MEMS probe device
By incorporating a guide plate and elastic arm structure into the MEMS probe device, the problem of unstable connection caused by probe tail offset was solved, achieving stable docking and signal transmission between the probe and the wafer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SOLARIS NANOFAB LTD
- Filing Date
- 2026-01-29
- Publication Date
- 2026-05-05
AI Technical Summary
In the wafer inspection process, existing MEMS probe cards are prone to the probe tail slipping out of the pad area, leading to unstable connection or probe jamming. Furthermore, existing solutions increase friction, which may cause poor contact.
The probe body is constructed by using a first guide plate and a second guide plate arranged in a preset direction. The probe body passes through the through hole of the guide plate and is provided with an elastic arm and a receiving notch. The elastic deformation of the elastic arm is used to provide guidance and stable connection by abutting the support end against the hole wall of the guide plate.
This effectively reduces the offset range of the probe tip relative to the multilayer organic substrate, ensuring a stable connection between the probe and the wafer and avoiding poor connection and probe jamming issues.
Smart Images
Figure CN121978374A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer inspection equipment technology, and more particularly to MEMS probe devices. Background Technology
[0002] MEMS is an abbreviation for Micro Electro Mechanical Systems. MEMS is a collective term for systems that process various input and output signals. In the wafer fabrication process, MEMS probe cards are used for wafer inspection to determine the quality of chips on the wafer.
[0003] In related technologies, such as Figure 1 As shown, the existing MEMS probe card includes an existing MLO (Multi-Layer Organic) substrate 1, an existing upper guide plate 2, an existing lower guide plate 3, and an existing probe 4. The tip of the existing probe 4 passes through the existing upper guide plate 2 and the existing lower guide plate 3 in sequence and then abuts against the wafer 2000. The existing MLO substrate 1 abuts against the tail of the existing probe 4 to achieve detection of the wafer 2000. Figure 2 As shown, when wafer 2000 rises, it causes the existing probe 4 to elastically deform. At this time, the probe tip of the existing probe 4 can be bent in a specified direction by controlling the offset direction of the existing lower guide plate 3. During the elastic deformation of the existing probe 4, the probe tail may shift relative to the existing MLO substrate 1. Due to the small pad area on the existing MLO substrate 1, combined with the effects of assembly tolerances and temperature, the probe tail of the existing probe 4 is prone to slipping to the edge of the pad or out of the pad area, resulting in unstable connections such as burnt probes and no signal. Current methods reduce the hole gap between the existing probe 4 and the existing upper guide plate 2 to limit the probe tail movement range. However, this causes the existing probe 4 to press tightly against the existing upper guide plate 2, increasing the friction between them, reducing the contact force between the existing probe 4 and the existing MLO substrate 1, and even causing the probe to get stuck, increasing the risk of poor contact.
[0004] Therefore, there is an urgent need to invent a MEMS probe device to solve the above problems. Summary of the Invention
[0005] The purpose of this invention is to provide a MEMS probe device to achieve a stable connection between the probe and the multilayer organic substrate and the wafer, and to reduce the offset range of the probe tail relative to the multilayer organic substrate.
[0006] To achieve this objective, the present invention adopts the following technical solution: MEMS probe device, including: A probe, comprising a needle tip, a body, and a needle tail connected in sequence; A first guide plate and a second guide plate are arranged sequentially along a preset direction. The first guide plate has a first through hole extending along the preset direction, and the second guide plate has a second through hole extending along the preset direction. The main body passes through the first through hole and the second through hole sequentially along the preset direction. The needle is used to dock with the wafer. A multilayer organic substrate is disposed at the end of the first guide plate away from the second guide plate, and the needle tail is configured to dock with the multilayer organic substrate; The main body has an elastic arm and a receiving notch, the receiving notch is directly opposite the first through hole, the elastic arm extends along the preset direction and is fixed in the receiving notch, the elastic arm has a supporting end, the elastic arm can elastically deform toward the side closer to the main body, the supporting end extends out of the outer peripheral wall of the main body and abuts against the hole wall of the first through hole, so that the end of the main body away from the elastic arm abuts against the hole wall of the first through hole.
