Vacuum packaging equipment and packaging method for semiconductor chip

Abstract

The invention relates to the technical field of vacuum packaging, in particular to vacuum packaging equipment for a semiconductor chip, which is characterized by comprising a vacuum packaging assembly and a frame, and the vacuum packaging assembly is mounted above the frame and comprises a lifting mechanism, a vacuum bin and a heating sealing piece; the heating sealing piece is installed below the vacuum bin, and the bottom face of the vacuum bin is arranged to be in an openable and closable state. The vacuum bin is installed at the bottom of the lifting mechanism, and the lifting mechanism drives the vacuum bin to move. The device has the beneficial effects that the two sets of circulating driving assemblies drive the multiple sets of supporting assemblies to move in a circulating mode, the automatic vacuum extraction and heating sealing actions of the vacuum packaging assembly are matched, vacuum packaging operation on multiple sealing bags at a time is achieved, and manual one-by-one packaging operation is not needed.

Description

Technical Field

[0001] This invention relates to the field of vacuum packaging technology, specifically to a vacuum packaging device and packaging method for semiconductor chips. Background Technology

[0002] In the final stages of semiconductor chip manufacturing, chips are often placed in sealed bags, which are then vacuum-sealed. This process is crucial for ensuring the quality of semiconductor chips upon delivery, extending their storage life, and enhancing their reliability. Its core purpose is to completely isolate the sealed bag from air, moisture, and various impurities, preventing oxidation and corrosion of core components such as the silicon substrate and metal leads. It also prevents damage to the chip's delicate structure from external vibrations and impacts, ensuring stable electrical performance and structural integrity throughout storage, transportation, and subsequent assembly. This meets the stringent requirements of semiconductor chip storage environments and is particularly suitable for applications with extremely high reliability requirements, such as aerospace, automotive electronics, and high-end consumer electronics.

[0003] In existing technologies, the vacuum sealing packaging process for chips still mainly relies on manual operation. The specific operation process is as follows: the staff first puts the produced and tested chips one by one into a special moisture-proof sealing bag, manually arranges the opening of the sealing bag, and then puts the opening of the sealing bag into the sealing station of the vacuum packaging equipment. The equipment is started to complete the vacuuming and sealing operation. After the packaging of a single bag of chips is completed, the packaged chips are manually taken out, and the above process is repeated to process the next bag of chips. Although this method can meet the basic vacuum sealing requirements, it has many inherent defects, the most prominent of which is its extremely low efficiency.

[0004] Specifically, the manual one-by-one processing method is limited by the operating speed, skill level and labor intensity of the staff. Each time a bag of chips is vacuum sealed, it must go through the complete process of "placing the chip - sorting the sealed bag - placing it at the workstation - starting the equipment - taking out the finished product". The cycle of each operation is long and it is difficult to adapt to the rhythm of large-scale chip production lines. Especially in the scenario of a surge in chip production, the efficiency bottleneck of manual operation becomes more and more obvious, directly restricting the delivery efficiency of the entire chip production chain and increasing the production cycle and manufacturing costs.

[0005] The existing method of manually completing vacuum sealing process one by one can no longer meet the industry's stringent requirements for packaging efficiency, packaging quality and production cost control. Therefore, developing a device that can replace manual operation and automate the vacuum sealing and packaging of chips, and solving the efficiency bottlenecks and quality defects in the existing technology, has become an urgent technical problem to be solved in the current semiconductor chip manufacturing field. Summary of the Invention

[0006] The purpose of this invention is to provide a vacuum packaging device and packaging method for semiconductor chips, so as to solve the problem of relying on manual vacuum sealing of semiconductor chips one by one as mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a vacuum packaging device for semiconductor chips. A vacuum sealing assembly and a frame are provided. The vacuum sealing assembly is mounted on top of the frame and includes a lifting mechanism, a vacuum chamber, and a heat sealing component. The heat sealing component is mounted below the vacuum chamber, and the bottom surface of the vacuum chamber is configured to be openable and closable. The vacuum chamber is mounted at the bottom of the lifting mechanism, and the lifting mechanism drives the vacuum chamber to move. Two sets of cyclic drive assemblies are respectively installed at the two long edges of the frame. Each set of cyclic drive assemblies includes a chain and a sprocket meshing inside the chain. The sprocket is stably installed on the frame through a bracket. The central shaft of the sprocket at the end of the chain is connected to the drive motor. Multiple sets of parallel support components are provided, and the support components can be detachably supported on two sets of circulating drive components. Each set of support components includes a placement frame, two limiting plates, two connectors, and multiple sets of adjustment plate groups. The placement frame is connected to the two limiting plates through the adjustment plate groups. The ends of the two limiting plates are connected to the same connector, and the connector is connected to the circulating drive components.

[0008] Furthermore, the frame includes two horizontal tubes, two vertical tubes, and multiple legs. The multiple legs are evenly installed below the two horizontal tubes, and the two vertical tubes are respectively installed on the opposite sides of the two horizontal tubes. The end of the vacuum sealing assembly is connected to the two vertical tubes, and two sets of circulating drive assemblies are respectively installed on the two horizontal tubes.

