Detection path planning method and device, equipment and storage medium

Abstract

The invention discloses a detection path planning method and device, equipment and a storage medium. The method comprises the following steps: determining coordinate positions of all measurement points, starting points and ending points required to be detected by semiconductor equipment; initializing an unvisited point set containing all measurement points, and adding a starting point as a current point into the planned path; in the non-visited point set, calculating the total consumed time for moving from the current point to each measurement point; selecting the measurement point with the minimum total consumed time as the next target point; removing the next target point from the unvisited point set, adding the planned path, and updating the next target point as a new current point; and circularly executing the steps until the non-visited point set is empty, finally adding the end point into the planned path, and outputting an optimal path. According to the method, time optimization is taken as a target, the limitation of the shortest path in the prior art is broken through, the optimal path with the shortest total consumed time is screened, and the yield of semiconductor quantity detection equipment is remarkably improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a detection path planning method, apparatus, device and storage medium. Background Technology

[0002] In the semiconductor manufacturing industry, wafer quality control is a crucial step in ensuring chip yield. Inspection equipment needs to move quickly and accurately across hundreds of measurement points on the wafer surface to complete the inspection. The quality of its path planning directly affects the inspection time per wafer and the overall yield (WPH). Traditional path planning algorithms, such as nearest neighbor and genetic algorithms, often use the "shortest geometric path" as their optimization objective, i.e., finding the movement sequence that minimizes the sum of Euclidean distances.

[0003] However, in the actual operation of semiconductor testing equipment, the "shortest path" is not equivalent to the "shortest testing time." The movement of the equipment's stage is subject to complex physical constraints, including the acceleration limits of the mechanical system, motion smoothness requirements (jerk limits), and motor response characteristics. These factors often prevent path planning based on pure geometric distance from achieving the expected time efficiency in actual execution. For example, for a path involving multiple measurement points, a shorter geometric path may contain many short segments requiring frequent acceleration and deceleration, while a slightly longer path with smoother motion may have a shorter actual execution time.

[0004] Current technologies lack path planning solutions that directly optimize based on "actual execution time." Most optimization algorithms remain at the spatial geometry level, failing to establish a precise mapping model from path sequences to actual time consumption. This results in the underutilization of the capacity potential of semiconductor metrology equipment, failing to meet the extreme efficiency demands of advanced manufacturing processes. Summary of the Invention

[0005] In view of this, this application provides a detection path planning method, apparatus, device and storage medium to solve the problem that existing path planning only considers the shortest distance and does not consider the actual detection time.

[0006] To solve the above-mentioned technical problems, this application adopts a technical solution as follows: a detection path planning method is provided, which includes: S1, determining the coordinate positions of all measurement points, starting points, and ending points to be detected by the semiconductor device; S2, initializing an unvisited point set containing all measurement points, and adding the starting point as the current point to the planned path; S3, calculating the total time taken to move from the current point to each measurement point in the unvisited point set; S4, selecting the measurement point with the minimum total time as the next target point; S5, removing the next target point from the unvisited point set and adding it to the planned path, while updating the next target point to the new current point; repeating steps S3 to S5 until the unvisited point set is empty, and finally adding the ending point to the planned path and outputting the optimal path.

[0007] As a further improvement to this application, the total time includes motion time and the integration time required to measure each measurement point.

[0008] As a further improvement to this application, the motion time includes the path motion time of the semiconductor testing equipment and / or the synchronous compensation time of the rotating motor of the semiconductor testing equipment.

[0009] As a further improvement of this application, the calculation process of the path movement time of the semiconductor testing equipment includes: using a trapezoidal acceleration and deceleration algorithm, calculating the stage time of the semiconductor testing equipment from the current point to each measurement point in the set of unvisited points based on the maximum speed, maximum acceleration, and maximum jerk of the semiconductor testing equipment.

[0010] As a further improvement to this application, the calculation process for the stage duration is expressed as follows: ; in, Indicates the current point, Indicates the number of unvisited points in the set. One measurement point, Indicates the distance from the current point to the th The time consumed at each measurement point in the process Indicates the maximum speed. Indicates the maximum acceleration. Indicates the maximum jerk. Indicates the distance from the current point to the th The distance between the measurement points This represents the trapezoidal acceleration function.