[0007] As an optional solution, the receiving notch includes two groove walls arranged opposite each other along the preset direction and a groove bottom located between the two groove walls, the elastic arm is fixedly connected to the groove wall, and there is a gap between the elastic arm and the groove bottom.
[0008] As an optional solution, the elastic arm has a first extended protrusion located at the end of the elastic arm away from the bottom of the groove, and one axial end of the elastic arm is fixedly connected to the groove wall near the needle tip in one of the two groove walls. The first extended protrusion is located at the end of the elastic arm near the needle tail along the preset direction, and the first extended protrusion serves as the support end.
[0009] As an alternative, the height of the first extensional protrusion gradually increases as it extends from the end near the needle tip toward the end near the needle tail along the preset direction.
[0010] As an optional solution, when the elastic arm does not undergo elastic deformation, the distance by which the first extension protrusion extends beyond the main body is K, and the vertical distance between the elastic arm and the bottom of the groove is M, wherein K is less than M.
[0011] As an optional solution, the two ends of the elastic arm along the preset direction are respectively fixedly connected to the groove wall, and a second extension protrusion is provided at the center position of the elastic arm along the preset direction. The second extension protrusion protrudes in a direction away from the bottom of the groove and can generate elastic deformation towards the end closer to the bottom of the groove. The second extension protrusion serves as the support end.
[0012] As an alternative, the diameter of the needle tip gradually decreases as it extends along the preset direction from the end near the needle tail towards the end near the needle tip.
[0013] As an alternative, the diameter of the needle tail gradually decreases as it extends from the end near the needle tip toward the end near the needle tail along the preset direction.
[0014] As an optional solution, the outer peripheral wall of the main body is provided with an abutment protrusion, which can abut against the first guide plate along the preset direction.
[0015] As an optional solution, the MEMS probe device has a plurality of probes and a plurality of multilayer organic substrates. The first guide plate has a plurality of first through holes, and the second guide plate has a plurality of second through holes. Each probe is correspondingly disposed with a multilayer organic substrate, a first through hole, and a second through hole.
[0016] The beneficial effects of this invention are: The MEMS probe device provided by this invention comprises a first guide plate and a second guide plate arranged sequentially along a preset direction, with a multilayer organic substrate disposed at the end of the first guide plate away from the second guide plate. A first through hole is formed in the first guide plate, and a second through hole is formed in the second guide plate. The probe body passes through the first through hole and the second through hole sequentially along the preset direction, providing guidance for the movement of the probe. The probe tip aligns with the wafer, and the probe tail aligns with the multilayer organic substrate, satisfying the signal transmission requirements of the probe. By providing an elastic arm and a receiving notch in the probe body, with the receiving notch facing the first through hole, the elastic arm extending along the preset direction is fixed in the receiving notch. A support end is provided at the other axial end of the elastic arm, extending out of the outer periphery of the body and abutting against the hole wall of the first through hole. This abuts the end of the body away from the elastic arm against the hole wall of the first through hole. By utilizing the elastic deformation of the elastic arm toward the side closer to the body, the offset range of the probe tail relative to the multilayer organic substrate can be significantly reduced. Specifically, the distance between the end of the needle tail that connects to the multilayer organic substrate and the first guide plate is defined as H. During the needle tail deflection process, the distance difference between the end of the needle tail that connects to the multilayer organic substrate and the first guide plate is negligible, and H can be considered a constant. The thickness of the first guide plate along a preset direction is defined as T. The diameter of the first through hole is defined as W. The diameter of the main body is defined as D. The maximum deflection angle of the main body is defined as θ. The maximum offset of the end of the needle tail that connects to the multilayer organic substrate when the main body switches from a state extending vertically and abutting the first through hole to the maximum deflection angle is defined as L0. ,and ,Right now In the existing solution, the maximum offset of the probe tail at the end that interfaces with the multilayer organic substrate when the probe deflects to its maximum deflection angle is defined as L1. L1 can be broken down into L... 11 and L 12 L 11 L is the maximum offset of the needle tail rotating in the positive direction. 