Coil electronic component

Abstract

The present disclosure provides a coil electronic component including a support member, a coil disposed on the support member, and a body surrounding the support member and the coil and containing a magnetic material. The coil includes an inner coil and an outer coil sequentially disposed on the support member, where the outer coil is electrically connected to the inner coil. The ratio of the sectional area of each turn of the inner coil to the sectional area of each turn of the outer coil is larger than or equal to 1100 / 1150 and smaller than or equal to 1200 / 1150.

Description

Technical Field

[0001] This disclosure relates to a coil-type electronic component. Background Technology

[0002] As mobile devices have become more versatile and power consumption has increased, low-loss and high-efficiency coil electronics are being used around power management integrated circuits (PMICs) to extend battery life in mobile devices.

[0003] Thin-film inductors can be manufactured by sputtering or plating coils onto a support member. Thin-film inductors employing multi-layer coil structures to increase inductance have multiple coil layers connected by vias. The problem with this approach is that the DC resistance increases as the inductor capacitance increases. Summary of the Invention

[0004] One aspect of the embodiments is to provide a coil electronic component capable of reducing DC resistance.

[0005] However, the problems sought to be solved by the embodiments are not limited to those described above, and can be extended in various ways within the scope of the technical ideas contained in the embodiments.

[0006] According to an embodiment, the coil electronic assembly includes: a support member; a coil disposed on the support member; and a body surrounding the support member and the coil, and comprising a magnetic material, wherein the coil may include an inner coil and an outer coil disposed sequentially on the support member, the outer coil being connectable to the inner coil, and the ratio of the cross-sectional area of ​​each turn of the inner coil to the cross-sectional area of ​​each turn of the outer coil being greater than or equal to 1100 / 1150 and less than or equal to 1200 / 1150.

[0007] The coil electronics assembly may further include an insulating layer disposed between the inner coil and the outer coil, and a first via penetrating the insulating layer to electrically connect the inner coil and the outer coil. The support member may include a first support surface and a second support surface opposite to the first support surface. The inner coil may include a first inner coil pattern disposed on the first support surface and a second inner coil pattern disposed on the second support surface. The coil electronics assembly further includes a second via penetrating the support member and connecting the second inner coil pattern to the first inner coil pattern.

[0008] The insulating layer may include a first insulating layer covering the first inner coil pattern and a second insulating layer covering the second inner coil pattern.

[0009] The outer coil may include a first outer coil pattern disposed on the first insulating layer and a second outer coil pattern disposed on the second insulating layer.

[0010] The coil electronic assembly may further include: a third insulating layer disposed between the first outer coil pattern and the main body; and a fourth insulating layer disposed between the second outer coil pattern and the main body.

[0011] The first outer coil pattern may include a first lead exposed from one surface of the body, and the second outer coil pattern may include a second lead exposed from another surface of the body.

[0012] The coil electronic assembly may further include: a first external electrode disposed outside the main body and connected to the first lead-out portion; and a second external electrode disposed outside the main body and connected to the second lead-out portion.

[0013] The coil electronic assembly may also include a surface insulating layer disposed on the outer surface of the body.

[0014] According to an embodiment, a coil electronic component capable of reducing DC resistance is provided. Attached Figure Description

[0015] Figure 1 This is a schematic perspective view of the coil electronic assembly according to an embodiment.

[0016] Figure 2 yes Figure 1 A schematic exploded perspective view of the coil electronic components.

[0017] Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0018] Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0019] <Explanation of reference numerals in the attached figures> 1000: Coil Electronic Components 100: Main Body 200: Coil 200A: Inner coil 200B: External coil 210: First inner coil pattern 220: Second inner coil pattern 230: Pattern of the first outer coil 240: Second outer coil pattern 211: First via pad 212: Second via pad 221: Third via pad 222: Fourth via pad 231: Fifth via pad 241: Sixth via pad 233: First Introduction 243: Second Introduction 300: Supporting component 410: First via 420: Second via 430: Third via 610: First insulating layer 620: Second insulating layer 630: Third insulation layer 640: Fourth Insulation Layer 700: First external electrode 800: Second external electrode 900: Surface insulation layer. Detailed Implementation

[0020] In the following detailed description, with reference to the accompanying drawings, embodiments are described in detail to enable those skilled in the art to readily perform this disclosure. The drawings and description are intended to be illustrative rather than restrictive in nature. Throughout the specification, the same reference numerals denote the same elements. Furthermore, some components in the drawings may be exaggerated, omitted, or shown schematically, and the dimensions of each component do not perfectly reflect actual dimensions.

