Light-emitting module and manufacturing method thereof
By setting transparent pads and color conversion layers on LED chips and covering the sides with opaque layers, the problem of difficult control of the amount of light-shielding adhesive injected was solved, achieving high color purity and brightness of multi-color LEDs and improving product yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HONGLI ZHIHUI GRP CO LTD
- Filing Date
- 2025-12-31
- Publication Date
- 2026-04-24
AI Technical Summary
When injecting light-shielding adhesive into existing multi-color LED products, it is difficult to simultaneously avoid the problem of the adhesive spreading to the front of the chip and blocking light emission, as well as light leakage from the sides of the chip, which affects the color purity and brightness of the product.
A transparent pad and a color conversion layer are placed on the LED chip, and an opaque layer is used to cover the side of the chip. The transparent pad balances the height difference of the chip, ensuring the amount of coating and the light-blocking effect. An adhesive layer is used to protect the color conversion layer and prevent overflow from affecting the color purity.
It improves the color purity and brightness of multi-color LEDs, enhances light-shielding and reflective effects, and improves product yield.
Smart Images
Figure CN121924922A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of LED lighting technology, specifically to a light-emitting module and its manufacturing method. Background Technology
[0002] LED is a common light source device. With the rapid development of LED technology, it is widely used in displays and lighting.
[0003] Currently, to meet customer requirements for luminous efficacy, color rendering index, and other optical parameters, it is necessary to use multiple LEDs of different colors for light mixing, with RGBW four-color LED mixing being the most common. There are generally two structural forms for these different colored LEDs: one is to directly utilize flip-chip illumination, and the other is to use flip-chip to excite a phosphor layer before illumination. When both structural forms are present in a multi-color LED product, some LEDs will have their top surfaces exposed. To avoid side light leakage, these multi-color LED products typically inject light-shielding adhesive around the LEDs. However, due to the exposed top surfaces, controlling the amount of adhesive injected is difficult. Too much adhesive will creep onto the exposed chip, blocking the front light emission, while too little will not prevent side light leakage. Therefore, how to ensure the correct amount of adhesive injected without affecting the front light emission of the chip has become a pressing technical problem for those skilled in the art. Summary of the Invention
[0004] To address the aforementioned technical problems, this application provides a light-emitting module and its manufacturing method, which improves the yield and performance of the light-emitting module.
[0005] To solve the above-mentioned technical problems, the light-emitting module provided in this application includes: substrate(100); The light-emitting unit (300) includes at least four light-emitting elements arranged at intervals on the substrate (100). Each light-emitting element includes an LED chip. Some of the light-emitting elements also include a transparent spacer located on the corresponding LED chip, and other light-emitting elements also include a color conversion layer located on the corresponding LED chip; and, An opaque layer (600) is located on the substrate (100) and is disposed around each of the light-emitting elements, the opaque layer (600) covering the side of each of the LED chips.
[0006] Optionally, in some of the light-emitting elements, an adhesive layer comprising a color conversion material is further provided between the LED chip and the color conversion layer.
[0007] Optionally, the opaque layer (600) also covers at least a portion of the side surface of the transparent pad, and / or the opaque layer (600) also covers at least a portion of the side surface of the color conversion layer.
[0008] Optionally, the area of the transparent pad is 90% to 150% of the area of the corresponding LED chip.
[0009] Optionally, the top surface of each of the light-emitting elements is flush.
[0010] Optionally, a cover plate (700) is also included, which is located on the light-emitting part (300).
[0011] Optionally, the light-emitting part (300) includes four light-emitting elements, which are arranged in an array on the substrate (100). The four light-emitting elements include a first LED chip (210) and three second LED chips (220). The first LED chip (210) and the second LED chips (220) emit light of different colors. A portion of the second LED chips (220) is provided with the color conversion layer. The first LED chip (210) and a portion of the second LED chips (220) are provided with the transparent pad.
[0012] Optionally, the first LED chip (210) includes a red LED chip, the second LED chip (220) includes a blue LED chip, the first LED chip (210) and the second LED chip (220) are provided with the transparent pad, the color conversion layer on the second LED chip (220) includes a green light conversion layer, and the color conversion layer on the second LED chip (220) includes a white light conversion layer.