12 This represents the maximum offset of the needle tail rotating in the opposite direction. , , And thus obtain H is much smaller than The actual size of L0 is much smaller than that of L1, thus effectively reducing the offset range of the probe tail relative to the multilayer organic substrate. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the first structure of the MEMS probe card and wafer in the existing solution; Figure 2 This is a schematic diagram of the second structure of the MEMS probe card and wafer in the existing solution; Figure 3 This is a schematic diagram of the third structure of the MEMS probe card and wafer in the existing solution; Figure 4 This is a dimension annotation diagram of the MEMS probe card in the existing solution; Figure 5 This is a schematic diagram of the structure of the MEMS probe device and the wafer in the state where the elastic arm is not connected to the first through hole, according to Embodiment 1 of the present invention. Figure 6 This is a schematic diagram of the first structure of the MEMS probe device and the wafer in the state where the elastic arm is docked with the first through hole, according to Embodiment 1 of the present invention. Figure 7 This is a schematic diagram of the second structure of the MEMS probe device and the wafer in the state where the elastic arm is docked with the first through hole, according to Embodiment 1 of the present invention. Figure 8 This is a dimension annotation diagram of the MEMA probe device provided in Embodiment 1 of the present invention; Figure 9 A schematic diagram of the structure of a portion of the main body, the needle tail, and the multilayer organic substrate when the main body is not bent, provided in Embodiment 1 of the present invention; Figure 10 This is a schematic diagram of the structure of a portion of the main body, the needle tail, and the multilayer organic substrate when the main body is bent, as provided in Embodiment 1 of the present invention. Figure 11 This is a schematic diagram of the probe structure provided in Embodiment 2 of the present invention.
[0018] In the picture: 1. Existing MLO substrate; 2. Existing upper guide plate; 3. Existing lower guide plate; 4. Existing probe; 100. First guide plate; 110. First through hole; 200. Second guide plate; 210. Second through hole; 300, Probe; 310, Body; 311, Elastic Arm; 3111, First Extensional Protrusion; 3112, Second Extensional Protrusion; 312, Receiving Notch; 313, Abutting Boss; 320, Needle Head; 330, Needle Tail; 400, Multilayer organic substrate; 2000, wafer. Detailed Implementation
[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0020] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0021] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0022] Example 1 The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0023] like Figure 1As shown, the existing MEMS probe card includes an existing MLO (Multi-Layer Organic) substrate 1, an existing upper guide plate 2, an existing lower guide plate 3, and an existing probe 4. The tip of the existing probe 4 passes through the existing upper guide plate 2 and the existing lower guide plate 3 in sequence and then abuts against the wafer 2000. The existing MLO substrate 1 abuts against the tail of the existing probe 4 to achieve detection of the wafer 2000. Figure 2 and Figure 3 As shown, when wafer 2000 rises, it causes the existing probe 4 to elastically deform. At this time, the probe tip of the existing probe 4 can be bent in a specified direction by controlling the offset direction of the existing lower guide plate 3. During the elastic deformation of the existing probe 4, the probe tail may shift relative to the existing MLO substrate 1. Due to the small pad area on the existing MLO substrate 1, combined with the effects of assembly tolerances and temperature, the probe tail of the existing probe 4 is prone to slipping to the edge of the pad or out of the pad area, resulting in unstable connections such as burnt probes and no signal. Current methods reduce the hole gap between the existing probe 4 and the existing upper guide plate 2 to limit the probe tail movement range. However, this causes the existing probe 4 to press tightly against the existing upper guide plate 2, increasing the friction between them, reducing the contact force between the existing probe 4 and the existing MLO substrate 1, and even causing the probe to get stuck, increasing the risk of poor contact.
