Semiconductor processing-based resin reinforced adhesive coating device and method

Abstract

The invention discloses a semiconductor processing-based resin reinforced adhesive coating device and method, and relates to the technical field of semiconductor processing. The device comprises an equipment box and a semiconductor material fixedly connected to a substrate, and further comprises a processing platform which is arranged on the equipment box, a movable transverse plate is installed on the processing platform in a sliding mode, and a movable assembly is arranged between the movable transverse plate and the equipment box; the machining platform is provided with two positioning assemblies used for positioning a base plate. And the movable frame is arranged on the movable transverse plate, a lifting plate is arranged on the movable frame through a lifting assembly, and two coating units are arranged on the lifting plate. The device has the beneficial effects that through cooperation of the external spraying pipe and the internal spraying pipe, effective tackifier spraying can be conducted on the outer connecting angle and the inner connecting angle of a substrate and a semiconductor material at the same time, spraying pertinence is higher, meanwhile, horizontal moving spraying of the outer connecting angle and the inner connecting angle can be achieved under cooperation of the moving assembly, the spraying range is wider, and efficiency is higher.

Description

An apparatus and method for coating resin-reinforced adhesives based on semiconductor processing. Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more particularly to a coating apparatus and method for resin-reinforced adhesives based on semiconductor processing. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. In current semiconductor processing, after the semiconductor material is fixed to the substrate, a coating device is typically used to apply an adhesive layer to the junction between the substrate and the material. This prevents damage at the junction and provides secondary protection. Existing coating devices employ various methods to coat semiconductor substrates. For example, CN113695135A discloses a semiconductor chip uniform spraying device, including a frame, a chip placement stage, a nozzle, and a position adjustment device. The chip placement stage is fixedly connected to the frame and located on one side of the frame. The nozzle is slidably connected to the frame and located on the side of the frame closer to the chip placement stage. The position adjustment device includes a vertical lifting guide rail, a mounting platform, a lifting drive assembly, a moving assembly, a first support plate, an adjustment assembly, and... The second support plate, with the vertical lifting guide rail fixedly connected to the frame and located on the side of the frame near the chip placement stage; existing coating devices, in actual use, can usually only achieve horizontal or vertical spraying of semiconductor materials, but cannot achieve targeted spraying at the corners, thus failing to protect the corners of the semiconductor materials. For example, the aforementioned prior art, which uses the cooperation of moving and adjusting components to achieve horizontal and vertical movement of the nozzle, can only spray the front or side of the semiconductor material, but cannot achieve spraying at the external corners of the semiconductor material and the substrate, let alone the internal corners of the semiconductor material and the substrate. The spraying range is limited and has certain limitations; therefore, there is an urgent need to design a coating device and method based on semiconductor processing resin-reinforced adhesives to solve the above problems. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a coating apparatus and method for resin-reinforced adhesives based on semiconductor processing, which solves the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a coating apparatus for resin-reinforced adhesives based on semiconductor processing, comprising an equipment housing and semiconductor material fixedly connected to a substrate, and further comprising: a processing platform disposed on the equipment housing, a movable horizontal plate slidably mounted on the processing platform, and a moving component disposed between the movable horizontal plate and the equipment housing; two positioning components for positioning the substrate disposed on the processing platform; a movable frame disposed on the movable horizontal plate, and a lifting plate disposed on the movable frame via a lifting component, and two coating units disposed on the lifting plate; a storage tank for storing resin-reinforced adhesive disposed within the coating unit, a discharge pump disposed within the storage tank, and a discharge pipe disposed at the output end of the discharge pump; an external coating component and an internal coating component disposed on the discharge pipe, the external coating component comprising an external spraying pipe for spraying adhesive at the outer junction of the substrate and the semiconductor material, and the internal coating component comprising an internal spraying pipe for spraying adhesive at the inner junction of the substrate and the semiconductor material.

[0005] Preferably, the equipment box is equipped with a control panel, which is used to control the opening, closing and operation status of the moving components, lifting components and coating unit, so as to realize the automated spraying of the inner and outer corners of the substrate and semiconductor material.

[0006] Preferably, the moving component includes a servo motor fixedly installed inside the equipment housing, and a drive roller is fixedly installed on the drive end of the servo motor. A threaded push rod is fixedly installed on the drive roller, and a moving nut is threadedly installed on the threaded push rod. A moving rod is fixedly installed on the moving nut, and the upper end of the moving rod is fixedly installed on the moving horizontal plate. A transverse sliding groove is provided inside the processing platform, and a transverse sliding block that cooperates with the transverse sliding groove is fixedly installed on the moving horizontal plate.

