Manufacturing method of printed circuit board with heat conduction structure and printed circuit board
By creating mounting holes in the inner core of the printed circuit board and filling them with a high thermal conductivity paste, combined with the design of thermally conductive through holes and insulation gaps, the problem of a single heat dissipation path for components is solved, and efficient heat dissipation of the printed circuit board is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- KUSN HULI MICROELECTRONICS
- Filing Date
- 2026-02-09
- Publication Date
- 2026-05-05
AI Technical Summary
The heat dissipation path of components in existing printed circuit boards is singular, resulting in low heat dissipation efficiency.
Mounting holes are made on the inner core of the printed circuit board, components are fixed by a carrier adhesive film, and windows are formed by laser engraving. High thermal conductivity paste is filled to enhance the heat dissipation path. Combined with the design of thermally conductive through holes and insulation gaps, efficient heat dissipation of multilayer boards is achieved.
It significantly improves the thermal conductivity of components. Through the high thermal conductivity paste and thermally conductive via design inside the multilayer board, it enhances the heat dissipation efficiency of the printed circuit board and solves the problem of a single heat dissipation path.
Smart Images
Figure CN121985493A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of printed circuit board technology, and in particular to a method for manufacturing a printed circuit board with a thermally conductive structure and the printed circuit board itself. Background Technology
[0002] As electronic devices become increasingly miniaturized and integrated, the requirements for heat dissipation performance of printed circuit boards (PCBs) are increasing. To meet these requirements, current technologies embed components directly within the PCB. However, because the components are embedded inside the circuit board, their heat dissipation mainly relies on the heat dissipation copper foil on the back of the components. This results in a limited heat dissipation contact area and a single heat dissipation path, leading to low overall heat dissipation efficiency. Summary of the Invention
[0003] The purpose of this application is to provide a method for manufacturing a printed circuit board with a thermally conductive structure and a printed circuit board, so as to solve the problem of low heat dissipation efficiency caused by the single heat dissipation path of components in the prior art.
[0004] To solve the above-mentioned technical problems, this application adopts the following technical solution:
[0005] In a first aspect, this application provides a method for manufacturing a printed circuit board with a thermally conductive structure, comprising the following steps:
[0006] Mounting holes are made in the first inner core board;
[0007] A first carrier adhesive film is applied to the first contact surface of the first inner core board, and the components are embedded in the mounting holes.
[0008] A second carrier adhesive film is attached to the second contact surface of the first inner core board to fix the components between the first carrier adhesive film and the second carrier adhesive film.
[0009] The first inner core board is laser-processed to form a window at the position of the gap between the component and the mounting hole corresponding to the second carrier adhesive film;
[0010] The high thermal conductivity paste is filled into the gap between the component and the mounting hole through the window opening;
[0011] The first inner core board is cured.
[0012] Remove the first carrier film and the second carrier film to obtain the second inner core board;
[0013] The first multilayer board is made by pressing the second inner core board together.
[0014] Furthermore, after the first multilayer board is formed by laminating the second inner core board, it also includes:
[0015] Drill holes in the first multilayer board to form heat-conducting through holes that penetrate the first multilayer board;
[0016] Fill the heat-conducting through holes with a high thermal conductivity slurry;
[0017] The first multilayer board is cured to obtain the second multilayer board.
[0018] Furthermore, after curing the first multilayer board to obtain the second multilayer board, the process also includes:
[0019] The heat dissipation layer of the second multilayer board is etched to form an insulating gap between the functional area and the heat dissipation area of the heat dissipation layer.
[0020] Fill the insulation gap with a high thermal conductivity slurry;
[0021] The second multilayer board is cured to obtain the third multilayer board.
[0022] Furthermore, after curing the second multilayer board to obtain the third multilayer board, the process also includes:
[0023] The plates are stacked and pressed in the following order: conductive layer, barrier film, third multilayer board, high thermal conductivity film, and conductive layer.
[0024] After the laminates are pressed together, the barrier film is removed to obtain the fourth multilayer board.
[0025] Furthermore, the high thermal conductivity paste includes phenolic resin and aluminum nitride powder.
