CSP (Chip Scale Package) chip test equipment

Abstract

The invention relates to the technical field of chip testing, and discloses CSP packaging chip testing equipment which comprises a processing bin, a conveyor is installed in the processing bin, an operation table is arranged at the tail end of the conveyor, and a lifting table is installed at the top end of the operation table. According to the CSP chip testing equipment, detection is carried out based on the surface spiral moving track of the solder ball, the detection accuracy is greatly improved, a semicircular straight gear is driven to form a motion mode of self-rotation and revolution around a shaft through a composite transmission structure of the spherical surface transposition assembly, the probe assembly is driven to move along the outer spherical surface of the solder ball in a spiral track mode, and the detection accuracy is greatly improved. The single detection limitation of vertical contact of traditional equipment is thoroughly broken through, the problem of unstable electrical connection caused by a local oxide layer of the solder ball can be effectively avoided through the multi-point sampling mode, the surface detection point positions of the solder ball are comprehensively covered, the chip performance misjudgment risk caused by single-point contact misjudgment is remarkably reduced, and the real electrical performance state of the chip is precisely restored.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to CSP packaged chip testing equipment. Background Technology

[0002] CSP (Chip Scale Package) is a micro-packaging technology whose package size is close to that of the chip core. It features small size, low power consumption, and excellent electrical performance, and is widely used in consumer electronics, communications, automotive electronics and other fields. CSP packaged chip testing equipment is a key piece of equipment to ensure the yield and performance compliance of this type of chip. It runs through the finished product testing process after chip packaging, and its core function is to verify the electrical performance, functional integrity and reliability of the chip.

[0003] The prior art, disclosed in CN117554788B, provides a chip packaging and testing device, relating to the field of chip technology. It includes a carrier tray, a testing component, a feeding component, a base plate, and a unloading component. The carrier tray has three testing slots, each equipped with a blocking component. The feeding component feeds the chip into the testing slot, the blocking component limits the chip's position, and the testing component tests the chip. A transmission sleeve is fixedly connected to the center of the carrier tray, and two support rods are fixedly connected to the bottom of the carrier tray. An annular groove is formed on the base plate, and the support rods slide within the groove. A first electric telescopic rod is fixedly connected to the center of the base plate, and a push rod is fixedly connected to the end of the first electric telescopic rod. The push rod passes through the transmission sleeve, and its top is connected to the testing component. This device enables automatic chip unloading, loading, and testing, improving testing efficiency.

[0004] While existing technologies can automate chip loading, unloading, and testing, they still have significant limitations. They lack the ability to perform comprehensive multi-angle and multi-dimensional testing of solder balls in CSP-packaged chips. Current equipment generally employs a single testing method where probes are positioned vertically above the solder balls, allowing only vertical contact testing. If an oxide layer exists at the contact point, the probe cannot establish a stable electrical connection with the solder ball, making it difficult to accurately determine the chip's true performance status. Furthermore, damage during chip testing can stem from multiple wear and tear faults in the probe itself, such as contact failures between the probe and the solder ball. Surface contamination caused by contact – When probes come into contact with different chip solder balls, they are prone to adhering to contaminants such as solder particles and oxide debris. These contaminants can form an insulating layer at the probe tip, causing an abnormal increase in contact resistance during subsequent testing and leading to signal misjudgment. They can also cause secondary contamination to other solder balls, damaging the surface integrity of the solder balls. The existing probe damage judgment mechanism has a significant lag. Usually, the probe is only judged to be damaged after it has passed through multiple stations and all the corresponding chips have been reported as damaged. It is impossible to achieve timely identification of the probe status. This judgment delay can easily cause a large number of chips to be misjudged as defective products, resulting in unnecessary losses to the production end.

[0005] It is evident that there is an urgent need to develop a CSP packaged chip testing device to improve the single vertical probe contact mode of existing CSP packaged chip testing devices, as well as the defects of probe contamination and delayed damage detection. This device would also solve the problems mentioned in the background technology, such as poor contact and test misjudgment caused by solder ball oxide layer, self-contamination and secondary contamination of solder balls caused by solder particles and oxide debris attached to the probe, and batch loss of chips due to the inability to identify probe wear in a timely manner. Summary of the Invention

[0006] The purpose of this invention is to provide a CSP packaged chip testing device to solve the problems mentioned in the background art.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a CSP packaged chip testing equipment, including a processing chamber, a conveyor installed inside the processing chamber, an operating platform at the tail end of the conveyor, a lifting platform installed at the top of the operating platform, and a spherical transposition component integrated inside the lifting platform. A probe component for contact testing with solder balls is installed inside the spherical transposition component, and the spherical transposition component can drive the probe component to move spirally on the outer spherical surface of the solder balls. An adjacent station transposition contact linkage component is installed on one side of the probe component inside the spherical transposition component, and the adjacent station transposition contact linkage component can drive the probe component to tilt and descend to contact the solder balls of the adjacent station. The spherical transposition assembly includes multiple sets of first spherical transposition assemblies with identical structures. Each first spherical transposition assembly includes a first bevel gear. A second bevel gear meshes with the lower side of the first bevel gear. A transmission gear located inside the cage is connected to the center of the second bevel gear via a shaft. The transmission gear meshes with a semi-circular spur gear located below the cage. The adjacent station transposition contact linkage assembly and the probe assembly are both installed inside the semi-circular spur gear. The adjacent workstation switching contact linkage component includes a second helical gear, and a fixed frame is provided on one side of the second helical gear. One end of the fixed frame is connected to an arc-shaped gear, and a small gear meshes with one side of the arc-shaped gear. A large gear is connected to the front side of the small gear through a shaft. The large gear is located inside the rotating frame, and the large gear meshes with the lifting slider to drive its lifting and lowering. The lifting slider drives the lifting inner cylinder to lift and lower, and a three-contact spring probe that contacts the solder ball is installed at the bottom end of the lifting inner cylinder.

