Conductive member

Abstract

The conductive member includes a substrate (2) having a first layer (4) and a second layer (5) laminated on the first layer (4), a first wiring portion (10) provided on the first layer (4), and a second wiring portion (20) provided on the second layer (5). A first groove (6) is provided in the first layer (4), and a second groove (7) is provided in the second layer (5). The first wiring portion (10) includes a first conductive layer made of a conductive material and embedded in the first groove portion (6), and the second wiring portion (20) includes a second conductive layer made of a conductive material and embedded in the second groove portion (7). In a contact region (A) in which the first wiring section (10) and the second wiring section (20) overlap in plan view and extend in mutually parallel directions, the lower portion of the second wiring section (20) includes a contact portion (Cp) in contact with the upper portion of the first wiring section (10). The contact portion (Cp) of the second wiring portion (20) extends in the direction in which the first wiring portion (10) and the second wiring portion (20) extend in the contact region (A).

Description

Technical Field

[0001] This disclosure relates to a conductive component. Background Technology

[0002] To date, conductive components, such as the one shown in Patent Document 1, have been known as conductive components.

[0003] Patent Document 1 discloses a conductive component (touch sensor) comprising a base and multiple electrodes composed of multiple wiring portions (fine metal wires). The base has a substrate made of a thin film material and a resin layer composed of a single layer laminated on the surface of the substrate. In the resin layer, multiple grooves formed concave towards the substrate are provided on the surface opposite to the surface opposite to the substrate. A conductive material such as copper or a copper alloy constituting the aforementioned wiring portions is embedded in each groove.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: WO2020 / 137178 Summary of the Invention

[0007] -The technical problem the invention aims to solve-

[0008] However, in the conductive component as described in Patent Document 1, increasing the line width of each wiring section is effective in reducing the resistance of each wiring section. That is, if the line width of each wiring section is made larger, the cross-sectional area of ​​the conductive material embedded in each groove increases. As a result, the resistance of each wiring section is suppressed. However, when the line width of each wiring section is increased, there is a problem that the wiring sections constituting the conductive component are easily visually identifiable when viewed from above.

[0009] Furthermore, as another common method for reducing the resistance of each wiring section, it is also effective to make the cross-sectional depth of each groove relatively large. That is, by setting the aspect ratio of each groove in the cross-section to increase the depth of each groove, the cross-sectional area of ​​the conductive material embedded in each groove is increased. As a result, the resistance of each wiring section is suppressed, and the line width of each wiring section can also be made thinner. However, in the conductive component of Patent Document 1, when the aspect ratio is set with emphasis on the depth of each groove as described above, the length of each wiring section in the thickness direction of the resin layer is increased. That is, the thickness of each wiring section is increased. As a result, in the design process when embedding conductive material in each groove within a single-layer resin layer, the optimal amount and embedding conditions of conductive material need to be carefully studied. In addition, in the manufacturing process when embedding conductive material in each groove within a single-layer resin layer, the management of the amount of conductive material embedded can easily become complicated.

[0010] This disclosure was made to solve the above-mentioned technical problems, and its purpose is to make the wiring section have a thinner line width and a lower resistance.

[0011] - Technical solutions used to solve technical problems -

[0012] To achieve the above objectives, a conductive component according to one embodiment of this disclosure includes a substrate, a first wiring portion, and a second wiring portion. The substrate has a first layer and a second layer stacked on the first layer. The first wiring portion is disposed on the first layer, and the second wiring portion is disposed on the second layer. A first groove is provided in the first layer. A second groove is provided in the second layer. The first wiring portion includes a first conductive layer made of conductive material embedded in the first groove. The second wiring portion includes a second conductive layer made of conductive material embedded in the second groove. In a contact area where the first wiring portion and the second wiring portion overlap and extend in parallel directions when viewed from above, the lower part of the second wiring portion includes a contact portion that contacts the upper part of the first wiring portion. Furthermore, the contact portion of the second wiring portion extends along the extending direction of the first wiring portion and the second wiring portion in the contact area.

