Glue joint structure defect detection method, equipment, medium and program product

Abstract

The invention relates to the technical field of aeronautical manufacturing, and discloses a defect detection method and equipment of a glue joint structure, a medium and a program product. The method comprises the following steps: acquiring a first depth of an interface between a surface metal skin and a composite material skin in a glue joint structure and a second depth of an interface between the composite material skin and a glue film; according to the first depth and the second depth, echo delay is obtained through calculation, and according to the echo delay, a first defect tracking gate and a second defect tracking gate are generated; and performing defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, and obtaining a defect detection result according to the defect detection image. The corresponding echo delay is determined according to the depth of the interface between different materials, and the corresponding defect tracking gate is generated according to the echo delay and is used for extracting the effective ultrasonic echo signal, so that the effective interval of the ultrasonic reflection signal can be accurately determined, and the defect detection accuracy can be improved.

Description

Technical Field

[0001] This invention relates to the field of aerospace manufacturing technology, and in particular to a method, equipment, medium, and procedure for detecting defects in bonded structures. Background Technology

[0002] Metal-composite-honeycomb bonded structures are a typical type of aerospace component, possessing strong resistance to impact damage. They are often used in the leading edge region of aircraft to transmit aerodynamic loads, resist external impacts, and protect internal piping and circuitry. However, this type of structure has a complex manufacturing process and is prone to defects such as delamination and detachment during manufacturing.

[0003] Currently, existing methods for detecting defects in bonded structures typically employ ultrasonic testing, which involves analyzing ultrasonic reflection signals to detect defects. However, because bonded structures are sandwich structures made up of multiple materials bonded together in a specific sequence, there are numerous interfaces between different materials. This results in a time delay in the ultrasonic reflection signals, making it difficult to determine the effective range of the ultrasonic reflection signals, and consequently leading to low accuracy in defect detection. Summary of the Invention

[0004] This invention provides a method, equipment, medium, and program product for detecting defects in adhesive structures, which can accurately determine the effective range of ultrasonic reflection signals and improve the accuracy of defect detection.

[0005] According to one aspect of the present invention, a method for detecting defects in adhesively bonded structures is provided, comprising: The first depth of the interface between the surface metal skin and the composite material skin in the adhesive structure, and the second depth of the interface between the composite material skin and the adhesive film are obtained. Based on the first depth and the second depth, the echo delay is calculated, and based on the echo delay, a first defect tracking gate and a second defect tracking gate are generated; Defect detection is performed based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, and a defect detection result is obtained based on the defect detection image.

[0006] According to another aspect of the present invention, a defect detection device for adhesive structures is provided, comprising: The depth acquisition module is used to acquire the first depth of the interface between the surface metal skin and the composite material skin in the adhesive structure, and the second depth of the interface between the composite material skin and the adhesive film. The gate generation module is used to calculate the echo delay based on the first depth and the second depth, and generate a first defect tracking gate and a second defect tracking gate based on the echo delay. The result acquisition module is used to perform defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, and to obtain a defect detection result based on the defect detection image.

[0007] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the defect detection method for adhesive structures according to any embodiment of the present invention.

[0008] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing a computer program configured to cause a processor to execute and implement the defect detection method for adhesive structures according to any embodiment of the present invention.

[0009] According to another aspect of the present invention, a computer program product is provided, comprising a computer program that, when executed by a processor, implements the defect detection method for adhesive structures according to any embodiment of the present invention.

[0010] The technical solution of this invention involves obtaining a first depth of the interface between the surface metal skin and the composite material skin in an adhesive structure, and a second depth of the interface between the composite material skin and the adhesive film; calculating the echo delay based on the first and second depths, and generating a first defect tracking gate and a second defect tracking gate based on the echo delay; performing defect detection based on the first and second defect tracking gates to obtain a defect detection image, and obtaining the defect detection result based on the defect detection image; by determining the corresponding echo delay based on the depth of the interface between different materials, and generating a corresponding defect tracking gate based on the echo delay, the effective ultrasonic echo signal can be extracted, thereby accurately determining the effective range of the ultrasonic reflection signal and improving the accuracy of defect detection.