[0024] Specifically, such as Figure 4 As shown, the distance between the end of the needle tail that abuts with the existing MLO substrate 1 and the existing upper guide plate 2 is defined as H. Understandably, during the needle tail deflection process, the distance difference between the end of the needle tail that abuts with the existing MLO substrate 1 and the existing upper guide plate 2 is negligible, and H can be considered a constant. The thickness of the existing upper guide plate 2 is defined as T, the diameter of the hole in the existing upper guide plate 2 through which the existing probe 4 passes is defined as W, the diameter of the existing probe 4 is defined as D, the maximum deflection angle of the existing probe 4 is defined as θ, and the maximum offset of the end of the needle tail that abuts with the existing MLO substrate 1 when the existing probe 4 deflects to its maximum deflection angle is defined as L1. L1 can be decomposed into L... 11 and L 12 L 11 L is the maximum offset of the needle tail rotating in the positive direction. 12 This represents the maximum offset of the needle tail rotating in the opposite direction. , , ,Right now .
[0025] This embodiment provides a MEMS probe device, such as Figures 5-8As shown, the MEMS probe device includes a probe 300, a first guide plate 100, a second guide plate 200, and a multilayer organic substrate 400. The first guide plate 100 and the second guide plate 200 are arranged sequentially along a predetermined direction. The probe 300 includes a needle tip 320, a body 310, and a needle tail 330 connected sequentially. The first guide plate 100 has a first through hole 110 extending along the predetermined direction, and the second guide plate 200 has a second through hole 210 extending along the predetermined direction. The body 310 passes through the first through hole 110 and the second through hole 210 sequentially along the predetermined direction. The needle tip 320 is used for docking with a wafer 2000 and a multilayer organic substrate 400. The substrate 400 is disposed at the end of the first guide plate 100 away from the second guide plate 200. The needle tail 330 is configured to dock with the multilayer organic substrate 400. The main body 310 has an elastic arm 311 and a receiving notch 312. The receiving notch 312 is directly opposite to the first through hole 110. The elastic arm 311 extends along a preset direction and is fixed in the receiving notch 312. The elastic arm 311 has a supporting end. The elastic arm 311 can elastically deform toward the side closer to the main body 310. The supporting end extends out of the outer peripheral wall of the main body 310 and abuts against the hole wall of the first through hole 110, so that the end of the main body 310 away from the elastic arm 311 abuts against the hole wall of the first through hole 110.
[0026] This MEMS probe device comprises a first guide plate 100 and a second guide plate 200 arranged sequentially along a preset direction, with a multilayer organic substrate 400 disposed at the end of the first guide plate 100 away from the second guide plate 200. A first through hole 110 is formed in the first guide plate 100, and a second through hole 210 is formed in the second guide plate 200. The body 310 of the probe 300 passes sequentially through the first through hole 110 and the second through hole 210 along the preset direction, providing guidance for the movement of the probe 300. This allows the probe tip 320 to mate with the wafer 2000, and the probe tail 330 to mate with the multilayer organic substrate 400, satisfying the requirements of probe... To meet the signal transmission requirements of the needle 300, an elastic arm 311 and a receiving notch 312 are provided on the main body 310 of the probe 300. The receiving notch 312 is aligned with the first through hole 110. The elastic arm 311, which extends in a preset direction, is fixed in the receiving notch 312. A support end is provided on the elastic arm 311, which extends out of the outer periphery of the main body 310 and abuts against the hole wall of the first through hole 110. This allows the end of the main body 310 away from the elastic arm 311 to abut against the hole wall of the first through hole 110. By utilizing the elastic deformation of the elastic arm 311 toward the side closer to the main body 310, the offset range of the needle tail 330 relative to the multilayer organic substrate 400 can be significantly reduced.
[0027] Specifically, such as Figure 8As shown, the distance between the end of the needle tail 330 that abuts against the multilayer organic substrate 400 and the first guide plate 100 is defined as H. During the deflection of the needle tail 330, the distance difference between the end of the needle tail 330 that abuts against the multilayer organic substrate 400 and the first guide plate 100 is negligible, and H can be considered a constant. The thickness of the first guide plate 100 along a preset direction is defined as T, the diameter of the first through hole 110 is defined as W, the diameter of the main body 310 is defined as D, the maximum deflection angle of the main body 310 is defined as θ, and the maximum offset of the end of the needle tail 330 that abuts against the multilayer organic substrate 400 when the main body 310 switches from a state extending vertically and abutting against the first through hole 110 to the maximum deflection angle is defined as L0. ,and ,Right now .
