Power supply device for semiconductor test based on electrical sensor

Abstract

The invention discloses a semiconductor test power supply device based on an electrical sensor, and relates to the technical field of semiconductor test. The power supply device for semiconductor testing based on the electrical sensor comprises a power supply assembly and a testing bin, a cold air input pipe is assembled on the side face of the power supply assembly, a power supply element placing bin is assembled in the power supply assembly, and a first magnetic type power supply element is assembled in the power supply element placing bin; a penetrating first hydraulic bin is assembled on the side face of the power supply assembly, a second hydraulic bin communicating with the first hydraulic bin is assembled on the side face of the first hydraulic bin, one end of the first hydraulic bin is slidably connected with an operating rod through a piston, and the other end of the first hydraulic bin is slidably connected with a first transmission rod through a piston. The device is used for solving the problem that a new power supply element is difficult to increase quickly when the voltage of a magnetic power supply element in the device is insufficient when different semiconductors are detected.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor testing technology, specifically a power supply device for semiconductor testing based on electrical sensors. Background Technology

[0002] The aging test of semiconductor lasers involves supplying power to the semiconductor laser at a preset power level, causing the semiconductor laser to operate continuously under a preset load. During this process, the power output status and the offset status of the emission band of the semiconductor laser are detected to determine whether there are any defects in the semiconductor laser.

[0003] Chinese Patent CN111239581A, published on June 5, 2020, discloses an aging test device for a single-tube semiconductor laser, which includes a mounting platform, a power supply connector, and a probe assembly. The mounting platform is used to mount the single-tube semiconductor laser to be tested. The power supply connector is mounted on the mounting platform and connected to the probe assembly. The power supply connector extends to a preset position on the upper side of the single-tube semiconductor laser to be tested, so that the end of the probe assembly contacts the electrode of the single-tube semiconductor laser to be tested.

[0004] In the aforementioned application, the semiconductors in the detection chamber are tested by inputting current into the detection probe. However, when the device tests different semiconductors, the voltage of the magnetic power supply component inside the device becomes insufficient, making it difficult to quickly add new power supply components, thus affecting the efficiency of the device. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a semiconductor testing power supply device based on an electrical sensor, solving the problems mentioned in the background section. To achieve the above objectives, this invention is implemented through the following technical solution: a semiconductor testing power supply device based on an electrical sensor, comprising a power supply component and a testing chamber; a cold air input pipe is mounted on the side of the power supply component; a power supply element placement chamber is mounted inside the power supply component; and a magnetically attached power supply element is mounted inside the power supply element placement chamber. The power supply component has a through hydraulic chamber 1 mounted on its side. The hydraulic chamber 1 has a hydraulic chamber 2 mounted on its side, which is connected to the hydraulic chamber 1. One end of the hydraulic chamber 1 is connected to a control lever via a piston. The other end of the hydraulic chamber 1 is connected to a transmission rod 1 via a piston. The bottom of the hydraulic chamber 2 is connected to a transmission rod 2 via a piston. A transmission component for transmission is mounted between the control lever and the transmission rod 1 and transmission rod 2. The power supply component has a cooling component and an auxiliary pressing component mounted inside.

[0006] Preferably, the transmission component includes a block rotatably connected within a hydraulic chamber, a damped rotating rod fixedly connected to the top of the block, a limiting block fixedly connected to the side of the rotating rod, and a magnetically attracted power supply element 2 assembled at the bottom of the rotating rod. This design allows for the first opening of the power supply element placement chamber before the magnetically attracted power supply element 2 is installed inside, improving the device's efficiency.

[0007] Preferably, the block is in a state of blocking the hydraulic chamber two when not in use.

[0008] Preferably, the cooling assembly includes a transmission rod three fixed to the sides of the transmission rod two; a fan wheel rotatably connected to the side of the cold air inlet pipe; a telescopic rod fixedly connected to the bottom of the fan wheel; a bevel gear one fixedly connected to the bottom of the telescopic rod; a torsion spring rod rotatably connected to the top of the test chamber; a bevel gear two and a sprocket one fixedly connected to the outer side of the torsion spring rod; a chain mounted on the outer side of the sprocket one; a guide rod rotatably connected inside the power supply assembly; a sprocket two fixedly connected to the outer side of the guide rod; and a guide plate fixedly connected to the side of the guide rod. By configuring the cooling assembly, after adding power supply components, cold air can be guided to various positions within the power supply assembly, improving the cooling effect of the device.

