Preparation method of display panel, display panel and display device

Abstract

The invention discloses a preparation method of a display panel, the display panel and a display device. After a pixel definition material layer and an isolation material layer are prepared on a substrate, a barrier material layer is arranged on the isolation material layer, and the barrier material layer is located in a display area to cover the isolation material layer located in the display area and realize etching protection on the isolation material layer in the display area; and only etching the part of the isolation material layer in the hole region so as to remove at least part of the isolation material layer in the hole region. The orthographic projection of the through hole on the substrate is overlapped with the orthographic projection of the isolation opening on the substrate, and the pixel definition material layer can be exposed from the through hole, so that the exposed pixel definition material layer is etched through the through hole to form a pixel opening communicated with the isolation opening. According to the preparation method, when the isolation material layer of the hole area and the pixel definition material layer of the display area are patterned, the same barrier material layer is adopted for etching protection, and the preparation process of the display panel is simplified.

Description

Methods for manufacturing display panels, display panels and display devices Technical Field

[0001] This application relates to the field of display technology, specifically to a method for manufacturing a display panel, the display panel itself, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a method for manufacturing a display panel, a display panel, and a display device, aiming to improve the performance of the display panel.

[0005] The first aspect of this application provides a method for manufacturing a display panel, the display panel including a display area and an aperture area, the display area surrounding at least a portion of the aperture area, the method comprising:

[0006] A pixel definition material layer and an isolation material layer are sequentially fabricated on the substrate, and an isolation opening located in the display area is formed on the isolation material layer;

[0007] A barrier material layer is prepared on the side of the isolation material layer away from the substrate, and the barrier material layer is located in the display area;

[0008] The isolation material layer is patterned to remove at least a portion of the isolation material layer located in the hole area;

[0009] The barrier material layer is patterned to form a barrier layer with through holes, wherein the projection of the through holes onto the substrate and the projection of the isolation openings onto the substrate at least partially overlap.

[0010] The pixel definition material layer is patterned by through-holes to form a pixel definition layer. The pixel definition layer includes a pixel limiting part and a pixel opening formed by the pixel limiting part. The pixel opening and the isolation opening are connected.

[0011] According to an embodiment of the first aspect of this application, the step of preparing a barrier material layer on the side of the isolation material layer facing away from the substrate further includes:

[0012] A barrier material layer is prepared and patterned to obtain a barrier material layer with grooves, wherein the orthographic projection of the grooves onto the substrate and the orthographic projection of the isolation openings onto the substrate at least partially overlap.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the step of patterning a barrier material layer with grooves to form a barrier layer with through holes includes:

[0014] An ashing process is used to remove the portion of the barrier material layer located at the bottom of the groove, thereby forming a barrier layer with through holes.

[0015] The method for patterning the insulating material layer includes:

[0016] The portion of the isolation material layer located in the hole area is patterned to remove the entire isolation material layer located in the hole area.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the entire isolation material layer located in the hole area is removed by dry etching the isolation material layer.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the step of patterning the insulating material layer further includes:

[0019] The pixel-defined material layer is patterned to remove all pixels located in the hole area.

[0020] According to any of the foregoing embodiments of the first aspect of this application, after the step of forming the pixel definition layer, the method further includes:

[0021] A light-emitting layer, a first electrode layer, and a first encapsulation layer are sequentially fabricated on the side of the pixel definition layer away from the substrate. The light-emitting layer includes a light-emitting unit located within the pixel opening, the first electrode layer includes a first electrode located within an isolation opening, and the first encapsulation layer includes an encapsulation portion located within the isolation opening.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the isolation material layer includes a first layer and a second layer, the second layer being located on the side of the first layer facing away from the substrate. The step of patterning the isolation material layer to remove at least a portion of the isolation material layer located in the hole region includes:

[0023] The isolation material layer is patterned to remove all of the second layer located in the hole area.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the entire second layer located in the hole area is removed by dry etching the isolation material layer.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the step of patterning the insulating material layer further includes:

[0026] The isolation material layer is patterned to remove at least a portion of the first layer located in the hole area.

[0027] According to any of the foregoing embodiments of the first aspect of this application, after the step of sequentially fabricating a light-emitting layer, a first electrode layer, and a first encapsulation layer on the side of the pixel definition layer facing away from the substrate, the method further includes:

[0028] The first layer is patterned, and the portion of the first layer located in the hole area is removed.

[0029] According to any of the foregoing embodiments of the first aspect of this application, the portion of the first layer located in the hole region is removed by wet etching of the first layer.

[0030] According to any of the foregoing embodiments of the first aspect of this application, the insulating material layer further includes a third layer, which is located on the side of the first layer near the substrate.

[0031] According to any of the foregoing embodiments of the first aspect of this application, after the step of sequentially fabricating a light-emitting layer, a first electrode layer, and a first encapsulation layer on the side of the pixel definition layer facing away from the substrate, the method further includes:

[0032] The third layer is patterned, and all areas of the third layer located in the hole area are removed.

[0033] According to any of the foregoing embodiments of the first aspect of this application, the entire third layer located in the hole area is removed by wet etching of the third layer.

[0034] According to any of the foregoing embodiments of the first aspect of this application, the pixel definition layer extends to the hole region and covers at least a portion of the substrate in the hole region.

[0035] According to any of the foregoing embodiments of the first aspect of this application, the step of preparing a barrier material layer and patterning the barrier material layer to obtain a barrier material layer with grooves includes:

[0036] A barrier material layer is prepared on the side of the isolation material layer that faces away from the substrate;

[0037] A halftone mask is used to pattern the barrier material layer to obtain a barrier material layer with grooves.

[0038] According to any of the foregoing embodiments of the first aspect of this application, the material of the blocking material layer includes photoresist.

[0039] A second aspect of this application provides a display panel, which includes a display area and an aperture area. The display area surrounds at least a portion of the aperture area. The display panel further includes: a substrate; an isolation structure located on the substrate and at least partially located in the display area, the isolation structure enclosing an isolation opening, the isolation structure including a first layer and a second layer, the second layer being located on the side of the first layer away from the substrate; and a light-emitting layer located on the substrate, the light-emitting layer including light-emitting units located within the isolation opening, wherein the first layer has a first sidewall facing the aperture area, the second layer has a second sidewall facing the aperture area, the orthographic projection of the second sidewall on the substrate coincides with the orthographic projection of the first sidewall on the substrate, or the orthographic projection of the second sidewall on the substrate is located on the side of the first sidewall on the substrate away from the aperture area.