[0011] As a further improvement of this application, the calculation process of the synchronous compensation time of the rotary motor of the semiconductor testing equipment includes: confirming the measurement angle of the semiconductor testing equipment corresponding to each measurement point; calculating the target angle required for the motor to drive the semiconductor testing equipment to rotate based on the measurement angle of the current point and the measurement angle of each measurement point in the set of unvisited points; and calculating the angle adjustment time required from the current point to each measurement point based on the preset rotational angular velocity of the motor and the target angle corresponding to each measurement point.

[0012] As a further improvement to this application, the calculation process for the angle adjustment time is expressed as follows: ; in, Indicates the first The angle adjustment time for each measurement point Indicates the first The measured angle at each measurement point Indicates the measured angle at the current point. This indicates the preset rotational angular velocity of the motor.

[0013] As a further improvement of this application, the integration time required to measure each measurement point is obtained by querying the pre-set integration time corresponding to each measurement point.

[0014] To address the aforementioned technical problems, another technical solution adopted in this application is: providing a detection path planning device, comprising: a determination module for determining the coordinate positions of all measurement points, starting points, and ending points to be detected by the semiconductor device; an initialization module for initializing a set of unvisited points containing all measurement points and adding the starting point as the current point to the planned path; a calculation module for calculating the total time taken to move from the current point to each measurement point in the set of unvisited points; a selection module for selecting the measurement point with the minimum total time as the next target point; and a path update module for removing the next target point from the set of unvisited points and adding it to the planned path, while updating the next target point to the new current point; the calculation module, selection module, and path update module operate in a loop until the set of unvisited points is empty, and finally, the ending point is added to the planned path, outputting the optimal path.

[0015] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a computer device, the computer device including a processor and a memory coupled to the processor, the memory storing program instructions, and when the program instructions are executed by the processor, causing the processor to perform the steps of the detection path planning method as described above.

[0016] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a storage medium storing program instructions capable of implementing any of the above-mentioned detection path planning methods.

[0017] The beneficial effects of this application are as follows: The detection path planning method of this application breaks through the limitations of the traditional "shortest geometric path" planning by introducing a greedy decision-making mechanism based on total time consumption. It changes the evaluation standard from simple travel distance to a comprehensive "total time consumption". By calculating and comparing the total time consumption to each test point in each path selection step, and iteratively selecting the point with the minimum time consumption as the next target, it ensures that the overall path achieves optimal time in the actual equipment operating environment. This effectively solves the problem of low path planning efficiency caused by ignoring the actual dynamic constraints and operating conditions of the equipment (such as acceleration and deceleration processes, waiting for coordination between mechanisms, and the time consumption of the measurement operation itself). Ultimately, it achieves a fundamental shift from "shortest path" to "shortest time consumption". Without increasing hardware costs, it significantly shortens the single wafer detection cycle and directly improves equipment capacity. Attached Figure Description

[0018] Figure 1 This is a flowchart illustrating an embodiment of the detection path planning method of the present invention; Figure 2 This demonstrates the principle of elliptic polarization. Figure 3 This is a functional module schematic diagram of an embodiment of the detection path planning device of the present invention; Figure 4 This is a schematic diagram of the structure of a computer device according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the storage medium according to an embodiment of the present invention. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0020] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0021] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0022] Figure 1 This is a flowchart illustrating the detection path planning method according to an embodiment of the present invention. It should be noted that if substantially the same result is obtained, the method of the present invention is not necessarily identical. Figure 1 The illustrated process sequence is limited. For example... Figure 1 As shown, the detection path planning method includes the following steps: Step S1: Determine the coordinates of all measurement points, starting points, and ending points that the semiconductor device needs to detect.

[0023] Specifically, the detection path planning method of this invention is applicable to semiconductor inspection equipment and can be used to inspect wafers. The coordinate positions of the measurement points are typically derived from upstream wafer inspection formulation documents. These documents are pre-defined by process engineers and clearly specify the distribution of the feature structures to be inspected on the wafer. The coordinates are usually defined in the equipment coordinate system or the wafer coordinate system. For example, a Cartesian coordinate system can be established with the wafer center as the origin, and each measurement point... The coordinates are represented as The measurement points are specifically divided into a starting point, a set of measurement points, and an ending point. The starting point is usually the safe waiting position of the equipment or the ending position of the previous wafer; the set of measurement points includes the positions of all n points that must be measured; the ending point can be the same position as the starting point, or it can be a specific safe position that the equipment needs to return to after the measurement is completed. These coordinate positions will be stored in a list or matrix as direct input to the detection path planning method.