[0013] Optionally, the transparent gasket may be made of glass, and the color conversion layer may be a plastic sheet with a color conversion material.
[0014] Optionally, there are multiple light-emitting parts (300), which are arranged at intervals on the substrate (100).
[0015] Based on another aspect of this application, a method for manufacturing a light-emitting module is also provided, comprising: At least four LED chips are arranged at intervals on the substrate (100); A transparent pad is disposed on a portion of the LED chips, and a color conversion layer is disposed on another portion of the LED chips to form at least four light-emitting elements, the at least four light-emitting elements serving as light-emitting parts (300). An opaque layer (600) is formed on the substrate (100), the opaque layer (600) is disposed around the light-emitting element, and the opaque layer (600) covers the side of each of the LED chips.
[0016] In summary, this application provides a light-emitting module and a method for manufacturing the same. The light-emitting module includes: a substrate; a light-emitting part, which includes at least four light-emitting elements arranged at intervals on the substrate, each light-emitting element including an LED chip, a portion of the light-emitting elements including a transparent pad on the corresponding LED chip, and another portion of the light-emitting elements including a color conversion layer on the corresponding LED chip; and an opaque layer located on the substrate and surrounding the light-emitting elements, the opaque layer covering the sides of each LED chip. In this application, transparent pads are placed on LED chips that do not require a color conversion layer, and the height difference between the surface of each transparent pad and the surface of each color conversion layer is minimized. This is equivalent to raising the surface of the LED chips (light-emitting components) that do not require a color conversion layer, balancing (leveling) the height difference between the surfaces (top surfaces of the light-emitting components) of the four LED chips. This reduces the height difference between the surfaces of each LED chip (top surfaces of the light-emitting components), making it easy to prevent the opaque layer from overflowing onto the transparent pad surface and affecting product yield during the spraying of the opaque layer. It also increases the amount of opaque layer sprayed (dispensed), ensuring that the opaque layer not only completely covers the sides of each LED chip, preventing light leakage from the sides of the LED chips that could affect color purity, but also fully utilizing the light-shielding and reflective effects of the opaque layer to improve the color purity and brightness of multi-color LEDs. Alternatively, a color conversion layer can be attached to the corresponding LED chip using an adhesive layer containing color conversion material, with transparent pads protecting (covering) the remaining adjacent LED chips. This prevents the adhesive layer containing color conversion material from overflowing onto adjacent LED chips and affecting the color purity of the emitted light, thereby improving product yield. Attached Figure Description
[0017] Figure 1 This is a top view of the light-emitting module provided in an embodiment of this application.
[0018] Figure 2 Provided for the embodiments of this application Figure 1 A cross-sectional view along the dotted line.
[0019] Figure 3 A top view of a light-emitting module provided in an embodiment of this application.
[0020] Figure 4 A flowchart illustrating the manufacturing method of the light-emitting module provided in this application embodiment.
[0021] Figure 5 This is a schematic diagram of four LED chips arranged in a grid pattern, as provided in an embodiment of this application.
[0022] Figure 6 A CAD schematic diagram of four LED chips arranged in a grid pattern, provided for an embodiment of this application.
[0023] Figure 7 This is a schematic diagram showing the setup of the first and second transparent gaskets according to an embodiment of this application.
[0024] Figure 8 This is a CAD diagram showing the setup of the first and second transparent gaskets, provided for an embodiment of this application.
[0025] Figure 9 This is a schematic diagram showing the formation of the first color conversion layer and the second color conversion layer, provided in an embodiment of this application.
[0026] Figure 10 This is a CAD schematic diagram showing the formation of the first color conversion layer and the second color conversion layer, provided in an embodiment of this application.