[0007] Preferably, the positioning component includes a support pad fixedly installed on the processing platform, and the substrate is placed on the support pad. Two positioning bolts are threadedly installed on the support pad. A positioning pressure plate for pressing and positioning the substrate is vertically slidably installed on the support pad via a sliding rod, and both positioning bolts are rotatably connected to the positioning pressure plate.

[0008] Preferably, the lifting assembly includes two hydraulic lifting rods fixedly installed on the movable frame, two lifting limit plates are slidably installed inside the movable frame, and the lifting plate is fixedly installed between the two lifting limit plates and at the lower end of the two hydraulic lifting rods.

[0009] Preferably, a support frame is fixedly installed on the lower part of the lifting plate, and a positioning roller for squeezing and positioning semiconductor material is rotatably installed on the support frame.

[0010] Preferably, the external coating assembly includes an external spray pipe fixedly installed on the discharge pipe, and a mounting bracket 1 and a mounting bracket 2 are fixedly installed on the external spray pipe. A cleaning bracket for cleaning the external corners is fixedly installed on the mounting bracket 2, and a smoothing applicator is used to spread the tackifier evenly after spraying on the mounting bracket 1.

[0011] Preferably, the internal coating assembly includes a conveying telescopic tube fixedly connected to the discharge pipe, a fixed tube fixedly connected to the conveying telescopic tube via a guide tube, and a limiting plate fixedly installed on the fixed tube to press against the side of the substrate; a spraying telescopic tube fixedly connected to the fixed tube, and an internal spraying tube fixedly connected to the spraying telescopic tube for spraying; a limiting clamping frame fixedly installed on the limiting plate, and a lifting plate having a lifting slot that cooperates with the limiting clamping frame; and a driven mechanism installed between the external spraying tube and the internal spraying tube.

[0012] Preferably, the driven mechanism includes an electromagnetic adsorption plate one fixedly installed on an external spraying pipe, and an electromagnetic adsorption plate two that cooperates with the electromagnetic adsorption plate one fixedly installed on the internal spraying pipe, wherein the magnetic poles of the electromagnetic adsorption plate one and the electromagnetic adsorption plate two are opposite on the side that are close to each other.

[0013] A method for coating a resin-reinforced adhesive based on semiconductor processing, used in the aforementioned coating apparatus for a resin-reinforced adhesive based on semiconductor processing, includes the following steps: S1, placing the fixed substrate and semiconductor material on a processing platform and fixing them using a positioning component; S2, activating a lifting component to move the coating unit downwards, causing the external spray pipe and internal spray pipe to move downwards synchronously and align with the outer and inner corners of the substrate and semiconductor material, respectively; S3, activating a discharge pump to pump the resin-reinforced adhesive out through the discharge pipe, and using the cooperation of the external and internal coating components to evenly coat the resin-reinforced adhesive onto the outer and inner corners of the substrate and semiconductor material; S4, activating a moving component during the coating process to move the moving frame and coating unit as a whole, coating the outer and inner corners of the substrate and semiconductor material.

[0014] This invention provides a coating apparatus and method for resin-reinforced adhesives based on semiconductor processing. It has the following advantages: 1. When coating semiconductor materials, this coating apparatus, through the cooperation of the discharge pump and the external coating component, can uniformly spray the adhesive in the storage tank onto the outer corner of the substrate and the semiconductor material via an external spray pipe, achieving targeted and uniform coating at the outer corner, resulting in a better coating effect.

[0015] 2. When coating semiconductor materials, this coating device, through the cooperation of the discharge pump and the internal coating component, can evenly spray the tackifier in the storage tank onto the internal junction of the substrate and the semiconductor material through the built-in spray pipe, thereby achieving targeted and uniform coating of the internal junction and better coating effect.

[0016] 3. When coating semiconductor materials, this coating device can flexibly adjust the height of the external and internal spray tubes through the cooperation of the lifting components, so as to adapt to semiconductor materials and substrates of different sizes. Through the cooperation of the moving components, the position of the external and internal spray tubes can be flexibly adjusted to achieve moving coating of the inner and outer corners of the substrate and semiconductor materials, resulting in higher coating efficiency.

