Dielectric paste and preparation method and application thereof

By adjusting the composition of the microcrystalline glass powder and the selection of the organic carrier, a low-dielectric-expansion dielectric slurry was prepared, which solved the problems of insufficient compatibility and high-temperature insulation of the alumina substrate, and improved the stability and insulation of the dielectric layer.

CN121964241APending Publication Date: 2026-05-01BEIJING U PRECISION TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING U PRECISION TECH
Filing Date
2024-10-30
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

Existing dielectric pastes are difficult to match with alumina substrates, resulting in easy cracking at high temperatures and insufficient insulation performance, which cannot meet the high-temperature use requirements of equipment such as electrostatic chucks.

Method used

By adjusting the composition of the microcrystalline glass powder, adding raw materials such as silicon oxide, barium oxide, and aluminum oxide, and doping with strontium oxide, magnesium oxide, zinc oxide, and rare earth oxides, a low-dielectric-expansion dielectric slurry is prepared. Combined with the selection of organic carriers and sintering processes, the compatibility and insulation with the alumina substrate are ensured.

Benefits of technology

The prepared dielectric slurry has a thermal expansion coefficient close to that of the alumina substrate. After sintering, it forms a dense and flat dielectric layer that maintains good insulation at 500℃, has a high breakdown voltage and low leakage current, and is suitable for high-temperature stable use on alumina substrates.

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Abstract

The invention relates to the technical field of paste, and particularly provides dielectric paste and a preparation method and application thereof.The dielectric paste is composed of, by mass, 65-80 wt% of glass ceramic powder and 20-35 wt% of organic carriers, and the glass ceramic powder is composed of, by mass, 25-45 wt% of SiO2, 10-20 wt% of BaO, 10-30 wt% of Al2O3, 0-20 wt% of SrO, 0-10 wt% of MgO, 5-10 wt% of ZnO, 1-3 wt% of coloring metal oxide and 4-9 wt% of rare earth oxide. The expansion coefficient of the dielectric paste is similar to that of an aluminum oxide substrate, the dielectric paste has good matching performance, the dielectric paste is compact and flat after being sintered into a film, good insulativity can still be kept at the high temperature of 500 DEG C, breakdown voltage is high, leakage current is small, and safe and stable use of low-expansion substrate thick-film circuits such as aluminum oxide and the like in severe environments can be met.
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Citation Information

Patent Citations

  • Composite oxide microcrystalline glass, insulating medium slurry and preparation method and application thereof

    CN108682478A