[0040] According to an embodiment of the second aspect of this application, the first sidewall and the second sidewall are coplanar.

[0041] According to any of the foregoing embodiments of the second aspect of this application, the second layer is provided to protrude from the first layer in the direction of the isolation opening.

[0042] According to any of the foregoing embodiments of the second aspect of this application, the isolation structure includes a first isolation structure located in the display area and a second isolation structure located in the hole area, with the first isolation structure and the second isolation structure spaced apart to form a gap.

[0043] According to any of the foregoing embodiments of the second aspect of this application, the second isolation structure encloses and forms a hollow area, the hollow area being located on the side of the second isolation structure opposite to the gap.

[0044] According to any of the foregoing embodiments of the second aspect of this application, the first layer of the second isolation structure has a third sidewall facing the gap, and the second layer of the second isolation structure has a fourth sidewall facing the gap. The orthographic projection of the fourth sidewall on the substrate coincides with the orthographic projection of the third sidewall on the substrate, or the orthographic projection of the fourth sidewall on the substrate is located on the side of the orthographic projection of the third sidewall on the substrate that is away from the hole area.

[0045] According to any of the foregoing embodiments of the second aspect of this application, the second layer of the second isolation structure protrudes from the first layer in the direction of the hollowed-out area.

[0046] According to any of the foregoing embodiments of the second aspect of this application, the display panel further includes: a pixel definition layer located on the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel opening and the isolation structure being connected.

[0047] According to any of the foregoing embodiments of the second aspect of this application, the isolation structure is located on the side of the pixel limiting portion away from the substrate.

[0048] According to any of the foregoing embodiments of the second aspect of this application, the display panel further includes a second electrode, which is located between the substrate and the pixel definition layer and is exposed through a pixel opening.

[0049] According to any of the foregoing embodiments of the second aspect of this application, the pixel definition layer further includes a cutout region, wherein the orthographic projection of the cutout region on the substrate at least partially overlaps with the orthographic projection of the hole region on the substrate.

[0050] According to any of the foregoing embodiments of the second aspect of this application, the orthographic projection of the hollow area on the substrate coincides with the orthographic projection of the hole area on the substrate.

[0051] According to any of the foregoing embodiments of the second aspect of this application, the pixel defining portion includes a top surface on the side away from the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the top surface on the substrate.

[0052] According to any of the foregoing embodiments of the second aspect of this application, the isolation structure further includes a third layer, which is located on the side of the first layer near the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0053] According to any of the foregoing embodiments of the second aspect of this application, the orthographic projection of the third layer onto the substrate is located within the orthographic projection of the top surface onto the substrate.

[0054] According to any of the foregoing embodiments of the second aspect of this application, the display panel further includes: a first electrode layer located on the side of the light-emitting layer away from the substrate, and including a plurality of first electrodes, the first electrodes being located in corresponding isolation openings, and the first electrodes being electrically connected to the isolation structure.

[0055] According to any of the foregoing embodiments of the second aspect of this application, the orthogonal projection of the light-emitting unit onto the substrate is located within the orthogonal projection of the first electrode onto the substrate.

[0056] According to any of the foregoing embodiments of the second aspect of this application, the light-emitting unit and the isolation structure are arranged at intervals.

[0057] According to any of the foregoing embodiments of the second aspect of this application, the first layer includes a conductive material.

[0058] According to any of the foregoing embodiments of the second aspect of this application, the second layer includes a conductive material or an insulating material.

[0059] According to any of the foregoing embodiments of the second aspect of this application, both the first layer and the second layer comprise metallic materials, and the materials of the first layer and the second layer are different.

[0060] An embodiment of the third aspect of this application provides a display device that includes a display panel of any of the above embodiments.

[0061] According to the display panel fabrication method of this application, after fabricating a pixel definition material layer and an isolation material layer on a substrate, a barrier material layer is disposed on the isolation material layer. The barrier material layer is located within the display area to cover the isolation material layer located in the display area, thereby providing etching protection for the isolation material layer in the display area. When the isolation material layer is subsequently etched, only the portion of the isolation material layer located in the hole area is etched, thereby removing at least a portion of the isolation material layer located in the hole area. The orthographic projection of the via on the substrate overlaps with the orthographic projection of the isolation opening on the substrate, allowing the pixel definition material layer to be exposed through the via. The exposed pixel definition material layer is then etched through the via to form a pixel opening communicating with the isolation opening. In the fabrication method of this application, the same barrier material layer is used for etching protection when patterning the isolation material layer in the hole area and the pixel definition material layer in the display area, eliminating the need for additional processes and simplifying the fabrication process of the display panel. Attached Figure Description

[0062] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0063] Figure 1 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of this application;

[0064] Figure 2 is a top view of a display panel provided in an embodiment of this application;

[0065] Figure 3 is a magnified view of a portion of Figure 2;

[0066] Figures 4 to 18 are process diagrams illustrating the fabrication of a display panel according to an embodiment of this application;

[0067] Figure 19 is a partial cross-sectional view of a display panel provided in an embodiment of this application;

[0068] Figure 20 is a partial cross-sectional view of a display panel provided in another embodiment;

[0069] Figure 21 is a partial cross-sectional view of a display panel provided in another embodiment;

[0070] Figure 22 is a partial cross-sectional view of a display panel provided in another embodiment;

[0071] Figure 23 is a partial cross-sectional view of a display panel provided in another embodiment.

[0072] Figure 24 is a partial cross-sectional view of a display panel provided in another embodiment.

[0073] Explanation of reference numerals in the attached figures:

[0074] 10. Display panel; AA, display area; NA, hole area; 11. Gap;

[0075] 100. Substrate;

[0076] 200. Isolation structure; 201. Isolation material layer; 210. First layer; 211. First sidewall; 212. Third sidewall; 220. Second layer; 221. Second sidewall; 222. Fourth sidewall; 230. Third layer; 240. Isolation opening; 250. First isolation structure; 260. Second isolation structure; 270. Hollowed-out area;

[0077] 300, Light-emitting layer; 310, Light-emitting unit;

[0078] 400, First electrode layer; 410, First electrode;

[0079] 500, Pixel definition layer; 501, Pixel definition material layer; 510, Pixel limiting part; 520, Pixel opening; 530, Cutout area;

[0080] 600, Second electrode;

[0081] 700, barrier material layer; 701, groove; 702, through hole; 710, barrier layer. Detailed Implementation

[0082] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0083] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0084] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0085] This application provides a method for manufacturing a display panel, a display panel, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the method for manufacturing the display panel, the display panel, and the display device.

