fiber / optical waveguide interface, it is preferably set such that M2 + D2 + T2 ≤ 0.75, and more preferably in the range of M2 + D2 + T2 ≤ 0.60. By setting it within this range, an appropriate content ratio of polymerizable alkenyl groups can be maintained, and an appropriate crosslinking density can be achieved so that the cured product does not become brittle.

[0215] In the second embodiment, in addition to the above effects, from the viewpoints of achieving more excellent heat resistance and having a refractive index close to that of the quartz-based optical fiber core material in the near-infrared wavelength region, M2 + D2 + T2 ≤ 0.25.

[0216] As described above, in the first embodiment of both schemes, it is preferably 0 < M2 + D2 + T2 ≤ 0.75, more preferably 0.10 ≤ M2 + D2 + T2 ≤ 0.75, and further preferably 0.12 ≤ M2 + D2 + T2 ≤ 0.60; in the second embodiment of both schemes, 0 < M2 + D2 + T2 ≤ 0.25, preferably 0.10 ≤ M2 + D2 + T2 ≤ 0.25, more preferably 0.12 ≤ M2 + D2 + T2 ≤ 0.25, further preferably 0.12 < M2 + D2 + T2 ≤ 0.25, and even more preferably 0.12 < M2 + D2 + T2 ≤ 0.20.

[0217] <O 1 / 2 R 11 and O 1 / 2 R 2-11 >

[0218] (O 1 / 2 R 11 in the first scheme of the present invention, and (O 1 / 2 R 2-11 in the second scheme of the present invention are structures that do not have polymerizable alkenyl groups and have groups selected from the group consisting of organic groups, reactive functional groups, and hydrogen atoms. Specifically, they are alkoxy groups or silanol groups bonded to silicon, which can respectively control the viscosity of the organopolysiloxane and can be adjusted to a viscosity suitable for molding. The silanol group has the effect of increasing viscosity, and by converting the silanol group into an alkoxy group, there is an effect of reducing viscosity. In addition, if the total amount of alkoxy groups and silanol groups is small, the amount of terminal groups with high mobility is small, and in addition, the siloxane backbone becomes rigid due to the formation of a cage structure, resulting in an increase in viscosity. On the contrary, when the total amount of alkoxy groups and silanol groups is large, the amount of terminal groups with high mobility is large, and the siloxane backbone also becomes a non-cage-like soft random structure, thus reducing viscosity.

[0219] <Coefficient Y1>

[0220] (O 1 / 2 R11 ), and the coefficient Y1 of the content ratio in this second aspect is 0 or a positive value. According to R 1 / 2 R 2-11 ), the coefficient Y1 representing the total content ratio of silanol groups and alkoxy groups in the organopolysiloxane is 0 or a positive value. According to the definitions of R 11 and R 2-11 , Y1 represents the total content ratio of silanol groups and alkoxy groups in the organopolysiloxane.

[0221] In the third embodiment of the two aspects, from the viewpoints of the synthesis of the organopolysiloxane described later, the viscosity adjustment required for the production of the organopolysiloxane composition, and the toughness of the cured product, the range of the coefficient Y1 is greater than 0.05, preferably 0.07 or more.

[0222] In the fourth embodiment of the two aspects, from the viewpoints of the synthesis of the organopolysiloxane described later, the viscosity adjustment required for the production of the organopolysiloxane composition, and the toughness of the cured product, the range of the coefficient Y1 is generally 0 or more, preferably 0.02 or more, more preferably 0.025 or more, and further preferably 0.03 or more.

[0223] On the other hand, from the viewpoint of storage stability, the upper limit of the coefficient Y1 is generally 0.25 or less, preferably 0.2 or less, and more preferably 0.1 or less.

[0224] Therefore, in the third embodiment of the two aspects, 0.05 < Y1, preferably 0.05 < Y1 ≤ 0.25, more preferably 0.05 < Y1 ≤ 0.2, and further preferably 0.07 ≤ Y1 ≤ 0.1.

[0225] In the fourth embodiment of the two aspects, preferably 0.02 ≤ Y1 ≤ 0.25, more preferably 0.025 ≤ Y1 ≤ 0.2, and further preferably 0.03 ≤ Y1 ≤ 0.1.

[0226] It should be noted that Y1 is represented as a relative value with respect to M1 + M2 + D1 + D2 + T1 + T2 + Q = 1.

[0227] <Coefficient Y2>

[0228] The coefficient Y2 is the content ratio of an organic group containing a polymerizable alkenyl bonded to a silicon atom via an oxygen atom, and preferably Y2 > 0.25. If Y2 > 0.25, the compatibility with other resins is improved. It should be noted that since the compound in which the polymerizable alkenyl is bonded to silicon is easily hydrolyzed by water and detached, the water absorption rate sometimes increases, so it is preferably used in a method that is not easily affected by moisture.

[0229] On the other hand, in an environment affected by moisture, when Y2 is large, the cured product is easily embrittled by moisture, so preferably Y2 < 0.4, more preferably Y2 < 0.3, and further preferably Y2 < 0.2. In addition, Y2 being 0 is also preferred.

[0230] It should be noted that Y2 is expressed as a relative value with respect to M1+M2+D1+D2+T1+T2+Q=1.

[0231] <Coefficient M1>

[0232] Does not have R 6 Or R 2-6 The M unit is not a necessary component in the organopolysiloxanes of both schemes, but is preferably included. Therefore, it indicates the absence of R... 6 Or R 2-6 The coefficient M1 of the M unit ratio is preferably M1>0. By replacing the alkoxy and silanol groups of the organopolysiloxane with M units, the storage stability of the organopolysiloxane can be improved, resulting in a low viscosity. From the viewpoint of storage stability, the coefficient M1 is preferably 0.09 or higher, and is generally 0.6 or lower, preferably 0.5 or lower, and more preferably 0.4 or lower.

[0233] <M1+M2>

[0234] In both embodiments, the M1+M2 coefficient, which is the M unit coefficient, is preferably less than 0.50 (M1+M2<0.50). If the value of the coefficient M1+M2 is within the above range, the storage stability of the organopolysiloxane can be improved, resulting in a low viscosity. Furthermore, it can maintain good compatibility with other components added to the organopolysiloxane composition described later. M1+M2 is more preferably 0.49 or less.

[0235] <Coefficient D1>

[0236] Does not have R 6 Or R 2-6 The D-unit is not a necessary component in either of the organopolysiloxane schemes, but its introduction can impart toughness to the cured product. However, without R... 6 Or R 2-6 If the proportion of D units is too high, the heat resistance of the cured product will decrease. Therefore, it indicates the absence of R... 6 Or R 2-6 The coefficient D1 of the D unit ratio is preferably D1≤0.7, more preferably D1≤0.6, and even more preferably D1≤0.3.

[0237] <Coefficient T1>

[0238] Does not have R 6 Or R 2-6 The T unit is not a necessary component in either of the organopolysiloxane schemes, but its introduction improves compatibility with other components added to the organopolysiloxane compositions described later. However, without R... 6 Or R2-6 If the content ratio of the T unit is too high, due to the steric hindrance of the introduced organic groups, it is likely to cause poor curing. Therefore, it means that it does not have R 6 or R 2-6 The coefficient T1 representing the ratio of the T unit is preferably T1≤0.5, more preferably T1≤0.4, and further preferably T1≤0.3.

[0239] In the first to fourth embodiments of the above two solutions, as long as the effects of the present invention are not hindered, they can be arbitrarily combined.

[0240] Based on the above, the coefficients in the above formula [1] or formula

[21] are as described below.

[0241] In one aspect of the two solutions, it is preferred that 0<Q≤0.65, 0<M2 + D2 + T2≤0.25, 0.05<Y1≤0.25, Y2<0.4, 0<M1 + M2≤0.6, D1≤0.7, T1≤0.5; more preferably 0.04≤Q≤0.60, 0.10≤M2 + D2 + T2≤0.25, 0.05<Y1≤0.2, Y2<0.3, 0.09≤M1 + M2≤0.5, D1≤0.6, T1≤0.4; further preferably 0.04≤Q≤0.45, 0.10≤M2 + D2 + T2≤0.20, 0.07≤Y1≤0.1, Y2<0.2, 0.09≤M1 + M2≤0.4, D1≤0.3, T1≤0.3.

[0242] In another aspect of the two solutions, it is preferred that 0<Q≤0.65, 0<M2 + D2 + T2≤0.75, 0.02≤Y1≤0.25, Y2<0.4, 0<M1 + M2≤0.6, D1≤0.7, T1≤0.5; more preferably 0.04≤Q≤0.60, 0.10≤M2 + D2 + T2≤0.75, 0.025≤Y1≤0.20, Y2<0.3, 0.09≤M1 + M2≤0.5, D1≤0.6, T1≤0.4; further preferably 0.04≤Q≤0.45, 0.12≤M2 + D2 + T2≤0.6, 0.03≤Y1≤0.1, Y2<0.2, 0.09≤M1 + M2≤0.4, D1≤0.3, T1≤0.3.

[0243] <R 6 或R 2-6 >

[0244] R in this first solution 6 and R in this second solution 2-6It is an organic group that is replaced by a polymerizable alkenyl group. Specifically, groups having acryloyl, methacryloyl, vinyl, styrene, etc. can be listed, and preferably, a molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5].

[0245] [Chemical Formula 3]

[0246]

[0247] (In the above formula, * represents a bond).

[0248] A further preferred option is R 6 and R 2-6 A molecule has at least one functional group selected from the group consisting of acryloyloxypropyl, acryloyloxyoctyl, methacryloyloxypropyl, and methacryloyloxyoctyl, wherein, particularly preferably, a molecule has acryloyloxypropyl and / or methacryloyloxypropyl.

[0249] In formulas [3] and [5], X is a divalent organic group that optionally includes a branched structure and / or a cyclic structure. In addition to carbon and hydrogen, X optionally includes any one selected from the group consisting of oxygen, nitrogen, phosphorus, sulfur, and halogens. Furthermore, when a silicon atom is bonded to X, the atom that is at the end of X and directly bonded to silicon is preferably a carbon atom. Furthermore, when an oxygen atom directly bonded to silicon is bonded to X, the atom that is at the end of X and directly bonded to the oxygen atom is preferably a carbon atom. For example, hydrocarbon groups, polyalkylene glycols, etc., that optionally include a divalent branched structure or a cyclic structure with 1 to 20 carbon atoms can be appropriately used.

[0250] The organopolysiloxane of this second embodiment is required to be free of aromatic structures. However, in the organopolysiloxane of this first embodiment, the refractive index of the cured product is also higher. Therefore, the proportion of aromatic groups in the total amount of all groups bonded to silicon atoms is preferably 20 mol% or less, more preferably 15 mol% or less, even more preferably 10 mol% or less, even more preferably 5 mol% or less, and particularly preferably 1 mol% or less. It is especially preferred to use a substance that does not contain aromatic structures. When the organopolysiloxane of this first embodiment has aromatic groups, its lower limit is not limited as long as it does not impair the effect of the present invention. For example, it can be 0.01 mol% or 0.1 mol%.

[0251] The content of aromatic groups can be determined by... 1 H-NMR, 29 Confirmed by Si-NMR. "Completely absent" means that the NMR spectrum does not contain any distinct peaks that can be clearly identified as aromatic groups.

