Silicon nitride vacuum carrier plate curved surface polishing device and polishing method

Abstract

The invention discloses a silicon nitride vacuum carrier plate curved surface polishing device and a polishing method, and aims to provide a silicon nitride vacuum carrier plate curved surface polishing device which can improve the polishing efficiency of a silicon nitride vacuum carrier plate curved surface and reduce the labor intensity. The polishing effect of the curved surface of the silicon nitride vacuum carrier plate can be improved, and the rework rate is effectively reduced. The curved surface polishing device for the silicon nitride vacuum carrier disc comprises a shell, a polishing head and a polishing head, the elastic pressing assembly comprises a floating part slidably arranged on the shell in the vertical direction and an elastic element for driving the floating part to move downwards; and the polishing resin block is detachably fixed on the downward bottom surface of the floating part, the side surface facing the polishing resin block is a polishing curved surface, and the polishing curved surface is matched with the curved surface of the silicon nitride vacuum carrier plate.

Description

Technical Field

[0001] This invention relates to the field of wafer carrier disk processing technology, specifically to a silicon nitride vacuum carrier disk curved surface polishing device and polishing method. Background Technology

[0002] Silicon nitride vacuum carriers are primarily used in bonding equipment for wafer positioning, support, and heat conduction control. They can operate stably at temperatures up to 1200℃, making them suitable for the high-temperature environments of bonding processes. They ensure the carriers do not deform during thermal cycling and possess excellent high-temperature resistance, wear resistance, corrosion resistance, and high thermal conductivity. For example, Chinese Patent Publication No. CN206385256U describes an invention entitled "Durable Wafer Carrier." With the increasing demand for 3D integration and heterogeneous bonding, designing the back side (i.e., the support surface) of the vacuum carrier as a vacuum-shaped curved surface can better enhance wafer fixation stability and heat conduction. The surface finish and contour accuracy of the silicon nitride vacuum carrier surface are crucial, affecting the bonding quality.

[0003] Currently, the surface curvature requirements for silicon nitride vacuum carrier disks are a contour accuracy of 0.1 and a surface finish of Ra 0.4. Silicon nitride material has high hardness and bending strength, but narrow surface features, leading to severe tool wear during machining, poor surface finish, and high polishing difficulty and requirements. Currently, polishing such curved surfaces generally employs manual felt polishing, which is labor-intensive, time-consuming, produces poor polishing results, and has a high rework rate. Therefore, there is an urgent need to design and develop a polishing device and method for irregular curved surfaces of silicon nitride vacuum carrier disks to address the aforementioned problems associated with mirror polishing of curved surfaces. Summary of the Invention

[0004] The purpose of this invention is to provide a silicon nitride vacuum carrier disk surface polishing device and polishing method that can not only improve the polishing efficiency of silicon nitride vacuum carrier disk curved surfaces and reduce labor intensity, but also improve the polishing effect of silicon nitride vacuum carrier disk curved surfaces and effectively reduce rework rate.

[0005] The technical solution of this invention is: A silicon nitride vacuum disk surface polishing apparatus includes: The housing has a mounting section on it; The elastic clamping assembly includes a floating component that slides vertically on the housing and an elastic element that drives the floating component to move downward. The polishing resin block is detachably fixed to the downward-facing bottom surface of the floating component. The side of the polishing resin block facing upwards is a polishing curved surface, which is adapted to the curved surface of the silicon nitride vacuum carrier disk. The specific use of the silicon nitride vacuum carrier disk curved surface polishing device in this solution is as follows. First, fix the silicon nitride vacuum carrier disk on the surface of the rotary table of the vertical machining center, with the curved surface of the silicon nitride vacuum carrier disk facing upwards. The silicon nitride vacuum carrier disk curved surface polishing device is fixed on the spindle of the vertical machining center through the mounting part. The polishing resin block is located above the silicon nitride vacuum carrier disk, and the polishing curved surface faces the curved surface of the silicon nitride vacuum carrier disk.

[0006] Second, rough polishing: The spindle lowers the silicon nitride vacuum carrier disk surface polishing device to a designated position, causing the polishing surface of the polishing resin block to press against the surface of the silicon nitride vacuum carrier disk under the elastic force applied by the elastic element. Then, the turntable rotates the silicon nitride vacuum carrier disk to perform rough polishing on the surface of the silicon nitride vacuum carrier disk. At the same time, polishing fluid is added to the surface of the vacuum carrier disk during the rough polishing process.

[0007] Third, fine polishing: The spindle drives the silicon nitride vacuum disk surface polishing device to move upwards and reset; then, the polishing resin block in the silicon nitride vacuum disk surface polishing device is removed, and a polishing resin block with a larger mesh size is installed; next, the spindle drives the silicon nitride vacuum disk surface polishing device to descend to the designated position, and then the turntable drives the silicon nitride vacuum disk to rotate, performing fine polishing on the surface of the silicon nitride vacuum disk. Simultaneously, polishing fluid is added to the surface of the vacuum disk during the rough polishing process. Compared with the existing technology that uses manual felt polishing to polish the surface of silicon nitride vacuum disks, the silicon nitride vacuum disk surface polishing device in this solution can be combined with a vertical machining center to automatically polish the surface of the silicon nitride vacuum disk, thereby effectively improving the polishing efficiency of the silicon nitride vacuum disk surface and reducing labor intensity; moreover, it can improve the polishing effect of the silicon nitride vacuum disk surface and effectively reduce the rework rate.

