Pellicle pasting device, pellicle pasting method, pellicle transfer printing device, and pellicle transfer printing method

By improving the affinity of the bonding surfaces of the frame components and applying liquid adhesion, the problem of uneven bonding of the protective film was solved, achieving uniform bonding of the protective film and stability of light transmittance.

CN121989438APending Publication Date: 2026-05-08LINTEC CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
LINTEC CORP
Filing Date
2025-11-06
Publication Date
2026-05-08

AI Technical Summary

Technical Problem

In the prior art, the protective film is prone to uneven adhesion on the bonding surface of the frame component, resulting in uneven adhesion of the carbon nanotube self-supporting film and affecting the uniformity of light transmittance and density.

Method used

By performing affinity enhancement treatment on the bonding surfaces of the frame components, plasma irradiation is used to improve their affinity with liquids, and then the liquid is uniformly adhered. Subsequently, a protective film is pasted onto the bonding surfaces with the liquid adhering, and then fixed by heating and drying.

Benefits of technology

This method achieves uniform adhesion of the protective film to the frame components, avoiding changes in light transmittance and density caused by uneven adhesion, and ensuring the overall quality of the protective film.

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Abstract

This pellicle pasting device is provided with: an affinity improvement treatment means for applying an affinity improvement treatment for improving the affinity with a liquid to a surface to be pasted of a first frame member; and a liquid attachment means for attaching the liquid to the surface to be pasted, which has been subjected to the affinity improvement treatment. And a pasting mechanism that pastes a protective film to the surface to be pasted to which the liquid adheres.
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Description

Technical Field

[0001] This invention relates to a protective film pasting device and method, as well as a protective film transfer device and method. Background Technology

[0002] Protective film pasting devices are known for pasting protective films onto the bonding surfaces of frame members (for example, see reference 1: Japanese Patent Application Publication No. 2020-160345).

[0003] In the device described in Document 1, since water (liquid) may not be able to adhere evenly to part 190A (bonded surface) of the frame member 190 (first frame member), there is a risk that the carbon nanotube self-supporting film 125 (protective film) may be unevenly bonded to the bonded surface of the first frame member.

[0004] Content of the invention

[0005] The purpose of this invention is to provide a protective film pasting device and method that can prevent the protective film from being unevenly pasted on the bonding surface of a frame member, as well as a protective film transfer device and method.

[0006] One embodiment of the protective film pasting device includes: an affinity enhancement treatment mechanism that performs an affinity enhancement treatment on the bonding surface of a first frame member to enhance its affinity with a liquid; a liquid adhesion mechanism that causes the liquid to adhere to the bonding surface on which the affinity enhancement treatment has been performed; and an pasting mechanism that pastes the protective film onto the bonding surface on which the liquid has adhered.

[0007] One embodiment of the protective film transfer apparatus includes: the protective film pasting device of the above-described embodiment, and a transfer mechanism for transferring the protective film pasted on the second frame member to the first frame member.

[0008] One embodiment of the protective film pasting method includes the following steps: an affinity enhancement treatment step, in which the bonding surface of the first frame member is subjected to an affinity enhancement treatment to improve its affinity with the liquid; a liquid adhesion step, in which the liquid is adhered to the bonding surface that has undergone the affinity enhancement treatment; and a pasting step, in which the protective film is pasted to the bonding surface on which the liquid has adhered.

[0009] One embodiment of the protective film transfer method includes the following steps: each step in the protective film pasting method of the above embodiment; and a transfer step, in which the protective film pasted on the second frame member is transferred to the first frame member.

[0010] According to the above-described apparatus and method, since the bonding surface of the first frame member is subjected to an affinity enhancement treatment, the liquid is uniformly adhered to the bonding surface, thus preventing the protective film from being unevenly adhered to the bonding surface of the first frame member. Attached Figure Description

[0011] Figure 1 This is a front view of a protective film transfer apparatus according to one embodiment of the present invention.

[0012] Figure 2 yes Figure 1 The diagram shows the operation of the protective film transfer device. Detailed Implementation

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0014] It should be noted that in this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other. The X-axis and Y-axis are axes within a given plane, and the Z-axis is an axis orthogonal to the given plane. Furthermore, in this embodiment, [the following is an explanation of the concept of "from the plane parallel to the Y-axis"]. Figure 1 When viewing from the near-forward direction as a reference point, "up" indicates the direction of the arrow along the Z-axis, "down" is its opposite, "left" indicates the direction of the arrow along the X-axis, "right" is its opposite, and "forward" is parallel to the Y-axis. Figure 1 The direction of "near" is forward, and "back" is the opposite direction.

