Vehicle-mounted power supply device and power equipment

Abstract

The embodiment of the invention provides a vehicle-mounted power supply device and power equipment, relates to the technical field of power supply, and is used for improving the overall performance of the vehicle-mounted power supply device. The vehicle-mounted power supply device comprises a circuit board, a radiator and a plurality of power modules. The circuit board is used for electrically connecting the power module. The radiator is used for transmitting cooling liquid to radiate the plurality of power modules. The power modules are distributed between the circuit board and the radiator in the first direction, the power modules are fixed to the side, facing the circuit board, of the radiator, the face, facing the circuit board, of each power module comprises a first groove, and the first grooves are sunken towards the radiator in the first direction. And the other surface of each power module deviating from the circuit board is used for heat-conducting connection with the radiator. The power modules are distributed between the circuit board and the radiator in the first direction and in the first groove, so that the space utilization rate of the vehicle-mounted power supply device is improved, the safety and reliability of the power modules are improved, and the overall performance of the vehicle-mounted power supply device is improved.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and in particular to an on-board power supply device and power equipment. Background Technology

[0002] The on-board power supply unit is used to control the drive motor or charge the power battery, and is one of the core components of the electrical system of electric vehicles.

[0003] The vehicle power supply unit includes a radiator, multiple power modules, and circuit boards. The radiator is used to dissipate heat from the power modules. Under faults such as overcurrent, overvoltage, and overtemperature, the internal pressure of the power modules rises sharply. When the internal pressure exceeds the safety threshold, it will cause the insulating substrate inside the power module to rupture. This will lead to the failure of the power module's own electrical insulation and may also cause the radiator to break down, resulting in coolant leakage. This poses a significant risk of electrical safety and thermal runaway, endangering the safety of the entire vehicle. Furthermore, the vehicle power supply unit occupies a large space, making it difficult to meet the requirements of vehicle miniaturization and weight reduction. Summary of the Invention

[0004] This application provides an on-board power supply device and a power equipment, which improves the space utilization of the on-board power supply device while enhancing the safety and reliability of the power module.

[0005] To achieve the above objectives, this application adopts the following technical solution: A first aspect of this application provides an on-board power supply device, which includes at least one of a motor controller and an on-board charger. The motor controller controls the drive motor of a power device, and the on-board charger charges the power battery of the power device. The on-board power supply device includes a circuit board, a heat sink, and multiple power modules. The circuit board electrically connects the power modules, and the heat sink transfers coolant to dissipate heat from the multiple power modules, wherein: Multiple power modules are distributed between the circuit board and the heat sink along a first direction. The multiple power modules are fixed to the side of the heat sink facing the circuit board. Each power module has a first groove on the side facing the circuit board. The first groove is recessed towards the heat sink along the first direction. The other side of each power module away from the circuit board is used for thermal connection to the heat sink.

[0006] In the vehicle power supply device provided in this application, multiple power modules are distributed between the heat sink and the circuit board along the first direction. By making full use of the space in the first direction, the large space occupied by the horizontally dispersed layout of the circuit board, heat sink, and multiple power modules is avoided, which helps to save space and makes the structure of the vehicle power supply device more compact, thereby improving the space utilization rate of the vehicle power supply device. Furthermore, multiple power modules are clamped together by heat sinks and circuit boards to fix the power modules in specific positions, reducing displacement and shaking of the power modules in the vehicle environment. This enhances the mechanical strength of the vehicle power supply device, enabling it to better resist vibration and impact in the vehicle environment and ensure stable operation of the vehicle power supply device under harsh conditions.

[0007] Each power module has a first groove on the side facing the circuit board. The first groove is recessed towards the heat sink along a first direction, and the thickness of the bottom of the first groove decreases in the first direction to serve as a pre-designed weak structure. This facilitates the establishment of a directional pressure relief path away from the heat sink surface. When the internal pressure of the power module rises sharply due to overcurrent, overvoltage, or overtemperature conditions, the internal pressure is released along this directional pressure relief path. This prevents the heat sink or the connection structure between the heat sink and the power module from being damaged by a sudden, concentrated pressure release, thus avoiding leakage and electrical safety issues caused by the heat sink. This ensures the safety and reliability of the vehicle power supply system, thereby improving the overall performance of the vehicle power supply system.

[0008] In one embodiment, the vehicle power supply device includes a connector fixed to the side of the heat sink facing the circuit board, and the connector is used to fix the thermally conductive connection between the power module and the heat sink.

[0009] In the vehicle-mounted power supply device disclosed in this application, the connector is used to fix the thermally conductive connection between the power module and the heat sink, ensuring the reliability of the thermally conductive connection between the power module and the heat sink, ensuring good thermal contact between the power module and the heat sink, reducing thermal resistance, improving heat dissipation efficiency, and allowing the heat generated by the power module to be quickly dissipated onto the heat sink. Furthermore, it facilitates subsequent installation and maintenance, improves maintenance efficiency, and reduces maintenance costs.

[0010] The connector is fixed on the side of the heat sink facing the circuit board, so that the power module, heat sink, connector and circuit board are arranged compactly in the space of the first direction, avoiding the additional space occupied by the connector in other directions, which helps to reduce the size of the entire vehicle power supply device and improve the space utilization of the vehicle power supply device.

[0011] In one embodiment, the vehicle power supply device includes a fixing plate for fixing a heat sink and a connector. The fixing plate is distributed on the side of the heat sink facing the circuit board, and the fixing connection method between the fixing plate and the heat sink is different from the fixing connection method between the fixing plate and the connector.

[0012] In the vehicle-mounted power supply device disclosed in this application, the fixing connection method between the mounting plate and the radiator differs from the fixing connection method between the mounting plate and the connector. These two different fixing connection methods work together to, on the one hand, make the stress distribution between different components more uniform and avoid localized stress concentration; on the other hand, the different fixing connection methods jointly enhance the connection strength between the mounting plate and the radiator, and between the mounting plate and the connector, thereby improving the overall structural stability. Furthermore, the different fixing connection methods simplify the installation process and reduce installation and maintenance costs.

[0013] In one embodiment, the side of the heat sink facing the circuit board is used for welding or bonding a mounting plate, and the vehicle power supply device includes a fixing member for passing through a connector and embedding into a fixing hole in the mounting plate.

[0014] In the vehicle-mounted power supply device provided in this application, the welding connection method provides a firm connection and good sealing performance, ensuring a tight bond between the mounting plate and the radiator. The adhesive connection method offers uniform stress distribution on the connection surface, is simple and flexible to operate, and can achieve a seamless connection, effectively preventing the ingress of dust and other impurities.

[0015] After the fastener is embedded in the mounting hole, a tight fit is formed between the two, effectively distributing the stress on the connection point, reducing stress concentration, and thus enhancing the connection strength of the entire vehicle power supply device structure. During vehicle operation, it is subject to various vibrations and impacts. The connection method of the fastener passing through the connector and embedding into the mounting hole of the mounting plate ensures that the power module remains firmly connected, preventing loosening or detachment.

[0016] The design of embedding the fastener into the mounting hole allows the fastener to be hidden within the mounting plate, without occupying additional space. This makes the structure of the vehicle power supply unit more compact, further improving the space utilization of the vehicle power supply unit. Furthermore, compared to the fastener extending into the radiator, embedding the fastener into the mounting plate reduces mutual interference between the fastener and the radiator, which helps to reduce the size of the radiator or increase the proportion of coolant flow channels within the radiator in the overall structure.

[0017] In some embodiments, the fastener includes screws, bolts, rivets, or pins.

[0018] In one embodiment, the vehicle power supply device includes multiple connectors, the fixed end of which is used to fix and connect to a heat sink, and the movable end of each connector is used to abut against the bottom of a first groove in the power module.

[0019] In the vehicle-mounted power supply device disclosed in this application, the fixed end of the connector is fixedly connected to the heat sink, and the movable end of the connector abuts against the bottom of the first groove. This utilizes the deformation of the connector to press the power module against the heat sink, thereby fixing the power module to the heat sink and ensuring the reliability of the thermal connection between the power module and the heat sink. The movable end of the connector abuts against the bottom of the first groove, reducing the size of the vehicle-mounted power supply device in the first direction and helping to improve the space utilization of the vehicle-mounted power supply device.

[0020] In one embodiment, the power module includes a second groove distributed on one side of the power module. The second groove is used to connect to the first groove, and the movable end of the connector extends into the first groove through the second groove.

[0021] In the vehicle power supply device provided in this application, the movable end of the connector extends through the second groove into the first groove to further reduce the size of the vehicle power supply device in the first direction, which helps to improve the space utilization of the vehicle power supply device.

[0022] In one embodiment, the dimension of the power module along the third direction is larger than the dimension of the power module along the second direction, and the first direction, the second direction and the third direction are perpendicular to each other. The multiple power modules include multiple pairs of power modules, each pair of power modules includes two power modules, and the two power modules in each pair of power modules are arranged at intervals between or on both sides of the fixed ends of the two connectors.

[0023] In the vehicle-mounted power supply device disclosed in this application, the power modules are arranged using the space between the fixed ends of two connectors, achieving a compact spatial layout of the power modules. Compared with traditional random placement or simple stacking methods, this arrangement minimizes redundant space between power modules, allowing more power modules to be accommodated within the same vehicle-mounted power supply device volume, improving space utilization, and meeting the requirements of vehicle-mounted power supply devices for high power density and miniaturization.

[0024] By arranging the power modules using the space on both sides of the fixed ends of the two connectors, the space around the fixed ends of the two connectors is fully utilized. Because the power modules are spaced apart and distributed on both sides of the fixed ends of the two connectors, the space wastage caused by concentrated stacking of power modules is avoided, resulting in a more rational distribution and utilization of the space around the fixed ends. Furthermore, by optimizing the arrangement of the power modules within the same space, more power modules can be accommodated, improving the overall space utilization rate and helping to achieve a miniaturized and compact design of the vehicle power supply device while meeting power requirements.

[0025] In one embodiment, the size of the opening of the first groove along the second direction is smaller than the size of the opening of the first groove along the third direction.

[0026] In the vehicle power supply device provided in this application, the opening of the first groove is smaller in the second direction to limit the connection member abutting the bottom of the first groove, preventing the connection member from moving or shaking in the second direction. The opening of the first groove is larger in the third direction to facilitate adjustment of the length of the connection member extending into the first groove, so as to meet the pressure requirements for fixing different power modules to the heat sink.

[0027] In one embodiment, the first and second sides of each power module are opposite to each other along a second direction. Each power module includes multiple signal pins and multiple power pins. The signal pins are used to transmit control signals or detection signals, and the power pins are used to transmit AC or DC power. Multiple signal pins of each power module are distributed on the first side, and multiple power pins of each power module are distributed on the second side. The first sides of two power modules that are adjacent to each other along the second direction are arranged opposite each other along the second direction.