[0009] Furthermore, the lifting mechanism includes a first telescopic cylinder, upper and lower distributed support plates and a lifting plate; the ends of the support plates and the lifting plate are fixedly provided with end tubes, the end tubes of the support plates are statically connected to the top of the vertical pipe, and the end tubes of the lifting plates are slidably sleeved on the vertical pipe; the first telescopic cylinder is installed upside down on the support plate, and its telescopic end is connected to the lifting plate.

[0010] Furthermore, the vacuum chamber includes a chamber body, a movable plate, and a second telescopic cylinder. The bottom of the chamber body is open, and the top is detachably connected to the lifting plate. A vacuum gauge and an air pipe are also installed on the chamber body. The movable plate is slidably and sealed at the opening of the chamber body. The second telescopic cylinder is installed at the end of the chamber body and controls the movement of the movable plate. A push plate is installed below the movable plate, and a third telescopic cylinder is installed on the side of the push plate. The third telescopic cylinder is connected to the movable plate, and the latching post below the movable plate is located in the latching arc groove of the push plate. The central angle of the latching arc groove is greater than 180°. A heating sealing component is installed on the push plate.

[0011] Furthermore, a snap-fit ​​groove is provided at the edge of the opening of the hopper body, and a snap-fit ​​plate is fixedly installed above the movable plate, with the snap-fit ​​plate passing through the snap-fit ​​groove; an inclined connecting plate is rotatably installed at the end of the movable plate, and a driving plate is connected to the bottom of the two inclined connecting plates, which is connected to the telescopic end of the second telescopic cylinder; side plates are provided at the ends of the two movable plates that are close to each other, and sealing strips are provided on the side of the two side plates that are close to each other.

[0012] Furthermore, a fixed arc plate is provided at the top of the frame, and a clamping arc plate is detachably provided above the fixed arc plate; the central shaft of the sprocket passes through the space formed by the fixed arc plate and the clamping arc plate through a bearing; a square rod is fixedly provided at the bottom of the frame, and a stud is fixedly provided below the square rod; a square hole is provided on the horizontal tube, and the square rod passes through the square hole.

[0013] Furthermore, multiple support members are provided on the chain, and ear plates are fixedly provided at the lower corners of the support members. The ear plates are detachably connected to the chain. Support grooves are provided on the support members. End posts are fixedly provided at the ends of the connectors, and the end posts extend into the support grooves.

[0014] Furthermore, two sliding grooves are symmetrically arranged on the end faces of the two connectors that are close to each other, and a bidirectional threaded rod is arranged across the two sliding grooves; an end plate is fixedly arranged at the end of the limiting plate, the end plate extends into the sliding groove, and the bidirectional threaded rod is threaded through the end plate; a sliding slot is provided on the side wall of the two limiting plates that are close to each other, an inlet and outlet slot is arranged above the sliding slot, and a dumbbell rod is slidably arranged at the sliding slot.

[0015] Furthermore, the adjusting plate assembly includes a slatted frame and four sliding plates, each in pairs. The slatted frame has insertion slots on both edges, and bolts are installed through both ends of the insertion slots. The ends of two sliding plates in the same pair that are close to each other extend into the same insertion slot, and the bolts pass through a connecting hole of the sliding plate.

[0016] A vacuum packaging method for semiconductor chips, step 1, loading operation: multiple sealed bags containing semiconductor chips with their openings facing upwards are placed into the placement frame of the support assembly, and a dumbbell bar is inserted from the inlet / outlet slot of the limiting plate into the sliding slot and slid to the side of the sealed bag to press the sealed bag to prevent displacement. Step 2, Material Conveying: The drive motor drives the chain of the circulating drive component to move, conveying the tray component carrying the sealed bag to directly below the vacuum sealing component. The control system controls the chain to stop moving. Step 3, Vacuum sealing: The first telescopic cylinder of the lifting mechanism extends, driving the vacuum chamber to descend until the movable plate is in contact with the top of the support assembly, and the sealing bag extends into the vacuum chamber. The second telescopic cylinder drives the two movable plates of the vacuum chamber to close through the driving plate and the inclined connecting plate. The sealing strip between the movable plates is adhered to form a sealed cavity. The vacuum pump is started to extract the air from the sealed cavity and the sealing bag. The vacuum gauge on the vacuum chamber monitors the vacuum in real time. After reaching the preset vacuum level, the pressure is maintained for 3 to 5 seconds. Step 4, Heating and Sealing: Control the heating and sealing component to heat up to the set temperature. The third telescopic cylinder extends to drive the push plate to move the heating and sealing component to fit the opening of the sealing bag. Maintain the set sealing time to complete the heat-melt sealing of the sealing bag. After sealing, the heating and sealing component cools down, and the third telescopic cylinder retracts and resets. Step 5, Unloading Operation: The vacuum pump stops working, the two movable plates are opened to release pressure, the first telescopic cylinder retracts to drive the vacuum chamber to rise and reset, the drive motor restarts to drive the chain to continue moving, and the packaged chip is transported to the unloading station to remove the supporting components.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention uses two sets of circulating drive components to drive multiple sets of support components to move in a cyclic manner, and cooperates with the automated vacuum extraction and heating sealing actions of the vacuum packaging components to form a vacuum packaging operation for multiple sealed bags at one time. There is no need for manual operation of packaging one by one, which solves the problem of low efficiency of traditional manual packaging, greatly improves packaging capacity, adapts to the batch packaging needs of large-scale semiconductor chip production, and at the same time reduces manual input and reduces the quality risks caused by human operation errors. Attached Figure Description