[0015] The protective film pasting device EA comprises: an affinity enhancement treatment mechanism 10 that performs an affinity enhancement treatment process, which enhances the affinity of the bonding surface RF11 of the first frame member RF1 with water WT, which is a liquid selected from water WT, one or more low molecular weight alcohols, or combinations thereof; a liquid adhesion mechanism 20 that performs a liquid adhesion process, which adheres an exemplary water WT to the bonding surface RF11 that has undergone the affinity enhancement treatment; and an adhesion mechanism 30 that performs an adhesion process, which adheres the protective film CS to the bonding surface RF11 to which water WT is attached.

[0016] It should be noted that the affinity with the liquid refers to the property that the surface RF11 to which the liquid is attached is easily wetted by the liquid, and the liquid is preferably easily and evenly spread on the surface RF11 to be bonded. The affinity improvement treatment is preferably a treatment in which the contact angle of the liquid with the surface RF11 to be bonded is reduced after the affinity improvement treatment compared with the treatment before the affinity improvement treatment.

[0017] In this embodiment, the first frame member RF1 and the second frame member RF2 are composed of annular metal members with an opening in the center, and the protective film CS is formed to cover the size of the opening of the frame members RF1 and RF2. Furthermore, the protective film CS in this embodiment is a sheet formed of carbon nanotubes, and one side of the protective film CS (the bottom surface facing downwards) is adhered to the second frame member RF2 to form an adhesive SA2 for subsequent transfer of the protective film CS.

[0018] The protective film transfer device EA1 includes: a protective film pasting device EA and a transfer mechanism 40 for performing a transfer process, which transfers the protective film CS pasted on the second frame member RF2 to the first frame member RF1.

[0019] The affinity enhancement processing mechanism 10 includes: a linear motor 11 as a drive device; a linear motor 12 as a drive device supported by a slider 11A of the linear motor 11; and a plasma irradiator 13 as an irradiation mechanism supported by a slider 12A of the linear motor 12. The linear motor 11 moves the plasma irradiator 13 in the left-right direction. The linear motor 12 moves the plasma irradiator 13 in the front-back direction.

[0020] The liquid attachment mechanism 20 includes: a worktable 21, and a liquid supply mechanism 22 such as a pressure pump or impeller that supplies the aforementioned liquid or exemplary water WT to the worktable 21.

[0021] The workbench 21 includes: a support surface 21A (also referred to as the upward-facing XY plane of the workbench 21) having a liquid supply port 21B for supplying water WT to wet the support surface 21A (or subsequently to wet the downward-facing surface of the first frame member RF1); and a flow path 21C connected to the liquid supply mechanism 22 via a pipe 22A and communicating with the liquid supply port 21B.

[0022] The pasting mechanism 30 includes: a linear motor 31 as a drive device; a linear motion motor 32, supported by a slider 31A of the linear motor 31 and also a drive device; and a chuck cylinder 33, supported by the output shaft 32A of the linear motion motor 32 and having multiple holding members 33A for holding the first frame member RF1, serving as a holding mechanism. The linear motor 31 moves the chuck cylinder 33 in the left-right direction. The linear motion motor 32 moves the chuck cylinder 33 in the up-down direction.

[0023] The transfer mechanism 40 includes: a worktable 41 that supports the adhesive SA2; a heating mechanism 42 such as a coil heater and a heating side of a heat pipe that serves as a drying mechanism for drying the protective film CS; and a cutting mechanism 43 for cutting the protective film CS.

[0024] The worktable 41 includes: a support surface 41A for holding the lower surface of the adhesive SA2 in place by a pressure reduction mechanism (holding mechanism) not shown in the figure, such as a pressure reduction pump or a vacuum ejector; and a recess 41B formed in the support surface 41A.

[0025] The heating mechanism 42 is configured as an annular shape along the side of the recess 41B and is supported by the side.

