Substrate processing apparatus and substrate processing method

Abstract

The invention provides a substrate processing apparatus and a substrate processing method capable of increasing heat when heating a substrate. The substrate processing apparatus includes: a processing container; a substrate support unit which is provided inside the processing container and supports a substrate; and a heating unit that heats the substrate supported by the substrate support unit. The heating unit includes a heating wire that transmits radiant heat to the surroundings during heating, and a lens member provided at a position adjacent to the heating wire. The lens member is disposed between the substrate supporting portion and the heating wire so that the radiant heat is directed in the direction in which the substrate is located, and / or the lens member is disposed between the processing container and the heating wire so that the radiant heat is directed in the direction orthogonal to the surface of the processing container.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] Patent Document 1 discloses a substrate processing apparatus (heat treatment apparatus) that includes a rotating stage supporting multiple substrates inside a vacuum container. A processing gas is supplied while the rotating stage rotates (revolves) to form a film on the surface of each substrate. The substrate processing apparatus has a heating section (heater) on the back side of the rotating stage for heating each substrate. The heating section is constructed by concentrically arranging multiple heating elements, such as carbon filament heaters.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 6464785 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] This invention provides a technique that can increase the heat generated when heating a substrate.

[0008] Technical means for solving technical problems

[0009] According to one aspect of the present invention, a substrate processing apparatus is provided, comprising: a processing container; a substrate support portion disposed inside the processing container for supporting a substrate; and a heating portion for heating the substrate supported on the substrate support portion, the heating portion including a heating wire that transmits radiant heat to the surroundings during heating, and a lens member disposed adjacent to the heating wire, the lens member being disposed between the substrate support portion and the heating wire to direct the radiant heat toward the direction of the substrate, and / or, the lens member being disposed between the processing container and the heating wire to direct the radiant heat toward a direction orthogonal to the surface of the processing container.

[0010] Invention Effects

[0011] One method can increase the heat generated when heating the substrate. Attached Figure Description

[0012] Figure 1 This is a cross-sectional view that schematically illustrates the substrate processing apparatus of an embodiment.

[0013] Figure 2 It is a top view that roughly shows the interior of the processing container of the substrate processing device.

[0014] Figure 3It is a partial cross-sectional view of the concentric circular processing container along the rotating stage, which includes the raw material gas nozzle, the first separation gas nozzle, and the reaction gas nozzle.

[0015] Figure 4 It is a three-dimensional cross-sectional view showing the rotary table and the heating element.

[0016] Figure 5 It is a cross-sectional view showing the structure near the outer periphery of the rotary table.

[0017] Figure 6 It is a magnified cross-sectional view of the lens component.

[0018] Figure 7 This is a flowchart illustrating the processing flow of the substrate processing method.

[0019] Figure 8 This is a cross-sectional view that roughly represents the heating section of the first modified example.

[0020] Figure 9 This is a magnified view of the heating wire and lens component in the second modified example.

[0021] Figure 10 This is a magnified view of the heating wire and lens component of the third modified example. Detailed Implementation

[0022] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the same reference numerals are sometimes used to refer to the same structural parts, and repeated descriptions are omitted.

[0023] <Structure of the substrate processing device 100>

[0024] like Figure 1 and Figure 2 As shown, the substrate processing apparatus 100 of the embodiment performs substrate processing by forming a film on the surface of a substrate W using atomic layer deposition (ALD) or molecular layer deposition (MLD). The substrate processing apparatus 100 includes a processing container 1 capable of housing the substrate W, and a substrate support, i.e., a rotary table 2, inside the processing container 1 to support the substrate W in a manner that allows it to rotate.

[0025] The processing container 1 is formed as a flattened cylindrical shape with a processing chamber inside. For example, the processing container 1 is assembled from a container body 12 with an opening on its upper surface and a top plate 11 that closes the opening of the container body 12. Furthermore, in Figure 2 For ease of explanation, the illustration of the top plate 11 has been omitted.

[0026] The container body 12 includes a circular plate-shaped bottom 14 and a side portion 13 that protrudes vertically upward from the outer edge of the bottom 14. The upper end of the side portion 13 of the container body 12 is airtightly fixed to the top plate 11, for example, via a sealing member 15 such as an O-ring.

[0027] The rotating platform 2 is formed in an annular shape, with its inner circumference fixed to a cylindrical core 21. The rotating platform 2 is made of transparent quartz. The core 21 is fixed to the upper end of a rotating shaft 22 extending vertically. The rotating shaft 22 passes through the bottom 14 of the processing container 1, and its lower end is held by a drive unit 23. The drive unit 23 causes the rotating shaft 22 to rotate about its axis. Thus, the rotating platform 2 rotates about the center of the processing container 1 via the rotating shaft 22 and the core 21.

[0028] The rotating shaft 22 and the drive unit 23 are housed within a cylindrical housing 20 with an opening on its upper surface. The housing 20 is hermetically fixed to the bottom 14 of the processing container 1 via a flange at its upper end. Therefore, the internal space of the housing 20 is isolated from the outside of the housing 20 and communicates with the processing chamber of the processing container 1.

[0029] like Figure 2 As shown, multiple ( ) are arranged on the upper surface of the rotary table 2 along the rotation direction of the rotary table 2. Figure 2 Five circular mounting recesses 24 (mounting portions) are provided for mounting the substrate W. Examples of semiconductor wafers, such as silicon semiconductors, compound semiconductors, or oxide semiconductors, can be used as the substrate W for substrate processing. The substrate W may have recesses such as trenches and vias on its surface.