[0017] 4. When coating semiconductor materials, this coating device can stably squeeze and fix both ends of the substrate through the cooperation of two positioning components, so that it will not shake during spraying. At the same time, the positioning pressure roller can apply a certain pressure to the semiconductor material during the moving spraying process, further improving the spraying stability of the semiconductor material.

[0018] In summary, this invention, through the combination of an external spray tube and an internal spray tube, can simultaneously and effectively apply adhesive to the outer and inner corners of the substrate and semiconductor material, resulting in more targeted spraying. Furthermore, with the assistance of the moving component, horizontal moving spraying of the outer and inner corners can be achieved, resulting in a wider application range and higher efficiency.

[0019] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings. Attached Figure Description

[0020] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, in which: Figure 1 is a structural schematic diagram of a coating device for resin-reinforced adhesive based on semiconductor processing proposed in the present invention; Figure 2 is a structural schematic diagram of Figure 1 after being rotated by a certain angle; Figure 3 is a structural schematic diagram of the internal structure of the equipment box in Figure 2; Figure 4 is a structural schematic diagram of Figure 3 after removing the equipment box; Figure 5 is a structural schematic diagram of the upper structure of the processing platform in Figure 3; Figure 6 is a structural schematic diagram of the processing platform and the substrate in Figure 5; Figure 7 is an exploded view of the structure of Figure 6; Figure 8 is a structural schematic diagram of the moving frame and the substrate in Figure 5; Figure 9 is a front view of Figure 8; Figure 10 is a structural schematic diagram of the moving horizontal plate and the moving frame in Figure 8; Figure 11 is an enlarged view of the moving frame in Figure 10; Figure 12 is a structural schematic diagram of the storage box and the limiting plate in Figure 10; Figure 13 is a structural schematic diagram of Figure 12 after removing the storage box; Figure 14 is a structural schematic diagram of the external coating component in Figure 13; Figure 15 is a structural schematic diagram of the internal coating component in Figure 13.

[0021] In the diagram: 1 Equipment box, 2 Control panel, 3 Processing platform, 4 Moving horizontal plate, 5 Substrate, 6 Semiconductor material, 7 Positioning pressure plate, 8 Servo motor, 9 Drive roller, 10 Threaded push rod, 11 Moving nut, 12 Hydraulic lifting rod, 13 Moving rod, 14 Positioning bolt, 15 Storage box, 16 Lifting plate, 17 Material replenishment pipe, 18 Positioning pressure roller, 19 Support frame, 20 Lifting limit plate, 21 Discharge pipe, 22 External spraying pipe, 23 Limiting plate, 24 Limiting clamping frame, 25 Guide pipe, 26 Material conveying telescopic pipe, 27 Spraying telescopic pipe, 28 Internal spraying pipe, 29 Electromagnetic adsorption plate one, 30 Mounting frame one, 31 Flat coating box, 32 Cleaning frame, 33 Mounting frame two, 34 Electromagnetic adsorption plate two, 35 Moving frame, 36 Support pad. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0023] Example 1: Referring to Figures 1-4, a coating device for resin-reinforced adhesive based on semiconductor processing includes an equipment box 1 and a semiconductor material 6 fixedly connected to a substrate 5. The substrate 5 is made of materials such as copper, silver, and nickel. The semiconductor material 6 and the substrate 5 are connected and fixed by welding.

[0024] The coating apparatus also includes: a processing platform 3, which is set on the equipment box 1. A movable horizontal plate 4 is slidably installed on the processing platform 3. A transverse sliding groove is opened in the processing platform 3, and a transverse sliding block that cooperates with the transverse sliding groove is fixedly installed on the movable horizontal plate 4. Through the cooperation of the transverse sliding groove and the transverse sliding block, the movable horizontal plate 4 is slidably installed on the lower part of the processing platform 3, so that the movable horizontal plate 4 can only slide horizontally on the processing platform 3, and will not deviate or separate from the processing platform 3.

[0025] In a further embodiment, a moving assembly is provided between the moving horizontal plate 4 and the equipment box 1. The moving assembly includes a servo motor 8 fixedly installed inside the equipment box 1, and a drive roller 9 is fixedly installed on the drive end of the servo motor 8. A threaded push rod 10 is fixedly installed on the drive roller 9, and a moving nut 11 is threadedly installed on the threaded push rod 10. A moving rod 13 is fixedly installed on the moving nut 11, and the upper end of the moving rod 13 is fixedly installed on the moving horizontal plate 4. The cooperation between the moving rod 13 and the moving horizontal plate 4 is used to limit the moving nut 11, so that the moving nut 11 can only move horizontally and will not rotate.

