Sound equipment

Abstract

The invention discloses a sound box, and relates to the technical field of loudspeakers, the sound box comprises a box body, a loudspeaker unit, a power amplifier module and an air guide pipe, the box body defines a mounting cavity, and the loudspeaker unit is arranged in the box body and is arranged corresponding to the mounting cavity so as to drive air in the mounting cavity to flow to generate air flow; the power amplifier module is arranged in the installation cavity and electrically connected with the horn unit, the air guide pipe is arranged in the installation cavity, the two ends of the air guide pipe are a first pipe opening and a second pipe opening respectively, the first pipe opening is located in the flowing path of airflow, and the second pipe opening is communicated with the outside of the box body.

Description

Technical Field

[0001] This invention relates to the field of loudspeaker technology, and particularly to an audio system. Background Technology

[0002] When the amplifier module of an audio system is working, it generates a lot of heat. If the heat dissipation is not good, it will affect the performance and lifespan of the internal components of the audio system, which will lead to sound quality distortion or even equipment damage.

[0003] In related technologies, fans are usually used to actively cool the power amplifier module. However, the fans generate noise when they are running, which affects the sound quality of the audio equipment and can easily lead to user complaints. Summary of the Invention

[0004] The main objective of this invention is to propose a speaker that aims to reduce noise and improve sound quality while simultaneously dissipating heat.

[0005] To achieve the above objectives, the present invention provides an audio system comprising: a cabinet, a speaker unit, a power amplifier module, and a duct. The cabinet defines a mounting cavity. The speaker unit is disposed in the cabinet and corresponding to the mounting cavity, thereby driving airflow within the mounting cavity to generate airflow. The power amplifier module is disposed in the mounting cavity and electrically connected to the speaker unit. The duct is disposed within the mounting cavity, with a first port and a second port at its two ends. The first port is located on the airflow path, and the second port communicates with the outside of the cabinet. Attached Figure Description

[0006] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0007] Figure 1 A stereo sound system provided by the present invention Figure 1 ;

[0008] Figure 2 for Figure 1 Stereo sound of mid-range speakers Figure 2 ; Figure 3 for Figure 1 Top view of the central speaker; Figure 4 for Figure 3 Enlarged view at point A; Figure 5 for Figure 1A cross-sectional view of the central acoustic unit; Figure 6 for Figure 5 Enlarged view at point B.

[0009] Explanation of icon numbers: 10. Audio equipment; 1. Enclosure; 11. Mounting cavity; 111. Acoustic chamber; 112. Heat dissipation chamber; 2. Speaker unit; 3. Power amplifier module; 31. Upper PCB board; 32. Lower PCB board; 33. Power supply board; 4. Thermal storage layer; 5. Air duct; 51. Duct body; 511. First duct opening; 512. Second duct opening; 52. Heat dissipation sleeve; 521. Heat dissipation fins; 6. Partition.

[0010] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0011] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0012] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0013] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0014] This invention proposes an audio device 10.

[0015] Please see Figures 1-4 In one embodiment of the present invention, the speaker 10 includes a cabinet 1, a speaker unit 2, a power amplifier module 3, and a duct 5. The cabinet 1 defines a mounting cavity 11. The speaker unit 2 is disposed in the cabinet 1 and is disposed corresponding to the mounting cavity 11 so as to drive the air flow in the mounting cavity 11 to generate airflow. The power amplifier module 3 is disposed in the mounting cavity 11 and is electrically connected to the speaker unit 2. The duct 5 is disposed in the mounting cavity 11. The two ends of the duct 5 are a first port 511 and a second port 512, respectively. The first port 511 is located on the airflow path, and the second port 512 is connected to the outside of the cabinet 1.