[0030] The mounting recess 24 has an inner diameter slightly larger than the diameter of the substrate W (e.g., 300 mm) and a depth approximately equal to the thickness of the substrate W. Thus, when the substrate W is placed in the mounting recess 24, the area on the upper surface of the rotary table 2 where the substrate W is not mounted is at approximately the same height as the upper surface of the substrate W.

[0031] Furthermore, the substrate processing apparatus 100 includes a gas supply section 30 for supplying gas to the interior of the processing container 1. The gas supply section 30 is formed of quartz, for example, and includes a plurality of gas nozzles 30N extending in a straight line. The inlet 30a of each gas nozzle 30N, serving as its root end, is fixed to the side 13 of the processing container 1 and extends radially along the processing container 1 to near the center. Each gas nozzle 30N extends parallel to the upper surface of the rotary table 2 within the processing chamber. Each gas nozzle 30N has a plurality of gas outlet holes 30h (see also) that open vertically downward toward the rotary table 2. Figure 3 Each gas outlet 30h is arranged at equal intervals along the axial direction (radial direction of processing container 1).

[0032] The gas supply unit 30 includes a raw material gas supply unit 31 for supplying raw material gas, a reaction gas supply unit 32 for supplying reaction gas, and a first separation gas supply unit 34 and a second separation gas supply unit 35 for supplying separation gas. Furthermore, the raw material gas supply unit 31, the reaction gas supply unit 32, the first separation gas supply unit 34, and the second separation gas supply unit 35 each include one raw material gas nozzle 31N, one reaction gas nozzle 32N, one first separation gas nozzle 34N, and one second separation gas nozzle 35N. However, the number of gas nozzles 30N is not particularly limited, and multiple nozzles may be included. In the illustrated example, the processing container 1 has the second separation gas nozzle 35N, the raw material gas nozzle 31N, the first separation gas nozzle 34N, and the reaction gas nozzle 32N arranged clockwise from the delivery port 16 located on the side 13.

[0033] The raw material gas supply unit 31 connects the raw material gas supply path to the inlet 30a of the raw material gas nozzle 31N, which protrudes from the outside of the processing container 1. The raw material gas supply path, for supplying raw material gas to the raw material gas nozzle 31N, includes a raw material gas supply source (not shown), an on / off valve, a flow regulator, etc. Regarding the raw material gas supplied from the raw material gas supply unit 31 to the processing chamber, an appropriate gas can be selected based on the type of film to be formed on the substrate W. For example, if a titanium film is to be formed on the substrate W, a titanium-containing gas is supplied as the raw material gas.

[0034] The reaction gas supply unit 32 connects the reaction gas supply path to the inlet 30a of the reaction gas nozzle 32N, which protrudes from the outside of the processing container 1. To supply reaction gas to the reaction gas nozzle 32N, the reaction gas supply path includes a reaction gas supply source (not shown), an on / off valve, a flow regulator, etc. Regarding the reaction gas supplied from the reaction gas supply unit 32 to the processing chamber, an appropriate gas can be selected depending on the type of film to be formed on the substrate W. For example, in the case of oxidizing a titanium film attached to the substrate W, an oxygen-containing gas is supplied as the reaction gas.

[0035] The first separation gas supply unit 34 connects the separation gas supply path to the inlet 30a of the first separation gas nozzle 34N, which protrudes from the outside of the processing container 1. To supply separation gas to the first separation gas nozzle 34N, the first separation gas supply path includes a separation gas supply source (not shown), an on / off valve, a flow regulator, etc. The second separation gas supply unit 35 connects the separation gas supply path to the inlet 30a of the second separation gas nozzle 35N, which protrudes from the outside of the processing container 1. To supply separation gas to the second separation gas nozzle 35N, the second separation gas supply path includes a separation gas supply source (not shown), an on / off valve, a flow regulator, etc. Regarding the separation gas supplied by the first separation gas supply unit 34 and the second separation gas supply unit 35, appropriate gases can be selected from rare gases such as argon (Ar) and helium (He), and inactive gases such as nitrogen (N2).

[0036] In addition, the processing container 1 has two protrusions 4 along the circumferential direction inside. The protrusions 4 have a generally fan-shaped planar shape that is cut into an arc shape. In the embodiment, they are configured such that the inner arc is connected to the protrusion 5 described later, and the outer arc runs along the inner circumferential surface of the side portion 13 of the processing container 1.

[0037] like Figure 3 As shown, the protrusion 4 is mounted on the lower surface of the top plate 11. Therefore, within the processing container 1, there is a flat and low top surface 46 that serves as the lower surface of the protrusion 4, and a top surface 47 located on both circumferential sides of the top surface 46 that is higher than the top surface 46.

[0038] A groove 4a extending radially along the rotary table 2 is formed in the convex portion 4. A first separating gas nozzle 34N is housed in this groove 4a. Similarly, a groove 4a is formed in another convex portion 4, and a second separating gas nozzle 35N (see reference 2) is housed in this groove 4a. Figure 2 ).

[0039] exist Figure 3 In the substrate W, a raw material gas nozzle 31N is provided in the space 481 on the right side of the convex portion 4 (the space below the vertical direction of the high top surface 47). A reaction gas nozzle 32N is provided in the space 482 on the left side of the convex portion 4 (the space below the vertical direction of the high top surface 47). These gas nozzles 30N are provided near the substrate W at intervals from the top surface 47.

[0040] On the other hand, the lower top surface 46 forms a narrow space, namely the separation space H, relative to the rotating stage 2. Since the volume of the separation space H is smaller than that of spaces 481 and 482, when nitrogen (the separation gas) is supplied from the first separation gas nozzle 34N, the pressure in the separation space H can be made higher than the pressures in spaces 481 and 482. Thus, the separation space H forms a pressure barrier between spaces 481 and 482. Furthermore, the nitrogen flowing from the separation space H into spaces 481 and 482 acts as a countercurrent flow between the feed gas and the reactant gas. Therefore, the feed gas and the reactant gas are separated by the separation space H, preventing them from mixing and reacting.