[0026] When the servo motor 8 starts, it drives the drive roller 9 to rotate in the forward direction. The forward rotation of the drive roller 9 drives the threaded push rod 10 on it to rotate in the forward direction. Since the threaded push rod 10 is threadedly connected to the moving nut 11, and since the moving nut 11 can only move horizontally, the forward rotation of the threaded push rod 10 will drive the moving nut 11 to move in the forward direction. When the drive roller 9 drives the threaded push rod 10 to rotate in the reverse direction, the moving nut 11 can move in the reverse direction. Thus, the moving direction of the moving nut 11 can be controlled by the servo motor 8, and the moving rod 13 will drive the moving horizontal plate 4 to move horizontally, so that the moving horizontal plate 4 can move horizontally in both forward and reverse directions on the processing platform 3.

[0027] Example 2: Referring to Figures 1-2 and 5-7, the technical difference between this example and Example 1 is that: the processing platform 3 is provided with two positioning components for positioning the substrate 5; the positioning components include a support pad 36 fixedly installed on the processing platform 3, and the substrate 5 is placed on the support pad 36. Two positioning bolts 14 are threadedly installed on the support pad 36. A positioning pressure plate 7 for pressing and positioning the substrate 5 is vertically slidably installed on the support pad 36 through a sliding rod, and both positioning bolts 14 are rotatably connected to the positioning pressure plate 7.

[0028] When coating the substrate 5 and the semiconductor material 6, first place the two ends of the substrate 5 on the two support pads 36 respectively, then rotate the positioning bolt 14 to drive the corresponding positioning plate 7 to move down, so that the positioning plate 7 moves down to contact and press with the upper part of the substrate 5, thus firmly pressing and positioning the substrate 5 between the positioning plate 7 and the support pad 36, thereby achieving stable clamping and positioning of the substrate 5.

[0029] In a further embodiment, the equipment box 1 is provided with a control panel 2, which is used to control the opening and closing and operation status of the moving component, the lifting component and the coating unit, so as to realize the automated spraying of the inner and outer corners of the substrate 5 and the semiconductor material 6; the equipment box 1 is provided with multiple heat dissipation openings, so as to efficiently dissipate heat from the internal structure of the equipment box 1 through the heat dissipation openings.

[0030] A movable frame 35 is mounted on the movable horizontal plate 4, and a lifting plate 16 is mounted on the movable frame 35 via a lifting assembly. The movable frame 35 is fixedly mounted on the movable horizontal plate 4, so that it can move with the horizontal movement of the movable horizontal plate 4, which facilitates subsequent moving coating.

[0031] In a further embodiment, the lifting assembly includes two hydraulic lifting rods 12 fixedly mounted on a movable frame 35. Two lifting limit plates 20 are slidably mounted inside the movable frame 35, and a lifting plate 16 is fixedly mounted between the two lifting limit plates 20 and at the lower end of the two hydraulic lifting rods 12. The two lifting limit plates 20 are slidably mounted inside the movable frame 35, so that they can only slide vertically within the movable frame 35 without shifting or separating, thereby limiting the lifting plate 16 so that it can only move vertically.

[0032] When the two hydraulic lifting rods 12 are activated, they will drive the lifting plate 16 below them to move vertically up and down, which can effectively control the height position of the lifting plate 16, so that the lifting plate 16 can be close to the corner of the semiconductor material 6 and the substrate 5, which is convenient for the application of targeted resin-reinforced adhesive at the corner.

[0033] A support frame 19 is fixedly installed on the lower part of the lifting plate 16, and a positioning roller 18 for pressing and positioning the semiconductor material 6 is rotatably installed on the support frame 19. When the lifting plate 16 moves down, it will drive the positioning roller 18 to move down synchronously through the support frame 19, so that the positioning roller 18 can move down to press and adhere to the upper surface of the semiconductor material 6. When the lifting plate 16 moves with the horizontal movement of the moving frame 35, the positioning roller 18 can move synchronously and roll on the upper surface of the semiconductor material 6, so that the semiconductor material 6 can be pressurized at the same time as it moves, thereby further improving the positioning stability of the semiconductor material 6 and improving the stability of its coating process.