[0011] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a flowchart of a defect detection method for an adhesive structure according to Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of a complete ultrasonic echo signal provided according to Embodiment 1 of the present invention; Figure 3 This is a schematic diagram of a defect tracking gate provided in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of a defect detection image provided in Embodiment 1 of the present invention; Figure 5 This is a flowchart of a defect detection method for an adhesive structure according to Embodiment 2 of the present invention; Figure 6 This is a schematic diagram of a defect detection device for adhesive structures according to Embodiment 3 of the present invention; Figure 7 This is a schematic diagram of the structure of an electronic device that implements the defect detection method for adhesive structures according to embodiments of the present invention. Detailed Implementation

[0014] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0015] It should be noted that the terms "first," "second," "modification," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0016] Example 1 Figure 1 This is a flowchart of a defect detection method for adhesive structures provided in Embodiment 1 of the present invention. This embodiment is applicable to the defect detection of metal-composite-honeycomb adhesive structures. The method can be executed by a defect detection device for adhesive structures, which can be implemented in hardware and / or software. Typically, this defect detection device can be configured in electronic devices, such as computer equipment or servers. Figure 1 As shown, the method includes: S110. Obtain the first depth of the interface between the surface metal skin and the composite material skin in the adhesive structure, and the second depth of the interface between the composite material skin and the adhesive film.

[0017] The adhesive structure is a sandwich structure consisting of a surface metal skin, a composite material skin, and a honeycomb layer bonded together from the outside in. The composite material skin and the honeycomb layer are bonded together using an adhesive film.

[0018] In this embodiment, a parameter configuration document for the adhesive structure can be obtained, and natural language understanding can be performed on the document to extract the first depth of the interface between the surface metal skin and the composite material skin, and the second depth of the interface between the composite material skin and the adhesive film. The interface depth refers to the vertical distance from the surface of the adhesive structure to that interface.

[0019] S120. Calculate the echo delay based on the first depth and the second depth, and generate a first defect tracking gate and a second defect tracking gate based on the echo delay.

[0020] It should be noted that ultrasonic reflection testing involves pulse emission, interface reflection, and echo reception. The testing instrument can only receive ultrasonic waves reflected back to the test surface and cannot directly receive transmitted waves. Ultrasonic signals are reflected to varying degrees by surface metal skins, composite material skins, and films. A complete ultrasonic echo signal is composed of reflected echoes from each interface. For example, a complete ultrasonic echo signal can be represented as follows: Figure 2 As shown.

[0021] In this embodiment, the material type corresponding to the surface metal skin can be obtained. Based on the current first depth and material type, the current first delay is obtained by looking up a preset correspondence between material type, depth, and delay. Simultaneously, the difference between the second depth and the first depth can be calculated, and the material type corresponding to the composite material skin can be obtained. Then, based on the current difference and material type, the current second delay is obtained by looking up a preset correspondence between material type, depth difference, and delay. Next, the sum of the first delay and the second delay can be calculated as the echo delay. Here, the echo delay represents the arrival time of the echo reflected from the film.

[0022] Furthermore, the thickness and material type of the cellular layer can be obtained, and the current duration can be obtained by looking up the preset correspondence between thickness, material type, and duration. Then, a first defect tracking gate is generated, starting with the echo delay and using the current duration as the duration. Simultaneously, a second defect tracking gate is generated, starting with the end position of the first defect tracking gate and ending with the tail of the complete ultrasonic echo signal. The defect tracking gate is in square wave form, with an amplitude (height) of a preset fixed value. For example, the defect tracking gate can be configured as follows: Figure 3 As shown, the first defect tracking gate is located between t1 and t2, and the second defect tracking gate is located after t2.

[0023] S130. Perform defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, and obtain a defect detection result based on the defect detection image.

[0024] In this embodiment, the complete ultrasonic echo signal can be truncated based on a first defect tracking gate and a second defect tracking gate to obtain a first ultrasonic echo signal whose abscissa falls on the first defect tracking gate and a second ultrasonic echo signal whose abscissa falls on the second defect tracking gate. Next, ultrasonic C-scan imaging is performed based on the first and second ultrasonic echo signals to obtain a first defect detection image and a second defect detection image. Finally, by comparing pixel values, the presence of bright spots or specified color spots in the first and second defect detection images is detected. If so, it is determined that a defect exists at the location of the adhesive structure corresponding to the bright spot or specified color spot; otherwise, it is determined that the adhesive structure does not have a defect, thereby obtaining the final defect detection result. For example, the defect detection image can be as follows: Figure 4 As shown, dark spots were found at 6 detection locations, which indicates that there are defects in the adhesive structure.