[0041] Back Figure 1 and Figure 2 A protrusion 5, located on the lower surface of the top plate 11, surrounds the outer periphery of the core 21 that fixes the rotary table 2. The protrusion 5 is connected to the rotation center side of the convex part 4, and its lower surface is set to the same height as the top surface 46.

[0042] Additionally, exhaust ports 61 are formed between the rotating platform 2 and the side portion 13 of the container body 12. An exhaust pipe 63 is connected to the exhaust port 61, and the exhaust pipe 63 is connected to a vacuum pump 64, which serves as a vacuum exhaust mechanism, via a pressure regulator 65.

[0043] A heating section 7 is provided in the space between the bottom 14 of the processing container 1 and the rotating stage 2 to heat each substrate W placed on the rotating stage 2. The heating section 7 heats each substrate W to reach the target temperature set in the substrate processing scheme. The target temperature is not particularly limited, but can be in the range of about 650°C to 800°C. In particular, when a carbon filament heater is used in the heating wire 71 of the heating section 7, a large amount of radiant heat can be radiated by using a temperature of 700°C or higher. The structure of the heating section 7 will be described in detail later.

[0044] Furthermore, at the portion of the bottom 14 closer to the rotation center than the space where the heating element 7 is located, there is a protrusion 12a that protrudes from the center of the lower surface of the rotary table 2 near the core 21. This protrusion 12a forms a narrow space with the core 21. Additionally, the gap between the inner circumferential surface of the through hole of the rotation shaft 22 penetrating the bottom 14 and the rotation shaft 22 narrows, and these narrow spaces communicate with the housing 20.

[0045] Furthermore, the housing 20 is provided with a purge gas supply pipe 25 that supplies purge gas (the same gas as the separation gas supplied by the first separation gas nozzle 34N) into the narrow space. Moreover, at the bottom 14 below the heating section 7, a plurality of purge gas supply pipes 74 for purging the arrangement space of the heating section 7 are provided at appropriate intervals along the circumference.

[0046] When purge gas is supplied from the purge gas supply pipe 25, the purge gas flows through the gap between the inner circumferential surface of the through hole of the rotating shaft 22 and the rotating shaft 22, and the gap between the protrusion 12a and the core 21, in the space between the rotating table 2 and the heating unit 7, and is discharged from multiple exhaust ports 61. Additionally, when purge gas is supplied from the purge gas supply pipe 74, the purge gas flows out from the space housing the heating unit 7 through gaps (not shown) and is discharged from multiple exhaust ports 61. Through the flow of these purge gases, mixing of the raw material gas and the reactant gas in the space below the center of the processing container 1 and the space below the rotating table 2 can be suppressed.

[0047] Additionally, a separation gas supply pipe 51 is connected to the center of the top plate 11 of the processing container 1. The separation gas supply pipe 51 supplies separation gas (the same gas supplied by the first separation gas nozzle 34N) to the space between the top plate 11 and the core 21. The separation gas supplied to this space flows along the surface of the rotating table 2 through the narrow space between the protrusion 5 and the rotating table 2. The space near the center of the protrusion 5 and the rotating table 2 is maintained at a higher pressure by the separation gas. Therefore, it is possible to prevent the raw material gas and the reactant gas from mixing as they pass through the space near the center.

[0048] And, as Figure 2 As shown, a conveying port 16 is formed on the side wall of the processing container 1 for the transfer of substrate W between the external conveying robot 16A and the rotary table 2. The conveying port 16 is opened and closed by a gate (not shown). The substrate processing apparatus 100 receives or delivers substrate W between itself and the conveying robot 16A by arranging each of the mounting recesses 24 of the rotary table 2 in a position opposite to the conveying port 16. Therefore, the substrate processing apparatus 100 has a lifting pin and a lifting mechanism (both not shown) that pass through the mounting recesses 24 to lift the substrate W from the back side adjacent to the conveying port 16 on the lower side of the rotary table 2.

[0049] The substrate processing apparatus 100 includes a control unit 90 that controls the operation of the entire apparatus. The control unit 90 is a computer having a processor, memory, input / output interfaces, and a communication interface. The processor is a combination of one or more of the following: CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), or a circuit composed of multiple discrete semiconductors. The memory includes main storage and auxiliary storage. The memory can be configured by appropriately combining volatile memory and non-volatile memory (e.g., hard disk, flash memory, optical disk, DVD (Digital Versatile Disc), etc.). In other words, in this invention, the control unit 90 is an electronic circuit having a CPU, GPU, ASIC, FPGA, etc., which executes various control actions described in this specification by executing command codes stored in the memory or by designing circuits for specific purposes.

[0050] For example, during substrate processing, the control unit 90 uses the vacuum pump 64 to depressurize the processing container 1 while controlling the heating unit 7 to heat each substrate W. Furthermore, the control unit 90 controls the rotary table 2 to rotate (revolve) each substrate W, and controls the gas supply unit 30 to supply raw material gas, reaction gas, separation gas, etc., to each area of ​​the processing container 1, thereby forming a film on each rotating substrate W. Specifically, each substrate W is coated with raw material gas ejected from the raw material gas processing space P1, which is equipped with raw material gas nozzles 31N. Then, the reaction gas ejected from the reaction gas processing space P2, which is equipped with reaction gas nozzles 32N, reacts with the raw material gas coated on the substrate W, thereby forming the desired film on each substrate W. Additionally, by supplying separation gas to the separation space H when viewed from above, the processing container 1 can separate the raw material gas processing space P1 from the reaction gas processing space P2.