[0008] On the other hand, the elastic clamping assembly of this solution utilizes the elastic force applied by the elastic element to make the polishing surface tightly adhere to the curved surface of the silicon nitride vacuum carrier disk. In this way, the polishing surface of the polishing resin block can adaptively adjust according to its position when it contacts the curved surface of the silicon nitride vacuum carrier disk, making the polishing surface tightly adhere to the polishing surface, thereby improving the polishing effect. Furthermore, the pressure of the polishing resin block acting on the curved surface of the silicon nitride vacuum carrier disk can be conveniently and accurately controlled by the spindle lifting stroke, avoiding excessive pressure that may cause excessive wear or even deformation of the curved surface of the silicon nitride vacuum carrier disk, and avoiding insufficient pressure that may affect the polishing quality, thereby improving the polishing mirror finish.

[0009] Preferably, a pressure detection unit is also included, comprising a pressure sensor disposed between the elastic element and the housing or between the elastic element and the floating component, to detect the pressure on the elastic element. Thus, the pressure on the elastic element can be detected by the pressure sensor, thereby detecting the pressure exerted by the polishing resin block on the curved surface of the silicon nitride vacuum carrier disk, allowing for convenient and accurate control of the pressure exerted by the polishing resin block on the curved surface of the silicon nitride vacuum carrier disk. More importantly, during the polishing process of the curved surface of the silicon nitride vacuum carrier disk, the product surface heats up rapidly as the polishing process progresses, causing thermal expansion and deformation of the curved surface of the silicon nitride vacuum carrier disk. The polishing resin block also heats up and undergoes thermal expansion and deformation. This means that although the height of the spindle of the vertical machining center and the height of the polishing resin block remain unchanged during polishing, the pressure exerted by the polishing resin block on the curved surface of the silicon nitride vacuum carrier disk increases (changes), causing excessive wear on the curved surface of the silicon nitride vacuum carrier disk. Especially during fine polishing, the increased pressure exerted by the polishing resin block on the curved surface of the silicon nitride vacuum carrier disk can easily lead to over-polishing, affecting the dimensional accuracy of the product. In this solution, a pressure sensor can be used to detect the pressure of the polishing resin block on the curved surface of the silicon nitride vacuum carrier disk in real time. As the polishing process progresses, when the pressure of the polishing resin block on the curved surface of the silicon nitride vacuum carrier disk exceeds the set range, the spindle can drive the polishing resin block to move upward to reduce the pressure of the polishing resin block on the curved surface of the silicon nitride vacuum carrier disk, thus controlling the pressure of the polishing resin block on the curved surface of the silicon nitride vacuum carrier disk within the set range, thereby further improving the polishing quality, especially the polishing quality of fine polishing.

[0010] Preferably, the floating component includes: The floating block slides vertically onto the shell. The mounting plate is slidably connected to the bottom of the floating block in a horizontal direction, and the polishing resin block is detachably fixed to the bottom surface of the mounting plate facing downwards. The adjustment assembly includes an adjustment spring and an adjustment bolt. An adjustment block with a bolt through hole is mounted on the mounting plate. An adjustment screw hole is located on the side of the floating block. The adjustment bolt passes through the bolt through hole and connects to the adjustment screw hole. The sliding direction of the adjustment bolt is parallel to that of the mounting plate, and the bolt head rests against the floating block via the adjustment spring. Thus, the horizontal position of the polishing resin block can be adjusted using the adjustment bolt, aligning the polished surface of the polishing resin block with the curved surface of the silicon nitride vacuum carrier disk.

[0011] Preferably, the floating component includes: The floating block slides vertically onto the shell. The mounting plate is fixed to the bottom of the floating block, and the polishing resin block is detachably fixed to the bottom surface of the mounting plate facing downwards.

[0012] Preferably, the housing is provided with a limiting part, the elastic element is a compression spring, the elastic element is located above the floating part, the elastic element abuts between the housing and the floating part, and the floating part abuts against the limiting part under the action of the elastic element.

[0013] Preferably, a groove is provided on the polishing surface. The groove extends radially along the silicon nitride vacuum carrier and penetrates the polishing surface. The groove includes two sidewalls, one end of which has an outwardly extending flow guide baffle, the free end of which is inclined towards the other sidewall of the groove. As the polishing process progresses, the polishing resin block heats up and undergoes thermal expansion and deformation, causing changes (increases) in the pressure exerted by the polishing resin block on the silicon nitride vacuum carrier surface, affecting the polishing quality. To improve this problem, this solution provides a groove on the polishing surface. This allows for heat dissipation through the groove, reducing the temperature of the polishing resin block and minimizing thermal expansion and deformation. More importantly, when polishing fluid is added to the vacuum carrier surface during polishing, the flow guide baffle, as the silicon nitride vacuum carrier rotates, can guide a portion of the polishing fluid from the vacuum carrier surface into the groove, thereby using the polishing fluid to further reduce the temperature of the polishing resin block and minimize thermal expansion and deformation.

[0014] Preferably, the width of the partition gradually increases from top to bottom.

[0015] Preferably, the polishing resin block is bonded and fixed to the bottom surface of the floating component facing downwards, or the polishing resin block is fixed to the bottom surface of the floating component facing downwards by bolts, rivets or clips.