[0013] -The effects of the invention-

[0014] According to this disclosure, the first wiring section and the second wiring section can be made thinner, and the resistance of the first wiring section and the second wiring section can be reduced. Attached Figure Description

[0015] Figure 1 This is a top view showing the overall conductive components involved in the embodiments of this disclosure.

[0016] Figure 2 It is shown in magnification Figure 1 A magnified top view of part II.

[0017] Figure 3 Is it only extracting Figure 2 The equivalent of the multiple first wiring sections shown Figure 2 The image.

[0018] Figure 4 Is it only extracting Figure 2 The equivalent of the multiple second wiring sections shown Figure 2 The image.

[0019] Figure 5 It is along Figure 2 A cross-sectional view taken along the V-V line.

[0020] Figure 6 It is shown in magnification Figure 5 A partially enlarged sectional view of section VI.

[0021] Figure 7 This is a simplified diagram showing the first and second wiring sections located in the contact area.

[0022] Figure 8 This is equivalent to the conductive component involved in the modified embodiment shown. Figure 2 The image. Detailed Implementation

[0023] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. The following description of the embodiments is merely illustrative in nature and is not intended to limit the scope of this disclosure, its application, or its uses.

[0024] Figure 1 The overall structure of the conductive component 1 according to an embodiment of the present disclosure is shown. In this embodiment, a conductive component 1 formed by an imprinting process is illustrated.

[0025] It should be noted that, in this embodiment, for ease of explanation, [the following will be used]. Figure 1 The direction from left to right on the paper is defined as the "X direction". On the other hand, Figure 1 The direction from the bottom to the top of the paper is defined as the "Y direction".

[0026] Additionally, in the following explanation, in Figure 5 In the thickness direction of the substrate 2 (described later), the side containing the film substrate 3 (described later) is defined as the "lower side" of the substrate 2, and the side containing the second layer 5 (described later) is defined as the "upper side" of the substrate 2. It should be noted that this positional relationship is independent of the actual orientation of the conductive component 1 or the product in which the conductive component 1 is applied.

[0027] (Conductive components)

[0028] like Figure 1 As shown, in top view, the conductive component 1 has multiple (four in the example) contact areas A and one non-mounting area B. Each contact area A is an area where a specified electronic component (not shown) can be mounted. The non-mounting area B is the area other than the contact areas A. Examples of such electronic components include LED elements and diodes. The multiple electronic components are arranged on the upper surface side of the substrate 2 (the upper surface side of the second layer 5, described later).

[0029] (Substrate)

[0030] like Figure 5 and Figure 6As shown, the conductive component 1 includes a substrate 2. The substrate 2 is transparent and light-transmitting. The thickness of the substrate 2 is, for example, 25 μm to 250 μm. The substrate 2 has a film substrate 3, a first layer 4, and a second layer 5.

[0031] (Membrane substrate)

[0032] The membrane substrate 3 is, for example, made of a flexible, i.e., transparent resin material. Preferably, the membrane substrate 3 has a light transmittance of 85% or more. The thickness of the membrane substrate 3 is, for example, 25 μm to 250 μm. It should be noted that the membrane substrate 3 may also be transparent.

[0033] Resin materials constituting the film substrate 3 include, for example, PET (polyethylene terephthalate), polycarbonate, COP (cyclic olefin polymer), and COC (cyclic olefin copolymer).

[0034] (First floor)

[0035] like Figure 5 and Figure 6 As shown, the first layer 4 is used to form the plurality of first wiring portions 10 described later. The first layer 4 is stacked on the upper side of the film substrate 3 (see reference). Figure 5 ).

[0036] The first layer 4 is made of a resin material that is both insulating and transparent. Examples of resin materials constituting the first layer 4 include thermosetting resins and UV-curable resins. The thickness of the first layer 4 is, for example, set to be 1.8 μm or more and 5.2 μm or less. Furthermore, the thickness of the first layer 4 is greater than the depth of the first groove 6, which will be described later.

[0037] A plurality of first grooves 6 are provided in the first layer 4. The first grooves 6 are recessed from the upper surface of the first layer 4 downward. The spacing between the side portions 6a, 6a in the first grooves 6 gradually increases as they approach the opening side (the upper surface side of the first layer 4) from the lower portion 6b side.