[0016] It is understandable that the power amplifier module 3 is electrically connected to the speaker unit 2. When the power amplifier module 3 transmits the amplified audio signal to the speaker unit 2, the speaker unit 2 generates vibrations at the corresponding frequency according to the audio signal, thereby driving the air flow in the mounting cavity 11 to form an airflow. This airflow can flow from the first port 511 into the air guide duct 5, and then be discharged from the second port 512 to the outside of the cabinet 1. This can effectively balance the air pressure difference between the inside of the mounting cavity 11 and the outside of the cabinet 1, reduce the risk of vibration distortion and sound quality degradation caused by air pressure imbalance, effectively enhance and diffuse low-frequency sounds, effectively improve the clarity and layering of the sound, and improve the sound quality of the speaker 10.

[0017] The power amplifier module 3 generates heat during operation, which is conducted to the airflow. As the airflow exits the enclosure 1, it also carries the heat away from the enclosure 1, achieving efficient heat dissipation for the speaker 10. This reduces the risk of heat accumulation within the mounting cavity 11, thereby minimizing the risk of performance degradation or damage to the power amplifier module 3 and speaker unit 2 due to overheating. This improves the stability and reliability of the speaker 10, eliminates the need for an additional fan, reduces manufacturing costs, and lowers overall power consumption and noise. As a result, the speaker 10 achieves good sound quality while maintaining excellent heat dissipation, enhancing the user experience.

[0018] In the technical solution of the present invention, the speaker unit 2 can drive the air flow in the mounting cavity 11 to generate airflow. The airflow can be discharged to the outside of the cabinet 1 through the air duct 5, which can balance the air pressure difference between the inside of the mounting cavity 11 and the outside of the cabinet 1, and improve the sound effect of the speaker 10. At the same time, the airflow can carry away the heat generated by the power amplifier module 3 during operation, thereby realizing natural heat dissipation inside the speaker 10, reducing the risk of performance degradation or damage to the power amplifier module 3 and speaker unit 2 due to excessive temperature. Moreover, no additional fan is required, which can reduce costs and noise, and improve the sound quality of the speaker 10 while achieving heat dissipation.

[0019] Please see Figures 1-3 In an embodiment of the present invention, there are two air ducts 5. In the length direction of the housing 1, the horn unit 2 is located between the first openings 511 of the two air ducts 5.

[0020] Understandably, the airflow generated by the vibration of the speaker unit 2 can be simultaneously discharged from the first port 511 on both sides to the air duct 5, and then discharged through the second port 512 of the air duct 5. This can further enhance the diffusion range and uniformity of low-frequency sound, thereby further improving the sound quality of the speaker 10. At the same time, the airflow carrying heat discharged from the air ducts 5 on both sides can quickly disperse and carry away the heat generated by the power amplifier module 3 from the mounting cavity 11, thereby further improving the heat dissipation efficiency. While ensuring the sound quality enhancement effect, the optimization of the airflow path makes the heat dissipation process more efficient and stable, which can further ensure the performance stability and service life of the speaker 10 under long-term operation.

[0021] Please see Figures 1-3 In an embodiment of the present invention, the speaker 10 further includes two partitions 6. The two partitions 6 are arranged at intervals along the length of the enclosure 1 to divide the mounting cavity 11 into an acoustic chamber 111 and a heat dissipation chamber 112 located on both sides of the acoustic chamber 111. Two air ducts 5 pass through the two partitions 6 respectively. The speaker unit 2 and the first pipe openings 511 of the two air ducts 5 are both located in the acoustic chamber 111. At least a portion of the power amplifier module 3 is located in the heat dissipation chamber 112.

[0022] It is understandable that by setting two spaced partitions 6 to divide the mounting cavity 11 into an acoustic chamber 111 and heat dissipation chambers 112 on both sides, the acoustic vibrations generated by the speaker unit 2 during operation can be effectively physically isolated from heat-generating components such as the power amplifier module 3. This reduces the transfer of heat from the heat dissipation chamber 112 to the acoustic chamber 111, reduces the risk of heat accumulation in the acoustic chamber 111, and thus reduces the risk of damage to the speaker unit 2 due to high temperature, thereby helping to ensure the acoustic performance of the speaker unit 2.