[0008] Preferably, an XY-axis moving track is installed above the operating table, and a clamp for fixing the chip tray is installed on the XY-axis moving track. A transfer mechanism is installed between the transport machine and the operating table, and the transfer mechanism is used to transport the chip tray transported on the transport machine to the XY-axis moving track. The XY-axis moving track consists of two sets of lead screws, corresponding to the X-axis and Y-axis respectively, and the position of the tray is adjusted by the linear movement of the XY-axis.

[0009] Preferably, the spherical transposition assembly includes a motor, and the output end of the motor is connected to a synchronous pulley set. The first spherical transposition assembly is located below the synchronous pulley set. The cage is located below the middle position of the first bevel gear, and the transmission gear rotates inside the cage. The second bevel gear is located on one side of the cage. The semi-circular spur gear rotates inside the cage. The synchronous pulley set includes multiple multi-groove pulleys and a belt wound on the outside. The number of multi-groove pulleys matches the number of first spherical transposition assemblies, so as to realize the synchronous operation of multiple sets of first spherical transposition assemblies.

[0010] Preferably, the adjacent workstation switching contact linkage component includes a drive motor, and the output end of the drive motor is connected to a first helical gear, which meshes with a second helical gear. The second helical gear passes through a fixed frame via a shaft and is connected to a rotating frame. The rotating frame is connected to a slide rail via a fixed cylinder. The lifting slider moves inside the slide rail. The lifting slider includes a wedge-shaped block, a rack, and a connecting part. The rack is disposed on one side of the wedge-shaped block and meshes with a large gear. The connecting part is fixed to the rear side of the wedge-shaped block and passes through the fixed cylinder to connect with the lifting inner cylinder. The wedge-shaped block contacts and engages with the slide rail.

[0011] Preferably, the probe assembly includes a fixed cylinder, and a spring is connected inside the fixed cylinder. The spring is penetrated by a lifting inner cylinder, and a worm gear is connected to the bottom end of the lifting inner cylinder. The three-contact spring probe is installed below the worm gear.

[0012] Preferably, the outer side of the fixed cylinder is connected to a hinge seat, and the hinge seat is hinged with a hinge claw inside. The number of hinge claws is three sets. The hinge claw includes a worm gear and a cleaning block. The worm gear is located at the head of the hinge claw and meshes with the worm. The cleaning block is located on the inner side of the tail of the hinge claw. The outer side of the fixed cylinder is provided with a groove, and the hinge claw moves in the groove.

[0013] Preferably, the number of the three-contact spring probes is three sets, and the three sets of three-contact spring probes respectively contact the three sets of cleaning blocks.

[0014] Compared with the prior art, the beneficial effects achieved by the present invention are: First, this invention relies on the detection of the spiral movement trajectory on the surface of the solder ball, which greatly improves the detection accuracy. Through the composite transmission structure of the spherical transposition component, the semi-circular spur gear is driven to form a motion mode of "self-rotation + revolution around the axis", which drives the probe component to move along the spiral trajectory of the outer spherical surface of the solder ball. This completely breaks through the limitation of single detection by vertical contact in traditional equipment. This multi-point sampling method can effectively avoid the problem of unstable electrical connection caused by the local oxide layer of the solder ball, fully cover the detection points on the surface of the solder ball, significantly reduce the risk of misjudgment of chip performance caused by misjudgment due to single-point contact, and accurately restore the true electrical performance state of the chip.

[0015] Secondly, this invention achieves dual verification of probe status and solder ball performance through adjacent workstation detection design. By utilizing the linkage transmission mechanism of the adjacent workstation interchange contact linkage component, the drive motor drives the three-contact spring probe to complete the tilt angle adjustment and lifting action, so that it accurately contacts the solder ball of the adjacent workstation for secondary detection. This design overcomes the drawback of the delayed detection of probe damage in the prior art. It can quickly locate the damaged probe by comparing the two detection data, avoiding a large number of chip misjudgments caused by continuous detection of damaged probes. At the same time, the secondary verification can further confirm the solder ball performance, providing double protection for the detection results and reducing unnecessary economic losses on the production side.

[0016] Third, this invention integrates a probe self-cleaning function to prevent chain problems caused by contamination. Accompanying the lifting and lowering of the inner cylinder, the worm gear drives the hinge claw to achieve synchronous cleaning of the three-contact spring probe by the cleaning block, removing solder particles, oxide debris and other contaminants attached to the probe surface in real time. This not only prevents contaminants from forming an insulating layer that would cause abnormally high contact resistance and ensures a stable electrical connection between the probe and the solder ball, but also avoids secondary contamination of other solder balls and damage to the integrity of the solder ball surface. At the same time, it extends the service life of the probe and reduces equipment maintenance costs and downtime frequency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a diagram showing the processing chamber of the present invention in its open state; Figure 3 This is a schematic diagram of the internal structure of the processing chamber of the present invention; Figure 4 This is a schematic diagram of the connection structure between the transport machine and the lifting platform of the present invention; Figure 5 This is a schematic diagram of the spherical transposition component structure of the present invention; Figure 6 This is a partial structural diagram of the spherical transposition component of the present invention; Figure 7 This is a schematic diagram of the connection structure between the adjacent workstation switching contact linkage component and the probe component of the present invention; Figure 8 This is a schematic diagram of the inverted structure of the adjacent workstation interchange contact linkage component and probe component of the present invention; Figure 9 This is an exploded view of the probe assembly structure of the present invention; Figure 10 This is a schematic diagram of the probe assembly structure of the present invention; Figure 11 For the present invention Figure 9 Enlarged view of the structure at point A.