[0009] Preferably, the telescopic end of the telescopic rod is located on the side of the transmission rod three and is rotatably connected to the transmission rod three.

[0010] Preferably, the end of the chain furthest from the first sprocket is fitted to the outer side of the second sprocket.

[0011] Preferably, the auxiliary pressing assembly includes a hydraulic chamber three mounted on the top of the test chamber. A force-bearing rod is slidably connected to the top of the hydraulic chamber three via a piston. A spring one is mounted at the bottom of the force-bearing rod. A hydraulic hose communicating with the hydraulic chamber three is mounted on its side. A hydraulic chamber four is mounted on the side of the transmission rod one. A moving block is slidably connected to the side of the hydraulic chamber four via a piston. A transmission plate is fixedly connected to the side of the moving block. A spring two is mounted between the transmission plate and the limiting block. By setting up the auxiliary pressing assembly, additional pressure can be applied to the limiting block, thereby improving the stability of the power supply component during use.

[0012] Preferably, the end of the spring away from the force-bearing rod is fitted onto the inner wall of the hydraulic chamber.

[0013] Preferably, the end of the hydraulic hose furthest from the hydraulic chamber three is fitted to the side of the hydraulic chamber four and is connected to the hydraulic chamber four.

[0014] This invention provides a power supply device for semiconductor testing based on an electrical sensor. It has the following advantages: (1) When the device tests different semiconductors, resulting in insufficient voltage of the magnetic power supply element 1, the control lever is pulled to the right. In conjunction with the hydraulic chamber 1, hydraulic chamber 2, transmission rod 1, transmission rod 2, block, rotating rod 1 and limiting block, the power supply element placement chamber can be opened first, and then the magnetic power supply element 2 can be assembled in the power supply element placement chamber, which improves the efficiency of the device.

[0015] (2) The power supply device for semiconductor testing based on electrical sensors heats up the power supply component by inputting cold air into the power supply component through the cold air input pipe. When the transmission rod 2 moves downward, it works with the transmission rod 3, fan wheel, telescopic rod, bevel gear 1, torsion spring rod, bevel gear 2, sprocket 1, chain, guide rod and sprocket 2 to guide the cold air to various positions in the power supply component after the addition of power supply components, thereby improving the cooling effect of the device.

[0016] (3) When the first bevel gear moves downward to the second bevel gear, it can squeeze the force rod and drive the force rod to move downward. In conjunction with the third hydraulic chamber, the first spring, the hydraulic hose, the fourth hydraulic chamber, the moving block, the transmission plate and the second spring, additional pressure can be applied to the limiting block, thereby improving the stability of the power supply components during use. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the overall appearance of the present invention; Figure 2 This is a schematic diagram of the overall cross-sectional three-dimensional structure of the present invention; Figure 3 This is a three-dimensional structural diagram of some parts of the present invention; Figure 4 This is a three-dimensional structural diagram of some parts of the present invention; Figure 5 This is a three-dimensional structural diagram of the cooling component of the present invention; Figure 6 This is a three-dimensional structural diagram of some parts of the cooling assembly of the present invention; Figure 7 This is a three-dimensional structural diagram of the auxiliary pressing component of the present invention; Figure 8 This is a three-dimensional structural diagram of some parts of the auxiliary pressing component of the present invention.

[0018] In the picture: 100. Power supply assembly; 200. Test chamber; 300. Cold air inlet pipe; 400. Power supply component placement chamber; 500. Magnetic power supply component one; 601. Hydraulic chamber one; 602. Hydraulic chamber two; 603. Control lever; 604. Transmission rod one; 605. Transmission rod two; 606. Block; 607. Rotating rod one; 608. Limiting block; 609. Magnetic power supply component two; 700. Cooling assembly; 701. Transmission rod three; 702. Fan wheel; 703. Telescopic rod; 704. Bevel gear one; 705. Torsion spring rod; 706. Bevel gear two; 707. Sprocket one; 708. Chain; 709. Guide rod; 710. Sprocket two; 711. Guide plate; 800. Auxiliary pressing component; 801. Hydraulic chamber three; 802. Force rod; 803. Spring one; 804. Hydraulic hose; 805. Hydraulic chamber four; 806. Moving block; 807. Transmission plate; 808. Spring two. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort should fall within the scope of protection of the present application.