[0034] Example 3: Referring to Figures 1-3 and 8-15, the technical difference between this example and Example 2 is that: two coating units are provided on the lifting plate 16, and a storage tank 15 for storing resin-reinforced adhesive is provided in the coating unit. A discharge pump is provided in the storage tank 15, and a discharge pipe 21 is provided on the output end of the discharge pump. When the discharge pump is started, it will suck in the resin-reinforced adhesive in the storage tank 15 and pump it out through the discharge pipe 21 to complete the automatic transfer of resin-reinforced adhesive. A replenishment pipe 17 is provided on the storage tank 15, through which resin-reinforced adhesive can be replenished into the storage tank 15.

[0035] In a further embodiment, the discharge pipe 21 is provided with an external coating component and an internal coating component. The external coating component is provided with an external spraying pipe 22 for spraying an adhesive at the outer junction of the substrate 5 and the semiconductor material 6. The external coating component includes an external spraying pipe 22 fixedly installed on the discharge pipe 21. During spraying, the hydraulic lifting rod 12 drives the lifting plate 16, the storage tank 15, the discharge pipe 21, and the external spraying pipe 22 to move downward as a whole, so that the external spraying pipe 22 moves down to the outer junction of the substrate 5 and the semiconductor material 6. At this time, the discharge pump is started to pass the resin-reinforcing adhesive through the discharge pipe. The material is pumped through the discharge pipe 21 into the external spraying pipe 22 and sprayed directly onto the outer corner of the substrate 5 and the semiconductor material 6, thus completing the automatic spraying of the outer corner. During the spraying process, the servo motor 8 drives the moving horizontal plate 4 and the moving frame 35 to move horizontally as a whole, which in turn drives the external spraying pipe 22 to move horizontally relative to the substrate 5. This allows for simultaneous spraying of the corner of the substrate 5 and the semiconductor material 6 while moving, thereby completing the comprehensive and efficient spraying of the outer corner of the substrate 5 and the semiconductor material 6, resulting in higher spraying efficiency.

[0036] An external spraying pipe 22 is fixedly mounted with a mounting bracket 30 and a mounting bracket 33. A cleaning bracket 32 ​​for cleaning the outer corners is fixedly mounted on the mounting bracket 33. The mounting bracket 30 is a smoothing applicator 31 for evenly spreading the tackifier after spraying. The cleaning bracket 32 ​​is located at the front of the external spraying pipe 22, and the smoothing applicator 31 is located at the rear of the external spraying pipe 22. This ensures that when the external spraying pipe 22 moves to spray, the cleaning bracket 32 ​​will first contact the outer corners of the substrate 5 and the semiconductor material 6. The coating material comes into contact with the substrate 5 and semiconductor material 6, and removes dust and impurities from the outer corners while moving. After the coating is applied by the external spray tube 22, the flat coating box 31 will come into contact with the coated substrate 5 and semiconductor material 6. This allows the coated resin-reinforcing adhesive to come into contact with the substrate 5 and semiconductor material 6 while moving, and spreads the resin-reinforcing adhesive evenly. At the same time, excess resin-reinforcing adhesive is scooped into the flat coating box 31, making the resin-reinforcing adhesive more evenly applied and preventing bulges, thus improving the overall aesthetics of the coated outer corners.

[0037] In a further embodiment, the internal coating assembly is provided with a built-in spraying tube 28 for spraying an adhesive at the inner corner of the substrate 5 and the semiconductor material 6. The internal coating assembly includes a conveying telescopic tube 26 fixedly connected to the discharge tube 21. A fixed tube is fixedly connected to the conveying telescopic tube 26 via a guide tube 25, and a limiting plate 23 that abuts against the side of the substrate 5 is fixedly installed on the fixed tube. A spraying telescopic tube 27 is fixedly connected to the fixed tube, and the built-in spraying tube 28 for spraying is fixedly connected to the spraying telescopic tube 27. The resin-enhancing adhesive in the discharge tube 21 is conducted through the conveying telescopic tube 26 to the guide tube 25, and then through the guide tube 25 to the fixed tube, and then through the fixed tube to the spraying telescopic tube 27, and finally to the built-in spraying tube 28 and sprayed out.