[0051] <Structure of heating section 7>

[0052] Next, refer to Figure 1 , Figures 4-6The structure of the heating section 7 of the substrate processing apparatus 100 will be described below. The heating section 7 includes a plurality of heating wires 71 arranged radially along the bottom 14 of the processing container 1, a cover 72 disposed between each heating wire 71 and the rotating table 2, and an outer peripheral support portion 73 supporting the cover 72 on the outer periphery of the heating section 7. Furthermore, lens members 75 are disposed adjacent to appropriate heating wires 71 among the plurality of heating wires 71 in the heating section 7. In addition, in… Figure 4 In the accompanying diagram, cover 72 has been omitted for ease of understanding.

[0053] Each heating wire 71 is powered by a heating control module (not shown) based on instructions from the control unit 90, thereby heating itself and transferring radiant heat to its surroundings. For example, a carbon filament heater can be used as this heating wire 71. The carbon filament heater can be made of carbon fiber or graphite. However, the heating wire 71 is not limited to carbon; halogen, ceramic, or nickel-chromium heat-resistant alloy wires can also be used.

[0054] Each heating wire 71 includes a recurring straight section 71a and a curved section 71b, wherein the straight section 71a extends in a straight line over a short section above the bottom 14, and the curved section 71b is slightly curved and connects to the adjacent straight section 71a. Thus, each heating wire 71, when viewed from above, has a generally polygonal, arc-shaped overall appearance. Furthermore, each heating wire 71 is supported by a support portion 71c protruding vertically upward from the bottom 14, thereby extending approximately parallel to the upper surface of the bottom 14 at a position away from it. The ends of each heating wire 71 exposed above the bottom 14 are inserted into the bottom 14, for example, via the support portion 71c, and electrically connected to wiring (not shown) within the bottom 14. This wiring is connected to a heating control module located outside the processing container 1.

[0055] By arranging multiple arc-shaped heating wires 71 at circumferential intervals at the same radius position on the bottom 14, the heating section 7 is formed into a roughly circular shape. These roughly circular lines are then arranged in concentric circles with different radii around the bottom 14. Each concentric heating wire 71 is arranged to cross over each substrate W placed in the mounting recess 24 on the rotating table 2 in a radial direction, thereby heating each substrate W as a whole using each heating wire 71.

[0056] Alternatively, the heating unit 7 can be configured to independently heat each of the multiple regions Z1 to Z5 along the radial direction of the processing container 1 and the rotating platform 2. For example, the heating unit 7 can be divided radially outward from the center of the rotating platform 2 into the innermost region Z1, the sub-inner region Z2, the middle region Z3, the sub-outer region Z4, and the outermost region Z5. However, the number and division of regions are not particularly limited; there can be four or fewer regions, or six or more regions.

[0057] Each of the regions Z1 to Z5 is arranged in a ring with the same radius (concentrically) within the processing container 1. Each region Z1 to Z5 is heated by one or more heating wires 71. The heating wires 71 arranged in the same region Z1 form a group that receives the same electrical energy from the heating control module. The same applies to regions Z2 to Z5. By adjusting the electrical energy for each region Z1 to Z5 in this way, the heating unit 7 can improve the in-plane uniformity of the temperature of each substrate W placed on the rotary table 2.

[0058] like Figure 1 and Figure 5 As shown, the cover 72 of the heating section 7 is formed as an annular plate, positioned between the upper end of the protrusion 12a and the outer peripheral support 73. That is, each heating wire 71 of the heating section 7 is housed within a space surrounded by the bottom 14, the protrusion 12a, the cover 72, and the outer peripheral support 73. As described above, purge gas can be supplied to this space from the purge gas supply pipe 74. This prevents processing gases (raw material gas, reaction gas) from entering the space, suppressing the deterioration of the heating wires 71 and the lens component 75.

[0059] The cover 72 is preferably made of a material that has heat resistance to withstand high temperatures and transparency that allows the radiant heat from each heating wire 71 to pass through easily. For example, transparent quartz can be used as a material for the cover 72.

[0060] Furthermore, a lens component 75 is disposed on a portion of each heating wire 71 in the heating section 7. The lens component 75 is arranged to cover the top of each corresponding heating wire 71, and has the function of allowing and converging electromagnetic waves, i.e., radiant heat, emitted by the heating wire 71. The material of the lens component 75 can also be transparent quartz, similar to that of the cover 72.

[0061] The lens component 75 has a semi-circular inner circumferential surface 75a on its lower surface side opposite to the heating wire 71, and a flat surface 75b on the opposite side (upper surface side) of the semi-circular inner circumferential surface 75a. The lens component 75 is positioned close to the heating wire 71 such that the upper half of the heating wire 71 enters the space surrounded by the semi-circular inner circumferential surface 75a. For example, the lens component 75 is supported by a plurality of lens supports 76 provided on the bottom 14, thereby being positioned at uniformly spaced intervals relative to the outer circumferential surface of the heating wire 71.

[0062] Furthermore, the lens component 75 in this embodiment is formed as a multi-lens structure composed of multiple components. Specifically, the lens component 75 includes a central convergent 77 located in the central portion and a pair of lateral convergents 78 located on either side of the central convergent 77. The central convergent 77 and the pair of lateral convergents 78 have different refractive indices. For example, the refractive indices of the central convergent 77 and the pair of lateral convergents 78 are appropriately different by varying the amount or type of additives added to the quartz.