[0252] In both schemes, the elements constituting the M, D, and T elements do not need to be entirely identical. For example, in the first scheme, the element that forms the coefficient M1 is (R... 1 R 2 R 3 SiO 1 / 2 ) and the second scheme of this scheme (R) 2-1 R 2-2 R 2-3 SiO 1 / 2 In, for example, it can also have a certain R. 1 and R 2-1 For hydrogen atoms, a certain R 1 and R 2-1 This is a different structure for methyl groups. This is also common to other R and X groups.

[0253] R in this first scheme 1 ~R 5 R 7 ~R 10 and R in this second scheme 2-1 ~R 2-5 R 2-7 ~R 2-10 Each group is independently selected from organic groups, reactive functional groups, and hydrogen atoms, and this second scheme does not have an aromatic structure.

[0254] As the aforementioned organic group, R 1 ~R 5 R 7 ~R 10 and R 2-1 ~R 2-5 R 2-7 ~R 2-10 The ether groups are preferably alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, sec-butyl, tert-butyl, octyl, cyclohexyl, and polyalkylene glycol groups, and more preferably methyl or hydrogen atoms.

[0255] R in this first scheme 1 ~R 5 R 7 ~R 10 It can be an aromatic group such as phenyl, naphthyl, carbazole, phenylene, furanyl, etc.

[0256] R 11 and R 2-11 Not containing polymerizable alkenyl groups, indicating that it is selected from organic groups having 1 to 20 carbon atoms and groups from hydrogen atoms, and R 2-11 It does not have an aromatic structure. Methyl groups are preferred.

[0257] Preferably, the reactive functional groups mentioned above are SiH groups, hydroxyl groups such as alcohol hydroxyl groups, carboxyl groups, aldehyde groups, epoxy groups, etc. Among them, R... 1 ~R 3 R 7 R 8 R 10 and R 2-1 ~R 2-3 R 2-7 R 2-8 R 2-10 It does not contain polymerizable alkenyl groups. This is because, for example, in R... 1 ~R 3 and R 2-1 ~R 2-3 In the case of organic groups containing polymeric alkenyl groups, it is impossible to distinguish between the M1 proportion portion and the M2 proportion portion, hence this stipulation.

[0258] On the other hand, even R in the M2 proportional portion 4 R 5 and R 2-4 R 2-5 Organic groups containing polymeric alkenyl groups do not present this problem and are therefore not subject to this restriction. The same reasoning applies to the D1 and T1 ratio portions. 7 R 8 R 10 and R 2-7 R 2-8 R 2-10 It is defined as not containing polymerizable alkenyl groups.

[0259] The organopolysiloxanes of the two aforementioned schemes are particularly suitable for near-infrared waveguide applications. Therefore, in another embodiment of the present invention, an organopolysiloxane for near-infrared waveguides is also provided. The various schemes and requirements of the organopolysiloxane for near-infrared waveguides are as described in the organopolysiloxanes of the two schemes.

[0260] In this specification, when referred to as "organopolysiloxane", it means that it includes both organopolysiloxane and organopolysiloxane for near-infrared waveguides.

[0261] <Method for manufacturing organopolysiloxanes>

[0262] The methods for manufacturing organopolysiloxanes in the two schemes described above are not particularly limited as long as they can produce organopolysiloxanes represented by formulas [1] and

[21] . For example, it can be a method of simultaneously condensing one or more disiloxane compounds and / or disilazines and their hydrolysates, alkoxysilane compounds or their hydrolysates, or partially hydrolyzed condensates; a method of condensing chlorosilane compounds or their hydrolysates or partially hydrolyzed condensates; a method of ring-opening polymerization of cyclic siloxane compounds; chain polymerization represented by anionic polymerization, etc., and multiple manufacturing methods can also be used in combination. In addition, there are no particular limitations on the method of introducing polymerizable alkenyl groups. It can be any method of simultaneously condensing one or more alkoxysilane compounds, disiloxane compounds, disilazines or their hydrolysates or partially hydrolyzed condensates having polymerizable alkenyl groups, or a method of converting reactive organic groups introduced into organopolysiloxanes into polymerizable alkenyl groups by chemical methods, etc., and these methods can also be used in combination.

[0263] The following examples illustrate raw materials that can be used to manufacture the organopolysiloxanes of the present invention through hydrolysis and condensation.

[0264] (M-unit source)

[0265] As an example of the M-unit source in both schemes, trimethylsilanol, trimethylmethoxysilane, hexamethyldisiloxane, hexamethyldisilazane, dimethylsilanol, dimethylmethoxysilane, tetramethyldisiloxane, tetramethyldisilazane, dimethylvinylsilanol, dimethylvinylmethoxysilane, 1,3-divinyltetramethyldisiloxane, 1,3-divinyltetramethyldisilazane, dimethyl(meth)acryloyloxypropylsilanol, dimethyl(meth)acryloyloxypropylmethoxysilane, 1,3- Di(meth)acryloyloxypropyltetramethyldisiloxane, 3-(meth)acryloyloxypropyldimethylmethoxysilane, 1,3-bis((meth)acryloyloxypropyl)-1,1,3,3-tetramethyldisiloxane, tetramethyldisiloxane, dimethylglycidoxypropylmethoxysilane, 1,3-bis(3-glycidoxypropyl)tetramethyldisiloxane, and compounds containing silanol hydroxyl or alkoxy groups among the above-listed compounds that are bonded with halogens to replace the silanol hydroxyl or alkoxy groups, etc. In this first embodiment, 1,3-diphenyltetramethyldisiloxane, 1,3-diphenyltetramethyldisilazane, dimethylphenylsilanol, dimethylmethoxyphenylsilane, 1,4-bis(dimethylmethoxysilyl)benzene, 1,4-bis(dimethylethoxysilyl)benzene, and compounds containing silanol hydroxyl or alkoxy groups among the listed compounds, where a halogen is bonded to replace the silanol hydroxyl or alkoxy group, may also be used. In particular, hexamethyldisiloxane is preferred in both embodiments. It should be noted that, since this results in a higher refractive index of the cured product, even in this first embodiment, it is preferable to use a substance without aromatic structures.

[0266] (D-cell source)

[0267] As an example of the D-unit source in both schemes, dimethyldisilanol, dimethyldimethoxysilane, 3-(meth)acryloyloxypropyldimethoxymethylsilane, 3-glycidoxypropylmethyldimethoxysilane, and compounds with halogenated bonds that replace the silanol hydroxyl or alkoxy groups of the compounds listed above, as well as polymers thereof, can be used. In this first scheme, diphenyldisilanol, diphenyldimethoxysilane, methyldimethoxyphenylsilane, diethoxymethylphenylsilane, methylphenyldisilanol, 1,4-bis(methyldimethoxysilyl)benzene, 1,4-bis(methyldiethoxysilyl)benzene, dimethoxy(methyl)(3,3,3-trifluoropropyl)silane, and compounds with halogenated bonds that replace the silanol hydroxyl or alkoxy groups of the compounds listed above, as well as polymers thereof, can also be used. In both schemes, dimethyldimethoxysilane is particularly preferred. It should be noted that, since this will lead to an increase in the refractive index of the cured product, even in this first embodiment, it is preferable to use a substance that does not contain aromatic structures.

[0268] (T-unit source)

[0269] As an example of the T-unit source in both schemes, trimethoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, hexyltrimethoxysilane, decyltrimethoxysilane, etc., can be used to react with C1 to C2. 20 Long-chain alkoxy-modified trimethoxysilanes, vinyltrimethoxysilanes, 3,3,3-trifluoropropyltrimethoxysilanes, 3-(meth)acryloyloxypropyltrimethoxysilanes, 8-(meth)acryloyloxyoctyltrimethoxysilanes, p-styryltrimethoxysilanes, 3-glycidoxypropyltrimethoxysilanes, 8-glycidoxyoctyltrimethoxysilanes, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilanes, and in addition to these methoxysilane compounds, alkoxysilanes such as ethoxysilanes, silanols, chlorosilanes, hydrosilylsilanes, and polymers thereof may also be used. In this first embodiment, phenyltrimethoxysilanes, 1,4-bis(trimethoxysilyl)benzene, and these alkoxysilane compounds, silanols, chlorosilanes, hydrosilylsilanes, and polymers thereof may also be used. In both embodiments, 3-methacryloxypropyltrimethoxysilane, 8-methacryloxyoctyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, and 8-acryloxyoctyltrimethoxysilane are particularly preferred. It should be noted that, since these formulations result in a higher refractive index in the cured product, even in this first embodiment, substances without aromatic structures are preferred.

[0270] (Q-cell source)

[0271] As an example of the Q-unit source in both schemes, tetrachlorosilane, tetramethoxysilane, tetraethoxysilane, tetraisopropoxysilane, tetrapropoxysilane, tetrabutoxysilane, tetrapentoxysilane, trimethoxymonoethoxysilane, dimethoxydiethoxysilane, triethoxymonomethoxysilane, trimethoxymonopropoxysilane, monomethoxytributoxysilane, monomethoxytripentoxysilane, dimethoxydipropoxysilane, tripropoxymonomethoxysilane, trimethoxymonobutoxysilane, dimethoxymonobutoxysilane, triethoxymonopropoxysilane, diethoxymonopropoxysilane, diethoxymonopropoxysilane, tributoxymonopropoxysilane, dimethoxymonoethoxymonobutoxysilane, diethoxymonoprop ... Alkoxysilanes such as methoxymonobutoxysilane, diethoxymonopropoxymonobutoxysilane, diethoxymonomethoxymonoethoxysilane, diethoxymonomethoxymonobutoxysilane, diethoxymonoethoxymonobutoxysilane, diethoxymonomethoxymonoethoxysilane, diethoxymonoethoxymonopropoxysilane, and monomethoxymonoethoxymonopropoxymonobutoxysilane, or methylsilicates MS51, MS56, MS57, and MS60 manufactured by Mitsubishi Chemical Corporation as tetramethoxysilane oligomers, and ethylsilicate oligomers ES40 and ES48 manufactured by Tama Chemical Industry Co., Ltd. as tetraethoxysilane oligomers, are preferred, with methylsilicate MS51 being particularly preferred. In this first embodiment, in addition to the above, aryloxysilanes such as tetraphenoxysilane and monomethoxytriphenoxysilane can also be used, but since this would lead to an increase in the refractive index of the cured product, even in this first embodiment, it is more preferable to use a substance without an aromatic structure.

[0272] In both schemes, the aforementioned M, D, T, and Q unit sources can each use one type or a combination of two or more types.

[0273] As a catalyst for the hydrolysis and condensation of these silicon raw materials, an acid catalyst, a base catalyst, or an inorganic salt can be used, with an acid catalyst being particularly preferred.

[0274] As an example of an acid catalyst, hydrochloric acid, sulfuric acid, trifluoroacetic acid, acetic acid, methacrylic acid, acrylic acid, etc. can be used, with hydrochloric acid being particularly preferred.

[0275] As an example of an alkaline catalyst, ammonia, hexamethyldisilazane, triethylamine, tetraethylammonium hydroxide, diazabicycloundecene, potassium hydroxide, sodium hydroxide, barium hydroxide, potassium carbonate, sodium carbonate, etc., can be used, with potassium hydroxide being particularly preferred.

[0276] As an inorganic salt, sodium chloride, potassium chloride, magnesium chloride, calcium chloride, sodium bromide, potassium bromide, magnesium bromide, calcium bromide, etc. can be used, with sodium chloride being particularly preferred.

[0277] As an example of a solvent used in a hydrolysis-condensation reaction, tetrahydrofuran, toluene, methanol, ethanol, isopropanol, hexane, heptane, etc. can be used, with tetrahydrofuran being particularly preferred. Two or more solvents can also be used depending on the solubility of the product, with a mixture of toluene and methanol or a mixture of tetrahydrofuran and methanol being particularly preferred.