[0018] Figure 1 This is a first structural schematic diagram of the entire invention; Figure 2 This is a schematic diagram of the second structure of the entire invention; Figure 3 This is a schematic diagram of the third structure of the entire invention; Figure 4 This is a schematic diagram of the framework of the present invention; Figure 5 This is a schematic diagram of the vacuum packaging component of the present invention; Figure 6 This is a schematic diagram of the lifting mechanism of the present invention; Figure 7 This is a schematic diagram of the first structure of the vacuum chamber of the present invention; Figure 8 This is a schematic diagram of the second structure of the vacuum chamber of the present invention; Figure 9 This is a schematic diagram of the structure of the support component and the cycle drive component of the present invention; Figure 10This is a schematic diagram of the structure of the loop drive component of the present invention; Figure 11 This is a schematic diagram of the structure of the frame of the present invention; Figure 12 This is a schematic diagram of the structure of the support component of the present invention; Figure 13 This is a schematic diagram of the structure of the support component of the present invention; Figure 14 This is a schematic diagram of the structure of the limiting plate and connector of the present invention; Figure 15 This is a schematic diagram of the structure of the limiting plate of the present invention; Figure 16 This is a schematic diagram of the structure of the connector of the present invention; Figure 17 This is a schematic diagram of the structure of the adjustment plate assembly of the present invention; Figure 18 This is a schematic diagram of the structure of the movable plate and the heating sealing component of the present invention.

[0019] The attached diagram lists the components represented by each number as follows: 1. Frame; 2. Vacuum sealing assembly; 3. Support assembly; 4. Circulation drive assembly; 5. Control system; 6. Vacuum pump; 7. Drive motor; 8. Support leg; 9. Square hole; 10. Vertical tube; 11. Horizontal tube; 12. Lifting mechanism; 13. Vacuum chamber; 14. First telescopic cylinder; 15. Support plate; 16. Lifting plate; 17. End tube; 18. Chamber body; 19. Movable plate; 20. Vacuum gauge; 21. Second telescopic cylinder; 22. Snap-on slot; 23. Snap-on plate; 24. Side plate; 25. Sealing strip; 26. Drive plate; 27. Slanted connecting plate; 28. Support component; 2 9. Chain; 30. Sprocket; 31. Frame; 32. Fixed arc plate; 33. Clamping arc plate; 34. Square rod; 35. Stud; 36. Ear plate; 37. Support groove; 38. Placement frame; 39. Adjustment plate assembly; 40. Limiting plate; 41. Connector; 42. Inlet / outlet groove; 43. Sliding slot; 44. Dumbbell bar; 45. End plate; 46. End post; 47. Bidirectional threaded rod; 48. Slide groove; 49. H-shaped frame; 50. Insertion groove; 51. Sliding plate; 52. Connecting hole; 53. Third telescopic cylinder; 54. Buckle post; 55. Push plate; 56. Heating sealing component. Detailed Implementation

[0020] The following will refer to the appendices in the embodiments of the present invention. Figure 1-18 The technical solutions in the embodiments of the present invention are clearly and completely described herein. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that all directional indicators (such as up and down, edge, end, sliding direction, circulation direction, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship, installation method, movement trajectory, etc. between the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0022] In this invention, unless otherwise explicitly specified and limited, the terms "detachable installation," "engagement," "sealed sliding," "threaded penetration," and "cyclic drive," etc., should be interpreted broadly. For example, they can refer to bolt-fixed detachable installation or snap-fit ​​detachable engagement; they can refer to tight engagement of gears and chains or transmission engagement within the allowable tolerance range; they can refer to tight sliding with seals or smooth sliding with clearance fit; they can refer to zero-backlash threaded penetration or threaded connection with adaptability adjustment. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] To address the technical problems of existing semiconductor chip vacuum packaging methods, which rely on manual, one-by-one operation, resulting in extremely low efficiency and difficulty in adapting to large-scale production, this invention provides a vacuum packaging device and method for semiconductor chips. The device, through the collaborative design of a frame 1, a vacuum packaging component 2, a circulating drive component 4, and multiple sets of support components 3, achieves vacuum sealing of chip sealing bags. Simultaneously, the support components 3 can accommodate chip sealing bags of different specifications. The packaging process requires no manual intervention, significantly improving packaging efficiency and perfectly meeting the needs of large-scale semiconductor chip production. The accompanying packaging method features clear steps, strong operability, and ensures efficient equipment operation.