[0023] At least a portion of the power amplifier module 3 is disposed within the heat dissipation chamber 112. The heat generated by the portion of the power amplifier module 3 located within the heat dissipation chamber 112 can be conducted to the air within the heat dissipation chamber 112. The heat of the air can be conducted to the portion of the air duct 5 located within the heat dissipation chamber 112. When the airflow in the air duct 5 flows towards the outside of the enclosure 1, the airflow can carry away the heat conducted to the air duct 5, thereby achieving heat dissipation.

[0024] The first port 511 of the speaker unit 2 and the air duct 5 is located inside the acoustic chamber 111, ensuring that the sound signal can propagate and diffuse in an independent and optimized acoustic space, which is conducive to improving the purity and accuracy of the sound quality. At least part of the power amplifier module 3 is located in the heat dissipation chamber 112, which allows the heat generated by the power amplifier module 3 during operation to be concentrated in a relatively independent space, which is convenient to be efficiently discharged through the air duct 5, further optimizing the heat dissipation path and improving the heat dissipation efficiency. Thus, while ensuring the sound quality performance of the speaker 10, the working stability and service life of the internal electronic components are effectively guaranteed.

[0025] In an embodiment of the present invention, at least a portion of the top end of the partition 6 is spaced apart from the top wall of the mounting cavity 11, and in the length direction of the housing 1, the distance between the top ends of the two partitions 6 is greater than the distance between the bottom ends of the two partitions 6.

[0026] It is understandable that the length direction of box 1 can be Figure 1 In the left-right direction, the distance between the top ends of the two partitions 6 is greater than the distance between the bottom ends of the two partitions 6, so that the two partitions 6 are inclined relative to the bottom wall of the mounting cavity 11. This allows the hot air in the acoustic chamber 111 to be guided, so that the hot air rises naturally along the inclined surface of the partitions 6 and flows from the gap between the top of the partitions 6 and the top wall of the mounting cavity 11 to the heat dissipation chamber 112. This reduces the risk of hot air accumulating in the acoustic chamber 111, thereby reducing the risk of damage to the speaker unit 2 due to high temperature, and thus helping to ensure the acoustic performance of the speaker unit 2.

[0027] In embodiments of the present invention, the angle between the partition 6 and the bottom wall of the mounting cavity 11 can be in the range of 30° to 75°. For example, the angle between the partition 6 and the bottom wall of the mounting cavity 11 can be 30°, 45°, 60°, 75°, etc., so as to balance the efficiency of hot air flow and the utilization rate of the cavity space.

[0028] In an embodiment of the present invention, at least a portion of the bottom end of the partition 6 is spaced apart from the bottom wall of the mounting cavity 11.

[0029] It is understandable that the bottom end of the partition 6 is spaced apart from the bottom wall of the mounting cavity 11 to jointly define the channel for air circulation. After the hot air in the heat dissipation chamber 112 exchanges heat with the airflow in the air duct 5, the hot air will naturally sink after its temperature drops. The cooled hot air can flow from the channel between the bottom end of the partition 6 and the bottom wall of the mounting cavity 11 to the acoustic chamber 111. The operation of the speaker unit 2 can drive the flow of the cooled hot air so that the cooled hot air flows into the air duct 5 and then is discharged to the outside of the enclosure 1 through the second pipe port 512, thereby directly discharging the hot air in the heat dissipation chamber 112 to the outside of the enclosure 1. This configuration allows the heat in the heat dissipation chamber 112 to be continuously carried out through the airflow in the air duct 5. At the same time, the hot air in the acoustic chamber 111 enters the heat dissipation chamber 112 from the top of the mounting cavity 11, and the hot air in the heat dissipation chamber 112, which has been cooled by the airflow in the air duct 5, enters the mounting cavity from the bottom. This can form air convection, further accelerating the diffusion and discharge of heat, effectively improving the heat dissipation efficiency of the entire speaker 10, and ensuring that the internal components work stably in a suitable temperature environment.

[0030] In an embodiment of the present invention, the distance between the top end of the partition 6 and the top wall of the mounting cavity 11 is greater than the distance between the bottom end of the partition 6 and the bottom wall of the mounting cavity 11.