[0021] The accompanying drawings are provided to aid in the easy understanding of the embodiments disclosed in this specification, and the technical spirit disclosed in this specification is not limited to the drawings. It should be understood that this disclosure includes all modifications, equivalents and substitutions within the spirit and scope of this disclosure.

[0022] Terms including ordinal numbers such as first and second are used to describe various constituent elements, but the constituent elements are not limited by these terms. These terms are only used to distinguish one constituent element from another.

[0023] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it may be directly on the other element, or there may be intermediate elements present. Conversely, when an element is referred to as being "directly on" another element, there are no intermediate elements present. Furthermore, when an element is referred to as being "on" a reference portion, the element may be located above or below the reference portion, and it does not necessarily mean that the element is located "above" or "on" the reference portion in a direction opposite to the direction of gravity.

[0024] Throughout this specification, it should be understood that the terms "comprising" and "having" are intended to specify the presence of the features, quantities, steps, operations, constituent elements and components or combinations thereof described in the specification, and do not exclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, constituent elements and components or combinations thereof. Therefore, unless expressly stated otherwise, the words "comprising" and variations such as "having" or "including" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements.

[0025] Furthermore, throughout the instruction manual, when referred to as "on a plane," it means the situation of viewing the target portion from above, and when referred to as "on a cross section," it means the situation of viewing the cross section obtained by vertically cutting the target portion from the side.

[0026] Furthermore, throughout the specification, when referred to as “connected,” this can mean not only that two or more components are directly connected, but also that two or more components are indirectly connected through another component, physically connected, electrically connected, or integrated (although the two or more components are referred to by different names depending on their location and function).

[0027] Figure 1 This is a schematic perspective view of the coil electronics assembly according to an embodiment. Figure 2 yes Figure 1 A schematic exploded perspective view of the coil electronic components. Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line I-I'. Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0028] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 According to an embodiment, the coil electronic assembly 1000 includes a main body 100, a coil 200, a support member 300, a first external electrode 700, a second external electrode 800, and a surface insulating layer 900.

[0029] The main body 100 may have an approximately rectangular hexahedral shape, but this embodiment is not limited to this. Due to the shrinkage of magnetic powder particles, etc., during sintering, the main body 100 may not have a perfect rectangular hexahedral shape, but may have an approximately rectangular hexahedral shape. For example, the main body 100 may have an approximately rectangular hexahedral shape, but its corners or vertices may have rounded shapes.

[0030] In this embodiment, for better understanding and ease of description, the two surfaces of the body 100 that are opposite each other in the length direction (L-axis direction) are defined as the first surface S1 and the second surface S2, the two surfaces that are opposite each other in the width direction (W-axis direction) are defined as the third surface S3 and the fourth surface S4, and the two surfaces that are opposite each other in the thickness direction (T-axis direction) are defined as the fifth surface S5 and the sixth surface S6.

[0031] Referring to an optical microscope or scanning electron microscope (SEM) photograph of a cross-section taken at the central portion of the coil electronics component 1000 in the width direction (W-axis direction) along the length direction (L-axis direction) and thickness direction (T-axis direction), the length of the coil electronics component 1000 can refer to the maximum length of multiple line segments of the coil electronics component 1000 shown in the aforementioned cross-sectional photograph, which are connected to the two outermost boundary lines opposite each other in the length direction (L-axis direction) and are parallel to the length direction (L-axis direction). Alternatively, the length of the coil electronics component 1000 can refer to the minimum length of multiple line segments of the coil electronics component 1000 shown in the aforementioned cross-sectional photograph, which are connected to the two outermost boundary lines opposite each other in the length direction (L-axis direction) and are parallel to the length direction (L-axis direction). Optionally, the length of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two of the multiple line segments of the coil electronic component 1000 shown in the cross-sectional photograph above, which are connected to each other along the length direction (L-axis direction) and are parallel to each other.

[0032] Referring to an optical microscope or SEM image of a cross-section taken at the central portion of the coil electronic component 1000 in the width direction (W-axis direction) along the length direction (L-axis direction) and thickness direction (T-axis direction), the thickness of the coil electronic component 1000 can be defined as the maximum value among the lengths of multiple line segments of the coil electronic component 1000 connected to each other along the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction) in the aforementioned cross-sectional image. Alternatively, the thickness of the coil electronic component 1000 can refer to the minimum value among the lengths of multiple line segments of the coil electronic component 1000 connected to each other along the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction) in the aforementioned cross-sectional image. Alternatively, the thickness of the coil electronic component 1000 can refer to the arithmetic mean of the lengths of at least two line segments of the coil electronic component 1000 connected to each other along the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction) in the aforementioned cross-sectional image.