[0026] Furthermore, using screen printing or electrostatic spraying, a high thermal conductivity paste is filled into the gap between the component and the mounting hole through the window.
[0027] Furthermore, the first inner core board is cured using UV curing or high-temperature curing processes.
[0028] Furthermore, a vacuum resin plugging process is used to fill the thermally conductive through holes with a high thermal conductivity slurry.
[0029] Secondly, this application also provides a printed circuit board, which is manufactured according to any of the above-described manufacturing methods.
[0030] Compared with the prior art, the beneficial effects achieved by this application are as follows:
[0031] 1. By filling the gaps between components and mounting holes with a high thermal conductivity paste, direct contact heat dissipation of components inside the printed circuit board is achieved, thereby significantly improving heat conduction efficiency. Specifically, a carrier adhesive film is applied to the first and second contact surfaces on the first inner core board to fix the components. A window is then formed on the second carrier adhesive film with corresponding gaps, through which the high thermal conductivity paste is filled into the gaps around the components. After curing, the high thermal conductivity paste fixes the components in the mounting holes, and the components can conduct heat to the inner core board and subsequent multilayer boards through the high thermal conductivity paste on the sidewalls, improving heat dissipation efficiency.
[0032] 2. By forming thermally conductive vias and filling them with a high thermal conductivity paste on the first multilayer board, heat dissipation channels are created, further improving the heat dissipation efficiency of the printed circuit board. Specifically, the thermally conductive vias are designed to dissipate heat from the high thermal conductivity paste surrounding the components in the second inner core board. The heat generated by the components during operation is first transferred to the surrounding high thermal conductivity paste, and then conducted through the copper foil of the inner core board to the location of the thermally conductive vias. The high thermal conductivity paste filling the vias then rapidly dissipates the heat to the outside of the printed circuit board. This design utilizes the internal space of the multilayer board, effectively solving the problem of low heat conduction efficiency caused by a single heat dissipation path for embedded components.
[0033] 3. By forming an insulating gap filled with a highly thermally conductive paste between the functional area and the heat dissipation area of the heat dissipation layer, electrical insulation is achieved while improving the thermal conductivity of the heat dissipation layer. Specifically, in the prior art, solder resist ink is usually applied between the functional area and the heat dissipation area to achieve insulation. However, the high thermal resistance of the solder resist ink hinders the conduction of heat generated in the functional area to the heat dissipation area, leading to heat accumulation in the functional area. This application forms an insulating gap on the heat dissipation layer through etching and fills the insulating gap with a highly thermally conductive paste. The highly thermally conductive paste not only meets the insulation requirements of the functional area and the heat dissipation area, but also conducts the heat generated in the functional area to the heat dissipation area through the highly thermally conductive paste, thereby dissipating the heat. This solves the problem in the prior art where heat cannot be conducted from the functional area to the heat dissipation area, thus improving the heat dissipation efficiency. Attached Figure Description
[0034] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0035] Figure 1 This is a schematic diagram of the structure of the first inner core board of some embodiments provided in this application.
[0036] Figure 2 This is a schematic diagram of the structure with mounting holes in the first inner core board.
[0037] Figure 3 This is a schematic diagram of the structure of the first inner core board, which has a first carrier adhesive film and components.
[0038] Figure 4 This is a schematic diagram of a structure in which the first inner core board has a second carrier film and a high thermal conductivity paste.
[0039] Figure 5 This is a schematic diagram of the second inner core board.
[0040] Figure 6 This is a schematic diagram of a four-layer board structure.
[0041] Figure 7 Is Figure 6 A schematic diagram of the structure of a six-layer plate obtained by pressing.
[0042] Figure 8 This is a schematic diagram of the structure of the first multilayer board with heat-conducting through holes.
[0043] Figure 9 This is a schematic diagram of the third-layer multilayer board.
[0044] Figure 10 Is Figure 6 A schematic diagram of the structure of a seven-layer board obtained by pressing.
[0045] Figure 11 This is a schematic diagram of the fourth multilayer board.