[0086] This application provides a method for manufacturing a display panel, a display panel, and a display device. The display panel may be an organic light-emitting diode (OLED) display panel.

[0087] Please refer to Figures 1 to 18 together. Figure 1 is a schematic flowchart of a method for manufacturing a display panel 10 according to an embodiment of this application; Figure 2 is a top view of a display panel 10 according to an embodiment of this application; Figure 3 is a partial enlarged view of Figure 2; Figures 4 to 18 are process diagrams of the manufacturing process of a display panel 10 according to an embodiment of this application. Figures 12, 17, and 18 are all cross-sectional views of AA in Figure 3.

[0088] As shown in Figures 1 to 11, a first aspect of this application provides a method for manufacturing a display panel 10. The display panel 10 includes a display area AA and an aperture area NA, wherein the display area AA surrounds at least a portion of the aperture area NA. The method includes:

[0089] Step S01: A pixel definition material layer 501 and an isolation material layer 201 are sequentially prepared on the substrate 100. An isolation opening 240 located in the display area AA is formed on the isolation material layer 201.

[0090] Step S02: Prepare a barrier material layer 700 on the side of the isolation material layer 201 facing away from the substrate 100. The barrier material layer 700 is located in the display area AA.

[0091] Step S03: Pattern the isolation material layer 201 to remove at least a portion of the isolation material layer 201 located in the hole region NA;

[0092] Step S04: Pattern the barrier material layer 700 to form a barrier layer 710 with a through hole 702, wherein the orthographic projection of the through hole 702 on the substrate 100 and the orthographic projection of the isolation opening 240 on the substrate 100 at least partially overlap.

[0093] Step S05: Pattern the pixel definition material layer 501 through the through hole 702 to form a pixel definition layer 500. The pixel definition layer 500 includes a pixel limiting part 510 and a pixel opening 520 formed by the pixel limiting part 510. The pixel opening 520 and the isolation opening 240 are connected.

[0094] According to the method for fabricating the display panel 10 according to the embodiments of this application, after fabricating a pixel definition material layer 501 and an isolation material layer 201 on a substrate 100, a barrier material layer 700 is provided on the isolation material layer 201. The barrier material layer 700 is located within the display area AA to cover the isolation material layer 201 located in the display area AA, thereby providing etching protection for the isolation material layer 201 in the display area AA. When the isolation material layer 201 is subsequently etched, only the portion of the isolation material layer 201 located in the hole area NA is etched, thereby removing at least a portion of the isolation material layer 201 located in the hole area NA. Since the orthographic projection of the via 702 on the substrate 100 overlaps with the orthographic projection of the isolation opening 240 on the substrate 100, the pixel definition material layer 501 can be exposed through the via 702. Thus, the exposed portion of the pixel definition material layer 501 is etched through the via 702 to form a pixel opening 520 communicating with the isolation opening 240. In the fabrication method of this application, the same barrier material layer 700 is used for etching protection when patterning the isolation material layer 201 and the pixel definition material layer 501, eliminating the need for additional processes and simplifying the fabrication process of the display panel 10. Furthermore, the step of removing at least a portion of the isolation material layer 201 located in the hole region NA is performed after the barrier material layer 700 is set, improving the performance of the display panel 10.

[0095] Optionally, the orthographic projection of the via 702 onto the substrate 100 is located within the orthographic projection of the isolation opening 240 onto the substrate 100, so that the isolation structure will not be damaged when etching is performed through the via 702.

[0096] In some optional embodiments, in step S02, the method further includes:

[0097] A barrier material layer 700 is prepared and patterned to obtain a barrier material layer 700 with a groove 701, wherein the orthographic projection of the groove 701 on the substrate 100 at least partially overlaps with the orthographic projection of the isolation opening 240 on the substrate 100.

[0098] In these optional embodiments, after the isolation material layer 201 is patterned, the barrier material layer 700 is patterned at the groove 701 position, so that the groove 701 is etched to form a through hole 702. Since the orthographic projection of the groove 701 on the substrate 100 overlaps with the orthographic projection of the isolation opening 240 on the substrate 100, the pixel definition material layer 501 can be exposed through the through hole 702. Thus, the exposed part of the pixel definition material layer 501 is etched through the through hole 702 to form a pixel opening 520 communicating with the isolation opening 240.

[0099] In some optional embodiments, the steps of preparing the barrier material layer 700 and patterning the barrier material layer 700 to obtain a barrier material layer 700 with grooves 701 include:

[0100] The barrier material layer 700 is removed by an ashing process within the groove 701, thereby forming a barrier layer 710 with through holes 702.

[0101] In these alternative embodiments, since the barrier material layer 700 is relatively thin in the groove 701 region, the ashing process can effectively remove part of the barrier material layer 700 in the groove 701 region, thereby forming a through hole 702. This allows the pixel definition material layer 501 to be exposed through the through hole 702, facilitating subsequent patterning of the pixel definition material layer 501 through the through hole 702 to form a pixel opening 520.

[0102] As shown in Figures 7 and 8, in some optional embodiments, the step of patterning the insulating material layer 201 includes:

[0103] The portion of the isolation material layer 201 located in the hole region NA is patterned to remove the entire isolation material layer 201 located in the hole region NA.

[0104] In these optional embodiments, the isolation material layer 201 of the aperture region NA is completely removed to avoid the problem of the isolation material layer 201 remaining in the aperture region NA, which would require additional processes to remove the residual isolation material layer 201 in subsequent processes.

[0105] Optionally, the isolation material layer 201 can be dry-etched to completely remove the isolation material layer 201 in the hole area NA, thus avoiding any residue of the isolation material layer 201 in the hole area NA.

[0106] As shown in Figure 9, in some optional embodiments, the step of patterning the isolation material layer 201 further includes:

[0107] The pixel definition material layer 501 is patterned to remove all of the pixel definition material layer 501 located in the hole region NA.

[0108] In these alternative embodiments, the pixel definition material layer 501 located in the aperture region NA is removed, and only the pixel definition material layer 501 located in the display region AA is retained. This avoids the problem that cracks generated when cutting the aperture region NA will extend to the display region AA through the pixel definition material layer 501, affecting the light emission display of the display region AA.

[0109] As shown in Figure 12, in some optional embodiments, after the step of forming the pixel definition layer 500, the method further includes:

[0110] A light-emitting layer 300, a first electrode layer 400, and a first encapsulation layer are sequentially formed on the side of the pixel definition layer 500 away from the substrate 100. The light-emitting layer 300 includes a light-emitting unit 310 located in the pixel opening 520, the first electrode layer 400 includes a first electrode 410 located in the isolation opening 240, and the first encapsulation layer includes an encapsulation portion located in the isolation opening 240.