[0027] In the attached figures: 100 - substrate; 210 - first LED chip; 220 - second LED chip; 300 - light-emitting part; 310 - first light-emitting element; 320 - second light-emitting element; 330 - third light-emitting element; 340 - fourth light-emitting element; 410 - first transparent gasket; 420 - second transparent gasket; 510 - first color conversion layer; 520 - second color conversion layer; 501 - adhesive layer with color conversion material; 600 - opaque layer; 700 - cover plate. Detailed Implementation
[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0029] Figure 1 This is a top view schematic diagram of the light-emitting module provided in the embodiments of this application. Figure 2 Provided for the embodiments of this application Figure 1 A cross-sectional view along the dotted line. (See diagram.) Figure 1 and Figure 2 As shown, the light-emitting module provided in this application embodiment includes a substrate 100, a light-emitting part 300, at least four light-emitting elements (first light-emitting elements 310-340), LED chips (first LED chip 210 and second LED chip 220), transparent gaskets (first transparent gasket 410 and second transparent gasket 420), color conversion layers (first color conversion layer 510 and second color conversion layer 520), opaque layer 600, and cover plate 700.
[0030] The substrate 100 (e.g., a PCB board) may have pads and circuit traces. Four light-emitting elements are fixedly spaced on the substrate 100 and electrically connected to the corresponding pads and circuit traces on the substrate 100. Each light-emitting element includes an LED chip located on the substrate 100. Some light-emitting elements also include a transparent spacer on the corresponding LED chip, and other light-emitting elements also include a color conversion layer on the corresponding LED chip. The top surface of each light-emitting element is flush. Specifically, as shown... Figure 1 and Figure 2 In the example, the light-emitting part 300 of the light-emitting module may include four light-emitting elements. The first light-emitting element 310, the second light-emitting element 320, the third light-emitting element 330, and the fourth light-emitting element 340 are fixed on the substrate 100 in an array (a grid-like arrangement). The first light-emitting element 310 includes a first LED chip and a first transparent pad arranged in sequence. The second light-emitting element 320 includes a second LED chip and a second transparent pad arranged in sequence. The third light-emitting element 330 includes a second LED chip and a first color conversion layer arranged in sequence. The fourth light-emitting element 340 includes a second LED chip and a second color conversion layer arranged in sequence. It should be noted that this application does not limit the number and arrangement of the light-emitting elements in the light-emitting part 300 on the substrate.
[0031] Please continue to refer to Figure 1 and Figure 2 A first LED chip and three second LED chips are fixed on the substrate 100 in a crisscross pattern and electrically connected to corresponding pads and circuit traces on the substrate 100. In some examples, at least some of the LED chips are electrically connected to the pads on the substrate 100 in a flip-chip manner. In other examples, at least some of the LED chips are electrically connected to the pads on the substrate 100 by bonding wires. It is understood that the four LED chips on the substrate 100 may also be arranged in a non-strict (non-uniform, asymmetrical) array, for example, the spacing between at least some of the four LED chips may be different, or the size of at least one of the four LED chips may be different from the others.
[0032] Please refer to Figure 2A first transparent pad 410 is located on the first LED chip 210, and a second transparent pad 420 is located on a second LED chip 220 to one side of the first LED chip 210. The first transparent pad 410 can be fixed to the first LED chip 210, and the second transparent pad 420 can be fixed to the second LED chip 220 by a transparent adhesive layer (e.g., transparent silicone). A first color conversion layer 510 is located on the second LED chip 220 close to the first LED chip 210, and can be fixed to the corresponding second LED chip 220 by an adhesive layer with a corresponding color conversion material. A second color conversion layer 520 is located on the second LED chip 220 away from the first LED chip 210, and can be fixed to the corresponding second LED chip 220 by an adhesive layer with a corresponding color conversion material. The color temperature deviation of the color conversion layers can be flexibly adjusted by using adhesive layers.
[0033] It should be specifically noted that, given the different thicknesses of the transparent adhesive layer beneath the first transparent pad 410 and the second transparent pad 420 and the adhesive layer 501 with color conversion material, as well as the different thicknesses of the first LED chip and the second LED chip themselves, this embodiment can, based on the aforementioned differences in the thickness of the adhesive layers, the differences in the thickness of the different LED chips, and the thickness of the color conversion layer, set the first transparent pad 410 and the second transparent pad 420 with appropriate thicknesses to ensure that the top surfaces of the first light-emitting element 310, the second light-emitting element 320, the third light-emitting element 330, and the fourth light-emitting element 340 are flush (the height difference between the top surfaces of any two light-emitting elements is less than or equal to 100 micrometers). It is understood that, since the transparent adhesive layer beneath the first transparent pad 410 and the second transparent pad 420 does not contain color conversion material, the thickness of the transparent adhesive layer is less than that of the adhesive layer 501 with color conversion material, and the thickness of the first transparent pad 410 and the second transparent pad 420 is greater than the thickness of the first color conversion layer 510 and the second color conversion layer 520.