[0278] For any alkoxy or silanol groups remaining after unhydrolyzed condensation, they can be replaced with organic acids or alcohols as needed. Examples of organic acids include acetic acid, acrylic acid, and methacrylic acid. Alcohols that do not contain polymerizable alkenyl groups include methanol, ethanol, propanol, butanol, pentanol, hexanol, heptanol, and their structural isomers. Alcohols that contain polymerizable alkenyl groups include 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate. From a stability point of view, 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate are preferred.

[0279] Furthermore, when the organopolysiloxane has a rigid structure such as a completely cage-like silsesquioxane, the cured product becomes hard and brittle; therefore, a non-cage-like structure is preferred. As long as it is not a completely cage-like silsesquioxane, for example, a random structure or a trapezoidal structure as an advanced structure can be included without impairing the effects of the present invention.

[0280] <Water>

[0281] The amount of water used for hydrolysis is preferably 0.5 equivalents or more, more preferably 0.8 equivalents or more, and even more preferably 1.1 equivalents or more, relative to the total amount of alkoxy groups contained in the MDTQ unit source. As an example of the type of water, it may be water contained in commercially available hydrochloric acid, or water purified by distillation or ion exchange resin.

[0282] [Organopolysiloxane composition]

[0283] The organopolysiloxane composition of this embodiment is used to form a near-infrared optical waveguide. In addition to the organopolysiloxane of the first or second embodiment described above, the composition may contain monofunctional polymeric alkenyl compounds, polyfunctional polymeric alkenyl compounds, and / or alkenyl polymers, etc., within a range that does not impair the properties of the cured product obtained from the composition as described later.

[0284] Furthermore, to facilitate the polymerization and easy curing of organopolysiloxanes and polymerizable alkenyl compounds, a polymerization initiator may be included. Alternatively, the organopolysiloxane or organopolysiloxane composition may be cured by electron beam irradiation or the like without using a polymerization initiator. However, since curing requires a large amount of energy, in the preferred embodiment of this invention, the organopolysiloxane composition contains at least a polymerization initiator in addition to the aforementioned organopolysiloxane.

[0285] Furthermore, to the extent that the cured products obtained from the composition may be impaired, they may contain chain transfer agents, antioxidants, ultraviolet absorbers, light stabilizers, leveling agents, rheology modifiers, silane coupling agents and other adhesive aids, dyes, defoamers, sensitizers, other components, solvents, etc.

[0286] The following describes the components optionally included in the organopolysiloxane composition.

[0287] <Monofunctional polymeric alkenyl compounds>

[0288] Specific examples of monofunctional polymeric alkenyl compounds include carboxyl esters such as (meth)acrylic acid, 2-(meth)acryloyloxyethyl succinate, 2-(meth)acryloyloxyethyl maleate, 2-(meth)acryloyloxyethyl phthalate, and 2-(meth)acryloyloxyethyl hexahydrophthalate.

[0289] 2-Hydroxyethyl methacrylate, 2-Hydroxypropyl methacrylate, 2-Hydroxybutyl methacrylate, 4-Hydroxybutyl methacrylate, 6-Hydroxyhexyl methacrylate and other methacrylates containing hydroxyl groups;

[0290] Methyl methacrylate, ethyl methacrylate, propyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, pentyl methacrylate, heptyl methacrylate, 2-ethylhexyl methacrylate, n-octyl methacrylate, isooctyl methacrylate, n-nonyl methacrylate, isononyl methacrylate, decyl methacrylate, lauryl methacrylate, tridecyl methacrylate, stearyl methacrylate, and other alkyl methacrylates.

[0291] Cyclohexyl methacrylate, dicyclopentenyl methacrylate, 2-dicyclopentenoxyethyl methacrylate, isobornyl methacrylate, dicyclopentenyl methacrylate, adamantane methacrylate, 4-tert-butylcyclohexyl methacrylate, and other methacrylates containing alicyclic structures;

[0292] (Meth)acrylates containing aromatic ring structures include phenyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, diethylene glycol (meth)acrylate, phenoxy polyethylene glycol (meth)acrylate, nonylphenoxy polyethylene glycol (meth)acrylate, phenoxy polypropylene glycol (meth)acrylate, phenyl methacrylate, phenyl phenoxyethyl methacrylate, phenoxybenzyl methacrylate, phenyl benzyl methacrylate, naphthyl methacrylate, and (1-naphthyl)methyl methacrylate.

[0293] Tetrahydrofurfuryl (meth)acrylate, glycidyl (meth)acrylate, methacryloylmorpholine, and other (meth)acrylates containing heterocyclic structures;

[0294] (Meth)acrylate methoxyethyl ester, (meth)acrylate ethoxyethyl ester, (meth)acrylate butoxyethyl ester, and other (meth)acrylate alkoxy esters;

[0295] 3-(meth)acryloyloxypropyltrimethoxysilane, 3-(meth)acryloyloxypropyltriethoxysilane, 2-(meth)acryloyloxyethyl acid phosphate, trifluoroethyl (meth)acrylate and heptadecafluorodecyl (meth)acrylate, 2-(meth)acryloyloxyethyl isocyanate;

[0296] Styrene, α-methylstyrene, 2-vinylpyridine, 4-vinylpyridine, 1,1-diphenylethylene and their aromatic cyclic hydrogen-substituted derivatives, and other styrene derivatives;

[0297] Vinyl compounds such as vinyl acetate, vinyl octanoate, vinyl decanoate, vinyl hexanoate, acrylonitrile, and vinyl benzoate.

[0298] It should be noted that since the refractive index of the cured material will increase, it is preferable to use a substance that does not contain aromatic structures.

[0299] <Multifunctional polymeric alkenyl compounds>

[0300] Specific examples of multifunctional polymerizable alkenyl compounds include: ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, and other alkylene glycol di(meth)acrylates;

[0301] Polyalkylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, polybutylene glycol di(meth)acrylate, and other polyalkylene glycol di(meth)acrylates;

[0302] Cyclohexanediethanol di(meth)acrylate, tricyclodecanediethanol di(meth)acrylate, ethoxylated hydrogenated bisphenol A di(meth)acrylate, propoxylated hydrogenated bisphenol A di(meth)acrylate, adamantanediol di(meth)acrylate, and other di(meth)acrylates containing alicyclic structures;

[0303] Difunctional (meth)acrylates such as polycarbonate diol di(meth)acrylate, polyester diol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, propoxylated bisphenol A di(meth)acrylate, 9,9-bis(4-acryloyloxyethoxyphenyl)fluorene, and polyurethane di(meth)acrylate.

[0304] Trimethylolpropane tri(meth)acrylate, ethoxylated isocyanurate tri(meth)acrylate, ε-caprolactone-modified tri((meth)acryloyloxyethyl)isocyanurate and other trifunctional (meth)acrylates;

[0305] Tetrafunctional (meth)acrylates such as bis(trimethylolpropane)tetra(meth)acrylate;

[0306] Pentafunctional (meth)acrylates such as dipentaerythritol penta(meth)acrylate;

[0307] Dipentaerythritol hexa(meth)acrylate and other hexafunctional (meth)acrylates and other multifunctional monomers;

[0308] 1,4-Divinylbenzene, 1,3-Divinylbenzene, etc.

[0309] It should be noted that since the refractive index of the cured material will increase, it is preferable to use a substance that does not contain aromatic structures.

[0310] <Alkenyl Polymers>

[0311] Alkenyl polymers are polymers whose composition contains 50% by mass or more of alkenyl monomer units. In this specification, "unit" refers to a repeating unit constituting the polymer. Polymerizable alkenyl compounds can be monofunctional or polyfunctional. Furthermore, since the refractive index increases, it is preferable to use substances that do not contain aromatic structures.

[0312] Alkenyl polymers can contain one or more alkenyl monomer units.

[0313] The polymerization method used to obtain the alkenyl polymer is not particularly limited. For example, polymerization can be carried out by known methods such as solution polymerization, suspension polymerization, emulsion polymerization, and bulk polymerization. In this invention, suspension polymerization is preferred from the perspective of controlling the polymerization reaction and the relative ease of separating the resulting polymer.

[0314] Furthermore, as an alkenyl polymer, substances modified by introducing functional groups containing double bonds, such as (meth)acryloyl or vinyl groups, into the side chains can be used. Examples of chemical modification methods include the reaction of carboxyl groups with glycidyl groups and the reaction of hydroxyl groups with isocyanate groups.

[0315] When using the reaction of carboxyl and glycidyl groups as a chemical modification method, for example, a method can be described to manufacture an alkenyl polymer containing an alkenyl monomer unit having a carboxyl group, and then react the resulting alkenyl polymer with a compound having a glycidyl group and a double bond, such as glycidyl (meth)acrylate.

[0316] To shorten the reaction time, a reaction catalyst is preferably used for the reaction of alkenyl polymers containing carboxyl monomer units with compounds having glycidyl groups and double bonds. Examples of reaction catalysts include quaternary ammonium salts such as tetrabutylammonium bromide, quaternary phosphonium salts such as ethyltriphenylphosphonium bromide, and phosphine compounds such as triphenylphosphine. Quaternary ammonium salts are particularly preferred from the viewpoint that the organopolysiloxane composition of this embodiment is less prone to coloring.

[0317] The weight-average molecular weight (Mw) of the alkenyl polymer is preferably 5,000 to 500,000, more preferably 10,000 to 200,000. If the weight-average molecular weight is 5,000 or more, the strength of the cured product becomes good. If it is 500,000 or less, the viscosity of the organopolysiloxane composition of this embodiment decreases, and therefore the workability becomes good.

[0318] <Polymerization Initiator>

[0319] Examples of polymerization initiators include photopolymerization initiators, thermal polymerization initiators, and peroxides used in redox polymerization. The type of polymerization initiator can be appropriately selected based on the polymerization method.

[0320] (Photopolymerization initiator)

[0321] Photopolymerization initiators are free radical polymerization initiators used in photopolymerization. Specific examples of photopolymerization initiators include: benzophenone, 4-methylbenzophenone, 2,4,6-trimethylbenzophenone, methyl 2-benzoylbenzoate, 4-phenylbenzophenone, and other benzophenone-type compounds; anthraquinone-type compounds such as tert-butylanthraquinone and 2-ethylanthraquinone; 2-hydroxy-2-methyl-1-phenylpropane-1-one, oligomeric {2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone}, benzyl dimethyl... Alkyl ketal compounds such as 1-hydroxycyclohexylphenyl ketone, benzoin methyl ether, 2-methyl-[4-(methylthio)phenyl]-2-morpholino-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropanoyl)benzyl]phenyl}-2-methylpropane-1-one; thioxanthone compounds such as 2-benzyl-2-dimethylamino-4'-morpholinobutyrophenyl, diethylthioxanthone, and isopropylthioxanthone; 2,4,6-trimethylbenzyl... Acylphosphine oxides, such as bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; phenylglyoxal esters, such as methyl phenylglyoxalate; N-acetoxy-N-{4-acetoxyimino-4-[9-ethyl-6-(o-tolyl)-9H-carbazole-3-yl]but-2-yl}acetamide, N-acetyl... Oxime esters such as oxy-N-{3-(acetoxyimino)-3-[9-ethyl-6-(1-naphthoyl)-9H-carbazole-3-yl]-1-methylpropyl}acetamide, methyl 4-acetoxyimino-5-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-5-oxovalerate, and methyl 4-acetoxyimino-5-oxo-5-(4-(phenylthio)phenyl)valerate; and combinations thereof.