[0033] Referring to an optical microscope or SEM (scanning electron microscope) photograph of a cross-section taken at the central portion of the coil electronic component 1000 in the thickness direction (T-axis direction) along the length direction (L-axis direction) and width direction (W-axis direction), the width of the coil electronic component 1000 can refer to the maximum length of multiple line segments of the coil electronic component 1000 shown in the cross-sectional photograph, which are connected to the two outermost boundary lines opposite each other in the width direction (W-axis direction) and are parallel to the width direction (W-axis direction). Alternatively, the width of the coil electronic component 1000 can refer to the minimum length of multiple line segments of the coil electronic component 1000 shown in the cross-sectional photograph, which are connected to the two outermost boundary lines opposite each other in the width direction (W-axis direction) and are parallel to the width direction (W-axis direction). Optionally, the width of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two of the multiple line segments of the coil electronic component 1000 shown in the cross-sectional photograph above, which are connected to each other in the width direction (W-axis direction) by two outermost boundary lines and are parallel to each other in the width direction (W-axis direction).

[0034] The length, width, and thickness of the coil electronics assembly 1000 can each be measured using a micrometer. In this method, a micrometer providing measurement repeatability and reproducibility (Gage R&R) is set to zero, the coil electronics assembly 1000 according to this embodiment is inserted between the tips of the micrometer, and the measuring rod of the micrometer is rotated to perform the measurement. When measuring the length of the coil electronics assembly 1000 using this method, the length can refer to a single measurement or the arithmetic mean of multiple measurements. The same method can be applied to measure the width and thickness of the coil electronics assembly 1000.

[0035] The body 100 forms the appearance of the coil electronics assembly 1000, and the body 100 is the space that forms a magnetic circuit when current is applied to the coil 200 through the first external electrode 700 and the second external electrode 800, wherein the magnetic circuit is the path through which the magnetic flux generated by the coil 200 passes.

[0036] The body 100 surrounds and encloses the coil 200 and the support member 300 and includes a magnetic material. The body 100 includes magnetic particles, and an insulating material may be interposed between the magnetic particles.

[0037] The magnetic material may include first metallic magnetic particles, second metallic magnetic particles with a particle size smaller than the first metallic magnetic particles, and third metallic magnetic particles with a particle size smaller than the second metallic magnetic particles. The average particle size D of the first metallic magnetic particles... 50 The average particle size D of the second metallic magnetic particles can be greater than or equal to 5 μm and less than or equal to 30 μm. 50The average particle size D of the third metallic magnetic particles can be greater than or equal to 1 μm and less than or equal to 5 μm. 50 It can be greater than or equal to 0.05 μm and less than or equal to 0.5 μm.

[0038] Magnetic particles can be ferrite particles or metallic magnetic particles that exhibit magnetic properties.

[0039] Ferrite particles may include, for example, at least one of spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites), garnet-type ferrites (such as Y-based ferrites) and Li-based ferrites.

[0040] The metallic magnetic particles may be composed of two or more types of metallic magnetic particles with different compositions, and may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic particles may be at least one selected from pure iron, Fe-Si based alloys, Fe-Si-Al based alloys, Fe-Ni based alloys, Fe-Ni-Mo based alloys, Fe-Ni-Mo-Cu based alloys, Fe-Co based alloys, Fe-Ni-Co based alloys, Fe-Cr based alloys, Fe-Cr-Si based alloys, Fe-Si-Cu-Nb based alloys, Fe-Ni-Cr based alloys, and Fe-Cr-Al based alloys. Here, different compositions of the metallic magnetic particles may mean different contents.

[0041] The metallic magnetic particles can be amorphous or crystalline. For example, the metallic magnetic particles can be Fe-Si-B-Cr based amorphous alloys, but this embodiment is not limited to this. The metallic magnetic particles can have an average particle size ranging from about 0.1 μm to 30 μm, but are not limited to this.

[0042] In the instruction manual, the average particle size can be indicated by D. 90 D 50 Particle size distribution, expressed as such. Particle size distribution, as an indicator of the proportion of particles of a certain size (particle diameter) contained in a group of particles to be tested, is well known to those skilled in the art. D 50 (The particle size corresponding to 50% of the cumulative volume of the particle size distribution) refers to the median particle size.

[0043] Metallic magnetic particles can be two or more different types of metallic magnetic particles. Here, different types of metallic magnetic particles refer to metallic magnetic particles that are distinguishable from each other in at least one aspect of average particle size, composition, component ratio, crystallinity, and shape.

[0044] Insulating materials may include, but are not limited to, epoxy resins, polyimides, liquid crystal polymers, etc., either alone or in combination.

