Optimization method of vehicle-mounted power amplifier, electronic equipment and storage medium
By establishing a mesh model of the vehicle power amplifier and performing parametric scanning, the positions of the heat sink fins and heat source are optimized, solving the problem of high cost and time-consuming heat dissipation optimization in existing technologies, and realizing fast and accurate heat dissipation performance simulation and product design optimization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUZHOU SONAVOX ELECTRONICS CO LTD
- Filing Date
- 2025-12-29
- Publication Date
- 2026-04-24
AI Technical Summary
Existing technologies require a large number of verification samples and experiments when searching for the optimal heat dissipation factors for automotive power amplifiers, which is costly and time-consuming, and cannot meet the requirements of the R&D cycle.
A mesh model of the vehicle power amplifier was established and parametrically scanned to optimize variables such as heat sink fin height, thickness, spacing, or heat source location. The optimal solution was quickly found through simulation analysis using finite element simulation software.
It achieves efficient and accurate simulation of heat dissipation performance, reduces physical experiments, lowers R&D costs and time, and improves product reliability.
Smart Images
Figure CN121919985A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an optimization method for a vehicle power amplifier, an electronic device, and a storage medium. Background Technology
[0002] The in-vehicle power amplifier (also known as a car amplifier) is a key component of the car audio system, and its performance directly affects the passenger's listening experience and driving safety. As passengers' demands for a superior listening experience increase, amplifiers are becoming more feature-rich, with higher power outputs and consequently higher temperatures, posing a significant risk to the amplifier's thermal stability and vehicle fire safety. Therefore, the thermal design requirements and precision of in-vehicle amplifier products are becoming increasingly stringent.
[0003] Automotive power amplifiers typically consist of a heat sink, circuit board, and chassis. The heat sink and chassis are assembled together, with the chassis enclosing the circuit board within the heat sink. Factors such as the shape, size, and spacing of the heat sink fins, the chip placement, the shape and size of the heat-conducting pillars within the heat sink, the thickness of the thermal gel, and the height and size of the chassis bumps all significantly impact the overall heat dissipation performance of the automotive power amplifier. Optimizing these influencing factors and finding their optimal solutions is an urgent need. Finding these optimal solutions through experimentation requires creating a large number of validation samples, covering the adjustment range of every variable. The experimental scale explodes exponentially, and the experimental costs and time are unsustainable with current R&D cycles.
[0004] The information disclosed in the background section is only intended to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention
[0005] In view of this, the present invention provides an optimization method, electronic device and storage medium for vehicle power amplifiers, which can quickly find suitable structural parameters (such as the height, thickness, spacing or location of heat source of heat sink fins), making it easier for R&D personnel to find better heat dissipation paths and reducing R&D costs and time.
[0006] The present invention adopts the following technical solution: An optimization method for a vehicle-mounted power amplifier includes: establishing a mesh model of the vehicle-mounted power amplifier and performing parametric scanning to obtain the temperature field distribution of the variable to be optimized under different values, and selecting the optimal value of the variable to be optimized; wherein, when establishing the mesh model, the variable to be optimized is parametrically modeled, and the variable to be optimized includes one or more of the height, thickness, spacing of the heat dissipation fins of the vehicle-mounted power amplifier or the location of the heat source.
[0007] In a preferred embodiment, the process of parametrically modeling the variable to be optimized is as follows: add the variable to be optimized with a positional shift in the global definition, and add the shift step in the geometry.
[0008] In a more preferred embodiment, during the parameter modeling process, multiple shift values are specified for the variable to be optimized, and the shift values are referenced in the X, Y, or Z displacements.
[0009] In a preferred embodiment, the mesh model is established through the following steps: S110. Select the physical fields required for modeling; S120. Import the geometric model of the vehicle amplifier and set the material parameters; S130. Perform parametric modeling on the variables to be optimized; S140. Set the physical field, including setting the solid domain, fluid domain and heat source of the vehicle power amplifier in the solid and fluid heat transfer physical field, setting the inlet, outlet and fluid type in the laminar flow physical field, setting the ambient temperature, radiation direction and emissivity in the surface to surface radiation physical field, and setting the coupling relationship between fluid, heat transfer and radiation in the multi-physics field. S150, Draw the grid.
[0010] In a more preferred embodiment, in step S110, the physical field includes a solid-fluid heat transfer physical field, a laminar flow physical field, or a surface-to-surface physical field.
