COMSOL-based vehicle-mounted power amplifier temperature field simulation method and device and storage medium

Abstract

The invention discloses a COMSOL-based vehicle-mounted power amplifier temperature field simulation method and device and a storage medium. The vehicle-mounted power amplifier temperature field simulation method comprises the following steps: S110, selecting a physical field required by modeling; s120, importing a geometric model of the vehicle-mounted power amplifier, and setting material parameters; s130, environment parameters are defined; s140, setting physical fields, including setting a solid domain, a fluid domain and a heat source of the vehicle-mounted power amplifier in a solid and fluid heat transfer physical field, setting an inlet, an outlet and a fluid type in a laminar flow physical field, setting an environment temperature, a radiation direction and a radiation rate in a surface-to-surface radiation physical field, and setting a coupling relationship of fluid, heat transfer and radiation in multiple physical fields; s150, drawing a grid; and S160, calculating and outputting the temperature field distribution of the vehicle-mounted power amplifier. The device is specially used for the vehicle-mounted power amplifier, the heat dissipation performance of the vehicle-mounted power amplifier under different installation working conditions can be accurately simulated, and potential problems can be identified in the early stage of product design.

Description

Technical Field

[0001] This invention relates to a method, apparatus, and storage medium for simulating the temperature field of an in-vehicle power amplifier based on COMSOL. Background Technology

[0002] The in-vehicle power amplifier (also known as a car amplifier) ​​is a key component of the car audio system, and its performance directly affects the passenger's listening experience and driving safety. In actual car use, the power amplifier is installed in different locations, such as the dashboard, under the center armrest, under the seats, and in the trunk. These different locations result in varying degrees of convection heat dissipation, heat radiation, and ambient temperature, leading to significantly different requirements for heat dissipation performance. These factors pose a severe challenge to the amplifier's heat dissipation performance. Traditional thermal design mainly relies on experimental methods, but the diversity of influencing factors leads to lengthy testing times and complex testing procedures.

[0003] As passengers demand higher and higher auditory experiences, power amplifiers are becoming more and more numerous and powerful, resulting in higher and higher temperatures. This can easily affect the thermal stability of power amplifier performance and vehicle fire safety.

[0004] The information disclosed in the background section is only intended to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] In view of this, the present invention provides a COMSOL-based method, device and storage medium for simulating the temperature field of automotive power amplifiers, specifically designed for automotive power amplifiers. It can accurately simulate the heat dissipation performance of automotive power amplifiers under different installation conditions, identify potential problems in the early stages of product design, optimize product structure, improve product reliability, and at the same time reduce the need for physical experiments, thereby reducing R&D costs and time.

[0006] The present invention adopts the following technical solution: A COMSOL-based method for simulating the temperature field of an automotive power amplifier includes the following steps: S110. Select the physical fields required for modeling; S120. Import the geometric model of the vehicle amplifier and set the material parameters; S130, Define environment parameters; S140. Set the physical field, including setting the solid domain, fluid domain and heat source of the vehicle power amplifier in the solid and fluid heat transfer physical field, setting the inlet, outlet and fluid type in the laminar flow physical field, setting the ambient temperature, radiation direction and emissivity in the surface to surface radiation physical field, and setting the coupling relationship between fluid, heat transfer and radiation in the multi-physics field. S150, Draw the grid; S160. Calculate and output the temperature field distribution of the vehicle power amplifier.

[0007] In a preferred embodiment, in step S110, the physical field includes a solid-fluid heat transfer physical field, a laminar flow physical field, or a surface-to-surface physical field.

[0008] In a preferred embodiment, in step S120, the geometric model of the vehicle amplifier includes a vehicle amplifier model and an air domain surrounding the vehicle amplifier.

[0009] In a more preferred embodiment, the vehicle amplifier model includes a heat sink, a circuit board, and a base, the air domain having a closed boundary, and the vehicle amplifier model being enclosed within the closed boundary.

[0010] In a further preferred embodiment, the circuit board includes a substrate and a heating element disposed on the substrate, the heating element including a chip, an inductor and a switching transistor; in step S140, the chip, capacitor, inductor and switching transistor are configured as heat sources.

[0011] In a further preferred embodiment, in step S140, in the solid and fluid heat transfer physical field, the vehicle power amplifier model is set as a solid domain and the air domain is set as a fluid domain; a heat source and its heat dissipation rate are set; a convective heat transfer boundary is added, and the boundary of the air domain is set as a convective heat transfer boundary; surface-to-surface radiative heat transfer is enabled in the multiphysics field.

[0012] In a preferred embodiment, in step S130, the ambient temperature, forced convection velocity, or convective heat transfer coefficient is defined.

[0013] In a preferred embodiment, in step S160, a steady-state or transient solver is used for calculation.