[0028] In the vehicle power supply device provided in this application, multiple signal pins and multiple power pins are respectively distributed on the first side and the second side of the package opposite each other along the second direction, so as to achieve physical isolation and functional partitioning of strong and weak currents. On the one hand, it optimizes the electrical performance of the power module and effectively suppresses electromagnetic interference of the power circuit to sensitive signals. On the other hand, it can also improve heat dissipation efficiency through centralized heat source management.

[0029] Along the second direction, the signal pins of two adjacent power modules are arranged side by side, which avoids the space waste caused by the scattered arrangement of signal pins. This helps to reduce the size of the vehicle power supply device along the second direction, thereby reducing the overall volume of the vehicle power supply device and meeting the requirements for miniaturization and lightweighting.

[0030] In one embodiment, the package includes a third groove and a fourth groove, the third groove or the fourth groove being distributed between two adjacent pins arranged along a third direction, the depth of the third groove being less than the depth of the fourth groove along a second direction, the width of the third groove being less than the width of the fourth groove along a third direction, and the fourth groove being distributed between two adjacent power pins arranged along a third direction.

[0031] In the vehicle power supply device provided in this application, the third or fourth groove between two adjacent pins is used to increase the creepage distance, so as to ensure the electrical safety between the corresponding two pins while reducing the size of the power module along the third direction.

[0032] The third groove has a shallow depth along the second direction, while the fourth groove has a deep depth along the second direction. Therefore, the bottom thickness of the fourth groove is thinner than that of the third groove, resulting in lower cross-sectional stiffness. When the internal pressure of the power module increases due to a fault, the bottom of the fourth groove will break first, thus creating a directional venting path parallel to the heat dissipation surface. In the event of a sharp increase in internal pressure due to overcurrent, overvoltage, or overtemperature conditions, the pressure inside the power module will be guided to release along the venting path parallel to the heat dissipation surface, preventing pressure from being released from the heat dissipation surface. This reduces the risk of the heat dissipation surface of the power module being damaged under faults such as overcurrent, overvoltage, and overtemperature, thereby ensuring the safety of the power module.

[0033] Within the narrow pin gap, the wider fourth groove along the third direction forms a significant stress concentration area and weak point, serving as an internal pressure relief zone for the power module and contributing to its safety. Furthermore, even if the bottom of the fourth groove ruptures, the wider groove guides the release of high-pressure gas, effectively suppressing internal pressure peaks and preventing ruptures at other locations within the power module due to internal overpressure. This significantly improves the safety and reliability of the power module.

[0034] In some embodiments, the fourth groove is distributed between two power pins arranged adjacent to each other along a third direction. During explosion venting, the high-energy venting risk is confined to the power-side region, keeping the venting energy impact away from vulnerable signal pins. This significantly reduces damage to control and monitoring functions during explosion venting, enhancing the overall reliability and fault tolerance of the power module.

[0035] In one embodiment, the power module includes a package and multiple pins. The package is used to fix the multiple pins. One end of each pin is exposed outside the package. One end of each pin is bent in the direction away from the heat sink to serve as a connection end. The connection end is used to electrically connect to the circuit board.

[0036] In the vehicle power supply device provided in this application, the bent connection end is used to reduce the size of the power module along the second direction, thereby reducing the size of the vehicle power supply device along the second direction.

[0037] The bent connection end reduces the height of the power module in the first direction, which helps to reduce the size of the power module in the first direction, and thus reduce the size of the vehicle power supply device in the first direction.

[0038] In one embodiment, the package includes a heat dissipation window and a first groove. The package is used to encapsulate an insulating substrate. The heat dissipation window exposes the heat dissipation surface of the power module, and the heat dissipation surface is used for thermally conductive connection to the heat sink.

[0039] The heat dissipation window and the first groove are distributed on opposite sides of the package body along the first direction. The recessed direction of the first groove is towards the heat dissipation window along the first direction. The side of the insulating substrate away from the first groove along the first direction is exposed to the package body through the heat dissipation window. The heat dissipation surface is distributed on the side of the insulating substrate exposed to the insulating substrate. The area of ​​the insulating substrate is larger than the bottom area of ​​the first groove.

[0040] In the vehicle-mounted power supply device provided in this application, the heat dissipation surface of the power module is used for direct thermal connection to the heat sink. On the one hand, this establishes a path with the lowest thermal resistance, improving the heat dissipation efficiency of the power module, thereby allowing the power module to withstand higher power or reduce the operating temperature of the power module. On the other hand, it reduces the size of the vehicle-mounted power supply device along the first direction.

[0041] Because the package has the smallest dimensions and weakest structure along the first direction, a directional pressure relief path is constructed by distributing the first grooves on the side away from the heat dissipation window along the first direction. In the event of a sharp increase in internal pressure due to overcurrent, overvoltage, or overtemperature conditions, the internal pressure of the power module is released along this directional pressure relief path, preventing pressure release from the heat dissipation surface. This reduces the risk of the heat dissipation surface of the power module being damaged under faults such as overcurrent, overvoltage, and overtemperature, thus ensuring the safety of the power module.

[0042] The heat dissipation surface is exposed to the outside of the package and is thermally connected to the heat sink. In the event of a power module failure, the heat inside the power module is quickly transferred to the heat sink through the heat dissipation surface, reducing the temperature rise around the heat dissipation surface and the pressure buildup inside the power module, which helps to reduce the risk of the heat dissipation surface bursting.

[0043] The area of ​​the insulating substrate is larger than the area of ​​the bottom of the first groove. The larger area of ​​the insulating substrate that bears pressure compared to the smaller area of ​​the bottom of the first groove improves the pressure-bearing capacity of the insulating substrate under the same conditions. This results in the insulating substrate having a greater breaking strength than the bottom of the first groove. This ensures that under fault conditions such as overcurrent, overtemperature, and overvoltage, when the pressure inside the power module exceeds the bearing capacity of the bottom of the first groove, the bottom of the first groove will break before the insulating substrate. Furthermore, the insulating substrate will not break when the bottom of the first groove breaks. This effectively avoids the risk of insulation failure of the power module and leakage of the heat sink due to the breakage of the insulating substrate, thus ensuring the operational reliability of the vehicle power supply device.

[0044] In one embodiment, the power module includes multiple power devices, and a package is used to encapsulate the multiple power devices. Each power device is distributed between an insulating substrate and the bottom of a first groove. The thickness of the insulating substrate along a first direction is greater than the thickness of the bottom of the first groove along the first direction.

[0045] When the power module is working normally, the insulating substrate and the bottom of the first groove form an efficient double-sided heat dissipation channel for the power device, thereby improving the heat dissipation efficiency, power density and electrical performance of the power device.

[0046] Since the first groove is used for internal explosion venting of the power module, in the event of a power module failure, the power devices are distributed between the insulating substrate and the bottom of the first groove to ensure that the high pressure or high temperature gas inside the power module is released in a directional manner along the directional explosion venting path defined by the first groove, preventing the package from randomly bursting and thus improving safety.

[0047] The thicker insulating substrate and the thinner bottom of the first groove, under the same conditions, improve the pressure resistance of the insulating substrate. This makes the breaking strength of the insulating substrate greater than that of the bottom of the first groove. This ensures that under fault conditions such as overcurrent, overtemperature, and overvoltage, when the pressure inside the power module exceeds the bearing capacity of the bottom of the first groove, the bottom of the first groove will break before the insulating substrate. Furthermore, the insulating substrate will not break when the bottom of the first groove breaks. This effectively avoids the risk of insulation failure of the power module and heat sink breakdown and leakage due to the breaking of the insulating substrate, thus ensuring the operational reliability of the vehicle power supply device.

[0048] In one embodiment, the opening area of ​​the first groove is larger than the bottom area of ​​the first groove, and the breaking strength of the bottom of the first groove is less than the breaking strength of the insulating substrate.

[0049] In the vehicle power supply device provided in this application, the insulating substrate has a large thickness and the bottom of the first groove has a small thickness. Under the same conditions, this is beneficial to improve the pressure resistance of the insulating substrate, thereby making the fracture strength of the insulating substrate greater than that of the bottom of the first groove. This ensures that under fault conditions such as overcurrent, overtemperature, and overvoltage, when the pressure inside the power module exceeds the bearing capacity of the bottom of the first groove, the bottom of the first groove will fracture before the insulating substrate. Furthermore, the insulating substrate will not fracture when the bottom of the first groove fractures, effectively avoiding the risk of insulation failure of the power module and heat sink breakdown and leakage due to the fracture of the insulating substrate, and ensuring the operational reliability of the vehicle power supply device.

[0050] A second aspect of this application provides a power device comprising at least one of a drive motor or a power battery, and the aforementioned on-board power supply device. The on-board power supply device is used to control the drive motor or to charge the power battery.

[0051] In some embodiments, the power equipment includes an electric vehicle, which includes a power battery and an on-board power supply device. The on-board power supply device includes an on-board charger, which is used to receive power from external power sources such as the power grid and portable energy storage power supplies to charge the power battery.

[0052] In other embodiments, the power equipment includes a powertrain, which includes a drive motor and an on-board power supply device. The on-board power supply device includes a motor controller for receiving power from the power battery in the electric vehicle and controlling the drive motor to drive the electric vehicle.

[0053] In some other embodiments, the power equipment includes an all-in-one powertrain, which includes a drive motor and an on-board power supply device. The on-board power supply device includes an on-board charger and a motor controller. The on-board charger is used to receive power from external power sources such as the power grid and portable energy storage power supplies to charge the power battery of the electric vehicle. The motor controller is used to receive power from the power battery in the electric vehicle and control the operation of the drive motor to drive the wheels of the electric vehicle to rotate, thereby enabling the electric vehicle to move.

[0054] The power equipment provided in this application includes the aforementioned vehicle-mounted power supply device. Therefore, the power equipment provided in this application solves the same technical problem and has the same technical effect as the vehicle-mounted power supply device of the aforementioned technical solution, and will not be repeated here. Attached Figure Description

[0055] Figure 1 This is one of the structural schematic diagrams of a power equipment provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the structure of a power device provided in an embodiment of this application; Figure 3 This is the third schematic diagram of the structure of a power device provided in the embodiments of this application; Figure 4 This is one of the structural schematic diagrams of a power module provided in an embodiment of this application; Figure 5 A partial cross-sectional view of a power module provided in an embodiment of this application; Figure 6 A top view of a power module provided in an embodiment of this application; Figure 7 A bottom view of a power module provided in an embodiment of this application; Figure 8 This is a second schematic diagram of the structure of a power module provided in an embodiment of this application; Figure 9 This is the third schematic diagram of the structure of a power module provided in an embodiment of this application; Figure 10 This is the fourth schematic diagram of a power module provided in an embodiment of this application; Figure 11 This is the fifth schematic diagram of a power module provided in the embodiments of this application; Figure 12This is a partial structural schematic diagram of an on-board power supply device provided in an embodiment of this application; Figure 13 This is one of the structural schematic diagrams of an on-board power supply device provided in an embodiment of this application; Figure 14 A partial exploded view of an on-board power supply device provided in an embodiment of this application; Figure 15 for Figure 14 A schematic diagram of the connecting parts in the diagram; Figure 16 This is a second schematic diagram of the structure of an on-board power supply device provided in an embodiment of this application; Figure 17 This is the third schematic diagram of the structure of an on-board power supply device provided in the embodiments of this application; Figure 18 This is the fourth schematic diagram of a vehicle-mounted power supply device provided in the embodiments of this application; Figure 19 for Figure 18 A schematic diagram of the structure of a medium-power module.