[0111] In these optional embodiments, the light-emitting unit 310 is located within the pixel opening 520 to achieve light-emitting display of the display panel 10. The first electrode 410 serves as the light-emitting electrode of the light-emitting unit 310 to drive the light-emitting electrode to emit light. The encapsulation portion covers the light-emitting unit 310 and the first electrode 410 to encapsulate them, reducing the corrosion of the light-emitting unit 310 and the first electrode 410 by water and oxygen, and improving the service life and reliability of the light-emitting unit 310 and the first electrode 410.

[0112] As shown in Figure 13, in some optional embodiments, the isolation material layer 201 includes a first layer 210 and a second layer 220, with the second layer 220 located on the side of the first layer 210 facing away from the substrate 100. The step of patterning the isolation material layer 201 to remove at least a portion of the isolation material layer 201 located in the via region NA includes:

[0113] The isolation material layer 201 is patterned to remove all of the second layer 220 located in the hole region NA.

[0114] In these optional embodiments, the isolation material layer 201 includes a first layer 210 and a second layer 220 stacked together. The second layer 220 located on the side of the first layer 210 facing away from the substrate 100 is removed in the hole area NA. After removing the second layer 220 in the hole area NA, the pixel definition layer 500 is etched with the same barrier material layer 700 to form a pixel opening 520. When patterning the isolation material layer 201 and the pixel definition material layer 501, the same barrier material layer 700 is used for etching protection, which eliminates the need for additional processes and simplifies the manufacturing process of the display panel 10.

[0115] Optionally, by dry etching the isolation material layer 201, the second layer 220 of the isolation material layer 201 can be dry-etched away in the hole region NA to prevent the second layer 220 from blocking the etching of the first layer 210 in the hole region NA during subsequent wet processing.

[0116] In some optional embodiments, the step of patterning the insulating material layer 201 further includes:

[0117] The isolation material layer 201 is patterned to remove at least a portion of the first layer 210 located in the hole region NA.

[0118] In these alternative embodiments, when the second layer 220 of the via region NA is dry-etched, the first layer 210 will continue to be etched after the second layer 220 is completely etched, thereby removing at least a portion of the first layer 210 located in the via region NA, reducing the thickness of the first layer 210, and facilitating subsequent wet etching removal.

[0119] As shown in Figure 17, in some optional embodiments, after the step of sequentially fabricating the light-emitting layer 300, the first electrode layer 400, and the first encapsulation layer on the side of the pixel definition layer 500 facing away from the substrate 100, the method further includes:

[0120] The first layer 210 is patterned, and the portion of the first layer 210 located in the hole region NA is removed.

[0121] In these optional embodiments, after the light-emitting layer 300, the first electrode layer 400 and the first encapsulation layer are prepared, the residual first layer 210 in the aperture region NA is patterned and removed, thereby removing all the second layer 220 and the first layer 210 in the aperture region NA, so as to avoid the presence of the second layer 220 and the first layer 210 in the aperture region NA and affecting the subsequent cutting of the aperture region NA.

[0122] Optionally, by wet etching the first layer 210, the first layer 210 in the hole area NA can be removed more thoroughly, avoiding the first layer 210 residue in the hole area NA.

[0123] As shown in Figure 18, optionally, the isolation material layer 201 further includes a third layer 230, which is located on the side of the first layer 210 near the substrate 100. After the steps of sequentially fabricating the light-emitting layer 300, the first electrode layer 400, and the first encapsulation layer on the side of the pixel definition layer 500 away from the substrate 100, the method further includes:

[0124] The third layer 230 is patterned to remove all of the third layer 230 located in the hole region NA.

[0125] In these optional embodiments, when the first layer 210 remaining in the hole region NA is patterned, the third layer 230 of the hole region NA is also patterned to remove the third layer 230 in the hole region NA, thereby removing the isolation material layer 201 in the hole region NA and preventing the isolation material layer 201 from existing in the hole region NA and affecting the subsequent cutting of the hole region NA.

[0126] Optionally, by wet etching the third layer 230, the first layer 210 and the third layer 230 in the hole area NA are etched using a wet etching process to completely remove the first layer 210 and the third layer 230 in the hole area NA, so as to avoid the third layer 230 remaining in the hole area NA.

[0127] In some alternative embodiments, the pixel definition layer 500 extends to the aperture region NA and covers at least a portion of the substrate 100 in the aperture region NA.

[0128] In these alternative embodiments, when wet etching is used to remove the first layer 210 and the third layer 230, the pixel defining portion 510 in the aperture region NA will not be damaged by etching. The pixel defining portion 510 extends to the aperture region NA, improving the packaging reliability of the aperture region NA, improving the water and oxygen barrier capability, and reducing the possibility of water and oxygen entering the display area AA through the aperture region NA.

[0129] In some optional embodiments, the steps of preparing the barrier material layer 700 and patterning the barrier material layer 700 to obtain a barrier material layer 700 with grooves 701 include:

[0130] A barrier material layer 700 is prepared on the side of the isolation material layer 201 that is away from the substrate 100;

[0131] The blocking material layer 700 is patterned using a halftone mask to obtain a blocking material layer 700 with grooves 701.

[0132] In these alternative embodiments, a halftone mask with different transmittance regions is used to pattern the barrier material layer 700. This can completely remove the barrier material layer 700 in the aperture region NA, while also forming a groove 701 in the display region AA. This facilitates the subsequent patterning of the isolation material layer 201 and the pixel definition material layer 501 using the barrier material layer 700. When patterning the isolation material layer 201 and the pixel definition material layer 501, the same barrier material layer 700 is used for etching protection, eliminating the need for additional processes and simplifying the manufacturing process of the display panel 10. Furthermore, the step of removing at least a portion of the isolation material layer 201 located in the aperture region NA is performed after the setting of the barrier material layer 700. The same barrier material layer 700 is used to etch the pixel definition layer 500 to form the pixel opening 520. This avoids the problem of first patterning the isolation material layer 201, removing the isolation material layer 201 in the aperture region NA, and then setting the barrier material layer 700 to cover other positions of the pixel opening 520. This avoids the problem of the barrier material layer 700 covering the sidewall of the isolation material layer 201 facing the aperture region NA, causing air bubbles and glue explosion between the barrier material layer 700 and the sidewall of the isolation material layer 201. This improves the performance of the display panel 10.