[0018] The components include: 1. Processing bay; 2. Conveyor; 201. Operating table; 202. XY axis moving track; 203. Transplanting mechanism; 3. Lifting platform; 4. Spherical transposition assembly; 401. Motor; 402. Synchronous belt pulley set; 403. First spherical transposition assembly; 4031. First bevel gear; 4032. Cage; 4033. Semicircular spur gear; 4034. Second bevel gear; 4035. Transmission gear; 5. Adjacent station transposition contact linkage assembly; 501. Drive. Motor; 502, First helical gear; 503, Second helical gear; 504, Fixed frame; 505, Arc gear; 506, Small gear; 507, Large gear; 508, Lifting slider; 509, Slide rail; 510, Rotating frame; 6, Probe assembly; 601, Fixed cylinder; 602, Hinge seat; 603, Spring; 604, Lifting inner cylinder; 605, Worm; 606, Hinge claw; 6061, Worm wheel; 6062, Cleaning block; 607, Three-contact spring probe. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1-6 The CSP packaged chip testing equipment includes a processing chamber 1, a conveyor 2 installed inside the processing chamber 1, an operating table 201 at the tail end of the conveyor 2, a lifting platform 3 installed at the top of the operating table 201, and a spherical transposition assembly 4 integrated inside the lifting platform 3. The spherical transposition assembly 4 can drive the probe assembly 6 to move spirally on the outer spherical surface of the solder ball. The spherical transposition assembly 4 includes multiple sets of first spherical transposition assemblies 403 with the same structure. The first spherical transposition assembly 403 includes a first bevel gear 4031. A second bevel gear 4034 meshes with the lower side of the first bevel gear 4031. The center of the second bevel gear 4034 is connected by a shaft to a transmission gear 4035 located inside a retainer 4032. The transmission gear 4035 meshes with a semi-circular spur gear 4033 located inside and below the retainer 4032. The adjacent station transposition contact linkage assembly 5 and the probe assembly 6 are both installed inside the semi-circular spur gear 4033.

[0021] In this embodiment, the aim is to solve the problems of single detection angle of solder balls in CSP packaged chips, and the lag in probe contamination and damage judgment in the prior art. Through multi-component collaborative design, it realizes multi-dimensional accurate detection of solder balls, probe self-cleaning and rapid performance verification, and is suitable for wafer-level CSP package testing scenarios. The equipment as a whole uses the processing chamber 1 as the installation carrier and integrates the functions of loading, detection, cleaning and unloading. It has a compact structure and is easy to operate.

[0022] Specifically, an XY-axis moving track 202 is installed above the operating table 201, and a clamp for fixing the chip carrier is installed on the XY-axis moving track 202. A transfer mechanism 203 is installed between the transport machine 2 and the operating table 201, and the transfer mechanism 203 is used to move the chip carrier transported on the transport machine 2 to the XY-axis moving track 202. The XY-axis moving track 202 consists of two sets of lead screws, corresponding to the X-axis and Y-axis respectively. The linear movement of the XY-axis drives the carrier to adjust its position.

[0023] In this embodiment, the processing chamber 1 is a closed rectangular chamber structure, and an observation window is provided on the outer side of the upper part of the processing chamber 1. The observation window is connected to the processing chamber 1 by a hinge and can be opened at any time to observe the internal processing situation. The observation windows are located on the sides and front and rear ends of the processing chamber 1. The side observation windows can be opened for observation, and the front and rear observation windows can be connected to an external transportation mechanism after being opened. For example, the pallet transported on the conveyor 2 is transported to the conveyor 2 by the external transportation mechanism, and the pallet tested on the operating table 201 can be unloaded by the external transportation mechanism and transported to other processing steps. The conveyor 2, the lifting platform 3, and the ball... The surface transposition component 4, the adjacent station transposition contact linkage component 5, and the probe component 6 are all installed and operate in the upper space inside the processing chamber 1. Matching control and drive equipment is installed below the processing chamber 1 to support the normal operation of the conveyor 2, lifting platform 3, spherical transposition component 4, adjacent station transposition contact linkage component 5, and probe component 6. Metal grille heat dissipation slots are provided on the outer side below the processing chamber 1 for heat dissipation. Self-locking universal pulleys and support legs are installed at the bottom of the processing chamber 1. When the support legs are lowered, the processing chamber 1 is positioned and cannot move. When the universal pulleys are lowered, the processing chamber 1 can be freely pushed and moved, adapting to… Depending on the production site layout, conveyor 2 is used to transport chip trays. When the tray is transported to the end of conveyor 2 near the operating table 201, the transfer mechanism 203 is activated to clamp and move the chip tray onto the XY-axis moving track 202. The tray is clamped by the fixtures installed on the XY-axis moving track 202. When the XY-axis moving track 202 is activated, it will drive the tray to move, causing the chip solder balls fixed on the tray to move below the probe assembly 6, changing the contact target with the three-contact spring probe 607, so that all the chip solder balls on the tray can contact the three-contact spring probe 607 and be tested. A computer is installed on the outside of the device. After the three-contact spring probe 607 contacts the solder ball, it is electrically connected and the computer will directly display the energization status of the solder ball and the degree of chip damage. The XY axis moving track 202 includes two sets of lead screws, one set on the X axis and one set on the Y axis. After starting, it can drive the upper plate to move through the linear movement of the XY axis. The lifting platform 3 is a height-adjustable structure, which can drive the spherical transposition component 4, the adjacent station transposition contact linkage component 5 and the probe component 6 to rise and fall together. In accordance with the chip height, the three-contact spring probe 607 maintains contact with the solder ball, which is convenient for normal testing.