[0025] The first defect detection image can detect delamination and debonding defects in a portion of the skin thickness of the bonded structure, while the second defect detection image can detect delamination and debonding defects in another portion of the skin thickness of the bonded structure.

[0026] The defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image may include: The initial ultrasonic echo signal corresponding to each detection position of the adhesive structure is obtained by using a low-frequency ultrasonic probe. The initial ultrasonic echo signal is analyzed based on the first defect tracking gate and the second defect tracking gate to obtain the signal analysis results corresponding to each detection position, and the defect detection image is generated based on the signal analysis results.

[0027] In this embodiment, the low-frequency ultrasonic probe can be a low-frequency array ultrasonic phased array probe. The natural frequency of the probe chip should be low enough to ensure sufficient penetration for the thickness of the bonded structure. Typically, the probe frequency is 0.5 MHz. The probe is equipped with a suitable ultrasonic coupling device to ensure good coupling for the surface of the bonded structure. Typically, the ultrasonic coupling device is an ultrasonic phased array probe wedge using a flexible water bladder as the coupling surface.

[0028] Specifically, low-frequency ultrasonic probes can be sequentially deployed at various detection positions on the outer surface of the bonded structure to acquire initial ultrasonic echo signals corresponding to each detection position. Then, a first defect tracking gate is used to truncate each initial ultrasonic echo signal to obtain first ultrasonic echo signals. The maximum amplitude value is identified in each first ultrasonic echo signal as the first analysis result corresponding to the detection position. Further, based on the first analysis result corresponding to each detection position and the preset correspondence between amplitude and pixel value, the pixel value corresponding to each detection position is obtained, and a first defect detection image is generated based on this pixel value.

[0029] Similarly, using the same steps as described above, a secondary analysis is performed on each initial ultrasonic echo signal based on the second defect tracking gate to obtain the second analysis result corresponding to each detection location. Based on this second analysis result, a corresponding second defect detection image is generated. The first and second analysis results corresponding to each detection location together constitute its corresponding signal analysis result.

[0030] The analysis of the initial ultrasonic echo signal based on the first defect tracking gate and the second defect tracking gate to obtain the signal analysis results corresponding to each detection position may include: The initial ultrasonic echo signal is sparsified to obtain the target ultrasonic echo signal; Extract the first ultrasonic echo signal corresponding to the first defect tracking gate and the second ultrasonic echo signal corresponding to the second defect tracking gate from the target ultrasonic echo signal; The amplitude of the first ultrasonic echo signal is compared with that of the first defect tracking gate to obtain a first analysis result, and the amplitude of the second ultrasonic echo signal is compared with that of the second defect tracking gate to obtain a second analysis result. The signal analysis result is obtained based on the first analysis result and the second analysis result.

[0031] In this embodiment, after acquiring the initial ultrasonic echo signal, it can be first subjected to sparsification processing, for example, by sampling the reflected echoes from each interface, to obtain the target ultrasonic echo signal. Then, the first ultrasonic echo signal whose abscissa falls within the range of the first defect tracking gate, and the second ultrasonic echo signal whose abscissa falls within the range of the second defect tracking gate, are extracted from the target ultrasonic echo signal. Next, the amplitude of each peak of the first ultrasonic echo signal is compared with the amplitude of the first defect tracking gate. If the amplitude of a certain peak is detected to be greater than the amplitude of the first defect tracking gate, the maximum amplitude of the detected peak is obtained as the first analysis result. If the amplitude of all peaks is less than or equal to the amplitude of the first defect tracking gate, a preset amplitude (a preset smaller value) is used as the first analysis result. Similarly, the amplitude of each peak of the second ultrasonic echo signal is compared with the amplitude of the second defect tracking gate to obtain the second analysis result. Finally, the first and second analysis results are combined to obtain the final signal analysis result.

[0032] The advantage of the above settings is that they can reduce the computational load of signal analysis, thereby improving the efficiency of defect detection.

[0033] The comparison of the amplitude of the first ultrasonic echo signal with the first defect tracking gate to obtain the first analysis result may include: Determine whether there is a candidate peak in the first ultrasonic echo signal with an amplitude greater than that of the first defect tracking gate. If so, determine the target peak among the candidate peaks. Obtain the target time corresponding to the target peak, and obtain the first analysis result based on the target time.