[0133] Optionally, the material of the barrier material layer 700 may include photoresist, which is readily available and has good etching resistance. Using the same barrier material layer 700 to etch the pixel definition layer 500 to form the pixel opening 520 avoids the problem of first patterning the isolation material layer 201, removing the isolation material layer 201 of the hole area NA, and then setting the barrier material layer 700 to cover other positions of the pixel opening 520. This avoids the problem of the barrier material layer 700 covering the sidewall of the isolation material layer 201 facing the hole area NA, causing air bubbles and delamination between the barrier material layer 700 and the sidewall of the isolation material layer 201.

[0134] Please refer to Figures 19 and 20. Figure 19 is a partial cross-sectional view of a display panel 10 provided in an embodiment of this application; Figure 20 is a partial cross-sectional view of a display panel 10 provided in another embodiment.

[0135] As shown in Figures 19 and 20, a second aspect embodiment of this application provides a display panel 10, which includes a display area AA and an aperture area NA. The display area AA surrounds at least a portion of the aperture area NA. The display panel 10 further includes: a substrate 100; an isolation structure 200 located on the substrate 100 and located on the display area AA, the isolation structure 200 forming an isolation opening 240, the isolation structure 200 including a first layer 210 and a second layer 220, the second layer 220 being located on the side of the first layer 210 facing away from the substrate 100; and a light-emitting layer 3. 00, located on substrate 100, light-emitting layer 300 includes light-emitting unit 310 located within isolation opening 240, wherein the first layer 210 has a first sidewall 211 facing the aperture region NA, and the second layer 220 has a second sidewall 221 facing the aperture region NA. The orthographic projection of the second sidewall 221 on substrate 100 coincides with the orthographic projection of the first sidewall 211 on substrate 100, or the orthographic projection of the second sidewall 221 on substrate 100 is located on the side of the first sidewall 211 on substrate 100 away from the aperture region NA.

[0136] According to an embodiment of this application, the display panel 10 includes a substrate 100, an isolation structure 200, and a light-emitting layer 300. The isolation structure 200 is disposed on the substrate 100 and forms a plurality of isolation openings 240 to isolate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing crosstalk of charge carriers in the light-emitting layer 300, improving the display effect of the display panel 10, and the fabrication of the light-emitting units 310 can be carried out without the use of a precision mask, which can reduce the development and use of precision masks and reduce the manufacturing cost. The orthographic projection of the second sidewall 221 on the substrate 100 coincides with the orthographic projection of the first sidewall 211 on the substrate 100. Alternatively, the orthographic projection of the second sidewall 221 on the substrate 100 is located on the side of the first sidewall 211 on the substrate 100 that is away from the hole area NA. This ensures that the first layer 210 is not recessed on the side facing the hole area NA relative to the side of the second layer 220 facing the hole area NA. When photoresist or other materials are covered on the side of the isolation structure 200 facing the hole area NA, no air bubbles will be generated between the photoresist and the sidewall of the isolation structure 200 facing the hole area NA. This avoids the formation of air bubbles between the photoresist and the sidewall of the isolation structure 200 facing the hole area NA, which would lead to delamination and improve the performance of the display panel 10.

[0137] There are many other ways to arrange the substrate 100. For example, the substrate 100 may include a substrate and an array substrate disposed on the substrate. Alternatively, the substrate 100 may be the substrate itself. Or the substrate 100 may include a buffer layer and a support plate on the side facing away from the substrate.

[0138] Please refer to Figures 21 and 22. Figure 21 is a partial cross-sectional view of a display panel provided in another embodiment; Figure 22 is a partial cross-sectional view of a display panel provided in yet another embodiment.

[0139] As shown in Figures 21 and 22, in some optional embodiments, the isolation structure 200 includes a first isolation structure 250 located in the display area AA and a second isolation structure 260 located in the aperture area NA, with the first isolation structure 250 and the second isolation structure 260 spaced apart to form a gap 11.

[0140] In these optional embodiments, the first isolation structure 250 isolates the portion of the light-emitting layer 300 located in the display area AA to form a light-emitting unit 310 located in the display area AA, and the second isolation structure 260 isolates the portion of the light-emitting layer 300 located in the aperture area NA to form a light-emitting unit 310 located in the aperture area NA, so that both the display area AA and the aperture area NA emit light, thereby achieving a full-screen display.

[0141] As shown in Figure 22, in some optional embodiments, the second isolation structure 260 encloses a hollow area 270, which is located on the side of the second isolation structure 260 opposite to the gap 11. All the second isolation structures 260 are arranged around the same hollow area 270.

[0142] In these alternative embodiments, the arrangement of the hollowed-out area 270 can reduce the distribution area of ​​the second isolation structure 260 in the aperture area NA, increase the light-transmitting area of ​​the aperture area NA, and improve the transmittance of the aperture area NA, thereby improving the photosensitivity of the aperture area NA.

[0143] As shown in FIG21, in some optional embodiments, the first layer 210 of the second isolation structure 260 has a third sidewall 212 facing the gap 11, and the second layer 220 of the second isolation structure 260 has a fourth sidewall 222 facing the gap 11. The orthographic projection of the fourth sidewall 222 on the substrate 100 coincides with the orthographic projection of the third sidewall 212 on the substrate 100, or the orthographic projection of the fourth sidewall 222 on the substrate 100 is located on the side of the orthographic projection of the third sidewall 212 on the substrate 100 that is away from the hole region NA.

[0144] In these optional embodiments, the orthographic projection of the fourth sidewall on the substrate 100 coincides with the orthographic projection of the first sidewall 211 on the substrate 100, or the orthographic projection of the fourth sidewall on the substrate 100 is located on the side of the third sidewall on the substrate 100 away from the hole area NA, so that the first layer 210 is not recessed on the side facing the gap 11 relative to the side facing the gap 11 of the second layer 220. When a material such as photoresist is covered on the side of the isolation structure 200 facing the gap 11, no air bubbles are generated between the photoresist and the sidewall of the isolation structure 200 facing the gap 11, thereby avoiding the defective phenomenon of photoresist delamination caused by air bubbles being generated between the photoresist and the sidewall of the isolation structure 200 facing the gap 11, thereby improving the performance of the display panel 10.

[0145] As shown in Figure 22, optionally, the second layer 220 of the second isolation structure 260 protrudes from the first layer 210 in the direction of the hollow area 270, so that the light-emitting layer 300 can be easily broken on the side of the second isolation structure 260 facing the hollow area 270, thereby forming the light-emitting unit 310 located in the isolation opening 240 in the hole area NA.