[0322] Among these, alkyl phenyl ketone type compounds are preferred for suppressing coloration of the cured product, and 2-hydroxy-2-methyl-1-phenylpropane-1-one and 1-hydroxycyclohexylphenyl ketone are more preferred. Furthermore, acylphosphine oxide type compounds are preferred for facilitating thorough curing of the cured product to its interior, and 2,4,6-trimethylbenzoyl diphenylphosphine oxide is more preferred for suppressing coloration of the cured product. Moreover, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and methyl 4-acetoxyimino-5-oxo-5-(4-(phenylthio)phenyl)valerate, which have higher photosensitivity to longer wavelengths of light, are more preferred. From the viewpoint of high reactivity to light near 365 nm, 2-benzyl-2-dimethylamino-4'-morpholinylbutyrophenylene is preferred. These photopolymerization initiators can be used alone or in combination of two or more.

[0323] When a cured product is obtained by photopolymerization of the organopolysiloxane composition of this embodiment (hereinafter sometimes referred to simply as "curable composition"), the wavelength of the light irradiating the curable composition is not particularly limited, but ultraviolet light with a wavelength of 200 to 500 nm is preferred. Specific examples of ultraviolet light sources include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, high-power metal halide lamps, UV-LED lamps, chemical lamps, black light lamps, etc. After photopolymerization of the curable composition, post-curing can be further performed. This reduces the amount of unreacted polymeric alkenyl groups remaining in the cured product and further improves the strength of the cured product. Examples of post-curing conditions include temperatures of 50°C to 200°C for tens of seconds to 60 minutes, or temperatures of 80°C to 150°C for tens of seconds to 60 minutes.

[0324] (Thermal polymerization initiator)

[0325] Thermal polymerization initiators are free radical polymerization initiators used for thermal polymerization. Examples of thermal polymerization initiators include organic peroxides and azo compounds.

[0326] Specific examples of organic peroxides include: ketone peroxides such as methyl ethyl ketone peroxide; ketal peroxides such as 1,1-di(tert-hexylperoxide)-3,3,5-trimethylcyclohexane, 1,1-di(tert-hexylperoxide)cyclohexane, and 1,1-di(tert-butylperoxide)cyclohexane; hydroperoxides such as 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, and p-menthane hydroperoxide; and diisopropylphenyl peroxide. Dialkyl peroxides such as di-tert-butyl peroxide; dilauroyl peroxide, dibenzoyl peroxide, and other dialkyl peroxides; dicarbonates such as di(4-tert-butylcyclohexyl) peroxide and di(2-ethylhexyl) peroxide; and peroxide esters such as tert-butyl peroxide-2-ethylhexanoate, tert-hexyl peroxide-isopropyl monocarbonate, tert-butyl peroxide-benzoate, and 1,1,3,3-tetramethylbutyl peroxide-2-ethylhexanoate.

[0327] Specific examples of azo compounds include: 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis(2,4-dimethylpentanitrile), 1,1'-azobis-1-cyclohexanecarboxylonitrile, dimethyl 2,2'-azobisisobutyrate, 4,4'-azobis-4-cyanopentanoic acid, and 2,2'-azobis-(2-amidinylpropane) dihydrochloride, etc.

[0328] These thermal polymerization initiators can be used alone or in combination of two or more. Organic peroxides are preferred as thermal polymerization initiators because they minimize the formation of bubbles in the cured product. Considering the balance between the curing time and pot life of the curable composition, the 10-hour half-life temperature of the organic peroxide is preferably 35–80°C, more preferably 40–75°C, and even more preferably 45–70°C. If the 10-hour half-life temperature is 35°C or higher, the curable composition is less prone to gelation at room temperature, resulting in a good pot life. On the other hand, if the 10-hour half-life temperature is below 80°C, the curing time of the curable composition can be shortened.

[0329] Examples of such organic peroxides include 1,1,3,3-tetramethylbutyl peroxide-2-ethylhexanoate, tert-butyl peroxide-2-ethylhexanoate, and di(4-tert-butylcyclohexyl) peroxide dicarbonate. Commercially available products of 1,1,3,3-tetramethylbutyl peroxide-2-ethylhexanoate include PEROCTA O (trade name, manufactured by Nippon Oil Co., Ltd., 10-hour half-life temperature: 65.3°C). Commercially available products of tert-butyl peroxide-2-ethylhexanoate include PERBUTYL O (trade name, manufactured by Nippon Oil Co., Ltd., 10-hour half-life temperature: 72.1°C). Commercially available products of di(4-tert-butylcyclohexyl) peroxide dicarbonate include PEROYL TCP (trade name, manufactured by Nippon Oil Co., Ltd., 10-hour half-life temperature: 40.8°C).

[0330] When a cured composition is cured by thermal polymerization to obtain a cured product, the curing conditions are not particularly limited. From the viewpoint of easily obtaining a resin for optical components with suppressed coloration, the curing temperature is preferably 40 to 200°C, more preferably 60 to 150°C. The curing time (heating time) varies depending on the curing temperature, and is preferably 1 to 120 minutes, more preferably 1 to 60 minutes.

[0331] Preferably, post-curing is performed after the curable composition has been thermally polymerized. Examples of post-curing conditions include tens of seconds to 60 minutes at a temperature of 50°C to 200°C, or tens of seconds to 60 minutes at a temperature of 80°C to 150°C.

[0332] (Redox polymerization)

[0333] Redox polymerization typically uses redox-based polymerization initiators. Redox-based polymerization initiators are polymerization initiators that combine a peroxide with a reducing agent. Examples of peroxides used in redox polymerization include benzoyl peroxide and hydrogen peroxide. These peroxides can be used alone or in combination with two or more. An example of a combination of the above-mentioned peroxides as redox polymerization initiators with a reducing agent is described below.

[0334] (1) Combination of benzoyl peroxide (peroxide) with aromatic tertiary amines (reducing agents) such as N,N-dimethylaniline, N,N-dimethyl-p-toluidine, and N,N-bis(2-hydroxypropyl)-p-toluidine.

[0335] (2) Combination of hydroperoxide (peroxide) and metal soap (reducing agent).

[0336] (3) Combination of hydroperoxide (peroxide) and thiourea (reducing agent).

[0337] When a cured composition is cured by redox polymerization to obtain a cured product, curing can be carried out at a temperature of 5 to 40°C by using a redox polymerization initiator. From the viewpoint of reducing the amount of unreacted (meth)acryloyl groups remaining in the obtained optical component resin and further improving the strength of the optical component resin, the curing temperature is preferably 15 to 40°C.

[0338] Furthermore, considering that the curable composition is not prone to gelation and can be handled stably, it is preferable to carry out the curing method in the following order: dissolve the reducing agent in the curable composition in advance, and add the peroxide thereto.

[0339] When curing the curable composition, it is preferable to cure the composition in a sealed state to suppress curing obstacles caused by oxygen. Examples of sealing methods include embedding the curable composition within glass or PET film.

[0340] <Chain transfer agent>

[0341] When the curing reaction of organopolysiloxane compositions is carried out in air, the polymerization is hindered by the capture of active free radicals as peroxide free radicals due to oxygen. However, by adding a chain transfer agent that imparts hydrogen, the polymerization hindrance caused by oxygen can be suppressed.

[0342] Examples of chain transfer agents, such as thiols, include: methyl mercaptoacetate, methyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, 3-methoxybutyl 3-mercaptopropionate, n-octyl 3-mercaptopropionate, stearyl 3-mercaptopropionate, 1,4-bis(3-mercaptopropionyloxy)butane, 1,4-bis(3-mercaptobutyryloxy)butane, trimethylolethane tris(3-mercaptopropionate), trimethylolethane tris(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetras(3-mercaptopropionate), pentaerythritol tetras(3-mercaptobutyrate), dipentaerythritol hexa(3-mercaptopropionate), dipentaerythritol hexa(3-mercaptobutyrate), tri[2-(3-mercaptopropionyloxy) [Acyloxy]ethyl]isocyanurate, tris[2-(3-mercaptobutyryloxy)ethyl]isocyanurate and other mercaptocarboxylic acid esters; ethanethiol, 2-methylpropane-2-thiol, n-dodecanethiol, 2,3,3,4,4,5-hexamethylhexane-2-thiol (tert-dodecanethiol), ethane-1,2-dithiol, propane-1,3-dithiol, benzylthiol and other alkylthiols; thiophenol, 3-methylthiophenol, 4-methylthiophenol, naphthiophenol, pyridine-2-thiophenol, benzimidazole-2-thiophenol, benzothiazole-2-thiophenol and other aromatic thiophenols; 2-mercaptoethanol, 4-mercapto-1-butanol and other mercaptools; 3-(trimethoxysilyl)propane-1-thiol, 3-(triethoxysilyl)propane-1-thiol and other silane-containing thiols, etc. From the viewpoint of the reactivity and storage stability of the curable composition, secondary thiol compounds are preferred.

[0343] When a chain transfer agent is added, it can be used alone or in combination with two or more. Furthermore, the amount added is preferably 0.01 to 20 parts by mass relative to 100 parts by mass of the total polymerizable component, more preferably 0.1 to 10 parts by mass, and even more preferably 0.5 to 10 parts by mass. It should be noted that when two or more chain transfer agents are used in combination, the total amount of chain transfer agent is within the above range.

[0344] <Solvent>

[0345] For the purpose of diluting organopolysiloxanes and their compositions, solvents may be included. The type of solvent is not particularly limited, as long as it does not impair the required physical properties of the cured organopolysiloxane and its compositions. Aromatic hydrocarbons with good solubility (e.g., toluene, xylene, ethyl benzoate, ethylbenzene, benzyl alcohol), ketones (e.g., acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanone, diacetone alcohol), and esters (e.g., methyl acetate, ethyl acetate, butyl acetate, sec-butyl acetate, methoxybutyl acetate, amyl acetate, n-propyl acetate, ethyl lactate, methyl lactate, butyl lactate) can be used. Esters, propylene glycol monomethyl ether acetate, γ-butyrolactone), ethers (e.g., isopropyl ether, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, 1,4-dioxane, methyl tert-butyl ether, tetrahydrofuran), alcohols (e.g., methanol, ethanol, n-propanol, isopropanol, butanol, sec-butanol, tert-butanol, n-pentanol), halogen solvents (e.g., dichloromethane, trichloroethylene, tetrachloroethylene, bromopropane, chloroform), others (e.g., dimethyl sulfoxide, N,N-dimethylformamide, water), etc., may also be used, and two or more solvents may be used.

[0346] The content of the solid is not particularly limited as long as it does not impair the required physical properties of the cured organopolysiloxane or its composition. However, when it is desirable to suppress volatile matter to a small amount and reduce viscosity, it is preferably greater than 0% by mass and less than 25% by mass relative to the total organopolysiloxane or its composition. Furthermore, when it is desirable to obtain a cured film, it is preferably more than 75% by mass and less than 100% by mass relative to the total organopolysiloxane or its composition.

[0347] (Antioxidants)

[0348] Preferably, the curable composition further contains an antioxidant. By including an antioxidant in the curable composition, coloring caused by heat, such as heating during soldering of the cured product or heat generated by the device, can be suppressed.

