Optical module

Abstract

The invention discloses an optical module, and relates to the technical field of optical communication equipment packaging, the optical module comprises a shell, a circuit board, a heat sink, a transmitting end assembly and a first photoelectric chip, the circuit board is provided with an upper surface and a lower surface which are the back surfaces of each other, and a through hole is formed in the circuit board in the thickness direction of the circuit board; the heat sink is connected with the lower surface of the circuit board and at least partially covers the through hole; the transmitting end assembly is arranged on the heat sink and is at least partially located in the coverage range of the through hole; the first photoelectric chip is arranged on the heat sink or the lower surface of the circuit board and is electrically connected with the circuit board; light emitted by the transmitting end assembly enters the first photoelectric chip, is processed by the first photoelectric chip and then is emitted from the first photoelectric chip; according to the optical module, the through hole is formed in the circuit board, and the position of the optical chip at the transmitting end is adjusted, so that the space utilization rate of the optical module in the vertical direction is improved, the element integration level and the heat dissipation performance are further improved, and meanwhile, the signal transmission rate and the signal integrity are improved.

Description

Technical Field

[0001] This invention relates to the field of optical communication equipment packaging technology, and more particularly to an optical module. Background Technology

[0002] In the current field of optical communication technology, using silicon photonics chips to achieve photoelectric conversion is a mainstream technical solution adopted by high-speed optical modules. In some high-speed optical modules, silicon photonics chips are only used at the transmitting end, while the receiving end still uses traditional photodiodes (PDs) for photoelectric signal conversion. Typically, the PD and trans-impedance amplifier (TIA) are bonded to the circuit board using gold wire bonding. The receiving surface of the PD is parallel to the circuit board surface, and the optical signal emitted from the fiber array at the receiving end is also parallel to the circuit board surface. In order to couple the optical signal at the receiving end to the receiving surface, a fiber array with tilted end faces and a lens are required. The tilted end faces and the lens work together to perform optical path turning and convergence.

[0003] Because the longitudinal space inside the housing of the entire optical module is very limited, in conventional technical solutions, the optical path of the receiver is turned and converged above the PD receiving surface. Adjusting the height of the optical path is difficult. A certain height of pad needs to be glued between the fiber array of the receiver and the circuit board to adjust the distance between the optical path turning point and the receiving surface. This solution is not conducive to the coupling and assembly between devices, and the circuit board also hinders the heat dissipation of the devices to some extent. Summary of the Invention

[0004] This application provides an optical module designed to address the problem of limited space in existing high-speed optical modules.

[0005] To achieve the above objectives, this application provides an optical module, including a housing, a circuit board, a heat sink, an emitting end assembly, and a first optoelectronic chip; a mounting cavity is formed within the housing, the circuit board is disposed within the mounting cavity and has an upper surface and a lower surface that are opposite to each other, a through hole is formed along the thickness direction of the circuit board, the heat sink is disposed within the mounting cavity and connected to the lower surface of the circuit board, the heat sink at least partially covers the through hole, the emitting end assembly is disposed on the heat sink and at least partially located within the coverage area of ​​the through hole, the first optoelectronic chip is disposed on the lower surface of the circuit board on the heat sink and electrically connected to the circuit board, and at least partially located within the through hole or at least partially located within the coverage area of ​​the through hole; light emitted by the emitting end assembly is incident on the first optoelectronic chip, processed by the first optoelectronic chip, and emitted from the first optoelectronic chip.

[0006] In some embodiments of this application, the first optoelectronic chip further comprises an upper surface and a lower surface that are opposite to each other, the lower surface of which is connected to the heat sink, the lower surface of the first optoelectronic chip being flush with the lower surface of the circuit board, and the lower surface of the first optoelectronic chip being electrically connected to the circuit board.

[0007] Furthermore, the lower surface of the first optoelectronic chip is electrically connected to the lower surface of the circuit board via bonding gold wires.

[0008] Furthermore, the heat sink has a notch at the position corresponding to the bonding gold wire, a portion of the lower surface of the first optoelectronic chip is located at the notch, and the other portion is bonded and fixed to the heat sink. The position where the lower surface of the first optoelectronic chip and the circuit board are electrically connected is located in the notch.

[0009] Furthermore, one end of the first optoelectronic chip that is electrically connected to the circuit board abuts against the circuit board.