[0020] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate for the purposes of describing embodiments of this application herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0021] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0022] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0023] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] Example 1, please refer to Figures 1-4 A semiconductor testing power supply device based on an electrical sensor includes a power supply component 100 and a test chamber 200. A cold air inlet pipe 300 is mounted on the side of the power supply component 100, and a power supply component placement chamber 400 is mounted inside the power supply component 100. A magnetic power supply component 500 is mounted inside the power supply component placement chamber 400. A through-hole hydraulic chamber 601 is mounted on the side of the power supply assembly 100. A second hydraulic chamber 602, communicating with the first hydraulic chamber 601, is mounted on the side of the first hydraulic chamber 601. One end of the first hydraulic chamber 601 is connected to a control lever 603 via a piston, and the other end is connected to a transmission rod 604 via a piston. The bottom of the second hydraulic chamber 602 is connected to a transmission rod 605 via a piston. A transmission component for transmission is mounted between the control lever 603 and the transmission rods 604 and 605. The transmission component includes a block 606 rotatably connected within the first hydraulic chamber 601. When not in use, the block 606 blocks the second hydraulic chamber 602. When the device tests different semiconductors, causing insufficient voltage in the magnetically attached power supply component 500, [the following occurs]. Figure 4 As shown, when the control lever 603 is pulled to the right, the hydraulic chamber 601, which is connected to the control lever 603 by a piston, is engaged, and the block 606 is in a state of blocking the hydraulic chamber 602, so that the oil in the hydraulic chamber 601 is drawn out along with the control lever 603.

[0026] A damped rotating rod 607 is fixedly connected to the top of the block 606, a limiting block 608 is fixedly connected to the side of the transmission rod 604, and a magnetic power supply element 609 is mounted on the bottom of the transmission rod 605. When the transmission rod 605 moves out of the hydraulic chamber 602, it moves the magnetic power supply element 609 mounted on its bottom downwards, placing it into the power supply element placement chamber 400. In this way, after adding the power supply element, cool air can be directed to various positions within the power supply assembly 100, improving the cooling effect of the device.

[0027] During use, when the device tests different semiconductors, causing insufficient voltage in the magnetically attached power supply component 500, Figure 4 As shown, pulling the control lever 603 to the right engages hydraulic chamber 601, which is slidably connected to the control lever 603 via a piston. With the block 606 blocking hydraulic chamber 602, the oil in hydraulic chamber 601 is drawn out along with the control lever 603. The oil in hydraulic chamber 601 then flows away from the transmission rod 604, causing the transmission rod 604, which is slidably connected to hydraulic chamber 601 via a piston, to move into hydraulic chamber 601. The moving transmission rod 604 then moves the limiting block 608, which is fixedly connected to it, a certain distance, opening the power supply component placement chamber 400. Subsequently... Rotate the damped rotating rod 607 counterclockwise by 90 degrees to close the hydraulic chamber 601 and open the hydraulic chamber 602. Then move the control lever 603 to the left to allow oil to flow into the hydraulic chamber 602, pushing the oil originally stored in the hydraulic chamber 602. The oil then flows towards the side closer to the transmission rod 605, causing the transmission rod 605, which is connected to the hydraulic chamber 602 by a piston, to move out of the hydraulic chamber 602. The moving transmission rod 605 can then drive the magnetic power supply element 609 mounted at its bottom to move downwards, moving the magnetic power supply element 609 into the power supply element placement chamber 400.

[0028] Example 2, please refer to Figures 1-6 Based on Embodiment 1, a cooling assembly 700 is installed inside the power supply assembly 100. The cooling assembly 700 includes a transmission rod 701 fixed to the side of the transmission rod 605. Cool air is introduced into the power supply assembly 100 through the cold air inlet pipe 300 for heat dissipation. When the transmission rod 605 moves downward, it can drive the transmission rod 701 fixedly connected to it to move downward together.

[0029] A fan wheel 702 is rotatably connected to the side of the cold air inlet pipe 300. A telescopic rod 703 is fixedly connected to the bottom of the fan wheel 702. The telescopic end of the telescopic rod 703 is located on the side of the transmission rod 701 and is rotatably connected to the transmission rod 701. A bevel gear 704 is fixedly connected to the bottom of the telescopic rod 703. A torsion spring rod 705 is rotatably connected to the top of the test chamber 200. A bevel gear 706 and a sprocket 707 are fixedly connected to the outside of the torsion spring rod 705. A chain 708 is mounted on the outside of the sprocket 707. A guide rod 709 is rotatably connected inside the power supply assembly 100. A sprocket 710 is fixedly connected to the outside of the guide rod 709. The end of the chain 708 away from the sprocket 707 is mounted on the outside of the sprocket 710. A guide plate 711 is fixedly connected to the side of the guide rod 709. When the second sprocket 710 reciprocates at a certain angle, it drives the guide rod 709, which is fixedly connected to it, to rotate. This causes the guide rod 709 to drive the guide plate 711, which is fixedly connected to it, to reciprocate at a certain angle, guiding the cold air input through the cold air input pipe 300 to various positions within the power supply component 100. After adding the power supply component, the cooling effect of the device is improved.