[0011] In a more preferred embodiment, in step S120, the geometric model of the vehicle power amplifier includes a vehicle power amplifier model and an air domain surrounding the vehicle power amplifier. The vehicle power amplifier model includes a heat sink, a circuit board, and a bottom shell. The air domain has a closed boundary, and the vehicle power amplifier model is surrounded within the closed boundary. The circuit board includes a substrate and a heat-generating element disposed on the substrate. The heat-generating element includes a chip, a capacitor, an inductor, and a switching transistor, and the chip, capacitor, inductor, and switching transistor are configured as heat sources.
[0012] In a more preferred embodiment, in step S140, in the solid and fluid heat transfer physical field, the vehicle power amplifier model is set as a solid domain and the air domain is set as a fluid domain; a heat source and its heat dissipation rate are set; a convective heat transfer boundary is added, and the boundary of the air domain is set as a convective heat transfer boundary; surface-to-surface radiative heat transfer is enabled in the multiphysics field.
[0013] In a preferred embodiment, if more variables need to be optimized, the next variable to be optimized is parameterized and modeled, and a parameter scan is performed to obtain the temperature field distribution of the next variable to be optimized under different values.
[0014] The present invention also adopts the following technical solution: An electronic device includes a memory and a processor, the memory storing a computer program, characterized in that the processor executes the computer program to implement the optimization method for the vehicle power amplifier.
[0015] The present invention also adopts the following technical solution: A computer-readable storage medium storing a computer program that, when executed by a processor, implements the optimization method for the vehicle-mounted power amplifier.
[0016] The present invention adopts the above solution and has the following advantages: The optimization method for vehicle-mounted power amplifiers of this invention can efficiently and accurately simulate the heat dissipation performance of various variables affecting heat dissipation performance under different values, find local optimal solutions, and provide a comprehensive and efficient solution for product design and testing. Through this optimization method, a reasonable and efficient heat dissipation path can be determined in the early stages of product design, optimizing the product structure, improving product reliability, while reducing the need for physical experiments and lowering R&D costs and time. Attached Figure Description
[0017] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a flowchart of an optimization method for a vehicle-mounted power amplifier according to an embodiment of the present invention.
[0019] Figure 2 This is a geometric model of a vehicle power amplifier according to an embodiment of the present invention.
[0020] Figure 3 This is a mesh model of a vehicle power amplifier according to an embodiment of the present invention.
[0021] Figure 4 This is a schematic diagram of the location of a large chip heat source according to an embodiment of the present invention.
[0022] Figure 5 This is a schematic diagram of the initial position of a small chip heat source according to an embodiment of the present invention.
[0023] Figure 6 This is a schematic diagram of the convective heat transfer boundary of an air domain according to an embodiment of the present invention.
[0024] Figures 7a to 7d Four temperature field distribution diagrams are generated for the simulation of optimizing the location of the heat source of the small chip according to an embodiment of the present invention. Detailed Implementation
[0025] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more readily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding the present invention, but does not constitute a limitation thereof.
[0026] This embodiment relates to an optimization method for automotive power amplifiers. In finite element simulation software, the geometry, size, and location of key components affecting the heat dissipation performance of the automotive power amplifier, such as heat sink fins and heat-generating components (heat sources) on the circuit board, are parametrically modeled. By defining parametric variables, the heat dissipation performance of the automotive power amplifier under forced convection or natural convection conditions and different ambient temperatures is simulated and analyzed. This efficiently identifies suitable design solutions to improve the heat dissipation performance and reliability and stability of the automotive power amplifier under high power conditions. Specifically, the optimization method includes: establishing a mesh model of the automotive power amplifier and performing parametric scanning to obtain the temperature field distribution of the variable to be optimized under different values, and selecting the optimal value of the variable to be optimized. Specifically, when establishing the mesh model, the variable to be optimized is parametrically modeled, and the variable to be optimized includes one or more of the following: the height, thickness, and spacing of the heat sink fins of the automotive power amplifier, or the location of the heat source.