[0024] As attached Figure 1 , 2 As shown in Figure 3, the core of the semiconductor chip vacuum packaging equipment of the present invention consists of a frame 1, a vacuum packaging component 2, two sets of circulating drive components 4, and multiple sets of support components 3, and is equipped with a drive motor 7, a vacuum pump 6, and a control system 5. The frame 1 serves as the basic support carrier for the entire equipment. The vacuum packaging component 2 is installed above the frame 1 and is responsible for vacuum extraction and heat sealing. The two sets of circulating drive components 4 are symmetrically installed at the two long edges of the frame 1 to provide conveying power. The multiple sets of support components 3 are detachably supported on the two sets of circulating drive components 4 and are used to carry the chip sealing bag. They move with the circulating drive components 4 to the bottom of the vacuum packaging component 2 to complete the packaging operation. The specific structure and connection relationship of each core component, as well as the complete packaging method, are described in detail below with reference to the accompanying drawings: As attached Figure 4As shown, frame 1 is the basic support structure of the equipment, used to install and fix the vacuum sealing assembly 2 and the cycle drive assembly 4, ensuring the installation accuracy and operational stability of each component. The specific structure is as follows: The frame 1 consists of two horizontal tubes 11, two vertical tubes 10, and multiple support legs 8. The multiple support legs 8 are evenly installed below the two horizontal tubes 11 to form a stable support structure. Anti-slip pads or fixing holes can be added to the bottom of the support legs 8 to improve the stability of the equipment on the ground. The two vertical tubes 10 are respectively installed vertically on the opposite sides of the two horizontal tubes 11, forming a portal frame 1 structure, which provides an installation foundation for the vacuum sealing component 2. The horizontal tubes 11 and the vertical tubes 10 are detachably connected by welding or bolts, which facilitates transportation and disassembly.

[0025] Both horizontal tubes 11 have square holes 9, which are adapted to the square rods 34 at the bottom of the frame 31 of the circulating drive assembly 4 to realize the positioning and installation of the frame 31; the top of the vertical tube 10 is fixedly connected to the support plate 15 of the vacuum sealing assembly 2, and the middle part of the vertical tube 10 is slidably engaged with the lifting plate 16 of the vacuum sealing assembly 2 to provide guidance for the movement of the lifting mechanism 12.

[0026] As attached Figure 5 , 6 As shown in Figures 7, 8, and 18, the vacuum sealing component 2 is the core functional execution component, installed above the frame 1, responsible for vacuum extraction, heat sealing, and sealing compaction. Its core features are adjustable height, double movable plate sealing, and precise heat sealing. The specific structure is as follows: The lifting mechanism 12 is used to drive the vacuum chamber 13 to move up and down to dock with the support component 3. It includes a first telescopic cylinder 14, a support plate 15, and a lifting plate 16. Both ends of the support plate 15 and the lifting plate 16 are fixedly provided with end tubes 17. The end tubes 17 of the support plate 15 are statically and fixedly connected to the top of the vertical pipe 10. The end tubes 17 of the lifting plate 16 are slidably sleeved on the vertical pipe 10, and the contact surface between the end tubes 17 and the vertical pipe 10 is smoothed to ensure the smoothness of the lifting plate 16 sliding up and down. The first telescopic cylinder 14 is installed upside down on the support plate 15, and its telescopic end is fixedly connected to the upper surface of the lifting plate 16. By telescoping the first telescopic cylinder 14, the lifting plate 16 and the vacuum chamber 13 below it can be driven to move up and down along the vertical pipe 10 to adjust the distance between the vacuum chamber 13 and the support component 3.

[0027] Vacuum chamber 13 is the core cavity for vacuum sealing, including chamber body 18, two movable plates 19, and a second telescopic cylinder 21, responsible for forming a sealed space and drawing a vacuum. Chamber body 18 is a box structure with a closed top and an open bottom. The top is detachably connected to the lifting plate 16. Vacuum gauge 20 and air pipe are installed on chamber body 18. The air pipe is connected to vacuum pump 6 through a valve. Vacuum gauge 20 can monitor the vacuum level inside the chamber in real time to ensure sealing quality. The two movable plates 19 are slidably installed at the bottom opening of chamber body 18, which can... The opening and closing control controls the closure and opening of the opening; a buckle plate 23 is fixedly installed above the movable plate 19, and a buckle groove 22 is opened at the edge of the opening of the compartment 18. The buckle plate 23 is set through the buckle groove 22 to improve the stability and sealing of the sliding of the movable plate 19; a side plate 24 is provided at the end of the two movable plates 19 that are close to each other, and a sealing strip 25 is provided on the inner side of the side plate 24. When the two movable plates 19 are closed, the sealing strip 25 is attached to ensure the sealing performance of the compartment 18 and to facilitate the flow of gas from the sealed bag.

