High-precision sapphire optical wafer intelligent cutting device

Abstract

The invention relates to the technical field of sapphire processing, and particularly discloses a high-precision sapphire optical wafer intelligent cutting device which comprises a processing platform, a cutting assembly is fixed to the processing platform and comprises a processing seat, and a transverse arc-shaped processing opening is formed in the middle of the side wall of the processing seat; the machining base is further provided with two first mounting grooves symmetrically formed based on the upper end and the lower end of the machining opening, first air cylinders are fixed to the bottoms of the first mounting grooves, a supporting frame is fixed to the output ends of the first air cylinders, a hollow supporting shaft is fixed to the side wall of the supporting frame, and a guide wheel is rotationally connected to the outer wall of the supporting shaft. A plurality of first through holes communicating with the interior of the guide wheel are formed in the outer wall of the supporting shaft, and a plurality of second liquid passing channels correspondingly communicating with the first through holes are formed in the inner wall of the guide wheel in a penetrating mode to the outer wall of the guide wheel along a center array. The problem that an existing sapphire optical wafer cutting device is low in cutting efficiency is solved.

Description

A high-precision intelligent cutting device for sapphire optical wafers. Technical Field

[0001] This invention relates to the field of sapphire processing technology, and in particular to a high-precision intelligent cutting device for sapphire optical wafers. Background Technology

[0002] In the processing and manufacturing of sapphire optical wafers, the dicing process is extremely critical, as its quality and efficiency directly affect the performance and production cost of the final product. Traditional sapphire wafer dicing equipment mainly uses a taut dicing wire to cut sapphire crystal pillars to obtain lenses of the required thickness.

[0003] However, this traditional cutting method has many significant problems in practical applications. During the cutting process, the contact area between the cutting wire and the sapphire crystal pillar is dynamically changing, gradually increasing to a maximum value and then gradually decreasing. When the contact area reaches its maximum, the resistance experienced by the cutting wire is greatest, resulting in the slowest feed speed. Because current technology struggles to precisely control the feed speed of the cutting wire, to ensure the stability of the cutting process, the cutting wire must feed at its slowest speed throughout the entire process. This inefficient feeding method severely limits the improvement of cutting efficiency, leading to longer production cycles, increased production costs, and difficulty in meeting the requirements of high efficiency and low cost for large-scale industrial production.

[0004] Furthermore, the high-speed friction between the cutting wire and the sapphire crystal pillar during the cutting process generates a significant amount of heat. If this heat cannot be dissipated effectively and promptly, it can cause localized overheating of the sapphire crystal pillar, leading to thermal damage, affecting cutting quality, and reducing product yield. Simultaneously, high temperatures accelerate the wear of the cutting wire, shorten its lifespan, increase equipment maintenance costs and the frequency of wire replacement, further raising production costs.

[0005] Therefore, a high-precision intelligent sapphire optical wafer cutting device is proposed to solve the problem of low cutting efficiency in existing sapphire optical wafer cutting devices. Summary of the Invention

[0006] The purpose of this invention is to provide a high-precision intelligent sapphire optical wafer cutting device to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a high-precision intelligent sapphire optical wafer cutting device, comprising a processing platform, on which a cutting component is fixed, the cutting component comprising a processing seat, wherein a transverse arc-shaped processing opening is formed in the middle of the side wall of the processing seat; the processing seat also has two mounting slots symmetrically arranged at the upper and lower ends of the processing opening, wherein a cylinder is fixed at the bottom of the mounting slot, a support frame is fixed at the output end of the cylinder, and a hollow support shaft is fixed to the side wall of the support frame, a guide wheel is rotatably connected to the outer wall of the support shaft, and a plurality of through holes communicating with the inside of the guide wheel are formed on the outer wall of the support shaft, wherein a plurality of liquid channels corresponding to and communicating with the through holes are formed along the central array of the inner wall of the guide wheel to the outer wall; the outer wall of the processing seat along Two mounting slots are provided on the outer side of the two mounting slots, and two wire routing slots are provided thereto. A diamond wire channel is slidably connected in the wire routing slots. An arc-shaped groove with the same curvature is provided in the center of the machining opening. A second mounting slot is provided in the center of the bottom of the arc-shaped groove. A second cylinder is fixed at the bottom of the second mounting slot. A cooling component is fixed at the output end of the second cylinder. The output end of the cooling component faces the central cutting area of ​​the machining opening. Two adjustment components are provided in the machining opening based on central symmetry. The two adjustment components are located at the upper and lower ends of the machining opening, respectively, and correspond one-to-one with the positions of the wire routing slots. They are also located on the sliding path of the diamond wire channel. The input end of the support shaft is connected to an external cooling medium supply pipeline. The cooling medium is sequentially led out to the surface of the guide wheel through the internal cavity of the support shaft, through hole one, and through liquid channel two.