[0146] As shown in Figure 19, in some optional embodiments, the first sidewall 211 and the second sidewall 221 are coplanar.

[0147] The first sidewall 211 and the second sidewall 221 are coplanar, meaning that the first sidewall 211 and the second sidewall 221 are located on the same plane, that is, the extended surfaces of the first sidewall 211 and the second sidewall 221 overlap each other.

[0148] In these optional embodiments, when the first sidewall 211 and the second sidewall 221 are coplanar, the first layer 210 is not recessed on the side facing the hole area NA relative to the side facing the hole area NA of the second layer 220. When a material such as photoresist is covered on the side of the isolation structure 200 facing the hole area NA, the photoresist adheres well to the first sidewall 211 and the second sidewall 221, and no bubbles are generated. This avoids the formation of bubbles between the photoresist and the sidewall of the isolation structure 200 facing the hole area NA, which would lead to the defect of photoresist delamination, thereby improving the performance of the display panel 10.

[0149] In some alternative embodiments, the second layer 220 protrudes beyond the first layer 210 in the direction of the isolation opening 240.

[0150] In these optional embodiments, the first layer 210 and the second layer 220 are stacked to form the isolation structure 200, with the first layer 210 recessed relative to the second layer 220 in a direction away from the isolation opening 240. When the light-emitting layer 300 is fabricated, a large drop occurs at the edge of the isolation structure 200, and since the first layer 210 is recessed relative to the second layer 220, the light-emitting layer 300 is difficult to connect at the edge of the isolation structure 200, resulting in breakage. The breakage of the light-emitting layer 300 forms mutually disconnected light-emitting units 310.

[0151] The composition and preparation of the isolation structure 200 are detailed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and C. Further descriptions are provided in N117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0152] In some optional embodiments, the display panel 10 further includes a pixel definition layer 500 located on the substrate 100. The pixel definition layer 500 includes a pixel limiting portion 510 and a pixel opening 520 formed by the pixel limiting portion 510. The pixel opening 520 is connected to the isolation structure 200.

[0153] In these optional embodiments, the pixel limiting portion 510 defines the setting area of ​​each light-emitting unit 310, reducing color crosstalk between the light-emitting units 310. The pixel opening 520 is connected to the isolation opening 240, reducing the occlusion of the pixel opening 520 by the isolation structure 200 and ensuring the light-emitting effect of the display panel 10.

[0154] In some alternative embodiments, the isolation structure 200 is located on the side of the pixel limiting portion 510 away from the substrate 100.

[0155] In these optional embodiments, the isolation structure 200 is disposed on the pixel defining portion 510, and the isolation structure 200 has a large height difference equivalent to the pixel opening 520. When the first electrode layer 400 is fabricated, due to the large height difference, the first electrode layer 400 is easier to break at the location of the isolation structure 200, reducing the fabrication difficulty of the first electrode layer 400.

[0156] Optionally, the pixel defining portion 510 may be made of inorganic materials, such as SiO or SiN. The pixel defining portion 510 made of inorganic materials has good barrier properties against water and oxygen, which can reduce the intrusion of water and oxygen into the first electrode 410 and improve the reliability of the first electrode 410.

[0157] Optionally, the display panel 10 further includes a second electrode 600, which is located between the substrate 100 and the pixel definition layer 500, and is exposed through the pixel opening 520. One of the second electrode 600 and the first electrode 410 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. This embodiment uses the second electrode 600 as the anode of the light-emitting unit 310 and the first electrode 410 as the cathode for illustrative purposes.

[0158] Please refer to Figure 23, which is a partial cross-sectional view of a display panel provided in another embodiment.

[0159] As shown in FIG23, in some optional embodiments, the pixel definition layer 500 further includes a cutout region 530, the orthographic projection of the cutout region 530 on the substrate 100 at least partially overlapping the orthographic projection of the hole region NA on the substrate 100.

[0160] In these optional embodiments, a cutout area 530, at least partially located in the aperture region NA, is formed on the pixel definition layer 500 to reduce the area of ​​the pixel definition layer 500 in the aperture region NA. This avoids the problem that when the aperture region NA is cut, cracks are generated in the pixel definition layer 500 in the aperture region NA and extend into the display area AA, affecting the normal light emission display of the display area AA.

[0161] Optionally, by removing the pixel definition layer 500 of the aperture region NA, a cutout region 530 of the pixel definition layer 500 in the aperture region NA is formed. The orthographic projection of the cutout region 530 on the substrate 100 coincides with the orthographic projection of the aperture region NA on the substrate 100, or the orthographic projection of the aperture region NA on the substrate 100 lies within the orthographic projection of the cutout region 530 on the substrate 100. The portion of the pixel definition layer 500 within the aperture region NA is completely removed, further preventing the pixel definition layer 500 from generating cracks within the aperture region NA during aperture region NA cutting and extending into the display area AA, thus affecting the normal light emission and display of the display area AA.

[0162] In some alternative embodiments, the pixel defining portion 510 includes a top surface on the side away from the substrate 100, and the orthographic projection of the first layer 210 onto the substrate 100 is located within the orthographic projection of the top surface onto the substrate 100.

[0163] In these optional embodiments, the pixel defining portion 510 is not recessed on the side facing the aperture region NA relative to the side of the first layer 210 facing the aperture region NA. When a material such as photoresist is covered on the side of the isolation structure 200 facing the aperture region NA, no air bubbles are generated between the photoresist and the sidewalls of the isolation structure 200 and the pixel defining layer 500 facing the aperture region NA. This avoids the formation of air bubbles between the photoresist and the sidewalls of the isolation structure 200 and the pixel defining layer 500 facing the aperture region NA, which would lead to the defect of photoresist delamination, thereby improving the performance of the display panel 10.

[0164] Please refer to Figure 24, which is a partial cross-sectional view of a display panel provided in another embodiment.

[0165] As shown in FIG24, in some optional embodiments, the isolation structure 200 further includes a third layer 230, which is located on the side of the first layer 210 near the substrate 100, and the orthographic projection of the first layer 210 onto the substrate 100 is located within the orthographic projection of the third layer 230 onto the substrate 100.