[0024] Step S2: Initialize a set of unvisited points containing all measurement points, and add the starting point as the current point to the planned path.

[0025] Specifically, first, all measurement points that need to be detected are included in the set of unvisited points, denoted as... Then, construct the planned path and add the starting point as the current point to the planned path, using the starting point as the starting point of the planned path.

[0026] Step S3: Calculate the total time taken to move from the current point to each measurement point in the set of unvisited points.

[0027] Specifically, for the set of unvisited points Each measurement point in Calculate from the current point Total time spent moving to each measurement point .

[0028] It should be noted that the total time includes the motion time and the integration time required to measure each measurement point.

[0029] In some embodiments, the motion time includes the path motion time of the semiconductor detection device, and the total time includes the path motion time of the semiconductor detection device and the integration time required to measure each measurement point. The calculation process for the total time is expressed as follows: .in, This indicates moving from the current point to the measurement point. Total time spent This indicates the path travel time of the semiconductor testing equipment. Indicates measurement point Required integration time.

[0030] In other embodiments, the motion time includes the synchronization compensation time of the rotary motor of the semiconductor testing equipment, and the total time includes the synchronization compensation time of the rotary motor of the semiconductor testing equipment and the integration time required to measure each measurement point. The calculation process for the total time is expressed as follows: .in, This indicates moving from the current point to the measurement point. Total time spent This indicates the synchronous compensation time of the rotary motor in the semiconductor testing equipment. Indicates measurement point Required integration time.

[0031] In other embodiments, the motion time includes the path motion time of the semiconductor testing equipment and the synchronization compensation time of the rotating motor of the semiconductor testing equipment. The total time includes the path motion time of the semiconductor testing equipment, the synchronization compensation time of the rotating motor of the semiconductor testing equipment, and the integration time required to measure each measurement point. The calculation process for the total time is expressed as follows: .in, This indicates moving from the current point to the measurement point. Total time spent This indicates the path travel time of the semiconductor testing equipment. This indicates the synchronous compensation time of the rotary motor in the semiconductor testing equipment. Indicates measurement point Required integration time.

[0032] Furthermore, the calculation process for the path movement time of the semiconductor testing equipment includes: using a trapezoidal acceleration / deceleration algorithm, based on the maximum speed, maximum acceleration, and maximum jerk of the semiconductor testing equipment, calculating the stage time of the semiconductor testing equipment from the current point to each measurement point in the set of unvisited points.

[0033] It should be noted that the trapezoidal acceleration and deceleration algorithm divides the motion of the device between two adjacent measurement points into three typical stages: acceleration stage: starting from rest or the last velocity of the previous stage, the acceleration is smoothly increased to the maximum value under the jerk limit, so that the speed increases from the initial value; constant speed stage: maintaining constant speed at the maximum speed reached (not exceeding the device limit); deceleration stage: smoothly decreasing speed under the jerk limit until the target speed is reached.

[0034] Furthermore, the calculation process for the time consumed in each stage is expressed as follows: ; in, Indicates the current point, Indicates the number of unvisited points in the set. One measurement point, Indicates the distance from the current point to the th The time consumed at each measurement point in the process Indicates the maximum speed. Indicates the maximum acceleration. Indicates the maximum jerk. Indicates the distance from the current point to the th The distance between the measurement points This represents the trapezoidal acceleration function.