[0038] A limiting clamping frame 24 is fixedly installed on the limiting clamping plate 23, and a lifting plate 16 has a lifting groove that cooperates with the limiting clamping frame 24. When the limiting clamping frame 24 is engaged with the lifting plate 16, the vertical movement of the lifting plate 16 will drive the limiting clamping plate 23 to move through the limiting clamping frame 24. Therefore, during spraying, the lifting plate 16 can drive the limiting clamping frame 24 and the limiting clamping plate 23 to move downwards, causing the limiting clamping plate 23 to engage with the side of the substrate 5, thus enabling proper spraying. The limiting plate 23 limits the movement of the moving frame 35 during the coating process, preventing the limiting plate 23 from continuing to move horizontally synchronously. When the limiting plate 23 moves downward, it will drive the built-in spray tube 28 to move synchronously through the fixing tube and the spray telescopic tube 27. This will move the built-in spray tube 28 to the inner corner of the substrate 5 and the semiconductor material 6. At this time, the resin-reinforced adhesive sprayed from the built-in spray tube 28 will be directly sprayed onto the inner corner, thus enabling synchronous spraying of the inner corner.

[0039] In a further embodiment, a driven mechanism is installed between the external spraying pipe 22 and the internal spraying pipe 28. The driven mechanism includes an electromagnetic adsorption plate 29 fixedly installed on the external spraying pipe 22, and an electromagnetic adsorption plate 34 fixedly installed on the internal spraying pipe 28 to cooperate with the electromagnetic adsorption plate 29. The magnetic poles of the electromagnetic adsorption plate 29 and the electromagnetic adsorption plate 34 are opposite on the side closest to each other. After the height positions of the external spraying pipe 22 and the internal spraying pipe 28 are adjusted, the operator can use the servo motor 8 to move the external spraying pipe 22 to the outside of the semiconductor material 6. Push the manually movable built-in spray tube 28 to move it to the corresponding position inside the semiconductor material 6 to complete the initial preparation; then activate the electromagnetic adsorption plate 29 and the electromagnetic adsorption plate 34 so that they are adsorbed by the outer wall of the semiconductor material 6, thus completing the synchronous movement of the external spray tube 22 and the built-in spray tube 28. At this time, as the external spray tube 22 moves, it will drive the built-in spray tube 28 to move synchronously through the adsorption of the electromagnetic adsorption plate 29 and the electromagnetic adsorption plate 34, thus completing the synchronous spraying of the outer and inner corners of the substrate 5 and the semiconductor material 6, resulting in higher spraying efficiency.

[0040] During mobile spraying, the limiting plate 23 will not move under the limiting effect of the substrate 5, thus preventing the fixed tube from moving. At this time, when the discharge tube 21 and the built-in spraying tube 28 move synchronously, the conveying telescopic tube 26 and the spraying telescopic tube 27 will be stretched synchronously, so that the two can be extended synchronously. This allows for mobile spraying of the inner corner without affecting the conveying of the resin-reinforced adhesive, effectively improving the accuracy of spraying.

[0041] The working principle of this coating device is as follows: When coating the substrate 5 and the semiconductor material 6, the two ends of the substrate 5 are first placed on the two support pads 36 respectively. Then, the positioning bolt 14 is rotated to drive the corresponding positioning plate 7 to move down, so that the positioning plate 7 moves down to contact and press with the upper part of the substrate 5, thereby firmly pressing and positioning the substrate 5 between the positioning plate 7 and the support pads 36, thus achieving stable clamping and positioning of the substrate 5.

[0042] Then, the hydraulic lifting rod 12 is activated to drive the lifting plate 16 below it to move vertically downward. The downward movement of the lifting plate 16 will drive the external spraying pipe 22 to move downward as a whole through the storage box 15 and the discharge pipe 21, so that the external spraying pipe 22 moves down to the outer corner of the substrate 5 and the semiconductor material 6. At the same time, the downward movement of the lifting plate 16 will drive the limiting clamping frame 24 and the limiting clamping plate 23 to move downward, so that the limiting clamping plate 23 is clamped to the side of the substrate 5. The downward movement of the limiting clamping plate 23 will drive the internal spraying pipe 28 to move synchronously through the fixing pipe and the spraying telescopic pipe 27, so that the internal spraying pipe 28 can be moved to the inner corner of the substrate 5 and the semiconductor material 6, thus completing the height adjustment of the external spraying pipe 22 and the internal spraying pipe 28.

[0043] Once the height positions of the external spraying pipe 22 and the internal spraying pipe 28 are adjusted, the operator can start the servo motor 8 to move the external spraying pipe 22 to the outside of the semiconductor material 6, and then manually move the internal spraying pipe 28 to the corresponding position on the inside of the semiconductor material 6. Then, activate the electromagnetic adsorption plate 29 and the electromagnetic adsorption plate 34 so that they are attracted to each other through the outer wall of the semiconductor material 6, thus completing the synchronous movement of the external spraying pipe 22 and the internal spraying pipe 28. At this time, as the external spraying pipe 22 moves, it will drive the internal spraying pipe 28 to move synchronously through the adsorption effect of the electromagnetic adsorption plate 29 and the electromagnetic adsorption plate 34, thus completing the horizontal position adjustment of the external spraying pipe 22 and the internal spraying pipe 28.