[0016] A method for polishing curved surfaces of a silicon nitride vacuum carrier disk includes the following steps in sequence. The silicon nitride vacuum carrier disk is fixed on the surface of the rotary table of the vertical machining center; The silicon nitride vacuum carrier disk curved surface polishing device is fixed on the spindle of the vertical machining center, with the polishing surface of the polishing resin block facing the curved surface of the silicon nitride vacuum carrier disk. Rough polishing: The spindle drives the silicon nitride vacuum disk surface polishing device to descend to the designated position; then, the turntable drives the silicon nitride vacuum disk to rotate, performing rough polishing on the curved surface of the silicon nitride vacuum disk. The process begins with fine polishing, followed by replacing the polishing resin block with one of a larger mesh size. Next, the spindle lowers the silicon nitride vacuum disc surface polishing device to a designated position. Then, the turntable rotates the silicon nitride vacuum disc, performing fine polishing on its curved surface. This silicon nitride vacuum disc surface polishing method combines a silicon nitride vacuum disc surface polishing device with a vertical machining center to achieve automated polishing of the silicon nitride vacuum disc surface. This effectively improves the polishing efficiency, reduces labor intensity, enhances the polishing effect, and lowers the rework rate.

[0017] As a preferred option, the specific process for rough polishing is as follows. In the first rough polishing, the spindle drives the silicon nitride vacuum carrier disk surface polishing device to descend to the zero point position, at which point the polishing surface just contacts the silicon nitride vacuum carrier disk surface; then, the turntable drives the silicon nitride vacuum carrier disk to rotate, and polishes the silicon nitride vacuum carrier disk surface once. Secondary rough polishing: The spindle drives the silicon nitride vacuum disk curved surface polishing device to descend a set distance L1. Then, the turntable drives the silicon nitride vacuum disk to rotate, and performs secondary polishing on the curved surface of the silicon nitride vacuum disk. After three rough polishing processes, the spindle drives the silicon nitride vacuum carrier disk surface polishing device to descend a set distance L2. Then, the turntable drives the silicon nitride vacuum carrier disk to rotate, performing three polishing processes on the curved surface of the silicon nitride vacuum carrier disk.

[0018] Due to the high hardness of silicon nitride, the curved surface of the silicon nitride vacuum carrier disk has poor tool marks during processing and forming. It is often difficult to reliably remove the tool marks on the curved surface of the vacuum carrier disk by a single rough polishing. Therefore, this solution uses three rough polishing processes to gradually increase the pressure of the polishing resin block on the curved surface of the silicon nitride vacuum carrier disk during the rough polishing process. This reliably removes the tool marks on the curved surface of the vacuum carrier disk, lays a good foundation for fine polishing, and improves the polishing quality.

[0019] The beneficial effects of this invention are: Firstly, the silicon nitride vacuum carrier disk curved surface polishing device can be combined with existing vertical machining center applications to automatically polish the curved surface of silicon nitride vacuum carrier disks, thereby effectively improving the polishing efficiency of silicon nitride vacuum carrier disk curved surfaces, reducing labor intensity, improving the polishing effect of silicon nitride vacuum carrier disk curved surfaces, and reducing rework rate.

[0020] Secondly, by utilizing the elastic force applied by the elastic element, the polishing surface is made to fit tightly against the curved surface of the silicon nitride vacuum carrier disk. In this way, adaptive adjustment can be made according to the position when in contact with the curved surface of the silicon nitride vacuum carrier disk, so that the polishing surface fits tightly against the polishing surface, thereby improving the polishing effect. Furthermore, the pressure of the polishing resin block acting on the curved surface of the silicon nitride vacuum carrier disk can be accurately controlled by the spindle lifting stroke, thereby improving the polishing quality.

[0021] Third, by detecting the pressure on the elastic element through a pressure sensor, the pressure of the polishing resin block acting on the curved surface of the silicon nitride vacuum carrier disk can be detected, thereby conveniently and accurately controlling the pressure of the polishing resin block acting on the curved surface of the silicon nitride vacuum carrier disk. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural schematic diagram of a first embodiment of a silicon nitride vacuum disk curved surface polishing device of the present invention.

[0023] Figure 2This is a side view of a first embodiment of a silicon nitride vacuum disk curved surface polishing apparatus of the present invention.

[0024] Figure 3 This is a partial side view of a second embodiment of a silicon nitride vacuum disk curved surface polishing apparatus of the present invention.

[0025] Figure 4 This is a side view of a third embodiment of a silicon nitride vacuum disk curved surface polishing apparatus of the present invention.

[0026] Figure 5 This is a bottom view of the polishing resin block in a third embodiment of a silicon nitride vacuum disk curved surface polishing apparatus of the present invention.

[0027] In the picture: Housing 1, mounting part 1.1; Floating component 2, floating block 2.1, mounting plate 2.2, adjusting spring 2.3, adjusting bolt 2.4, adjusting block 2.5; Polishing resin block 3, polishing curved surface 3.1, partition groove 3.2, flow guide baffle 3.3; Silicon nitride vacuum carrier disk 4. Detailed Implementation

[0028] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Specific Implementation Example 1, such as Figure 1 , Figure 2 As shown, a silicon nitride vacuum disk curved surface polishing device includes a housing 1, an elastic clamping assembly, and a polishing resin block 3. The housing 1 is provided with a mounting part 1.1. The mounting part 1.1 is used to fix the housing 1 to the spindle of the vertical machining center. In this embodiment, the mounting part 1.1 is a mounting handle, which can be clamped onto the spindle of the vertical machining center. The specific installation method and structure of the mounting handle clamping in the spindle of the vertical machining center are prior art, and this structure is not the inventive point of this application. Therefore, this application will not elaborate on conventional technical means such as the specific installation method and structure of the mounting handle clamping in the spindle of the vertical machining center.