[0063] A gap C can be provided between the central converging element 77 and the pair of side converging elements 78 to separate them. For example, with respect to the lens component 75, the positional relationship between them and the gap C is maintained by having a plurality of protrusions 79 protruding from the side of either the central converging element 77 or the pair of side converging elements 78 contact the side of the other. However, the lens component 75 can change the direction of radiant heat at its boundary as long as the refractive index of the central converging element 77 is different from that of the pair of side converging elements 78, so the gap C may not be necessary. Alternatively, in a structure where the gap C is provided between the central converging element 77 and the pair of side converging elements 78, the refractive index of the central converging element 77 can be the same as that of the side converging elements 78. This is because the gap C itself can function as a boundary for changing the refractive index of radiant heat.

[0064] The central converging body 77 includes an arc-shaped heater-facing surface 771 forming the inner circumferential surface 75a in a cross-sectional view, an opposing surface 772 forming the flat surface 75b in a cross-sectional view, and a pair of inclined side surfaces 773 extending between the two ends of the heater-facing surface 771 and the two ends of the opposing surface 772. The pair of inclined side surfaces 773 are inclined in such a way that the spacing between them increases as they move from the heater-facing surface 771 toward the opposing surface 772.

[0065] Therefore, radiant heat radiated from the upper part of the heating line 71 enters the interior of the central converging body 77 through the heater-opposite surface 771. The central converging body 77 can refract the radiant heat using the heater-opposite surface 771 and a pair of inclined side surfaces 773, causing the radiant heat to exit in a direction orthogonal to the opposite surface 772 (normal direction). Thus, the radiant heat exiting from the opposite surface 772 travels in a straight line parallel to each other.

[0066] A pair of side converging bodies 78 each include an arc-shaped heater-facing surface 781 forming the inner circumferential surface 75a in a cross-sectional view, an opposite surface 782 forming the flat surface 75b in a straight line in a cross-sectional view, an inner surface 783 opposite to the inclined side surface 773 of the central converging body 77, and an outer surface 784 forming the side surface of the lens component 75. The inner surface 783 is inclined in a manner parallel to the inclined side surface 773. The outer surface 784 is slightly bulging in an arc shape and is inclined.

[0067] The lower ends of a pair of side converging bodies 78 (the boundary between the heater-facing surfaces 781 and the outer surface 784) are located at the midpoint of the vertical direction of the heating line 71. Thus, radiant heat radiated between the upper part of the heating line 71 and the midpoint of the vertical direction enters the interior from the heater-facing surfaces 781 of the pair of side converging bodies 78. The pair of side converging bodies 78 can refract the radiant heat using the outer surface 784, causing the radiant heat to exit in a direction orthogonal to the opposite surface 782 (normal direction). Therefore, the radiant heat exiting from the opposite surface 782 travels in a straight line parallel to each other.

[0068] In this way, by combining the central converging element 77 and a pair of side converging elements 78, the lens component 75 enables the radiant heat radiated from the upper half of the heating wire 71 to propagate parallel to the normal direction of the flat surface 75b. As a result, a bundle of radiant heat can be stably provided to the substrate W located on the upper vertical side of the lens component 75.

[0069] In addition, such as Figure 4 As shown, the lens component 75 is formed along the extending direction of the heating line 71 to a length corresponding to the straight portion 71a of the heating line 71. That is, the lens component 75 is arranged to overlap with the straight portion 71a of the heating line 71, but is not provided at the curved portion 71b of the heating line 71. Therefore, the lens component 75 can be simply formed as a component in which the central converging body 77 and a pair of side converging bodies 78 are continuously arranged in a straight line with the same cross-sectional shape. The heating section 7 can use multiple of these components (lens components 75) to cover most of the heating lines 71 that extend in a generally arcuate shape.

[0070] The heating section 7 has the lens component 75 provided on only a portion of the multiple heating wires 71 arranged radially at the bottom 14. Here, the substrates W placed on the rotary table 2 are affected by the rotation of the rotary table 2, the gas supply from the gas supply section 30, and the gas exhaust from the exhaust port 61 during substrate processing, resulting in uneven temperature distribution. For example, the temperature distribution may be affected by the separation gas supply pipe 51 (see reference 51). Figure 1The supplied separation gas flows into the center of the rotary table 2. Therefore, the temperature of each substrate W is prone to drop near the center of the rotary table 2. Additionally, for example, various gases discharged into the processing container 1 near the outer periphery of the rotary table 2 go to the exhaust port 61. Therefore, the temperature of each substrate W is also prone to drop near the outer periphery of the rotary table 2.

[0071] The heating unit 7 can independently adjust the temperature along the radial direction of the rotary table 2 using multiple pre-divided regions Z1 to Z5. However, in the substrate processing apparatus 100, depending on the substrate processing content such as an increase in the gas supply, simply raising the temperature of regions Z1 and Z5 above the temperature of other regions is sometimes insufficient to fully address the temperature drop of the substrate W near the center and outer periphery of the rotary table 2.

[0072] Based on this, in order to increase the heat at the center of the rotary table 2, the heating unit 7 of the embodiment is provided with lens members 75 on all the heating lines 71 in region Z1 and a portion of the heating lines 71 in region Z2. In addition, in order to increase the heat at the outer periphery of the rotary table 2, the heating unit 7 is provided with lens members 75 on a portion of the heating lines 71 in region Z4 and all the heating lines 71 in region Z5.

[0073] In particular, such as Figure 5 As shown, the heating line 71 of region Z4 is positioned to overlap with the substrate W placed on the rotary table 2 in the vertical direction. Therefore, the lens component 75 provided on the heating line 71 of region Z4 is adjusted in orientation so that the flat surface 75b is in the horizontal direction (parallel to the rotary table 2).