[0008] Preferably, a movable block is fixed on the side of the support frame away from the guide wheel, and a liquid storage chamber is opened inside the movable block. The support shaft passes through the support frame and the movable block and communicates with the liquid storage chamber. Liquid inlet holes are opened on both sides of the liquid storage chamber, and the liquid inlet holes are used to input cooling medium into the liquid storage chamber.

[0009] Preferably, a slide rail is fixed to the inner wall of the mounting groove, and the slide rail is arranged vertically and slidably connected to the moving block.

[0010] Preferably, a fixing block is also fixed to the inner wall of the mounting groove, the fixing block is located on both sides of the moving block and is slidably connected to the moving block; a liquid storage chamber is provided inside the fixing block, and a liquid delivery pipe is connected inside the liquid storage chamber, the liquid delivery pipe passes through the processing seat and is connected to an external cooling medium; a strip-shaped liquid passage hole is provided on the side of the fixing block near the moving block, the liquid passage hole coincides with the liquid inlet hole, and the liquid passage hole always coincides with the liquid inlet hole during the sliding process of the moving block relative to the fixing block.

[0011] Preferably, the cooling assembly includes a cooling box adapted to the arc-shaped groove. The cooling box has a liquid inlet hole one on the side near the second mounting groove. The liquid inlet hole one is connected to an external cooling medium supply pipeline. The cooling box has a plurality of liquid outlet holes arranged in an array on the side away from the second mounting groove. Each of the plurality of liquid outlet holes is equipped with a nozzle.

[0012] Preferably, the adjustment assembly includes two support plates symmetrically arranged based on the center of the cable tray. Each of the two support plates is rotatably connected to a conical support roller on the side facing the cable tray. The conical tips of the two support rollers correspond to each other and are arranged apex-to-apex. The conical tip area corresponds to the outlet position of the diamond wire channel.

[0013] Preferably, the diameter of the diamond wire channel is larger than the cross-sectional area of ​​the cutting wire and is arranged vertically downwards.

[0014] Preferably, the assembly further includes a pre-cutting component, which includes a sliding seat and a processing platform connected by a linear drive. A pre-processing ring is fixed to the sliding seat via a connecting arm, and the pre-processing ring is coaxially arranged with the processing opening. An annular groove is formed inside the pre-processing ring, and four sliding blocks are slidably connected to the annular groove via an annular electric track. The four sliding blocks are divided into two groups, and two sliding blocks in each group are rotatably connected to a wire feeding roller. An arc-shaped connecting plate is fixedly connected between the two groups of sliding blocks. The curvature of the connecting plate is consistent with and adapted to the annular groove. Two take-up rollers are fixedly fixed on the connecting plate, and a micro motor is fixed on one of the take-up rollers. The cutting diamond wire passes through the two wire feeding rollers in sequence and then connects to the take-up roller.

[0015] Preferably, the cutting assembly further includes a connecting seat, the bottom of which is fixedly connected to the processing platform, and a slide rail is longitudinally arranged on the top side wall of the connecting seat. A sliding channel is transversely arranged on the slide rail, and the processing seat is slidably arranged in the sliding channel.