[0026] The cutting mechanism 43 includes: a linear motor 43A, which serves as a drive device, disposed on the bottom surface of the recess 41B; a linear motor 43C, which also serves as a drive device, supported by a slider 43B of the linear motor 43A; and a laser cutter 43E, which is supported by a slider 43D of the linear motor 43C. The linear motor 43A moves the laser cutter 43E in the left-right direction. The linear motor 43C moves the laser cutter 43E in the front-back direction.

[0027] The operation of the protective film transfer device EA1, which is equipped with the above-mentioned protective film pasting device EA, will be explained.

[0028] First, for the protective film transfer device EA1, the user of the protective film transfer device EA1 (hereinafter referred to as "the user") inputs a signal to start automatic operation through an operating mechanism not shown in the figure, such as an operation panel or personal computer, and configures the various components of the protective film transfer device EA1. Figure 1 The initial position is indicated by a solid line. Next, when the user or a transport mechanism (not shown in the figure), such as a multi-joint robot or conveyor belt, places the adhesive SA2 onto the support surface 41A, the transfer mechanism 40 drives a pressure-reducing mechanism (not shown in the figure), such as... Figure 1 As shown in the diagram on the right, the adhesion and retention of the lower surface of the adhesive SA2 at the support surface 41A begins.

[0029] In one implementation, such as Figure 1 As shown in the left-hand diagram, when the user or a conveying mechanism (not shown) subsequently positions the first frame member RF1 between the multiple holding members 33A, the adhesive mechanism 30 drives the chuck cylinder 33, as... Figure 1 As shown by the double-dotted line on the left, the first frame member RF1 is held by the holding member 33A. Next, the affinity enhancement processing mechanism 10 drives the linear motors 11 and 12, causing the plasma irradiator 13 to circle the bonded surface RF11 of the first frame member RF1 once, irradiating the bonded surface RF11 with plasma to perform the affinity enhancement treatment. As a result, the affinity of the bonded surface RF11 is improved, and the surface is cleaned.

[0030] Then, as Figure 1As shown in the center, the liquid attachment mechanism 20 drives the liquid supply mechanism 22 to supply water WT to the liquid supply port 21B. Next, the adhesive mechanism 30 drives the linear motor 31 and the linear motion motor 32 to move the first frame member RF1 to the right, and then lowers it, as shown... Figure 1 As shown by the double-dotted line in the center, the water WT supplied to the liquid supply port 21B adheres to the bonding surface RF11 of the first frame member RF1. At this time, the water WT is evenly spread (coated) on the bonding surface RF11, which has undergone affinity enhancement treatment.

[0031] Then, the pasting mechanism 30 drives the linear motor 31 and the linear motion motor 32, causing the first frame member RF1 to rise and move to the right, positioning the first frame member RF1 above the protective film CS. Next, the pasting mechanism 30 drives the chuck cylinder 33, as... Figure 1 As shown by the double-dotted line on the right side, the gripping members 33A are brought closer together, compressing the first frame member RF1 inward. Then, the pasting mechanism 30 drives the linear motion motor 32, as... Figure 1 As shown by the double-dotted line, the first frame member RF1 is lowered, causing the water WT adhering to the bonding surface RF11 to come into contact with the upward-facing surface, which is the other side of the protective film CS. Thus, the protective film CS is adhered to the bonding surface RF11 by the water WT. Next, the transfer mechanism 40 heats and dries the protective film CS via the heating mechanism 42, and then the pasting mechanism 30 drives the chuck cylinder 33, causing the holding member 33A to move outward, releasing the compression of the first frame member RF1. This increases the tension of the protective film CS. Then, the laser cutter 43E moves along the outer periphery of the bonding surface RF11 via linear motors 43A and 43C, cutting the protective film CS. Thus, the protective film CS is divided into the protective film CS1 adhered to the first frame member RF1 and the useless piece US adhered to the second frame member RF2.

[0032] Next, the pasting mechanism 30 drives the linear motion motor 32, as follows: Figure 2 As shown, the first frame member RF1 is raised, and a protective film CS1 of a given shape is peeled off from the second frame member RF2. Thus, the protective film CS is transferred onto the first frame member RF1, forming an adhesive body SA1 with the protective film CS1 attached to the first frame member RF1. Then, a user or a conveying mechanism (not shown) conveys the adhesive body SA1 to the next process, and the second frame member RF2, with the unused piece US (i.e., the remaining portion of the protective film CS attached to the second frame member RF2) attached, is conveyed to a recycling mechanism such as a box or container, and the same operation is repeated thereafter.