[0349] Specific examples of antioxidants include: 2,6-di-tert-butylphenol, 2,6-di-tert-butyl-p-cresol, octadecyl 3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate, tetra[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, triethylene glycol bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl)propionate], and 1,6-hexanediol bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], etc., which are phenolic antioxidants. Antioxidants include: phosphorus-based antioxidants such as triphenyl phosphite, triisodecyl phosphite, tri(tetrazyl) phosphite, tri(2,4-di-tert-butylphenyl) phosphite, and tetrakis(C12-15 alkyl)-4,4'-isopropylidene diphenyl diphosphite; and sulfur-based antioxidants such as dilauryl 3,3'-thiodipropionate, di(tetrazyl) 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate, distearate, and pentaerythritol tetra(β-lauryl thiopropionate). These antioxidants can be used alone or in combination with two or more.

[0350] (Other ingredients)

[0351] The curable composition of this embodiment may also include other components such as fillers, curing control agents, and viscosity modifiers. These components may be appropriately contained within a range that does not affect the transport loss, heat resistance, and refractive index of the cured product of the organopolysiloxane composition of this embodiment.

[0352] <Cure of Organopolysiloxane Compositions>

[0353] Another embodiment of the present invention is a cured product obtained by curing the described organopolysiloxane composition (curable composition) by heat and light.

[0354] There are no particular limitations on the curing conditions of the organopolysiloxane composition. Curing can be carried out appropriately by using the conditions adopted in the curing of organosilicon resin, depending on the type of polymerization initiator, etc.

[0355] <Properties of cured products>

[0356] If it has polymerizable alkenyl groups and contains Q units (SiO2) 4 / 2 When the organopolysiloxane and its composition of the first embodiment of the present invention are cured as described above, a cured product having the following properties can be obtained.

[0357] • Heat resistance

[0358] A cured product with high reflow solderability can be obtained, preferably with a 1% weight loss temperature of 285°C or higher, more preferably 290°C or higher. It should be noted that the weight loss temperature is determined according to the method described in the examples below.

[0359] • Transmission loss

[0360] A cured optical waveguide core material with a transmission loss preferably below 0.30 dB / cm, more preferably below 0.25 dB / cm, suitable for near-infrared wavelengths, can be obtained. The transmission loss is measured according to the method described in the examples below.

[0361] If the organopolysiloxane and its composition of the second embodiment of this invention, which have organic groups containing polymerizable alkenyl groups and do not have aromatic structures, are cured in the manner described above, a cured product with the following properties can be obtained.

[0362] • Heat resistance

[0363] A cured product with high reflow solderability and a 5% weight loss temperature preferably above 330°C, more preferably above 333°C, can be obtained. It should be noted that the weight loss temperature is determined according to the method described in the examples below.

[0364] The organopolysiloxane composition of this embodiment is particularly suitable for near-infrared waveguide applications. Therefore, in another embodiment of the present invention, an organopolysiloxane composition for near-infrared waveguides is also provided. The various schemes and requirements of the organopolysiloxane composition for near-infrared waveguides are as described above for the organopolysiloxane composition.

[0365] Hereinafter, when referred to as "organopolysiloxane composition", it refers to both the organopolysiloxane composition and the organopolysiloxane composition for near-infrared waveguides.

[0366] [Near-infrared optical waveguides and near-infrared light transmission components]

[0367] Near-infrared waveguides made using the above-described organopolysiloxane composition and near-infrared light transmission components having at least the aforementioned near-infrared waveguides are also within the scope of this invention.

[0368] Furthermore, as described later, near-infrared waveguides having a cured form of the above-described organopolysiloxane composition and near-infrared light transmission components having at least the near-infrared waveguide are also within the scope of the present invention.

[0369] Furthermore, as will be described later, the method for manufacturing near-infrared waveguides using the aforementioned organopolysiloxane composition is also within the scope of this invention.

[0370] The near-infrared waveguide of the present invention has at least a core and / or cladding formed by curing the organopolysiloxane composition, and may also have a substrate (also referred to as a “substrate”).

[0371] The near-infrared waveguide of the present invention preferably comprises a core and a cladding made using the aforementioned organopolysiloxane composition.

[0372] Furthermore, the cladding can be composed of a lower cladding and an upper cladding.

[0373] In addition to the aforementioned near-infrared waveguide, the near-infrared light transmission component of the present invention may also include reflectors, connectors, and other connecting components for optical fibers, silicon photonic optical circuits, etc.

[0374] The above-mentioned organopolysiloxane composition can be used for either the cladding forming material for forming the cladding of an optical waveguide or the core forming material for forming the core, but the refractive index of the core material for forming the core needs to be higher than the refractive index of the cladding material constituting the cladding.

[0375] The refractive index of the cured product can be controlled by changing the proportion of structural units of the organopolysiloxane. For example, by increasing the value of M2+D2+T2 in the above formula [1] of the first embodiment or the above formula

[21] of the second embodiment, that is, by increasing the content of polymerizable alkenyl groups, the density of the resulting cured product increases, thereby increasing the refractive index. Conversely, by decreasing the value of M2+D2+T2, that is, by decreasing the content of polymerizable alkenyl groups, the density of the resulting cured product decreases, thereby decreasing the refractive index. In addition, the refractive index of the cured product can also be controlled by changing the component proportions of the organopolysiloxane composition, etc.

[0376] Furthermore, by adjusting the content (volume %) of polymeric alkenyl compounds and / or alkenyl polymers contained in the aforementioned organopolysiloxane composition, the crosslinking density of the cured product can be controlled in the same manner as described above, thereby controlling the refractive index. Additionally, in the organopolysiloxane of this first embodiment, increasing the aromatic group content (volume %) of the cured product can increase the refractive index, while increasing the fluorine content (volume %) can decrease the refractive index. Furthermore, combining these methods can also control the refractive index of the cured product.

[0377] In the case of near-infrared single-mode optical signals, the refractive index difference between the core material and the cladding material is preferably 0.01 to 0.05, more preferably 0.01 to 0.04, further preferably 0.01 to 0.03, and even more preferably 0.01 to 0.02.

[0378] When connecting to near-infrared single-mode silica fiber in a device, if the difference in refractive index between the core material of the silica fiber and the core material of the optical waveguide is small, there will be less interfacial reflection of light at the connection point, and the connection loss may be further reduced. Typically, the refractive index of the core material of near-infrared single-mode silica fiber is 1.4–1.5 at near-infrared wavelengths. If the refractive index of the core material of the optical waveguide is 1.400–1.500 at 589 nm and 1.400–1.500 at 1300 nm, more preferably 1.430–1.490 at 589 nm and 1.420–1.480 at 1300 nm, and even more preferably 1.435–1.480 at 589 nm and 1.425–1.470 at 1300 nm, the difference in refractive index between the two materials becomes smaller, and the connection loss may be further reduced.

[0379] In the near-infrared waveguides targeted by this invention, the fabrication method is not particularly limited. For example, the waveguide can be formed by curing the aforementioned organopolysiloxane composition through exposure (photocuring) or heating (thermal curing). As a representative example, the waveguide can be formed using photolithography with a photomask, through etching and developing processes. When fabricating the waveguide by photolithography, it is preferable to use an organopolysiloxane composition that contains at least an organopolysiloxane and a photopolymerization initiator. An organopolysiloxane composition with further additions of solvents, chain transfer agents, etc., as needed can also be used. Furthermore, it can also be fabricated using methods such as nanoimprinting.

[0380] The optical waveguide formation method described above using photolithography can fabricate optical waveguides with small linewidths and spacings, and is particularly preferred.

[0381] The substrate for near-infrared waveguides can be silicon wafers, silicon wafers with oxide films, polyimide resins, epoxy resins, PEEK resins, liquid crystal polymers, glass, glass epoxy boards, etc. When using photolithography, the waveguide core can be fabricated on the substrate by coating an organopolysiloxane composition onto the substrate, exposing it through a photomask, and cleaning the non-exposed areas with a solvent. Furthermore, a cladding layer can be fabricated by coating the core fabricated on the substrate with the organopolysiloxane composition and allowing it to cure. Alternatively, a bottom cladding layer can be pre-fabricated by coating the substrate with the organopolysiloxane composition and allowing it to cure before fabricating the core. Furthermore, the waveguide can be peeled off from the substrate after fabricating the core and cladding layer on the substrate.

[0382] In another embodiment of the present invention, a method for manufacturing a near-infrared optical waveguide is provided (sometimes referred to as the manufacturing method herein).

[0383] The first aspect of this manufacturing method comprises, in sequence, the following steps: step (i-1), coating a first curable polymer composition onto a substrate surface to form a first polymer layer; step (i-2), irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and step (i-3), removing the non-exposed region of the partially exposed layer with a solvent to form a patterned core.

[0384] The first curable polymer composition is an organopolysiloxane composition as described in this invention or an organopolysiloxane composition for near-infrared waveguides.

[0385] In the first embodiment described above, it is preferable to further include: step (i-4), coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and step (i-5), curing the second polymer layer to form an upper cladding layer.

[0386] The second curable polymer composition is not particularly limited to any composition that has curability, but is preferably the organopolysiloxane composition of the present invention.

[0387] The second aspect of this manufacturing method comprises, in sequence: step (ii-1), coating a third curable polymer composition onto the surface of a substrate to form a third polymer layer; step (ii-2), irradiating at least one selected region of the third polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; step (i-3), removing the non-exposed region of the partially exposed layer with a solvent to form a patterned core; step (ii-4), coating the substrate surface and the core with a fourth curable polymer composition to form a fourth polymer layer; and step (ii-5), curing the fourth polymer layer to form an upper cladding layer.

[0388] At least one of the third curable polymer and the fourth curable polymer composition is the above-mentioned organopolysiloxane composition.

[0389] As described above, as long as at least one of the third and fourth curable polymer compositions is the aforementioned organopolysiloxane composition, the other curable polymer composition is not particularly limited as long as it is a curable composition. In this embodiment, it is preferred that both the third and fourth curable polymer compositions are organopolysiloxane compositions as described above.

[0390] The third aspect of this manufacturing method comprises, in sequence: step (iii-1), coating a fifth curable polymer composition onto a substrate surface to form a fifth polymer layer; step (iii-2), curing the fifth polymer layer to form a lower cladding layer; step (iii-3), coating a sixth curable polymer composition onto the lower cladding layer to form a sixth polymer layer; step (iii-4), irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and step (iii-5), removing the non-exposed region of the partially exposed layer with a solvent to form a patterned core.

[0391] At least one of the fifth curable polymer composition and the sixth curable polymer composition is the above-mentioned organopolysiloxane composition.

[0392] As described above, if at least one of the fifth curable polymer composition and the sixth curable polymer composition is the aforementioned organopolysiloxane composition, then the other curable polymer composition is not particularly limited as long as it is a curable composition. In this embodiment, it is preferable that both the fifth curable polymer composition and the sixth curable polymer composition are organopolysiloxane compositions as described above.

[0393] The fourth aspect of this manufacturing method comprises, in sequence: step (iv-1), coating a fifth curable polymer composition onto a substrate surface to form a fifth polymer layer; step (iv-2), curing the fifth polymer layer to form a lower cladding layer; step (iv-3), coating a sixth curable polymer composition onto the lower cladding layer to form a sixth polymer layer; step (iv-4), irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; step (iv-5), removing the non-exposed region of the partially exposed layer with a solvent to form a patterned core; step (iv-6), coating the lower cladding layer and the core with a seventh curable polymer composition to form a seventh polymer layer; and step (iv-7), curing the seventh polymer layer to form an upper cladding layer.

[0394] At least one of the fifth, sixth, and seventh curable polymer compositions is the aforementioned organopolysiloxane composition.