[0016] Preferably, the processing platform is further fixed with a clamping device, which is used to clamp the sapphire crystal pillar and is located directly below the cutting assembly.

[0017] The beneficial effects of this invention are as follows: By employing a curved cutting line that surrounds the cylindrical surface of a sapphire crystal pillar for cutting, this invention effectively reduces the variation in the contact area between the cutting line and the sapphire crystal pillar. Compared to traditional cutting methods where the feed speed is limited due to changes in the contact area, this device allows the cutting line to cut at a more stable and relatively faster speed, significantly shortening the cutting time, greatly improving cutting efficiency, reducing production costs, and meeting the demands of large-scale industrial production for high-efficiency manufacturing. This device is equipped with a sophisticated cooling system. By injecting cooling medium into the support shaft, the cooling medium can be precisely sprayed onto the crystal pillar cutting area and the cutting line surface through through-holes and liquid channels, providing timely and effective cooling to both the crystal pillar and the cutting line. Simultaneously, the output end of the cooling component can spray cooling medium onto the central cutting area of ​​the processing opening, further suppressing the heat generated during cutting, avoiding thermal damage to the sapphire crystal pillar due to localized overheating, ensuring the flatness and precision of the cut surface, and improving the product yield. Attached Figure Description

[0018] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 is a schematic diagram of the internal structure of an embodiment of the present invention; Figure 3 is an enlarged schematic diagram of region A in Figure 2 of an embodiment of the present invention; Figure 4 is a schematic diagram of the processing seat structure of an embodiment of the present invention; Figure 5 is a schematic diagram of the internal structure of the processing seat of an embodiment of the present invention; Figure 6 is a schematic diagram of the moving block connection structure of an embodiment of the present invention; Figure 7 is a schematic diagram of the internal structure of the moving block of an embodiment of the present invention.

[0019] In the diagram: 1. Cutting assembly; 101. Machining base; 102. Machining opening; 103. Mounting slot one; 1031. Slide rail two; 104. Cylinder one; 105. Support frame; 106. Support shaft; 1061. Through hole one; 107. Guide wheel; 1071. Liquid passage two; 108. Cable tray; 1081. Diamond wire passage; 109. Arc groove; 110. Mounting slot two; 111. Cylinder two; 112. Connecting seat; 1121. Slide rail one; 1122. Sliding channel; 113. Moving block; 1131. Liquid storage chamber one; 1132. 1. Liquid inlet hole 2; 114. Fixing block; 1141. Liquid storage chamber 2; 1142. Liquid passage hole; 115. Liquid delivery pipe; 2. Cooling assembly; 201. Cooling tank; 202. Liquid inlet hole 1; 203. Liquid outlet hole; 204. Nozzle; 3. Adjustment assembly; 301. Support plate; 302. Support roller; 4. Pre-cutting assembly; 401. Sliding seat; 402. Connecting arm; 403. Pre-processing ring; 404. Annular groove; 405. Sliding block; 406. Wire feeding roller; 407. Connecting plate; 408. Wire take-up reel; 5. Processing platform; 6. Clamping device. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0021] Traditional sapphire wafer cutting equipment cuts sapphire crystal pillars with a straight cutting wire to obtain lenses of the required thickness. However, in this method, the contact area between the cutting wire and the sapphire crystal gradually increases during the cutting process, then gradually decreases after reaching its maximum. During this process, the feed speed of the cutting wire is slowest when the contact area between the cutting wire and the sapphire crystal is at its maximum. Since the feed speed of the cutting wire cannot be accurately controlled, it feeds at the slowest speed throughout the cutting process, which undoubtedly reduces the cutting efficiency. To address this, this device uses a curved cutting wire to cut around the cylindrical surface of the sapphire crystal, reducing the change in the contact area between the cutting wire and the sapphire crystal, thereby increasing the cutting efficiency.