[0038] The width W1 of the first groove 6 is set to be 0.3 μm or more and 30.0 μm or less. The groove depth D1 of the first groove 6 is, for example, set to be 0.5 μm or more and 2.5 μm or less.

[0039] The angle between the side portion 6a and the lower portion 6b of the first groove portion 6 is set as a first angle θ1. The first angle θ1 is, for example, 116°.

[0040] (Second layer)

[0041] like Figure 5 and Figure 6As shown, the second layer 5 is used to form the second wiring portion 20, which will be described later. The second layer 5 is stacked on the first layer 4. That is, the second layer 5 is arranged in the thickness direction of the substrate 2 at a position corresponding to the upper side (surface side) of the substrate 2. In addition, in the contact area A, the upper surface (front side) of the second layer 5 is a surface on which the aforementioned electronic components can be disposed.

[0042] The second layer 5, like the first layer 4, is made of a resin material that is both insulating and translucent. To ensure flexibility, the thickness of the second layer 5 is set, for example, to be 0.5 μm to 3.2 μm.

[0043] A plurality of second grooves 7 are provided in the second layer 5. Each second groove 7 is formed in a recessed shape from the upper surface of the second layer 5 downward. The spacing between the side portions 7a, 7a in the second groove 7 gradually increases as it approaches the opening side (the upper surface side of the second layer 5) from the lower portion 7b side. In addition, the second groove 7 bends downward as it approaches the center of the width direction of the lower portion 7b (approximately the center of the X direction of the lower portion 7b) from the lower side portion of the side portion 7a.

[0044] In this embodiment, the groove width W2 of the second groove 7 is greater than the groove width W1 of the first groove 6. Specifically, the groove width W2 is set to, for example, 1.1 μm or more and 34.0 μm or less.

[0045] In this embodiment, the groove depth D2 of the second groove 7 is greater than the groove depth D1 of the first groove 6. Specifically, the groove depth D2 is set to, for example, 0.3 μm or more and 2.3 μm or less. It should be noted that the relationship between the groove depths D1 and D2 is not limited to the relationship exemplified in this embodiment. For example, the groove depth D2 may be equal to the groove depth D1, which is not shown in the figure. Alternatively, the groove depth D2 may be smaller than the groove depth D1.

[0046] The angle formed by the side portion 7a and the lower portion 7b of the second groove 7 is set as a second angle θ2. In this embodiment, the second angle θ2 is greater than the first angle θ1. The second angle θ2 is, for example, 135°.

[0047] like Figure 6 As shown, in the second groove 7 located in the contact area A, the portion corresponding to the connecting portion Cp described later penetrates the second layer 5 in the thickness direction of the substrate 2. Furthermore, in the second groove 7 located in the contact area A, the lower portion 7b is partially recessed into the side of the first layer 4.

[0048] Here, as Figure 6As illustrated, when the upper surface of the first wiring portion 10 is recessed, the lower surface of the second layer 5 bulges along the upper surface of the first wiring portion 10. It should be noted that the interface between the first layer 4 and the second layer 5 may have irregularities (not shown).

[0049] (First Cabling Department)

[0050] like Figure 2 and Figure 3 As shown, the conductive component 1 includes a plurality of first wiring portions 10. It should be noted that, in Figure 2 In the illustration, the overlapping portions of each first wiring portion 10 and each second wiring portion 20 (described later) located in the contact area A are shown by "thick lines".

[0051] Viewed from above, the plurality of first wiring portions 10 extend in a straight line along the Y direction. Each first wiring portion 10 is thinned. The linewidth of each first wiring portion 10 is, for example, 4.0 μm.

[0052] In this embodiment, the plurality of first wiring portions 10 are divided into two groups Gp1 and Gp2 (see reference). Figure 3 ).

[0053] When viewed from above, the multiple first wiring sections 10 belonging to group Gp1 are arranged to enter from the non-installation area B toward the contact area A.

[0054] When viewed from above, the plurality of first wiring portions 10 belonging to group Gp2 are arranged only in the non-installation area B. That is, when viewed from above, the plurality of first wiring portions 10 belonging to group Gp2 are arranged so as not to enter from the non-installation area B toward the contact area A.