[0395] In this embodiment, it is preferred that the fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition are all organopolysiloxane compositions for near-infrared waveguides of the present invention.

[0396] The aforementioned substrate can be used as the substrate. The surface of the substrate is preferably pretreated with ozone, plasma, or corona treatment to remove surface deposits, prevent rejection of the curable polymer composition to be coated, and improve adhesion. Similarly, before forming the core and the upper cladding, the surfaces to be formed of the core and the upper cladding are preferably pretreated with ozone, plasma, or corona treatment.

[0397] In each of the first to seventh curable polymer compositions, at least a portion thereof is required to be the aforementioned organopolysiloxane composition, but other curable polymer compositions may be any other polymer composition forming the core, lower cladding, or upper cladding.

[0398] Other polymer compositions are not limited, and examples include: curable silicone compositions other than the organopolysiloxane compositions described above; curable polyolefin compositions; curable polyamide compositions; curable epoxy resin compositions; curable amino resin compositions; curable polyurethane compositions; curable polyimide compositions; curable polyester compositions; and curable acrylic resin compositions.

[0399] Curable polymer compositions can be applied to a substrate using any common method, such as spin coating, die coating, gravure coating, dip coating, spraying, brushing, or screen printing. Typically, curable polymer compositions can be applied by spin coating. The desired polymer layer thickness can be achieved by adjusting the spin speed and spin time, as well as the solids content and viscosity of the curable polymer composition.

[0400] When the curable polymer composition contains a solvent, the manufacturing method may further include a step of removing at least a portion of the solvent from the formed polymer layer. The solvent can be removed by heating the polymer layer at a temperature of 50°C to 200°C for tens of seconds to 60 minutes, or at a temperature of 80°C to 150°C for tens of seconds to 60 minutes. Alternatively, the solvent can be removed under reduced pressure, or it can be removed under reduced pressure followed by heating to remove the solvent.

[0401] The polymer layer can be cured by various means according to the curing mechanism of the curable polymer composition. Examples of such means include heating, exposure (irradiation with active energy lines such as radiation or ultraviolet light), and steam. The conditions can be appropriately selected. For example, a high-pressure mercury lamp light source can be used for curing. The atmosphere during exposure can be air or an inert atmosphere. Exposure under an inert atmosphere can reduce the formation of an uncured layer on the polymer layer surface.

[0402] The polymer layer used to form the core is configured to be irradiated with active energy rays of wavelength 150–800 nm over at least one selected region, creating a partially exposed layer having at least one exposed region and at least one non-exposed region. Alternatively, the polymer layer used to form the cladding layer can also be irradiated with active energy rays of wavelength 150–800 nm over at least one selected region, creating a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0403] After the polymer layer has cured, it can be further heated or exposed again. These treatments can sometimes promote curing and improve the adhesion between the polymer layer and the substrate, as well as the adhesion between the polymer layers. Examples of the above-mentioned heat treatment conditions include, for example, temperatures of 50°C to 200°C for tens of seconds to 60 minutes, or temperatures of 80°C to 150°C for tens of seconds to 60 minutes.

[0404] In the core formation process, after the curable polymer composition has cured, a so-called developing process is performed to remove the unexposed areas using a solvent. There are no restrictions on the solvent or developing method used; any solvent can be used as long as it can dissolve the curable polymer composition, and the unexposed portions of the curable polymer composition can be dissolved by any method such as immersion or spraying. In the cladding formation process, after the curable polymer composition has cured, a so-called developing process can also be performed to remove the unexposed areas using a solvent. There are no restrictions on the solvent or developing method used; any solvent can be used as long as it can dissolve the curable polymer composition, and the unexposed portions of the curable polymer composition can be dissolved by any method such as immersion or spraying. Furthermore, in the core, upper, and lower cladding formation processes, the same process as the aforementioned developing process can be used to remove the uncured layer on the surface of the polymer layer. After removing the unexposed areas with a solvent, it is preferable to remove the solvent by air drying or heating.

[0405] Typically, the lower and upper cladding layers have a thickness of approximately 1–100 μm, and the core has a thickness of 1–50 μm. The refractive index of the core is preferably higher than that of the cladding layers, enabling light to be transmitted in the desired propagation mode according to the core's size and refractive index.

[0406] This manufacturing method can be extended to high-productivity manufacturing methods. Multiple optical waveguides can also be fabricated simultaneously on a single substrate. Furthermore, this method can also utilize conventional wafer fabrication techniques (e.g., coating, exposure, development, curing) and apparatus.

[0407] The optical waveguides manufactured according to this method have superior microfabrication, heat resistance, and low transmission loss at near-infrared wavelengths compared to optical waveguides containing other known materials, and can reduce connection loss caused by reflection at the fiber / waveguide interface.

[0408] Example

[0409] The present invention will now be described in detail with reference to embodiments, but the present invention is not limited to these embodiments.

[0410] [Evaluation Method]

[0411] (1) 1 Methods for determining H-NMR

[0412] Weigh 60 mg of the organopolysiloxane of the analyte, and add 12 mg of N,N-dimethylformamide as an internal standard. Further add deuterated chloroform to dissolve it to 1 g, add this solution to an NMR sample tube, and perform NMR analysis at 400 MHz. 1 ¹H-NMR (Bruker AVANCE NEO 400, BBFO Probe (5mm diameter)) was performed with pulse repetition time of 5 seconds, 16 scans, single-pulse mode, 25°C, 30° flip angle, 20Hz rotation, and a measurement temperature of 25°C. The functional group content was estimated based on the ratio of the signal intensity of each component to that of the internal standard N,N-dimethylformamide, and the weighing value.

[0413] (2) 29 Si-NMR determination method

[0414] • Device: JNM-ECS400 manufactured by Nippon Electronics Co., Ltd., TUNABLE Probe (10mm diameter): Si-free, AT10 probe.

[0415] • Measurement conditions: Pulse repetition time / 16 seconds, number of scans / 1024 times, measurement mode / non-gated decoupled pulse method (NNE), flip angle / 90°, rotation / none, measurement temperature / 25℃.

[0416] • Sample preparation: Tris(2,4-pentanedione)chromium III was added to deuterated chloroform to a concentration of 0.5% by mass to obtain 29Solvent for Si-NMR determination. Weigh 1.5 g of the organopolysiloxane of the analyte and add 2.5 ml of the above solvent. 29 The sample is dissolved in a solvent and added to the NMR sample tube for Si-NMR determination.

[0417] • Calculation of structural units: The signal strength of each silicon unit is measured, based on the above... 1 The ratio of silicon unit composition is calculated by combining the ratio of signal intensity measured by H-NMR with the ratio of functional group content.

[0418] (3) Determination of the refractive index of the cured material

[0419] Using a Kalnew precision refractometer KPR2000 manufactured by Shimadzu Corporation, the refractive index of the cured material at a wavelength of 589 nm was measured at 23°C using a mixture of diiodomethane, monobromonaphthalene, and liquid paraffin as an intermediate solution.

[0420] Alternatively, using a Metricon prism coupler model 2010 / M, the refractive index of the thin film cured on the substrate at wavelengths of 1300 nm and 1550 nm can be measured.

[0421] (4) Thermal weight loss temperature

[0422] The measurements were performed using the Hitachi Advanced Technology Corporation STA200 thermogravimetric analyzer under air conditions and a temperature increase of 10°C / min.

[0423] (5) Transmission loss

[0424] Using a Hitachi High Technology Spectrophotometer U-4000 manufactured by Hitachi, Ltd., the transmittance at 1310 nm wavelength was measured for cured materials with a thickness of approximately 0.5 mm and approximately 1 mm, respectively. The transmission loss L (dB / cm) was calculated using formula [6].

[0425] L = -(10 / Δd) × log 10 (T) 1.0 / T 0.5 ...[6]

[0426] Δd (cm) ... the difference in film thickness between the two samples

[0427] T 1.0 (%) ... Transmittance of a sample with a film thickness of approximately 1.0 mm

[0428] T 0.5 (%) ... Transmittance of a sample with a film thickness of approximately 0.5 mm

[0429] [Synthetic methods of organopolysiloxanes]

[0430] [Synthetic Example 1] Synthetic methods of organopolysiloxanes A to E

[0431] Using 1.600 g of methylsilicate MS51 (manufactured by Mitsubishi Chemical Corporation), 40.00 g of 3-methacryloyloxypropyltrimethoxysilane KBM503 (manufactured by Shin-Etsu Chemical Industry Co., Ltd.), and 17.92 g of hexamethyldisiloxane (manufactured by NACALAI TESQUE Co., Ltd.) as raw materials for the organopolysiloxane, 23.04 g of toluene and 23.04 g of methanol as solvents, and a mixture of 10.62 g of 1N hydrochloric acid and 10.62 g of methanol as catalysts and water, hydrolysis and condensation were carried out while maintaining the temperature between 15°C and 40°C. The reaction solution was then neutralized, washed with deionized water, the solvent and water were removed, and the mixture was filtered to obtain 34 g of the target liquid organopolysiloxane A.

[0432] By appropriately changing the amount of organopolysiloxane raw materials, organopolysiloxanes B to E were synthesized in the same manner.

[0433] [Synthetic Example 2] Synthesis method of organopolysiloxane F

[0434] Using p-styrenetrimethoxysilane KBM1403 manufactured by Shin-Etsu Chemical Industry Co., Ltd. instead of 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Industry Co., Ltd. as the organopolysiloxane raw material, organopolysiloxane F was obtained in the same manner as in Synthesis Example 1.

[0435] [Synthetic Example 3] Synthesis method of organopolysiloxane H

[0436] Using 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and dimethoxydimethylsilane manufactured by Tokyo Chemical Industry Co., Ltd., the organopolysiloxane H was obtained in the same manner as in Synthesis Example 1.

[0437] [Synthetic Example 4] Synthesis of Organopolysiloxane G

[0438] Referring to Japanese Patent Publication No. 2014-510159, organopolysiloxane G was obtained by using 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Industry Co., Ltd. and diphenylsilanediol manufactured by Tokyo Chemical Industry Co., Ltd. as raw materials for organopolysiloxane.

[0439] [Method for preparing cured products]

[0440] Relative to 100 parts by mass of liquid organopolysiloxanes A to H obtained in Synthetic Examples 1 to 4, 2.0 parts by mass of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenyl (Omnirad 369) manufactured by iGM Resins BV as a photopolymerization initiator were added, and 0.5 parts by mass of Omnirad 369 were added relative to 100 parts by mass of organopolysiloxane G and stirred to dissolve the photopolymerization initiator, thus preparing the composition.

[0441] Furthermore, a composition was prepared in which, relative to 100 parts by weight of organopolysiloxane B100, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenyl (Omnirad 369) manufactured by iGMResins BV as a photopolymerization initiator and 10 parts by weight of pentaerythritol tetra(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent were added.

[0442] In addition, compositions were prepared by adding 2.0 parts by weight of 2,4,6-trimethylbenzoyl diphenylphosphine oxide (manufactured by iGM Resins BV, Omnirad TPOH) instead of Omnirad 369 as a photopolymerization initiator relative to 100 parts by weight of organopolysiloxane C, and compositions were prepared by using 2 parts by weight of bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (manufactured by iGM Resins BV, Omnirad 819) instead of Omnirad 369 as a photopolymerization initiator relative to 100 parts by weight of organopolysiloxane C.