[0014] In a preferred embodiment, after step S160, based on the temperature field distribution data, it is determined whether the vehicle power amplifier model meets the heat dissipation requirements. If the result is yes, the simulation ends; if the result is no, the vehicle power amplifier model is modified, and steps S120 to S160 are repeated.

[0015] The present invention also adopts the following technical solution: A temperature field simulation device for a vehicle power amplifier includes a memory and a processor. The memory stores a computer program. The device is characterized in that the processor executes the computer program to implement the temperature field simulation method for the vehicle power amplifier.

[0016] The present invention also adopts the following technical solution: A computer-readable storage medium storing a computer program that, when executed by a processor, implements the vehicle power amplifier temperature field simulation method.

[0017] The present invention adopts the above solution and has the following advantages: This invention presents a COMSOL-based temperature field simulation method for automotive power amplifiers, specifically designed for automotive power amplifiers. This method accurately simulates the heat dissipation performance of automotive power amplifiers under different installation conditions, providing a more comprehensive and efficient solution for product design and testing. Through this simulation method, potential problems can be identified in the early stages of product design, product structure can be optimized, and product reliability can be improved, while reducing the need for physical experiments and lowering R&D costs and time. Furthermore, the heat dissipation performance of automotive power amplifiers under forced convection or natural convection conditions and different ambient temperature conditions can be simulated and analyzed, aiming to improve the heat dissipation performance and reliability and stability of automotive power amplifiers under high power conditions. Attached Figure Description

[0018] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart of a method for simulating the temperature field of an on-board power amplifier according to an embodiment of the present invention.

[0020] Figure 2 This is a geometric model of a vehicle power amplifier according to an embodiment of the present invention.

[0021] Figure 3 This is a mesh model of a vehicle power amplifier according to an embodiment of the present invention.

[0022] Figure 4 This is a schematic diagram of a heat source location according to an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of the convective heat transfer boundary of an air domain according to an embodiment of the present invention.

[0024] Figure 6 This is a temperature field distribution diagram of a vehicle-mounted power amplifier according to an embodiment of the present invention. Detailed Implementation

[0025] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more readily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding the present invention, but does not constitute a limitation thereof.

[0026] This embodiment relates to a temperature field simulation method for automotive power amplifiers. This method utilizes COMSOL Multiphysics software to simulate and analyze the heat dissipation performance of automotive power amplifiers under forced convection or natural convection conditions and different ambient temperature conditions. The aim is to improve the heat dissipation performance and reliability and stability of automotive power amplifiers under high power conditions. This COMSOL-based thermal simulation method, specifically designed for automotive power amplifiers, can more accurately simulate the heat dissipation performance of automotive power amplifiers under different installation conditions, providing a more comprehensive and efficient solution for product design and testing.

[0027] Reference Figure 1 As shown, the automotive power amplifier temperature field simulation method based on COMSOL (COMSOL Multiphysics) includes: 1) obtaining a 3D model suitable for simulation based on the overall design of the automotive speaker amplifier product; 2) selecting the spatial dimension, the required physical fields for simulation, and the study type; 3) importing geometry and setting material parameters; 4) inputting environmental variables; 5) setting the physical fields; 6) drawing the mesh; 7) setting the study and performing simulation calculations; and 8) post-processing the simulation. This COMSOL-based automotive power amplifier temperature field simulation method can accurately predict the amplifier's heat dissipation performance and reliability, thereby guiding product design improvements and enhancing the product's market competitiveness. This method can identify potential problems in the early stages of product development, avoiding failures in later physical testing and reducing R&D costs and time.

[0028] Specifically, the COMSOL-based method for simulating the temperature field of automotive power amplifiers includes the following steps: S110. Select the physical fields required for modeling; S120. Import the geometric model of the vehicle amplifier and set the material parameters; S130, Define environment parameters; S140. Set the physical field, including setting the solid domain, fluid domain and heat source of the vehicle power amplifier in the solid and fluid heat transfer physical field, setting the inlet, outlet and fluid type in the laminar flow physical field, setting the ambient temperature, radiation direction and emissivity in the surface to surface radiation physical field, and setting the coupling relationship between fluid, heat transfer and radiation in the multi-physics field. S150, Draw the grid; S160. Calculate and output the temperature field distribution of the vehicle power amplifier.

[0029] In step S110, the spatial dimension is selected as three-dimensional; the physical fields required for modeling are selected (the physical fields include three physical fields: "solid and fluid heat transfer", "laminar flow", and "surface to surface radiation"); and finally, the steady-state study step or the transient study step is selected.