[0045] The method used to form the body 100 is not particularly limited. For example, magnetic sheets may be placed on the upper and lower parts of the coil 200, and then pressed and cured to form the body 100.

[0046] The support member 300 is located inside the main body 100 and supports the coil 200.

[0047] The support member 300 may be made of an insulating material including thermosetting insulating resins such as epoxy resins, thermoplastic insulating resins such as polyimide, or photosensitive insulating resins, or may be formed using an insulating material prepared by impregnating a reinforcing material such as glass fiber or inorganic filler into an insulating resin. For example, the support member may be made of an insulating material such as a prepreg, ABF (Ajinomoto deposited film), FR-4, BT (bismaleimide triazine) film, or PID (photoimageable dielectric) film, but this embodiment is not limited thereto.

[0048] At least one of the following can be used as an inorganic filler in the support member 300: silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3).

[0049] The support member 300 may include a first support surface 320 and a second support surface 330 that are opposite each other in the thickness direction (T-axis direction). A through hole 310 is located at the center of the support member 300. The through hole 310 may be filled with a magnetic material to form a core 110 of the body 100. The core 110 may further improve the inductance of the coil electronics assembly 1000.

[0050] The coil 200 is embedded within the main body 100 to exhibit the characteristics of the coil electronics 1000. For example, when the coil electronics 1000 of this embodiment is used as a power inductor, when current is applied to the coil 200, the coil 200 can maintain the output voltage by storing energy in the form of a magnetic field to stabilize the power of the electronic device.

[0051] The coil 200 may include an inner coil 200A and an outer coil 200B arranged sequentially on the support member 300.

[0052] The outer coil 200B is connected to the inner coil 200A.

[0053] The inner coil 200A includes a first inner coil pattern 210 and a second inner coil pattern 220, and the outer coil 200B includes a first outer coil pattern 230 and a second outer coil pattern 240.

[0054] The coil 200 may include a structure in which a first outer coil pattern 230, a first inner coil pattern 210, a second inner coil pattern 220, and a second outer coil pattern 240 are stacked along the thickness direction (T-axis direction).

[0055] The first outer coil pattern 230, the first inner coil pattern 210, the second inner coil pattern 220, and the second outer coil pattern 240 may each have a planar spiral shape forming at least one turn around the core 110 of the body 100.

[0056] The first inner coil pattern 210 is located on the first support surface 320 of the support member 300. The first via pad 211 may be located at one end of the first inner coil pattern 210, and the second via pad 212 may be located at the other end of the first inner coil pattern 210.

[0057] The first insulating layer 610 is configured to cover a portion of the first support surface 320 of the support member 300 and the first inner coil pattern 210.

[0058] The second inner coil pattern 220 is located on the second support surface 330 of the support member 300. The third via pad 221 may be located at one end of the second inner coil pattern 220, and the fourth via pad 222 may be located at the other end of the second inner coil pattern 220.

[0059] The second insulating layer 620 is configured to cover a portion of the second support surface 330 of the support member 300 and the second inner coil pattern 220.

[0060] The first insulating layer 610 and the second insulating layer 620 may be disposed along the surface of the support member 300 and the surface of the first inner coil pattern 210 and the second inner coil pattern 220. The first insulating layer 610 and the second insulating layer 620 are used to insulate the first inner coil pattern 210 and the second inner coil pattern 220 from the body 100, and may include known insulating materials such as parylene. Any insulating material may be used for the first insulating layer 610 and the second insulating layer 620, and there are no particular limitations. For example, the first insulating layer 610 and the second insulating layer 620 may be constructed using polyurethane resin, polyester resin, epoxy resin, or polyamide-imide resin. The first insulating layer 610 and the second insulating layer 620 may be formed using methods such as vapor deposition, but are not limited thereto. For example, the first insulating layer 610 and the second insulating layer 620 may be formed by stacking insulating films on both surfaces of the support member 300.

[0061] The first outer coil pattern 230 is disposed on the first insulating layer 610. The fifth via pad 231 is located at one end of the first outer coil pattern 230, and the first lead-out portion 233 is located at the other end of the first outer coil pattern 230. The first lead-out portion 233 is exposed from the first surface S1 of the body 100 and can be electrically connected to the first outer electrode 700.

[0062] The second outer coil pattern 240 is located on the second insulating layer 620. The sixth via pad 241 is located at one end of the second outer coil pattern 240, and the second lead 243 is located at the other end of the second outer coil pattern 240. The second lead 243 is exposed from the second surface S2 of the body 100 and can be electrically connected to the second outer electrode 800.