[0034] The shape and size of each transparent pad and each color conversion layer can be matched with the shape and size of the corresponding LED chip. For example, each transparent pad and each LED chip can be rectangular. For example, the area of the first transparent pad 410 and the second transparent pad 420 can be 90% to 150% of the corresponding area of the corresponding LED chip. The area of the first color conversion layer 510 and the second color conversion layer 520 can be 100% to 150% of the corresponding size of the corresponding LED chip. The edges of each transparent pad and each color conversion layer facing other LED chips (inward) are aligned with the edges of the LED chips below them. The edges of each transparent pad and each color conversion layer away from other LED chips (outward) are aligned with or extend beyond the edges of the LED chips below them. The first transparent gasket 410 and the second transparent gasket 420 can be made of any transparent rigid or flexible material, such as, but not limited to, glass sheets, sapphire sheets, plastic films, etc. The first color conversion layer 510 and the second color conversion layer 520 can include a substrate and a color conversion material disposed in or on the surface of the substrate. The color conversion material can be a fluorescent material or a quantum dot material corresponding to the color light. The substrate can be a suitable rigid or flexible material.
[0035] In such Figure 1 and Figure 2 In some examples, the first LED chip 210 can be a red LED chip, emitting red light when its corresponding area is lit, i.e., the first light-emitting element 310 serves as the red light region. The second LED chip 220 can be a blue LED chip, with one second LED chip 220 adjacent to the first LED chip 210 used to emit blue light in subsequent multi-color LEDs, serving as the blue light region, i.e., the second light-emitting element 320 serves as the blue light region. The first color conversion layer 510 can be a green light conversion layer (e.g., a green phosphor or a green quantum dot layer), located on another second LED chip 220 adjacent to the first LED chip 210. The third light-emitting element 330 serves as the green light region, which is used to emit green light in subsequent multi-color LEDs. The second color conversion layer 520 can be a white phosphor (such as a yellow phosphor or a combination of other phosphors). The white phosphor is located on a second LED chip 220 that is diagonally opposite (far away, remaining) to the first LED chip 210 and is used to emit white light in subsequent multi-color LEDs. The fourth light-emitting element 340 serves as the white light region. The materials of the first transparent gasket 410 and the second transparent gasket 420 may include glass (i.e., glass sheet). The substrates of the first color conversion layer 510 and the second color conversion layer 520 may include plastic (plastic film).
[0036] Please continue to refer to Figure 1 and Figure 2The opaque layer 600 can be a light-shielding adhesive (such as light-shielding white adhesive) that covers the sides of each LED chip. On one hand, the opaque layer 600 can serve as a light-shielding part, blocking light from escaping from the side of the light-emitting element and preventing mutual interference. In particular, covering the side of the blue LED chip can prevent blue light leakage caused by side leakage, thereby improving the color purity of multi-color LEDs. For example, it is beneficial to make the color temperature of white light reach 3000K and DUV≥0.02 (hue leaning towards warm colors). On the other hand, the opaque layer 600 can also serve as a reflective part, used to reflect light incident on the side and improve light output efficiency. Moreover, the opaque layer 600 can also extend upward to cover at least part of the sides of each transparent pad and each color conversion layer, which can further improve its light-shielding and reflection effects on the side while ensuring that blue light leakage is avoided. In this embodiment, the top surface of the opaque layer 600 is located between the highest and lowest top surfaces of each light-emitting element, ensuring that the opaque layer 600 completely covers the sides of each LED chip. While covering a portion of the sides of each transparent pad and each color conversion layer, the opaque layer 600 prevents it from overflowing onto the surface of each transparent pad. Furthermore, in some other embodiments, while ensuring that the opaque layer 600 completely covers the sides of each LED chip, the area of the opaque layer 600 covering the sides of each transparent pad and each color conversion layer can be minimized to increase the light-emitting angle of the light-emitting elements in the light-emitting section 300.