[0028] H is much smaller than That is, the actual size of L0 is much smaller than L1. Therefore, the MEMS probe device provided in this embodiment can effectively reduce the offset range of the probe tail 330 of the probe 300 relative to the multilayer organic substrate 400.
[0029] It should be noted that in this embodiment, the preset direction is up and down. In other embodiments, the specific direction of the preset direction can be adjusted according to actual needs, and this embodiment does not impose any specific limitations.
[0030] In this embodiment, H = 0.15 mm, T = 0.25 mm, W = 0.03 mm, and D = 0.04 mm. Applying these data to the MEMA probe device provided in this embodiment and existing solutions respectively, the following values are obtained: tanθ = 0.04; L0 = 0.006 mm; L1 = L 11 +L 12 =0.016+0.006=0.022mm.
[0031] Understandably, the specific values of the distance H between the end of the needle tail 330 that docks with the multilayer organic substrate 400 and the first guide plate 100, the thickness T of the first guide plate 100 along the preset direction, the diameter W of the first through hole 110, and the diameter D of the main body 310 can all be adaptively adjusted according to actual needs, and this embodiment does not impose specific limitations.
[0032] like Figure 9 and Figure 10As shown, the receiving notch 312 includes two groove walls arranged opposite each other along a preset direction and a groove bottom located between the two groove walls. The elastic arm 311 is fixedly connected to the groove walls, and there is a gap between the elastic arm 311 and the groove bottom. By defining the two end faces arranged opposite each other along the preset direction within the receiving notch 312 as groove walls and the end face located between the two groove walls as the groove bottom, the elastic arm 311 is fixedly connected to the groove walls, and a gap is ensured between the elastic arm 311 and the groove bottom. This gap between the elastic arm 311 and the groove bottom can be used to increase the deformation space for the elastic arm 311 to deform sequentially toward the main body 310.
[0033] In this embodiment, the elastic arm 311 has a first extended protrusion 3111, which is located at the end of the elastic arm 311 away from the bottom of the groove. One axial end of the elastic arm 311 is fixedly connected to the groove wall near the needle tip 320 in one of the two groove walls. The first extended protrusion 3111 is located at the end of the elastic arm 311 along a predetermined direction near the needle tail 330, serving as a support end. By providing the first extended protrusion 3111 at the end of the elastic arm 311 away from the bottom of the groove, the axial end of the elastic arm 311 is fixedly connected to the groove wall near the needle tip 320 in one of the two groove walls. Furthermore, by placing the first extended protrusion 3111 at the end of the elastic arm 311 along a predetermined direction near the needle tail 330, and by having the first extended protrusion 3111 act as a support end abut against the wall of the first through hole 110, it is possible for the first extended protrusion 3111 to undergo elastic deformation towards the side closer to the main body 310.
[0034] In addition, the height of the first extensional protrusion 3111 gradually increases as it extends from the end near the needle tip 320 toward the end near the needle tail 330 along a preset direction, so as to form a guide slope on the first extensional protrusion 3111, so as to facilitate the first extensional protrusion 3111 entering the first through hole 110 and provide guidance for the docking of the first extensional protrusion 3111 and the first through hole 110.
[0035] As an optional solution, when the elastic arm 311 does not undergo elastic deformation, the distance by which the first extended protrusion 3111 extends beyond the main body 310 is K, and the vertical distance between the elastic arm 311 and the bottom of the groove is M, where K is less than M. When the first extended protrusion 3111 undergoes elastic deformation towards the side closer to the main body 310 under the action of the hole wall of the first through hole 110, the entire extension of the first extended protrusion 3111 beyond the main body 310 can retract into the receiving notch 312, thereby solving the problem of interference between the elastic arm 311 and the main body 310 during the elastic deformation process.