[0056] Figure label: 1000-Power equipment; 1001-Electric vehicle; 1002-Powertrain; 100-Power battery; 200-Drive motor; 300-On-board power supply device; 301-On-board charger; 302-Motor controller; 10-Power module; 1-Package; 11-First recess; 111-Gap opening; 112-Gap bottom; 12-Second recess; 13-Third recess; 14-Fourth recess; 15-Connecting slot; 16-Heat dissipation window; 2-Pin; 21-Connection terminal; 22-Power pin; 23-Signal pin; 3-Insulating substrate; 4-Power device; 51-First side surface; 52-Second side surface; 6-Heat dissipation surface; 20 - Circuit board; 30 - Heat sink; 40 - Connector; 401 - Fixed end; 402 - Movable end; 403 - Through hole; 50 - Fixing plate; 501 - Fixing hole; 60 - Fixing component. Detailed Implementation

[0057] In the accompanying drawings of the embodiments of this application, solid structures such as parts and components are represented by guide lines; hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with arrows.

[0058] For ease of understanding, the relevant technical terms involved in the embodiments of this application will be explained and described below.

[0059] Parallelism: Parallelism as defined in this application includes absolute parallelism and basic parallelism. Basic parallelism means that the relationship is not absolutely parallel due to factors such as assembly tolerances, design tolerances, and process tolerances, but rather allows for errors within a small angular range.

[0060] Perpendicularity: The perpendicularity defined in this application includes absolute perpendicularity and basic perpendicularity. Basic perpendicularity refers to a relationship that is not absolutely perpendicular due to factors such as assembly tolerances, design tolerances, and process tolerances, but rather allows for a small range of angular errors.

[0061] In power modules, under faults such as overcurrent, overvoltage, or overtemperature in power devices, the internal pressure of the power module rises sharply. When the internal pressure of the power module exceeds the safety threshold, it will cause the heat dissipation surface to crack. The impact and fragments from the cracked heat dissipation surface can easily penetrate the radiator connected to the heat dissipation surface, causing coolant leakage from the radiator, posing a significant risk of electrical safety and thermal runaway, and endangering the safety of the entire vehicle. Furthermore, on-board power supply devices occupy a large space, making it difficult to meet the requirements of vehicle miniaturization and weight reduction.

[0062] To address the aforementioned issues, this application provides an on-board power supply device that improves the space utilization of the on-board power supply device while enhancing the safety and reliability of the power module, thereby improving the overall performance of the on-board power supply device.

[0063] The vehicle-mounted power supply device provided in this application embodiment is applied to power equipment to improve the overall performance of the power equipment.

[0064] In this application, power equipment 1000 refers to equipment used to provide power. Power equipment 1000 includes at least one of a drive motor 200 or a power battery 100 and an on-board power supply device 300. The on-board power supply device 300 is used to control the drive motor 200 or to charge the power battery 100. The on-board power supply device 300 includes at least one of an on-board charger 301 and a motor controller 302.

[0065] Reference Figure 1 The power equipment 1000 is an electric vehicle 1001. The electric vehicle 1001 includes a power battery 100 and an on-board power supply device 300. The on-board power supply device 300 includes an on-board charger 301, whose English name is On... Board Charger, abbreviated as OBC. On-board charger 301 is used to receive power from an external power source and charge the power battery 100.

[0066] In some embodiments, the on-board charger 301 is also used to supply power to the loads of the electric vehicle 1001. The loads supplied by the on-board charger 301 include high-voltage loads such as compressors or heaters.

[0067] There are various forms of external power sources. In some embodiments, the external power source includes the power grid. In some embodiments, the external power source includes a portable energy storage power source. The on-board charger 301 receives alternating current (AC) from external power sources such as the power grid and portable energy storage power sources and converts the AC to direct current (DC). The converted DC is then supplied to the power battery 100 to charge the power battery 100.

[0068] In some embodiments, the on-board power supply device 300 further includes a DC-DC converter. DC stands for Direct Current, and a DC-DC converter is a device that converts a DC power supply of one voltage level to a DC power supply of another voltage level. The DC-DC converter is used to supply power to the loads of the electric vehicle 1001. Unlike the on-board charger 301, the loads powered by the DC-DC converter include low-voltage loads such as low-voltage batteries, lights, wipers, air conditioners, audio systems, dashboards, and control displays.

[0069] In some embodiments, the DC-DC converter and the on-board charger 301 are integrated into an on-board power supply device 300 using an all-in-one packaging technology. This reduces the space occupied, weight and cost of the on-board power supply device 300 while improving the overall power density and energy efficiency, thereby freeing up more space for the overall vehicle layout and reducing the overall vehicle manufacturing cost.

[0070] Reference Figure 2 The power equipment 1000 is an electric vehicle 1001. The electric vehicle 1001 includes a power battery 100, a drive motor 200, and an on-board power supply device 300. The on-board power supply device 300 includes an on-board charger 301 and a motor controller 302. The on-board charger 301 is used to receive power from an external power source and charge the power battery 100. The motor controller 302 is used to receive power from the power battery 100 and to control the operation of the drive motor 200.

[0071] In some embodiments, the motor controller 302 and the on-board charger 301 are integrated into an on-board power supply device 300 using an all-in-one packaging technology. This device combines the functions of controlling the drive motor 200 and charging the power battery 100. This reduces the space occupied, weight, and cost of the on-board power supply device 300 while improving the overall power density and energy efficiency, thereby freeing up more space for the overall vehicle layout and reducing the overall vehicle manufacturing cost.

[0072] Reference Figure 3The power equipment 1000 is the powertrain 1002. The powertrain 1002 includes a drive motor 200 and an on-board power supply unit 300. The on-board power supply unit 300 includes a motor controller 302. The full English name of the motor controller 302 is Motor Control Unit, abbreviated as MCU. The motor controller 302 is used to control the drive motor 200.

[0073] In some embodiments, the drive motor 200 is an AC motor, and the motor controller 302 is used to receive DC power from the power battery 100 and convert the DC power into AC power to transmit to the drive motor 200, so as to control the operation of the drive motor 200. In some embodiments, the drive motor 200 is a DC motor, and the motor controller 302 is used to receive DC power from the power battery 100 and convert DC power of one voltage level into DC power of another motor level to transmit to the drive motor 200, so as to drive the drive motor 200 to operate.

[0074] In some scenarios, in addition to the motor controller 302, the on-board power supply device 300 also includes an on-board charger 301. The on-board charger 301 and the motor controller 302 are integrated into the housing of the powertrain 1002 to form an all-in-one powertrain 1002. The on-board charger 301 is used to charge the power battery 100 of the electric vehicle 1001.

[0075] The vehicle-mounted power supply device 300 of this application is used to realize power conversion. In the vehicle-mounted power supply device 300, the power module 10 is the core execution unit for realizing power conversion. Hereinafter, this application will provide a more detailed description of the power module 10 provided in the embodiments of this application with reference to the accompanying drawings.

[0076] Figure 4 This is one of the structural schematic diagrams of a power module 10 provided in an embodiment of this application. (Refer to...) Figure 4 The power module 10 includes a package 1 and multiple pins 2, with the package 1 used to fix the multiple pins 2.

[0077] The dimension of package 1 along the first direction is smaller than the dimensions of package 1 along the second direction and the third direction. The first direction, the second direction, and the third direction are perpendicular to each other. The dimension of package 1 along the first direction is the smallest, while the dimensions of package 1 along the second direction and the third direction are relatively large, which makes package 1 form a flat structure, which helps to reduce the space occupied by power module 10 along the first direction.

[0078] In some embodiments, the package 1 is made of a material with a high relative tracking index. The relative tracking index, or CTI, indicates that the package material has excellent insulation properties, making it suitable for high humidity or polluted environments and ensuring the long-term reliability of the power module 10.

[0079] Figure 5 This is a partial cross-sectional view of a power module 10 provided in an embodiment of this application. (Refer to...) Figure 5 The package 1 includes a heat dissipation window 16. The heat dissipation window 16 exposes the heat dissipation surface 6 of the power module 10. The heat dissipation surface 6 is used for thermally conductive connection to the heat sink. The heat sink is located in... Figure 5 Not shown in the image.

[0080] With the heat dissipation surface 6 exposed to the outside of the package 1 and thermally connected to the heat sink, the heat dissipation surface 6 helps improve the heat dissipation efficiency of the power module 10. When the power module 10 is operating normally or under slight overload, heat is transferred to the heat sink through the heat dissipation surface 6, preventing heat accumulation inside the power module 10 and reducing the likelihood of failure. In the event of a failure, the internal heat of the power module 10 is quickly transferred to the heat sink through the heat dissipation surface 6, reducing the temperature rise and internal pressure buildup in the area of ​​the heat dissipation surface 6, thus reducing the risk of the heat dissipation surface 6 bursting.

[0081] Reference Figure 4 and Figure 5 One end of each pin 2 is exposed in the package 1. Multiple pins 2 are distributed on opposite sides of the package 1 along the second direction. One end of each pin 2 is bent away from the heat dissipation window 16 to serve as a connection end 21, which is used to connect to the circuit board. Connecting the circuit board via the bent connection segment of the pin 2 facilitates the connection between the pin 2 and the circuit board, and also helps to reduce the dimensions of the power module 10 along the second direction and the third direction, thereby increasing the power density of the power module 10, making it suitable for scenarios with high space requirements. The circuit board is located in... Figure 4 and Figure 5 Not shown in the image.

[0082] Reference Figure 4 and Figure 5 The package 1 also includes a first groove 11, and a heat dissipation window 16 and the first groove 11 are distributed on opposite sides of the package 1 along a first direction. The recessed direction of the first groove 11 is towards the heat dissipation window 16 along the first direction.

[0083] Since the package 1 has the smallest dimensions and the weakest structure along the first direction, by distributing the first groove 11 on the side away from the heat dissipation window 16 along the first direction, a directional pressure relief path away from the heat dissipation surface 6 is constructed. In the event that the internal pressure of the power module 10 rises sharply due to overcurrent, overvoltage, overtemperature or other operating conditions, the internal pressure of the power module 10 is guided to be released along the directional pressure relief path, avoiding the pressure from being released from the heat dissipation surface 6. This reduces the risk of the heat dissipation surface 6 of the power module 10 being damaged under faults such as overcurrent, overvoltage, overtemperature or other faults, thereby ensuring the safety of the power module 10.