[0024] Specifically, the spherical transposition assembly 4 includes a motor 401, and the output end of the motor 401 is connected to a synchronous pulley set 402. The first spherical transposition assembly 403 is located below the synchronous pulley set 402. The cage 4032 is located below the middle position of the first bevel gear 4031, and the transmission gear 4035 rotates inside the cage 4032. The second bevel gear 4034 is located on one side of the cage 4032, and the semi-circular spur gear 4033 rotates inside the cage 4032. The synchronous pulley set 402 includes multiple multi-groove pulleys and a belt wound on the outside. The number of multi-groove pulleys matches the number of the first spherical transposition assemblies 403, so as to realize the synchronous operation of multiple sets of first spherical transposition assemblies 403.

[0025] In this embodiment, the motor 401 is a component that drives the synchronous pulley group 402 and the first spherical transposition assembly 403. The synchronous pulley group 402 includes multiple multi-groove pulleys and a belt wound around its outer side. By setting the synchronous pulley group 402, multiple first spherical transposition assemblies 403 can operate synchronously. The number of multi-groove pulleys in the synchronous pulley group 402 matches the number of first spherical transposition assemblies 403. Because the solder balls on the chip under test are usually rectangularly distributed in both directions, with a large number in each row and column, by setting multiple first spherical transposition assemblies 403, multiple three-contact spring probes 607 can be made to contact the solder balls synchronously, thereby greatly improving the detection efficiency and shortening the detection time. In this process, multiple first spherical transposition assemblies 403 are spaced a certain distance apart, but have the same structure. The multiple three-contact spring probes 607 also move along the same trajectory on the solder balls. The cage 4032 is generally an inverted "T"-shaped plate structure with plates on both sides and a cavity in the middle. Below the inverted "T" structure is an arc-shaped structure that matches the semi-circular spur gear 4033. The upper part of the internal cavity is used to place the transmission gear 4035, and the lower part is in contact with the semi-circular spur gear 4033. The cross-section of the cavity can be a wedge-shaped structure to match the semi-circular spur gear 4033, allowing the semi-circular spur gear 4033 to move freely inside the cage 4032. The cross-section of the semi-circular spur gear 4033 is semi-circular. The structure is such that the circular arc roughly matches the spherical surface of the solder ball, so the movement trajectory of the three-contact spring probe 607 will be more closely aligned with the outer surface of the solder ball. The first bevel gear 4031 meshes with the second bevel gear 4034, thus driving the second bevel gear 4034 to rotate. The second bevel gear 4034 drives the transmission gear 4035 located inside the first spherical transposition assembly 403 to rotate via a shaft. This shaft passes through the cage 4032 and is connected to the transmission gear 4035. When the transmission gear 4035 rotates, it also drives the semi-circular spur gear 4033, which meshes with it, to rotate, thereby driving the three-contact spring probe 607 installed inside the semi-circular spur gear 4033 to move along the solder ball. The surface moves along an arc-shaped trajectory, and while the first bevel gear 4031 rotates, it also drives the cage 4032 to rotate. This causes the cage 4032 to drive the transmission gear 4035, the second bevel gear 4034, and the semi-circular spur gear 4033 to rotate. This causes the second bevel gear 4034 to rotate around the first bevel gear 4031, and the transmission gear 4035 to rotate around the center point and also around the through axis. The combination of these two rotational trajectories makes the movement trajectory of the three-contact spring probe 607 more three-dimensional and not confined to a certain surface of the solder ball. This trajectory is similar to drawing a spiral on the outer spherical surface of the solder ball, sampling the contact points on the surface of the solder ball at multiple points, and avoiding the situation where the oxide layer on a certain part of the solder ball causes false detection.

[0026] Please see Figures 7-8The CSP packaged chip testing equipment has a probe assembly 6 located inside the spherical transposition assembly 4, on one side of which is installed an adjacent station transposition contact linkage assembly 5. The adjacent station transposition contact linkage assembly 5 can drive the probe assembly 6 to tilt and descend to contact the solder balls of the adjacent station.