[0037] In addition, such as Figure 2 As shown, a cover plate 700 may also be provided on the first transparent gasket 410, the second transparent gasket 420, the first color conversion layer 510 and the second color conversion layer 520 (i.e. the light-emitting part 300). The cover plate 700 is adhered to each transparent gasket and each color conversion layer by using a transparent adhesive layer, so that the cover plate 700 completely covers and seals each light-emitting component, and is used to protect the light-emitting module.
[0038] Figure 3 This is a top view of a light-emitting module provided as an embodiment of this application. Figure 3 As shown, the light-emitting part 300 can be used as a light-emitting unit. The substrate 100 of the light-emitting module may include a plurality of light-emitting parts 300 arranged in an array. The specific details of each light-emitting part 300 can be referred to the above embodiment.
[0039] This application also provides a method for manufacturing a light-emitting module. Figure 4 A flowchart illustrating a method for manufacturing a light-emitting module provided in an embodiment of this application. Figure 4 As shown, the manufacturing method of the light-emitting module provided in this application embodiment includes: S100: At least four LED chips are arranged at intervals on the substrate; S200: A transparent pad is provided on a portion of the LED chips, and a color conversion layer is provided on another portion of the LED chips to form at least four light-emitting elements, wherein the at least four light-emitting elements serve as light-emitting parts; S300: An opaque layer is formed on the substrate, the opaque layer is disposed around the light-emitting element, and the opaque layer covers the side of each of the LED chips.
[0040] First, such as Figure 5 As shown, in step S100, at least four LED chips are arranged at intervals on the substrate.
[0041] The substrate 100 (e.g., a PCB board) may have pads and circuit traces. A first LED chip 210 and three second LED chips 220 are fixed to the substrate 100 in an array (a crisscross arrangement), and the first LED chip 210 and the three second LED chips 220 are electrically connected to the corresponding pads and circuit traces on the substrate 100. In some examples, at least some of the LED chips are electrically connected to the pads on the substrate 100 in a flip-chip manner. In other examples, at least some of the LED chips are electrically connected to the pads on the substrate 100 using bonding wires.
[0042] Figure 6 A CAD schematic diagram of four LED chips arranged in a grid pattern, provided for an embodiment of this application. Figure 5 and Figure 6 As shown, the first LED chip 210 can be a red LED chip (emitting red light after being lit), and its corresponding area can be a red light area (i.e., the first light-emitting element 310). The second LED chip 220 can be a blue LED chip (emitting blue light after being lit). One second LED chip 220 adjacent to the first LED chip 210 is used to emit blue light in the subsequent multi-color LED, and its corresponding area can be a blue light area (i.e., the second light-emitting element 320). Another second LED chip 220 adjacent to the first LED chip 210 is used to emit green light in the subsequent multi-color LED, and its corresponding area can be a green light area (i.e., the third light-emitting element 330). A second LED chip 220 diagonally opposite (far away from, remaining) to the first LED chip 210 is used to emit white light in the subsequent multi-color LED, and its corresponding area can be a white light area (i.e., the fourth light-emitting element 340). The surface edges of the first LED chip 210 and the diagonally opposite second LED chip 220 are each provided with three bonding wires for electrical lead-out.
[0043] It is understandable that the four LED chips on the substrate 100 may also be arranged in a non-strict (non-uniform, asymmetrical) grid pattern (array shape), for example, the spacing between at least some of the four LED chips may be different, or the size of at least one of the four LED chips may be different from the others.
[0044] Next, as Figures 7-10 As shown, in step S200, a transparent pad is placed on a portion of the LED chips, and a color conversion layer is placed on another portion of the LED chips to form at least four light-emitting elements, and the top surface of each light-emitting element is flush with the top surface.