[0055] like Figure 5 As shown, each first wiring section 10 is disposed on the first layer 4. Figure 6 As shown, each first wiring section 10 includes a first tight-fitting layer 11, a first conductive layer 12, and a first blackening layer 13.

[0056] The first sealing layer 11 is an element used to ensure the tightness of the first conductive layer 12 relative to the first trench 6. The first sealing layer 11 has low reflectivity. That is, the first sealing layer 11 has a low reflectivity on the side where the first layer 4 is located ( Figure 6 The function of making the first conductive layer 12 less visually identifiable when observing the conductive component 1 from the underside of the paper.

[0057] The first close-bonding layer 11 is, for example, a metal layer comprising a metal nitride, a metal oxide, or a metal nitride comprising both metal nitride and metal oxide, which includes at least one metal selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Cu, and Zn. It should be noted that the first close-bonding layer 11 can be a single layer or a stack of multiple layers with different compositions.

[0058] The first bonding layer 11 is formed in the first groove portion 6. Specifically, the first bonding layer 11 is deposited in thin film form on the side portion 6a and the lower portion 6b of the first groove portion 6 by vapor deposition, sputtering or the like.

[0059] The first conductive layer 12 is an element used to ensure the conductivity of the first wiring portion 10. The first conductive layer 12 is stacked on the first tight-fitting layer 11. In this embodiment, in cross-section, the upper surface of the first conductive layer 12 is formed to be recessed downward from a position corresponding to the upper surface of the first layer 4. It should be noted that the upper surface of the first conductive layer 12 may also be flush with the upper surface of the first layer 4, which is not shown. Alternatively, the upper surface of the first conductive layer 12 may be located slightly above the upper surface of the first layer 4.

[0060] The first conductive layer 12 is embedded in the first trench 6 and is made of a conductive material. The conductive material is, for example, a conductive metal. For example, copper, silver, gold, or an alloy containing at least one of these metals is suitable as the conductive metal. The first conductive layer 12 is formed, for example, by vapor deposition, sputtering, electroless plating, or electroplating.

[0061] The first blackening layer 13 has the function of making the first conductive layer 12 less visually identifiable when the conductive component 1 is viewed from the first layer 4 side. The first blackening layer 13 is located on the upper part of the first wiring portion 10. Specifically, the first blackening layer 13 is stacked on the upper side of the first conductive layer 12 (on the opening side of the first groove portion 6).

[0062] The first blackening layer 13 is formed by replacing copper grains on the front side of the first conductive layer 12 with palladium (which undergoes a blackening treatment), with the replaced copper grains located at the boundaries between the copper grains. The thickness of the first blackening layer 13 is, for example, 10 nm or more and 500 nm or less.

[0063] (Second Cabling Department)

[0064] like Figure 2 and Figure 4 As shown, the conductive component 1 includes a plurality of second wiring portions 20.

[0065] Each second wiring section 20 is directly connected to an electronic component (not shown) arranged in contact area A. Each second wiring section 20 is thinned. The width W2 of the second wiring section 20 is greater than the width W1 of the first wiring section 10 (see reference). Figure 5 The line width W2 of each second wiring section 20 is, for example, 5.0 μm.

[0066] In this embodiment, the plurality of second wiring sections 20 are divided into two groups Gp3 and Gp4 (see reference). Figure 4 ).

[0067] When viewed from above, the multiple second wiring sections 20 belonging to group Gp3 are arranged to enter from the non-installation area B toward the contact area A.

[0068] Each of the second wiring portions 20 belonging to the above group Gp3 is composed of a first extension portion 20a, a second extension portion 20b, and a third extension portion 20c.

[0069] Viewed from above, the first extension 20a is arranged in the non-installation area B. The first extension 20a does not overlap with the adjacent first wiring portion 10 in the X direction. Specifically, the first extension 20a is arranged spaced apart from the adjacent first wiring portion 10 in the X direction (see reference). Figure 2 The first extension 20a extends in a straight line along the Y direction.