[0010] Furthermore, one end of the first optoelectronic chip that is electrically connected to the circuit board is suspended outside the heat sink. The portion of the first optoelectronic chip that is suspended outside the heat sink is provided with an electrical connection point, and the electrical connection point is electrically connected to the circuit board through a gold wire.

[0011] In some embodiments of this application, the heat sink has a width matching that of the circuit board, and at least a portion of the edge of the heat sink on one side surface facing the circuit board forms an adhesive area to adhere to the lower surface of the circuit board, and at least a portion of the central position forms a component area to place the transmitter assembly and the first optoelectronic chip; the component area at least partially covers the through hole; the transmitter assembly includes at least a laser, a lens, and an isolator.

[0012] Furthermore, on the side surface of the heat sink facing the circuit board, bumps and / or grooves are provided corresponding to the position of the transmitter assembly, so as to adjust the height of each device in the transmitter assembly and couple the light emitted by the laser to the first optoelectronic chip.

[0013] In some embodiments of this application, the optical module further includes a digital processing chip. The two opposite ends of the housing in the longitudinal direction are the electrical interface and the optical interface of the optical module. The digital processing chip is disposed on the lower surface of the circuit board, between the first optoelectronic chip and the electrical interface, and is electrically connected to the circuit board.

[0014] Furthermore, the heat sink is thermally connected to the housing, and the digital processing chip is thermally connected to the housing.

[0015] Furthermore, the optical module also includes a receiver assembly disposed on the upper surface of the circuit board and at least partially located within the coverage area of ​​the through hole; the receiver assembly is electrically connected to the circuit board.

[0016] Through the above embodiments of the present invention, at least the following technical effects can be achieved: By setting through holes on the circuit board, the transmitter assembly and the first optoelectronic chip are placed on the heat sink, and the optoelectronic chip of the transmitter can be arranged in the space left in the vertical direction of the through hole. Furthermore, the optoelectronic chip of the transmitter, i.e., the first optoelectronic chip, is directly connected to the circuit board, resulting in a shorter signal transmission path, better signal integrity, and faster speed. Moreover, due to the more compact layout of the first optoelectronic chip and the various devices on the heat sink in the vertical direction, the overall size of the optical module is further reduced. Simultaneously, the heat sink partially or completely covers the through hole, which can improve the heat dissipation efficiency of the devices within the through hole.

[0017] Furthermore, some embodiments further shorten the signal transmission path by arranging the digital processing chip and the first optoelectronic chip on the same side of the circuit board. Simultaneously, this also brings the digital processing chip closer to the heat sink, facilitating heat conduction from the digital processing chip to the heat sink and further improving heat dissipation performance. Attached Figure Description

[0018] The technical solution and other beneficial effects of the present invention will become apparent from the following detailed description of specific embodiments of the invention, in conjunction with the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the optical module 100 model in Embodiment 1;

[0020] Figure 2 This is a magnified view of part A in Example 1;

[0021] Figure 3-a This is a schematic diagram of part A in Example 1;

[0022] Figure 3-b This is a schematic diagram of part A in Example 2;

[0023] Figure 3-c This is a schematic diagram of part A in Example 3;

[0024] Figure 4 This is a schematic diagram of the circuit 200 in Embodiment 1 with the lower surface 220 facing upwards;

[0025] Figure 5 This is a schematic diagram of the heat sink 300 model in Example 1;

[0026] Figure 6 This is an exploded view of the model of the first optoelectronic chip 500 when the lower surface 220 of the circuit 200 faces upward in Embodiment 2;

[0027] Figure 7 This is a schematic diagram of the structure and optical path of an optical module in conventional technology.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100. Optical module; 101. Lens; 102. Gold wire; 103. Spacer block;

[0030] 110. Housing; 111. Electrical interface; 112. Optical interface;

[0031] 200, Circuit board; 201, Through hole; 210, Upper surface of circuit board 200; 220, Lower surface of circuit board 200;

[0032] 300, Heat sink; 310, Bonding area; 320, Component area; 330, Notch; 301, Bump; 302, Groove;

[0033] 400. Transmitter assembly; 410. Laser; 420. Isolator;

[0034] 500, First optoelectronic chip; 501, Upper surface of first optoelectronic chip 500; 502, Lower surface of first optoelectronic chip 500; 510, Second optoelectronic chip; 520, Digital processing chip;

[0035] 600. Receiver assembly; 610. Photodetector; 611. Light-receiving surface; 620. Transimpedance amplifier;