[0074] On the other hand, each heating wire 71 in region Z5 is positioned on the outer side of the substrate W placed on the rotary table 2 (at a position that does not overlap with the substrate W in the vertical direction). Therefore, the orientation of each lens component 75 provided on each heating wire 71 in region Z5 is adjusted such that the flat surface 75b is inclined relative to the horizontal direction. The inclination angle of the flat surface 75b relative to the horizontal direction is preferably adjusted appropriately according to its positional relationship with the substrate W. For example, in the embodiment, the inclination angle is set to 30°. As a result, the lens components 75 provided on each heating wire 71 in region Z5 can direct radiant heat to the vicinity of the outer periphery of the rotary table 2 and to the outer periphery of the substrate W.

[0075] Similarly, the lens component 75 of the heating line 71 located in region Z1 has also been adjusted in tilt angle, which allows radiant heat to be directed to the periphery of the substrate W near the center. In addition, the heating line 71 in region Z2 is positioned to overlap with the substrate W along the vertical direction, so the lens component 75 has been adjusted in orientation to make the flat surface 75b horizontal.

[0076] <Substrate Processing Methods>

[0077] The substrate processing apparatus 100 of the embodiment is basically configured as described above, and will be referred to below. Figure 7 The action (substrate processing method) is explained.

[0078] In substrate processing, the control unit 90 of the substrate processing apparatus 100 first controls the substrate processing apparatus 100 and the transport robot 16A to sequentially place the substrate W in the five placement recesses 24 of the rotary table 2 (step S101: process (A)).

[0079] Subsequently, the control unit 90 controls the vacuum pump 64 to exhaust the gas in the processing container 1, thereby reducing the pressure in the processing container 1, and controls the heating unit 7 to heat each substrate W (step S102). At this time, the temperature control module connected to each heating wire 71 supplies power to each region Z1 to Z5 according to the instructions of the control unit 90, thereby making the temperature of each substrate W consistent with the target temperature.

[0080] Then, the control unit 90 controls the drive unit 23 to make the rotary table 2 rotate (revolve) at the target speed (step S103). The substrate processing apparatus 100 also maintains the target speed of the rotary table 2 during substrate processing.

[0081] Then, the control unit 90 controls the gas supply unit 30 to supply gas (raw material gas, reaction gas, separation gas) into the processing container 1, thereby performing substrate processing on each substrate W (step S104). As a result, each substrate W rotates inside the processing container 1 while a suitable film is formed on its surface.

[0082] In this substrate processing, the heating unit 7 uses a temperature control module to control the electrical energy supplied to each heating wire 71 so that the temperature of each substrate W reaches the target temperature. At this time, the lens components 75 arranged in regions Z1, Z2, Z4, and Z5 suppress the waste of radiant heat radiated from the heating wire 71, and concentrate the radiant heat to the center of each substrate W near the rotating stage 2 and the outer periphery of each substrate W near the rotating stage 2. As a result, even if the temperature of each substrate W decreases rapidly due to the rotation of the rotating stage 2, gas flow, etc., by applying more heat from the heating unit 7 to this part, the in-plane temperature uniformity can be improved.

[0083] In addition, when performing substrate processing, the control unit 90 determines whether the substrate processing has ended (step S105). For example, the control unit 90 compares the target period set in the substrate processing scheme with the actual period of substrate processing, and determines that the substrate processing has ended based on the actual period reaching the target period.

[0084] When the control unit 90 determines that the substrate processing is complete, it performs an end-of-processing procedure to terminate the substrate processing (step S106). During the end-of-processing, the gas supply from the gas supply unit 30 is stopped, the rotation of the rotary table 2 is stopped, and the heating from the heating unit 7 is stopped. Furthermore, after the substrate processing is completed, the substrate processing apparatus 100, in cooperation with the transport robot 16A, performs the opposite action to step S101, thereby conveying each substrate W from the rotary table 2 to the outside of the processing container 1.

[0085] By providing a lens member 75 to the heating section 7, the substrate processing apparatus 100 described above can direct the radiant heat from the heating wire 71 in a desired direction. This increases the heat distribution in areas of the substrate W where the temperature is easily lowered during substrate processing. Consequently, the substrate processing apparatus 100 promotes in-plane temperature uniformity of the substrate W and improves the in-plane uniformity of the substrate processing.

[0086] Furthermore, the substrate processing apparatus 100 and substrate processing method described in the embodiments are not limited to the embodiments described above, and various modifications can be adopted. For example, the substrate processing performed by the substrate processing apparatus 100 is not limited to film formation processing. Other substrate processing methods include etching processing, cleaning processing, modification processing, and ashing processing.

[0087] Furthermore, the substrate processing apparatus 100 can be configured to only revolve around each substrate W placed on the rotary table 2, but it can also be a device that performs rotation in addition to the revolution of each substrate W. Alternatively, the substrate processing apparatus 100 can be configured to heat multiple substrates W on the rotary table 2, but it is not limited to this; it can also be a single-piece device that places one substrate W on a substrate support for substrate processing. In this case, the substrate processing apparatus can also be configured to have a heating section 7 for heating the substrate W inside the substrate support, and a lens component 75 is provided on the heating wire 71 of the heating section 7.

[0088] Furthermore, in the heating section 7, the heating wire 71 can be a curved line excluding the straight portion 71a and the curved portion 71b, and the lens component 75 is also formed as a curved and continuous component following the heating wire 71. Additionally, the lens component 75 in this embodiment is configured to be supported by a lens support 76 protruding from the bottom 14, but is not limited thereto. For example, the lens component 75 may also be supported by a support (not shown) protruding from the cover 72. Alternatively, the lens component 75 may be integrally formed with the cover 72, allowing the radiant heat from the heating wire 71 to pass through the structure of the cover 72 as well.