[0044] During spraying, the discharge pump can be started to draw in the resin-reinforced adhesive in the storage tank 15 and pump it out through the discharge pipe 21. The resin-reinforced adhesive in the discharge pipe 21 will be sprayed directly onto the outer corner of the substrate 5 and the semiconductor material 6 through the external spraying pipe 22, thus completing the automatic spraying of the outer corner. Another part of the resin-reinforced adhesive in the discharge pipe 21 will be conducted to the guide pipe 25 through the conveying telescopic pipe 26, and then to the fixed pipe through the guide pipe 25. It will then be conducted to the spraying telescopic pipe 27 through the fixed pipe, and finally to the built-in spraying pipe 28 and sprayed onto the inner corner, thus completing the synchronous spraying of the inner corner.

[0045] During the spraying process, the servo motor 8 is started to drive the drive roller 9 to rotate in the forward direction. The forward rotation of the drive roller 9 will drive the threaded push rod 10 on it to rotate in the forward direction, which in turn drives the moving horizontal plate 4 and the moving frame 35 to move horizontally through the moving rod 13. Thus, the external spraying pipe 22 and the internal spraying pipe 28 move synchronously through the moving frame 35, so as to complete the synchronous moving spraying of the outer and inner corners of the substrate 5 and the semiconductor material 6.

[0046] This invention also provides a method for coating a resin-reinforced adhesive based on semiconductor processing, used in the aforementioned coating apparatus for a resin-reinforced adhesive based on semiconductor processing, comprising the following steps: S1, placing the fixed substrate 5 and semiconductor material 6 on the processing platform 3, and fixing them by a positioning component; S2, activating the lifting component to move the coating unit downwards, causing the external spray pipe 22 and the internal spray pipe 28 to move downwards synchronously and align with the outer and inner corners of the substrate 5 and semiconductor material 6, respectively; S3, activating the discharge pump to pump the resin-reinforced adhesive out through the discharge pipe 21, and uniformly coating the resin-reinforced adhesive onto the outer and inner corners of the substrate 5 and semiconductor material 6 through the cooperation of the external coating component and the internal coating component; S4, activating the moving component during the coating process, moving the moving frame 35 and the coating unit as a whole to perform moving coating on the outer and inner corners of the substrate 5 and semiconductor material 6.

[0047] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A coating apparatus for a resin-reinforced adhesive based on semiconductor processing, comprising an equipment housing (1) and a semiconductor material (6) fixedly connected to a substrate (5), characterized in that, Also includes: A processing platform (3) is mounted on an equipment box (1). A movable horizontal plate (4) is slidably mounted on the processing platform (3), and a moving component is provided between the movable horizontal plate (4) and the equipment box (1). Two positioning components for positioning the substrate (5) are provided on the processing platform (3). A movable frame (35) is mounted on the movable horizontal plate (4), and a lifting plate (16) is provided on the movable frame (35) via a lifting component. Two coating units are provided on the lifting plate (16). The coating units are equipped with... A storage tank (15) for storing resin-reinforced adhesive is provided in the storage tank (15), and a discharge pump is provided on the output end of the discharge pump. An external coating assembly and an internal coating assembly are provided on the discharge pipe (21). An external spray pipe (22) for spraying adhesive at the outer corner of the substrate (5) and the semiconductor material (6) is provided in the external coating assembly, and an internal spray pipe (28) for spraying adhesive at the inner corner of the substrate (5) and the semiconductor material (6) is provided in the internal coating assembly.

2. The coating apparatus for a resin-reinforced adhesive based on semiconductor processing according to claim 1, characterized in that, The equipment box (1) is equipped with a control panel (2). The control panel (2) is used to control the opening and closing and operation status of the moving component, the lifting component and the coating unit, so as to realize the automated spraying of the inner and outer corners of the substrate (5) and the semiconductor material (6).