[0070] Viewed from above, the second extension 20b is arranged in the non-installation area B. The second extension 20b is located in the non-installation area B and near the boundary between the non-installation area B and the contact area A. The second extension 20b extends in a direction inclined relative to the X and Y directions. The second extension 20b is configured to connect the first extension 20a and the third extension 20c.

[0071] Viewed from above, the third extension 20c is arranged in the contact area A. Viewed from above, the third extension 20c overlaps with the first wiring portion 10 located in the contact area A. The third extension 20c extends in a straight line along the Y direction.

[0072] When viewed from above, the plurality of second wiring portions 20 belonging to group Gp4 are arranged only in the non-installation area B. That is, when viewed from above, the plurality of second wiring portions 20 belonging to group Gp4 are arranged so as not to enter from the non-installation area B toward the contact area A. In addition, when viewed from above, the plurality of second wiring portions 20 belonging to group Gp4 extend in a straight line along the Y direction.

[0073] like Figure 5 As shown, each second wiring section 20 is located on the second layer 5. Figure 6 As shown, each second wiring section 20 includes a second tight-fitting layer 21, a second conductive layer 22, and a second blackening layer 23.

[0074] The second sealing layer 21 is an element used to ensure the tightness of the second conductive layer 22 relative to the second trench 7. The second sealing layer 21 has low reflectivity. That is, the second sealing layer 21 has a low reflectivity on the side where the first layer 4 is located ( Figure 6 The function of making the second conductive layer 22 less visually identifiable when observing the conductive component 1 from the underside of the paper.

[0075] The second close-bonding layer 21 is, for example, a metal layer comprising a metal nitride, a metal oxide, or a metal nitride comprising both metal nitride and metal oxide, which includes at least one metal selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Cu, and Zn. It should be noted that the second close-bonding layer 21 can be a single layer or a stack of multiple layers with different compositions.

[0076] The second bonding layer 21 is formed in the second groove portion 7. Specifically, the second bonding layer 21 is deposited in thin film form on the side portion 7a and the bottom portion 7b of the second groove portion 7 by vapor deposition, sputtering or the like.

[0077] The second conductive layer 22 is an element used to ensure the conductivity of the second wiring portion 20. The second conductive layer 22 is stacked on the second tight-fitting layer 21. In this embodiment, in cross-section, the upper surface of the second conductive layer 22 is formed to be recessed downward from a position corresponding to the upper surface of the second layer 5. It should be noted that the upper surface of the second conductive layer 22 may also be formed flush with the upper surface of the second layer 5, which is not shown in the figure.

[0078] The second conductive layer 22 is embedded in the second trench 7 and is made of a conductive material. The conductive material is, for example, a conductive metal. For example, copper, silver, gold, or an alloy containing at least one of these metals is suitable as the conductive metal. The second conductive layer 22 is formed, for example, by vapor deposition, sputtering, electroless plating, or electroplating.

[0079] The second blackening layer 23 has the function of making the second conductive layer 22 less visually identifiable when the conductive component 1 is viewed from the second layer 5 side. The second blackening layer 23 is located on the upper part of the second wiring portion 20. Specifically, the second blackening layer 23 is stacked on the upper side of the second conductive layer 22 (on the opening side of the second groove portion 7).

[0080] The second blackening layer 23 is formed by replacing the copper grains on the front side of the second conductive layer 22 with palladium (which has undergone blackening treatment), with the replaced copper grains located at the boundaries between the copper grains. The thickness of the second blackening layer 23 is, for example, 10 nm or more and 500 nm or less.

[0081] (Characteristic structure)

[0082] In contact area A, when viewed from above, the first wiring portion 10 and the third extension 20c of the second wiring portion 20 overlap and extend in a parallel direction (see reference). Figure 2 ).

[0083] In addition, such as Figure 6 As shown, in contact area A, the lower part of the third extension 20c in the second wiring section 20 includes a contact portion Cp that contacts the upper part of the first wiring section 10 (see reference). Figure 6 and Figure 7 Specifically, in contact area A, the lower part (contact portion Cp) of the second wiring portion 20 contacts the first blackening layer 13. It should be noted that the lower part (contact portion Cp) of the aforementioned second wiring portion 20 (third extension 20c) is equivalent to... Figure 6 The lower portion of the second tight-fitting layer 21 and the second conductive layer 22 shown.