[0089] like Figure 8As shown in the first modified example, the heating section 7A can be configured such that lens members 75 are not provided on each heating line 71 in regions Z1 and Z5, while lens members 75 are provided on each heating line 71 in regions Z2 and Z4. In this case, the lens member 75 in region Z2 is adjusted in orientation (tilt angle) so that radiant heat is directed towards the center of the rotary table 2. Furthermore, the lens member 75 in region Z4 is adjusted in orientation (tilt angle) so that radiant heat is directed towards the outer periphery of the rotary table 2. Thus, by providing lens members 75, the heat generated near the center and outer periphery of the rotary table 2, where temperature drops are prone to occur, can be increased. By promoting temperature uniformity of the rotary table 2, the in-plane temperature uniformity of the substrate W placed on the rotary table 2 can be improved.

[0090] In summary, the lens component 75 can be disposed on any heating wire 71, such as a heating wire 71 directly below the area where heat generation is desired, or a heating wire 71 located near the area where heat generation is desired. Furthermore, by adjusting the orientation (tilt angle) of the lens component 75, the radiant heat from the heating wire 71 can be directed in an appropriate direction. For example, in areas with many heating wires 71, heat tends to increase; therefore, by distributing the radiant heat in such areas to other directions using the lens component 75, the heat in areas with many heating wires 71 can be suppressed, effectively increasing the heat in the surrounding area.

[0091] In addition, such as Figure 9 As shown in the second variation, in addition to providing a lens component 75 on the upper side of the heating wire 71 in the vertical direction, a lens component 75A may also be provided on the lower side of the heating wire 71 in the vertical direction. That is, the lens component 75A is disposed between the heating wire 71 and the bottom 14 of the container body 12.

[0092] The lens component 75A directs the radiant heat from the lower half of the heating wire 71 in a direction orthogonal to the surface direction of the bottom 14. The radiant heat is incident on the bottom 14 in this orthogonal direction, and the bottom 14 can directly reflect this radiant heat (in a way that suppresses scattering, diffuse reflection, etc.) back to the lens component 75A. The reflected radiant heat returning to the lens component 75A passes through the lens component 75A and returns to the heating wire 71. Therefore, the heat of the heating wire 71 increases, and the radiant heat is incident from the heating wire 71 onto the lens component 75 on the upper vertical direction, and exits from the flat surface 75b of the lens component 75 towards the substrate W.

[0093] In this way, by providing a lens component 75A on the lower side of the heating line 71 in the vertical direction, the heating section 7B can effectively direct the radiant heat radiated downwards in the vertical direction to the lens component 75. That is, the heating section 7B can minimize the waste of radiant heat from the heating line 71 and further increase the heat supplied to the substrate W.

[0094] In addition, such as Figure 10 As shown in the third variation, the heating section 7C can also be configured such that a lens member 75A is provided between the bottom 14 of the processing container 1 and the heating wire 71, while the lens member 75A is not provided on the upper part of the heating wire 71 in the vertical direction. In this case, as described above, the radiant heat transmitted through the lens member 75A is also reflected by the bottom 14, thereby increasing the heat of the heating wire 71 and the heat of the substrate W on the upper part of the vertical direction.

[0095] <Regarding the technical concept and effects>

[0096] The technical concept and effects of the present invention described in the above embodiments are described below.

[0097] The substrate processing apparatus 100 includes: a processing container 1; a substrate support (rotary stage 2) disposed inside the processing container 1 for supporting a substrate W; and a heating section 7 for heating the substrate W supported on the substrate support section. The heating section 7 includes a heating wire 71 that transmits radiant heat to the surroundings during heating, and lens components 75 and 75A disposed adjacent to the heating wire 71. The lens components 75 and 75A are disposed between the substrate support section and the heating wire 71 to direct the radiant heat in the direction where the substrate W is located, and / or, the lens components 75 and 75A are disposed between the processing container 1 and the heating wire 71 to direct the radiant heat in a direction orthogonal to the surface of the processing container 1.

[0098] As described above, when the substrate processing apparatus 100 heats the substrate using the heating unit 7, the heat generated during heating of the substrate W can be increased by providing lens members 75 and 75A at positions adjacent to the heating line 71. Specifically, the lens member 75, positioned between the substrate support (rotary table 2) and the heating line 71, directs radiant heat towards the substrate W, thereby increasing the heat of the substrate W. Furthermore, the lens member 75A, positioned between the processing container 1 and the heating line 71, directs radiant heat towards a direction orthogonal to the surface of the processing container 1, allowing the radiant heat to be reflected back to the heating line 71 by the processing container 1. As a result, the increased heat of the heating line 71 also increases the heat of the substrate W.

[0099] Furthermore, the lens components 75 and 75A have a central converging body 77 and a pair of side converging bodies 78 respectively disposed on both sides of the central converging body 77. In this way, by employing the dual structure of the central converging body 77 and the pair of side converging bodies 78, the lens component 75 can refract the radiant heat of the heating wire 71 in the desired direction in each converging body.

[0100] Furthermore, a gap C is provided between the central converging element 77 and the pair of side converging elements 78 to separate them. Thus, the lens components 75 and 75A can easily form shapes with different refractive indices at the boundaries between the central converging element 77 and the pair of side converging elements 78. Therefore, the lens components 75 and 75A can appropriately change the direction of radiant heat using the central converging element 77 and the pair of side converging elements 78.

[0101] Furthermore, the central converging element 77 and the pair of side converging elements 78 are formed of materials with different refractive indices. As a result, the lens components 75, 75A can properly refract radiant heat at the boundary between the central converging element 77 and the pair of side converging elements 78.