[0063] The third insulating layer 630 is configured to cover the first outer coil pattern 230, and the fourth insulating layer 640 is configured to cover the second outer coil pattern 240. That is, the third insulating layer 630 is located between the first outer coil pattern 230 and the main body 100, and the fourth insulating layer 640 is located between the second outer coil pattern 240 and the main body 100. The third insulating layer 630 is not present in the portion of the first outer coil pattern 230 connected to the first outer electrode 700, and the fourth insulating layer 640 is not present in the portion of the second outer coil pattern 240 connected to the second outer electrode 800.

[0064] The third insulating layer 630 and the fourth insulating layer 640 are used to insulate the first outer coil pattern 230 and the second outer coil pattern 240 from the body 100, and may include known insulating materials such as parylene. Any insulating material can be used for the third insulating layer 630 and the fourth insulating layer 640, and there are no particular limitations. For example, the third insulating layer 630 and the fourth insulating layer 640 may be polyurethane resin, polyester resin, epoxy resin, or polyamide-imide resin. The third insulating layer 630 and the fourth insulating layer 640 may be formed by methods such as vapor deposition, but are not limited thereto. For example, the third insulating layer 630 and the fourth insulating layer 640 may be formed by stacking insulating films on the outer surfaces of the first outer coil pattern 230 and the second outer coil pattern 240, respectively.

[0065] The coil electronic assembly 1000 includes a first via 410, a second via 420, and a third via 430.

[0066] The first via 410 penetrates the support member 300 to connect the first inner coil pattern 210 and the second inner coil pattern 220. That is, the first via 410 connects the second via pad 212 of the first inner coil pattern 210 and the fourth via pad 222 of the second inner coil pattern 220.

[0067] The second via 420 extends through the first insulating layer 610 to connect the first inner coil pattern 210 and the first outer coil pattern 230. That is, the second via 420 connects the first via pad 211 of the first inner coil pattern 210 and the fifth via pad 231 of the first outer coil pattern 230.

[0068] The third via 430 extends through the second insulating layer 620 to connect the second inner coil pattern 220 to the second outer coil pattern 240. That is, the third via 430 connects the third via pad 221 of the second inner coil pattern 220 and the sixth via pad 241 of the second outer coil pattern 240.

[0069] The first dummy pad 213 may be disposed on the first support surface 320 of the support member 300 facing the first lead-out portion 233. Since the first dummy pad 213 is used to maintain the balance of the coil electronics assembly 1000 in the length direction (L-axis direction), the first inner coil pattern 210 is not electrically connected to the first dummy pad 213. For example, the first inner coil pattern 210 and the first dummy pad 213 may be made of the same metal, but spaced apart from each other.

[0070] The second dummy pad 223 may be located on the second support surface 330 of the support member 300 facing the second lead-out portion 243. Since the second dummy pad 223 is used to maintain the balance of the coil electronics assembly 1000 in the length direction (L-axis direction), the second inner coil pattern 220 is not electrically connected to the second dummy pad 223. For example, the second inner coil pattern 220 and the second dummy pad 223 may be made of the same metal, but spaced apart from each other.

[0071] The aforementioned coil pattern and vias can be formed, for example, by a plating process, and both the coil pattern and vias can include a seed layer and an electroplated layer, the seed layer being formed by an electroless plating process or a vapor deposition process such as sputtering.

[0072] Here, the electroplated layer can be a single-layer structure or a multi-layer structure. The multi-layer electroplated layer can be formed as a conformal film structure in which the first electroplated layer is covered by the second electroplated layer, or as a stacked shape in which the second electroplated layer is stacked only on one surface of the first electroplated layer.

[0073] In addition, when the coil pattern and the via are connected to each other, the seed layer of the coil pattern and the seed layer of the via can be formed integrally so that no boundary is formed between them, but this embodiment is not limited to this.

[0074] The coil patterns 210, 220, 230 and 240 and the vias 410, 420 and 430 may be formed using conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) and / or alloys thereof, but are not limited thereto.

[0075] The cross-sectional area (S) of each turn of the inner coil 200A of the coil electronic assembly 1000 B The cross-sectional area per turn of the outer coil 200B (S) A The ratio of (S) A / S B (hereinafter referred to as the “area ratio”) can be greater than or equal to 1100 / 1150 and less than or equal to 1200 / 1150.

[0076] If the area ratio is less than 1100 / 1150 or greater than 1200 / 1150, there is a problem with the DC resistance (Rdc) exceeding the reference value (e.g., 320mΩ).