[0036] 700. Receiver fiber array; 710. Receiver fiber; 720. Receiver fiber connector; 721. Receiver coupling end face; 722. Tilt end face;

[0037] 800. Transmitter fiber array; 810. Transmitter fiber; 820. Transmitter fiber connector; 821. Transmitter coupling end face. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0039] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, the character " / " in this document, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0040] Unless otherwise expressly specified and limited, the terms “center,” “upper,” “lower,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0041] Unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0042] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] Unless otherwise expressly specified and limited, the terms "a," "one," or "the," and similar words do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "including," "comprising," or similar words mean that the elements or objects preceding "including" encompass the elements or objects listed following "including" or their equivalents, and do not exclude other elements or objects. The terms "upper," "lower," "left," and "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0044] In this application Figures 1-6 These are schematic diagrams of various embodiments of this application. Figure 7 This is a reference for conventional techniques. Figure 1 , Figure 7 An optical module includes at least an optical fiber assembly, a circuit board, and transmitter and receiver devices integrated on the circuit board, thereby transmitting optical signals and converting photoelectric signals. In conventional technology, using... Figure 7 Taking the schematic diagram of the optical module structure and optical path in conventional technology as an example, a receiving fiber array 700, a photodetector 610, and a transimpedance amplifier 620 are arranged on the top of the circuit board 200. The circuit board 200 has no through holes at the corresponding positions of the receiving fiber array 700. In the receiving fiber array 700, the end face of the receiving fiber connector 720 is an inclined end face 722. After the optical path bends at the inclined end face 722, it is converged by the lens 101 to the light-receiving surface 611 of the photodetector 610. The optical signal is converted into an electrical signal by the photodetector 610 and the transimpedance amplifier 620. Because a spacer 103 needs to be placed between the receiving fiber array 700 and the circuit board 200 to adjust the distance between the optical path bend and the light-receiving surface 611, the thickness of the optical module cannot be further reduced, and it is not conducive to heat dissipation. The coupling and assembly of the receiving fiber array 700 with other devices is also more difficult. In the embodiments provided in this application, the optical module 100 integrates the receiving and transmitting components on the upper and lower surfaces of a single circuit board 200, respectively, and places the component portion within the through-hole 201, thereby improving the space utilization of the entire optical module 100 in the direction perpendicular to the circuit board 201. Compared to conventional designs, the optical module 100 provided in this application is thinner and has a higher integration density.

[0045] This application provides an optical module 100 according to embodiment one. (Refer to...) Figure 1 , Figure 2 and Figure 3-a ,in Figure 1 This is a schematic diagram of the optical module 100 model in Embodiment 1. Figure 2 This is a magnified view of part A in Example 1. Figure 3-a This is a schematic cross-sectional view of the structure of part A along the longitudinal direction of the shell in Embodiment 1.

[0046] In Embodiment 1, the optical module 100 includes a housing 110, a circuit board 200, a heat sink 300, a transmitter assembly 400, and a first optoelectronic chip 500. The housing 110 has a mounting cavity, and the circuit board 200 is disposed within the mounting cavity. The two opposite ends of the housing 110 in the longitudinal direction are an electrical interface 111 and an optical interface 112, respectively. The circuit board 200 has an upper surface 210 and a lower surface 220 that are opposite to each other. The circuit board 200 has a through hole 201 along its thickness direction. The heat sink 300 is disposed on the lower surface 220 of the circuit board 200 and covers the through hole 201. The transmitter assembly 400 is disposed on the heat sink 300 and includes a laser 410, a lens 101, and an isolator 420. The first optoelectronic chip 500 is disposed on the heat sink 300 and located within the through hole 201.

[0047] like Figure 2 and Figure 3-a As shown, the optical module 100 in Embodiment 1 further includes a receiving fiber array 700, a transmitting fiber array 800, a second optoelectronic chip 510, and a digital processing chip 520. The receiving fiber array 700 and the transmitting fiber array 800 are respectively disposed on the upper and lower surfaces opposite to each other on the circuit board 200. The second optoelectronic chip 510 is disposed on the upper surface 210 of the circuit board 200 and is optically coupled to the receiving fiber array 700 through a receiving coupling end face 721. One end face of the second optoelectronic chip 510 with a waveguide abuts against the receiving coupling end face 721, aligning the optical paths. After the optical signal reaches the receiving coupling end face 721 of the receiving fiber connector 720 along the receiving fiber 710, it enters the waveguide of the second optoelectronic chip 510 from the receiving coupling end face 721. The second optoelectronic chip 510 performs the conversion of the photoelectric signal. Since the receiving end coupling face 721 and the second optoelectronic chip 510 are directly connected via a vertical end face, the transmission of optical signals does not require optical path turning and convergence. The first optoelectronic chip 500 and the transmitting fiber array 800 are optically coupled through the transmitting end coupling face 821. After being processed by the first optoelectronic chip 500, the optical signal is injected into the transmitting end coupling face 821 and transmitted along the transmitting fiber 810. The digital processing chip 520 is arranged on the lower surface 220 of the circuit board 200 and is electrically connected to the circuit board 200 via flip-chip bonding.