[0034] In this embodiment, if the amplitude of a peak in the first ultrasonic echo signal is greater than the amplitude of the first defect tracking gate, this peak is identified as a candidate peak. Then, the first peak to appear among all candidate peaks is selected as the target peak (the first peak within the gate that is higher than the gate height). Further, the abscissa of the target peak is obtained to determine its corresponding target time, and this target time is used as the first analysis result. A larger target time indicates a greater defect depth.

[0035] The technical solution of this invention involves obtaining a first depth of the interface between the surface metal skin and the composite material skin in an adhesive structure, and a second depth of the interface between the composite material skin and the adhesive film; calculating the echo delay based on the first and second depths, and generating a first defect tracking gate and a second defect tracking gate based on the echo delay; performing defect detection based on the first and second defect tracking gates to obtain a defect detection image, and obtaining the defect detection result based on the defect detection image; by determining the corresponding echo delay based on the depth of the interface between different materials, and generating a corresponding defect tracking gate based on the echo delay, the effective ultrasonic echo signal can be extracted, thereby accurately determining the effective range of the ultrasonic reflection signal and improving the accuracy of defect detection.

[0036] Example 2 Figure 5 This is a flowchart illustrating a defect detection method for adhesive structures according to Embodiment 2 of the present invention. This embodiment is a further refinement of the above technical solution, and the technical solution in this embodiment can be combined with one or more of the above implementation methods. Figure 5 As shown, the method includes: S210. Obtain the first depth of the interface between the surface metal skin and the composite material skin in the adhesive structure, and the second depth of the interface between the composite material skin and the adhesive film.

[0037] S220. Obtain the first sound velocity corresponding to the surface metal skin and the second sound velocity corresponding to the composite material skin.

[0038] In this embodiment, the first sound velocity corresponding to the surface metal skin can be obtained based on the material type of the surface metal skin and a preset correspondence between material type and sound velocity. Simultaneously, the second sound velocity corresponding to the composite material skin can be obtained based on the material type of the composite material skin and a preset correspondence between material type and sound velocity.

[0039] S230. The echo delay is calculated based on the first depth, the second depth, the first sound speed, and the second sound speed.

[0040] Specifically, based on the current first depth and first sound velocity, the corresponding first delay can be obtained by looking up the preset correspondence between depth, sound velocity, and delay. Next, the depth difference between the second depth and the first depth can be calculated, and based on the depth difference and the second sound velocity, the corresponding second delay can be obtained by looking up the preset correspondence between depth, sound velocity, and delay. Finally, the sum of the first delay and the second delay can be calculated as the echo delay.

[0041] The echo delay calculated based on the first depth, the second depth, the first sound velocity, and the second sound velocity may include: The depth difference between the second depth and the first depth is calculated; The first delay is calculated based on the first depth and the first sound speed, and the second delay is calculated based on the depth difference and the second sound speed. The echo delay is calculated based on the first delay and the second delay.

[0042] In this embodiment, it can be based on the formula t1=n ( / +( - ) / The echo delay t1 is calculated, where, Indicates the first depth. Indicates the first speed of sound. Indicates the second depth. This represents the second speed of sound, where n is a constant, typically 2 or 3.

[0043] S240. Obtain the thickness of the honeycomb layer in the adhesive structure, and the third sound velocity corresponding to the honeycomb layer.

[0044] In this embodiment, when setting the first defect tracking gate and the second defect tracking gate, the thickness of the cellular layer can be taken into account, ensuring that the first and second defect tracking gates cover at least half the thickness of the cellular layer. It is understood that the first and second defect tracking gates may overlap.

[0045] Specifically, based on the parameter configuration document of the adhesive structure, the thickness and material type of the honeycomb layer in the adhesive structure are identified, and based on the current material type, the third sound velocity corresponding to the honeycomb layer is obtained by finding the correspondence between the preset material type and the sound velocity.

[0046] S250. Based on the thickness and the third sound velocity, the propagation duration is calculated, and based on the echo delay and the propagation duration, the first defect tracking gate and the second defect tracking gate are generated.