[0022] Specifically, referring to Figures 1-7, a high-precision intelligent sapphire optical wafer cutting device includes a cutting component 1, which includes a processing seat 101, and a transverse arc-shaped processing opening 102 is provided in the middle of the side wall of the processing seat 101.

[0023] The processing base 101 is also provided with two mounting slots 103 symmetrically arranged at the upper and lower ends of the processing opening 102. A cylinder 104 is fixed at the bottom of the mounting slot 103. A support frame 105 is fixed at the output end of the cylinder 104. A hollow support shaft 106 is fixed on the side wall of the support frame 105. A guide wheel 107 is rotatably connected to the outer wall of the support shaft 106. A plurality of through holes 1061 communicating with the inside of the guide wheel 107 are provided on the outer wall of the support shaft 106. A plurality of liquid passages 1071 corresponding to and communicating with the through holes 1061 are provided on the inner wall of the guide wheel 107 through to the outer wall along the center array.

[0024] When cutting a diamond crystal pillar, a cooling medium is injected into the support shaft 106. The cooling medium located in the support shaft 106 is sprayed onto the crystal pillar cutting area and the surface of the cutting line through the through hole 1061 and the liquid passage 1071, thereby cooling the crystal pillar and the cutting line.

[0025] The outer wall of the processing base 101 is provided with two wire routing grooves 108 that communicate with the two mounting grooves 103. A diamond wire channel 1081 is slidably connected in the wire routing groove 108. The diamond wire channel 1081 is used for the cutting diamond wire to pass through and be guided. The diameter of the diamond wire channel 1081 is larger than the cross-sectional area of ​​the cutting wire and is vertically downward.

[0026] An arc-shaped groove 109 with the same curvature is provided at the center of the processing opening 102. An installation groove 110 is provided at the center of the bottom of the arc-shaped groove 109. A cylinder 111 is fixed at the bottom of the installation groove 110. A cooling component 2 is fixed at the output end of the cylinder 111. The output end of the cooling component 2 faces the central cutting area of ​​the processing opening 102.

[0027] Before cutting the diamond crystal pillar, the cooling component 2 is moved towards the crystal pillar by starting cylinder 2 111, so that the output end of the cooling component 2 gradually approaches the surface of the crystal pillar and sprays out cooling medium to cool the processing position of the crystal pillar.

[0028] Two adjustment components 3 are centrally symmetrically arranged inside the processing opening 102. The two adjustment components 3 are located at the upper and lower ends of the processing opening 102, respectively, and correspond one-to-one with the position of the wire routing groove 108. They are also located on the sliding path of the diamond wire channel 1081 and are used to adjust the sliding stroke and positioning accuracy of the diamond wire channel 1081.

[0029] A movable block 113 is fixed on the side of the support frame 105 away from the guide wheel 107. A liquid storage chamber 1131 is opened inside the movable block 113. The support shaft 106 passes through the support frame 105 and the movable block 113 and communicates with the liquid storage chamber 1131. Liquid inlet holes 1132 are opened on both sides of the liquid storage chamber 1131. The liquid inlet holes 1132 are used to input cooling medium into the liquid storage chamber 1131.

[0030] The input end of the support shaft 106 is connected to an external cooling medium supply pipeline. The cooling medium is GF-506A. The cooling medium is sequentially led out to the surface of the guide wheel 107 through the internal cavity of the support shaft 106, through hole 1061, and through channel 1071, so as to achieve synchronous cooling and lubrication of the cutting diamond wire and the guide wheel 107.

[0031] In some preferred embodiments, a slide rail 1031 is fixed to the inner wall of the mounting groove 103. The slide rail 1031 is arranged vertically and slidably connected to the moving block 113 to ensure that the moving block 113 can rise and fall smoothly in the vertical direction.

[0032] A fixing block 114 is also fixed to the inner wall of the mounting groove 103. The fixing block 114 is located on both sides of the moving block 113 and is slidably connected to the moving block 113. A liquid storage chamber 1141 is opened in the fixing block 114. A liquid delivery pipe 115 is connected inside the liquid storage chamber 1141. The liquid delivery pipe 115 passes through the processing seat 101 and is connected to the external cooling medium.

