Automatic tin coating and gold removing device for welding end of packaging component without lead at bottom

Abstract

The invention relates to the technical field of tin coating, in particular to an automatic tin coating and gold removing device for a welding end of a packaging component without a lead at the bottom. Comprising a bearing frame, a material carrying platform, a tin coating and gold removing mechanism and a preheating mechanism. The material carrying platform is connected with the bearing frame, the material carrying platform is provided with an installation groove suitable for containing components, and a groove opening of the installation groove is constructed to be of a chamfer structure so that a micro-cell structure can be defined by the installation groove and the components in the installation groove; the tin coating and gold removing mechanism is connected with the bearing frame through the linear displacement mechanism, and the tin coating and gold removing mechanism is used for injecting liquid soldering tin into the micro-pool structure and removing the liquid soldering tin in the micro-pool structure; and the preheating mechanism is connected with the tin coating and gold removing mechanism and is used for increasing the temperature of the micro-cell structure. The tinning and gold removing efficiency can be improved, and the consistency of the gold removing effect is improved to a certain extent.

Description

Technical Field

[0001] This application relates to the field of tinning technology, specifically to an automatic tinning and gold removal device for the solder ends of bottom leadless packaged components. Background Technology

[0002] In high-reliability products, tinning the leads of gold-plated components is an effective process to improve soldering reliability. Tinning involves wetting the gold layer on the component leads with liquid solder. Excessively thick gold plating will dissolve into the solder. Tinning the solder joints prevents excessive gold content from causing gold brittleness in subsequent solder joints. GJB 1150A-2017, "General Requirements for Electrical Assembly of Electronic Countermeasures Equipment," stipulates that surface-mount components with gold layers of not less than 1.27µm on their leads should have their leads and solder terminals tinned.

[0003] For leaded components, the immersion soldering method is usually used to tin the leads, which involves immersing the leads of the component into liquid solder and then taking them out to complete the tinning. However, for leadless components, there have always been problems such as difficulty in implementing the tinning process, low tinning efficiency, difficulty in cleaning the solder ends after tinning, and uneven solder ends.

[0004] Currently, leadless components can be soldered manually with a soldering iron. After soldering, desoldering tape is used to level the surface. However, this method suffers from low soldering efficiency, significant human error, and unsatisfactory leveling of the solder ends. Some soldering equipment supports soldering leadless components, but these methods involve individually clamping the components and immersing them in a solder bath, then removing the solder with a hot air knife. This method is inefficient and results in unsatisfactory leveling. Summary of the Invention

[0005] This application aims to solve at least one of the technical problems in the background art by providing an automatic soldering and gold removal device for the solder ends of bottom leadless packaged components.

[0006] This application is achieved through the following technical solution:

[0007] An automatic soldering and gold removal device for the solder ends of bottom leadless packaged components includes:

[0008] Support frame;

[0009] A loading platform is connected to the support frame. The loading platform has a mounting slot suitable for accommodating components. The opening of the mounting slot is constructed with a chamfered structure to form a micro-pool structure with the components in the mounting slot.

[0010] A tinning and gold removal mechanism is connected to the support frame via a linear displacement mechanism. The tinning and gold removal mechanism is used to inject liquid solder into the micro-pool structure and to remove liquid solder from the micro-pool structure.

[0011] A preheating mechanism, which is connected to a tinning and gold removal mechanism, is used to raise the temperature of the microcell structure.

[0012] In some optional embodiments, the tinning and gold removal mechanism includes:

[0013] A hot air hood, wherein the hot air hood is equipped with a hot air source to supply hot air into the hot air hood;

[0014] A soldering roller, which is rotatably connected to the hot air hood and located inside the hot air hood;

[0015] The desoldering roller is rotatably connected to the hot air hood and located inside the hot air hood. The desoldering roller and the tinning roller are arranged axially parallel and spaced apart.

[0016] A solder supply source is connected to and located inside the hot air hood, and is used to supply liquid solder to the soldering roller.