[0031] Understandably, the larger gap between the top of the partition 6 and the top wall of the mounting cavity 11 allows the hot air in the acoustic chamber 111 to flow upward more smoothly and enter the heat dissipation chamber 112. At the same time, the smaller gap between the bottom of the partition 6 and the bottom wall of the mounting cavity 11 ensures that the cooled hot air flows from the bottom of the partition 6 to the acoustic chamber 111, while reducing the heat exchange between the acoustic chamber 111 and the heat dissipation chamber 112. This reduces the risk of heat buildup in the acoustic chamber 111, thereby reducing the risk of the speaker unit 2 being affected by excessively high temperatures. This helps to ensure the acoustic stability and service life of the speaker unit 2 during long-term operation.

[0032] Please see Figure 5 and Figure 6 In an embodiment of the present invention, the speaker 10 further includes a heat storage layer 4, which is attached to the surface of the power amplifier module 3 and is used to absorb and store the heat generated by the power amplifier module 3.

[0033] It is understandable that the power amplifier module 3 will continuously generate heat during operation. If the heat cannot be dissipated in time, it will not only affect its own working efficiency and service life, but may also have adverse effects on the speaker unit 2 and other components through heat conduction. The heat storage layer 4 is attached to the surface of the power amplifier module 3, which can directly and efficiently absorb the heat generated by the power amplifier module 3 during operation and temporarily store this heat. This reduces the risk of a large amount of heat accumulating in a short period of time, thereby slowing down the rate of temperature rise of the power amplifier module 3 and achieving heat storage buffer. This can effectively stabilize the temperature fluctuation of the power amplifier module 3, reduce the risk of component performance degradation caused by sudden temperature changes, and thus improve the working stability and service life of the power amplifier module 3.

[0034] The heat storage layer 4 can be made of PCM (phase change material), which can effectively absorb the heat generated by the power amplifier module 3, realize the "cooling patch" function, effectively stabilize temperature fluctuations, and improve the working stability and service life of electronic components in the power amplifier module 3.

[0035] In an embodiment of the present invention, the heat storage layer 4 is disposed in the heat dissipation chamber 112 and sandwiched between the air duct 5 and the power amplifier module 3.

[0036] Understandably, the heat storage layer 4, sandwiched between the air duct 5 and the power amplifier module 3, can directly absorb heat from the surface of the power amplifier module 3. Furthermore, the airflow within the air duct 5 can exchange heat with the heat storage layer 4, thus carrying away the heat absorbed and stored in the heat storage layer 4 in a timely manner. This allows the heat storage layer 4 to not only temporarily store heat and buffer temperature peaks, but also quickly release the stored heat through the airflow within the air duct 5, achieving a dynamic balance between heat absorption and dissipation. When the power amplifier module 3 generates a large amount of heat during short-term high-power operation, the heat storage layer 4 can quickly absorb and store it, reducing the risk of a rapid temperature increase within the mounting cavity 11 due to sudden heat surges. Simultaneously, the heat stored in the heat storage layer 4 can be efficiently dissipated through the airflow within the air duct 5, thereby continuously maintaining the stable operating temperature of the power amplifier module 3. This further improves the efficiency and reliability of heat dissipation for the speaker 10, helping to ensure that the speaker 10 maintains good heat dissipation and sound quality performance.

[0037] Please see Figure 6 In an embodiment of the present invention, the air duct 5 includes a duct body 51 and a heat dissipation sleeve 52. The heat dissipation sleeve 52 is sleeved on the duct body 51, and the outer wall of the heat dissipation sleeve 52 is at least partially formed as heat dissipation fins 521. The first duct opening 511 and the second duct opening 512 are formed at both ends of the duct body 51.