[0035] Furthermore, it should be noted that you may refer to [link / reference needed]. Figure 2 , Figure 2 The principle of elliptic polarization is demonstrated. Natural light emitted from light source 1 is first converted to linearly polarized light by polarizer 2; then, it is adjusted to a specific polarization state by the first rotation compensator 3, causing the electric vector of the incident light to be decomposed into a p-component parallel to the incident plane and an s-component perpendicular to the incident plane; when the polarized light has an incident angle of... When the light is irradiated onto the surface of sample 4, the p and s components undergo multiple reflections and interferences at the interface of sample 4. Due to the different Fresnel reflection coefficients of the p and s components at the interface, the amplitude attenuation and phase shift of the two components after reflection will differ. The final reflected light will change from the polarization state at incidence to elliptically polarized light. The change in polarization state (amplitude ratio, phase difference) is determined only by the optical parameters of the sample (film thickness d, refractive index n, extinction coefficient k, etc.). After the reflected light passes through the second rotating compensator 5, its polarization state is analyzed by the analyzer 6, and finally the light intensity is recorded by the detector 7. It is possible to set only the first rotating compensator 3, only the second rotating compensator 5, or both the first rotating compensator 3 and the second rotating compensator 5.

[0036] By measuring the ellipsometric parameters of the reflected light and combining them with optical models (such as Fresnel's formula and multi-beam interference theory), parameters such as the film thickness and refractive index of the sample can be obtained by inversion. In semiconductor testing equipment, this is used to accurately measure key parameters such as film thickness and refractive index, which is fundamental to formula detection. In this elliptic polarization method, the rotating compensator is the core component of phase modulation. Periodic modulation of the polarization state is achieved through rotation, requiring the rotating motor to precisely control the angle of the compensator to achieve the conversion from phase information to light intensity signal. Therefore, in this embodiment, the rotating motor drives the compensator to rotate, ensuring rapid adjustment to a preset angle at each measurement point to guarantee the efficiency and accuracy of polarization modulation. Therefore, the calculation process for the synchronous compensation time of the rotating motor in the semiconductor testing equipment includes: 1. Confirm the measurement angle of the semiconductor testing equipment corresponding to each measurement point.

[0037] 2. Calculate the target angle required for the motor to drive the semiconductor detection device to rotate, based on the measured angle of the current point and the measured angle of each measured point in the set of unvisited points.

[0038] 3. Calculate the angle adjustment time required from the current point to each measurement point based on the motor's preset rotational angular velocity and the target angle corresponding to each measurement point.

[0039] Specifically, the detection angle at each measurement point Pre-stored in the test recipe, the angle definition is typically based on the wafer coordinate system or device coordinate system. The angle value represents the angle that the test probe (such as an electron beam or optical lens) needs to rotate relative to the reference direction. This occurs when the device moves from the previous measurement point... Move to the current measurement point At that time, the rotary motor needs to be rotated from the previous angle. Adjust to the angle required at present The target angle is the difference between the two.

[0040] Furthermore, the calculation process for the angle adjustment time is expressed as follows: ; in, Indicates the first The angle adjustment time for each measurement point Indicates the first The measured angle at each measurement point Indicates the measured angle at the current point. This indicates the preset rotational angular velocity of the motor.

[0041] Furthermore, the integration time required to measure each measurement point is obtained by querying the pre-set integration time corresponding to each measurement point.

[0042] Specifically, the integration time for each measurement point is pre-stored, and the integration time for each measurement point is independently set according to the detection task type and accuracy requirements of that measurement point. This integration time is expressed as... ,in The integral time for the measurement point.

[0043] Step S4: Select the measurement point with the shortest total time as the next target point.

[0044] Specifically, when selecting the next target point, this embodiment uses a nearest neighbor greedy algorithm to select the measurement point with the minimum total time as the next target point, expressed as: ; in, Indicates the next target point. Indicates the total time elapsed. Indicates in set Select the measurement point with the shortest total time.

[0045] Step S5: Remove the next target point from the set of unvisited points and add it to the planned path, while updating the next target point to the new current point.

[0046] Repeat steps S3 to S5 until the set of unvisited points is empty. Finally, add the end point to the planned path and output the optimal path.

[0047] Specifically, removing the next target point from the set of unvisited points is represented as: Once a measurement point is selected as the target point, it signifies that the detection task for that point is about to be executed, moving it from the set of unvisited points. Remove from the set to ensure that each measurement point is planned only once, avoiding cyclic detection. As iterations proceed, the set... The elements in the path are gradually reduced until it is empty. Adding the next target point to the planned path is represented as: The newly selected target point is appended to the end of the planned path S. This planned path S records all decision results made up to the current point, reflecting the step-by-step construction process of the final optimal path output, making the final path output an ordered and executable sequence of measurement points. Updating the next target point to the new current point is represented as: By updating the next target point to the new current point, a completely new and accurate computational benchmark is provided for the next iteration based on the new current point.