[0077] Here, the cross-sectional area (S) of each turn of the inner coil 200A is... A The cross-sectional area (S) can refer to the cross-sectional area of ​​any turn in the multi-turn inner coil 200A or the cross-sectional area of ​​a single-turn inner coil 200A. Additionally, the cross-sectional area (S) of each turn of the outer coil 200B... BThe cross-sectional area of ​​any turn in the multi-turn outer coil 200B can be referred to as the cross-sectional area of ​​any turn. That is, in this embodiment, when any turn of the inner coil 200A and any turn of the outer coil 200B are selected respectively, the ratio of the cross-sectional area of ​​the selected inner coil 200A turn to the cross-sectional area of ​​the selected outer coil 200B turn can be greater than or equal to 1100 / 1150 and less than or equal to 1200 / 1150.

[0078] The cross-sectional area per turn of the inner coil 200A (S) A ) and the cross-sectional area per turn of the outer coil 200B (S B The thickness and width of each turn of the inner coil 200A and the thickness and width of each turn of the outer coil 200B are calculated based on optical microscope or SEM images of a section (hereinafter, “LT section”) taken at the central portion of the coil electronic assembly 1000 in the width direction (W-axis direction) along the length direction (L-axis direction) - thickness direction (T-axis direction) perpendicular to the width direction (W-axis direction) at the length direction (L-axis direction) - thickness direction (T-axis direction) of the section.

[0079] For example, the thickness of the cross-section of each turn of the inner coil 200A (or outer coil 200B) can refer to the maximum length of multiple line segments connecting the two ends of the cross-section in the thickness direction and parallel to the thickness direction in the aforementioned LT cross-sectional photograph. The width of the cross-section of each turn of the inner coil 200A (or outer coil 200B) can refer to the maximum length of multiple line segments connecting the two ends of the cross-section in the length direction and parallel to the length direction in the aforementioned LT cross-sectional photograph.

[0080] As another example, the thickness of the cross-section of each turn of the inner coil 200A (or outer coil 200B) can be referred to as the arithmetic mean of the maximum and minimum lengths of multiple line segments connecting the two ends of the cross-section in the thickness direction and parallel to the thickness direction in the aforementioned LT cross-sectional photograph, and the width of the cross-section of each turn of the inner coil 200A (or outer coil 200B) can be referred to as the arithmetic mean of the maximum and minimum lengths of multiple line segments connecting the two ends of the cross-section in the length direction and parallel to the length direction in the aforementioned LT cross-sectional photograph. However, if the corresponding cross-section has a region that protrudes or bulges in the thickness direction, that region can be excluded, and the width can be measured in the remaining region.

[0081] Based on the thickness and width of the cross-section of each turn of the inner coil 200A (or outer coil 200B) as measured above, the cross-sectional area of ​​each turn of the inner coil 200A (or outer coil 200B) can be calculated.

[0082] As another example, the cross-sectional area per turn of the outer coil 200B and the cross-sectional area per turn of the inner coil 200A can be obtained by measuring the aforementioned LT cross-sectional image using a scanning electron microscope-energy dispersive X-ray spectrometer (hereinafter referred to as "SEM-EDX").

[0083] Furthermore, the cross-sectional area per turn of the outer coil 200B and the cross-sectional area per turn of the inner coil 200A shown in the aforementioned LT cross-sectional photograph can be accurately measured using known image analysis software.

[0084] The first external electrode 700 may be located on the first surface S1 of the body 100 and connected to the first lead-out portion 233 of the coil 200. The first external electrode 700 covers a portion of the sixth surface S6 of the body 100.

[0085] In another embodiment, the first external electrode 700 may cover the first surface S1 of the body 100, and may cover at least one of a portion of the third surface S3, a portion of the fourth surface S4, a portion of the fifth surface S5, and a portion of the sixth surface S6.

[0086] The second external electrode 800 may be located on the second surface S2 of the body 100 and connected to the second lead-out portion 243 of the coil 200. The second external electrode 800 covers a portion of the sixth surface S6 of the body 100.

[0087] In another embodiment, the second external electrode 800 may cover the second surface S2 of the body 100, and may cover at least one of a portion of the third surface S3, a portion of the fourth surface S4, a portion of the fifth surface S5, and a portion of the sixth surface S6.

[0088] The first external electrode 700 may include a first metal layer 701, a second metal layer 702, and a third metal layer 703.

[0089] The first metal layer 701 is a plating layer that contacts the outer surfaces (i.e., the first surface S1 and the sixth surface S6) of the first lead-out portion 233 and the main body 100, and may include copper (Cu). The second metal layer 702 is a plating layer that covers the first metal layer 701, and may include nickel (Ni). The third metal layer 703 is a plating layer that covers the second metal layer 702, and may include tin (Sn). However, this embodiment is not limited to a three-layer structure; a two-layer structure with only one additional metal layer on the first metal layer 701 is also feasible.