[0017] In some alternative embodiments, the surface of the tinning roller is coated with a silver-plated copper wire brush.

[0018] In some alternative embodiments, the surface of the detinning roller is coated with a silver-plated copper wire braid.

[0019] In some optional embodiments, a solder control mechanism is also connected inside the hot air hood, which is used to adjust the thickness of liquid solder on the surface of the soldering roller.

[0020] In some alternative embodiments, the solder control mechanism includes:

[0021] A linear translation component, which is connected to the hot air hood;

[0022] Mounting housing, which is connected to the linear translation assembly;

[0023] The solder control roller is rotatably connected to the mounting housing. The solder control roller is parallel to the axis of the soldering roller, so that under the drive of the linear translation component, the solder control roller will radially abut against or disengage from the soldering roller.

[0024] In some optional embodiments, the soldering roller and / or the solder control roller are equipped with temperature control components to control the surface temperature of the soldering roller and the solder control roller.

[0025] In some alternative embodiments, a desoldering scraper is connected to the hot air shroud, and the cutting edge of the desoldering scraper abuts against the desoldering roller.

[0026] In some alternative embodiments, the desoldering scraper is configured with a negative pressure adsorption component to adsorb liquid solder on the scraper.

[0027] In some alternative embodiments, the hot air shroud is equipped with a hot air leveling knife.

[0028] Compared with the prior art, this application has the following advantages and beneficial effects:

[0029] This application, by setting up a material loading platform with a chamfered mounting groove, can cooperate with components to form a controllable micro-pool structure, effectively accommodating and restricting the spread of liquid solder. Combined with a soldering and gold removal mechanism driven by a linear displacement mechanism, it realizes the automated operation of soldering and removing from the micro-pool, improving the efficiency and consistency of the soldering process. At the same time, the integrated preheating mechanism preheats the solder end area, improving solder wettability and reducing thermal shock. It overcomes the defects of traditional manual or single-piece tinning methods, such as low efficiency, excessive human intervention, and difficulty in controlling solder flatness. It is especially suitable for the high-quality, mass production of bottom-leadless packaged components in the soldering and gold removal process. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the exemplary embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be considered as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort. In the drawings:

[0031] Fig. 1 A schematic diagram of the automatic soldering and gold removal device for the solder ends of bottom leadless packaged components provided in this application embodiment;

[0032] Fig. 2 This is a schematic diagram of the tin-plating and gold-removing mechanism provided in an embodiment of this application;

[0033] Fig. 3 This is a partial schematic diagram of the micropool structure provided in an embodiment of this application.

[0034] The attached diagram shows the markings and corresponding component names:

[0035] 1-Support frame, 2-Material loading platform, 3-Tinning and gold removal mechanism, 31-Hot air hood, 32-Tinning roller, 33-Desoldering roller, 34-Tin supply source, 35-Mounting housing, 36-Tin control roller, 37-Desoldering scraper, 4-Preheating mechanism, 5-Linear displacement mechanism, 6-Soldering end. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this application are only for explaining this application and are not intended to limit this application.

[0037] Please refer to them together. Figs. 1-2 This application provides an automatic soldering and gold removal device for the solder ends of bottom leadless packaged components. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components includes a support frame 1, a material loading platform 2, a soldering and gold removal mechanism 3, and a preheating mechanism 4.

[0038] The support frame 1 includes a support platform and a top support beam. The support platform has a support plane, and there is a gap between the support plane and the top support beam. The overall shape of the support platform is roughly a cuboid, which means that the support plane is a rectangular plane. The support beam and the support plane can be connected by columns.