[0036] In one alternative embodiment, the diameter of the needle tip 320 gradually decreases as it extends along a predetermined direction from the end near the needle tail 330 toward the end near the needle tip 320. By making the diameter of the needle tip 320 gradually decrease as it extends along a predetermined direction from the end near the needle tail 330 toward the end near the needle tip 320, it is convenient for the needle tip 320 to sequentially insert into and pass through the first through hole 110 and the second through hole 210 during the assembly of the probe 300 with the first guide plate 100 and the second guide plate 200.
[0037] Furthermore, the diameter of the needle tail 330 gradually decreases as it extends from the end near the needle tip 320 toward the end near the needle tail 330 along a preset direction. By making the diameter of the needle tail 330 gradually decrease as it extends from the end near the needle tip 320 toward the end near the needle tail 330 along a preset direction, the diameter of the end of the needle tail 330 that interfaces with the multilayer organic substrate 400 can be reduced, allowing the needle tail 330 to be adapted to the multilayer organic substrate 400 and meeting the interface requirements between the needle tail 330 and the multilayer organic substrate 400.
[0038] Optionally, the outer peripheral wall of the main body 310 is provided with an abutment boss 313, which can abut against the first guide plate 100 in a preset direction. By setting the abutment boss 313 to abut against the first guide plate 100 in a preset direction, the main body 310 and the first guide plate 100 can be stopped and fixed in the preset direction, thereby realizing the positioning and fixing of the elastic arm 311 and the first through hole 110, and ensuring the normal operation of the probe 300.
[0039] As an optional solution, the MEMS probe device has multiple probes 300 and multiple multilayer organic substrates 400. A first guide plate 100 has multiple first through holes 110, and a second guide plate 200 has multiple second through holes 210. Each probe 300 is correspondingly arranged with one multilayer organic substrate 400, one first through hole 110, and one second through hole 210. By setting multiple probes 300 and multiple multilayer organic substrates 400 within the MEMS probe device, and by respectively opening multiple first through holes 110 in the first guide plate 100 and multiple second through holes 210 in the second guide plate 200, so that each probe 300 is correspondingly arranged with one multilayer organic substrate 400, one first through hole 110, and one second through hole 210, the effect of multiple probes 300 working collaboratively can be achieved. It should be noted that, in this embodiment, the MEMS probe device has three probes 300, each probe 300 corresponding to a multilayer organic substrate 400, a first through-hole 110, and a second through-hole 210. In other embodiments, the specific number of probes 300, and the specific number of multilayer organic substrates 400, first through-holes 110, and second through-holes 210 can be adjusted according to actual needs; this embodiment does not impose specific limitations.
[0040] Example 2 This embodiment provides a MEMS probe device. The specific structure of the MEMS probe device provided in this embodiment is basically the same as that in Embodiment 1. The difference between the MEMS probe device provided in this embodiment and Embodiment 1 is that the specific structure of the elastic arm 311 is different.
[0041] Specifically, such as Figure 11 As shown, the two ends of the elastic arm 311 along a preset direction are fixedly connected to the tank wall. A second extended protrusion 3112 is provided at the center of the elastic arm 311 along the preset direction. The second extended protrusion 3112 protrudes away from the bottom of the tank and can elastically deform towards the end near the bottom of the tank, serving as a support end. By fixing the two ends of the elastic arm 311 along the preset direction to the tank wall and providing a second extended protrusion 3112 protruding away from the bottom of the tank at the center of the elastic arm 311 along the preset direction, the second extended protrusion 3112 can elastically deform towards the end near the bottom of the tank, serving as a support end, thus satisfying the working requirements of the elastic arm 311.
[0042] In addition, the second extension protrusion 3112 is a hemispherical protrusion that is fastened to the elastic arm 311. The hemispherical surface of the hemispherical protrusion can provide guidance for the docking of the second extension protrusion 3112 and the first through hole 110.
[0043] Understandably, in other embodiments, the elastic arm 311 can also be configured as a spring or other elastic structure, so that the spring or other elastic structure can extend out of the body 310 in the radial direction and can generate elastic deformation in the radial direction of the body 310, thereby achieving the purpose of reducing the offset range of the probe tail 330 of the probe 300 relative to the multilayer organic substrate 400.