[0028] The second telescopic cylinder 21 is installed at the end of the chamber 18. The end of the movable plate 19 is rotatably provided with an inclined connecting plate 27. The bottom of the two inclined connecting plates 27 are rotatably connected to the driving plate 26. The driving plate 26 is fixedly connected to the telescopic end of the second telescopic cylinder 21. When the second telescopic cylinder 21 telescopics, it drives the two movable plates 19 to open and close synchronously through the driving plate 26 and the inclined connecting plate 27, thereby realizing the closing and opening of the bottom opening of the chamber 18. When closed, a sealed cavity is formed, and when opened, it facilitates the entry and exit of the support component 3.

[0029] The heating sealing component 56 is installed below the movable plate 19 and is responsible for heating and sealing the opening of the chip sealing bag. It includes a push plate 55, a third telescopic cylinder 53, and the heating sealing component 56. The heating sealing component 56 includes at least a heating strip and a heat insulation cloth. The heating strip can be made of nickel-chromium alloy and heats up when energized. The heat insulation cloth wraps the heating strip to prevent it from sticking to the bag. The push plate 55 is located below the movable plate 19. A latching post 54 is provided below the movable plate 19. The push plate 55 has a latching arc groove with a central angle greater than 180°. The latching post 54 is located in the latching arc groove to achieve sliding positioning of the push plate 55. The third telescopic cylinder 53 is installed on the side of the movable plate 19. Its telescopic end is connected to the push plate 55 and can drive the push plate 55 to finely adjust its position to ensure that the heating sealing component 56 is precisely aligned with the opening of the sealing bag. The temperature of the heating sealing component 56 can be precisely adjusted by the control system 5 to adapt to the sealing requirements of sealing bags of different materials.

[0030] As attached Figure 9 , 10 As shown in Figures 11 and 12, the cyclic drive assembly 4 is a power transmission component. Two sets of assemblies are symmetrically installed at the two long edges of the frame 1, responsible for driving the cyclic movement of the support assembly 3. Its core features are the chain drive structure and precise support positioning. The specific structure is as follows: Each set of circulating drive components 4 consists of a chain 29, multiple sprockets 30, and a frame 31. The multiple sprockets 30 are meshed inside the chain 29 to form a circulating transmission path. The central shaft of the sprocket 30 located at the end of the chain 29 is connected to the power output shaft of the drive motor 7. After the drive motor 7 starts, it drives the sprocket 30 to rotate, thereby driving the chain 29 to circulate. The frame 31 is the mounting carrier for the sprocket 30. Its top is provided with a fixed arc plate 32 and a detachable clamping arc plate 33. The central shaft of the sprocket 30 passes through the space formed by the fixed arc plate 32 and the clamping arc plate 33 through a bearing, realizing the stable rotation and fixed installation of the sprocket 30. The clamping arc plate 33 is detachable, which facilitates the maintenance and replacement of the sprocket 30.

[0031] A square rod 34 is fixedly installed at the bottom of the frame 31, and a stud 35 is fixedly installed below the square rod 34. The square rod 34 passes through the square hole 9 of the horizontal tube 11 and is screwed onto the stud 35 by a nut to achieve a firm fixation between the frame 31 and the horizontal tube 11.

[0032] Multiple support pieces 28 are evenly arranged on the chain 29. Ear plates 36 are fixedly installed at the lower corner of the support piece 28. The ear plates 36 are detachably connected to the chain 29 by bolts, which facilitates the replacement of the support piece 28. A closed-end C-shaped support groove 37 is opened on the support piece 28, which is adapted to the end post 46 of the connector 41 of the support assembly 3, so as to realize the quick positioning and disassembly of the support assembly 3 and prevent the support assembly 3 from shifting during the transportation process.

[0033] As attached Figure 13 , 14 As shown in Figures 15, 16, and 17, the support assembly 3 is the carrier component of the chip sealing bag. Multiple sets of components are evenly distributed along the circulation drive assembly 4, responsible for stably carrying the chip sealing bag and moving with the circulation drive assembly 4. The core features are the adjustable adaptable structure and the stable clamping design. The specific structure is as follows: Each set of support components 3 consists of a placement frame 38, two limiting plates 40, two connectors 41, and multiple sets of adjustment plate groups 39. The placement frame 38 is a rectangular frame structure 1, used to directly support the chip sealing bag, and its size can be designed according to common sealing bag specifications. The two limiting plates 40 are symmetrically arranged above the placement frame 38 to limit the left and right displacement of the sealing bag, and the top of the sealing bag passes through the two limiting plates 40. The two connectors 41 are respectively fixed at both ends of the two limiting plates 40 for connection with the support component 28 of the circulation drive component 4.

[0034] The placement frame 38 is connected to two limiting plates 40 via multiple sets of adjusting plate assemblies 39. Each adjusting plate assembly 39 includes a rectangular frame 49 and four sliding plates 51 divided into two groups. The rectangular frame 49 has insertion slots 50 on both edges, with bolts threaded through both ends of the insertion slots 50. The ends of two sliding plates 51 in the same group that are close to each other extend into the same insertion slot 50. The bolts pass through a connecting hole 52 in one of the sliding plates 51. By selecting different positions of the connecting holes 52, the extension length of the sliding plate 51 can be adjusted, thereby adjusting the placement... The position and size of frame 38 are adapted to different specifications of chip sealing bags; two grooves 48 are symmetrically opened on the end faces of the two connectors 41 that are close to each other. A bidirectional threaded rod 47 is arranged across the groove 48. An end plate 45 is fixedly installed at the end of the limiting plate 40. The end plate 45 extends into the groove 48 and the bidirectional threaded rod 47 is threaded through the end plate 45. Rotating the bidirectional threaded rod 47 can drive the two limiting plates 40 to move closer or further apart, so as to adjust the spacing of the limiting plates 40 to facilitate the top of the sealing bag to extend in.