[0033] According to the embodiment described above, since the bonding surface RF11 of the first frame member RF1 is subjected to an affinity enhancement treatment, water WT is uniformly adhered to the bonding surface RF11. This prevents the protective film CS from being unevenly adhered to the bonding surface RF11 of the first frame member RF1, and prevents a portion of the protective film CS1 from being folded, thus avoiding changes in the overall uniformity of the light transmittance of the protective film CS1 (i.e., changes in the density and porosity of the protective film CS1).

[0034] As described above, the optimal configuration, method, etc., for carrying out the present invention have been disclosed in the foregoing description, but the present invention is not limited thereto. That is, the present invention has been specifically illustrated and described with respect to particular embodiments; however, those skilled in the art can make various modifications to the above-described embodiments in terms of shape, material, quantity, and other detailed configurations without departing from the technical concept and purpose of the present invention. In addition, the foregoing descriptions that limit the shape, material, etc., are illustrative descriptions for ease of understanding of the present invention and do not limit the present invention; therefore, descriptions of the names of components that depart from some or all of these limitations on shape, material, etc., are also included in the present invention.

[0035] Furthermore, the mechanisms and processes in this invention are not limited to any specific embodiment as long as they can perform the actions, functions, or processes described herein, and are not limited to the components or processes of only one embodiment shown in the above embodiments. For example, the transfer mechanism can simply transfer the protective film pasted on the second frame member to the first frame member, and can be any mechanism, based on common technical knowledge at the time of application, as long as it is within its technical scope, without any limitation (the same applies to other mechanisms and processes).

[0036] The affinity enhancement treatment mechanism 10 can perform affinity enhancement treatment on the bonding surface RF11 of the first frame member RF1 before holding the first frame member RF1 by the chuck cylinder 33, or it can be configured to perform affinity enhancement treatment on multiple first frame members RF1 at one time, or it can be configured to perform affinity enhancement treatment on the bonding surface RF11 in an upward or horizontal state and then make the bonding surface RF11 face the water WT.

[0037] In another example of the affinity enhancement treatment mechanism 10, affinity enhancement treatment can be performed by irradiating the bonded surface RF11 with energy rays such as electron beams or microwaves using an electron beam irradiator or microwave irradiator. Affinity enhancement treatment can also be performed by heating or cooling the bonded surface RF11, or by using chemicals. When performing affinity enhancement treatment on the bonded surface RF11, any configuration can be adopted considering the characteristics, properties, characteristics, materials, composition, and structure of the first frame member RF1 and the bonded surface RF11.

[0038] The liquid adhesion mechanism 20 may be configured to, for example, adhere liquid to the bonded surface RF11 of the first frame member RF1 by means of spraying or blowing.

[0039] The liquid that is formed by adhering to the bonding surface RF11 can be made as long as it can adhere the protective film CS to the bonding surface RF11. Any composition can be adopted considering the characteristics, properties, materials, composition and structure of the first frame member RF1, the bonding surface RF11, and the protective film CS. For example, it can be a polar solvent such as isopropanol, methanol, ethanol and other low molecular weight alcohols, or a mixture of water and WT. In particular, from the viewpoint of not leaving any substances other than the protective film CS on the bonding surface RF11, it is preferable to be composed only of components that can be evaporated or volatilized by heat or natural drying, preferably water, organic solvents or mixtures thereof.

[0040] This method, particularly for nanotube protective films used in EUV lithography, avoids the common practice of applying adhesives to attach one object to another. Adhesives or their residues pose a risk of introducing unwanted volatile organic chemicals, contaminants, or particles into the ultra-clean semiconductor manufacturing environment, especially into the EUV lithography scanner. Removing the adhesive in any way can damage the protective film (CS) or introduce adhesive molecules that accumulate on the surface of the CS.

[0041] The pasting mechanism 30 can hold the first frame member RF1 with multiple chuck cylinders 33, and can compress the first frame member RF1 or not.

[0042] The holding mechanism can hold the first frame member RF1 by drive devices such as multi-joint robots, robotic arms, mechanical chucks, and actuators. Alternatively, it can replace the holding mechanism or be used in combination with it to have a holding mechanism that holds the first frame member RF1 by suction, adhesives, etc.