[0046] Figure 12 This is a schematic diagram of a fifth-layer multilayer board with heat-conducting through holes.
[0047] Figure 13 This is a structural diagram of a seventh-layer plywood.
[0048] Figure 14 This is a structural diagram of the eighth multilayer board.
[0049] Explanation of reference numerals in the attached figures:
[0050] 1. First inner core board; 11. Mounting hole; 21. First carrier film; 22. Second carrier film; 3. High thermal conductivity paste; 4. Conductive layer; 5. Dielectric layer; 6. High thermal conductivity adhesive film; 7. Barrier film; 8. Thermally conductive through hole; 9. Components. Detailed Implementation
[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this application or its application or use.
[0052] Example 1:
[0053] This embodiment provides a method for manufacturing a printed circuit board with a thermally conductive structure, including the following steps:
[0054] S1. A mounting hole 11 is made on the first inner core board 1.
[0055] Specifically, such as Figure 1 As shown, the first inner core board 1 consists of a substrate and two copper foils. The first inner core board 1 has a predetermined area for mounting components 9. Mounting holes 11, penetrating the first inner core board 1, are formed in the predetermined area using CNC machining. The mounting holes 11 are used to mount the components 9. Figure 2 As shown, Figure 2 This is a schematic diagram of the structure of the first inner core board 1 with mounting holes 11.
[0056] S2. A first carrier adhesive film 21 is attached to the first contact surface of the first inner core board 1, and the component 9 is embedded in the mounting hole 11.
[0057] Specifically, such as Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of the first inner core board 1, which includes a first carrier adhesive film 21 and components 9. The first inner core board 1 has a first contact surface and a second contact surface that are arranged opposite to each other. The first carrier adhesive film 21 is applied to the first contact surface using a vacuum molding process. Then, components 9 are placed into the mounting holes 11 from the direction of the second contact surface, with the heat dissipation surface of components 9 facing the first carrier adhesive film 21.
[0058] S3. A second carrier film 22 is attached to the second contact surface of the first inner core plate 1 to fix the component 9 between the first carrier film 21 and the second carrier film 22.
[0059] Specifically, the second carrier film 22 is applied to the second contact surface using a vacuum molding process. At this time, the heat dissipation surface of component 9 faces the first carrier film 21, and the circuit surface of component 9 faces the second carrier film 22.
[0060] It should be noted that there should be no bubbles or wrinkles after the first carrier film 21 and the second carrier film 22 are applied.
[0061] Preferably, the first carrier film 21 and the second carrier film 22 comprise polyimide colloid and acrylic resin polymer.
[0062] S4. Laser processing is performed on the first inner core board 1 to form a window at the position of the gap between the second carrier film 22 and the component 9 and the mounting hole 11.
[0063] Specifically, the area of the mounting hole 11 should be larger than the area of the component 9. When the mounting hole 11 is opened, a gap is reserved between the periphery of the component 9 and the mounting hole 11 so that there is a gap between the component 9 and the mounting hole 11 after the component 9 is embedded in the mounting hole 11.
[0064] S5. Fill the gap between component 9 and mounting hole 11 with high thermal conductivity paste 3 through the window opening;
[0065] Specifically, such as Figure 4 As shown, this is a schematic diagram of the structure of the first inner core board 1, which includes a second carrier adhesive film 22 and a high thermal conductivity paste 3. The high thermal conductivity paste 3 is filled between the component 9 and the mounting hole 11 through the window portion.
[0066] S6. Curing treatment is performed on the first inner core board 1.
[0067] Specifically, the first inner core board 1 is cured to solidify the high thermal conductivity paste 3, which enables the high thermal conductivity paste 3 to fix the components 9.
[0068] S7. Remove the first carrier film 21 and the second carrier film 22 to obtain the second inner core board.
[0069] Specifically, such as Figure 5 As shown, Figure 5 This is a schematic diagram of the second inner core board. The second inner core board is obtained after peeling off the first carrier film 21 and the second carrier film 22 using a peeling machine. Peeling off the first carrier film 21 and the second carrier film 22 requires a peeling force greater than 13 gf / inch, a peeling static voltage less than 100V, high temperature resistance greater than 200℃, and no adhesive residue after peeling.