[0027] Reference Figure 1 As shown, the optimization method for automotive power amplifiers includes the following steps: 1) Obtain a 3D model suitable for simulation based on the overall design of the automotive power amplifier, and perform geometric preprocessing on the locations requiring optimization; 2) Select the spatial dimension, the physical field required for simulation, and the study type; 3) Import the geometry and set the material parameters; 4) Perform parametric modeling on the optimization variables; 5) Set the physical field; 6) Draw the mesh; 7) Set the study and perform parametric scan calculations; 8) Read the parametric simulation results. This optimization method for automotive power amplifiers allows for the rapid identification of suitable structural shape and size parameters, comparison of the impact of each parameter on heat dissipation performance, and simulation optimization design of the product's structural shape, size, or location. This facilitates R&D personnel in finding better heat dissipation paths, reducing R&D costs and time.
[0028] The mesh model is established through the following steps: S110. Select the physical fields required for modeling; S120. Import the geometric model of the vehicle amplifier and set the material parameters; S130. Perform parametric modeling on the variables to be optimized; S140. Set the physical field, including setting the solid domain, fluid domain and heat source of the vehicle power amplifier in the solid and fluid heat transfer physical field, setting the inlet, outlet and fluid type in the laminar flow physical field, setting the ambient temperature, radiation direction and emissivity in the surface to surface radiation physical field, and setting the coupling relationship between fluid, heat transfer and radiation in the multi-physics field. S150, Draw the grid.
[0029] In step S110, the spatial dimension is selected as three-dimensional; the physical fields required for modeling are selected (the physical fields include three physical fields: "solid and fluid heat transfer", "laminar flow", and "surface to surface radiation"); and finally, the steady-state study step or the transient study step is selected.
[0030] In step S120, a 3D graphic suitable for simulation is obtained based on the vehicle amplifier design, and this 3D graphic is simplified, for example, by omitting components that have little impact on heat dissipation performance. The processed geometric model generally includes the vehicle amplifier model and an air domain surrounding the vehicle amplifier. The vehicle amplifier model includes a heat sink, circuit board, and base. The circuit board includes a substrate and heat-generating elements mounted on the substrate. The heat-generating elements include chips, inductors, and switching transistors (such as MOSFETs). The air domain has a closed boundary, and the vehicle amplifier model is enclosed within this closed boundary. The size of the boundary or the distance between the boundary and the vehicle amplifier model is determined empirically or obtained through COMSOL software simulation.
[0031] In step S130, the variable to be optimized is parametrically modeled. The variable to be optimized can be parameters such as the height, thickness, and gap of the heat sink fins, or the location of the heat source. In automotive power amplifiers, chips, capacitors, inductors, and switching transistors are components that generate significant heat and are considered heat sources. The process of parametrically modeling the variable to be optimized is as follows: add the variable to be optimized with a positional shift in the global definition, and add a shift step in the geometry. Specifically, multiple shift values can be specified for the variable to be optimized, and these shift values can be referenced in the X, Y, or Z displacements. For example, if the shift value is 2mm, then the value of the variable to be optimized (e.g., the position of the heat source in the X direction) is set to 0mm, 2mm, 4mm, 6mm, etc.
[0032] In step S130, the ambient temperature and convective heat transfer coefficient can also be defined. Ambient temperature, forced convection velocity, and equivalent convective heat transfer coefficient can be defined as corresponding variables, parameters, or functions. Specifically, the operating conditions to be simulated are determined. For example, forced convection velocity can be set to simulate the temperature field of the vehicle amplifier under forced convection conditions; or different ambient temperatures can be set to simulate the temperature field of the vehicle amplifier at different temperatures. The equivalent convective heat transfer coefficient reflects the amount of heat transferred per unit area per second on a surface with a temperature difference of 1°C. In this embodiment, the equivalent convective heat transfer coefficient represents the heat dissipation capacity of the outer boundary of the simulation model to infinite air. This value can be obtained empirically or through finite element analysis.
[0033] In step S140, the "Solid and Fluid Heat Transfer" physics field requires setting up solid domains, fluid domains, chip heat sources, capacitor heat sources, inductor heat sources, etc.; the "Laminar Flow" physics field sets up inlet, outlet, fluid type, etc.; the "Surface-to-Surface Radiation" physics field sets up ambient temperature, radiation direction, emissivity, etc.; and the "Multiphysics Field" sets up the coupling relationship between fluid, heat transfer, and radiation. Specifically, in the solid and fluid heat transfer physics field, the vehicle amplifier model is set as the solid domain, and the air domain is set as the fluid domain; the heat source and its heat dissipation rate (i.e., the heating power of the heating element, the heat emitted per unit time) are set; a convective heat transfer boundary is added, and the boundary of the air domain is set as the convective heat transfer boundary; and surface-to-surface radiation heat transfer is enabled in the multiphysics field.