[0030] In use, based on Embodiment 1, cold air is introduced into the power supply component 100 through the cold air inlet pipe 300 for heat dissipation. When the transmission rod 2 605 moves downward, it drives the transmission rod 3 701, which is fixedly connected to it, to move downward together. This causes the transmission rod 3 701 to drive the telescopic rod 703, which is rotatably connected to it, to move downward. As the telescopic end of the telescopic rod 703 extends, it drives the bevel gear 1 704, which is fixed to the outside of the telescopic end of the telescopic rod 703, to move downward together. The bevel gear 1 704 then moves downward to the position of bevel gear 2 706. The cold air in the cold air inlet pipe 300 drives the fan wheel 702 to rotate. The rotating fan wheel 702 can drive the bevel gear 1 704 to rotate through the telescopic rod 703. When the toothed side of the bevel gear 1 704 rotates to the position of bevel gear 2 706, the bevel gear 1 704 can drive the bevel gear 2 706, which is meshed with it, to rotate. This causes the bevel gear 2 706 to drive the bevel gear 2 706 to rotate. The torsion spring rod 705, which is fixedly connected to it, rotates at a certain angle. As the first bevel gear 704 continues to rotate, when the side without teeth rotates to the second bevel gear 706, the second bevel gear 706 loses its restraint and can rotate in the opposite direction under the action of the torsion spring rod 705 to reset. In this way, the torsion spring rod 705 can reciprocate at a certain angle, driving the first sprocket 707, which is fixedly connected to the torsion spring rod 705, to rotate synchronously. In conjunction with the chain 708 mounted on the outside of the first sprocket 707, the second sprocket 710, which is connected to the first sprocket 707 through the chain 708, can reciprocate at a certain angle. The rotating sprocket 710 can drive the guide rod 709, which is fixedly connected to it, to rotate. The guide rod 709 drives the guide plate 711, which is fixedly connected to it, to reciprocate at a certain angle, guiding the cold air input through the cold air input pipe 300 to various positions within the power supply component 100.

[0031] Example 3, please refer to Figures 1-8 Based on Embodiments 1 and 2, the power supply assembly 100 is internally equipped with an auxiliary pressing assembly 800. The auxiliary pressing assembly 800 includes a hydraulic chamber 3 801 mounted on the top of the test chamber 200. The top of the hydraulic chamber 3 801 is slidably connected to a force-bearing rod 802 via a piston. When the bevel gear 1 704 moves downward to the bevel gear 2 706, it can squeeze the force-bearing rod 802 and drive the force-bearing rod 802 downward.

[0032] A spring 803 is mounted at the bottom of the force-bearing rod 802. The end of the spring 803 away from the force-bearing rod 802 is mounted on the inner wall of the hydraulic chamber 801. A hydraulic hose 804 connected to the side of the hydraulic chamber 801 is mounted on the side of the transmission rod 604. A hydraulic chamber 805 is mounted on the side of the transmission rod 604. The end of the hydraulic hose 804 away from the hydraulic chamber 801 is mounted on the side of the hydraulic chamber 805 and connected to it. A moving block 806 is slidably connected to the side of the hydraulic chamber 805 via a piston. A transmission plate 807 is fixedly connected to the side of the moving block 806. A spring 808 is mounted between the transmission plate 807 and the limiting block 608. When the moving block 806 moves out of the hydraulic chamber 805, it can drive the transmission plate 807 fixedly connected to it to move a certain distance. With the help of the spring 808, additional pressure can be applied to the limiting block 608 through the spring 808, thereby improving the stability of the power supply component during use.