[0035] Sliding slots 43 are provided on the side walls of the two limiting plates 40 that are close to each other. An inlet / outlet slot 42 is provided above the sliding slots 43. A dumbbell rod 44 is slidably installed in the sliding slots 43. The length of the dumbbell rod 44 is less than the width of the sealed bag. After the chip sealed bag is placed in the placement frame 38, the dumbbell rod 44 is inserted from the inlet / outlet slot 42 into the sliding slot 43. The dumbbell rod 44 is slid along the sliding slot 43 to the side of the sealed bag, which can compress the sealed bag and prevent the sealed bag from shifting or the opening from loosening during transportation. At the same time, it provides a channel for gas to be discharged from the sealed bag.

[0036] The end of the connector 41 is fixedly provided with an end post 46, which extends into the support groove 37 of the support member 28 of the circulation drive component 4, so as to realize the quick connection and positioning of the support member 3 and the circulation drive component 4. When disassembling, the support member 3 can be separated by simply lifting it upwards, which is easy to operate.

[0037] The semiconductor chip vacuum packaging method of the present invention is implemented based on the above-mentioned equipment. The control system 5 coordinates the actions of each component to achieve automated, assembly-line packaging. The specific working principle and packaging steps are as follows: The circulating drive component 4 drives multiple sets of support components 3 to move. When the support component 3 moves to the loading station, the operator manually places multiple sealed bags containing semiconductor chips into the placement frame 38 and presses them in place using the dumbbell rod 44. The support component 3 moves with the chain 29 to below the vacuum packaging component 2. The lifting mechanism 12 drives the vacuum chamber 13 to descend, and the movable plate 19 closes to form a sealed cavity. The movable plate 19 applies moderate pressure to the sealed bags to provide a channel for gas to flow out of the sealed bags. The vacuum pump 6 extracts air from the chamber 18 to a preset vacuum level, and the heating sealing component 56 is heated and driven by the third telescopic cylinder 53 to fit the opening of the sealed bag, completing the heat sealing. After sealing, the movable plate 19 opens, the vacuum chamber 13 rises, and the support component 3 moves with the chain 29 to the unloading station. The operator or automated equipment removes the packaged chips, and the support component 3 continues to circulate to the loading station to complete one packaging cycle.

[0038] Equipment debugging: Start the control system 5 and check the operating status of each component; according to the specifications of the chip sealing bag, adjust the adjusting plate group 39 and the bidirectional threaded rod 47 of the support assembly 3 so that the placement frame 38 and the limiting plate 40 are adapted to the size of the sealing bag; set the vacuum degree parameters (e.g. -0.09~0.1MPa), heating sealing temperature (e.g. 120~180℃, adjusted according to the material of the sealing bag), and sealing time (e.g. 2~5s).

[0039] Loading operation: When the support assembly 3 moves to the loading station, the sealed bag containing the semiconductor chip is placed in the placement frame 38 with the opening facing upward, and the dumbbell bar 44 is pushed to slide along the sliding slot 43 to the side of the sealed bag to press the sealed bag to prevent displacement.

[0040] Circular conveying: The drive motor 7 starts, driving the chain 29 to move in a circular motion. The support component 3 moves at a constant speed with the chain 29 to directly below the vacuum sealing component 2. The control system 5 controls the chain 29 to stop moving.

[0041] Vacuum sealing: The first telescopic cylinder 14 extends, driving the lifting plate 16 and vacuum chamber 13 to descend, so that the movable plate 19 fits against the top of the support assembly 3; the second telescopic cylinder 21 works, driving the two movable plates 19 to close by driving the plate 26 and the inclined connecting plate 27, and the sealing strip 25 fits together to form a closed cavity; the vacuum pump 6 starts, extracting the air from the chamber 18 and the sealing bag, and the vacuum gauge 20 monitors in real time, maintaining the preset vacuum level for 3 to 5 seconds.

[0042] Heating and sealing: The heating and sealing component 56 is heated to the set temperature, the third telescopic cylinder 53 extends, and the drive push plate 55 drives the heating and sealing component 56 to fit against the opening of the sealing bag, maintains the set sealing time, and completes the heat-melt sealing of the sealing bag; after sealing, the heating and sealing component 56 is cooled down, and the third telescopic cylinder 53 retracts and resets.