[0102] Furthermore, the lens components 75 and 75A have an inner circumferential surface (semi-circular inner circumferential surface 75a) that is opposite to the heating wire 71 and surrounds the heating wire 71 in a concentric circle, and a flat surface 75b provided on the opposite side of the inner circumferential surface. As a result, the lens components 75 and 75A can cover a portion of the heating wire 71 with their inner circumferential surfaces, which can further suppress the waste of radiant heat radiated from the heating wire 71.

[0103] Furthermore, the lens components 75 and 75A are arranged with their flat surfaces 75b inclined relative to the horizontal direction. As a result, the substrate processing apparatus 100 can cause the radiant heat from the heating wire 71 to advance obliquely from the lens component 75, and can irradiate the desired location with radiant heat.

[0104] Furthermore, the substrate support includes a rotating stage 2 that allows multiple substrates W to be rotatably supported. A heating section 7 is disposed on the lower side of the rotating stage 2 in the vertical direction, and multiple heating wires 71 are arranged in concentric circles along the radial direction of the rotating stage 2. Thus, the substrate processing apparatus 100 can stably perform substrate processing while heating all multiple substrates W using the heating section 7.

[0105] In addition, the lens component 75 is provided on the heating line 71 located on the outer periphery of the rotary table 2. As a result, the substrate processing apparatus 100 can increase the heat of the substrate W on the outer periphery of the rotary table 2, where the temperature is prone to drop, and can improve the in-plane temperature uniformity of the substrate W.

[0106] Furthermore, the lens component 75 is disposed on the heating line 71 located near the center of the rotary table 2. As a result, the substrate processing apparatus 100 can increase the heat of the substrate W near the center of the rotary table 2, where the temperature is prone to drop, and can improve the in-plane temperature uniformity of the substrate W.

[0107] Another aspect of the present invention is a substrate processing method of a substrate processing apparatus 100, which includes: a processing container 1; a substrate support (rotary stage 2) disposed inside the processing container 1 for supporting a substrate W; and a heating section 7 for heating the substrate W supported on the substrate support, the heating section 7 including: a heating wire 71 that transmits radiant heat to the surroundings during heating; and a lens member 75 disposed adjacent to the heating wire 71. The substrate processing method includes: step (A), placing the substrate W on the substrate support; and step (B), heating the heating wire 71, using the lens member 75 disposed between the substrate support and the heating wire 71 to direct the radiant heat toward the direction where the substrate W is located, and / or, using the lens member 75A disposed between the processing container 1 and the heating wire 71 to direct the radiant heat toward a direction orthogonal to the surface of the processing container 1. In this case, the substrate processing method can also increase the heat applied to the substrate W.

[0108] The substrate processing apparatus 100 and substrate processing method disclosed herein are illustrative in all respects and are not limiting. The embodiments can be modified and improved in various ways without departing from the claimed technical solution and its spirit. The items described in the above embodiments can also be configured in other ways without contradiction, and can also be combined without contradiction.

[0109] Explanation of reference numerals in the attached figures

[0110] 1. Handling Containers

[0111] 2 Rotary Table

[0112] 7 Heating section

[0113] 71 Heating Wire

[0114] 75, 75A lens components

[0115] 100 Substrate Processing Device

[0116] W substrate.

Claims

1. A substrate processing apparatus, characterized in that, include: Handling containers; A substrate support portion, disposed inside the processing container, is used to support the substrate; and A heating section for heating the substrate supported on the substrate support portion. The heating element includes a heating wire that radiates heat to the surroundings during heating, and a lens component disposed adjacent to the heating wire. The lens component is disposed between the substrate support and the heating wire, so that the radiant heat is directed in the direction of the substrate, and / or, the lens component is disposed between the processing container and the heating wire, so that the radiant heat is directed in a direction orthogonal to the surface of the processing container.

2. The substrate processing apparatus according to claim 1, characterized in that: The lens component has a central converging element and a pair of side converging elements respectively disposed on both sides of the central converging element.

3. The substrate processing apparatus according to claim 2, characterized in that: A gap is provided between the central converging body and the pair of side converging bodies to separate them.

4. The substrate processing apparatus according to claim 2, characterized in that: The central converging body and the pair of side converging bodies are formed of materials with different refractive indices.

5. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: The lens component has: The inner circumferential surface of the heating wire is opposite to and concentrically surrounds the heating wire; and A flat surface located on the opposite side of the inner circumferential surface.

6. The substrate processing apparatus according to claim 5, characterized in that: The lens component is positioned with the flat surface tilted relative to the horizontal direction.

7. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that: The substrate support includes a rotary table that supports the plurality of substrates in a manner that allows the plurality of substrates to rotate. The heating element is located on the lower side of the rotary table in the vertical direction. The heating wires are arranged in concentric circles along the radial direction of the rotating platform.

8. The substrate processing apparatus according to claim 7, characterized in that: The lens component is disposed on the heating line located on the outer periphery of the rotating stage.

9. The substrate processing apparatus according to claim 7, characterized in that: The lens component is disposed on the heating line located near the center of the rotating stage.

10. A substrate processing method of a substrate processing apparatus, characterized in that: The substrate processing apparatus includes: Handling containers; A substrate support portion, disposed inside the processing container, is used to support the substrate; and A heating section for heating the substrate supported on the substrate support portion. The heating element includes a heating wire that radiates heat to the surroundings during heating, and a lens component disposed adjacent to the heating wire. The substrate processing method includes: Step A, placing the substrate on the substrate support portion; and Step B involves heating the heating wire, using the lens component disposed between the substrate support and the heating wire to direct the radiant heat toward the direction of the substrate, and / or using the lens component disposed between the processing container and the heating wire to direct the radiant heat toward a direction orthogonal to the surface of the processing container.

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