[0443] These compositions were held between two glass plates using a 1 mm thick silicone spacer and exposed to a 365 nm LED (cumulative light intensity: 6000 mJ / cm²). 2 This yielded a test piece approximately 1 mm thick. For the composition used to evaluate transmission loss, it was held between two glass plates via a 0.5 mm thick silicone spacer and exposed to an LED with a wavelength of 365 nm (cumulative light intensity: 6000 mJ / cm²). 2 ), and also obtained a test piece with a thickness of about 0.5 mm.

[0444] [Method for fabricating thin film cured on substrate]

[0445] The composition was prepared by adding 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenyl (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator and 60 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent, relative to 100 parts by weight of organopolysiloxane A to H, and stirring at room temperature.

[0446] The composition obtained by further adding 10 parts by weight of pentaerythritol tetra(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent is a composition containing the above-mentioned organopolysiloxane B.

[0447] Compositions containing the above-mentioned organopolysiloxane C were also prepared by adding 2.0 parts by weight of Omnirad TPO H instead of Omnirad 369 as a photopolymerization initiator, adding 2.0 parts by weight of Omnirad 819 instead of Omnirad 369 as a photopolymerization initiator, and adding 2.0 parts by weight of methyl 4-acetoxyimino-5-oxo-5-(4-(phenylthio)phenyl)valerate (photopolymerization initiator-1) instead of Omnirad 369 as a photopolymerization initiator.

[0448] After spin-coating these compositions onto a glass substrate, the solvent was removed by depressurization. Then, exposure was performed using a 365nm LED (cumulative light intensity: 1000mJ / cm²). 2 ), to create a thin film cured on a substrate.

[0449] Examples 1-6, Comparative Examples 1-3, Reference Examples 1-3

[0450] [Molecular composition ratio of liquid organopolysiloxanes and physical properties of cured products]

[0451] As Examples 1-6, liquid organopolysiloxanes C-E were used to prepare cured products and to prepare thin film cured products on glass substrates using the method described above. As Comparative Examples 1-3, liquid organopolysiloxanes G, H, and F were used to prepare cured products and to prepare thin film cured products on glass substrates using the method described above. As Reference Examples 1-3, liquid organopolysiloxanes A and B were used to prepare cured products and to prepare thin film cured products on glass substrates using the method described above.

[0452] For them, it will be through 1 H-NMR and 29 The molecular composition ratio of the liquid organopolysiloxane before curing and the physical properties of the cured product, calculated by Si-NMR determination, are shown in Tables 1, 2-1 and 2-2.

[0453] [Table 1]

[0454]

[0455] [Table 2-1]

[0456] Table 2-1

[0457] * 1: Other additives are those other than photopolymerization initiators and solvents.

[0458] [Table 2-2]

[0459] Table 2-2

[0460]

[0461] The following describes the fabrication of an optical waveguide using organopolysiloxane for near-infrared optical waveguides.

[0462] [Example 7]

[0463] [Method for fabricating an optical waveguide with a core on a substrate 1]

[0464] Relative to the above-mentioned parts by weight of organopolysiloxane B100, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenone (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator, 10 parts by weight of pentaerythritol tetra(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent, and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the first curable polymer composition. After spin-coating the first curable polymer composition onto a silicon wafer substrate with an ozone-treated surface, the solvent was removed by depressurization, and the substrate was exposed using a mask (intensity at 365 nm: 500 mW / cm²). 2 Cumulative light intensity: 2000 mJ / cm 2 After heating at 130°C for 10 minutes, the composition of the non-exposed portion is rinsed with propylene glycol monomethyl ether acetate followed by 2-propanol, heated in a furnace at 130°C for 30 seconds, and further heated in a furnace at 150°C for 1 hour, thereby fabricating the core of the optical waveguide on a silicon wafer substrate.

[0465] Figure 1 This is a schematic cross-sectional view of the optical waveguide fabricated in Example 7.

[0466] [Example 8]

[0467] [Method for fabricating an optical waveguide with a core / top cladding on a substrate 2]

[0468] Relative to the above-mentioned organopolysiloxane C100 parts by weight, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenone (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the second curable polymer composition. The surface of the silicon wafer substrate with the optical waveguide core obtained in Example 7 was subjected to plasma treatment, and after spin-coating with the second curable polymer composition, the solvent was removed by depressurization treatment, and the substrate was exposed using an exposure machine (intensity at wavelength 365 nm: 40 mW / cm). 2 Cumulative light intensity: 1000 mJ / cm 2 After heating at 130°C for 10 minutes, propylene glycol monomethyl ether acetate, followed by 2-propanol, is used to rinse the insufficiently cured parts of the coating surface. The coating is then heated at 130°C for 30 seconds in an oven, and further heated at 150°C for 1 hour in an oven, thereby fabricating an optical waveguide with a core and an upper cladding on a silicon wafer substrate.

[0469] Figure 2 This is a schematic cross-sectional view of the optical waveguide fabricated in Example 8.

[0470] [Example 9]

[0471] [Method 3 for fabricating an optical waveguide with a lower cladding / core on a substrate]

[0472] Relative to the above-mentioned 100 parts by weight of organopolysiloxane C, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenone (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the fifth curable polymer composition. After spin-coating this fifth curable polymer composition onto a silicon wafer substrate with an ozone-treated surface, the solvent was removed by depressurization, and the substrate was exposed using an exposure machine (intensity at 365 nm: 40 mW / cm). 2 Cumulative light intensity: 1000 mJ / cm 2 After heating at 130°C for 10 minutes, propylene glycol monomethyl ether acetate, followed by 2-propanol, is used to rinse the insufficiently cured parts of the coating surface. The coating is then heated at 130°C for 30 seconds in an oven to form a lower cladding layer on a silicon wafer substrate, formed from the fifth curable polymer composition.

[0473] Relative to the above-mentioned parts by weight of organopolysiloxane B100, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenone (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator, 10 parts by weight of pentaerythritol tetra(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent, and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the sixth curable polymer composition. The surface of a silicon wafer substrate with the above-mentioned lower cladding layer was subjected to plasma treatment, and the sixth curable polymer composition was spin-coated. The solvent was removed by depressurization treatment, and the substrate was exposed using a mask (intensity at wavelength 365 nm: 500 mW / cm²). 2 Cumulative light intensity: 2000 mJ / cm 2 After heating at 130°C for 10 minutes, the composition of the non-exposed portion is rinsed with propylene glycol monomethyl ether acetate followed by 2-propanol. The composition is then heated at 130°C for 30 seconds in a furnace and further heated at 150°C for 1 hour in a furnace, thereby fabricating an optical waveguide on a silicon wafer substrate having a lower cladding layer formed by a fifth curable polymer composition and a core formed by a sixth curable polymer composition.

[0474] Figure 3 This is a schematic cross-sectional view of the optical waveguide fabricated in Example 9.

[0475] [Example 10]

[0476] [4. Fabrication method of an optical waveguide having a lower cladding / core / upper cladding on a substrate]

[0477] Relative to the above-mentioned organopolysiloxane C100 parts by weight, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenyl (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the seventh curable polymer composition. The surface of the silicon wafer substrate with the lower cladding and core obtained in Example 9 was subjected to plasma treatment, and after spin-coating with the seventh curable polymer composition, the solvent was removed by depressurization treatment, and the substrate was exposed using an exposure machine (intensity at wavelength 365 nm: 40 mW / cm). 2 Cumulative light intensity: 1000 mJ / cm 2After heating at 130°C for 10 minutes, propylene glycol monomethyl ether acetate, followed by 2-propanol, is used to rinse the insufficiently cured parts of the coating surface. The coating is then heated at 130°C for 30 seconds in an oven, and further heated at 150°C for 1 hour in an oven, thereby fabricating an optical waveguide on a silicon wafer substrate having a lower cladding layer formed by a fifth curable polymer composition, a core composed of a sixth curable polymer composition, and an upper cladding layer formed by a seventh curable polymer composition.

[0478] Figure 4 This is a schematic cross-sectional view of the optical waveguide fabricated in Example 10.

[0479] [Examination of Results]

[0480] In Examples 1 to 3, where the coefficient Q>0 in Formula [1], the refractive index of the cured material at a wavelength of 589 nm is 1.437 to 1.452, which may reduce the loss when connected to a near-infrared single-mode quartz fiber. The cured material made from the organopolysiloxane compositions of Examples 1 to 6 has a refractive index of 1.429 to 1.453 at a wavelength of 1300 nm and a refractive index of 1.426 to 1.452 at a wavelength of 1550 nm. When connected to a near-infrared single-mode quartz fiber using it as the core material of a near-infrared optical waveguide, the connection loss may be reduced. Furthermore, the cladding material used around the core material with a refractive index of about 1.400 to 1.500 at a wavelength of 1300 nm is also useful. Moreover, the cured material made from the organopolysiloxane compositions of Examples 1 to 6 has a 1% weight loss temperature of 284°C or higher and a 5% weight loss temperature of 330°C or higher, exhibiting high reflow solderability. Therefore, it has been confirmed that an optical waveguide can be formed by photolithography. In Examples 7-10, various optical waveguides were actually fabricated.

[0481] Reference Examples 1-3 confirm that compositions containing organopolysiloxanes having this composition have a refractive index of 1.470 or less at a wavelength of 1300 nm and excellent heat resistance, making them suitable for near-infrared waveguide applications. Furthermore, Reference Example 3 confirms that by adding a chain transfer agent, curability is improved, and the heat resistance of the cured product is enhanced.

[0482] In Comparative Example 1, where the coefficient in Equation [1] is Q=0, the refractive index of the cured material is greater than 1.5, which may increase the loss when connected to a near-infrared single-mode quartz fiber. Furthermore, the 1% weight loss temperature of the cured material is below 285°C, which does not provide sufficient reflow soldering resistance. In Comparative Example 2, where the coefficient in Equation [1] is Q=0, the refractive index of the cured material at a wavelength of 589 nm is 1.476, which may reduce the loss when connected to a near-infrared single-mode quartz fiber, but the 1% weight loss temperature of the cured material is below 285°C, which also does not provide sufficient reflow soldering resistance.

[0483] Industrial availability

[0484] The optical waveguides manufactured according to this method have excellent microfabrication properties and heat resistance, and can reduce connection loss caused by reflection at the fiber / waveguide interface.

[0485] Therefore, the organopolysiloxanes in the two embodiments of the present invention are useful as forming materials for near-infrared optical waveguides. Furthermore, from the viewpoints of optical properties, heat resistance, and photolithographic patterning, their use as optical adhesives in optical waveguides connected to non-quartz optical fibers with a core material refractive index of approximately 1.4 to 1.5, and in the connection portion between the optical waveguide and the optical fiber, is also expected.

[0486] Explanation of reference numerals in the attached figures

[0487] 10: Substrate;

[0488] 20: Lower cladding;

[0489] 30: Upper cladding;

[0490] 40: core.

Claims

1. An organopolysiloxane, represented by the following general formula [1], (R 1 R 2 R 3 SiO 1 / 2 ) M1 (R 4 R 5 R 6 SiO 1 / 2 ) M2 (R 7 R 8 SiO 2 / 2 ) D1 (R 9 R 6 SiO 2 / 2 ) D2 (R 10 SiO 3 / 2 ) T1 (R 6 SiO 3 / 2 ) T2 (SiO 4 / 2 ) Q (O 1 / 2 R 11 ) Y1 (O 1 / 2 R 6 ) Y2 [1] In the aforementioned formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms. R 1 ~R 3 R 7 R 8 R 10 and R 11 Does not contain polymeric alkenyl groups. R 6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other. 0≤M1,D1,T1,Y1,Y2, 0<Q、 0 <M2+D2+T2≤0.25、 0.05<Y1、 M1+M2+D1+D2+T1+T2+Q=1.