[0166] In these optional embodiments, to obtain the recessed first layer 210, the first layer 210 has a faster etching rate than the second layer 220 and the third layer 230 during the etching process, thus forming the recessed first layer 210. Because the first layer 210 has a faster etching rate, more etching waste is generated and can easily enter other parts of the display panel 10, causing adverse effects. After the third layer 230 is formed, the first layer 210 can adhere better to the third layer 230, and the generated etching waste falls onto the third layer 230, making it easier to clean. The third layer 230 is not recessed on the side facing the aperture region NA relative to the side facing the aperture region NA of the first layer 210. When photoresist or other materials are covered on the side of the isolation structure 200 facing the aperture region NA, no air bubbles will be generated between the photoresist and the isolation structure 200 and the sidewall of the third layer 230 facing the aperture region NA. This avoids the formation of air bubbles between the photoresist and the sidewall of the isolation structure 200 facing the aperture region NA, which would lead to the defect of photoresist delamination, thereby improving the performance of the display panel 10.

[0167] In some alternative embodiments, the orthographic projection of the third layer 230 onto the substrate 100 lies within the orthographic projection of the top surface onto the substrate 100.

[0168] In these optional embodiments, the pixel defining portion 510 is not recessed on the side facing the aperture region NA relative to the side of the third layer 230 facing the aperture region NA. When a material such as photoresist is covered on the side of the isolation structure 200 facing the aperture region NA, no air bubbles are generated between the photoresist and the sidewalls of the isolation structure 200 and the pixel defining layer 500 facing the aperture region NA. This avoids the formation of air bubbles between the photoresist and the sidewalls of the isolation structure 200 and the pixel defining layer 500 facing the aperture region NA, which would lead to the defect of photoresist delamination, thereby improving the performance of the display panel 10.

[0169] In some optional embodiments, the display panel 10 further includes: a first electrode layer 400 located on the side of the light-emitting layer 300 away from the substrate 100, and including a plurality of first electrodes 410, the first electrodes 410 being located within corresponding isolation openings 240, and the first electrodes 410 being electrically connected to the isolation structure 200.

[0170] In these optional embodiments, the isolation structure 200 isolates the first electrode layer 400 to form mutually spaced first electrodes 410. The mutually spaced first electrodes 410 are electrically connected through the isolation structure 200 to form a full-surface electrode, ensuring the normal light emission of the light-emitting unit 310.

[0171] Optionally, the orthographic projection of the light-emitting unit 310 onto the substrate 100 is located within the orthographic projection of the first electrode 410 onto the substrate 100. That is, the first electrode 410 covers the light-emitting unit 310 and serves as the electrode of the light-emitting unit 310, ensuring normal light emission of the light-emitting unit 310 and improving the display effect of the display panel 10. In some optional embodiments, the light-emitting unit 310 and the isolation structure 200 are spaced apart.

[0172] Optionally, the light-emitting unit 310 and the isolation structure 200 are spaced apart, that is, each light-emitting unit 310 is spaced apart from each other, which reduces the crosstalk of charge carriers between each light-emitting unit 310 and improves the color crosstalk problem of the light-emitting unit 310.

[0173] Optionally, the first layer 210 includes a conductive material, such as a non-metallic conductive material or a metallic conductive material, to achieve an electrical connection between the isolation structure 200 and the first electrode 410.

[0174] In some alternative embodiments, the second layer 220 includes a conductive material or an insulating material, wherein the insulating material may be at least one of silicon nitride or silicon oxide.

[0175] In these alternative embodiments, the second layer 220 comprises a conductive material, such as a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, it is difficult to etch during the wet etching process of the first layer 210 using an etching solution, thereby making it easier for the first layer 210 to be recessed relative to the second layer 220. When the auxiliary structure is electrically connected to the touch electrode, the second layer 220 is a conductive material.

[0176] In some alternative embodiments, the first layer 210 and the second layer 220 comprise metallic materials, and the materials of the first layer 210 and the second layer 220 are different.

[0177] In these optional embodiments, when both the first layer 210 and the second layer 220 are metallic materials, the first layer 210 can be wet-etched using an etching solution. By adjusting the etching solution, the etching rate of the second layer 220 can be made lower than that of the first layer 210. Because the etching rate of the first layer 210 is higher, even if the second layer 220 is etched to some extent during wet etching, the first layer 210 is etched faster, resulting in the first layer 210 being recessed relative to the second layer 220. Optionally, the materials of the first layer 210, the second layer 220, or the third layer 230 include materials such as Ti, Al, Mo, Cu, Ti, ITO, or their alloys.

[0178] Optionally, the second layer 220 is made of titanium (Ti) or molybdenum (Mo), the first layer 210 is made of aluminum (Al), silver (Ag) or copper (Cu), and the third layer 230 is made of titanium (Ti) or molybdenum (Mo). For example, the isolation structure 200 is a Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum) three-layer metal composite material.

[0179] Optionally, the light-emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light-emitting material layer, a hole injection layer (HIL), and a hole transport layer (HTL).

[0180] The display panel 10 of this embodiment can be prepared by the preparation method of the display panel 10 in the above embodiment.

[0181] The structural design in this embodiment can be applied to other display panels 10. The specific choice can be made according to the actual situation, and this application does not impose any specific limitations on it. The display panel 10 provided in this application also includes a touch structure, a polarizer, and a cover plate, etc., which are stacked sequentially on the side of the first electrode layer 400 away from the substrate 100.

[0182] The third aspect of this application also provides a display device including the display panel 10 of any of the above embodiments. Since the display device provided in the third aspect of this application includes the display panel 10 of any of the above embodiments, it has the beneficial effects of the display panel 10 of any of the above embodiments, which will not be elaborated further here.

[0183] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0184] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0185] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

[0186] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A method for manufacturing a display panel, characterized in that, The display panel includes a display area and an aperture area, the display area surrounding at least a portion of the aperture area. The method includes: sequentially fabricating a pixel definition material layer and an isolation material layer on a substrate, the isolation material layer having an isolation opening located in the display area; fabricating a barrier material layer on the side of the isolation material layer opposite to the substrate, the barrier material layer being located in the display area; patterning the isolation material layer to remove at least a portion of the isolation material layer located in the aperture area; patterning the barrier material layer to form a barrier layer with through-holes, the orthographic projection of the through-holes on the substrate at least partially overlapping the orthographic projection of the isolation opening on the substrate; patterning the pixel definition material layer through the through-holes to form a pixel definition layer, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel opening and the isolation opening being connected.

2. The preparation method according to claim 1, characterized in that, In the step of preparing a barrier material layer on the side of the isolation material layer opposite to the substrate, the method further includes: preparing a barrier material layer and patterning the barrier material layer to obtain a barrier material layer with grooves, wherein the grooves at least partially overlap the orthographic projection of the isolation opening on the substrate; preferably, in the step of patterning the barrier material layer with grooves to form a barrier layer with through holes, the method includes: removing the portion of the barrier material layer located at the bottom of the grooves using an ashing process, thereby forming a barrier layer with through holes.