[0029] The elastic clamping assembly includes a floating component 2 that slides vertically on the housing 1 and an elastic element that drives the floating component 2 to move downward.

[0030] The polishing resin block 3 is detachably fixed to the downward-facing bottom surface of the floating component 2. The side facing upwards of the polishing resin block 3 is a polishing curved surface 3.1. This polishing curved surface 3.1 is adapted to the curved surface of the silicon nitride vacuum carrier disk 4.

[0031] The specific use of the silicon nitride vacuum disk curved surface polishing device in this embodiment is as follows. First, fix the silicon nitride vacuum carrier disk on the surface of the rotary table of the vertical machining center, with the curved surface of the silicon nitride vacuum carrier disk facing upwards. The silicon nitride vacuum carrier disk curved surface polishing device is fixed on the spindle of the vertical machining center by the mounting part 1.1. The polishing resin block 3 is located above the silicon nitride vacuum carrier disk, and the polishing curved surface faces the curved surface of the silicon nitride vacuum carrier disk.

[0032] Second, rough polishing: the spindle lowers the silicon nitride vacuum carrier disk surface polishing device to a designated position, causing the polishing surface 3.1 of the polishing resin block 3 to press against the surface of the silicon nitride vacuum carrier disk under the elastic force applied by the elastic element. Then, the turntable rotates the silicon nitride vacuum carrier disk to perform rough polishing on the surface of the silicon nitride vacuum carrier disk. At the same time, polishing fluid is added to the surface of the vacuum carrier disk during the rough polishing process.

[0033] Third, fine polishing: The spindle drives the silicon nitride vacuum disk curved surface polishing device to move upward and reset; then, the polishing resin block 3 in the silicon nitride vacuum disk curved surface polishing device is removed, and then a polishing resin block 3 with a larger mesh size is installed; next, the spindle drives the silicon nitride vacuum disk curved surface polishing device to descend to the designated position, and then the turntable drives the silicon nitride vacuum disk to rotate, performing fine polishing on the curved surface of the silicon nitride vacuum disk. Simultaneously, polishing fluid is added to the curved surface of the vacuum disk during the rough polishing process. Compared with the existing technology of polishing silicon nitride vacuum disk curved surfaces using manual felt polishing, the silicon nitride vacuum disk curved surface polishing device of this embodiment can be combined with a vertical machining center to automatically polish the silicon nitride vacuum disk curved surface, thereby effectively improving the polishing efficiency of the silicon nitride vacuum disk curved surface and reducing labor intensity; moreover, it can improve the polishing effect of the silicon nitride vacuum disk curved surface and effectively reduce the rework rate.

[0034] On the other hand, the elastic clamping assembly of this embodiment utilizes the elastic force applied by the elastic element to make the polishing surface 3.1 tightly adhere to the curved surface of the silicon nitride vacuum carrier disk. In this way, the polishing surface 3.1 of the polishing resin block 3 can be adaptively adjusted according to its position when it contacts the curved surface of the silicon nitride vacuum carrier disk, so that the polishing surface 3.1 is tightly adhered to the polishing surface 3.1, thereby improving the polishing effect. Furthermore, the pressure of the polishing resin block 3 acting on the curved surface of the silicon nitride vacuum carrier disk can be conveniently and accurately controlled by the spindle lifting stroke, avoiding excessive pressure that may cause excessive wear or even deformation of the curved surface of the silicon nitride vacuum carrier disk, and avoiding insufficient pressure that may affect the polishing quality, thereby improving the polishing mirror finish.

[0035] In one embodiment of this example, such as Figure 2As shown, the floating component 2 includes a floating block 2.1 and a mounting plate 2.2. The floating block 2.1 is slidably mounted on the housing 1 in a vertical direction. The mounting plate 2.2 is fixed to the bottom of the floating block 2.1. The mounting plate 2.2 and the floating block 2.1 are either integrally formed or separately manufactured and connected as one piece by bolts or welding. The polishing resin block 3 is detachably fixed to the downward-facing bottom surface of the mounting plate 2.2.

[0036] In another embodiment of this example, such as Figure 3 As shown, the floating component 2 includes a floating block 2.1, a mounting plate 2.2, and an adjusting assembly. The floating block 2.1 is slidably mounted on the housing 1 in a vertical direction. The mounting plate 2.2 is slidably connected to the bottom of the floating block 2.1 in a horizontal direction. The polishing resin block 3 is detachably fixed to the downward-facing bottom surface of the mounting plate 2.2. The adjusting assembly includes an adjusting spring 2.3 and an adjusting bolt 2.4. An adjusting block 2.5 is provided on the mounting plate 2.2. The adjusting block 2.5 has a bolt through hole, and the floating block 2.1 has an adjusting screw hole on its side. The adjusting bolt 2.4 passes through the bolt through hole and connects to the adjusting screw hole. The sliding direction of the adjusting bolt 2.4 is parallel to that of the mounting plate 2.2. The adjusting spring 2.3 is sleeved on the adjusting bolt 2.4. The adjusting spring 2.3 is located between the adjusting block 2.5 and the floating block 2.1, and the bolt head of the adjusting bolt 2.4 rests against the floating block 2.1 on the adjusting spring 2.3. After the mounting part 1.1 is clamped and fixed on the spindle of the vertical machining center, the mounting plate 2.2 slides radially along the spindle. In this way, the horizontal position of the polishing resin block 3 can be adjusted by adjusting the adjusting bolt 2.4 so that the polishing surface 3.1 of the polishing resin block 3 is aligned with the curved surface of the silicon nitride vacuum carrier disk.