[0043] Vacuum pump 6 stops working, movable plate 19 opens to release pressure; first telescopic cylinder 14 retracts, driving vacuum chamber 13 to rise and reset; drive motor 7 restarts, chain 29 continues to move, conveying the packaged chip to unloading station; manual or automated equipment removes the packaged finished product, pushes dumbbell rod 44 to inlet / outlet slot 42 to remove it, and support component 3 continues to circulate to loading station to enter the next round of packaging.

[0044] In this invention, the number of support components 3 can be flexibly increased or decreased according to the equipment length and production efficiency requirements. The speed of the chain 29 of the circulating drive component 4 can be adjusted by the control system 5 to adapt to different packaging rhythms. The temperature, vacuum parameters, and sealing time of the heating sealing component 56 can be precisely controlled by the control system 5 to adapt to chip sealing bags of different materials (such as aluminum foil bags and composite film bags). The number of sprockets 30 of the circulating drive component 4 can be adjusted according to the equipment length to ensure smooth operation of the chain 29. The adjustment range of the adjustment plate group 39 and the bidirectional threaded rod 47 of the support component 3 can be designed according to the specifications of common chip sealing bags to further improve adaptability. The core components can be made of corrosion-resistant, high-strength metal alloys or engineering plastics to extend the service life of the equipment.

[0045] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other. For example, an anti-slip pad can be added inside the placement frame 38 of the support component 3 to improve the stability of the sealed bag placement; a pressure sensor can be added inside the vacuum chamber 13 to further accurately control the vacuum level; a positioning sensor can be added to the cycle drive component 4 to realize the accurate positioning and start / stop of the support component 3, etc. However, this must be based on the ability of a person skilled in the art to implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the protection scope claimed by the present invention.

[0046] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0047] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vacuum packaging device for semiconductor chips, characterized in that: include A vacuum sealing assembly (2) and a frame (1) are provided. The vacuum sealing assembly (2) is installed above the frame (1) and includes a lifting mechanism (12), a vacuum chamber (13), and a heat sealing component (56). The heat sealing component (56) is installed below the vacuum chamber (13), and the bottom surface of the vacuum chamber (13) is set to be openable and closable. The vacuum chamber (13) is connected to a vacuum pump (6). The vacuum chamber (13) is installed at the bottom of the lifting mechanism (12), and the lifting mechanism (12) drives the vacuum chamber (13) to move. A control system (5) installed on the frame (1) controls the operation of the device. Two sets of cycle drive assemblies (4) are respectively installed at the two long edges of the frame (1). Each set of cycle drive assemblies (4) includes a chain (29) and a sprocket (30) meshing inside the chain (29). The sprocket (30) is stably installed on the frame (1) through a bracket (31). The central shaft of the sprocket (30) located at the end of the chain (29) is connected to the drive motor (7). Multiple sets of parallel support components (3), and the support components (3) are detachably supported on two sets of circulating drive components (4); each set of support components (3) includes a placement frame (38), two limiting plates (40), two connectors (41) and multiple sets of adjustment plate groups (39). The placement frame (38) is connected to the two limiting plates (40) through the adjustment plate groups (39). The ends of the two limiting plates (40) are connected to the same connector (41). The connector (41) is connected to the circulating drive component (4).

2. The vacuum packaging equipment for a semiconductor chip according to claim 1, characterized in that: The frame (1) includes two horizontal tubes (11), two vertical tubes (10) and multiple legs (8). The multiple legs (8) are evenly installed below the two horizontal tubes (11), and the two vertical tubes (10) are respectively installed on the side of the two horizontal tubes (11) that are far apart from each other. The end of the vacuum sealing assembly (2) is connected to the two vertical tubes (10), and the two sets of the cycle drive assemblies (4) are respectively installed on the two horizontal tubes (11).

3. The vacuum packaging equipment for a semiconductor chip according to claim 2, characterized in that: The lifting mechanism (12) includes a first telescopic cylinder (14), a support plate (15) distributed vertically, and a lifting plate (16); the ends of the support plate (15) and the lifting plate (16) are fixedly provided with end tubes (17), the end tubes (17) of the support plate (15) are statically connected to the top of the vertical pipe (10), and the end tubes (17) of the lifting plate (16) are slidably sleeved on the vertical pipe (10); the first telescopic cylinder (14) is installed upside down on the support plate (15), and its telescopic end is connected to the lifting plate (16).

4. The vacuum packaging equipment for a semiconductor chip according to claim 1, characterized in that: The vacuum chamber (13) includes a chamber body (18), a movable plate (19), and a second telescopic cylinder (21). The bottom of the chamber body (18) is set as an opening, and the top is detachably connected to the lifting plate (16). A vacuum gauge (20) and an air pipe are also provided on the chamber body (18). The movable plate (19) is sealed and slidably installed at the opening of the chamber body (18). The second telescopic cylinder (21) is installed at the end of the chamber body (18), and the second telescopic cylinder (21) controls the movement of the movable plate (19). A push plate (55) is provided below the movable plate (19), and a third telescopic cylinder (53) is provided on the side of the push plate (55). The third telescopic cylinder (53) is connected to the movable plate (19), and the buckle post (54) below the movable plate (19) is located in the buckle arc groove of the push plate (55). The central angle of the buckle arc groove is greater than 180°. The heating sealing component (56) is installed on the push plate (55).