[0030] In step S120, a 3D graphic suitable for simulation is obtained based on the design of the vehicle-mounted amplifier, and this 3D graphic is simplified. The processed geometric model generally includes the vehicle-mounted amplifier model and an air domain surrounding the amplifier. The vehicle-mounted amplifier model includes a heat sink, a circuit board, and a base. The circuit board includes a substrate and heat-generating elements mounted on the substrate. The heat-generating elements include chips, inductors, and switching transistors (such as MOSFETs). The air domain has a closed boundary, and the vehicle-mounted amplifier model is enclosed within this closed boundary. The size of the boundary or the distance between the boundary and the vehicle-mounted amplifier model is determined empirically or obtained through simulation using COMSOL software.

[0031] In step S130, the ambient temperature and convective heat transfer coefficient are defined. Ambient temperature, forced convection velocity, and equivalent convective heat transfer coefficient can be defined as corresponding variables, parameters, or functions. Specifically, the operating conditions to be simulated are determined. For example, the forced convection velocity can be set to simulate the temperature field of the vehicle amplifier under forced convection conditions; or different ambient temperatures can be set to simulate the temperature field of the vehicle amplifier at different temperatures. The equivalent convective heat transfer coefficient reflects the amount of heat transferred per unit area per second on a surface with a temperature difference of 1°C. In this embodiment, the equivalent convective heat transfer coefficient represents the heat dissipation capacity of the outer boundary of the simulation model to infinite air. This value can be obtained empirically or through finite element analysis.

[0032] In automotive power amplifiers, chips, capacitors, inductors, and switching transistors are components that generate significant heat and are considered heat sources. In step S140, the "solid-fluid heat transfer" physical field needs to set the solid domain, fluid domain, chip heat source, capacitor heat source, inductor heat source, etc.; the "laminar flow" physical field sets the inlet, outlet, fluid type, etc.; the "surface-to-surface radiation" physical field needs to set the ambient temperature, radiation direction, emissivity, etc.; and the "multiphysics field" sets the coupling relationship between fluid, heat transfer, and radiation.

[0033] Specifically, in the solid and fluid heat transfer physics field, the vehicle power amplifier model is set as the solid domain and the air domain is set as the fluid domain; the heat source and its heat dissipation rate (i.e., the heating power of the heating element, the heat emitted per unit time) are set; convective heat transfer boundary is added, and the boundary of the air domain is set as the convective heat transfer boundary; surface-to-surface radiation heat transfer is enabled in the multiphysics field.

[0034] In step S150, note that the mesh quality is strongly correlated with the fluid and temperature field results. Therefore, the quality of the drawn mesh must be good, especially in narrow air regions, regions with high flow velocities, and regions with large temperature gradients.

[0035] In step S160, select either transient or steady-state simulation type. If transient calculation is selected, the output time step of the transient simulation needs to be set, and the time interval of the output time step should not be too large. After setting, click Calculate.

[0036] After step S160, based on the temperature field distribution data, it is determined whether the vehicle amplifier model meets the heat dissipation requirements and whether optimization or improvement is needed. If the result is yes, the simulation ends; if the result is no, the vehicle amplifier model is modified, and steps S120 to S160 are repeated until the simulation results meet expectations.

[0037] The following is a specific application example of a method for simulating the temperature field of an in-vehicle power amplifier.

[0038] Geometric drawing: Figure 2 This is a model diagram used for simulating the temperature field of a power amplifier, which includes an automotive power amplifier model 100 and an air domain 200. The automotive power amplifier model 100 includes a heat sink 101, a chip 102, etc., and the air domain 200 has a closed boundary 201, in which the automotive power amplifier model 100 is enclosed.

[0039] Establish a COMSOL simulation model: 1) Open COMSOL Multiphysics software, add spatial dimension, physics interface, and study type. In this example, the spatial dimension is 3D, the physics interface is selected as "Solid and Fluid Heat Transfer" and "Surface to Surface Radiation", and the study type is selected as Steady State.

[0040] 2) Import geometric shapes into "Geometry". If necessary, you can also process the shapes in COMSOL.

[0041] 3) Set material parameters; including the material parameters of the heat sink and PCB, specifically including the density, thermal conductivity, specific heat capacity, boundary thermal emissivity, etc. of the heat sink, PCB and the heat-generating devices on it.

[0042] 4) Define environment variables, parameters, or functions. Set the ambient temperature to 25℃ and the convective heat transfer coefficient to 8 [W / (m^2*K)] through "Global Definition -> Parameters".