[0037] In this embodiment, the housing 1 is provided with a receiving groove with the opening facing downward, and the floating block 2.1 is located in the receiving groove. The floating block 2.1 is slidably disposed in the receiving groove of the housing 1 in the vertical direction.

[0038] Furthermore, a limiting part is provided on the housing 1. The elastic element is located above the floating component 2. The elastic element abuts between the housing 1 and the floating component 2. The floating component 2 abuts against the limiting part under the action of the elastic element.

[0039] Specifically, the elastic element is a compression spring. In this embodiment, the elastic element comprises multiple compression springs distributed sequentially, and the floating component 2 floats under the combined action of the compression springs.

[0040] Furthermore, the polishing resin block 3 is detachably fixed to the downward-facing bottom surface of the floating component 2. Specifically, In one example, the polishing resin block 3 is bonded and fixed to the downward-facing bottom surface of the floating component 2. In this embodiment, the polishing resin block 3 is bonded and fixed to the downward-facing bottom surface of the mounting plate 2.2. When replacing, the polishing resin block 3 can be peeled off, and then a new polishing resin block 3 can be bonded and fixed to the downward-facing bottom surface of the mounting plate 2.2.

[0041] In another example, the polishing resin block 3 is fixed to the downward-facing bottom surface of the floating component 2 by bolts, rivets, or clips. When needed, the polishing resin block 3 can be removed and replaced with a new one.

[0042] In this second specific embodiment, the remaining structure is the same as in the first specific embodiment, except that... like Figure 4 , Figure 5 As shown, the polished surface 3.1 in this embodiment is provided with a groove 3.2. The groove 3.2 extends radially along the silicon nitride vacuum carrier disk and penetrates the polished surface 3.1. The groove 3.2 includes two sidewalls, one of which has an outwardly extending flow guide baffle 3.3 at one end, and the free end of the flow guide baffle 3.3 is inclined toward the other sidewall of the groove 3.2. When the polished surface 3.1 is tightly fitted onto the surface of the silicon nitride vacuum carrier disk, the lower edge of the flow guide baffle 3.3 approaches or abuts against the surface of the silicon nitride vacuum carrier disk.

[0043] As the polishing process progresses, the polishing resin block 3 heats up and undergoes thermal expansion and deformation, causing changes (increases) in the pressure exerted by the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk, thus affecting the polishing quality. To improve this problem, this embodiment provides a partition groove 3.2 on the polishing curved surface 3.1. This serves two purposes: firstly, the partition groove 3.2 can dissipate heat, reducing the temperature of the polishing resin block 3 and minimizing thermal expansion and deformation; more importantly, when polishing fluid is added to the curved surface of the vacuum carrier disk during polishing, as the silicon nitride vacuum carrier disk rotates, the guide baffle 3.3 can guide a portion of the polishing fluid from the curved surface of the vacuum carrier disk into the partition groove 3.2, thereby using the polishing fluid to further reduce the temperature of the polishing resin block 3 and minimize thermal expansion and deformation.

[0044] In this embodiment, the width of the partition 3.2 gradually increases from top to bottom.

[0045] In this specific embodiment, the remaining structure is the same as in specific embodiment one or specific embodiment two, except that... A silicon nitride vacuum disc surface polishing apparatus further includes a pressure detection unit. The pressure detection unit includes a control board and a pressure sensor. The pressure sensor is connected to the control board via a signal line. The pressure sensor is used to detect the pressure applied to the elastic element.

[0046] In one example, the pressure sensor's elastic element is located between the housing 1 and the housing 1, for detecting the pressure applied to the elastic element.

[0047] In another example, the pressure on the elastic element is detected between the elastic element and the housing 1 or between the elastic element and the floating component 2.

[0048] Thus, the pressure on the elastic element can be detected by a pressure sensor, thereby detecting the pressure exerted by the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk. This allows for convenient and accurate control of the pressure exerted by the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk. More importantly, during the polishing process of the curved surface of the silicon nitride vacuum carrier disk, the product surface will heat up rapidly as the polishing process progresses, causing thermal expansion and deformation of the curved surface of the silicon nitride vacuum carrier disk. The polishing resin block 3 will also heat up and undergo thermal expansion and deformation. As a result, although the height position of the spindle of the vertical machining center and the polishing resin block 3 remains unchanged during the polishing process, the pressure exerted by the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk increases (changes), causing excessive wear on the curved surface of the silicon nitride vacuum carrier disk. Especially during fine polishing, the increased pressure exerted by the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk can easily lead to over-polishing, affecting the dimensional accuracy of the product. In this embodiment, a pressure sensor can be used to detect the pressure of the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk in real time. As the polishing process progresses, when the pressure of the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk exceeds the set range, the spindle can drive the polishing resin block 3 to move upward to reduce the pressure of the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk, and control the pressure of the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk within the set range, thereby further improving the polishing quality, especially the polishing quality of fine polishing.

[0049] Specific embodiment four: A method for polishing the curved surface of a silicon nitride vacuum carrier disk, using a silicon nitride vacuum carrier disk curved surface polishing device. The structure of the silicon nitride vacuum carrier disk curved surface polishing device is as described in specific embodiment one or specific embodiment two.

[0050] A method for polishing curved surfaces of a silicon nitride vacuum carrier disk includes the following steps in sequence. The silicon nitride vacuum carrier disk is fixed on the surface of the rotary table of the vertical machining center, with the curved surface of the silicon nitride vacuum carrier disk facing upwards and the center of the silicon nitride vacuum carrier disk coinciding with the rotation axis of the rotary table.