[0047] Next, half the thickness is divided by the third sound velocity to obtain the quotient value as the propagation time. The echo delay is used as the starting position, and the propagation time is used as the width to generate the first defect tracking gate. Then, the ending position of the first defect tracking gate is used as the starting position, and the bottom echo as the ending position to generate the second defect tracking gate. The bottom echo can be measured in advance. For example, it can be based on the formula t2=h m-c / V m +(h c-g -h m-c ) / V c +(1-1 / n) (h) core-g -h c-g ) / V core According to the thickness h core-g and the third speed of sound V core t2 is calculated, and then the first defect tracking gate and the second defect tracking gate are determined based on t1 and t2.

[0048] S260. Perform defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, and obtain a defect detection result based on the defect detection image.

[0049] The technical solution of this invention involves obtaining a first sound velocity corresponding to the surface metal skin and a second sound velocity corresponding to the composite material skin; calculating the echo delay based on the first depth, the second depth, the first sound velocity, and the second sound velocity; and improving the accuracy of the echo delay by jointly determining the echo delay based on the depth and sound velocity corresponding to the surface metal skin and the composite material skin. The thickness of the honeycomb layer in the adhesive structure and a third sound velocity corresponding to the honeycomb layer are obtained; the propagation time is calculated based on the thickness and the third sound velocity; and a first defect tracking gate and a second defect tracking gate are generated based on the echo delay and the propagation time. By calculating the propagation time of the ultrasonic wave in the honeycomb layer and combining the echo delay and the propagation time to set the gates, the rationality of the gate settings can be improved, and the accuracy of defect detection can be enhanced.

[0050] The technical solution of this invention, by combining probe frequency selection and ultrasonic testing technology selection, ultrasonic signal sparsity processing, and ultrasonic signal imaging data source setting, can achieve effective non-destructive testing of delamination and debonding defects in metal-composite-honeycomb bonded structures. It overcomes the shortcomings of traditional pulsed ultrasonic reflection methods, such as inability to inspect these structures, difficulty in defect identification, and inability to identify defect depth, and supports visualized imaging of the test results. Secondly, it is applicable to various testing technologies, including conventional single-probe ultrasonic testing and ultrasonic phased array testing, demonstrating strong technical scalability. If ultrasonic phased array testing technology is used, its beam deflection and focusing characteristics can be combined to further improve detection sensitivity and resolution. Furthermore, based on pulsed ultrasonic reflection technology, full-coverage testing of the part can be completed from the metal skin side of the structure, eliminating the need for traditional pulse penetration methods for defect localization. Combining pulsed reflection with defect characterization improves testing efficiency and allows for the acquisition of more defect-related information at once. Finally, for U-shaped metal-skin-honeycomb bonded structures, testing can be completed directly from the aerodynamic surface of the part, suitable for aircraft service operations, enabling defect inspection without disassembling the part.

[0051] Example 3 Figure 6 This is a schematic diagram of a defect detection device for adhesive structures provided in Embodiment 3 of the present invention. Figure 6 As shown, the device includes: a depth acquisition module 310, a gate generation module 320, and a result acquisition module 330; wherein, The depth acquisition module 310 is used to acquire the first depth of the interface between the surface metal skin and the composite material skin in the adhesive structure, and the second depth of the interface between the composite material skin and the adhesive film. The gate generation module 320 is used to calculate the echo delay based on the first depth and the second depth, and generate a first defect tracking gate and a second defect tracking gate based on the echo delay. The result acquisition module 330 is used to perform defect detection based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, and to obtain a defect detection result based on the defect detection image.

[0052] The technical solution of this invention involves obtaining a first depth of the interface between the surface metal skin and the composite material skin in an adhesive structure, and a second depth of the interface between the composite material skin and the adhesive film; calculating the echo delay based on the first and second depths, and generating a first defect tracking gate and a second defect tracking gate based on the echo delay; performing defect detection based on the first and second defect tracking gates to obtain a defect detection image, and obtaining the defect detection result based on the defect detection image; by determining the corresponding echo delay based on the depth of the interface between different materials, and generating a corresponding defect tracking gate based on the echo delay, the effective ultrasonic echo signal can be extracted, thereby accurately determining the effective range of the ultrasonic reflection signal and improving the accuracy of defect detection.

[0053] Optionally, the gate generation module 320 includes: The sound velocity acquisition unit is used to acquire the first sound velocity corresponding to the surface metal skin and the second sound velocity corresponding to the composite material skin. The delay calculation unit is used to calculate the echo delay based on the first depth, the second depth, the first sound speed, and the second sound speed.