[0033] The fixed block 114 has a strip-shaped liquid passage hole 1142 on the side near the moving block 113. The liquid passage hole 1142 coincides with the second liquid inlet hole 1132, and the liquid passage hole 1142 always coincides with the second liquid inlet hole 1132 during the sliding process of the moving block 113 relative to the fixed block 114.

[0034] In some preferred embodiments, the cooling assembly 2 includes a cooling box 201 adapted to the arc-shaped groove 109. The cooling box 201 has a liquid inlet 202 on the side near the mounting groove 110. The liquid inlet 202 is connected to an external cooling medium supply pipeline. The cooling box 201 has a plurality of liquid outlet holes 203 arranged in an array on the side away from the mounting groove 110. Each of the plurality of liquid outlet holes 203 is equipped with a nozzle 204, which is used to spray cooling medium onto the cutting area.

[0035] In some preferred embodiments, the adjustment component 3 includes two support plates 301 arranged symmetrically around the center of the cable tray 108. Each of the two support plates 301 is rotatably connected to a conical support roller 302 on the side facing the cable tray 108. The conical tips of the two support rollers 302 correspond to each other and are arranged apex to apex. The conical tip area corresponds to the outlet position of the diamond wire channel 1081. The diamond wire is accurately guided by the guiding effect of the conical tip.

[0036] In some preferred embodiments, the device further includes a pre-cutting assembly 4 for completing a pre-cutting process before the crystal is formally cut. The pre-cutting assembly 4 includes a sliding seat 401, which is slidably connected to the processing platform 5 via a linear drive. A pre-processing ring 403 is fixed to the sliding seat 401 via a connecting arm 402. The pre-processing ring 403 is coaxially arranged with the processing opening 102. An annular groove 404 is formed in the pre-processing ring 403. Four sliding blocks 405 are slidably connected to the annular groove 404 via an annular electric track. Divided into two groups, each group has two sliding blocks 405 rotatably connected to a wire feeding roller 406. The two groups of sliding blocks 405 are fixedly connected to an arc-shaped connecting plate 407. The curvature of the connecting plate 407 is consistent with and adapted to the annular groove 404. Two take-up rollers 408 are fixed on the connecting plate 407 for winding the cut diamond wire. One of the take-up rollers 408 is fixed with a micro motor. The micro motor drives the take-up roller 408 to rotate to wind the diamond wire. The cut diamond wire passes through the two wire feeding rollers 406 in sequence and then connects to the take-up roller 408.

[0037] During the pre-cutting operation, the crystal is placed on one side of the diamond wire. After adjusting the tension of the diamond wire, the pre-processing ring 403 is rotated to make the diamond wire rotate around the crystal. At the same time, the diamond wire is driven to move back and forth by a micro motor to achieve the ring pre-cutting of the crystal.

[0038] In some preferred embodiments, the cutting assembly 1 further includes a connecting seat 112, the bottom of which is fixedly connected to the processing platform 5. A slide rail 1121 is longitudinally arranged on the top side wall of the connecting seat 112, and a sliding channel 1122 is laterally arranged on the slide rail 1121. The processing seat 101 is slidably arranged in the sliding channel 1122, thereby realizing multi-dimensional adjustment of the processing seat 101 in both the horizontal and vertical directions.

[0039] In some preferred embodiments, a clamping device 6 is also fixed on the processing platform 5. The clamping device 6 adopts existing technology and is used to clamp the sapphire crystal pillar, and is located directly below the cutting component 1 and the pre-cutting component 4.

[0040] In some preferred embodiments, the clamping device 6 adopts existing technology, specifically a pneumatic three-jaw chuck, a hydraulic centering clamp, or a vacuum adsorption clamp.

[0041] In some preferred embodiments, the cutting assembly 1 includes a cutting drive system for driving a diamond core to cut a sapphire crystal ingot within the processing opening 102.