[0048] exist Figure 1 In section A shown, the through-hole 201 is located between the electrical interface 111 and the optical interface 112. Figure 3-a In the schematic diagram of part A shown, the position and shape of the through hole 201 are indicated by the dashed shaded frame in the center of the circuit board 200. For example... Figure 3-aAs shown, the first photoelectric chip 500 is entirely placed within the through-hole 201. The lower surface 502 of the first photoelectric chip 500 is flush with the lower surface 220 of the circuit board 200 and is mounted on the heat sink 300, and is electrically connected to the lower surface 220 of the circuit board 200 via gold wires 102. The receiving fiber array 700 is directly fixed to the first photoelectric chip 500. It should be noted that the gold wires 102 in the figure are only schematic; in reality, there is more than one gold wire, and they are very thin.

[0049] To further illustrate the structure of part A in Embodiment 1, this application provides Figure 4 For reference only. Figure 4 This is a schematic diagram of circuit 200 in Embodiment 1 with its lower surface 220 facing upwards. Figure 4 As shown, the first optoelectronic chip 500 is disposed within the through hole 201, and the first optoelectronic chip 500 abuts against the wall of the through hole 201 of the circuit board 200. At the position corresponding to the first optoelectronic chip 500, the width of the through hole 201 is equal to the width of the first optoelectronic chip 500. This arrangement of the through hole 201 facilitates the fixing and wire bonding of the first optoelectronic chip 500. At the same time, at positions other than the first optoelectronic chip 500, the width of the through hole 201 widens, leaving more space for other components.

[0050] Continue to refer to Figure 4 The first photoelectric chip 500 is electrically connected to the circuit board 200 via a gold wire 102, with the wire bonding point located on the first photoelectric chip 500 near the digital processing chip 520. The two ends of the gold wire 102 are respectively connected to the lower surface 220 of the circuit board 200 and the edge of the first photoelectric chip 500. Figure 1 As can be seen, there are two digital processing chips 520 in Embodiment 1, both located between the first optoelectronic chip 500 and the electrical interface 111, and both arranged on the lower surface 220 of the circuit board 200. The digital processing chip 520 is close to the through hole 201 and the first optoelectronic chip 500, which facilitates shortening the signal transmission path and improving the high-frequency signal characteristics. It should be noted that in this embodiment, the digital processing chip 520 is electrically connected to the circuit board 200 by flip-chip soldering, but the digital processing chip 520 can also be electrically connected to the lower surface 220 of the circuit board 200 through gold wire 102. In addition, a heat-conducting component (not shown in the figure) can also be provided on the digital processing chip 520 to facilitate thermal connection between the digital processing chip 520 and the housing 110.

[0051] To illustrate the structure and shape of the heat sink 300 in Embodiment 1 and the device layout on the heat sink 300, this application provides Figure 5 For reference only. Figure 5 This is a schematic diagram of the heat sink 300 model in Example 1. Figure 5 As shown, combined with Figure 2 As shown in the enlarged detail view of part A, in Embodiment 1, the width b of the heat sink 300 is less than or equal to the width of the circuit board 200, but greater than the width of the through hole 201. The length a is approximately equal to the length of the through hole 201. A transmitter fiber array 800 and a transmitter assembly 400 are arranged on the heat sink 300. The transmitter assembly 400 includes four sets of lasers 410, lenses 101, and isolators 420 arranged on both sides of the transmitter fiber array 800. The uniform arrangement of devices, including the lasers 410, on the heat sink 300 prevents excessive heat concentration. The narrow gaps and compact layout of the devices in the transmitter assembly 400 prevent collisions between the devices and the surface of the circuit board 200 during assembly.