[0070] It should be noted that the high thermal conductivity paste 3 should be filled smoothly and without air bubbles or voids. A 3D measuring instrument was used to construct and inspect the flatness and windowing accuracy of the high thermal conductivity paste 3 on the second inner core board. An X-ray scanner was used to inspect the number of air bubbles and voids in the high thermal conductivity paste 3. The high thermal conductivity paste 3 should be filled smoothly, without air bubbles or voids, and its flatness should be less than 40µm. The flatness of component 9 should be less than 20µm, and the windowing accuracy error of the windowed area should be within 25µm.
[0071] S8. The first multilayer board is formed by pressing the second inner core board together.
[0072] Specifically, a four-layer board is obtained by symmetrically pressing the conductive layer 4, dielectric layer 5, second inner core board, dielectric layer 5, and conductive layer 4 in the following order using a lamination process. For example... Figure 6 As shown, Figure 6 This is a schematic diagram of a four-layer board. Then, using a lamination process, the layers are symmetrically laminated in the following order: conductive layer 4, dielectric layer 5, second inner core board, dielectric layer 5, conductive layer 4, barrier film 7, and conductive layer 4. Figure 7 As shown. Then, after removing the barrier film 7 and the outermost conductive layer 4, a first multilayer board with built-in components 9 is formed. The circuit patterns of each layer are made on the first multilayer board using an etching process, and the components 9 and the circuit patterns of each layer are connected by laser and electroplating processes.
[0073] It should be noted that the number of layers in the first multilayer board can be set according to the specific needs of those skilled in the art. In this embodiment, the first multilayer board is a five-layer board.
[0074] Furthermore, following S8, it also includes:
[0075] S9. Drill holes in the first multilayer board to form a heat-conducting through hole 8 that penetrates the first multilayer board.
[0076] Specifically, a mechanical drilling process is used to drill thermally conductive vias 8 into the first multilayer board. The interlayer alignment of the thermally conductive vias 8 is less than 25µm. Figure 8 As shown, Figure 8 This is a schematic diagram of the structure of the first multilayer board with heat-conducting through holes 8.
[0077] S10. Fill the thermally conductive through hole 8 with the high thermal conductivity paste 3.
[0078] S11. The first multilayer board is cured to obtain the second multilayer board.
[0079] Specifically, the heat generated by component 9 during operation is first transferred to the high thermal conductivity paste 3 around it, and then conducted through the copper foil of the inner core board to the location of the thermally conductive through hole 8. The heat is then quickly dissipated to the outside of the printed circuit board through the high thermal conductivity paste 3 filled in the thermally conductive through hole 8.
[0080] Furthermore, following S11, it also includes:
[0081] S12. The heat dissipation layer of the second multilayer board is etched to form an insulating gap between the functional area and the heat dissipation area of the heat dissipation layer.
[0082] Specifically, the conductive layer 4 at the bottom of the second multilayer board, near the heat dissipation surface of component 9, serves as a heat dissipation layer. This heat dissipation layer contacts the heat dissipation surface of component 9 through vias for heat exchange, thereby dissipating heat from component 9. The heat dissipation layer is divided into a functional area and a heat dissipation area, as per customer requirements. Component 9 and circuitry are embedded in the functional area, while no components 9 or circuitry are embedded in the heat dissipation area. To prevent voltage breakdown during operation of component 9 in the functional area, an insulating gap is created between the functional area and the heat dissipation area using an etching process.
[0083] S13. Fill the insulation gap with high thermal conductivity paste 3.
[0084] S14. The second multilayer board is cured to obtain the third multilayer board.
[0085] Specifically, such as Figure 9 As shown, Figure 9 This is a schematic diagram of the third-layer multilayer board. The high thermal conductivity paste 3 not only meets the insulation requirements of both the functional area and the heat dissipation area, but also conducts the heat generated in the functional area to the heat dissipation area, thereby dissipating the heat. This solves the problem in existing technologies where heat cannot be conducted from the functional area to the heat dissipation area, thus improving heat dissipation efficiency.