2. A non-linear organopolysiloxane, represented by the following general formula [21], and without an aromatic structure, (R 2-1 R 2-2 R 2-3 SiO 1 / 2 ) M1 (R 2-4 R 2-5 R 2-6 SiO 1 / 2 ) M2 (R 2-7 R 2-8 SiO 2 / 2 ) D1 (R 2-9 R 2-6 SiO 2 / 2 ) D2 (R 2-10 SiO 3 / 2 ) T1 (R 2-6 SiO 3 / 2 ) T2 (SiO 4 / 2 ) Q1 (O 1 / 2 R 2-11 ) Y1 (O 1 / 2 R 2-6 ) Y2 [21] In the aforementioned formula [21], R 2-1 ~R 2-5 R 2-7 ~R 2-11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms. R 2-1 ~R 2-3 R 2-7 R 2-8 R 2-10 and R 2-11 Does not contain polymeric alkenyl groups. R 2-6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other. 0≤M1,D1,T1,Y1,Y2, 0 <M2+D2+T2≤0.25、 0.05<Y1、 M1+M2+D1+D2+T1+T2+Q=1.

3. The organopolysiloxane according to claim 1 or 2, wherein, In the aforementioned formula [1] or formula [21], 0.12 <M2+D2+T2≤0.25。 4. The organopolysiloxane according to claim 1 or 2, wherein, In the aforementioned formula [1] or formula [21], Y1≤0.

25.

5. The organopolysiloxane according to claim 2, wherein, In the aforementioned formula [21], 0 <Q。 6. The organopolysiloxane according to claim 1 or 5, wherein, In the aforementioned formula [1] or formula [21], 0.04 ≤ Q.

7. The organopolysiloxane according to claim 1 or 2, wherein, In the aforementioned formula [1] or formula [21], M1+M2<0.

50.

8. The organopolysiloxane according to claim 1, which does not have an aromatic structure.

9. The organopolysiloxane according to claim 1 or 2, wherein, In the aforementioned formula [1] or formula [21], the R 6 Or R 2-6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5]. [Chemical Formula 1] In the formula, X is a divalent organic group, optionally containing a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom that is the end of X and directly bonded to silicon is a carbon atom. When X is bonded to an oxygen atom that is directly bonded to silicon, the atom that is the end of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bond.

10. The organopolysiloxane according to claim 1 or 2, wherein, The R 6 Or R 2-6 It is (meth)acryloyloxypropyl.

11. An organopolysiloxane composition comprising the organopolysiloxane according to claim 1 or 2 and at least a polymerization initiator.

12. A cured product formed by curing the organopolysiloxane composition according to claim 11.

13. A near-infrared waveguide made using the organopolysiloxane composition according to claim 11.

14. A near-infrared optical waveguide, comprising a core and a cladding, wherein, The core and the cladding are made using the organopolysiloxane composition according to claim 11.

15. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 13.

16. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 14.

17. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (i-1): A first curable polymer composition is coated on the surface of a substrate to form a first polymer layer; Step (i-2) involves irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and In step (i-3), the non-exposed areas of the partially exposed layer are removed using a solvent to form a patterned core. The first curable polymer composition is the organopolysiloxane composition according to claim 11.

18. The method for manufacturing a near-infrared optical waveguide according to claim 17, further comprising: Step (i-4): Coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and In step (i-5), the second polymer layer is cured to form the upper cladding layer.

19. The method for manufacturing a near-infrared optical waveguide according to claim 18, wherein, The second curable polymer composition is the organopolysiloxane composition according to claim 11.

20. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (ii-1): A third curable polymer composition is coated on the surface of the substrate to form a third polymer layer; Step (ii-2) involves irradiating at least one selected region in the third polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region. In step (ii-3), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core; Step (ii-4): The substrate surface and the core are coated with a fourth curable polymer composition to form a fourth polymer layer; as well as In step (ii-5), the fourth polymer layer is cured to form the upper coating. At least one of the third curable polymer composition and the fourth curable polymer composition is an organopolysiloxane composition according to claim 11.

21. The method for manufacturing a near-infrared optical waveguide according to claim 20, wherein, Both the third curable polymer composition and the fourth curable polymer composition are organopolysiloxane compositions according to claim 11.

22. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (iii-1): A fifth curable polymer composition is coated on the surface of the substrate to form a fifth polymer layer; Step (iii-2) involves curing the fifth polymer layer to form the lower cladding layer; Step (iii-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer; Step (iii-4) involves irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and In step (iii-5), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core. At least one of the fifth curable polymer composition and the sixth curable polymer composition is an organopolysiloxane composition according to claim 11.

23. The method for manufacturing a near-infrared optical waveguide according to claim 22, wherein, Both the fifth curable polymer composition and the sixth curable polymer composition are organopolysiloxane compositions according to claim 11.

24. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (iv-1): A fifth curable polymer composition is coated on the substrate surface to form a fifth polymer layer; Step (iv-2) involves curing the fifth polymer layer to form the lower cladding layer; Step (iv-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer; Step (iv-4) involves irradiating at least one selected region in the sixth polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region. Step (iv-5) involves removing the non-exposed areas of the partially exposed layer using a solvent to form a patterned core; Step (iv-6): The lower cladding and the core are coated with a seventh curable polymer composition to form a seventh polymer layer; as well as In step (iv-7), the seventh polymer layer is cured to form the upper cladding layer. At least one of the fifth, sixth, and seventh curable polymer compositions is the organopolysiloxane composition according to claim 11.

25. The method for manufacturing a near-infrared optical waveguide according to claim 24, wherein, The fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition are all organopolysiloxane compositions according to claim 11.

26. An organopolysiloxane for near-infrared optical waveguides, comprising an organic group including a polymerizable alkenyl group and a Q-unit silicon SiO2. 4 / 2 It does not have an aromatic structure.

27. The organopolysiloxane for near-infrared waveguides according to claim 26, which is represented by the following general formula [1], (R 1 R 2 R 3 SiO 1 / 2 ) M1 (R 4 R 5 R 6 SiO 1 / 2 ) M2 (R 7 R 8 SiO 2 / 2 ) D1 (R 9 R 6 SiO 2 / 2 ) D2 (R 10 SiO 3 / 2 ) T1 (R 6 SiO 3 / 2 ) T2 (SiO 4 / 2 ) Q (O 1 / 2 R 11 ) Y1 (O 1 / 2 R 6 ) Y2 [1] In the above formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms. R 1 ~R 3 R 7 R 8 R 10 and R 11 Does not contain polymeric alkenyl groups. R 6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other. 0≤M1,D1,T1,Y1,Y2, 0 <Q、0<M2+D2+T2、 M1+M2+D1+D2+T1+T2+Q=1].

28. The organopolysiloxane for near-infrared waveguides according to claim 27, wherein, In the aforementioned formula [1], 0 <M2+D2+T2≤0.25。 29. The organopolysiloxane for near-infrared waveguides according to claim 27, wherein, In the formula [1], 0.02≤Y1≤0.

25.

30. The organopolysiloxane for near-infrared optical waveguides according to claim 27, wherein, In the above formula [1], 0.04≤Q.

31. The organopolysiloxane for near-infrared waveguides according to claim 27, wherein, In the above formula [1], M1+M2<0.

50.

32. The organopolysiloxane for near-infrared waveguides according to claim 27, wherein, In the above formula [1], R 6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5]. [Chemical Formula 2] In the formula, X is a divalent organic group that optionally includes a branched structure and / or a cyclic structure. In addition, when a silicon atom is bonded to X, the atom that is the end of X and directly bonded to silicon is a carbon atom. In addition, when an oxygen atom that is directly bonded to silicon is bonded to X, the atom that is the end of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bond.

33. The organopolysiloxane for near-infrared waveguides according to claim 27, wherein, The R 6 It is (meth)acryloyloxypropyl.

34. An organopolysiloxane composition for near-infrared waveguides, comprising an organopolysiloxane for near-infrared waveguides according to any one of claims 26 to 33 and at least a polymerization initiator.

35. A cured product for near-infrared waveguides, which is cured from the organopolysiloxane composition for near-infrared waveguides according to claim 34.

36. A near-infrared waveguide made using the organopolysiloxane composition for near-infrared waveguides according to claim 34.

37. A near-infrared optical waveguide, comprising a core and a cladding, wherein, The core and the cladding are made using the organopolysiloxane composition for near-infrared waveguides according to claim 34.

38. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 36.

39. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 37.

40. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (i-1): A first curable polymer composition is coated on the surface of a substrate to form a first polymer layer; Step (i-2) involves irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and In step (i-3), the non-exposed areas of the partially exposed layer are removed using a solvent to form a patterned core. The first curable polymer composition is the organopolysiloxane composition for near-infrared waveguides according to claim 34.

41. The method for manufacturing a near-infrared optical waveguide according to claim 17, further comprising: Step (i-4): Coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and In step (i-5), the second polymer layer is cured to form the upper cladding layer.

42. The method for manufacturing a near-infrared optical waveguide according to claim 41, wherein, The second curable polymer composition is the organopolysiloxane composition for near-infrared waveguides according to claim 34.

43. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (ii-1): A third curable polymer composition is coated on the surface of the substrate to form a third polymer layer; Step (ii-2) involves irradiating at least one selected region in the third polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region. In step (ii-3), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core; Step (ii-4): The substrate surface and the core are coated with a fourth curable polymer composition to form a fourth polymer layer; as well as In step (ii-5), the fourth polymer layer is cured to form the upper coating. At least one of the third curable polymer composition and the fourth curable polymer composition is an organopolysiloxane composition for near-infrared waveguides according to claim 34.

44. The method for manufacturing a near-infrared optical waveguide according to claim 43, wherein, The third curable polymer composition and the fourth curable polymer composition are both organopolysiloxane compositions for near-infrared waveguides according to claim 34.

45. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (iii-1): A fifth curable polymer composition is coated on the surface of the substrate to form a fifth polymer layer; Step (iii-2) involves curing the fifth polymer layer to form the lower cladding layer; Step (iii-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer; Step (iii-4) involves irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and In step (iii-5), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core. At least one of the fifth curable polymer composition and the sixth curable polymer composition is an organopolysiloxane composition for near-infrared waveguides according to claim 34.

46. ​​The method for manufacturing a near-infrared optical waveguide according to claim 45, wherein, The fifth curable polymer composition and the sixth curable polymer composition are both organopolysiloxane compositions for near-infrared waveguides according to claim 34.

47. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (iv-1): A fifth curable polymer composition is coated on the substrate surface to form a fifth polymer layer; Step (iv-2) involves curing the fifth polymer layer to form the lower cladding layer; Step (iv-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer; Step (iv-4) involves irradiating at least one selected region in the sixth polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region. Step (iv-5) involves removing the non-exposed areas of the partially exposed layer using a solvent to form a patterned core; Step (iv-6): The lower cladding and the core are coated with a seventh curable polymer composition to form a seventh polymer layer; as well as In step (iv-7), the seventh polymer layer is cured to form the upper cladding layer. At least one of the fifth, sixth, and seventh curable polymer compositions is the organopolysiloxane composition for near-infrared waveguides according to claim 34.

48. The method for manufacturing a near-infrared optical waveguide according to claim 47, wherein, The fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition are all organopolysiloxane compositions for near-infrared waveguides according to claim 34.

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