[0045] like Figure 7 As shown, a first transparent gasket 410 is disposed on the first LED chip 210, and a second transparent gasket 420 is disposed on a second LED chip 220 on one side of the first LED chip 210. A transparent adhesive layer (such as transparent silicone or transparent film) can be used to attach the first transparent gasket 410 to the first LED chip 210 for emitting red light in the subsequent light-emitting module as a red light area (first light-emitting element 310). The second transparent gasket 420 is attached to a second LED chip 220 adjacent to the first LED chip 210 for emitting blue light in the subsequent multi-color LED as a blue light area (second light-emitting element 320). The shape of the first transparent pad 410 can match the shape of the first LED chip 210, and the shape of the second transparent pad 420 can match the shape of the second LED chip 220, for example, both being rectangular. The areas of the first transparent pad 410 and the second transparent pad 420 can be set according to requirements. For example, the edges of the first transparent pad 410 and the second transparent pad 420 facing other LED chips (inward) are aligned with the edges of the LED chips below them, and the area of the first transparent pad 410 is 90% to 150% of the corresponding area of the first LED chip 210, and the area of the second transparent pad 420 is 90% to 150% of the corresponding area of the second LED chip 220. The first transparent pad 410 and the second transparent pad 420 can be made of any transparent rigid or flexible material, such as, but not limited to, glass sheets, sapphire sheets, plastic films, etc.
[0046] It should be noted that the thicknesses of the first transparent pad 410 and the second transparent pad 420 can be determined based on the thicknesses of the first LED chip 210 and the second LED chip 220, as well as the thicknesses of the color conversion layer and adhesive layer on subsequent LED chips, so that the top surfaces of the subsequent light-emitting elements are flush or substantially flush (the height difference between the top surfaces of any two light-emitting elements is less than or equal to 100 micrometers). For example, since the first LED chip 210 and the second LED chip 220 have different thicknesses, by setting first transparent pads 410 and second transparent pads 420 of different thicknesses, the top surfaces of the first transparent pad 410 and the second transparent pad 420 are made flush.
[0047] Figure 8 This is a CAD diagram illustrating the setup of the first transparent gasket 410 and the second transparent gasket 420, as provided in an embodiment of this application. Figure 7 and Figure 8 As shown, each side of the second transparent pad 420 is aligned with each side of the corresponding second LED chip 220. The two sides of the first transparent pad 410 facing the LED chip are aligned with the two sides of the corresponding first LED chip 210. The side of the first transparent pad 410 near the bonding wire extends outward beyond the light-emitting area of the first LED chip 210, and tries to avoid interference with the bonding wire (not covering the bonding area). The other edge of the first transparent pad 410 is aligned with or extends beyond the edge of the corresponding first LED chip 210.
[0048] like Figure 9As shown, the first color conversion layer 510 is attached to a second LED chip 220 using an adhesive layer with a corresponding color conversion material to form the third light-emitting element 330. The second color conversion layer 520 is attached to the remaining second LED chip 220 using an adhesive layer with a corresponding color conversion material to form the fourth light-emitting element 340. The surfaces of the first color conversion layer 510, the second color conversion layer 520, the first transparent pad 410, and the second transparent pad 420 are flush, that is, the top surfaces of each light-emitting element are flush (the height difference between the top surfaces of any two light-emitting elements is less than or equal to 100 micrometers). The first color conversion layer 510 can be a green light conversion layer, such as a green phosphor layer or a green quantum dot layer, which emits green light when excited by blue light. The second color conversion layer 520 can be a white light conversion layer, such as a yellow phosphor or a combination of other phosphors, which emits light when excited by blue light and mixes with the passing blue light to become white light. An adhesive layer 501 with a color conversion material (e.g., silicone) is disposed between the second LED chip and the color conversion layer. The color temperature deviation of the color conversion layer can be flexibly adjusted by the adhesive layer with the color conversion material. Since the surfaces of the adjacent first LED chip 210 and second LED chip 220 are attached with the first transparent gasket 410 and the second transparent gasket 420 and the surface is relatively high, the adhesive layer can be prevented from overflowing onto the surfaces of the adjacent first LED chip 210 and second LED chip 220.
[0049] The shapes of the first color conversion layer 510 and the second color conversion layer 520 can match the shape of the corresponding second LED chip 220, for example, both being rectangular. The areas of the first color conversion layer 510 and the second color conversion layer 520 can be set according to requirements, and the areas of the first color conversion layer 510 and the second color conversion layer 520 can be 100% to 150% of the area of the corresponding second LED chip 220. For example, ... Figure 8 As shown, the edges of the first color conversion layer 510 and the second color conversion layer 520 facing other LED chips (inward) can be aligned with the edge of the second LED chip 220 below them, and the edges of the first color conversion layer 510 and the second color conversion layer 520 away from other LED chips (outward) can extend beyond the edge of the second LED chip 220 below them.