[0086] Furthermore, following S14, it also includes:
[0087] S15. Stack and press the conductive layer 4, barrier film 7, third multilayer board, high thermal conductivity film 6, and conductive layer 4 in that order.
[0088] Specifically, such as Figure 10 As shown, Figure 10 This is a schematic diagram of a seven-layer board obtained by laminating the third layer of multilayer boards.
[0089] S16. After the laminates are pressed together, the barrier film 7 is removed to obtain the fourth multilayer board.
[0090] Specifically, such as Figure 11 As shown, Figure 11This is a schematic diagram of the fourth multilayer board. By employing a symmetrical structure during the lamination process and removing the barrier film 7 after lamination, the stress distribution during the lamination process of the multilayer board is improved, preventing board warping and thus improving the flatness and manufacturing yield of the printed circuit board. Specifically, since a high thermal conductivity film 6 is provided on one side of the third multilayer board, if asymmetrical lamination is performed directly, it is easy to cause uneven stress on both sides of the board, which will lead to warping deformation. To solve this problem, a conductive layer 4 and a high thermal conductivity film 6 are provided on one side of the third multilayer board, and a conductive layer 4 and a barrier film 7 are provided on the other side, forming a symmetrical structure, so that the thermal expansion and contraction on both sides of the board remain synchronized during the lamination process. After lamination, the fourth multilayer board is obtained by removing the barrier film 7 and the conductive layer 4 attached thereto.
[0091] Specifically, the heat generated by component 9 can be conducted to the high thermal conductivity adhesive film 6 through the high thermal conductivity paste 3 around component 9, the copper foil of the inner core board, and the high thermal conductivity paste 3 in the thermally conductive through-hole 8, and then to the outside of the printed circuit board through the high thermal conductivity adhesive film 6; the heat generated by component 9 can also be conducted to the high thermal conductivity adhesive film 6 through the heat dissipation surface of component 9, the through-hole, the functional area of the heat dissipation layer, the high thermal conductivity paste 3 in the insulation gap, and the heat dissipation area of the heat dissipation layer, and then to the outside of the printed circuit board through the high thermal conductivity adhesive film 6.
[0092] Preferably, the high thermal conductivity adhesive film 6 comprises a high thermal conductivity polymeric material composed of polyamide and ceramic powder, specifically aluminum nitride. The high thermal conductivity adhesive film 6 is required to have a thermal conductivity greater than 3.0 W / mk and a breakdown voltage greater than 50 kV / mm.
[0093] Furthermore, the high thermal conductivity paste 3 includes phenolic resin and aluminum nitride powder.
[0094] Specifically, the high thermal conductivity paste 3 requires a thermal conductivity greater than 3.0 W / mk and a breakdown voltage greater than 50 kV / mm.
[0095] Furthermore, using screen printing or electrostatic spraying, the high thermal conductivity paste 3 is filled into the gap between the component 9 and the mounting hole 11 through the window.
[0096] Furthermore, the first inner core board 1 is cured using UV curing or high-temperature curing processes.
[0097] Furthermore, a vacuum resin plugging process is used to fill the thermally conductive through holes 8 with a high thermal conductivity slurry 3.
[0098] Example 2:
[0099] This embodiment provides a method for manufacturing a printed circuit board with a thermally conductive structure, wherein steps S1 to S7 of the manufacturing method are the same as steps S1 to S7 of the manufacturing method in Embodiment 1, the difference being in step S8:
[0100] like Figure 6 As shown, a lamination process is used to symmetrically laminate the conductive layer 4, dielectric layer 5, second inner core board, dielectric layer 5, and conductive layer 4 in that order to obtain a fifth multilayer board, which is a four-layer board. Then, the fifth multilayer board is drilled to form heat-conducting through-holes 8, as shown. Figure 12 As shown. High thermal conductivity paste 3 is filled into the thermally conductive through-holes 8. The fifth multilayer board is then cured to obtain the sixth multilayer board.