[0052] Continue to refer to Figure 5 In Embodiment 1, the heat sink 300 includes an adhesive area 310 at the edge and a component area 320 at the center on the side facing the circuit board 200. The adhesive area 310 is bonded to the lower surface 220 of the circuit board 200. The component area 320 houses the transmitter assembly 400 and the first optoelectronic chip 500. The heat sink 300 has a groove 302 at the position corresponding to the transmitter fiber 810 to facilitate the assembly of the transmitter fiber 810. A protrusion 301 is provided at the position corresponding to the isolator 420 to adjust the height of the isolator 420 to receive the emitted light from the laser 410. A notch 330 is provided at the position corresponding to the first optoelectronic chip 500. The notch 330 is a missing portion of the heat sink 300. The notch 330 facilitates wire bonding between the first optoelectronic chip 500 and the lower surface of the circuit board 200.

[0053] It should be noted that in Embodiment 1, the heat sink 300 forms two side bonding areas 310 at both ends of its width b, and a component area 320 in the central region. The bonding areas 310 are as follows... Figure 5 As shown by the gray shaded box at the edge of the heat sink 300, the component area 320 is as follows. Figure 5 The gray shaded area in the center of the heat sink 300 is shown. The height of the component area 320 is lower than the plane containing the bonding area 310. However, in some feasible embodiments, the bonding area 310 can also be formed at both ends of length a, and the component area 320 can be flush with the height of the bonding area 310. Furthermore, in other feasible embodiments, the heat sink 300 may not have a notch 330, allowing the first optoelectronic chip 500 to be partially mounted on the heat sink 300, with one end of its wire bonding position suspended outside the heat sink 300. This also leaves space for wire bonding on the lower surface of the first optoelectronic chip 500, facilitating manufacturing.

[0054] The second embodiment provided in this application is largely the same as the first embodiment, and its model diagram can be referred to. Figure 1 However, the structure of part A is slightly different from that in Example 1. Figure 3-b This is a schematic diagram of part A in Embodiment 2. Figure 3-b As shown, the position and shape of the through-hole 201 are indicated by the dashed shaded area in the center of the circuit board 200. The first optoelectronic chip 500 is partially placed inside the through-hole 201. The upper surface 501 of the first optoelectronic chip 500 is higher than the lower surface 220 of the circuit board 200. The lower surface 502 of the first optoelectronic chip 500 is attached to the heat sink 300 and electrically connected to the lower surface 220 of the circuit board 200 via gold wire 102. To adjust the height of the receiving fiber array 700, a spacer 103 is also provided between the first optoelectronic chip 500 and the receiving fiber connector 720.

[0055] To further illustrate the structure of part A in Embodiment 2, this application provides Figure 6 For reference only. Figure 6 This is an exploded view of the first photoelectric chip 500 when the lower surface 220 of circuit 200 faces upwards in Embodiment 2. Figure 6 As shown, the through-hole 201 of the circuit board 200 in Embodiment 2 is roughly the same as that in Embodiment 1. However, in this embodiment, the thickness h2 of the circuit board 200 exceeds the thickness h1 of the first optoelectronic chip 500. A spacer 103 is provided between the first optoelectronic chip 500 and the receiving fiber array 700 to match the height required for coupling and docking between the receiving fiber array 700 and the second optoelectronic chip 510. The spacer 103 can adjust the position of the first optoelectronic chip 500 so that its lower surface extends beyond the lower surface 220 of the circuit board 200 or is flush with the lower surface 220 of the circuit board 200. Alternatively, when the position of the first optoelectronic chip 500 is fixed, the spacer 103 is attached to the upper surface of the first optoelectronic chip 500 to support the receiving fiber array 700 and adjust its height.

[0056] The third embodiment provided in this application is largely the same as the first embodiment, and its model diagram can be referred to. Figure 1 However, the structure of part A is slightly different from that of Embodiment 1 and Embodiment 2. Figure 3-c This is a schematic diagram of part A in Embodiment 3. Figure 3-cAs shown, the position and shape of the through-hole 201 are indicated by the dashed shaded area in the center of the circuit board 200. The upper surface 501 of the first optoelectronic chip 500 is attached to the lower surface 220 of the circuit board 200, and the lower surface 502 of the first optoelectronic chip 500 is electrically connected to the lower surface 220 of the circuit board 200 via a gold wire 102. It should be noted that, in this embodiment, to facilitate the fixed installation of the receiving fiber optic connector 720, the through-hole 201 is not completely through at the corresponding position of the receiving fiber optic connector 720, and the end of the first optoelectronic chip 500 that is connected to the transmitting fiber optic array 800 is aligned with the edge of the through-hole 201. With this configuration, no spacer is needed between the first optoelectronic chip 500 and the receiving fiber optic connector 720, which facilitates the fixed assembly of both with the circuit board 200.