[0050] Figure 10 This is a CAD schematic diagram showing the formation of the first color conversion layer 510 and the second color conversion layer 520, as provided in an embodiment of this application. Figure 9 and Figure 10As shown, the two sides of the first color conversion layer 510 facing the LED chip are aligned with the two sides of the corresponding second LED chip 220. The two sides of the first color conversion layer 510 away from the LED chip extend beyond the two sides of the corresponding second LED chip 220, that is, the area of the first color conversion layer 510 is larger than the area of the corresponding second LED chip 220. The two sides of the second color conversion layer 520 facing the LED chip are aligned with the two sides of the corresponding second LED chip 220. The side of the second color conversion layer 520 near the bonding wire extends outward beyond the light-emitting area of the second LED chip 220, and tries to avoid interference with the bonding wire (not covering the bonding area). The other edge of the second color conversion layer 520 is aligned with or extends beyond the edge of the corresponding second LED chip 220.
[0051] Next, as Figure 1 As shown, in step S300, an opaque layer 600 is formed on the substrate 100. The opaque layer 600 surrounds the light-emitting element and covers the sides of each LED chip.
[0052] The opaque layer 600 covers the sides of each LED chip, serving two purposes: firstly, as a light-shielding element to block light from escaping from the sides and preventing mutual interference, particularly covering the sides of blue LED chips to prevent blue light leakage and thus improve the color purity of multi-color LEDs; secondly, as a reflective element to reflect light incident on the sides, improving light extraction efficiency. Furthermore, the opaque layer 600 extends upwards to cover at least part of the sides of each transparent pad and each color conversion layer, further enhancing its light-shielding and reflective effects while ensuring blue light leakage is avoided. The top surface of the opaque layer 600 is located between the highest and lowest top surfaces of each light-emitting element, ensuring complete coverage of the sides of each LED chip while preventing the opaque layer 600 from overflowing onto the surface of each transparent pad. In addition, in some other embodiments, while ensuring that the opaque layer 600 completely covers the sides of each LED chip, the area of the opaque layer 600 covering the sides of each transparent pad and each color conversion layer can be minimized to increase the light emission angle of the light-emitting element in the light-emitting part.
[0053] Figure 1 This is a top view schematic diagram showing the formation of the opaque layer 600 according to an embodiment of this application. Figure 1In the example shown, the opaque layer 600 can be a light-shielding adhesive (e.g., light-shielding white glue). When the light-shielding adhesive is applied around each LED chip on the substrate 100, the adhesive spreads evenly outward from the point of application under the action of surface tension and molecular diffusion. The surface area gradually increases and the thickness gradually decreases, thereby covering the sides of each LED chip. The height of each light-emitting component can be controlled by controlling the amount of white glue sprayed. In this application, by setting a first transparent pad 410 and a second transparent pad 420 on the first LED chip 210 and the second LED chip 220 that do not require a color conversion layer, it is equivalent to raising the surface of the first LED chip 210 and the second LED chip 220 that do not require a color conversion layer, balancing (leveling) the height difference of the surfaces of the four LED chips (light-emitting elements), so that the top surfaces of each light-emitting element are flush. This makes it easy to avoid the opaque layer overflowing onto the surface of the transparent pad when spraying the opaque layer, which would affect the product yield. It can also increase the amount of light-shielding adhesive sprayed (dispensing amount), so that the light-shielding adhesive not only completely covers the sides of each LED chip, avoiding the color purity caused by light leakage from the sides of the LED chips, but also partially covers the sides of each transparent pad and each color conversion layer. This ensures that while completely covering the sides of each LED chip, the light-shielding adhesive fully exerts its light-shielding and reflective effects to improve color purity and brightness.