[0084] Reference Figure 5 The power module 10 includes an insulating substrate 3, and a package 1 is used to encapsulate the insulating substrate 3. The insulating substrate 3 can take many forms. In some embodiments, the insulating substrate 3 includes a copper-clad ceramic substrate, an active metal copper-clad ceramic substrate, or an insulating metal substrate, etc.

[0085] The English name for copper-clad ceramic substrate is Direct Bond Copper, abbreviated as DBC substrate. The English name for active metal brazing ceramic substrate is Active Metal Brazing Substrate, abbreviated as AMB substrate. The English name for insulating metal substrate is Insulated Metal Substrate, abbreviated as IMS.

[0086] In this application, the insulating substrate not only provides excellent thermal conductivity but also has good electrical insulation properties, effectively improving the reliability and heat dissipation capability of the power module.

[0087] In some embodiments, refer to Figure 5 The insulating substrate 3 is exposed to the package body 1 through the heat dissipation window 16 on the side opposite to the first groove 11 along the first direction. The heat dissipation surface 6 is distributed on the side of the insulating substrate 3 exposed to the heat dissipation window 16.

[0088] The heat dissipation surface 6 exposed on one side of the insulating substrate 3 is used for direct thermal conduction to connect the heat sink 30, thereby establishing a path with the lowest thermal resistance and improving the heat dissipation efficiency of the power module 10. This allows the power module 10 to withstand higher power or reduce its operating temperature. Furthermore, compared to heat dissipation via a metal base plate, direct heat dissipation via the insulating substrate 3 reduces the size of the power module 10 along the first direction and eliminates the need for a metal base plate, thus reducing the weight and cost of the power module 10.

[0089] Reference Figure 5The power module 10 includes multiple power devices 4, and the package 1 is used to encapsulate the multiple power devices 4. In some embodiments, the multiple power devices 4 include insulated-gate bipolar transistors, metal-oxide-semiconductor field-effect transistors, diodes, etc. An insulated-gate bipolar transistor is abbreviated as IGBT. A silicon carbide metal-oxide-semiconductor field-effect transistor is abbreviated as SiC MOSFET.

[0090] By encapsulating multiple power devices 4 in package 1, the number of pins 2 of power module 10 is reduced, the layout space of power module 10 is optimized, and the space waste caused by the arrangement of multiple independent power devices 4 in discrete design is reduced. Furthermore, by optimizing the internal interconnection structure, the power path is shortened, parasitic inductance and resistance are reduced, thereby improving the overall efficiency.

[0091] The reduction in the number of pins 2 in power module 10 not only simplifies system design and assembly processes but also reduces manufacturing costs and potential connection reliability risks. It is widely applicable to high power density and high integration scenarios.

[0092] In some embodiments, refer to Figure 5 Each power device 4 is distributed between the insulating substrate 3 and the bottom 112 of the first groove 11.

[0093] When the power module 10 is working normally, the insulating substrate 3 and the bottom 112 of the first groove 11 form an efficient double-sided heat dissipation channel for the power device 4, so as to improve the heat dissipation efficiency, power density and electrical performance of the power device 4.

[0094] Since the first groove 11 is used for internal explosion venting of the power module 10, under fault conditions such as overcurrent, overtemperature, and overvoltage, the power module 10 is distributed between the insulating substrate 3 and the bottom of the first groove 11 through the power devices 4, so as to ensure that the high pressure or high temperature gas inside the power module 10 is released in a directional manner along the directional explosion venting path defined by the first groove 11, preventing the package 1 from randomly bursting, thereby improving safety.

[0095] In some embodiments, the fracture strength of the bottom 112 of the first groove 11 is less than the fracture strength of the insulating substrate 3. Under fault conditions such as overcurrent, overtemperature, and overvoltage, when the pressure inside the power module 10 exceeds the bearing capacity of the bottom 112 of the first groove 11, the bottom 112 of the first groove 11 fractures, while the insulating substrate 3 does not fracture. This effectively avoids the risk of insulation failure of the power module 10 and leakage of the heat sink 30 due to the fracture of the insulating substrate 3, ensuring the operational reliability of the power module 10.

[0096] In this application, there are multiple ways to achieve a fracture strength of the bottom 112 of the first groove 11 that is less than the fracture strength of the insulating substrate 3.

[0097] In some embodiments, by designing the material of the bottom 112 of the first groove 11 to be different from the material of the insulating substrate 3, the breaking strength of the bottom 112 of the first groove 11 is less than the breaking strength of the insulating substrate 3.

[0098] In some embodiments, refer to Figure 5 The thickness of the insulating substrate 3 along the first direction is d1. The thickness of the bottom 112 of the first groove 11 along the first direction refers to the distance from the bottom surface of the first groove 11 to the insulating substrate 3 or the power device 4 along the first direction. The distance from the bottom surface of the first groove 11 to the power device 4 along the first direction is as follows: Figure 5 As shown in d2, d1 is greater than d2.

[0099] The insulation substrate 3 has a large thickness, while the bottom 112 of the first groove 11 has a small thickness. Under the same conditions, this is beneficial to improving the pressure resistance of the insulation substrate 3, thereby making the fracture strength of the insulation substrate 3 greater than that of the bottom 112 of the first groove 11. This ensures that under fault conditions such as overcurrent, overtemperature, and overvoltage, when the pressure inside the power module 10 exceeds the bearing capacity of the bottom 112 of the first groove 11, the bottom 112 of the first groove 11 will fracture before the insulation substrate 3. Furthermore, the insulation substrate 3 will not fracture when the bottom 112 of the first groove 11 fractures. This effectively avoids the risk of insulation failure of the power module 10 and leakage of the heat sink 30 due to the fracture of the insulation substrate 3, thus ensuring the operational reliability of the power module 10.

[0100] In some embodiments, refer to Figure 6 The area of ​​the bottom 112 of the first groove 11 is as shown by the letter S1. (Refer to...) Figure 7 The area of ​​the insulating substrate 3 is shown as S2. The area S2 of the insulating substrate 3 is larger than the area S1 of the bottom 112 of the first groove 11.

[0101] The insulating substrate 3 has a large pressure-bearing area, while the bottom 112 of the first groove 11 has a small pressure-bearing area. Under the same conditions, this is beneficial to improving the pressure-bearing capacity of the insulating substrate 3. As a result, the fracture strength of the insulating substrate 3 is greater than that of the bottom 112 of the first groove 11. This ensures that under fault conditions such as overcurrent, overtemperature, and overvoltage, when the pressure inside the power module 10 exceeds the bearing capacity of the bottom 112 of the first groove 11, the bottom 112 of the first groove 11 will fracture before the insulating substrate 3. Furthermore, the insulating substrate 3 will not fracture when the bottom 112 of the first groove 11 fractures. This effectively avoids the risk of insulation failure of the power module 10 and leakage of the heat sink 30 due to the fracture of the insulating substrate 3, thus ensuring the operational reliability of the power module 10.

[0102] Reference Figure 6 The dimension of the bottom 112 of the first groove 11 along the second direction is shown as d3, and the dimension of the bottom 112 of the first groove 11 along the third direction is shown as d4. The area S1 of the bottom 112 of the first groove 11 is the product of the dimension d3 of the bottom 112 of the first groove 11 along the second direction and the dimension d4 of the bottom 112 of the first groove 11 along the third direction.

[0103] Reference Figure 7 The dimension of the insulating substrate 3 along the second direction is shown as d5, and the dimension of the insulating substrate 3 along the third direction is shown as d6. The area S2 of the insulating substrate 3 is the product of the dimension d5 of the insulating substrate 3 along the second direction and the dimension d6 of the insulating substrate 3 along the third direction.

[0104] There are various ways to achieve the condition that the area S2 of the insulating substrate 3 is greater than the area S1 of the bottom 112 of the first groove 11. In some embodiments, the dimension d5 of the insulating substrate 3 along the second direction is greater than the dimension d3 of the bottom 112 of the first groove 11 along the second direction. In some embodiments, the dimension d6 of the insulating substrate 3 along the third direction is greater than the dimension d4 of the bottom 112 of the first groove 11 along the third direction. In some embodiments, referring to... Figure 6 and Figure 7 The dimension d5 of the insulating substrate 3 along the second direction is greater than the dimension d3 of the bottom 112 of the first groove 11 along the second direction, and the dimension d6 of the insulating substrate 3 along the third direction is greater than the dimension d4 of the bottom 112 of the first groove 11 along the third direction. Those skilled in the art can selectively design according to actual needs.

[0105] Reference Figure 5 and Figure 6The area of ​​the opening 111 of the first groove 11 is larger than the area S1 of the bottom 112 of the first groove 11, making the bottom 112 of the first groove 11 a weak point of the first groove 11, and generating a significant stress concentration effect at the bottom 112 of the first groove 11. When the internal pressure of the power module 10 exceeds the bearing capacity of the bottom 112 of the first groove 11, the rupture starts from the bottom 112 of the first groove 11, thereby achieving precise control of the initial position of the explosion vent.

[0106] After the bottom 112 of the first groove 11 breaks to form an initial pressure relief port, the high-pressure gas inside the power module 10 is rapidly released. Since the area of ​​the opening 111 of the first groove 11 is larger than the area S1 of the bottom 112 of the first groove 11, the high-pressure gas is guided to be released towards the larger opening 111. During this process, the pressure and flow rate of the released high-pressure gas drop rapidly, and the energy is rapidly dissipated, effectively suppressing the pressure peak inside the power module 10 and preventing the power module 10 from breaking at other locations due to overpressure inside the power module 10, thereby significantly improving the safety and reliability of the power module 10.

[0107] Reference Figure 6 The dimension of the opening 111 of the first groove 11 along the second direction is shown as d7. The dimension of the opening 111 of the first groove 11 along the third direction is the same as the dimension of the bottom 112 of the first groove 11 along the third direction, both shown as d4. The area of ​​the opening 111 of the first groove 11 is the product of the dimension d7 of the opening 111 of the first groove 11 along the second direction and the dimension d4 of the opening 111 of the first groove 11 along the third direction.

[0108] In some embodiments, the dimension d7 of the opening 111 of the first groove 11 along the second direction is smaller than the dimension d4 of the opening 111 of the first groove 11 along the third direction.

[0109] The opening 111 of the first groove 11 has a smaller dimension d7 along the second direction and a larger dimension d4 along the third direction. This guides and constrains the high-pressure gas released from the bottom 112 of the first groove 11, guiding the high-pressure gas released from the bottom 112 to diffuse rapidly along the third direction, effectively suppressing and reducing the internal pressure peak of the power module 10. Simultaneously, it helps ensure that the explosion energy and debris are released along the third direction, minimizing the risk of unintended impact damage or secondary destruction to the heat dissipation surface 6 and other locations of the power module 10, as well as other structures surrounding the power module 10, due to disordered energy diffusion.