3. The coating apparatus for a resin-reinforced adhesive based on semiconductor processing according to claim 1, characterized in that, The moving component includes a servo motor (8) fixedly installed in the equipment box (1), and a drive roller (9) fixedly installed on the drive end of the servo motor (8). A threaded push rod (10) is fixedly installed on the drive roller (9), and a moving nut (11) is threadedly installed on the threaded push rod (10). A moving rod (13) is fixedly installed on the moving nut (11), and the upper end of the moving rod (13) is fixedly installed on the moving horizontal plate (4). A transverse sliding groove is provided in the processing platform (3), and a transverse sliding block that cooperates with the transverse sliding groove is fixedly installed on the moving horizontal plate (4).

4. The coating apparatus for a resin-reinforced adhesive based on semiconductor processing according to claim 3, characterized in that, The positioning assembly includes a support pad (36) fixedly installed on the processing platform (3), and the substrate (5) is placed on the support pad (36). Two positioning bolts (14) are threaded on the support pad (36). A positioning pressure plate (7) for pressing the positioning substrate (5) is vertically slidably installed on the support pad (36) via a sliding rod, and both positioning bolts (14) are rotatably connected to the positioning pressure plate (7).

5. The coating apparatus for a resin-reinforced adhesive based on semiconductor processing according to claim 4, characterized in that, The lifting assembly includes two hydraulic lifting rods (12) fixedly installed on a movable frame (35). Two lifting limit plates (20) are slidably installed inside the movable frame (35), and a lifting plate (16) is fixedly installed between the two lifting limit plates (20) and at the lower end of the two hydraulic lifting rods (12).

6. The coating apparatus for a resin-reinforced adhesive based on semiconductor processing according to claim 5, characterized in that, The lower part of the lifting plate (16) is fixedly installed with a support frame (19), and a positioning roller (18) for extruding and positioning semiconductor material (6) is rotatably installed on the support frame (19).

7. The coating apparatus for a resin-reinforced adhesive based on semiconductor processing according to claim 5, characterized in that, The external coating assembly includes an external spray pipe (22) fixedly installed on the discharge pipe (21). The external spray pipe (22) is fixedly installed with a mounting bracket one (30) and a mounting bracket two (33). The mounting bracket two (33) is fixedly installed with a cleaning bracket (32) for cleaning the external corners. The mounting bracket one (30) is a smoothing applicator (31) for spreading the tackifier after spraying.

8. The coating apparatus for a resin-reinforced adhesive based on semiconductor processing according to claim 7, characterized in that, The internal coating assembly includes a conveying telescopic tube (26) fixedly connected to the discharge tube (21). A fixed tube is fixedly connected to the conveying telescopic tube (26) via a guide tube (25). A limiting plate (23) that abuts against the side of the substrate (5) is fixedly installed on the fixed tube. A spraying telescopic tube (27) is fixedly connected to the fixed tube. An internal spraying tube (28) for spraying is fixedly connected to the spraying telescopic tube (27). A limiting clamping frame (24) is fixedly installed on the limiting plate (23). A lifting slot that cooperates with the limiting clamping frame (24) is opened on the lifting plate (16). A driven mechanism is installed between the external spraying tube (22) and the internal spraying tube (28).

9. The coating apparatus for a resin-reinforced adhesive based on semiconductor processing according to claim 8, characterized in that, The driven mechanism includes an electromagnetic adsorption plate one (29) fixedly installed on an external spray pipe (22), and an electromagnetic adsorption plate two (34) that cooperates with the electromagnetic adsorption plate one (29) is fixedly installed on the internal spray pipe (28), and the magnetic poles of the electromagnetic adsorption plate one (29) and the electromagnetic adsorption plate two (34) are opposite on the side that are close to each other.

10. A coating method for a resin-reinforced adhesive based on semiconductor processing, used in the coating apparatus for a resin-reinforced adhesive based on semiconductor processing as described in any one of claims 1-9, characterized in that, Includes the following steps: S1. Place the fixed substrate (5) and semiconductor material (6) on the processing platform (3) and fix them by positioning components; S2. Start the lifting component to move the coating unit down, so that the external spray pipe (22) and the internal spray pipe (28) move down synchronously and align with the outer corner and inner corner of the substrate (5) and semiconductor material (6) respectively; S3. Start the discharge pump to pump out the resin-reinforced adhesive through the discharge pipe (21), and apply the resin-reinforced adhesive evenly to the outer corner and inner corner of the substrate (5) and semiconductor material (6) through the cooperation of the external coating component and the internal coating component; S4. During the application of the resin-reinforced adhesive, start the moving component to move the moving frame (35) and the coating unit as a whole, and apply the resin-reinforced adhesive to the outer corner and inner corner of the substrate (5) and semiconductor material (6).

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