[0054] Optionally, a delay calculation unit is specifically used to calculate the depth difference between the second depth and the first depth; The first delay is calculated based on the first depth and the first sound speed, and the second delay is calculated based on the depth difference and the second sound speed. The echo delay is calculated based on the first delay and the second delay.

[0055] Optionally, the gate generation module 320 also includes: A thickness acquisition unit is used to acquire the thickness of the honeycomb layer in the adhesive structure, and the third sound velocity corresponding to the honeycomb layer; The gate generation unit is used to calculate the propagation time based on the thickness and the third sound velocity, and to generate the first defect tracking gate and the second defect tracking gate based on the echo delay and the propagation time.

[0056] Optionally, the result acquisition module 330 includes: The signal acquisition unit is used to acquire the initial ultrasonic echo signal corresponding to each detection position of the adhesive structure through a low-frequency ultrasonic probe. An image generation unit is used to analyze the initial ultrasonic echo signal based on the first defect tracking gate and the second defect tracking gate to obtain the signal analysis results corresponding to each detection position, and to generate the defect detection image based on the signal analysis results.

[0057] Optionally, the image generation unit includes: A signal sparsity subunit is used to perform sparsification processing on the initial ultrasonic echo signal to obtain the target ultrasonic echo signal. The signal extraction subunit is used to extract the first ultrasonic echo signal corresponding to the first defect tracking gate and the second ultrasonic echo signal corresponding to the second defect tracking gate from the target ultrasonic echo signal. An amplitude comparison subunit is used to compare the amplitude of the first ultrasonic echo signal with the first defect tracking gate to obtain a first analysis result, and to compare the amplitude of the second ultrasonic echo signal with the second defect tracking gate to obtain a second analysis result. The result acquisition subunit is used to acquire the signal analysis result based on the first analysis result and the second analysis result.

[0058] Optionally, the amplitude comparison subunit is specifically used to determine whether there is a candidate peak in the first ultrasonic echo signal with an amplitude greater than that of the first defect tracking gate. If so, the target peak is determined from the candidate peaks. Obtain the target time corresponding to the target peak, and obtain the first analysis result based on the target time.

[0059] The defect detection device for adhesive structures provided in the embodiments of the present invention can execute the defect detection method for adhesive structures provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of executing the method.

[0060] The collection, storage, use, processing, transmission, provision, and disclosure of user personal information involved in the technical solution disclosed herein comply with the provisions of relevant laws and regulations and do not violate public order and good morals.

[0061] Example 4 Figure 7 A schematic diagram of an electronic device 40 that can be used to implement embodiments of the present invention is shown. The electronic device 40 is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device 40 can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0062] like Figure 7As shown, the electronic device 40 includes at least one processor 41 and a memory, such as a read-only memory (ROM) 42 or a random access memory (RAM) 43, communicatively connected to the at least one processor 41. The memory stores computer programs executable by the at least one processor. The processor 41 can perform various appropriate actions and processes based on the computer program stored in the read-only memory 42 or loaded from the storage unit 48 into the random access memory 43. The RAM 43 can also store various programs and data required for the operation of the electronic device 40. The processor 41, ROM 42, and RAM 43 are interconnected via a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44.

[0063] Multiple components in electronic device 40 are connected to I / O interface 45, including: input unit 46, such as keyboard, mouse, etc.; output unit 47, such as various types of monitors, speakers, etc.; storage unit 48, such as disk, optical disk, etc.; and communication unit 49, such as network card, modem, wireless transceiver, etc. Communication unit 49 allows electronic device 40 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0064] Processor 41 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 41 include, but are not limited to, central processing units, graphics processing units, various special-purpose artificial intelligence computing chips, various processors running machine learning model algorithms, digital signal processors, and any suitable processor, controller, microcontroller, etc. Processor 41 performs the various methods and processes described above, such as defect detection methods for glued structures.

[0065] In some embodiments, the defect detection method for adhesive structures can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 48. In some embodiments, part or all of the computer program can be loaded and / or installed on electronic device 40 via ROM 42 and / or communication unit 49. When the computer program is loaded into RAM 43 and executed by processor 41, one or more steps of the defect detection method for adhesive structures described above can be performed. Alternatively, in other embodiments, processor 41 can be configured to perform the defect detection method for adhesive structures by any other suitable means (e.g., by means of firmware).