[0110] In some embodiments, the dimension d7 of the opening 111 of the first groove 11 along the second direction is greater than the dimension d5 of the heat dissipation surface 6 along the second direction. The dimension d4 of the opening 111 of the first groove 11 along the third direction is greater than the dimension d6 of the heat dissipation surface 6 along the third direction.

[0111] When the power module 10 is vented through the first groove 11, by limiting the geometric dimensions of the slot 111 of the first groove 11, the high-pressure gas inside the power module 10 is guided and constrained to be released mainly through the first groove 11, a preset weak path. This avoids the high-pressure gas directly acting on the insulating substrate 3, which could cause the insulating substrate 3 to crack due to unexpected impact pressure. This further reduces the risk of the heat dissipation surface 6 cracking and penetrating the heat sink 30 connected to the heat dissipation surface 6.

[0112] In some embodiments, the projection of the slot 111 of the first groove 11 along the first direction covers the projection of the heat dissipation surface 6 along the first direction, so as to further reduce the risk of the insulating substrate 3 cracking due to unexpected impact pressure.

[0113] Figure 8 This is a second perspective structural diagram of a power module 10 provided in an embodiment of this application. Figure 4 The given embodiments differ from those described above, referring to... Figure 8 The package 1 includes two second grooves 12, which are indicated by letters 12a and 12b, respectively. The two second grooves 12 are distributed on two opposite sides of the package 1 along the third direction, and the recessed directions of the two second grooves 12 are opposite along the third direction. The second grooves 12 are connected to the first groove 11.

[0114] After the high-pressure gas inside the power module 10 is released through the bottom 112 of the first groove 11, it quickly enters two second grooves 12 with opposite recess directions, causing the explosion energy to be diverted to both sides along a third direction, avoiding excessive concentration of explosion pressure and impact in a single direction. Furthermore, the reverse forces acting when the explosion energy is diverted along the third direction can partially cancel each other out, reducing the asymmetrical impact on the entire package 1 and enhancing the structural stability of the package 1.

[0115] The second groove 12 is connected to the first groove 11, further increasing the area of ​​the explosion venting channel. As the high-pressure gas expands into the two second grooves 12, its flow rate, temperature, and pressure decrease more rapidly. By dispersing the concentrated explosion venting energy in multiple directions and increasing the complexity and area of ​​the explosion venting path, the efficiency of energy dissipation is greatly improved, thereby reducing the pressure peak inside the module more quickly.

[0116] Figure 9 This is the third schematic diagram of a power module 10 provided in an embodiment of this application. (Refer to...) Figure 9 The depth of the second groove 12 along the third direction is less than the depth of the first groove 11 along the first direction. The width of the second groove 12 along the second direction is less than the width of the first groove 11 along the second direction.

[0117] Compared to the second groove 12, the first groove 11 has a greater depth along the first direction and a greater width along the second direction, making the first groove 11 the weakest part of the package 1. This ensures that when the internal pressure of the power module 10 increases due to a fault, the rupture starts from the bottom 112 of the first groove 11, so as to precisely control the starting position and main venting path of the explosion venting process.

[0118] Figure 10 This is the fourth schematic diagram of a power module 10 provided in an embodiment of this application. Figure 9 The given embodiments differ from those described above, referring to... Figure 10 The package 1 includes a connecting groove 15, which connects the second groove 12 and the first groove 11. The width of the connecting groove 15 is smaller than the width of the first groove 11 and the width of the second groove 12.

[0119] exist Figure 10 In the given embodiment, the width of the connecting groove 15, the width of the first groove 11, and the width of the second groove 12 refer to the width of the connecting groove 15 along the second direction, the width of the first groove 11 along the second direction, and the width of the second groove 12 along the second direction, respectively.

[0120] The first groove 11 and the second groove 12 are connected by the connecting groove 15. The narrow groove 15 increases the local flow velocity of the gas. According to the principle of fluid mechanics, the increase in flow velocity causes the static pressure in the connecting groove 15 to decrease, which effectively attenuates the initial pressure peak transmitted from the connecting groove 15 to the second groove 12, thereby reducing the intensity of the explosion venting impact released from the second groove 12 and avoiding damage to other positions or surrounding components of the power module 10 by the explosion venting impact released from the second groove 12.

[0121] Figure 11 This is the fifth schematic diagram of a power module 10 provided in an embodiment of this application. (Refer to...) Figure 11 The package 1 includes a third groove 13 and a fourth groove 14, which are distributed between two pins 2 arranged adjacent to each other along a third direction.

[0122] The third groove 13 or the fourth groove 14 between two adjacent pins 2 is used to increase the creepage distance, so as to ensure the electrical safety between the corresponding two pins 2 while reducing the size of the third direction.

[0123] Reference Figure 11The depth of the third groove 13 along the second direction is less than the depth of the fourth groove 14. The fourth groove 14 has a greater depth along the second direction, therefore the thickness of the bottom 112 of the fourth groove 14 is thinner than that of the bottom 112 of the third groove 13, resulting in lower cross-sectional stiffness. When the internal pressure of the power module 10 increases due to a fault, the bottom 112 of the fourth groove 14 will break first, thus constructing a directional venting path parallel to the heat dissipation surface 6 through the fourth groove 14. In the event of a sharp increase in internal pressure of the power module 10 due to overcurrent, overvoltage, overtemperature, or other operating conditions, the internal pressure of the power module 10 will be guided to be released along the venting path parallel to the heat dissipation surface 6, preventing pressure from being released from the heat dissipation surface 6. This reduces the risk of the heat dissipation surface 6 of the power module 10 being damaged under faults such as overcurrent, overvoltage, and overtemperature, thereby ensuring the safety of the power module 10.

[0124] The power module 10 is internally vented by the fourth groove 14 between the narrow pins 2, which makes the layout of the power module 10 more flexible and the structure more compact.

[0125] Reference Figure 11 The width of the third groove 13 along the third direction is smaller than the width of the fourth groove 14. In the narrow gap between the pins 2, the wider fourth groove 14 along the third direction forms a significant stress concentration area and a weak point, serving as an internal pressure relief zone for the power module 10, thus contributing to the safety of the power module 10. After the bottom 112 of the fourth groove 14 ruptures, the wider fourth groove 14 guides the release of high-pressure gas. During this process, the pressure and flow rate of the released high-pressure gas rapidly decrease, and the energy is quickly dissipated, effectively suppressing the internal pressure peak of the power module 10 and preventing rupture at other locations of the power module 10 due to internal overpressure. This significantly improves the safety and reliability of the power module 10.

[0126] Reference Figure 4 , Figure 8 , Figure 9 and Figure 11 The multiple pins 2 include multiple signal pins 23 and multiple power pins 22. The signal pins 23 are used to transmit control signals or detection signals, and the power pins 22 are used to transmit AC or DC power.

[0127] Multiple signal pins 23 and multiple power pins 22 are distributed on opposite sides of the package 1 along the second direction to achieve physical isolation and functional partitioning of strong and weak currents. On the one hand, this optimizes the electrical performance of the power module 10 and effectively suppresses electromagnetic interference of the power circuit to sensitive signals. On the other hand, it can also improve heat dissipation efficiency through centralized heat source management.

[0128] Reference Figure 11The pins corresponding to DC+, DC-, SW1, and SW2 are all power pins. The pins corresponding to T1, T2, K1, K2, K3, K4, G1, G2, G3, and G4 are all signal pins.

[0129] The safety electrical clearance and creepage distance between pins 2 must be met. In some embodiments, the center distance between two adjacent power pins 22 along a third direction is greater than 4.5 mm. The spacing between pins 2 must simultaneously meet the safety electrical clearance and creepage distance requirements of pins 2 on the power module 10, and the safety electrical clearance and creepage distance requirements of pins 2 on the circuit board 20 after pins 2 are connected to the circuit board 20, to ensure the electrical safety performance of the power module 10.

[0130] In some embodiments, the electrical clearance between power pins 22 and the electrical clearance between power pins 22 and heat sink 30 or heat dissipation surface 6 are 3 mm, and the creepage distance is 5.5 mm, in order to meet the safety requirements of high voltage applications and effectively prevent arc discharge and leakage risks.

[0131] In some embodiments, the power module 10 includes an NTC thermistor pin 2, the NTC thermistor pin 2 as follows: Figure 11 As shown in T1 and T2. The center distance between pin 2 of the NTC thermistor and other pins 2 is greater than 6mm, avoiding the risk of short circuits caused by insufficient distance during soldering or assembly, and improving the reliability of manufacturing and assembly. NTC is an abbreviation for Negative Temperature Coefficient, referring to semiconductor materials or components with a large negative temperature coefficient.

[0132] The power module 10 of this application meets the insulation requirements of high voltage, high humidity and complex environments, and is suitable for scenarios with high reliability requirements.

[0133] In some embodiments, refer to Figure 11 The fourth groove 14 is distributed between two adjacent power pins 22 arranged along a third direction. In the event of an explosion, the high-energy explosion risk is confined to the power side region, keeping the explosion energy impact away from the vulnerable signal pins 23. This significantly reduces the damage to control and monitoring functions during an explosion, and enhances the overall reliability and fault safety of the power module 10.

[0134] In other embodiments of this application, the third groove 13 and the fourth groove 14 are located on the same side of the package 1 along the second direction.

[0135] In the power module 10 shown in the above embodiments, the number of bridge arms in the power module 10 varies. In some embodiments, the power module 10 includes two bridge arms for simple bidirectional current control, suitable for low-complexity motor control. In some embodiments, the power module 10 includes three bridge arms, suitable for speed regulation and vector control of three-phase motors, providing more flexible control capabilities. In other embodiments of this application, the power module 10 includes four, eight, or more bridge arms to suit more complex control requirements, such as high power density, high efficiency, or high performance applications. Those skilled in the art can adapt the different numbers of bridge arms in the packaging according to heat dissipation, integration, and electrical performance to meet different application requirements.

[0136] The above embodiments are described using the power module 10 applied to an on-board power supply device 300 as an example. The power module 10 provided in this application can also be applied to other fields. This application does not impose any special limitations on this.

[0137] The following is a detailed description of the vehicle-mounted power supply device 300 provided in the embodiments of this application, in conjunction with the accompanying drawings.

[0138] Figure 12 This is a partial structural schematic diagram of an on-board power supply device 300 provided in an embodiment of this application. (Refer to...) Figure 12 The vehicle-mounted power supply device 300 includes a heat sink 30, a circuit board 20, and multiple power modules 10. The circuit board 20 is used for electrical connection of the power modules 10. The heat sink 30 is used for transferring coolant to dissipate heat from the multiple power modules 10. The multiple power modules 10 are distributed between the circuit board 20 and the heat sink 30 along a first direction, and the multiple power modules 10 are fixed to the side of the heat sink 30 facing the circuit board 10.