[0043] 5) Set the "Solid and Fluid Heat Transfer" physics interface: ① Set air as the fluid domain and the rest as solid domains; ② The heat source heat dissipation rate is 90W: In this example, the chip heat source is as follows: Figure 4 As shown in the blue section. ③ Add "Convection Heat Transfer Boundary": In this example, the convection heat transfer boundary is as follows. Figure 5As shown in the blue section. In the "Surface to Surface Radiation" physics interface, the ambient temperature, radiation direction, and emissivity are set to 0.6; in the "Multiphysics" interface, the default settings are used, i.e., "Surface to Surface Radiation Heat Transfer" is enabled.

[0044] 6) Draw the mesh. In this example, the mesh is divided as follows: Figure 3 As shown.

[0045] 7) Solution and Post-processing a) In “Study -> Steady State”, use the default solver settings, display the initial values, and check whether the initial values ​​of the model are reasonable.

[0046] b) Click Calculate.

[0047] After the calculation is completed, the simulation results are post-processed to output the temperature field distribution at each location. The temperature field distribution of the heat sink is shown below. Figure 6 As shown.

[0048] The vehicle-mounted power amplifier temperature field simulation method in this embodiment considers the fully coupled modeling of three physical fields: fluid, solid, and heat, resulting in higher accuracy and greater realism. It can simulate both forced and natural convection conditions of the vehicle-mounted power amplifier, meeting the requirements of actual testing and benchmarking. This method adds simulation details of thermal radiation, taking into account its influence. Furthermore, it includes modeling of the convective heat transfer boundary (the boundary of the air domain), improving computational efficiency.

[0049] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the function involved, as will be understood by those skilled in the art to which embodiments of this application pertain.

[0050] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0051] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0052] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0053] The storage media mentioned above can be read-only memory, disk, or optical disk, etc.

[0054] As indicated in this specification and claims, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0055] It can be further understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar.

[0056] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0057] The above embodiments are only for illustrating the technical concept and features of the present invention, and are preferred embodiments. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the scope of protection of the present invention.

Claims

1. A method for simulating the temperature field of an automotive power amplifier based on COMSOL, characterized in that, Includes the following steps: S110. Select the physical fields required for modeling; S120. Import the geometric model of the vehicle amplifier and set the material parameters; S130, Define environment parameters; S140. Set the physical field, including setting the solid domain, fluid domain and heat source of the vehicle power amplifier in the solid and fluid heat transfer physical field, setting the inlet, outlet and fluid type in the laminar flow physical field, setting the ambient temperature, radiation direction and emissivity in the surface to surface radiation physical field, and setting the coupling relationship between fluid, heat transfer and radiation in the multi-physics field. S150, Draw the grid; S160. Calculate and output the temperature field distribution of the vehicle power amplifier.

2. The vehicle-mounted power amplifier temperature field simulation method according to claim 1, characterized in that, In step S110, the physical field includes a solid-fluid heat transfer physical field, a laminar flow physical field, or a surface-to-surface physical field.

3. The vehicle-mounted power amplifier temperature field simulation method according to claim 1, characterized in that, In step S120, the geometric model of the vehicle power amplifier includes a vehicle power amplifier model and an air domain surrounding the vehicle power amplifier.

4. The vehicle-mounted power amplifier temperature field simulation method according to claim 3, characterized in that, The vehicle amplifier model includes a heat sink, a circuit board, and a base shell. The air domain has a closed boundary, and the vehicle amplifier model is enclosed within the closed boundary.

5. The vehicle-mounted power amplifier temperature field simulation method according to claim 4, characterized in that, The circuit board includes a substrate and a heating element disposed on the substrate. The heating element includes a chip, a capacitor, an inductor, and a switching transistor. In step S140, the chip, inductor, and switching transistor are set as heat sources.

6. The vehicle-mounted power amplifier temperature field simulation method according to claim 3, characterized in that, In step S140, in the solid and fluid heat transfer physical field, the vehicle power amplifier model is set as a solid domain and the air domain is set as a fluid domain; a heat source and its heat dissipation rate are set; a convective heat transfer boundary is added, and the boundary of the air domain is set as a convective heat transfer boundary; surface-to-surface radiative heat transfer is enabled in the multiphysics field.

7. The method for simulating the temperature field of an on-board power amplifier according to claim 1, characterized in that, In step S130, the ambient temperature, forced convection velocity, or convective heat transfer coefficient are defined.

8. The method for simulating the temperature field of an on-board power amplifier according to claim 1, characterized in that, In step S160, a steady-state or transient solver is used for calculation; After step S160, based on the temperature field distribution data, it is determined whether the vehicle power amplifier model meets the heat dissipation requirements. If the result is yes, the simulation ends; if the result is no, the vehicle power amplifier model is modified, and steps S120 to S160 are repeated.

9. A temperature field simulation device for an in-vehicle power amplifier, comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the vehicle power amplifier temperature field simulation method as described in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the vehicle power amplifier temperature field simulation method as described in any one of claims 1 to 8.

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