[0034] In step S150, note that the mesh quality is strongly correlated with the fluid and temperature field results. Therefore, the quality of the drawn mesh must be good, especially in narrow air regions, regions with high flow velocities, and regions with large temperature gradients.
[0035] The mesh model is solved, and the post-processing output shows the temperature field distribution of the variable to be optimized under different values. Transient or steady-state simulation types can be selected. If transient calculation is selected, the output time step of the transient simulation needs to be set; the time interval of the output time step should not be too large. After setting, click Calculate.
[0036] Based on the temperature field distribution under multiple different values of the variable to be optimized, select the optimal value. For example, select the value corresponding to the temperature field distribution with the smallest maximum temperature (Tmax) as the optimal value of the variable to be optimized.
[0037] If more variables need to be optimized, then parameterize the next variable to be optimized, repeat the above steps, and perform parameter scanning to obtain the temperature field distribution of the next variable to be optimized under different values.
[0038] The following is a specific application example of a method for simulating the temperature field of an in-vehicle power amplifier.
[0039] Geometric drawing: Figure 2This is a model diagram used for simulating the temperature field of a power amplifier, which includes an in-vehicle power amplifier model 100 and an air domain 200. The in-vehicle power amplifier model 100 includes a heat sink 101, people, etc., and the air domain 200 has a closed boundary 201, in which the in-vehicle power amplifier model 100 is surrounded by the boundary 201 of the air domain 200. Figure 2 In the process, the heat source includes large chip 102 and small chip 103. There are multiple large chips 102 and one or more small chips 103.
[0040] Establish a COMSOL simulation model: (1) Open the COMSOL Multiphysics software, add the spatial dimension, physics interface and study type. In this case, the spatial dimension is 3D, the physics interface is selected as "solid and fluid heat transfer" and "surface to surface radiation", and the study type is selected as steady state.
[0041] (2) Import the processed geometric shapes (generally including heat sinks, PCB components, bottom shells, air, etc.).
[0042] (3) Set material parameters. These include parameters such as the density, thermal conductivity, specific heat capacity, and boundary thermal emissivity of the heat sink and PCB.
[0043] (4) Perform parametric modeling of the optimization variables. Add a position movement variable in the global definition and set its value to "0 [mm]". Add a "move" step to the chip in the geometry and reference the previously added movement variable in the x-displacement.
[0044] (5) Set the physical field interface for "Solid and Fluid Heat Transfer": ① Set air as the fluid domain and the rest as the solid domain. ② The heat dissipation rate of the "Large Chip Heat Source" is 20W: In this example, the large chip heat source is as follows: Figure 4 The blue section shows the heat dissipation rate of the "small chip heat source," which is 1W. In this example, the small chip heat source is as follows: Figure 5 As shown in blue; in this simulation, the positions of the eight large chips 102 relative to the heat sink 101 are fixed, while the positions of the small chips 103 are variable. The position of the small chips 103 is set as the variable to be optimized, and multiple values can be set for parameter scanning to optimize the position of the small chips 103. ③ Add "Convection Heat Transfer Boundary": In this case, the convection heat transfer boundary is as follows Figure 6 As shown in the blue section. In the "Surface to Surface Radiation" physics interface, the ambient temperature, radiation direction, and emissivity are set to 0.6; in the "Multiphysics" interface, the default settings are used, i.e., "Surface to Surface Radiation Heat Transfer" is enabled.
[0045] (6) Draw the mesh. In this example, the mesh is divided as follows: Figure 3 As shown.
[0046] (7) Set up the study and perform parametric scan calculation. Add a "parametric scan" to the study. In the parametric scan settings, select the previously defined position movement variable and set the corresponding scan type. If the scan type is not appropriate, it will cause a calculation error.
[0047] In "Study -> Steady State", use the default solver settings, display the initial values, and check whether the initial values of the model are reasonable.
[0048] Click to calculate.