[0066] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays, application-specific integrated circuits (ASICs), application-specific standard products (ASICs), system-on-a-chip (SoCs), complex programmable logic devices, computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0067] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0068] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory, read-only memory, erasable programmable read-only memory, optical fibers, portable compact disk read-only memory, optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0069] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device 40, which includes: a display device (e.g., a cathode ray tube or liquid crystal display) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device 40. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0070] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0071] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact via a communication network. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server.

[0072] This embodiment may also include a computer program product, which includes a computer program that, when executed by a processor, implements the defect detection method for adhesive structures provided in any embodiment of the present invention.

[0073] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0074] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for detecting defects in adhesive-bonded structures, characterized in that, include: The first depth of the interface between the surface metal skin and the composite material skin in the adhesive structure, and the second depth of the interface between the composite material skin and the adhesive film are obtained. Based on the first depth and the second depth, the echo delay is calculated, and based on the echo delay, a first defect tracking gate and a second defect tracking gate are generated; Defect detection is performed based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, and a defect detection result is obtained based on the defect detection image.

2. The method according to claim 1, characterized in that, The echo delay is calculated based on the first depth and the second depth, including: Obtain the first sound velocity corresponding to the surface metal skin and the second sound velocity corresponding to the composite material skin; The echo delay is calculated based on the first depth, the second depth, the first sound velocity, and the second sound velocity.

3. The method according to claim 2, characterized in that, The echo delay is calculated based on the first depth, the second depth, the first sound velocity, and the second sound velocity, including: The depth difference between the second depth and the first depth is calculated; The first delay is calculated based on the first depth and the first sound speed, and the second delay is calculated based on the depth difference and the second sound speed. The echo delay is calculated based on the first delay and the second delay.

4. The method according to claim 1, characterized in that, Based on the echo delay, a first defect tracking gate and a second defect tracking gate are generated, including: Obtain the thickness of the honeycomb layer in the adhesive structure, and the third sound velocity corresponding to the honeycomb layer; Based on the thickness and the third sound velocity, the propagation time is calculated, and based on the echo delay and the propagation time, the first defect tracking gate and the second defect tracking gate are generated.

5. The method according to claim 1, characterized in that, Defect detection is performed based on the first defect tracking gate and the second defect tracking gate to obtain a defect detection image, including: The initial ultrasonic echo signal corresponding to each detection position of the adhesive structure is obtained by using a low-frequency ultrasonic probe. The initial ultrasonic echo signal is analyzed based on the first defect tracking gate and the second defect tracking gate to obtain the signal analysis results corresponding to each detection position, and the defect detection image is generated based on the signal analysis results.

6. The method according to claim 5, characterized in that, The initial ultrasonic echo signal is analyzed based on the first defect tracking gate and the second defect tracking gate to obtain the signal analysis results corresponding to each detection position, including: The initial ultrasonic echo signal is sparsified to obtain the target ultrasonic echo signal; Extract the first ultrasonic echo signal corresponding to the first defect tracking gate and the second ultrasonic echo signal corresponding to the second defect tracking gate from the target ultrasonic echo signal; The amplitude of the first ultrasonic echo signal is compared with that of the first defect tracking gate to obtain a first analysis result, and the amplitude of the second ultrasonic echo signal is compared with that of the second defect tracking gate to obtain a second analysis result. The signal analysis result is obtained based on the first analysis result and the second analysis result.

7. The method according to claim 6, characterized in that, The amplitude of the first ultrasonic echo signal is compared with that of the first defect tracking gate to obtain a first analysis result, including: Determine whether there is a candidate peak in the first ultrasonic echo signal with an amplitude greater than that of the first defect tracking gate. If so, determine the target peak among the candidate peaks. Obtain the target time corresponding to the target peak, and obtain the first analysis result based on the target time.

8. An electronic device, characterized in that, The electronic device includes: At least one processor, and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the defect detection method for the adhesive structure according to any one of claims 1-7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the defect detection method for the adhesive structure according to any one of claims 1-7.

10. A computer program product, characterized in that, The method includes a computer program that, when executed by a processor, implements the defect detection method for the adhesive structure according to any one of claims 1-7.

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