[0042] Working principle: The sapphire crystal pillar is placed in the center of the cooling medium 5 of the processing platform and fixed by the clamping device cooling medium 6 to ensure that the crystal pillar axis is aligned with the center of the cooling medium 102 of the processing opening.

[0043] Start the pre-cutting component cooling medium 4, move the sliding seat cooling medium 401 to one side of the crystal pillar, and adjust the height of the pre-processing ring cooling medium 403 to make the diamond wire close to the surface of the crystal pillar.

[0044] A micro motor drives a take-up reel with cooling medium 408 to tighten the diamond wire. An annular electric track drives a sliding block with cooling medium 405 to move along an annular groove with cooling medium 404, so that the diamond wire forms a closed loop around the crystal pillar.

[0045] The pre-processing ring cooling medium 403 rotates, while a micro motor drives the diamond wire to move back and forth, completing the annular pre-cutting of the crystal column surface and forming a cutting guide groove.

[0046] Cylinder 104 cools the guide wheel, which is driven by the cooling medium 107 to raise and lower the cooling medium, adjusting the bending arc of the diamond wire to the preset value.

[0047] The cooling medium 111 in cylinder 2 pushes the cooling medium 201 in the cooling box closer to the cutting area, and the cooling medium 204 in the nozzle is aligned with the pre-cut groove.

[0048] When the external cooling medium supply pipeline is opened, GF-506A coolant is injected into the storage chamber 1131 and the cooling box 201 through the inlet hole 2 (cooling medium 1132) and inlet hole 1 (cooling medium 202), respectively.

[0049] The cutting drive system is started, and the diamond wire moves at high speed along the curved path. At the same time, the cooling system is activated: the cooling medium 107 on the guide wheel sprays coolant onto the surface of the cooling medium to reduce frictional heat; the cooling medium 204 on the nozzle sprays coolant onto the cutting area to suppress thermal damage to the crystal pillar.

[0050] The cooling medium 3 of the adjustment component monitors the tension of the diamond wire in real time, and the position is finely adjusted by the cooling medium 302 of the support roller to ensure cutting stability.

[0051] After cutting is completed, the cooling system and drive motor are shut off, and the cooling media of cylinder 104 and cylinder 211 are reset.

[0052] After the sapphire wafer is processed, it undergoes subsequent surface flatness and thickness testing. Qualified products proceed to the next process.

[0053] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A high-precision intelligent cutting device for sapphire optical wafers, characterized in that, The system includes a processing platform on which a cutting assembly is fixed. The cutting assembly includes a processing seat with a transversely arc-shaped processing opening in the middle of its side wall. The processing seat also has two mounting slots symmetrically arranged at the top and bottom of the processing opening. A cylinder is fixed to the bottom of each mounting slot, and a support frame is fixed to the output end of the cylinder. A hollow support shaft is fixed to the side wall of the support frame, and a guide wheel is rotatably connected to the outer wall of the support shaft. The outer wall of the support shaft has several through holes communicating with the inside of the guide wheel. The inner wall of the guide wheel extends to the outer wall and has several fluid passages corresponding to and communicating with the through holes along a central array. The outer wall of the processing seat has two drainage channels communicating with the two mounting slots along their outer sides. The machined opening has a wire groove, in which a diamond wire channel is slidably connected. An arc-shaped groove with the same curvature as the opening is formed at its center. A second mounting groove is formed at the center of the bottom of the arc-shaped groove. A second cylinder is fixed to the bottom of the second mounting groove, and a cooling component is fixed to the output end of the second cylinder. The output end of the cooling component faces the central cutting area of ​​the machined opening. Two adjusting components are centrally symmetrically arranged within the machined opening, located at the upper and lower ends respectively, corresponding one-to-one with the positions of the wire groove and simultaneously positioned on the sliding path of the diamond wire channel. The input end of the support shaft is connected to an external cooling medium supply pipe, and the cooling medium is sequentially discharged through the internal cavity of the support shaft, through hole one, and through liquid channel two to the surface of the guide wheel.