[0039] The loading platform 2 is connected to the support frame 1. Specifically, the loading platform 2 is fixedly or detachably connected to the support plane. The loading platform 2 is a cuboid in shape. One surface of the loading platform 2 has an installation groove. The shape of the installation groove is not specifically limited and can be designed adaptably according to the shape of the actual component. For example, it can be a square groove, a round groove, a triangular groove, an irregular groove, or other polygonal groove. The number of installation grooves can be one or more. When there are multiple installation grooves, the shapes of each installation groove can be the same or different. The groove opening of the installation groove is constructed as a chamfered structure to form a micro-pool structure with the component in the installation groove. That is, after the component is placed in the installation groove, a basically sealed state is formed between the component and the groove wall. The component is flush with the lower edge of the chamfered structure, which means that the aforementioned micro-pool structure is a conical shape that is larger at the top and smaller at the bottom.

[0040] The tinning and gold removal mechanism 3 is connected to the support frame 1 via the linear displacement mechanism 5. Specifically, the tinning and gold removal mechanism 3 is connected to the top support beam of the support frame 1 via the linear displacement mechanism 5. The tinning and gold removal mechanism 3 is suspended in the air. The tinning and gold removal mechanism 3 is used to inject liquid solder into the micro-pool structure and to remove liquid solder from the micro-pool structure. This means that under the drive of the linear displacement mechanism 5, the tinning and gold removal mechanism 3 can cross over the material loading platform 2. The tinning and gold removal mechanism 3 can perform tinning and gold removal operations through contact or non-contact. Under normal circumstances, the tinning and gold removal mechanism 3 uses contact to perform tinning and gold removal operations to ensure the quality and reliability of tinning and gold removal. This means that when the tinning and gold removal mechanism 3 is located above the material loading platform 2, part of its structure will come into contact with the material loading platform 2.

[0041] The preheating mechanism 4 is connected to the tinning and gold removal mechanism 3 and is used to raise the temperature of the microcell structure. This means that before tinning, the microcell structure can be preheated by the preheating mechanism 4 so that the components inside are in a certain temperature environment, and then tinning is performed to avoid thermal damage to the components due to thermal shock.

[0042] In some alternative embodiments, the loading platform 2 may be made of polytetrafluoroethylene (PTFE), which is heat-resistant and does not easily damage components, and meets electrostatic protection requirements.

[0043] In some optional embodiments, the tinning and gold removal mechanism 3 includes a hot air hood 31, a tinning roller 32, a detinning roller 33, and a tin supply source 34. The hot air hood 31 is generally a cuboid shape with one open side. The hot air hood 31 can be connected to the linear displacement mechanism 5 through a telescopic mechanism. The hot air hood 31 is equipped with a hot air source to supply hot air into the interior of the hot air hood 31. The hot air source can be connected to the hot air hood 31 through a hot air pipe. The hot air source can be connected to the support frame 1 to reduce the bearing pressure of the linear displacement mechanism 5. The hot air source supplies heated tin to the hot air hood 31 to prevent the liquid solder from oxidizing.

[0044] The tinning roller 32 is rotatably connected to the hot air hood 31 and located inside the hot air hood 31. At least a portion of the structure of the tinning roller 32 is located outside the hot air hood 31, meaning that when the hot air hood 31 is above the material carrier platform 2, the tinning roller 32 first contacts the material carrier platform 2. The tinning roller 32 is attached with a silver-plated copper wire brush, so that the tinning roller 32 has a certain amount of tin storage. In other embodiments, the tinning roller 32 can be elastically slidably connected to the hot air hood 31, so that the tinning roller 32 can abut against the material carrier platform 2 under the action of elasticity, so that a contact pressure is formed between the tinning roller 32 and the material carrier platform 2. Alternatively, the tinning roller 32 can be connected to the hot air hood 31 through, for example, a ball screw mechanism, so that the position of the tinning roller 32 is precisely controllable. With the help of the telescopic mechanism, the contact pressure between the tinning roller 32 and the material carrier platform 2 can be precisely adjusted.

[0045] The desoldering roller 33 is rotatably connected to the hot air hood 31 and located inside the hot air hood 31. The desoldering roller 33 and the tinning roller 32 are arranged axially parallel and spaced apart. The desoldering roller 33 and the tinning roller 32 are roughly the same, except that the surface of the desoldering roller 33 is covered with a silver-plated copper wire braided mesh, which effectively removes the liquid solder in the micro-pool structure.