3. The preparation method according to claim 1, characterized in that, In the step of patterning the isolation material layer, the method includes: patterning the portion of the isolation material layer located in the hole region to remove all of the isolation material layer located in the hole region; preferably, by dry etching the isolation material layer to remove all of the isolation material layer located in the hole region; preferably, in the step of patterning the isolation material layer, the method further includes: patterning the pixel definition material layer to remove all of the pixel definition material layer located in the hole region.

4. The preparation method according to claim 1, characterized in that, After the step of forming the pixel definition layer, the method further includes: sequentially forming a light-emitting layer, a first electrode layer and a first encapsulation layer on the side of the pixel definition layer opposite to the substrate, wherein the light-emitting layer includes a light-emitting unit located within the pixel opening, the first electrode layer includes a first electrode located within the isolation opening, and the first encapsulation layer includes an encapsulation portion located within the isolation opening.

5. The preparation method according to claim 4, characterized in that, The isolation material layer includes a first layer and a second layer, the second layer being located on the side of the first layer facing away from the substrate. In the step of patterning the isolation material layer to remove at least a portion of the isolation material layer located in the hole region, the method includes: patterning the isolation material layer to remove all of the second layer located in the hole region; preferably, removing all of the second layer located in the hole region by dry etching the isolation material layer; preferably, in the step of patterning the isolation material layer, the method further includes: patterning the isolation material layer to remove at least a portion of the first layer located in the hole region.

6. The preparation method according to claim 5, characterized in that, After the step of sequentially fabricating the light-emitting layer, the first electrode layer, and the first encapsulation layer on the side of the pixel definition layer opposite to the substrate, the method further includes: patterning the first layer to remove the portion of the first layer located in the hole region; preferably, the portion of the first layer located in the hole region is removed by wet etching of the first layer.

7. The preparation method according to claim 5, characterized in that, The isolation material layer further includes a third layer located on the side of the first layer near the substrate; preferably, after the step of sequentially fabricating the light-emitting layer, the first electrode layer, and the first encapsulation layer on the side of the pixel definition layer away from the substrate, the method further includes: patterning the third layer to remove all of the third layer located in the hole region; preferably, removing all of the third layer located in the hole region by wet etching the third layer; preferably, the pixel definition layer extends to the hole region and covers at least a portion of the substrate in the hole region.

8. The preparation method according to claim 2, characterized in that, In the step of preparing a barrier material layer and patterning the barrier material layer to obtain a barrier material layer with grooves, the method includes: preparing a barrier material layer on the side of the isolation material layer opposite to the substrate; patterning the barrier material layer using a halftone mask to obtain a barrier material layer with grooves; preferably, the material of the barrier material layer includes photoresist.

9. A display panel, characterized in that, The display panel includes a display area and an aperture area, the display area surrounding at least a portion of the aperture area. The display panel further includes: a substrate; an isolation structure located on the substrate and at least partially located in the display area, the isolation structure enclosing an isolation opening, the isolation structure including a first layer and a second layer, the second layer being located on the side of the first layer facing away from the substrate; and a light-emitting layer located on the substrate, the light-emitting layer including light-emitting units located within the isolation opening, wherein the first layer has a first sidewall facing the aperture area, the second layer has a second sidewall facing the aperture area, the orthographic projection of the second sidewall on the substrate coincides with the orthographic projection of the first sidewall on the substrate, or the orthographic projection of the second sidewall on the substrate is located on the side of the first sidewall on the substrate away from the aperture area.

10. The display panel according to claim 9, characterized in that, The first sidewall and the second sidewall are coplanar.

11. The display panel according to claim 9, characterized in that, The second layer protrudes from the first layer in the direction of the isolation opening; preferably, the isolation structure includes a first isolation structure located in the display area and a second isolation structure located in the hole area, with the first isolation structure and the second isolation structure spaced apart to form a gap; preferably, the second isolation structure encloses a hollow area, the hollow area being located on the side of the second isolation structure away from the gap; preferably, the first layer of the second isolation structure has a third sidewall facing the gap, and the second layer of the second isolation structure has a fourth sidewall facing the gap, the orthographic projection of the fourth sidewall on the substrate coincides with the orthographic projection of the third sidewall on the substrate, or the orthographic projection of the fourth sidewall on the substrate is located on the side of the orthographic projection of the third sidewall on the substrate away from the hole area; preferably, the second layer of the second isolation structure protrudes from the first layer in the direction of the hollow area.

12. The display panel according to claim 9, characterized in that, The display panel further includes: a pixel definition layer located on the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel opening and the isolation structure being connected; preferably, the isolation structure is located on the side of the pixel defining portion away from the substrate; preferably, the display panel further includes a second electrode located between the substrate and the pixel definition layer, the second electrode being exposed through the pixel opening.

13. The display panel according to claim 12, characterized in that, The pixel definition layer further includes a cutout area, the orthographic projection of the cutout area on the substrate at least partially overlaps with the orthographic projection of the hole area on the substrate; preferably, the orthographic projection of the cutout area on the substrate coincides with the orthographic projection of the hole area on the substrate.

14. The display panel according to claim 12, characterized in that, The pixel defining portion includes a top surface on the side away from the substrate, and the orthographic projection of the first layer onto the substrate is located within the orthographic projection of the top surface onto the substrate.

15. The display panel according to claim 14, characterized in that, The isolation structure further includes a third layer located on the side of the first layer near the substrate, wherein the orthographic projection of the first layer on the substrate is within the orthographic projection of the third layer on the substrate; preferably, the orthographic projection of the third layer on the substrate is within the orthographic projection of the top surface on the substrate.

16. The display panel according to claim 9, characterized in that, The display panel further includes: a first electrode layer located on the side of the light-emitting layer opposite to the substrate, and including a plurality of first electrodes, the first electrodes being located within the corresponding isolation openings, and the first electrodes being electrically connected to the isolation structure; preferably, the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate; preferably, the light-emitting unit and the isolation structure are spaced apart.

17. The display panel according to claim 9, characterized in that, The first layer comprises a conductive material; preferably, the second layer comprises a conductive material or an insulating material; preferably, both the first layer and the second layer comprise a metallic material, and the materials of the first layer and the second layer are different.

18. A display device, characterized in that, Includes the display panel as described in any one of claims 9-17.

Images