[0051] The silicon nitride vacuum carrier disk curved surface polishing device is fixed on the spindle of the vertical machining center. Specifically, the housing 1 is fixedly installed on the spindle of the vertical machining center through the mounting part 1.1, thereby fixing the silicon nitride vacuum carrier disk curved surface polishing device on the spindle of the vertical machining center. At this time, the polishing resin block 3 is located above the silicon nitride vacuum carrier disk, and the polishing curved surface 3.1 of the polishing resin block 3 faces the curved surface of the silicon nitride vacuum carrier disk.

[0052] In the rough polishing process, the spindle lowers the silicon nitride vacuum carrier disk surface polishing device to a designated position, causing the polishing surface 3.1 of the polishing resin block 3 to press against the surface of the silicon nitride vacuum carrier disk under the elastic force applied by the elastic element. Then, the turntable rotates the silicon nitride vacuum carrier disk to perform rough polishing on the surface of the silicon nitride vacuum carrier disk. At the same time, polishing fluid is added to the surface of the vacuum carrier disk during the rough polishing process.

[0053] For fine polishing, a larger grit polishing resin block 3 is used; for example, the polishing resin block 3 used in the rough polishing process is a 400# resin polishing block, while the polishing resin block 3 used in the fine polishing process is an 800# resin polishing block. Next, the spindle drives the silicon nitride vacuum disk curved surface polishing device to descend to the designated position, so that the polishing surface 3.1 of the polishing resin block 3 presses against the curved surface of the silicon nitride vacuum disk under the elastic force applied by the elastic element. Then, the turntable drives the silicon nitride vacuum disk to rotate, performing fine polishing on the curved surface of the silicon nitride vacuum disk. This silicon nitride vacuum disk curved surface polishing method uses a silicon nitride vacuum disk curved surface polishing device combined with a vertical machining center to achieve automatic polishing of the silicon nitride vacuum disk curved surface, thereby effectively improving the polishing efficiency of the silicon nitride vacuum disk curved surface, reducing labor intensity, improving the polishing effect of the silicon nitride vacuum disk curved surface, and reducing the rework rate.

[0054] Furthermore, the specific process for rough polishing is as follows: In the first rough polishing, the spindle drives the silicon nitride vacuum carrier disk surface polishing device to descend to the zero position, at which point the polishing surface 3.1 just contacts the silicon nitride vacuum carrier disk surface; then, the turntable drives the silicon nitride vacuum carrier disk to rotate, and performs a first polishing on the silicon nitride vacuum carrier disk surface.

[0055] In the second rough polishing, the spindle drives the silicon nitride vacuum carrier disk surface polishing device to descend a set distance L1, which is 0.02 mm. This causes the polishing surface 3.1 of the polishing resin block 3 to press against the surface of the silicon nitride vacuum carrier disk under the elastic force applied by the elastic element. Then, the turntable drives the silicon nitride vacuum carrier disk to rotate, performing a second polishing on the surface of the silicon nitride vacuum carrier disk.

[0056] The process involves three rough polishing passes. The spindle lowers the silicon nitride vacuum disk surface polishing device by a set distance L2 (0.005 mm), causing the polishing surface 3.1 of the polishing resin block 3 to press against the surface of the silicon nitride vacuum disk under the elastic force applied by the elastic element. Next, the turntable rotates the silicon nitride vacuum disk, performing three polishing passes on its surface. Due to the high hardness of silicon nitride, the surface of the silicon nitride vacuum disk exhibits poor tool marks during processing. A single rough polishing pass is often insufficient to reliably remove these tool marks. Therefore, this embodiment employs three rough polishing passes to gradually increase the pressure exerted by the polishing resin block 3 on the surface of the silicon nitride vacuum disk during the rough polishing process. This reliably removes the tool marks from the surface, laying a foundation for fine polishing and improving polishing quality.

[0057] Furthermore, the specific process for fine polishing is as follows: The spindle drives the silicon nitride vacuum disk curved surface polishing device to move upward and reset; then, the polishing resin block 3 in the silicon nitride vacuum disk curved surface polishing device is removed, and then a polishing resin block 3 with a larger mesh size is installed; for example, the polishing resin block 3 in the rough polishing process is a 400# resin polishing block, and the polishing resin block 3 in the fine polishing process is an 800# resin polishing block. Next, the spindle drives the silicon nitride vacuum disk curved surface polishing device to descend to the zero position, at which point the polishing surface 3.1 just contacts the silicon nitride vacuum disk curved surface; then, the spindle drives the silicon nitride vacuum disk curved surface polishing device to descend a set distance L3, the set distance L3 being 0.03 mm, so that the polishing surface 3.1 of the polishing resin block 3 abuts against the silicon nitride vacuum disk curved surface under the elastic force applied by the elastic element; Next, the turntable rotates the silicon nitride vacuum carrier disk to perform fine polishing on the curved surface of the silicon nitride vacuum carrier disk; until the roughness of the curved surface of the silicon nitride vacuum carrier disk reaches Ra0.2 or less and has a mirror effect, the fine polishing is completed.

[0058] Specific embodiment five: A method for polishing the curved surface of a silicon nitride vacuum carrier disk, using a silicon nitride vacuum carrier disk curved surface polishing device. The structure of the silicon nitride vacuum carrier disk curved surface polishing device is as described in specific embodiment three.