[0038] Understandably, when the speaker unit 2 generates airflow through the tube body 51 to the outside of the enclosure 1, the heat of the air around the tube body 51 can be conducted sequentially through the heat dissipation sleeve 52 and the tube body 51 to the airflow inside the air duct 5, and carried out of the enclosure 1 by the airflow. The outer wall of the heat dissipation sleeve 52 forms heat dissipation fins 521, which can significantly increase the heat exchange area between the tube body 51 and the surrounding air, thereby improving the heat exchange efficiency between the surrounding air and the airflow inside the tube body 51, and thus improving the heat dissipation capacity of the speaker 10. Even when the speaker 10 is running at high power for a long time, the airflow inside the air duct 5 can continuously remove heat, ensuring that the overall operating temperature of the speaker 10 is kept within a reasonable range, thereby improving the stability and durability of the speaker 10.

[0039] The tube body 51 and the heat sink 52 can be integrally formed from thermally conductive metal material to ensure good thermal conductivity between the tube body 51 and the heat sink 52, reduce interfacial contact thermal resistance, and improve overall heat dissipation efficiency.

[0040] In this embodiment, the heat sink 52 is located inside the heat dissipation chamber 112. The heat dissipation fins 521 formed on the outer wall of the heat sink 52 can effectively increase the contact area with the air inside the heat dissipation chamber 112, thereby improving the heat exchange efficiency and further accelerating the heat dissipation inside the heat dissipation chamber 112. This can effectively improve the heat dissipation capacity of the entire speaker 10, reduce the thermal stress caused by the temperature accumulation inside the cabinet 1 on the electronic components, and help ensure the performance stability and service life of the speaker 10 under long-term operation.

[0041] In an embodiment of the present invention, the heat storage layer 4 is sandwiched between the heat dissipation fins 521 and the power amplifier module 3. The heat storage layer 4 can directly absorb the heat generated by the power amplifier module 3 and achieve efficient heat conduction through close contact with the heat dissipation fins 521. When the airflow flows in the air duct 5, the heat dissipation fins 521 quickly transfer the heat to the airflow and discharge it from the cabinet 1, which can effectively improve the heat dissipation performance of the speaker 10.

[0042] In an embodiment of the present invention, the surface roughness of the inner wall of the tube body 51 is Ra, which satisfies the relationship: Ra≤0.8μm. For example, Ra can be 0.8μm, 0.6μm, 0.5μm, etc., which can ensure that the inner wall of the tube body 51 is smooth, thereby reducing the frictional resistance when the airflow flows inside the tube body 51, which is conducive to the smooth flow of airflow out of the tube body 51, thereby improving the heat dissipation efficiency. At the same time, it can also reduce the noise generated by airflow disturbance, thereby improving the sound quality performance of the speaker 10.

[0043] In an embodiment of the present invention, the enclosure 1 can be made of a composite material composed of ABS (acrylonitrile-butadiene-styrene copolymer) and PC (polycarbonate). This composite material has both good mechanical strength and thermal stability, which can ensure the structural strength of the enclosure 1 and effectively protect the speaker unit 2, power amplifier module 3 and other components inside the enclosure 1.

[0044] Please see Figure 5 In an embodiment of the present invention, the power amplifier module 3 may include an upper PCB board 31, a lower PCB board 32, and a power supply board 33, which are located in the height direction of the housing 1, i.e. Figure 5 In the vertical direction, the air duct 5 is located between the upper PCB board 31 and the lower PCB board 32. A heat storage layer 4 is sandwiched between the upper PCB board 31 and the heat dissipation fins 521 of the air duct 5, and a heat storage layer 4 is also sandwiched between the lower PCB board 32 and the heat dissipation fins 521 of the air duct 5. This allows the heat generated by the electronic components on the upper PCB board 31 and the lower PCB board 32 during operation to be quickly conducted to the heat dissipation fins 521 through the two heat storage layers 4. The heat is then efficiently carried out of the enclosure 1 by the airflow in the air duct 5. The power board 33 is located in the acoustic chamber 111, which can optimize the circuit layout. The speaker unit 2 can be constructed as a woofer. The woofer and the acoustic chamber 111 work together to enhance the low-frequency response and further improve the sound quality.