[0044] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.
Claims
1. A MEMS probe device, characterized in that, include: The probe (300) includes a needle tip (320), a body (310), and a needle tail (330) connected in sequence. A first guide plate (100) and a second guide plate (200) are arranged sequentially along a preset direction. The first guide plate (100) has a first through hole (110) extending along the preset direction, and the second guide plate (200) has a second through hole (210) extending along the preset direction. The main body (310) passes through the first through hole (110) and the second through hole (210) sequentially along the preset direction. The needle (320) is used to dock with the wafer (2000). A multilayer organic substrate (400) is disposed at one end of the first guide plate (100) away from the second guide plate (200), and the needle tail (330) is configured to dock with the multilayer organic substrate (400); The main body (310) has an elastic arm (311) and a receiving notch (312). The receiving notch (312) is directly opposite to the first through hole (110). The elastic arm (311) extends along the preset direction and is fixed in the receiving notch (312). The elastic arm (311) has a supporting end. The elastic arm (311) can elastically deform toward the side closer to the main body (310). The supporting end extends out of the outer peripheral wall of the main body (310) and abuts against the hole wall of the first through hole (110), so that the end of the main body (310) away from the elastic arm (311) abuts against the hole wall of the first through hole (110).
2. The MEMS probe device according to claim 1, characterized in that, The receiving notch (312) includes two groove walls arranged opposite each other in sequence along the preset direction and a groove bottom located between the two groove walls. The elastic arm (311) is fixedly connected to the groove wall, and there is a gap between the elastic arm (311) and the groove bottom.
3. The MEMS probe device according to claim 2, characterized in that, The elastic arm (311) has a first extended protrusion (3111), which is located at one end of the elastic arm (311) away from the bottom of the groove. One axial end of the elastic arm (311) is fixedly connected to the groove wall of the two groove walls near the needle tip (320). The first extended protrusion (3111) is located at one end of the elastic arm (311) along the preset direction near the needle tail (330). The first extended protrusion (3111) serves as the support end.
4. The MEMS probe device according to claim 3, characterized in that, The height of the first extensional protrusion (3111) gradually increases as it extends along the preset direction from one end near the needle tip (320) toward the needle tail (330).
5. The MEMS probe device according to claim 3, characterized in that, When the elastic arm (311) does not undergo elastic deformation, the distance by which the first extension protrusion (3111) extends out of the main body (310) is K, and the vertical distance between the elastic arm (311) and the bottom of the groove is M, where K is less than M.
6. The MEMS probe device according to claim 2, characterized in that, The elastic arm (311) is fixedly connected to the groove wall at both ends along the preset direction. The elastic arm (311) is provided with a second extension protrusion (3112) at the center position along the preset direction. The second extension protrusion (3112) protrudes in a direction away from the bottom of the groove. The second extension protrusion (3112) can generate elastic deformation towards the end close to the bottom of the groove. The second extension protrusion (3112) serves as the support end.
7. The MEMS probe device according to claim 1, characterized in that, The diameter of the needle (320) gradually decreases as it extends along the preset direction from one end near the needle tail (330) toward the direction near the needle tip (320).
8. The MEMS probe device according to claim 1, characterized in that, The diameter of the needle tail (330) gradually decreases as it extends from the end near the needle tip (320) toward the needle tail (330) along the preset direction.
9. The MEMS probe device according to claim 1, characterized in that, The outer peripheral wall of the main body (310) is provided with an abutment boss (313), which can abut against the first guide plate (100) along the preset direction.
10. The MEMS probe device according to claim 1, characterized in that, The MEMS probe device has a plurality of probes (300) and a plurality of multilayer organic substrates (400). The first guide plate (100) has a plurality of first through holes (110), and the second guide plate (200) has a plurality of second through holes (210). Each probe (300) is correspondingly arranged with one multilayer organic substrate (400), one first through hole (110) and one second through hole (210).