[0059] A method for polishing curved surfaces of a silicon nitride vacuum carrier disk includes the following steps in sequence. The silicon nitride vacuum carrier disk is fixed on the surface of the rotary table of the vertical machining center, with the curved surface of the silicon nitride vacuum carrier disk facing upwards and the center of the silicon nitride vacuum carrier disk coinciding with the rotation axis of the rotary table.

[0060] The silicon nitride vacuum carrier disk curved surface polishing device is fixed on the spindle of the vertical machining center. Specifically, the housing 1 is fixedly installed on the spindle of the vertical machining center through the mounting part 1.1, thereby fixing the silicon nitride vacuum carrier disk curved surface polishing device on the spindle of the vertical machining center. At this time, the polishing resin block 3 is located above the silicon nitride vacuum carrier disk, and the polishing curved surface 3.1 of the polishing resin block 3 faces the curved surface of the silicon nitride vacuum carrier disk.

[0061] In the rough polishing process, the spindle lowers the silicon nitride vacuum carrier disk surface polishing device to a designated position, causing the polishing surface 3.1 of the polishing resin block 3 to press against the surface of the silicon nitride vacuum carrier disk under the elastic force applied by the elastic element. Then, the turntable rotates the silicon nitride vacuum carrier disk to perform rough polishing on the surface of the silicon nitride vacuum carrier disk. At the same time, polishing fluid is added to the surface of the vacuum carrier disk during the rough polishing process.

[0062] For fine polishing, replace the polishing resin block 3 with a larger grit. For example, the polishing resin block 3 in the rough polishing process is a 400# resin polishing block, while the polishing resin block 3 in the fine polishing process is an 800# resin polishing block. Next, the spindle drives the silicon nitride vacuum disk surface polishing device to descend to the designated position, so that the polishing surface 3.1 of the polishing resin block 3 is pressed against the surface of the silicon nitride vacuum disk under the elastic force applied by the elastic element. Next, the turntable rotates the silicon nitride vacuum carrier disk to perform fine polishing on the curved surface of the silicon nitride vacuum carrier disk until the roughness of the curved surface of the silicon nitride vacuum carrier disk reaches Ra0.2 or less and has a mirror effect, thus completing the fine polishing. During this process, a pressure sensor is used to detect the pressure of the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk. When the pressure detected by the pressure sensor exceeds the set range, the spindle drives the polishing resin block 3 to move upward to reduce the pressure of the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk until the pressure detected by the pressure sensor returns to the set range. In this way, the pressure of the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier can be accurately controlled, effectively solving the problem that during the polishing process of the silicon nitride vacuum carrier, the product surface will heat up rapidly as the polishing process progresses, causing thermal expansion and deformation of the curved surface of the silicon nitride vacuum carrier. The polishing resin block 3 will also heat up and undergo thermal expansion and deformation. As a result, although the height position of the spindle of the vertical machining center and the polishing resin block 3 remains unchanged during the polishing process, the pressure of the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier increases (changes), causing excessive wear on the curved surface of the silicon nitride vacuum carrier and affecting the dimensional accuracy of the product.

[0063] Furthermore, the specific process for rough polishing is as follows: In the first rough polishing, the spindle drives the silicon nitride vacuum carrier disk surface polishing device to descend to the zero position, at which point the polishing surface 3.1 just contacts the silicon nitride vacuum carrier disk surface; then, the turntable drives the silicon nitride vacuum carrier disk to rotate, and performs a first polishing on the silicon nitride vacuum carrier disk surface.

[0064] In the second rough polishing, the spindle drives the silicon nitride vacuum carrier disk surface polishing device to descend a set distance L1, which is 0.02 mm. This causes the polishing surface 3.1 of the polishing resin block 3 to press against the surface of the silicon nitride vacuum carrier disk under the elastic force applied by the elastic element. Then, the turntable drives the silicon nitride vacuum carrier disk to rotate, performing a second polishing on the surface of the silicon nitride vacuum carrier disk.

[0065] The process involves three rough polishing passes. The spindle lowers the silicon nitride vacuum disk surface polishing device by a set distance L2 (0.005 mm), causing the polishing surface 3.1 of the polishing resin block 3 to press against the surface of the silicon nitride vacuum disk under the elastic force applied by the elastic element. Next, the turntable rotates the silicon nitride vacuum disk, performing three polishing passes on its surface. Due to the high hardness of silicon nitride, the surface of the silicon nitride vacuum disk exhibits poor tool marks during processing. A single rough polishing pass is often insufficient to reliably remove these tool marks. Therefore, this embodiment employs three rough polishing passes to gradually increase the pressure exerted by the polishing resin block 3 on the surface of the silicon nitride vacuum disk during the rough polishing process. This reliably removes the tool marks from the surface, laying a foundation for fine polishing and improving polishing quality.

[0066] Furthermore, the specific process for fine polishing is as follows: The spindle drives the silicon nitride vacuum disk curved surface polishing device to move upward and reset; then, the polishing resin block 3 in the silicon nitride vacuum disk curved surface polishing device is removed, and then a polishing resin block 3 with a larger mesh size is installed; for example, the polishing resin block 3 in the rough polishing process is a 400# resin polishing block, and the polishing resin block 3 in the fine polishing process is an 800# resin polishing block. Next, the spindle drives the silicon nitride vacuum disk curved surface polishing device to descend to the zero position, at which point the polishing surface 3.1 just contacts the silicon nitride vacuum disk curved surface; then, the spindle drives the silicon nitride vacuum disk curved surface polishing device to descend a set distance L3, the set distance L3 being 0.03 mm, so that the polishing surface 3.1 of the polishing resin block 3 abuts against the silicon nitride vacuum disk curved surface under the elastic force applied by the elastic element; Next, the turntable rotates the silicon nitride vacuum carrier disk to perform fine polishing on its curved surface. During this process, a pressure sensor detects the pressure exerted by the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk. When the pressure detected by the pressure sensor exceeds the set range, the spindle moves the polishing resin block 3 upward to reduce the pressure exerted by the polishing resin block 3 on the curved surface of the silicon nitride vacuum carrier disk until the pressure detected by the pressure sensor returns to the set range.