[0046] The solder supply source 34 is connected to the hot air shroud 31 and located inside the hot air shroud 31. The solder supply source 34 is used to supply liquid solder to the upward solder roller 32.

[0047] In some optional embodiments, a solder control mechanism is also connected inside the hot air shroud 31, which is used to adjust the thickness of liquid solder on the surface of the soldering roller 32.

[0048] In this embodiment, the tin control mechanism can prevent excessive liquid solder on the surface of the tinning roller 32 from accidentally dripping, and can also effectively control the thickness of the liquid solder on the surface of the tinning roller 32, so that the amount of tin applied is controllable.

[0049] In some optional embodiments, the solder control mechanism includes a linear translation component, a mounting housing 35, and a solder control roller 36. The linear translation component is connected to the hot air hood 31; the mounting housing 35 is connected to the linear translation component; the solder control roller 36 is rotatably connected to the mounting housing 35, and the solder control roller 36 is parallel to the axis of the solder application roller 32. Thus, driven by the linear translation component, the solder control roller 36 will radially abut against or disengage from the solder application roller 32. Through the drive of the linear translation component, the contact pressure between the solder control roller 36 and the solder application roller 32 can be adjusted, thereby adjusting the thickness of the liquid solder on the solder application roller 32. Furthermore, the contact pressure generated between the solder control roller 36 and the solder application roller 32 can prevent accidental rotation of the solder application roller 32, making the soldering process precise and controllable.

[0050] In some alternative embodiments, the tinning roller 32 and / or the tin control roller 36 are provided with temperature control components to control the surface temperature of the tinning roller 32 and the tin control roller 36.

[0051] In this embodiment, the temperature control component can maintain a high surface temperature on the soldering roller 32 and the solder control roller 36 to prevent the liquid solder from cooling and solidifying.

[0052] In some alternative embodiments, a desoldering scraper 37 is connected to the hot air shroud 31, and the cutting edge of the desoldering scraper 37 abuts against the desoldering roller 33.

[0053] In this embodiment, the desoldering scraper 37 can scrape off the liquid solder on the desoldering roller 33, allowing the desoldering roller 33 to operate continuously multiple times. In addition, the contact pressure generated by the desoldering scraper 37 on the desoldering roller 33 can prevent the desoldering roller 33 from rotating accidentally and avoid the liquid solder on it from dripping accidentally.

[0054] In some alternative embodiments, the desoldering scraper 37 is configured with a negative pressure adsorption component to adsorb liquid solder on the desoldering scraper 37, thereby enabling the desoldering scraper 37 to be used continuously.

[0055] In some optional embodiments, a hot air leveling air knife is configured on the hot air shroud 31. The hot air leveling air knife is an air knife that can provide hot air to remove residual liquid solder in the micro-pool structure. In practice, the hot air leveling air knife can share a hot air source with the hot air shroud 31.

[0056] When using, place the component into the mounting slot with the soldered bottom end of the component facing upwards, such as... Fig. 3As shown, driven by the linear displacement mechanism 5, the preheating mechanism 4 first preheats the micro-pool structure, causing the solder ends of the components to heat up. Subsequently, the tinning roller 32 in the tinning and gold removal mechanism 3 first contacts the material carrier platform 2, thereby filling the micro-pool structure with liquid solder. The gold layer on the component solder ends will dissolve into the liquid solder. The thickness of the liquid solder is higher than the material carrier platform 2 by a certain height. This is caused by the formed micro-pool structure, that is, the solder ends 6 of the components sink a little distance relative to the material carrier platform 2. On the one hand, the desoldering roller 33 first contacts the surface of the material carrier platform 2, and the silver-plated copper wire braided mesh on the desoldering roller 33 is compressed (that is, the silver-plated copper wire braided mesh has a certain thickness and can be compressed to a certain extent). As the desoldering roller 33 leaves the material carrier platform 2, the desoldering roller 33... As the material platform 2 moves to the micro-pool structure, the silver-plated copper wire mesh on the desoldering roller 33 is gradually released. During this release process, the liquid solder in the micro-pool structure is quickly absorbed, thus achieving a rapid gold removal effect. On the other hand, the surface of the material platform 2 forms a physical spatial limit on the desoldering roller 33, effectively limiting the contact pressure between the silver-plated copper wire mesh on the desoldering roller 33 and the solder end 6 of the component when the desoldering roller 33 crosses the micro-pool structure, thereby reducing the risk of the component being scratched and damaged. Finally, the desoldering roller 33 contacts the liquid solder in the micro-pool structure to remove the liquid solder. If the removal effect does not meet the expectations, the liquid solder in the micro-pool structure is removed again by a hot air leveling air knife until the removal effect meets the requirements.