[0084] Furthermore, as a characteristic structure of the embodiments disclosed herein, the contact portion Cp of the second wiring section 20 (refer to...) Figure 6 and Figure 7 It extends along the extension direction (Y direction in the example figure) of the first wiring portion 10 and the second wiring portion 20 in the contact area A.

[0085] [Effects of the Implementation Method]

[0086] As described above, in contact area A, when viewed from above, the first wiring portion 10 and the second wiring portion 20 (third extension 20c) overlap and extend in a parallel direction. In contact area A, the lower part of the second wiring portion 20 (third extension 20c) includes a contact portion Cp that contacts the upper part of the first wiring portion 10. Through this contact portion Cp, the first wiring portion 10 and the second wiring portion 20 (third extension 20c) become integrated. In this state, the first groove 6 and the second groove 7 have an aspect ratio equal to the sum of the depths of the first groove 6 and the second groove 7 when viewed in cross-section. Therefore, the sum of the cross-sectional area of ​​the conductive material embedded in the first groove 6 (the cross-sectional area of ​​the first conductive layer 12) and the cross-sectional area of ​​the conductive material embedded in the second groove 7 (the cross-sectional area of ​​the second conductive layer 22) appears to increase. In other words, the cross-sectional areas of the first wiring portion 10 and the second wiring portion 20 substantially increase.

[0087] Furthermore, the contact portion Cp of the second wiring portion 20 extends along the extending direction of the first wiring portion 10 and the second wiring portion 20 in the contact region A. According to this structure, the integrity of the first wiring portion 10 and the second wiring portion 20 is ensured in the contact region A. That is, in the contact region A, the cross-sectional area of ​​the first wiring portion 10 and the second wiring portion 20 is substantially increased. Therefore, in the contact region A, based on the general relationship between resistance and cross-sectional area (based on the general formula that the resistance of a conductor is inversely proportional to the cross-sectional area of ​​that conductor), even without relying on increasing the line width, the resistance of the first wiring portion 10 and the second wiring portion 20 is reduced. Moreover, in the contact region A, the first wiring portion 10 and the second wiring portion 20 can be made thinner. As a result, multiple first wiring portions 10 and multiple second wiring portions 20 can be efficiently arranged when viewed from above.

[0088] Therefore, in the conductive component 1 according to the embodiments of this disclosure, the first wiring portion 10 and the second wiring portion 20 can be made thinner, and the resistance of the first wiring portion 10 and the second wiring portion 20 can be reduced.

[0089] Furthermore, in the conductive component 1 disclosed herein, the amount of conductive material embedded in the first groove 6 and the amount of conductive material embedded in the second groove 7 can be managed separately in terms of design and manufacturing. Therefore, problems arising from prior art, such as those based on Patent Document 1, are unlikely to occur. It should be noted that, as mentioned above, problems based on prior art include issues with the design process for embedding conductive material in each groove (the need for meticulous study of the optimal amount and conditions of the conductive material) and problems with the manufacturing process (the tendency for management of the amount of conductive material embedded to become complex).

[0090] Furthermore, in this embodiment, the width W2 of the second wiring portion 20 when viewed from above is greater than the width W1 of the first wiring portion 10. Consequently, the cross-sectional area of ​​the second conductive layer 22 constituting the second wiring portion 20 is greater than the cross-sectional area of ​​the first conductive layer 12 constituting the first wiring portion 10. As a result, based on the general relationship between resistance and cross-sectional area, the wiring resistance of the second wiring portion 20 can be relatively suppressed. Therefore, the stability of the electrical connection between the electronic component (not shown) arranged in the contact area A and the second wiring portion 20 directly connected to that electronic component can be ensured.

[0091] Furthermore, the second angle θ2 is greater than the first angle θ1. According to this structure, the cross-sectional area of ​​the second conductive layer 22 constituting the second wiring portion 20 is greater than the cross-sectional area of ​​the first conductive layer 12 constituting the first wiring portion 10. As a result, based on the general relationship between resistance and cross-sectional area, the wiring resistance of the second wiring portion 20 can be relatively suppressed. Therefore, the stability of the electrical connection between the electronic component (not shown) arranged in the contact area A and the second wiring portion 20 directly connected to that electronic component can be ensured.