[0139] The heat sink 30 is stacked on the circuit board 20, and multiple power modules 10 are distributed between the heat sink 30 and the circuit board 20. By making full use of the space in the first direction, the large space occupied by the horizontally dispersed layout of the circuit board 20, heat sink 30 and multiple power modules 10 is avoided, which helps to save space and makes the structure of the vehicle power supply device 300 more compact.

[0140] Furthermore, the power modules 10 are clamped by the heat sink 30 and the circuit board 20 to fix the power modules 10 in a specific position, thereby reducing the displacement and shaking of the power modules 10 in the vehicle environment, and thus enhancing the mechanical strength of the vehicle power supply device 300, enabling it to better resist the vibration and impact of the vehicle environment, and ensuring the stable operation of the vehicle power supply device 300 under harsh working conditions.

[0141] Reference Figure 12Each power module 10 has a first groove 11 on the side facing the circuit board 20, which is recessed toward the heat sink 30 along a first direction. The other side of each power module 10 away from the circuit board 20 is used for thermally conductive connection to the heat sink 30.

[0142] Each power module 10 has a first groove 11 on the side facing the circuit board 20. The first groove 11 is recessed towards the heat sink 30 along a first direction. The thickness of the bottom 112 of the first groove 11 decreases in the first direction to serve as a pre-designed weak structure, facilitating the establishment of a directional pressure relief path away from the heat dissipation surface 6 through the first groove 11. When the internal pressure of the power module 10 rises sharply due to overcurrent, overvoltage, overtemperature, or other operating conditions, the internal pressure of the power module 10 is released along this directional pressure relief path. This prevents the heat sink 30 or the connection structure between the heat sink 30 and the power module 10 from being damaged by a sudden concentrated release of pressure, thus avoiding leakage of the heat sink 30 and causing electrical safety problems. This ensures the safety of the vehicle power supply device 300.

[0143] In some embodiments, the circuit board 20 is a PCB stack-up structure that integrates control circuitry and drive circuitry to further reduce the size of the vehicle power supply device 300 along the first direction.

[0144] Figure 13 This is one of the structural schematic diagrams of an on-board power supply device 300 provided in an embodiment of this application. Figure 14 A partial exploded view of a vehicle-mounted power supply device 300 provided in an embodiment of this application. (Refer to...) Figure 13 and Figure 14 The vehicle power supply device 300 includes a connector 40, which is fixed to the side of the heat sink 30 facing the circuit board 20. The connector 40 is used to fix the thermally conductive connection between the power module 10 and the heat sink 30.

[0145] The connector 40 is used to secure the thermally conductive connection between the power module 10 and the heat sink 30, ensuring the reliability of the thermal connection and good thermal contact between them. This reduces thermal resistance, improves heat dissipation efficiency, and allows the heat generated by the power module 10 to be quickly dissipated onto the heat sink 30. Furthermore, it facilitates subsequent installation and maintenance, improving maintenance efficiency and reducing maintenance costs.

[0146] Fixing the connector 40 to the side of the heat sink 30 facing the circuit board 20 allows the power module 10, heat sink 30, connector 40 and circuit board 20 to be arranged compactly in the space of the first direction, avoiding the additional space occupied by the connector 40 in other directions, which helps to reduce the volume of the entire vehicle power supply device 300 and improve the space utilization of the vehicle power supply device 300.

[0147] Reference Figure 13 and Figure 14 The vehicle power supply device 300 includes a fixing plate 50, which is used to fix the radiator 30 and the connector 40. The fixing plate 50 is distributed on the side of the radiator 30 facing the circuit board 20. The fixing connection method between the fixing plate 50 and the radiator 30 is different from the fixing connection method between the fixing plate 50 and the connector 40.

[0148] The fixing connection method between the fixing plate 50 and the radiator 30 differs from the fixing connection method between the fixing plate 50 and the connector 40. These two different fixing connection methods work together to, on the one hand, make the stress distribution between different components more uniform and avoid localized stress concentration; on the other hand, the different fixing connection methods jointly enhance the connection strength between the fixing plate 50 and the radiator 30, and between the fixing plate 50 and the connector 40, thereby improving the overall structural stability. Furthermore, the different fixing connection methods help simplify the installation process and reduce installation and maintenance costs.

[0149] In some embodiments, the side of the heat sink 30 facing the circuit board 20 is used for soldering or bonding the mounting plate 50. Soldering provides a strong and well-sealed connection, enhancing the connection strength and thermal conductivity between the mounting plate 50 and the heat sink 30. Through an efficient heat conduction path, the heat generated by the power device 4 is rapidly transferred to the heat sink 30, ensuring temperature control of the power module 10 during high-power operation and improving the power density and efficiency of the power module 10. This also adapts to the needs of high-power, high-reliability applications.

[0150] The adhesive bonding method results in uniform stress distribution on the bonding surface, is simple and flexible to operate, can achieve seamless connection, and effectively prevents dust and other impurities from entering.

[0151] Reference Figure 13 and Figure 14 The vehicle-mounted power supply device 300 includes a fixing member 60, which passes through the connector 40 and is embedded in the fixing hole 501 of the fixing plate 50. After the fixing member 60 is embedded in the fixing hole 501, a tight fit is formed between the two, effectively distributing the stress on the connection point, reducing stress concentration, and thus enhancing the connection strength of the entire vehicle-mounted power supply device 300 structure. During vehicle operation, it is subject to various vibrations and impacts. The connection method of the fixing member 60 passing through the connector 40 and embedding in the fixing hole 501 of the fixing plate 50 ensures that the power module 10 remains firmly connected, preventing loosening or detachment.

[0152] The design of the fastener 60 being embedded in the mounting hole 501 allows the fastener 60 to be hidden within the mounting plate 50, without occupying additional space. This makes the structure of the vehicle power supply device 300 more compact, further improving the space utilization of the vehicle power supply device 300. Furthermore, compared to the fastener 60 extending into the radiator 30, embedding the fastener 60 into the mounting plate 50 reduces the mutual interference between the fastener 60 and the radiator 30, which helps to reduce the volume of the radiator 30 or increase the proportion of the coolant flow channels within the radiator 30 in the overall structure.

[0153] To further improve connection efficiency, the connector 40 includes a through hole 403 through which the fixing member 60 passes, and the fixing member 60 is embedded in the fixing hole 501 of the fixing plate 50 through the through hole 403. The connector 40 is fixed to the fixing plate 50 by fixing members 60 such as bolts, which not only improves the mechanical strength of the power module 10 and the reliability of the electrical connection, but also optimizes the overall layout through this embedded design and avoids additional space occupation.

[0154] The fastener 60 can take many forms. In some embodiments, the fastener 60 includes screws, bolts, rivets, or pins. In other embodiments of this application, the fastener 60 takes other forms, and this application does not impose any special restrictions on it.

[0155] Figure 15 for Figure 14 A structural schematic diagram of connector 40. (Refer to...) Figure 14 and Figure 15 The vehicle power supply device 300 includes multiple connectors 40. The fixed end 401 of the connector 40 is used to fix the heat sink 30, and the movable end 402 of each connector 40 is used to abut the bottom 112 of the first groove 11 in the power module 10.

[0156] The fixed end 401 of the connector 40 is fixedly connected to the heat sink 30, and the movable end 402 of the connector 40 abuts against the bottom 112 of the first groove 11. The deformation of the connector 40 presses the power module 10 against the heat sink 30, thereby fixing the power module 10 to the heat sink 30 and ensuring the reliability of the thermal connection between the power module 10 and the heat sink 30. The movable end 402 of the connector 40 abuts against the bottom 112 of the first groove 11, reducing the size of the vehicle power supply device 300 in the first direction and helping to improve the space utilization of the vehicle power supply device 300.

[0157] Figures 13 to 14 In the given vehicle power supply device 300, the structure of the power module 10 is similar to... Figure 4 The structure of the power module 10 is the same as that given, and will not be described again in this application.

[0158] Figure 16This is a second structural schematic diagram of a vehicle-mounted power supply device 300 provided in an embodiment of this application. (Refer to...) Figure 12 The power module 10 includes a second groove 12, which is distributed on one side of the power module 10. The second groove 12 is used to connect to the first groove 11. The movable end 402 of the connector 40 passes through the second groove 12 and extends into the first groove 11 to further reduce the size of the vehicle power supply device 300 in the first direction, which helps to improve the space utilization of the vehicle power supply device 300.

[0159] Since the first groove 11 is used for internal explosion venting of the power module 10, and the second groove 12 connects to the first groove 11, after the high pressure inside the power module 10 is released through the bottom 112 of the first groove 11, it quickly enters the second groove 12 through the first groove 11, so that the explosion venting energy is released along the second groove 12, avoiding excessive concentration of explosion venting pressure and impact in a single direction.

[0160] The second groove 12 is connected to the first groove 11, further increasing the flow area of ​​the explosion venting path. As the high-pressure gas expands into the two second grooves 12, its velocity, temperature, and pressure decrease more rapidly. By dispersing the concentrated explosion venting energy in multiple directions and increasing the complexity and area of ​​the explosion venting path, the efficiency of energy dissipation is greatly improved, thereby reducing the pressure peak inside the module more quickly. Reference Figure 13 and Figure 16 The dimension of power module 10 along the third direction is larger than the dimension of power module 10 along the second direction, and the first, second, and third directions are perpendicular to each other. The dimension of power module 10 along the first direction is the smallest, the dimension of power module 10 along the second direction is the second smallest, and the dimension of power module 10 along the third direction is the largest.

[0161] In some embodiments, the plurality of power modules 10 includes a plurality of pairs of power modules 10, each pair of power modules 10 includes two power modules 10, and the two power modules 10 in each pair of power modules 10 are spaced apart between or on both sides of the fixed ends 401 of the two connectors 40.

[0162] Reference Figure 16 The plurality of power modules 10 includes two pairs of power modules 10. The two pairs of power modules 10 are represented by the letters a1 and a2, respectively. The two pairs of power modules 10 are arranged at intervals along a second direction. Each pair of power modules 10 includes two power modules 10. The two power modules 10 in each pair are arranged at intervals along a third direction between the fixed ends 401 of the two connectors 40.

[0163] Taking the pair of power modules 10 indicated by letter A1 as an example, the two power modules 10 are arranged at intervals along a third direction between the fixed ends 401 of the two connectors 40. The fixed ends 401 of the connectors 40 serve to position and fix the power modules 10. During installation, the power modules 10 only need to be placed within the space defined by the two connectors 40 indicated by letters A1 and A2, which allows for quick and accurate determination of the installation position of the power modules 10, greatly improving installation efficiency.

[0164] By utilizing the space between the fixed ends 401 of the two connectors 40 indicated by letters A1 and A2, the power modules 10 are arranged in a compact spatial layout. Compared to traditional random placement or simple stacking methods, Figure 16 The arrangement of multiple power modules 10 minimizes the redundant space between power modules 10, allowing more power modules 10 to be accommodated in the same volume of the vehicle power supply device 300, improving space utilization and meeting the requirements of the vehicle power supply device 300 for high power density and miniaturization.