[0027] In this embodiment, the second helical gear 503 has a larger diameter. When the first helical gear 502 rotates one revolution, the second helical gear 503 cannot rotate a full revolution, but can only rotate a certain angle. Therefore, it can only drive the large gear 507 to rotate a certain angle. Consequently, the slide rail 509 and the fixed cylinder 601 can only rotate a certain angle, which matches the solder balls at adjacent workstations. When the spacing between the solder balls is too large or too small, or when the chip is a non-standard part, the second helical gear 503 can be replaced, and its diameter adjusted to match the solder ball spacing. The rotation angle of the large gear 507 can also be adjusted. The length and curvature of the arc gear 505 are perfectly matched, allowing the pinion 506 to mesh with the arc gear 505 during rotation and be driven to rotate. This causes the lifting slider 508 to rise and fall a certain distance, which matches the distance between the solder balls at adjacent workstations. If this is not met, the three-contact spring probe 607 has a certain fine-tuning function, and the lifting platform 3 can be adjusted in distance. Furthermore, the rack on the front side of the lifting slider 508 can be replaced with a more dense or sparse rack to further adapt to the detection of solder balls with different spacing.

[0028] Specifically, the adjacent workstation switching contact linkage component 5 includes a drive motor 501, and the output end of the drive motor 501 is connected to a first helical gear 502, and the first helical gear 502 meshes with a second helical gear 503. The second helical gear 503 passes through a shaft through a fixed frame 504 and is connected to a rotating frame 510. The rotating frame 510 is connected to a slide rail 509 through a fixed cylinder 601. The lifting slider 508 moves inside the slide rail 509, and the lifting slider 508 includes a wedge-shaped block part, a rack part, and a connecting part. The rack is disposed on one side of the wedge-shaped block part and meshes with a large gear 507. The connecting part is fixed to the rear side of the wedge-shaped block part and passes through the fixed cylinder 601 and is connected to the lifting inner cylinder 604. The wedge-shaped block part contacts and engages with the slide rail 509.

[0029] In this embodiment, the connection between the drive motor 501 and the first bevel gear 502 is wrapped by a part of the fixing bracket 504 to form a fixation. One end of the fixing bracket 504 is connected to an arc-shaped gear 505 with an arc-shaped structure, and the fixing bracket 504 and the arc-shaped gear 505 are integrally formed and are relatively fixedly arranged inside the semi-circular spur gear 4033. The rotating bracket 510 and the second bevel gear 503 are connected by a shaft and are located on the side of the fixing bracket 504 away from the arc-shaped gear 505. The cross-section is in a "冂"-shaped structure, and a cavity is provided inside it. The internal cavity provides a position for the large gear 507 to rotate inside it. A shaft connected to a small gear 506 meshing with the arc-shaped gear 505 penetrates through the "冂"-shaped connecting block. The side of the "冂"-shaped connecting block close to the slide rail 509 is not sealed. Therefore, the large gear 507 will contact and mesh with the rack part in the lifting slider 508. The slide rail 509 at the rear of the lifting slider 508 is fixedly arranged on one side of the rotating bracket 510, and a wedge-shaped groove matching the wedge-shaped block part is provided inside the slide rail 509. The cooperation between the two will enable the lifting slider 508 to normally lift and move in the slide rail 509. The connecting block part in the lifting slider 508 penetrates through the slide rail 509 and is connected to the lifting inner cylinder 604. Therefore, when the lifting slider 508 lifts or lowers, it will also drive the lifting inner cylinder 604 to lift and lower inside the fixed cylinder 601. When the drive motor 501 is started, it will drive the first bevel gear 502 to rotate. The first bevel gear 502 drives the second bevel gear 503 meshing with it to rotate. The second bevel gear 503 drives the rotating bracket 510, the fixed cylinder 601 and the slide rail 509 to rotate synchronously. This rotation makes the three-contact spring probe 607 that was originally vertically downward tilt towards one side, and the rotating bracket 510 will also drive the small gear 506 to rotate. Therefore, the small gear 506 meshes with the arc-shaped gear 505 during the rotation process and rotates itself, and then drives the large gear 507 to rotate. The large gear 507 drives the lifting slider 508 and the lifting inner cylinder 604 to lift and lower, so that the three-contact spring probe 607 extends out in the tilted state and naturally contacts the solder balls at the adjacent workstations. When the three-contact spring probe 607 retracts, it will also naturally return to the original position and retract. This state is used for the contact and detection of the solder balls at the vertical workstations, forming a double detection mode of "main detection + secondary verification".

[0030] Please refer to Figures 9-11The CSP packaged chip testing equipment includes a spherical transposition component 4 with a probe component 6 for contact testing with solder balls. The adjacent station transposition contact linkage component 5 includes a second helical gear 503, and a fixed frame 504 is provided on one side of the second helical gear 503. One end of the fixed frame 504 is connected to an arc gear 505, and a small gear 506 meshes on one side of the arc gear 505. A large gear 507 is connected to the front side of the small gear 506 via a shaft. The large gear 507 is located inside the rotating frame 510, and the large gear 507 meshes with a lifting slider 508 to drive its lifting and lowering. The lifting slider 508 drives the lifting inner cylinder 604 to lift and lower, and a three-contact spring probe 607 for contacting solder balls is installed at the bottom end of the lifting inner cylinder 604.