[0043] The transfer mechanism 40 may not have a heating mechanism 42, and may be able to adhere the bonding surface RF11 of the first frame member RF1 to one side of the protective film CS. It may also not have a cutting mechanism 43, and may not be used as a pasting mechanism 30. In the absence of a cutting mechanism 43, the protective film CS may be separated from the second frame member RF2 without cutting it. In the absence of a cutting mechanism 43 and without being used as a pasting mechanism 30, the protective film CS may also be separated from the second frame member RF2 by other means.

[0044] The drying mechanism may include a spraying mechanism such as a nozzle or spray pipe. Through the spraying mechanism, heated gas, including but not limited to heated air such as the heating mechanism 42 and inactive gas, is sprayed onto the protective film CS, preferably onto a portion of the protective film CS covering the surface of the first frame member RF1.

[0045] The frame components RF1 and RF2 can be formed from metals such as stainless steel, aluminum, copper, and brass, resins such as silicone, fluoropolymers, and acrylic resins, or ceramic materials. They are preferably made of silicon or quartz with a low coefficient of thermal expansion, and more preferably of silicon that is easy to process into the desired shape. They can be non-ring-shaped (without connected outer perimeters), or circular, elliptical, polygonal, or other shapes.

[0046] The protective film CS and frame components RF1 and RF2 in this invention are not particularly limited in terms of material, type, or shape. For example, the protective film CS and frame components RF1 and RF2 can be polygons such as circles, ellipses, triangles, and quadrilaterals, or other shapes.

[0047] The drive device in the above embodiments can be a single unit, such as a rotary motor, a linear motor, a linear motor, a single-axis robot, a so-called multi-joint robot with two or more joints, or an actuator such as a cylinder, a hydraulic cylinder, a rodless cylinder, or a rotary cylinder. It can also be a device that combines these electric devices and actuators directly or indirectly. It can also be a device that can or cannot perform torque control, speed control, etc. on the output of these electric devices and actuators.

[0048] In the above embodiments, for any object (hereinafter referred to as "object A") and an object moving relative to object A (hereinafter referred to as "object B"), that is, for the relatively moving object A and object B, object B can move relative to the stationary object A, object A can move relative to the stationary object B, or both object A and object B can move. As long as the result achieved by the movement is the same, either object A or object B can move. When a device for supporting (holding) a supported member (held member) is used, such as a support (holding) mechanism or support (holding) component, the supported member can be supported (held) by means of a mechanical chuck, chuck cylinder or other holding mechanism, Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive (adhesive sheet, adhesive tape), magnetism, Bernoulli adsorption, suction adsorption, drive equipment, etc. When a cutting mechanism, cutting member, or other device is used to cut the component to be cut, or to form a cut or cutting line on the component to be cut, a cutting device using a cutting blade, laser cutting machine, ion beam, electrical discharge machining, fire, heat, water pressure, heating wire, gas or liquid spray, etc., can be used instead of the above examples or in combination with them, or the cutting can be performed by moving the cutting member through a device composed of appropriate drive equipment.

Claims

1. A protective film pasting device, comprising: An affinity enhancement treatment mechanism is applied to the bonding surfaces of the first frame member to improve their affinity with liquids. The liquid adhesion mechanism that allows the liquid to adhere to the bonded surface after the affinity enhancement treatment has been applied, and An adhesive mechanism that attaches the protective film to the surface to be bonded where the liquid has adhered.

2. A protective film transfer device, comprising: The protective film pasting device according to claim 1, and The protective film, which is affixed to the second frame member, is transferred to the transfer mechanism of the first frame member.

3. A method for applying a protective film, comprising the following steps: The affinity enhancement process involves applying an affinity enhancement treatment to the bonding surface of the first frame member to improve its affinity with liquids. A liquid adhesion process, wherein the liquid is adhered to the bonding surface that has undergone the affinity enhancement treatment; and In the pasting process, the protective film is pasted onto the bonding surface that has the liquid attached to it.

4. A method for transferring a protective film, comprising the following steps: Each step of the protective film pasting method according to claim 3; and In the transfer process, the protective film that is pasted on the second frame component is transferred to the first frame component.

Citation Information

Patent Citations

  • Producing method of pellicle self-supporting film, producing method of pellicle, and producing method of semiconductor device

    JP2020160345A