[0092] Furthermore, the first wiring portion 10 also has a first blackening layer 13 stacked on the first conductive layer 12. This first blackening layer 13 provides rust protection for the first conductive layer 12. Additionally, in the contact area A, the contact portion Cp of the second wiring portion 20 contacts the first blackening layer 13. Thus, the lower part of the second wiring portion 20 and the first blackening layer 13 are firmly bonded to each other through a so-called anchoring effect. As a result, the connection stability between the first wiring portion 10 and the second wiring portion 20 is improved. Therefore, in the contact area A, the first wiring portion 10 and the second wiring portion 20 can be ensured to be integrated.

[0093] Furthermore, the second wiring section 20 also has a second blackening layer 23 stacked on the second conductive layer 22. Through this second blackening layer 23, when the conductive component 1 is viewed from the side where the second layer 5 is located, it is difficult to visually identify the second conductive layer 22 constituting each second wiring section 20. In other words, so-called "line visibility" of each second wiring section 20 is prevented. Therefore, the appearance of the conductive component 1 becomes better.

[0094] Furthermore, in the non-installation area B where no electronic components are installed, when viewed from above, the plurality of first wiring portions 10 (the plurality of first wirings) and the plurality of second wiring portions 20 (the plurality of second wirings) do not overlap with each other. Therefore, compared to the non-installation area B, the integration of the first wiring portions 10 and the second wiring portions 20 in the contact area A becomes more pronounced. In other words, in the contact area A, compared to the non-installation area B, the resistance of the first wiring portions 10 and the second wiring portions 20 can be reduced.

[0095] [Modifications of the Implementation Method]

[0096] like Figure 8 As shown in the modified example, multiple pseudo-wire portions 30 can also be arranged in the contact area A. Each pseudo-wire portion 30 is made of conductive material embedded in each pseudo-groove (not shown) formed in the second layer 5.

[0097] Viewed from above, the plurality of dummy wiring portions 30 do not overlap with the plurality of first wiring portions 10 and the plurality of second wiring portions 20. Specifically, viewed from above, the plurality of dummy wiring portions 30 are arranged at intervals from the plurality of first wiring portions 10 and the plurality of second wiring portions 20 located in contact area A. In this modified example, the interval in the X direction between the second wiring portion 20 (first wiring portion 10) and the dummy wiring portion 30 located in contact area A is equal to the interval in the X direction between the first wiring portion 10 and the second wiring portion 20 located in non-installation area B.

[0098] according to Figure 8 In the modified example shown, when viewed from above, the appearance of the plurality of second wiring portions 20 and the plurality of pseudo wiring portions 30 located in the contact area A is not easily different from that of the plurality of first wiring portions 10 and the plurality of second wiring portions 20 located in the non-installation area B. In other words, when viewed from above, the appearance of the contact area A and the non-installation area B is uniform. As a result, the aesthetics of the conductive component 1 when viewed from above can be optimized.

[0099] [Other Implementation Methods]

[0100] In the above embodiment, a method is shown in which a plurality of first wiring portions 10 are provided in the first layer 4, but the embodiment is not limited to this method. That is, it is sufficient to provide at least one first wiring portion 10 in the first layer 4.

[0101] In the above embodiment, a method is shown in which multiple second wiring portions 20 are provided in the second layer 5, but the embodiment is not limited to this method. That is, it is sufficient to provide at least one second wiring portion 20 in the second layer 5.

[0102] In the above embodiment, it is shown that the width W2 of the second wiring portion 20 is greater than the width W1 of the first wiring portion 10, but it is not limited to this method. For example, the width W2 of the second wiring portion 20 may also be the same as the width W1 of the first wiring portion 10.

[0103] In the above embodiment, a method in which the second angle θ2 is greater than the first angle θ1 is shown, but the embodiment is not limited to this method. For example, the second angle θ2 can also be an angle equal to the first angle θ1.