2. The high-precision intelligent sapphire optical wafer cutting device according to claim 1, characterized in that, A movable block is fixed on the side of the support frame away from the guide wheel. A liquid storage chamber is opened inside the movable block. The support shaft passes through the support frame and the movable block and communicates with the liquid storage chamber. Liquid inlet holes are opened on both sides of the liquid storage chamber. The liquid inlet holes are used to input cooling medium into the liquid storage chamber.

3. The high-precision intelligent sapphire optical wafer cutting device according to claim 2, characterized in that, The inner wall of the mounting groove is fixed with a slide rail 2, which is vertically arranged and slidably connected to the moving block.

4. The high-precision intelligent sapphire optical wafer cutting device according to claim 3, characterized in that, The inner wall of the mounting groove is also fixed with a fixing block, which is located on both sides of the moving block and is slidably connected to the moving block; a liquid storage chamber is opened in the fixing block, and a liquid delivery pipe is connected inside the liquid storage chamber. The liquid delivery pipe passes through the processing seat and is connected to an external cooling medium; a strip-shaped liquid passage hole is opened on the side of the fixing block near the moving block. The liquid passage hole coincides with the liquid inlet hole, and the liquid passage hole always coincides with the liquid inlet hole during the sliding process of the moving block relative to the fixing block.

5. The high-precision intelligent sapphire optical wafer cutting device according to claim 1, characterized in that, The cooling assembly includes a cooling box adapted to the arc-shaped groove. The cooling box has a liquid inlet hole one on the side near the second mounting groove. The liquid inlet hole one is connected to an external cooling medium supply pipeline. The cooling box has a plurality of liquid outlet holes arranged in an array on the side away from the second mounting groove. Each of the plurality of liquid outlet holes is equipped with a nozzle.

6. The high-precision intelligent sapphire optical wafer cutting device according to claim 1, characterized in that, The adjustment assembly includes two support plates symmetrically arranged based on the center of the cable tray. Each of the two support plates is rotatably connected to a conical support roller on the side facing the cable tray. The conical tips of the two support rollers correspond to each other and are arranged apex to apex. The conical tip area corresponds to the outlet position of the diamond wire channel.

7. The high-precision intelligent sapphire optical wafer cutting device according to claim 1, characterized in that, The diameter of the diamond wire channel is larger than the cross-sectional area of ​​the cutting line and is arranged vertically downwards.

8. The high-precision intelligent sapphire optical wafer cutting device according to claim 1, characterized in that, It also includes a pre-cutting assembly, which includes a sliding seat that is linearly driven and slidably connected to the processing platform. A pre-processing ring is fixed to the sliding seat via a connecting arm, and the pre-processing ring is coaxially arranged with the processing opening. An annular groove is formed inside the pre-processing ring, and four sliding blocks are slidably connected to the annular groove via an annular electric track. The four sliding blocks are divided into two groups, and a wire feeding roller is rotatably connected between the two groups of sliding blocks. An arc-shaped connecting plate is fixedly connected between the two groups of sliding blocks. The curvature of the connecting plate is consistent with and adapted to the annular groove. Two take-up rollers are fixedly fixed on the connecting plate, and a micro motor is fixed on one of the take-up rollers. The cutting diamond wire passes through the two wire feeding rollers in sequence and then connects to the take-up roller.

9. The high-precision intelligent sapphire optical wafer cutting device according to claim 1, characterized in that, The cutting assembly also includes a connecting seat, the bottom of which is fixedly connected to the processing platform. A slide rail is longitudinally arranged on the top side wall of the connecting seat, and a sliding channel is transversely arranged on the slide rail. The processing seat is slidably arranged in the sliding channel.

10. The high-precision intelligent sapphire optical wafer cutting device according to claim 1, characterized in that, The processing platform is also fixed with a clamping device, which is used to clamp the sapphire crystal pillar and is located directly below the cutting assembly.

Images