[0031] In this embodiment, a controller is installed in the device, and the controller is electrically connected to the electronic components in the device. For example, there are multiple sets of drive motors 501 that drive the adjacent station switching contact linkage component 5, each set is controlled independently. Each set can control the tilt angle between two adjacent sets of three-contact spring probes 607, i.e., exchange the detection objects between two adjacent sets of three-contact spring probes 607. If multiple sets of drive motors 501 are centrally controlled, then the tilt angle between two adjacent sets of three-contact spring probes 607 is the same, meaning the first set of three-contact spring probes 607 detects the solder balls in the vertical direction of the next set of solder balls. The two working modes can be selected according to the solder ball distribution on the detection chip. Both working modes involve exchanging detection objects between adjacent workstations. If coordinated with the movement of the adjacent station switching contact linkage component 5, it can cause half... The spur gear 4033 is not parallel to the row but parallel to the column. The tilted and descending three-contact spring probe 607 can detect solder balls in adjacent rows. If the spur gear 4033 is neither parallel to the row nor parallel to the column, the tilted and descending position of the three-contact spring probe 607 can detect more surrounding solder balls, which can adapt to different chip detection situations. The three sets of three-contact spring probes 607 distributed in a circle can also meet the avoidance between tilted and descending at different angles and vertical solder balls. After the three-contact spring probe 607 tilts and descends and contacts the solder ball in the adjacent station, it is a fixed-point contact. The purpose is to make a secondary judgment on the state of the solder ball to avoid misjudgment due to probe damage. In addition, this secondary judgment can also quickly judge the probe condition, quickly locate and discard damaged probes, and reduce invalid detection.

[0032] Specifically, the probe assembly 6 includes a fixed cylinder 601, and a spring 603 is connected inside the fixed cylinder 601. The spring 603 is penetrated by the lifting inner cylinder 604, and a worm gear 605 is connected to the bottom end of the lifting inner cylinder 604. The three-contact spring probe 607 is installed below the worm gear 605.

[0033] In this embodiment, a pressure plate is provided at the top of the spring 603. The pressure plate has a hole inside that matches the lifting inner cylinder 604. The spring 603 is located inside the fixed cylinder 601 and sleeved on the outside of the lifting inner cylinder 604. The spring 603 is fixedly installed inside the fixed cylinder 601 by the pressure plate. Its purpose is to prevent the lifting inner cylinder 604 from rising excessively. A worm gear 605 is fixedly connected to the bottom end of the lifting inner cylinder 604. Three sets of hinge claws 606 are arranged on the outside of the worm gear 605. When the worm gear 605 rises and falls with the lifting inner cylinder 604, it can drive the worm wheel 6061 meshing with the worm gear 605 to change angle. The hinge claw 606 is positioned on the hinge seat 602. When the worm gear 6061 at the head rotates, the cleaning block 6062 at the tail also rotates, thereby achieving the purpose of contraction and release. During the contraction process, the three sets of cleaning blocks 6062 will contact the three sets of three-contact spring probes 607. At this time, the three-contact spring probes 607 move upward with the movement of the lifting inner cylinder 604, so the three sets of cleaning blocks 6062 will clean the surface of the three sets of three-contact spring probes 607, achieving the purpose of self-cleaning during the rise. The cleaning process does not require additional drive, saving equipment energy consumption.

[0034] Specifically, a hinge seat 602 is connected to the outer side of the fixed cylinder 601, and a hinge claw 606 is hinged inside the hinge seat 602. There are three sets of hinge claws 606. The hinge claw 606 includes a worm gear 6061 and a cleaning block 6062. The worm gear 6061 is located at the head of the hinge claw 606 and meshes with the worm 605. The cleaning block 6062 is located on the inner side of the tail of the hinge claw 606. A groove is opened on the outer side of the fixed cylinder 601, and the hinge claw 606 moves in the groove.

[0035] In this embodiment, due to its small size, the CSP adopts a method similar to wafer inspection. After the chip is packaged with solder balls, it is not diced but directly tested with probes. After testing, dicing, sorting, and packaging are then performed. During testing, the probes are directly attached to the solder balls of the CSP package to establish electrical connection. The tester, which is a computer electrically connected to it, applies voltage or waveform excitation through wires to test the relevant electrical parameters of the chip. However, in wafer testing, the probes are attached to the PADs on the die. The aluminum PADs cause very little contamination to the probes, and frequent cleaning of the probes is not required during testing. In CSP packaging testing, the oxidation of the solder balls can easily cause serious contamination to the probes, affecting the electrical contact between the probes and solder balls and causing excessive contact resistance, thus leading to test result failure. In order to reduce or eliminate the influence of contact resistance, this device uses a self-cleaning method to repeatedly clean the probes. When the three-contact spring probe 6 When the 07 rises, the three sets of cleaning blocks 6062 will converge and approach, with each set of cleaning blocks 6062 corresponding to cleaning one set of three-contact spring probes 607. This prevents the three-contact spring probes 607 from becoming contaminated during contact with the tin oxide ball, which could lead to subsequent detection errors. The three sets of cleaning blocks 6062 can be cleaning sponge structures, using physical contact to clean the oxide impurities adhering to the three-contact spring probes 607. They are detachable and need to be disassembled and replaced daily. Alternatively, electrostatic adsorption modules and vacuum modules can be used. For example, a vacuum port can be opened at the cleaning block 6062, with a thin pipe connecting the three sets of cleaning blocks 6062. A vacuum fan can be installed at the other end of the thin pipe, and the activated vacuum fan can adsorb all the oxide impurities adhering to the three-contact spring probes 607. Alternatively, an electrostatic adsorption block can be set at the cleaning block 6062, and when activated, static electricity can be used to remove the oxide impurities adhering to the outside of the three-contact spring probes 607. The specific choice can be determined according to the on-site construction. The attached diagram does not affect the actual cleaning structure used.

[0036] Specifically, there are three sets of three-contact spring probes 607, and the three sets of three-contact spring probes 607 respectively contact the three sets of cleaning blocks 6062.