[0057] In the above embodiments, both the receiving fiber optic connector 720 and the transmitting fiber optic connector 820 are partially located within the through-hole 201 in a direction perpendicular to the circuit board 200. Furthermore, to facilitate the integration of the receiving fiber 710 and the transmitting fiber 810 into the optical interface 112, the through-hole 201 extends along the longitudinal direction of the circuit board 200 towards the end of the circuit board 200 closest to the optical interface 112 at the positions corresponding to the receiving fiber 710 and the transmitting fiber 810.

[0058] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. An optical module, characterized in that, include: The housing has an internal mounting cavity; A circuit board is disposed in the mounting cavity and has an upper surface and a lower surface that are opposite to each other. The circuit board has through holes along its thickness direction. A heat sink is disposed within the mounting cavity and connected to the lower surface of the circuit board, the heat sink at least partially covering the through hole; The transmitter assembly is disposed on the heat sink and is at least partially located within the coverage area of ​​the through hole; A first optoelectronic chip is disposed on the heat sink or the lower surface of the circuit board and electrically connected to the circuit board, and the first optoelectronic chip is at least partially located inside the through hole or at least partially located within the coverage area of ​​the through hole; The light emitted by the transmitting component is incident on the first optoelectronic chip, processed by the first optoelectronic chip, and then emitted from the first optoelectronic chip.

2. The optical module according to claim 1, characterized in that, The first optoelectronic chip has an upper surface and a lower surface that are opposite to each other. Its lower surface is connected and fixed to the heat sink. The first optoelectronic chip is completely housed in the through hole. The lower surface of the first optoelectronic chip is flush with the lower surface of the circuit board. The lower surface of the first optoelectronic chip is electrically connected to the circuit board.

3. The optical module according to claim 2, characterized in that, The lower surface of the first optoelectronic chip is electrically connected to the lower surface of the circuit board via bonding gold wires.

4. The optical module according to claim 3, characterized in that, The heat sink has a notch at the position corresponding to the bonding gold wire. A portion of the lower surface of the first optoelectronic chip is located at the notch, and the other portion is bonded and fixed to the heat sink. The position where the lower surface of the first optoelectronic chip is electrically connected to the circuit board is located in the notch.

5. The optical module according to claim 2, characterized in that, One end of the first optoelectronic chip that is electrically connected to the circuit board abuts against the wall of the through hole of the circuit board.

6. The optical module according to claim 3, characterized in that, One end of the first optoelectronic chip that is electrically connected to the circuit board is suspended outside the heat sink. The part of the first optoelectronic chip that is suspended outside the heat sink is provided with an electrical connection point, and the electrical connection point is electrically connected to the circuit board through a gold wire.

7. The optical module according to claim 1, characterized in that, The heat sink has a width that matches the circuit board. On one side surface of the heat sink facing the circuit board, at least a portion of the edge position forms an adhesive area to adhere to the lower surface of the circuit board, and at least a portion of the central position forms a component area to place the transmitter assembly and the first optoelectronic chip. The component area at least partially covers the through hole; The transmitter assembly includes at least a laser, a lens, and an isolator.

8. The optical module according to claim 7, characterized in that, On the side surface of the heat sink facing the circuit board, bumps and / or grooves are provided corresponding to the position of the transmitter assembly, so as to adjust the height of each device in the transmitter assembly and couple the light emitted by the laser to the first optoelectronic chip.

9. The optical module according to claim 1, characterized in that, It also includes digital processing chips, The two opposite ends of the housing along its longitudinal direction are the electrical interface and the optical interface of the optical module. The digital processing chip is located on the lower surface of the circuit board, between the first optoelectronic chip and the electrical interface, and is electrically connected to the circuit board.

10. The optical module according to claim 9, characterized in that, The heat sink is thermally connected to the housing, and the digital processing chip is thermally connected to the housing.

11. The optical module according to claim 1, characterized in that, It also includes a receiving end component disposed on the upper surface of the circuit board and at least partially located within the coverage area of ​​the through hole; The receiving end component is electrically connected to the circuit board.

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