[0045] In an embodiment of the present invention, the lower PCB board 32 can be first installed and fixed at the bottom of the mounting cavity 11, then the air duct 5 can be attached to the PCB board and fixed, the two partitions 6 can be installed on the air duct 5 and fixed by the limiting buckle of the box 1, and then the upper PCB board 31 can be fixed on the partitions 6 and the air duct 5 to complete the overall installation of the speaker 10.

[0046] In the technical solution of this invention, the noise source, the fan, is eliminated. Through an innovative triple passive mechanism of "PCM heat storage + hot airflow guidance + air duct 5 conduction and heat dissipation," efficiency comparable to active cooling by a fan is achieved, with lower noise, realizing efficient and silent passive cooling. The partition design of the two baffles 6 isolates the main heat source from the core acoustic chamber 111, greatly reducing sound coloration caused by the "thermoacoustic coupling" effect and improving the acoustic performance of the speaker 10. The integrated heat dissipation air duct 5 also optimizes low-frequency response and reduces distortion caused by cabinet resonance, effectively integrating the heat sink with the core acoustic components. The component (air duct 5) is integrated into one, avoiding the need for an additional bulky heat dissipation module. This makes the industrial design simpler, more compact, and more efficient, achieving a high degree of integration between structure and function. This is beneficial for improving the structural compactness of the speaker 10 and its miniaturization design. While ensuring efficient heat dissipation, it further improves the acoustic purity and overall reliability of the speaker 10. With no moving parts (fan), the number of failure points is reduced. Good heat dissipation extends the service life of components such as the power amplifier module 3 and speaker unit 2, ensuring long-term stability of audio performance and effectively improving the reliability and stability of the speaker 10.

[0047] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A sound system, characterized in that, include: The housing defines an installation cavity; A speaker unit is disposed in the enclosure and corresponding to the mounting cavity, so as to drive the air flow in the mounting cavity to generate airflow; Amplifier module, wherein the amplifier module is disposed in the mounting cavity and electrically connected to the speaker unit; and, An air duct is provided inside the mounting cavity. The two ends of the air duct are a first port and a second port, respectively. The first port is located on the flow path of the airflow, and the second port is connected to the outside of the housing.

2. The audio system as described in claim 1, characterized in that, The number of air ducts is two, and the horn unit is located between the first openings of the two air ducts along the length of the housing.

3. The audio system as described in claim 2, characterized in that, The speaker also includes two partitions, which are spaced apart along the length of the enclosure to divide the mounting cavity into an acoustic chamber and a heat dissipation chamber located on both sides of the acoustic chamber. The two air ducts are respectively passed through the two partitions, the speaker unit and the first duct openings of the two air ducts are located in the acoustic cavity, and at least part of the power amplifier module is located in the heat dissipation cavity.

4. The audio system as described in claim 3, characterized in that, At least a portion of the top of the partition is spaced apart from the top wall of the mounting cavity, and the distance between the tops of the two partitions is greater than the distance between the bottoms of the two partitions in the length direction of the housing.

5. The audio system as described in claim 4, characterized in that, At least a portion of the bottom end of the partition is spaced apart from the bottom wall of the mounting cavity.

6. The audio system as described in claim 5, characterized in that, The distance between the top end of the partition and the top wall of the mounting cavity is greater than the distance between the bottom end of the partition and the bottom wall of the mounting cavity.

7. The audio system as described in claim 3, characterized in that, The speaker also includes a heat storage layer, which is attached to the surface of the power amplifier module to absorb and store the heat generated by the power amplifier module.

8. The audio system as described in claim 7, characterized in that, The heat storage layer is located in the heat dissipation chamber and sandwiched between the air duct and the power amplifier module.

9. The audio system as described in claim 1, characterized in that, The air duct includes a duct body and a heat dissipation sleeve, the heat dissipation sleeve is fitted onto the duct body, and the outer wall of the heat dissipation sleeve is at least partially formed as heat dissipation fins. The first and second openings are formed at both ends of the pipe body.

10. The audio system as described in claim 9, characterized in that, The surface roughness of the inner wall of the tube body is Ra, and Ra satisfies the following relationship: Ra≤0.8μm.

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