5. The vacuum packaging equipment for a semiconductor chip according to claim 4, characterized in that: A buckle groove (22) is provided at the opening edge of the compartment (18), and a buckle plate (23) is fixedly provided above the movable plate (19). The buckle plate (23) passes through the buckle groove (22). An inclined connecting plate (27) is rotatably provided at the end of the movable plate (19). A driving plate (26) is connected to the bottom of the two inclined connecting plates (27). The driving plate (26) is connected to the telescopic end of the second telescopic cylinder (21). A side plate (24) is provided at the ends of the two movable plates (19) that are close to each other. A sealing strip (25) is provided on the side of the two side plates (24) that are close to each other.

6. The vacuum packaging equipment for a semiconductor chip according to claim 2, characterized in that: The top of the frame (31) is provided with a fixed arc plate (32), and a clamping arc plate (33) is detachably provided above the fixed arc plate (32); the central shaft of the sprocket (30) is connected through the space formed by the fixed arc plate (32) and the clamping arc plate (33) by a bearing; a square rod (34) is fixedly provided at the bottom of the frame (31), and a stud (35) is fixedly provided below the square rod (34); a square hole (9) is provided on the horizontal tube (11), and the square rod (34) is provided through the square hole (9).

7. The vacuum packaging equipment for a semiconductor chip according to claim 1, characterized in that: Multiple support members (28) are provided on the chain (29). Ear plates (36) are fixedly provided at the lower corner of the support member (28). The ear plates (36) are detachably connected to the chain (29). Support grooves (37) are provided on the support member (28). An end post (46) is fixedly provided at the end of the connector (41). The end post (46) extends into the support groove (37).

8. The vacuum packaging equipment for a semiconductor chip according to claim 1, characterized in that: Two sliding grooves (48) are symmetrically arranged on the end faces of the two connectors (41) that are close to each other, and a bidirectional threaded rod (47) is arranged across the two sliding grooves (48); an end plate (45) is fixedly arranged at the end of the limiting plate (40), the end plate (45) extends into the sliding groove (48), and the bidirectional threaded rod (47) is threaded through the end plate (45); a sliding slot (43) is provided on the side wall of the two limiting plates (40) that are close to each other, an inlet and outlet slot (42) is provided above the sliding slot (43), and a dumbbell rod (44) is slidably arranged in the sliding slot (43).

9. The vacuum packaging equipment for a semiconductor chip according to claim 1, characterized in that: The adjusting plate group (39) includes a swivel frame (49) and four sliding plates (51) in pairs. The two edges of the swivel frame (49) are provided with insertion slots (50), and bolts are provided through both ends of the insertion slots (50). The ends of the two sliding plates (51) in the same group that are close to each other extend into the same insertion slot (50), and the bolts pass through a connecting hole (52) of the sliding plate (51).

10. A vacuum packaging method for a semiconductor chip, applied to the semiconductor chip vacuum packaging equipment as described in claim 1, characterized in that: Step 1, loading operation: Place multiple sealed bags containing semiconductor chips with the opening facing up into the placement frame (38) of the support assembly (3), and put the dumbbell bar (44) from the inlet / outlet slot (42) of the limiting plate (40) into the sliding slot (43) and slide it to the side of the sealed bag to press the sealed bag to prevent displacement. Step 2, Material conveying: The drive motor (7) drives the chain (29) of the circulating drive assembly (4) to move, conveying the support assembly (3) carrying the sealed bag to the bottom of the vacuum sealing assembly (2), and the chain (29) is stopped by the control system (5); Step 3, Vacuum sealing: The first telescopic cylinder (14) of the lifting mechanism (12) extends, driving the vacuum chamber (13) to descend to the top of the movable plate (19) and the support assembly (3), and the sealing bag extends into the vacuum chamber (13). The second telescopic cylinder (21) drives the two movable plates (19) of the vacuum chamber (13) to close through the driving plate (26) and the inclined connecting plate (27). The sealing strip (25) between the movable plates (19) is adhered to form a sealed cavity. The vacuum pump (6) is started to extract the air in the sealed cavity and the sealing bag. The vacuum gauge (20) on the vacuum chamber (13) monitors in real time. After reaching the preset vacuum level, the pressure is maintained for 3~5 seconds. Step 4, Heating and sealing: Control the heating and sealing component (56) to heat up to the set temperature, the third telescopic cylinder (53) extends to drive the push plate (55) to drive the heating and sealing component (56) to fit the opening of the sealing bag, maintain the set sealing time to complete the heat melt sealing of the sealing bag, after sealing, the heating and sealing component (56) cools down, and the third telescopic cylinder (53) retracts and resets; Step 5, unloading operation: The vacuum pump (6) stops working, and the two movable plates (19) are opened to release pressure. The first telescopic cylinder (14) retracts to drive the vacuum chamber (13) to rise and reset. The drive motor (7) is restarted to drive the chain (29) to continue moving, and the packaged chip is transported to the unloading station. The support assembly (3) is removed.

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