[0101] The heat dissipation layer of the sixth multilayer board is etched to form an insulating gap between the functional area and the heat dissipation area of the heat dissipation layer; a high thermal conductivity paste 3 is filled into the insulating gap; the sixth multilayer board is then cured to obtain the seventh multilayer board, as shown below. Figure 13 As shown.
[0102] The eighth multilayer board is obtained by stacking and laminating conductive layer 4, dielectric layer 5, seventh multilayer board, high thermal conductivity adhesive film 6, and conductive layer 4 in that order. Figure 14 As shown. Then, the top of the eighth multilayer board is drilled at the position corresponding to the thermal through hole 8 so that the thermal through hole 8 can penetrate through the top of the eighth multilayer board; the high thermal conductivity paste 3 is filled into the thermal through hole 8; the eighth multilayer board is cured to obtain the fourth multilayer board.
[0103] Example 3:
[0104] This embodiment provides a printed circuit board, which is manufactured according to the manufacturing method described in Embodiment 1 or Embodiment 2.
[0105] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used to explain the relative positional relationship and movement between components in a specific orientation. If the specific orientation changes, the directional indication will also change accordingly. These terms are used only for the convenience of describing this application and for simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0106] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0107] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.
[0108] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.
Claims
1. A method for manufacturing a printed circuit board with a thermally conductive structure, characterized in that, Includes the following steps: Mounting holes are made in the first inner core board; A first carrier adhesive film is attached to the first contact surface of the first inner core board, and the components are embedded in the mounting holes. A second carrier film is attached to the second contact surface of the first inner core board to fix the component between the first carrier film and the second carrier film. The first inner core board is laser-processed to form a window at the position of the second carrier film corresponding to the gap between the component and the mounting hole; A high thermal conductivity paste is filled into the gap between the component and the mounting hole through the window opening; The first inner core board is cured. Remove the first carrier film and the second carrier film to obtain the second inner core board; The second inner core board is used to press together to form the first multilayer board.
2. The method for manufacturing a printed circuit board with a thermally conductive structure according to claim 1, characterized in that, After the second inner core board is pressed into the first multilayer board, the process further includes: The first multilayer board is drilled to form a heat-conducting through hole that penetrates the first multilayer board; The high thermal conductivity slurry is filled into the thermally conductive through-hole; The first multilayer board is cured to obtain the second multilayer board.
3. The method for manufacturing a printed circuit board with a thermally conductive structure according to claim 2, characterized in that, After curing the first multilayer board to obtain the second multilayer board, the process further includes: The heat dissipation layer of the second multilayer board is etched to form an insulating gap between the functional area and the heat dissipation area of the heat dissipation layer; The high thermal conductivity slurry is filled into the insulating gap; The second multilayer board is cured to obtain the third multilayer board.
4. The method for manufacturing a printed circuit board with a thermally conductive structure according to claim 3, characterized in that, After curing the second multilayer board to obtain the third multilayer board, the process further includes: The plates are stacked and pressed in the following order: conductive layer, barrier film, third multilayer board, high thermal conductivity film, and conductive layer. After the laminates are pressed together, the barrier film is removed to obtain a fourth multilayer board.
5. The method for manufacturing a printed circuit board with a thermally conductive structure according to claim 1, characterized in that, The high thermal conductivity paste comprises phenolic resin and aluminum nitride powder.
6. The method for manufacturing a printed circuit board with a thermally conductive structure according to claim 1, characterized in that, The high thermal conductivity paste is filled into the gap between the component and the mounting hole through the window using screen printing or electrostatic spraying.
7. The method for manufacturing a printed circuit board with a thermally conductive structure according to claim 1, characterized in that, The first inner core board is cured using UV curing or high-temperature curing processes.
8. The method for manufacturing a printed circuit board with a thermally conductive structure according to claim 2, characterized in that, The high thermal conductivity slurry is filled into the thermally conductive through holes using a vacuum resin plugging process.
9. A printed circuit board, characterized in that, The printed circuit board is manufactured according to the manufacturing method described in any one of claims 1 to 8.