[0037] In this embodiment, there are three sets of three-contact spring probes 607, each set being independent. The contacts of all three sets of spring probes 607 are rounded to avoid scratching the solder balls. Furthermore, the contacts are integrally connected to the probe rod, ensuring no noticeable unevenness when in contact with the probe. The spring probes 607 can clean the probe rod and contact area together, reducing cleaning dead zones. A spring is provided on the outer side of the probe rod. The three sets of spring probes 607 are not arranged side-by-side. Instead of being placed in a fixed position, the three sets of spring probes are arranged in a circular structure, which fits the shape of the solder ball's spherical surface. This ensures that when the three-contact spring probes 607 move to detect the solder ball at different angles, at least one set of the three sets of spring probes 607 always maintains contact with it, preventing interruption of contact. Furthermore, when the three-contact spring probes 607 need to tilt down to detect solder balls at adjacent stations, the three sets of spring probes 607 can avoid interference with solder balls at vertical stations, ensuring a smooth detection process.

[0038] When in use, an external power supply is required first. The external power supply provides power to the device so that it can operate normally. The chip tray is sent into the conveyor 2 inside the processing chamber 1 by an external transport mechanism. The conveyor 2 transports the tray to one end near the operating table 201. At this time, the transfer mechanism 203 is activated, clamping the tray and transferring it onto the XY axis moving track 202. The tray is fixed by the clamps on the XY axis moving track 202. The controller drives the XY axis lead screw of the XY axis moving track 202 to move the tray, so that the solder ball of the chip to be tested is accurately aligned directly below the probe assembly 6. At the same time, the lifting platform 3 starts to lift and adjust the overall height of the spherical transposition assembly 4, the adjacent station transposition contact linkage assembly 5, and the probe assembly 6 to ensure that the three-contact spring probe 607 and the solder ball are at a suitable contact distance. The detection phase is divided into main detection and auxiliary secondary detection. During main detection, the motor 401 in the spherical transposition assembly 4 starts, driving multiple sets of first spherical transposition assemblies 403 to operate synchronously through the synchronous pulley group 402, realizing parallel detection of multiple solder balls. The motor 401 drives the first bevel gear 4031 to rotate, and the first bevel gear 4031 meshes with the second bevel gear 4034 to rotate. The second bevel gear 4034 drives the transmission gear 4035 inside the cage 4032 to rotate through the shaft, and the transmission gear 4035 further meshes. The first bevel gear 4031 rotates, causing the retainer 4032 to rotate around its axis, thus creating a composite motion of "self-rotation + revolution around the axis" for the semicircular spur gear 4033. This motion, in turn, causes the probe assembly 6 installed inside the semicircular spur gear 4033 to move along the outer spherical surface of the solder ball in a spiral trajectory. During the movement, the three-contact spring probe 607 samples the contact points on the surface of the solder ball at multiple points and transmits the detection data to an external computer via electrical connection, thus completing a multi-dimensional determination of the electrical performance of the solder ball. The auxiliary secondary inspection is used to verify the solder ball condition and probe reliability. It is driven by the adjacent station interchange contact linkage component 5. After the drive motor 501 starts, it drives the first helical gear 502 to rotate. The first helical gear 502 meshes with the second helical gear 503 to drive its rotation. The second helical gear 503 drives the rotating frame 510, the fixed cylinder 601 and the slide rail 509 to rotate synchronously through the shaft, so that the three-contact spring probe 607 tilts from the vertical state towards the solder ball of the adjacent station. At the same time, the rotating frame 510 drives the small gear 506 to rotate with the whole. The small gear 506 meshes with the arc gear 505 and rotates, which in turn drives the large gear 507 to rotate. The large gear 507 meshes with the rack part of the lifting slider 508, which drives the lifting slider 508 to rise and fall along the wedge groove of the slide rail 509. The lifting slider 508 pulls the lifting inner cylinder 604 to rise and fall through the connecting part, so that the tilted three-contact spring probe 607 extends to the solder ball of the adjacent station and makes contact, thus completing the secondary inspection and realizing the dual verification of the solder ball condition and probe performance. The probe self-cleaning process is carried out synchronously with the detection process. After the three-contact spring probe 607 completes one detection, the lifting inner cylinder 604 drives the worm gear 605 to rise. The worm gear 605 meshes with the worm wheel 6061, driving the three sets of hinge claws 606 to rotate around the hinge point of the hinge seat 602. This causes the cleaning block 6062 to approach and contact the three-contact spring probe 607. Through the cleaning structure sponge, electrostatic adsorption, or dust suction module of the cleaning block 6062, the solder particles, oxide debris, and other contaminants attached to the surface of the three-contact spring probe 607 are physically removed. After cleaning is completed, the lifting inner cylinder 604 descends and resets, waiting for the next detection cycle. In addition, the device can switch working modes via the controller: when multiple sets of drive motors 501 are controlled individually, the adjacent three-contact spring probes 607 are tilted at opposite angles to exchange detection objects; when drive motors 501 are controlled centrally, the adjacent three-contact spring probes 607 are tilted at the same angle to detect subsequent solder balls in the vertical direction; with the help of the spherical transposition component 4 to adjust the placement posture of the semi-circular spur gear 4033 (parallel to the row and column or at an angle), it can realize the detection of solder balls in the same row, column and surrounding multi-station, and adapt to chips with different solder ball distributions.

[0039] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made to these embodiments without departing from the principles and spirit of this application. The scope of this application is defined by the appended claims and their equivalents.