[0104] In the above embodiment, a plurality of first wiring portions 10 belonging to group Gp2 and a plurality of second wiring portions 20 belonging to group Gp4 are exemplified, but the plurality of first wiring portions 10 belonging to group Gp2 and the plurality of second wiring portions 20 belonging to group Gp4 may be omitted appropriately.

[0105] In the above embodiment, each first wiring portion 10 is shown to include a first blackening layer 13, but it is not limited to this embodiment. That is, each first wiring portion 10 may also not include a first blackening layer 13. It should be noted that when each first wiring portion 10 does not include a first blackening layer 13, the upper surface of the first conductive layer 12 is in contact with the lower part of the second wiring portion 20.

[0106] In the above embodiment, each second wiring portion 20 is shown to include a second blackening layer 23, but it is not limited to this embodiment. That is, each second wiring portion 20 may also not include a second blackening layer 23.

[0107] The above describes the implementation of this disclosure, but this disclosure is not limited to the above implementation, and various modifications can be made within the scope of this disclosure.

[0108] -Industry Applicability-

[0109] This disclosure can be used industrially as a conductive component.

[0110] - Symbol Explanation -

[0111] 1: Conductive components

[0112] 2: Substrate

[0113] 3: Membrane substrate

[0114] 4: First floor

[0115] 5: Second layer

[0116] 6: First trench section

[0117] 7: Second groove section

[0118] 10: First Cabling Department

[0119] 11: First Close-knit Layer

[0120] 12: First conductive layer

[0121] 13: First Blackening Layer

[0122] 20: Second Wiring Department

[0123] 20a: First extension

[0124] 20b: Second extension

[0125] 20c: Third extension

[0126] 21: Second close-knit layer

[0127] 22: Second conductive layer

[0128] 23: Second Blackening Layer

[0129] 30: Pseudo-wiring department

[0130] A: Contact area

[0131] B: Non-installation area

[0132] θ1: First angle

[0133] θ2: Second angle

[0134] Cp: ​​Contact portion

Claims

1. A conductive component, characterized in that: The conductive component includes a substrate, a first wiring portion, and a second wiring portion. The substrate has a first layer and a second layer stacked on top of the first layer. The first wiring section is located on the first layer. The second wiring section is located on the second layer. A first groove is provided in the first layer. A second groove is provided in the second layer. The first wiring portion includes a first conductive layer made of conductive material embedded in the first groove portion. The second wiring portion includes a second conductive layer made of conductive material embedded in the second groove portion. In the contact area where the first wiring portion and the second wiring portion overlap and extend in parallel directions when viewed from above, the lower part of the second wiring portion includes a contact portion that contacts the upper part of the first wiring portion. The contact portion of the second wiring portion extends along the extension direction of the first wiring portion and the second wiring portion in the contact area.

2. The conductive component according to claim 1, characterized in that: When viewed from above, the width of the second wiring section is greater than the width of the first wiring section.

3. The conductive component according to claim 1, characterized in that: When the angle between the lower part and the side part of the first groove is defined as the first angle, and the angle between the lower part and the side part of the second groove is defined as the second angle,... The second angle is greater than the first angle.

4. The conductive component according to claim 1, characterized in that: The first wiring portion further comprises a first blackening layer stacked on the first conductive layer. The first blackening layer is located on the upper part of the first wiring portion. In the contact area, the contact portion of the second wiring portion contacts the first blackening layer.

5. The conductive component according to claim 1, characterized in that: The second wiring portion further includes a second blackening layer stacked on top of the second conductive layer.

6. The conductive component according to claim 1, characterized in that: The conductive component further includes multiple first wirings and multiple second wirings. The plurality of first wirings are respectively the first wiring section. The plurality of second wirings are respectively the second wiring sections. In the non-installation area where no electronic components are installed, when viewed from above, the plurality of first wirings and the plurality of second wirings do not overlap with each other.

7. The conductive component according to claim 6, characterized in that: The conductive component also includes a pseudo-wiring section. When viewed from above, the pseudo wiring portion does not overlap with the plurality of first wirings and the plurality of second wirings.

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