[0057] The specific embodiments described above illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details are included in the above description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0058] It should be noted that in this specification, similar reference numerals and letters in the above figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this application, it should be noted that unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0059] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An automatic soldering and gold removal device for the solder ends of bottom-leadless packaged components, characterized in that, include: Support frame (1); The material carrier platform (2) is connected to the support frame (1). The material carrier platform (2) has a mounting slot suitable for accommodating components. The opening of the mounting slot is constructed as a chamfered structure to form a micro pool structure with the components in the mounting slot. The tinning and gold removal mechanism (3) is connected to the support frame (1) through a linear displacement mechanism (5). The tinning and gold removal mechanism (3) is used to inject liquid solder into the micro pool structure and to remove liquid solder from the micro pool structure. The preheating mechanism (4) is connected to the tinning and gold removal mechanism (3) and is used to raise the temperature of the microcell structure.

2. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components according to claim 1, characterized in that, The tinning and gold removal mechanism (3) includes: A hot air hood (31) is provided with a hot air source to supply hot air into the interior of the hot air hood (31); Tinning roller (32), which is rotatably connected to the hot air hood (31) and located inside the hot air hood (31); The desoldering roller (33) is rotatably connected to the hot air hood (31) and located inside the hot air hood (31). The desoldering roller (33) and the tinning roller (32) are arranged axially parallel and spaced apart. A solder supply source (34) is connected to and located inside the hot air hood (31). The solder supply source (34) is used to supply liquid solder to the soldering roller (32).

3. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components according to claim 2, characterized in that, The surface of the tinning roller (32) is coated with silver-plated copper wire brush.

4. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components according to claim 2, characterized in that, The surface of the detinning roller (33) is covered with a silver-plated copper wire braided mesh.

5. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components according to claim 2, characterized in that, The hot air hood (31) is also connected to a solder control mechanism, which is used to adjust the thickness of liquid solder on the surface of the soldering roller (32).

6. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components according to claim 5, characterized in that, The tin control mechanism includes: A linear translation component, which is connected to the hot air hood (31); Mounting housing (35), which is connected to the linear translation assembly; The tin control roller (36) is rotatably connected to the mounting housing (35). The tin control roller (36) is parallel to the axis of the tin-up roller (32). Thus, under the drive of the linear translation component, the tin control roller (36) will radially abut against or disengage from the tin-up roller (32).

7. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components according to claim 2, characterized in that, The tinning roller (32) and / or the tin control roller (36) are equipped with temperature control components to control the surface temperature of the tinning roller (32) and the tin control roller (36).

8. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components according to claim 2, characterized in that, A desoldering scraper (37) is connected to the hot air hood (31), and the cutting edge of the desoldering scraper (37) abuts against the desoldering roller (33).

9. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components according to claim 8, characterized in that, The desoldering scraper (37) is equipped with a negative pressure adsorption component to adsorb liquid solder on the desoldering scraper (37).

10. The automatic soldering and gold removal device for the solder ends of bottom leadless packaged components according to claim 2, characterized in that, The hot air hood (31) is equipped with a hot air leveling knife.

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