[0067] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications, alterations, and equivalent transformations made to the above embodiments based on the technical essence of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A silicon nitride vacuum disk curved surface polishing apparatus, characterized in that, include: The housing has a mounting section on it; The elastic clamping assembly includes a floating component that slides vertically on the housing and an elastic element that drives the floating component to move downward. The polishing resin block is detachably fixed to the bottom surface of the floating component. The side facing up on the polishing resin block is a polishing curved surface, which is adapted to the curved surface of the silicon nitride vacuum carrier disk.

2. The silicon nitride vacuum disk curved surface polishing apparatus according to claim 1, characterized in that, It also includes a pressure detection unit, which includes a pressure sensor located between the elastic element and the housing or between the elastic element and the floating component, to detect the pressure on the elastic element.

3. The silicon nitride vacuum disk curved surface polishing apparatus according to claim 1, characterized in that, The floating component includes: The floating block slides vertically onto the shell. The mounting plate is slidably connected to the bottom of the floating block in a horizontal direction, and the polishing resin block is detachably fixed to the bottom surface of the mounting plate facing downwards. The adjustment assembly includes an adjustment spring and an adjustment bolt. An adjustment block is provided on the mounting plate, and a bolt through hole is provided on the adjustment block. An adjustment screw hole is provided on the side of the floating block. The adjustment bolt passes through the bolt through hole and is connected to the adjustment screw hole. The sliding direction of the adjustment bolt is parallel to that of the mounting plate. The bolt head of the adjustment bolt rests against the floating block on the adjustment spring.

4. The silicon nitride vacuum disk curved surface polishing apparatus according to claim 1, characterized in that, The floating component includes: The floating block slides vertically onto the shell. The mounting plate is fixed to the bottom of the floating block, and the polishing resin block is detachably fixed to the bottom surface of the mounting plate facing downwards.

5. A silicon nitride vacuum disk curved surface polishing apparatus according to claim 1, 2, 3, or 4, characterized in that, The housing is provided with a limiting part, and the elastic element is a compression spring. The elastic element is located above the floating part and abuts between the housing and the floating part. The floating part abuts against the limiting part under the action of the elastic element.

6. A silicon nitride vacuum disk curved surface polishing apparatus according to claim 1, 2, 3, or 4, characterized in that, The polished surface is provided with a groove, which extends radially along the silicon nitride vacuum carrier disk and penetrates the polished surface. The groove includes two sidewalls, one of which has an outwardly extending flow guide baffle at one end, and the free end of the flow guide baffle is inclined toward the other sidewall of the groove.

7. The silicon nitride vacuum disk curved surface polishing apparatus according to claim 6, characterized in that, The width of the partition gradually increases from top to bottom.

8. A silicon nitride vacuum disk curved surface polishing apparatus according to claim 1, 2, 3, or 4, characterized in that, The polishing resin block is bonded and fixed to the bottom surface of the floating component facing downwards, or the polishing resin block is fixed to the bottom surface of the floating component facing downwards by bolts, rivets, or clips.

9. A method for polishing curved surfaces of a silicon nitride vacuum carrier disk, characterized in that, The steps are as follows: The silicon nitride vacuum carrier disk is fixed on the surface of the rotary table of the vertical machining center; The silicon nitride vacuum carrier disk curved surface polishing device is fixed on the spindle of the vertical machining center, with the polishing surface of the polishing resin block facing the curved surface of the silicon nitride vacuum carrier disk. Rough polishing: The spindle drives the silicon nitride vacuum disk surface polishing device to descend to the designated position; then, the turntable drives the silicon nitride vacuum disk to rotate, performing rough polishing on the curved surface of the silicon nitride vacuum disk. For fine polishing, replace the polishing resin block with one of a larger grit size; then, the spindle drives the silicon nitride vacuum carrier disk surface polishing device to descend to the designated position; next, the turntable drives the silicon nitride vacuum carrier disk to rotate, and performs fine polishing on the surface of the silicon nitride vacuum carrier disk.

10. The method for polishing curved surfaces of a silicon nitride vacuum carrier disk according to claim 9, characterized in that, The specific process of rough polishing is as follows. In the first rough polishing, the spindle drives the silicon nitride vacuum carrier disk surface polishing device to descend to the zero point position, at which point the polishing surface just contacts the silicon nitride vacuum carrier disk surface; then, the turntable drives the silicon nitride vacuum carrier disk to rotate, and polishes the silicon nitride vacuum carrier disk surface once. Secondary rough polishing: The spindle drives the silicon nitride vacuum disk curved surface polishing device to descend a set distance L1. Then, the turntable drives the silicon nitride vacuum disk to rotate, and performs secondary polishing on the curved surface of the silicon nitride vacuum disk. After three rough polishing processes, the spindle drives the silicon nitride vacuum carrier disk surface polishing device to descend a set distance L2. Then, the turntable drives the silicon nitride vacuum carrier disk to rotate, performing three polishing processes on the curved surface of the silicon nitride vacuum carrier disk.

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