Claims

1. A CSP packaged chip testing device, including a processing chamber (1), characterized in that: The processing chamber (1) is equipped with a conveyor (2), and the tail end of the conveyor (2) is equipped with an operating table (201). The top of the operating table (201) is equipped with a lifting platform (3), and the lifting platform (3) is integrated with a spherical transposition component (4). The spherical transposition component (4) is equipped with a probe component (6) for contact testing with solder balls. The spherical transposition component (4) can drive the probe component (6) to move spirally on the outer spherical surface of the solder ball. One side of the probe component (6) is equipped with an adjacent station transposition contact linkage component (5) inside the spherical transposition component (4). The adjacent station transposition contact linkage component (5) can drive the probe component (6) to tilt and descend to contact the solder balls of the adjacent station. The spherical transposition assembly (4) includes multiple sets of first spherical transposition assemblies (403) with the same structure. The first spherical transposition assembly (403) includes a first bevel gear (4031). A second bevel gear (4034) meshes with the lower side of the first bevel gear (4031). A transmission gear (4035) located inside the cage (4032) is connected to the center of the second bevel gear (4034) via a shaft. The transmission gear (4035) meshes with a semi-circular spur gear (4033) located inside the cage (4032). The adjacent station transposition contact linkage assembly (5) and the probe assembly (6) are both installed inside the semi-circular spur gear (4033). The adjacent workstation switching contact linkage component (5) includes a second helical gear (503), and a fixed frame (504) is provided on one side of the second helical gear (503). One end of the fixed frame (504) is connected to an arc gear (505), and a small gear (506) meshes on one side of the arc gear (505). A large gear (507) is connected to the front side of the small gear (506) through a shaft. The large gear (507) is located inside the rotating frame (510), and the large gear (507) meshes with the lifting slider (508) to drive it to rise and fall. The lifting slider (508) drives the lifting inner cylinder (604) to rise and fall, and a three-contact spring probe (607) that contacts the solder ball is installed at the bottom end of the lifting inner cylinder (604).

2. The CSP packaged chip testing equipment according to claim 1, characterized in that: An XY-axis moving track (202) is installed above the operating table (201), and a clamp for fixing the chip carrier is installed on the XY-axis moving track (202). A transfer mechanism (203) is installed between the transport machine (2) and the operating table (201), and the transfer mechanism (203) is used to move the chip carrier transported on the transport machine (2) to the XY-axis moving track (202). The XY-axis moving track (202) consists of two sets of lead screws, corresponding to the X-axis and Y-axis respectively. The position of the carrier is adjusted by the linear movement of the XY-axis.

3. The CSP packaged chip testing equipment according to claim 1, characterized in that: The spherical transposition assembly (4) includes a motor (401), and the output end of the motor (401) is connected to a synchronous pulley group (402). The first spherical transposition assembly (403) is located below the synchronous pulley group (402). The cage (4032) is located below the middle position of the first bevel gear (4031), and the transmission gear (4035) rotates inside the cage (4032). The second bevel gear (4034) is located on one side of the cage (4032). The semi-circular spur gear (4033) rotates inside the cage (4032). The synchronous pulley group (402) includes multiple multi-groove pulleys and a belt wound on the outside. The number of multi-groove pulleys matches the number of the first spherical transposition assemblies (403), so that multiple sets of first spherical transposition assemblies (403) can operate synchronously.

4. The CSP packaged chip testing equipment according to claim 1, characterized in that: The adjacent workstation switching contact linkage component (5) includes a drive motor (501), and the output end of the drive motor (501) is connected to a first helical gear (502), and the first helical gear (502) meshes with a second helical gear (503). The second helical gear (503) passes through a fixed frame (504) through a shaft and is connected to a rotating frame (510). The rotating frame (510) is connected to a slide rail (509) through a fixed cylinder (601). The lifting slider (508) moves inside the slide rail (509). The lifting slider (508) includes a wedge block part, a rack part and a connecting part. The rack is set on one side of the wedge block part and meshes with a large gear (507). The connecting part is fixed on the rear side of the wedge block part and passes through the fixed cylinder (601) and is connected to the lifting inner cylinder (604). The wedge block part is in contact with the slide rail (509).

5. The CSP packaged chip testing equipment according to claim 1, characterized in that: The probe assembly (6) includes a fixed cylinder (601), and a spring (603) is connected inside the fixed cylinder (601). The spring (603) is penetrated by a lifting inner cylinder (604), and a worm gear (605) is connected to the bottom end of the lifting inner cylinder (604). The three-contact spring probe (607) is installed below the worm gear (605).

6. The CSP packaged chip testing equipment according to claim 5, characterized in that: The fixed cylinder (601) is connected to a hinge seat (602) on the outside, and a hinge claw (606) is hinged inside the hinge seat (602). There are three sets of hinge claws (606). Each hinge claw (606) includes a worm gear (6061) and a cleaning block (6062). The worm gear (6061) is located at the head of the hinge claw (606) and meshes with the worm (605). The cleaning block (6062) is located on the inner side of the tail of the hinge claw (606). A groove is opened on the outside of the fixed cylinder (601), and the hinge claw (606) moves in the groove.

7. The CSP packaged chip testing equipment according to claim 6, characterized in that: The number of the three-contact spring probes (607) is three sets, and the three sets of three-contact spring probes (607) respectively contact the three sets of cleaning blocks (6062).

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