[0090] The second external electrode 800 may include a first metal layer 801, a second metal layer 802, and a third metal layer 803.

[0091] The first metal layer 801 is a plating layer that contacts the second lead-out portion 243 and the outer surfaces of the body 100 (i.e., the second surface S2 and the sixth surface S6), and may include copper (Cu). The second metal layer 802 is a plating layer that covers the first metal layer 801, and may include nickel (Ni). The third metal layer 803 is a plating layer that covers the second metal layer 802, and may include tin (Sn). However, this embodiment is not limited to a three-layer structure, and a two-layer structure with only one metal layer added to the first metal layer 801 is also feasible.

[0092] As another example, the first external electrode 700 and the second external electrode 800 may comprise metal and glass. The metal may be, for example, a conductive metal including copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and / or alloys thereof. The glass component included in the first external electrode 700 and the second external electrode 800 may be a mixture of oxides. The glass component may include, for example, silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, alkaline earth metal oxide, or combinations thereof. Here, the transition metal may be selected from zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni); the alkali metal may be selected from lithium (Li), sodium (Na), and potassium (K); and the alkaline earth metal may be selected from magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba). There are no particular limitations on the method used to form the first external electrode 700 and the second external electrode 800. For example, the first external electrode 700 and the second external electrode 800 can be formed by immersing the body 100 in a conductive paste containing conductive metal and glass, or by printing the conductive paste onto the surface of the body 100, for example, by screen printing or gravure printing. Furthermore, various methods, such as applying conductive paste to the surface of the body 100 or transferring a dry film formed by drying the conductive paste onto the body 100, can be used to form the first external electrode 700 and the second external electrode 800.

[0093] The surface insulating layer 900 may be located on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the body 100. However, the surface insulating layer 900 may partially cover the sixth surface S6 of the body 100. That is, the first external electrode 700 and the second external electrode 800 may be located on the sixth surface S6 of the body 100, and the surface insulating layer 900 may not cover the first external electrode 700 and the second external electrode 800.

[0094] As described above, the surface insulating layer 900 is located on at least a portion of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the body 100 to prevent electrical short circuits between other electronic components and the external electrodes 700 and 800.

[0095] When the external electrodes 700 and 800 are formed by electroplating, the surface insulating layer 900 can be used as an anti-plating agent, but is not limited thereto.

[0096] The surface insulating layer may include polymer resins, pigments, fillers, etc. Polymer resins may include thermosetting polymer resins (such as epoxy resins) or thermoplastic polymer resins (such as acrylic resins). Pigments capable of producing color (such as black) may include carbon black, manganese (Mn)-based spinel powder, etc., and the surface insulating layer may also include additives such as SiO2 and talc to control strength and / or coefficient of thermal expansion.

[0097] For example, the surface insulating layer 900 may include thermoplastic resins (such as polystyrene resins, vinyl acetate resins, polyester resins, polyethylene resins, polypropylene resins, polyamide resins, rubber resins, acrylic resins, etc.), thermosetting resins (such as phenolic resins, epoxy resins, polyurethane resins, melamine resins, alkyd resins), photosensitive resins, parylene, SiO2, etc. x or SiN x .

[0098] The surface insulating layer 900 can be formed using processes such as screen printing, pad printing, dipping, or inkjet printing. For example, the surface insulating layer 900 can be formed by applying a liquid insulating resin to the surface of the body 100, by stacking an insulating film (such as a dry film) on the surface of the body 100, or by a thin film process (such as vapor deposition). In the case of an insulating film, an Ajinomoto stacked film (ABF) or a polyimide film that does not contain a photosensitive insulating resin can be used.

[0099] The thickness of the surface insulating layer 900 can be greater than or equal to 3 μm and less than or equal to 25 μm. If the thickness of the surface insulating layer 900 is less than 3 μm, magnetic material may be exposed in the thin portion of the surface insulating layer 900, which may cause appearance problems such as oxidation in practical use environments. If the thickness of the surface insulating layer 900 exceeds 25 μm, the insulation properties may be excellent, but the volume of the body may be relatively reduced compared to the volume of the coil electronics assembly 1000, and correspondingly, electrical characteristics such as inductance, DC resistance, or rated current may deteriorate.

[0100] [Preparation Example: Fabrication of a Coil Electronic Component] (Example 1) A material with a cross-sectional area of ​​1150 μm was manufactured. 2 The outer coil and have a cross-sectional area of ​​1100μm 2 The inner coil is embedded in the coil electronic component of the main body.