[0054] In summary, this application provides a light-emitting module and a method for manufacturing the same. The light-emitting module includes: a substrate; a light-emitting part, which includes at least four light-emitting elements arranged at intervals on the substrate, each light-emitting element including an LED chip, a portion of the light-emitting elements including a transparent pad on the corresponding LED chip, and another portion of the light-emitting elements including a color conversion layer on the corresponding LED chip; and an opaque layer located on the substrate and surrounding the light-emitting elements, the opaque layer covering the sides of each LED chip. In this application, transparent pads are placed on LED chips that do not require a color conversion layer, and the height difference between the surface of each transparent pad and the surface of each color conversion layer is minimized. This is equivalent to raising the surface of the LED chips (light-emitting components) that do not require a color conversion layer, balancing (leveling) the height difference between the surfaces (top surfaces of the light-emitting components) of the four LED chips. This reduces the height difference between the surfaces of each LED chip (top surfaces of the light-emitting components), making it easy to prevent the opaque layer from overflowing onto the transparent pad surface and affecting product yield during the spraying of the opaque layer. It also increases the amount of opaque layer sprayed (dispensed), ensuring that the opaque layer not only completely covers the sides of each LED chip, preventing light leakage from the sides of the LED chips that could affect color purity, but also fully utilizing the light-shielding and reflective effects of the opaque layer to improve the color purity and brightness of multi-color LEDs. Alternatively, a color conversion layer can be attached to the corresponding LED chip using an adhesive layer containing color conversion material, with transparent pads protecting (covering) the remaining adjacent LED chips. This prevents the adhesive layer containing color conversion material from overflowing onto adjacent LED chips and affecting the color purity of the emitted light, thereby improving product yield.
[0055] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A light-emitting module, characterized in that, include: substrate(100); The light-emitting unit (300) includes at least four light-emitting elements arranged at intervals on the substrate (100). Each light-emitting element includes an LED chip. Some of the light-emitting elements also include a transparent spacer located on the corresponding LED chip, and other light-emitting elements also include a color conversion layer located on the corresponding LED chip; and, An opaque layer (600) is located on the substrate (100) and is disposed around each of the light-emitting elements, the opaque layer (600) covering the side of each of the LED chips.
2. The light-emitting module according to claim 1, characterized in that, In some of the light-emitting components, an adhesive layer comprising a color conversion material is further provided between the LED chip and the color conversion layer.
3. The light-emitting module according to claim 1, characterized in that, The opaque layer (600) also covers at least a portion of the side surface of the transparent pad, and / or the opaque layer (600) also covers at least a portion of the side surface of the color conversion layer.
4. The light-emitting module according to claim 1, characterized in that, The area of the transparent pad is 90% to 150% of the area of the corresponding LED chip.
5. The light-emitting module according to claim 1, characterized in that, The top surface of each of the light-emitting elements is flush.
6. The light-emitting module according to claim 1, characterized in that, It also includes a cover plate (700) located on the light-emitting part (300).
7. The light-emitting module according to any one of claims 1 to 6, characterized in that, The light-emitting part (300) includes four light-emitting elements, which are arranged in an array on the substrate (100). The four light-emitting elements include a first LED chip (210) and three second LED chips (220). The first LED chip (210) and the second LED chips (220) emit light of different colors. A color conversion layer is provided on a portion of the second LED chips (220). The transparent pad is provided on the first LED chip (210) and a portion of the second LED chips (220).
8. The light-emitting module according to claim 7, characterized in that, The first LED chip (210) includes a red LED chip, the second LED chip (220) includes a blue LED chip, the first LED chip (210) and the second LED chip (220) are provided with the transparent pad, the color conversion layer on the second LED chip (220) includes a green light conversion layer, and the color conversion layer on the second LED chip (220) includes a white light conversion layer.
9. The light-emitting module according to claim 8, characterized in that, The transparent pad is made of glass, and the color conversion layer is a plastic sheet with a color conversion material.
10. The light-emitting module according to claim 1, characterized in that, There are multiple light-emitting parts (300), and the light-emitting parts (300) are arranged at intervals on the substrate (100).
11. A method for manufacturing a light-emitting module, characterized in that, include: At least four LED chips are arranged at intervals on the substrate (100); A transparent pad is disposed on a portion of the LED chips, and a color conversion layer is disposed on another portion of the LED chips to form at least four light-emitting elements, the at least four light-emitting elements serving as light-emitting parts (300). An opaque layer (600) is formed on the substrate (100), the opaque layer (600) is disposed around the light-emitting element, and the opaque layer (600) covers the side of each of the LED chips.