[0033] In use, based on Embodiments 1 and 2, when the first bevel gear 704 moves downward to the second bevel gear 706, it can squeeze the force rod 802 and drive it to move downward. This, combined with the hydraulic chamber 3 801 which is slidably connected to the force rod 802 via a piston, causes the oil originally stored in the hydraulic chamber 3 801 to flow into the hydraulic hose 804 connected to the hydraulic chamber 3 801. A portion of the oil in the hydraulic hose 804 then flows into the hydraulic chamber 4 805 connected to it, causing the oil in the hydraulic chamber 4 805 to move towards the moving block 806. The flow on one side causes the moving block 806, which is connected to the hydraulic chamber 805 by a piston, to move out of the hydraulic chamber 805. The moving block 806, in its moving state, can drive the transmission plate 807, which is fixedly connected to it, to move a certain distance. In conjunction with the second spring 808, the second spring 808 can apply additional pressure to the limiting block 608. Similarly, when the bevel gear 704 moves upward to reset, the force rod 802 loses its restriction and can be reset under the action of the first spring 803. Similarly, the auxiliary pressing component 800 can be reset.

[0034] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0035] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A power supply device for semiconductor testing based on electrical sensors, comprising a power supply component and a test chamber, characterized in that, The side of the power supply assembly is equipped with a cold air inlet pipe, and the inside of the power supply assembly is equipped with a power supply component placement compartment, and the inside of the power supply component placement compartment is equipped with a magnetic power supply component. The power supply component has a through hydraulic chamber 1 mounted on its side. The hydraulic chamber 1 has a hydraulic chamber 2 mounted on its side, which is connected to the hydraulic chamber 1. One end of the hydraulic chamber 1 is connected to a control lever via a piston. The other end of the hydraulic chamber 1 is connected to a transmission rod 1 via a piston. The bottom of the hydraulic chamber 2 is connected to a transmission rod 2 via a piston. A transmission component for transmission is mounted between the control lever and the transmission rod 1 and transmission rod 2. The power supply component has a cooling component and an auxiliary pressing component mounted inside.

2. The power supply device for semiconductor testing based on an electrical sensor according to claim 1, characterized in that: The transmission component includes a block rotatably connected within a hydraulic chamber, a damped rotating rod fixedly connected to the top of the block, a limiting block fixedly connected to the side of the transmission rod, and a magnetic power supply element 2 assembled at the bottom of the transmission rod.

3. The power supply device for semiconductor testing based on an electrical sensor according to claim 2, characterized in that: When not in use, the block is in a state of blocking the hydraulic chamber two.

4. The power supply device for semiconductor testing based on an electrical sensor according to claim 2, characterized in that: The cooling assembly includes a transmission rod three fixed to the two sides of the transmission rod, a fan wheel rotatably connected to the side of the cold air input pipe, a telescopic rod fixedly connected to the bottom of the fan wheel, a bevel gear one fixedly connected to the bottom of the telescopic rod, a torsion spring rod rotatably connected to the top of the test chamber, a bevel gear two and a sprocket one fixedly connected to the outer side of the torsion spring rod respectively, a chain mounted on the outer side of the sprocket one, a guide rod rotatably connected inside the power supply assembly, a sprocket two fixedly connected to the outer side of the guide rod, and a guide plate fixedly connected to the side of the guide rod.

5. A semiconductor testing power supply device based on an electrical sensor according to claim 4, characterized in that: The telescopic end of the telescopic rod is located on the side of the transmission rod three and is rotatably connected to the transmission rod three.

6. A power supply device for semiconductor testing based on an electrical sensor according to claim 4, characterized in that: The end of the chain furthest from the first sprocket is fitted onto the outer side of the second sprocket.

7. A power supply device for semiconductor testing based on an electrical sensor according to claim 4, characterized in that: The auxiliary pressing assembly includes a hydraulic chamber three mounted on the top of the test chamber. A force-bearing rod is slidably connected to the top of the hydraulic chamber three via a piston. A spring one is mounted at the bottom of the force-bearing rod. A hydraulic hose communicating with the hydraulic chamber three is mounted on the side of the hydraulic chamber three. A hydraulic chamber four is mounted on the side of the transmission rod one. A moving block is slidably connected to the side of the hydraulic chamber four via a piston. A transmission plate is fixedly connected to the side of the moving block. A spring two is mounted between the transmission plate and the limiting block.

8. A semiconductor testing power supply device based on an electrical sensor according to claim 7, characterized in that: The end of the spring away from the force-bearing rod is fitted onto the inner wall of the hydraulic chamber.

9. A power supply device for semiconductor testing based on an electrical sensor according to claim 7, characterized in that: The end of the hydraulic hose furthest from the hydraulic chamber three is fitted to the side of the hydraulic chamber four and is connected to the hydraulic chamber four.

Images