[0165] based on Figure 16 The arrangement of multiple power modules 10 allows the heat from the multiple power modules 10 to be transferred to the heat sink 30 more smoothly and evenly, which helps to improve the heat dissipation efficiency of the power modules 10.

[0166] Reference Figure 17 The plurality of power modules 10 includes two pairs of power modules 10. The two pairs of power modules 10 are spaced apart along a second direction, and the two pairs of power modules 10 are represented by the letters b1 and b2, respectively. Each pair of power modules 10 includes two power modules 10. The two power modules 10 in each pair of power modules 10 are arranged spaced apart along a third direction on both sides of the fixed ends 401 of the two connectors 40.

[0167] Taking the pair of power modules 10 indicated by letter B1 as an example, the two power modules 10 in each pair are arranged at intervals along a third direction on both sides of the fixed ends 401 of the two connectors 40 indicated by letters B1 and B2. This makes full use of the space around the fixed ends 401 of the two connectors 40 indicated by letters B1 and B2, avoiding the space idle caused by the concentrated stacking of power modules 10, and making the space around the fixed ends 401 more rationally distributed and utilized. Moreover, within the same space, by optimizing the arrangement of power modules 10 to accommodate more power modules 10, the overall space utilization rate is improved, which helps to achieve the miniaturization and compact design of the vehicle power supply device 300 while meeting power requirements.

[0168] Figure 18This is the fourth structural schematic diagram of an on-board power supply device 300 provided in an embodiment of this application. (Refer to...) Figure 18 The plurality of power modules 10 includes two pairs of power modules 10. The two pairs of power modules 10 are represented by the letters c1 and c2, respectively. The two pairs of power modules 10 are arranged at intervals along a third direction. Each pair of power modules 10 includes two power modules 10. The two power modules 10 in each pair of power modules 10 are arranged at intervals along a second direction.

[0169] and Figure 16 and Figure 17 The difference between the vehicle-mounted power supply device 300 and the one in the middle is that... Figure 18 In the vehicle-mounted power supply device 300, the power module 10 is fixed to the heat sink 30 on both sides along the third direction by a connector 40, which further improves the connection reliability between the heat sink 30 and the power module 10, and is conducive to improving the mechanical fixation, heat dissipation performance and assembly convenience of the power module 10. In addition, the combination with the explosion-proof groove design significantly enhances the safety and reliability of the module.

[0170] exist Figure 18 In the given embodiment, the connector 40 located between the two pairs of power modules 10 along a third direction is integrated to reduce the number of parts and improve assembly efficiency.

[0171] exist Figure 16 , Figure 17 and Figure 18 In the given vehicle power supply device 300, the structure of the power module 10 is similar to... Figure 8 The power module 10 given in the previous paper has the same structure and the same technical effect, and will not be described again in this application.

[0172] exist Figures 12 to 14 , Figures 16 to 18 In the given embodiment, the size of the slot 111 of the first groove 11 of the power module 10 along the second direction is smaller than the size of the slot 111 of the first groove 11 along the third direction.

[0173] The opening 111 of the first groove 11 has a smaller dimension along the second direction to limit the connection 40 that abuts against the bottom 112 of the first groove 11, preventing the connection 40 from moving or shaking in the second direction. The opening 111 of the first groove 11 has a larger dimension along the third direction to facilitate adjustment of the length of the connection 40 extending into the first groove 11, so as to meet the pressure requirements for fixing different power modules 10 to the heat sink 30.

[0174] Furthermore, when the first groove 11 is used to vent an explosion inside the power module 10, the opening 111 of the first groove 11 has a smaller dimension along the second direction and a larger dimension along the third direction. This guides and constrains the high-pressure gas released from the bottom 112 of the first groove 11, guiding the high-pressure gas released from the bottom 112 to diffuse rapidly along the third direction, effectively suppressing and reducing the pressure peak inside the power module 10. Simultaneously, this helps ensure that the vented energy and debris are released along the third direction, minimizing the risk of unintended impact damage or secondary destruction to the heat dissipation surface 6 and other locations of the power module 10, as well as other structures surrounding the power module 10, due to disordered energy diffusion.

[0175] Figure 19 for Figure 18 A schematic diagram of the structure of the medium-power module 10. (Refer to...) Figure 18 and Figure 19 Each power module 10 has a first side 51 and a second side 52 facing away from each other along a second direction. Each power module 10 includes a plurality of signal pins 23 and a plurality of power pins 22. The signal pins 23 are used to transmit control signals or detection signals, and the power pins 22 are used to transmit AC power or direct power. The plurality of signal pins 23 of each power module 10 are distributed on the first side 51, and the plurality of power pins 22 of each power module 10 are distributed on the first side 51.

[0176] Multiple signal pins 23 and multiple power pins 22 are respectively distributed on the first side 51 and the second side 52 opposite to each other along the second direction of the package body 1 to achieve physical isolation and functional partitioning of strong and weak currents. On the one hand, it optimizes the electrical performance of the power module 10 and effectively suppresses electromagnetic interference of the power circuit to sensitive signals. On the other hand, it can also improve heat dissipation efficiency through centralized heat source management.

[0177] Reference Figure 18 and Figure 19 The first side 51 of two power modules 10 arranged adjacent to each other along the second direction are arranged opposite each other along the second direction. Along the second direction, the signal pins 23 of the two adjacent power modules 10 are arranged adjacent to each other, which avoids the space waste caused by the dispersed arrangement of the signal pins 23, helps to reduce the size of the vehicle power supply device 300 along the second direction, thereby reducing the overall volume of the vehicle power supply device 300 and meeting the requirements for miniaturization and lightweighting.

[0178] In some embodiments, refer to Figure 11 and Figure 18The power module 10 includes a third groove 13 and a fourth groove 14, which are distributed between two adjacent pins 2 arranged along a third direction. The depth of the third groove 13 along the second direction is less than the depth of the fourth groove 14. The width of the third groove 13 along the third direction is less than the width of the fourth groove 14.

[0179] The third groove 13 or the fourth groove 14 between two adjacent pins 2 is used to increase the creepage distance, so as to ensure the electrical safety between the corresponding two pins 2 while reducing the size of the power module 10 along the third direction.

[0180] The third groove 13 has a shallow depth along the second direction, while the fourth groove 14 has a deep depth along the second direction. Therefore, the thickness of the bottom 112 of the fourth groove 14 is thinner than that of the bottom 112 of the third groove 13, resulting in lower cross-sectional stiffness. When the internal pressure of the power module 10 increases due to a fault, the bottom 112 of the fourth groove 14 will break first, thus constructing a directional venting path parallel to the heat dissipation surface 6 through the fourth groove 14. When the internal pressure of the power module 10 rises sharply due to overcurrent, overvoltage, overtemperature, or other operating conditions, the internal pressure of the power module 10 will be guided to be released along the venting path parallel to the heat dissipation surface 6, preventing the pressure from being released from the heat dissipation surface 6. This reduces the risk of the heat dissipation surface 6 of the power module 10 being damaged under faults such as overcurrent, overvoltage, and overtemperature, thereby ensuring the safety of the power module 10.

[0181] Within the narrow gap of pin 2, a fourth groove 14 with a relatively large width along the third direction forms a significant stress concentration area and a weak point, serving as an internal pressure relief zone for the power module 10 and contributing to its safety. Furthermore, after the bottom 112 of the fourth groove 14 ruptures, the wider groove 14 guides the release of high-pressure gas, effectively suppressing internal pressure peaks in the power module 10 and preventing ruptures at other locations in the power module 10 due to internal overpressure. This significantly improves the safety and reliability of the power module 10.

[0182] In some embodiments, refer to Figure 11 The fourth groove 14 is distributed between two adjacent power pins 22 arranged along a third direction. In the event of an explosion, the high-energy explosion risk is confined to the power side region, keeping the explosion energy impact away from the vulnerable signal pins 23. This significantly reduces the damage to control and monitoring functions during an explosion, and enhances the overall reliability and fault safety of the power module 10.

[0183] In the vehicle-mounted power supply device 300 provided in this application, reference is made to Figure 5Each power module 10 includes a package 1 and multiple pins 2. The package 1 is used to fix the multiple pins 2. One end of each pin 2 is exposed in the package 1. One end of each pin 2 is bent in the direction away from the heat sink 30 to serve as a connection end 21. The connection end 21 is used to electrically connect to the circuit board 20 to reduce the size of the power module 10 in the second direction, thereby reducing the size of the vehicle power supply device 300 in the second direction.

[0184] The bent connection end 21 reduces the height of the power module 10 in the first direction, which helps to reduce the size of the power module 10 in the first direction, and thus reduce the size of the vehicle power supply device 300 in the first direction.

[0185] In some embodiments, refer to Figure 5 The package 1 includes a heat dissipation window 16 and a first groove 11. The package 1 is used to encapsulate the insulating substrate 3. The heat dissipation window 16 is used to expose the heat dissipation surface 6 of the power module 10. The heat dissipation surface 6 is used to conduct heat to connect the heat sink 30.

[0186] The heat dissipation surface 6 of the power module 10 is used for direct thermal connection to the heat sink 30. On the one hand, this establishes a path with the lowest thermal resistance, improving the heat dissipation efficiency of the power module 10, thereby allowing the power module 10 to withstand higher power or reduce the operating temperature of the power module 10. On the other hand, it is used to reduce the size of the vehicle power supply device 300 along the first direction.

[0187] In some embodiments, the heat dissipation window 16 and the first groove 11 are distributed on opposite sides of the package body 1 along the first direction. The recessed direction of the first groove 11 is towards the heat dissipation window 16 along the first direction. The side of the insulating substrate 3 away from the first groove 11 along the first direction is exposed to the package body 1 through the heat dissipation window 16. The heat dissipation surface 6 is distributed on the side of the insulating substrate 3 exposed to the insulating substrate 3. The area of ​​the insulating substrate 3 is larger than the area of ​​the groove bottom 112 of the first groove 11.

[0188] Because the package 1 has the smallest dimensions and the weakest structure along the first direction, a directional pressure relief path is constructed by distributing the first grooves 11 on the side away from the heat dissipation window 16 along the first direction. In the event of a sharp increase in internal pressure due to overcurrent, overvoltage, or overtemperature conditions, the internal pressure of the power module 10 is released along this directional pressure relief path, preventing pressure release from the heat dissipation surface 6. This reduces the risk of the heat dissipation surface 6 of the power module 10 being damaged under faults such as overcurrent, overvoltage, or overtemperature, thus ensuring the safety of the power module 10.

[0189] The heat dissipation surface 6 is exposed to the outside of the package 1 and is thermally connected to the heat sink 30. When the power module 10 fails, the heat inside the power module 10 is quickly transferred to the heat sink 30 through the heat dissipation surface 6, which reduces the temperature rise around the heat dissipation surface 6 and the pressure buildup inside the power module 10, thus helping to reduce the risk of the heat dissipation surface 6 bursting.