[0101] (Example 2) In addition to the inner coil having a cross-sectional area of ​​1150 μm 2 Except for that, it is the same as in Example 1.

[0102] (Example 3) In addition to the inner coil having a cross-sectional area of ​​1200μm 2 Except for that, it is the same as in Example 1.

[0103] (Comparative Example 1) In addition to the inner coil having a cross-sectional area of ​​950μm 2 Except for that, it is the same as in Example 1.

[0104] (Comparative Example 2) In addition to the inner coil having a cross-sectional area of ​​1000μm 2 Except for that, it is the same as in Example 1.

[0105] (Comparative Example 3) In addition to the inner coil having a cross-sectional area of ​​1050 μm 2 Except for that, it is the same as in Example 1.

[0106] (Comparative Example 4) In addition to the inner coil having a cross-sectional area of ​​1250μm 2 Except for that, it is the same as in Example 1.

[0107] (Comparative Example 5) In addition to the inner coil having a cross-sectional area of ​​1300μm 2 Except for that, it is the same as in Example 1.

[0108] (Comparative Example 6) In addition to the inner coil having a cross-sectional area of ​​1350μm 2 Except for that, it is the same as in Example 1.

[0109] [Experimental Example: DC Resistance of a Coil Electronic Component] After manufacturing fifty (50) coil electronic components according to Examples 1 to 3 and Comparative Examples 1 to 6 respectively, the DC resistance was measured. When the DC resistance was less than 320 mΩ, it was considered "suitable" and when the DC resistance was greater than 320 mΩ, it was considered "unsuitable".

[0110] The results are presented in Table 1.

[0111] (Table 1)

[0112] Referring to Table 1, the DC resistance of the coil electronic assemblies according to Examples 1 to 3 is less than 320 mΩ. In contrast, the DC resistance of the coil electronic assemblies according to Comparative Examples 1 to 6 exceeds 320 mΩ. This may be because, in Comparative Examples 1 to 3, the cross-sectional area of ​​the inner coil is too small compared to the cross-sectional area of ​​the outer coil, while in Comparative Examples 4 to 6, the cross-sectional area of ​​the inner coil is too large compared to the cross-sectional area of ​​the outer coil.

[0113] While this disclosure has been described in conjunction with what is now considered to be actual embodiments, it should be understood that this disclosure is not limited to the disclosed embodiments. Rather, this disclosure is intended to cover various modifications and equivalents within the spirit and scope of the appended claims.

Claims

1. A coil electronic assembly, comprising: Supporting components; A coil is disposed on the support member; as well as The main body surrounds the support member and the coil, and includes a magnetic material. The coil comprises an inner coil and an outer coil sequentially arranged on the support member. The outer coil is connected to the inner coil, and The ratio of the cross-sectional area of ​​each turn of the inner coil to the cross-sectional area of ​​each turn of the outer coil is greater than or equal to 1100 / 1150 and less than or equal to 1200 / 1150.

2. The coil electronic assembly as claimed in claim 1, further comprising: An insulating layer is disposed between the inner coil and the outer coil; as well as A first via extends through the insulating layer and electrically connects the inner coil and the outer coil.

3. The coil electronic assembly as claimed in claim 2, wherein: The support member includes a first support surface and a second support surface opposite to the first support surface, and The inner coil includes: A first inner coil pattern is disposed on the first support surface; and The second inner coil pattern is disposed on the second support surface. The coil electronics assembly further includes a second via, which penetrates the support member and connects the second inner coil pattern to the first inner coil pattern.

4. The coil electronics assembly as claimed in claim 3, wherein: The insulating layer includes: A first insulating layer covers the first inner coil pattern; and A second insulating layer covers the second inner coil pattern.

5. The coil electronics assembly as claimed in claim 4, wherein: The outer coil includes: A first outer coil pattern is disposed on the first insulating layer; and The second outer coil pattern is disposed on the second insulating layer.

6. The coil electronic assembly of claim 5, further comprising: A third insulating layer is disposed between the first outer coil pattern and the main body; as well as A fourth insulating layer is disposed between the second outer coil pattern and the main body.

7. The coil electronics assembly as claimed in claim 5, wherein: The first outer coil pattern includes a first lead exposed on one surface of the body, and The second outer coil pattern includes a second lead exposed on another surface of the body.

8. The coil electronic assembly of claim 7, further comprising: The first external electrode is disposed outside the main body and connected to the first lead-out portion; as well as The second external electrode is disposed outside the main body and connected to the second lead-out portion.

9. The coil electronic assembly of claim 1, further comprising: A surface insulating layer is disposed on the outer surface of the main body.

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