[0049] (8) After the calculation is complete, read the parametric scan results. For example... Figures 7a to 7d The image shows the temperature field distribution of the small chip at four different locations. From... Figures 7a to 7d As can be seen, when the chip is positioned at point 0, the maximum temperature of the entire temperature field is 141.5℃, which is lower than the maximum temperature of the temperature field at the other three positions. Therefore, the optimal position of the chip is... Figure 7a The indicated position is "0".
[0050] If more variables or values need to be optimized, repeat the above steps until the simulation results meet expectations. For example, if you need to optimize the position of one of the large chips, fix the position of the small chip at 0, set different values for the position of the large chip to be optimized, and repeat the above steps to determine the optimal position for that large chip.
[0051] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the function involved, as will be understood by those skilled in the art to which embodiments of this application pertain.
[0052] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.
[0053] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.
[0054] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.
[0055] The storage media mentioned above can be read-only memory, disk, or optical disk, etc.
[0056] As indicated in this specification and claims, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, and these steps and elements do not constitute an exclusive list, as the method or apparatus may also include other steps or elements.
[0057] It can be further understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar.
[0058] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.
[0059] The above embodiments are only for illustrating the technical concept and features of the present invention, and are preferred embodiments. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the scope of protection of the present invention.
Claims
1. An optimization method for a vehicle-mounted power amplifier, characterized in that, include: A mesh model of the vehicle power amplifier is established and parametrically scanned to obtain the temperature field distribution of the variable to be optimized under different values, and the optimal value of the variable to be optimized is selected. In the process of establishing the mesh model, the variable to be optimized is parametrically modeled, and the variable to be optimized includes one or more of the following: the height, thickness, spacing of the heat sink fins of the vehicle power amplifier, or the location of the heat source.
2. The optimization method according to claim 1, characterized in that, The process of parametrically modeling the variable to be optimized is as follows: add the variable to be optimized with position movement in the global definition, and add the movement step in the geometry.
3. The optimization method according to claim 2, characterized in that, During parametric modeling, multiple shift values are specified for the variable to be optimized, and these shift values are referenced in the X, Y, or Z displacements.
4. The optimization method according to any one of claims 1 to 3, characterized in that, The mesh model is established through the following steps: S110. Select the physical fields required for modeling; S120. Import the geometric model of the vehicle amplifier and set the material parameters; S130. Perform parametric modeling on the variables to be optimized; S140. Set the physical field, including setting the solid domain, fluid domain and heat source of the vehicle power amplifier in the solid and fluid heat transfer physical field, setting the inlet, outlet and fluid type in the laminar flow physical field, setting the ambient temperature, radiation direction and emissivity in the surface to surface radiation physical field, and setting the coupling relationship between fluid, heat transfer and radiation in the multi-physics field. S150, Draw the grid.
5. The vehicle-mounted power amplifier temperature field simulation method according to claim 4, characterized in that, In step S110, the physical field includes a solid-fluid heat transfer physical field, a laminar flow physical field, or a surface-to-surface physical field.
6. The vehicle-mounted power amplifier temperature field simulation method according to claim 4, characterized in that, In step S120, the geometric model of the vehicle power amplifier includes a vehicle power amplifier model and an air domain surrounding the vehicle power amplifier. The vehicle power amplifier model includes a heat sink, a circuit board, and a bottom shell. The air domain has a closed boundary, and the vehicle power amplifier model is surrounded within the closed boundary. The circuit board includes a substrate and a heat-generating element disposed on the substrate. The heat-generating element includes a chip, a capacitor, an inductor, and a switching transistor, and the chip, capacitor, inductor, and switching transistor are set as heat sources.
7. The vehicle-mounted power amplifier temperature field simulation method according to claim 6, characterized in that, In step S140, in the solid and fluid heat transfer physical field, the vehicle power amplifier model is set as a solid domain and the air domain is set as a fluid domain; a heat source and its heat dissipation rate are set; a convective heat transfer boundary is added, and the boundary of the air domain is set as a convective heat transfer boundary; surface-to-surface radiative heat transfer is enabled in the multiphysics field.
8. The optimization method according to claim 1, characterized in that, If more variables need to be optimized, then parameterize the next variable to be optimized and perform a parameter scan to obtain the temperature field distribution of the next variable to be optimized under different values.
9. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the optimization method for the vehicle power amplifier as described in any one of claims 1 to 8.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the optimization method for the vehicle power amplifier as described in any one of claims 1 to 8.