[0190] The area of ​​the insulating substrate 3 is larger than the area of ​​the bottom 112 of the first groove 11. The larger area of ​​the insulating substrate 3 bearing pressure and the smaller area of ​​the bottom 112 of the first groove 11 bearing pressure are beneficial to improving the pressure bearing capacity of the insulating substrate 3 under the same conditions. This makes the fracture strength of the insulating substrate 3 greater than that of the bottom 112 of the first groove 11. This ensures that when the pressure inside the power module 10 exceeds the bearing value of the bottom 112 of the first groove 11 under fault conditions such as overcurrent, overtemperature, and overvoltage, the bottom 112 of the first groove 11 will fracture before the insulating substrate 3. Furthermore, the insulating substrate 3 will not fracture when the bottom 112 of the first groove 11 fractures. This effectively avoids the risk of insulation failure of the power module 10 and leakage of the heat sink 30 due to the fracture of the insulating substrate 3, thus ensuring the operational reliability of the power module 10.

[0191] In some embodiments, the power module 10 includes a plurality of power devices 4, and the package 1 is used to encapsulate the plurality of power devices 4. Each power device 4 is distributed between the insulating substrate 3 and the bottom 112 of the first groove 11. The thickness of the insulating substrate 3 along the first direction is greater than the thickness of the bottom 112 of the first groove 11 along the first direction.

[0192] When the power module 10 is working normally, the insulating substrate 3 and the bottom 112 of the first groove 11 form an efficient double-sided heat dissipation channel for the power device 4, so as to improve the heat dissipation efficiency, power density and electrical performance of the power device 4.

[0193] Since the first groove 11 is used for internal explosion venting of the power module 10, in the event of a power module 10 failure, the power devices 4 are distributed between the insulating substrate 3 and the bottom of the first groove 11 to ensure that the high pressure or high temperature gas inside the power module 10 is released directionally along the directional explosion venting path defined by the first groove 11, preventing the package 1 from randomly bursting, thereby improving safety.

[0194] The insulation substrate 3 has a large thickness, while the bottom 112 of the first groove 11 has a small thickness. Under the same conditions, this is beneficial to improving the pressure resistance of the insulation substrate 3, thereby making the fracture strength of the insulation substrate 3 greater than that of the bottom 112 of the first groove 11. This ensures that under fault conditions such as overcurrent, overtemperature, and overvoltage, when the pressure inside the power module 10 exceeds the bearing capacity of the bottom 112 of the first groove 11, the bottom 112 of the first groove 11 will fracture before the insulation substrate 3. Furthermore, the insulation substrate 3 will not fracture when the bottom 112 of the first groove 11 fractures. This effectively avoids the risk of insulation failure of the power module 10 and leakage of the heat sink 30 due to the fracture of the insulation substrate 3, thus ensuring the operational reliability of the power module 10.

[0195] In some embodiments, the area of ​​the opening 111 of the first groove 11 is greater than the area of ​​the bottom 112 of the first groove 11, and the breaking strength of the bottom 112 of the first groove 11 is less than the breaking strength of the insulating substrate 3.

[0196] The insulation substrate 3 has a large thickness, while the bottom 112 of the first groove 11 has a small thickness. Under the same conditions, this is beneficial to improving the pressure resistance of the insulation substrate 3, thereby making the fracture strength of the insulation substrate 3 greater than that of the bottom 112 of the first groove 11. This ensures that under fault conditions such as overcurrent, overtemperature, and overvoltage, when the pressure inside the power module 10 exceeds the bearing capacity of the bottom 112 of the first groove 11, the bottom 112 of the first groove 11 will fracture before the insulation substrate 3. Furthermore, the insulation substrate 3 will not fracture when the bottom 112 of the first groove 11 fractures. This effectively avoids the risk of insulation failure of the power module 10 and leakage of the heat sink 30 due to the fracture of the insulation substrate 3, thus ensuring the operational reliability of the power module 10.

[0197] In this application, by packaging multiple power devices 4 into a single module, not only is the power density improved, but the layout space of the power devices 4 and the number of power terminals are also optimized. This simplifies system design and assembly processes, and reduces manufacturing costs and potential connection reliability risks. By distributing a first groove 11 on the side of the package 1 of the power module 10 or on the side facing away from the heat dissipation surface 6, a pre-designed bursting path at the first groove 11 guides the release of internal pressure in the power module 10 in the event of a failure. When the internal pressure of the power module 10 rises sharply due to overcurrent, overvoltage, or overtemperature conditions, the bottom 112 of the first groove 11 will rupture first, preventing the pressure from the power module 10 bursting and directly acting on the heat dissipation surface 6, effectively preventing damage to the heat dissipation surface 6 due to bursting, and thus preventing damage to the insulating layer of the insulating substrate 3. Furthermore, it prevents the pressure from the power module 10 bursting and puncturing the heat sink 30, preventing leakage or damage to the heat sink 30.

[0198] Therefore, this application improves the safety of the power module 10 by designing the first groove 11. The power module 10 provided in this application is also suitable for scenarios with high power density and high reliability requirements, such as vehicle power supply devices 300, effectively extending the life of the power module 10, reducing maintenance costs, and ensuring the safety and stability of system operation.

[0199] In the vehicle power supply device 300 provided in this application, by optimizing the spatial layout of the circuit board 20, heat sink 30, multiple power modules 10 and connectors 40, the overall height of the vehicle power supply device 300 is significantly reduced, and the structure of the vehicle power supply device 300 is made more compact. It also improves the power density and efficiency of the power modules 10, making it suitable for high power density and high reliability scenarios.

[0200] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A vehicle-mounted power supply device, characterized in that, The on-board power supply device includes at least one of a motor controller and an on-board charger. The motor controller controls the drive motor of the power equipment, and the on-board charger charges the power battery of the power equipment. The on-board power supply device includes a circuit board, a heat sink, and multiple power modules. The circuit board electrically connects the power modules, and the heat sink transfers coolant to dissipate heat from the multiple power modules. The plurality of power modules are distributed between the circuit board and the heat sink along a first direction. The plurality of power modules are fixed to the side of the heat sink facing the circuit board. Each power module includes a first groove on the side facing the circuit board. The first groove is recessed towards the heat sink along the first direction. The other side of each power module away from the circuit board is used for thermally conductive connection to the heat sink.

2. The vehicle-mounted power supply device according to claim 1, characterized in that, The vehicle power supply device includes a connector, which is fixed to the side of the heat sink facing the circuit board. The connector is used to fix the thermally conductive connection between the power module and the heat sink.

3. The vehicle-mounted power supply device according to claim 2, characterized in that, The vehicle power supply device includes a fixing plate for fixing the radiator and the connector. The fixing plate is distributed on the side of the radiator facing the circuit board. The fixing connection method between the fixing plate and the radiator is different from the fixing connection method between the fixing plate and the connector.

4. The vehicle-mounted power supply device according to claim 3, characterized in that, The side of the heat sink facing the circuit board is used for welding or bonding the mounting plate, and the vehicle power supply device includes a fixing member for passing through the connector and embedding into the fixing hole of the mounting plate.

5. The vehicle-mounted power supply device according to any one of claims 1-4, characterized in that, The vehicle power supply device includes multiple connectors, the fixed end of each connector is used to fix the heat sink, and the movable end of each connector is used to abut the bottom of the first groove in the power module.

6. The vehicle-mounted power supply device according to claim 5, characterized in that, The power module includes a second groove, which is distributed on one side of the power module. The second groove is used to connect to the first groove, and the movable end of the connector extends into the first groove through the second groove.

7. The vehicle-mounted power supply device according to claim 5, characterized in that, The dimension of the power module along the third direction is greater than the dimension of the power module along the second direction. The first direction, the second direction and the third direction are perpendicular to each other. The plurality of power modules include a plurality of pairs of power modules. Each pair of power modules includes two power modules. The two power modules in each pair are arranged at intervals between or on both sides of the fixed ends of the two connectors.

8. The vehicle-mounted power supply device according to claim 7, characterized in that, The dimension of the opening of the first groove along the second direction is smaller than the dimension of the opening of the first groove along the third direction.

9. The vehicle-mounted power supply device according to claim 7, characterized in that, The first and second sides of each power module are opposite to each other along the second direction. Each power module includes multiple signal pins and multiple power pins. The signal pins are used to transmit control signals or detection signals, and the power pins are used to transmit AC or DC power. The plurality of signal pins of each power module are distributed on the first side, and the plurality of power pins of each power module are distributed on the second side. The first sides of two power modules that are adjacent to each other along the second direction are arranged opposite each other along the second direction.

10. The vehicle-mounted power supply device according to claim 9, characterized in that, The power module includes a third groove and a fourth groove, the third groove or the fourth groove being distributed between two adjacent pins arranged along the third direction, the depth of the third groove being less than the depth of the fourth groove along the second direction, the width of the third groove being less than the width of the fourth groove along the third direction, and the fourth groove being distributed between two adjacent power pins arranged along the third direction.

11. The vehicle-mounted power supply device according to any one of claims 1-10, characterized in that, The power module includes a package and multiple pins. The package is used to fix the multiple pins. One end of each pin is exposed in the package. One end of each pin is bent in a direction away from the heat sink to serve as a connection end. The connection end is used to electrically connect to the circuit board.

12. The vehicle-mounted power supply device according to claim 11, characterized in that, The package includes a heat dissipation window and the first groove. The package is used to encapsulate an insulating substrate. The heat dissipation window exposes the heat dissipation surface of the power module. The heat dissipation surface is used for thermally conductive connection to a heat sink, wherein: The heat dissipation window and the first groove are distributed on opposite sides of the package body along the first direction. The recessed direction of the first groove is towards the heat dissipation window along the first direction. The side of the insulating substrate away from the first groove along the first direction is exposed to the package body through the heat dissipation window. The heat dissipation surface is distributed on the side of the insulating substrate exposed to the insulating substrate. The area of ​​the insulating substrate is larger than the bottom area of ​​the first groove.

13. The vehicle-mounted power supply device according to claim 11, characterized in that, The power module includes multiple power devices and an insulating substrate. The package is used to encapsulate the multiple power devices and the insulating substrate. Each power device is distributed between the insulating substrate and the bottom of the first groove. The thickness of the insulating substrate along the first direction is greater than the thickness of the bottom of the first groove along the first direction.

14. The vehicle-mounted power supply device according to claim 11, characterized in that, The opening area of ​​the first groove is larger than the bottom area of ​​the first groove, and the breaking strength of the bottom of the first groove is less than the breaking strength of the insulating substrate of the power module.

15. A power equipment, characterized in that, The power equipment includes at least one of a drive motor or a power battery and an on-board power supply device according to any one of claims 1-14, wherein the on-board power supply device is used to control the drive motor or to charge the power battery.

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