[0048] The detection path planning method in this embodiment introduces a greedy decision-making mechanism based on total time consumption, breaking through the limitations of traditional "shortest geometric path" planning. It transforms the evaluation criterion from simple travel distance to a comprehensive "total time consumption." By calculating and comparing the total time consumption to each test point in each path selection step, and iteratively selecting the point with the minimum time consumption as the next target, it ensures that the overall path achieves optimal time under real equipment operating conditions. This effectively solves the problem of low path planning efficiency caused by ignoring the actual dynamic constraints and operating conditions of the equipment (such as acceleration and deceleration processes, waiting for coordination between mechanisms, and the time consumption of the measurement operation itself). Ultimately, it achieves a fundamental shift from "shortest path" to "shortest time consumption," significantly shortening the single wafer detection cycle without increasing hardware costs and directly improving equipment capacity.

[0049] Figure 3 This is a schematic diagram of the functional modules of the detection path planning device according to an embodiment of the present invention. Figure 3 As shown, the detection path planning device 20 includes: a determination module 21, an initialization module 22, a calculation module 23, a selection module 24, and a path update module 25.

[0050] Module 21 is used to determine the coordinate positions of all measurement points, starting points and ending points that the semiconductor device needs to detect; Initialization module 22 is used to initialize a set of unvisited points containing all measurement points and add the starting point as the current point to the planned path; Calculation module 23 is used to calculate the total time taken to move from the current point to each measurement point in the set of unvisited points; Select module 24 is used to select the measurement point with the shortest total time as the next target point; The path update module 25 is used to remove the next target point from the set of unvisited points and add it to the planned path, while updating the next target point to the new current point; The calculation module 23, selection module 24 and path update module 25 run in a loop until the set of unvisited points is empty. Finally, the end point is added to the planned path and the optimal path is output.

[0051] Optionally, the total time includes the path movement time of the semiconductor testing equipment, the synchronous compensation time of the rotating motor of the semiconductor testing equipment, and the integration time required to measure each measurement point.

[0052] Optionally, the calculation module 23 performs the operation of calculating the path movement time of the semiconductor testing device, specifically including: using a trapezoidal acceleration and deceleration algorithm, and calculating the stage time of the semiconductor testing device from the current point to each measurement point in the set of unvisited points based on the maximum speed, maximum acceleration, and maximum jerk of the semiconductor testing device.

[0053] Optionally, the calculation process for stage duration is expressed as follows: ; in, Indicates the current point, Indicates the number of unvisited points in the set. One measurement point, Indicates the distance from the current point to the th The time consumed at each measurement point in the process Indicates the maximum speed. Indicates the maximum acceleration. Indicates the maximum jerk. Indicates the distance from the current point to the th The distance between the measurement points This represents the trapezoidal acceleration function.

[0054] Optionally, the calculation module 23 performs the operation of calculating the synchronous compensation time of the rotating motor of the semiconductor testing equipment, specifically including: confirming the measurement angle of the semiconductor testing equipment corresponding to each measurement point; calculating the target angle required for the motor to drive the semiconductor testing equipment to rotate based on the measurement angle of the current point and the measurement angle of each measurement point in the set of unvisited points; and calculating the angle adjustment time required from the current point to each measurement point based on the preset rotational angular velocity of the motor and the target angle corresponding to each measurement point.

[0055] Optionally, the calculation process for the angle adjustment time is expressed as follows: ; in, Indicates the first The angle adjustment time for each measurement point Indicates the first The measured angle at each measurement point Indicates the measured angle at the current point. This indicates the preset rotational angular velocity of the motor.

[0056] Optionally, the integration time required to measure each measurement point is obtained by querying the pre-set integration time corresponding to each measurement point.

[0057] For other details regarding the implementation techniques of each module in the detection path planning device of the above embodiments, please refer to the description in the detection path planning method of the above embodiments, which will not be repeated here.

[0058] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For apparatus embodiments, since they are basically similar to method embodiments, the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0059] Please see Figure 4 , Figure 4 This is a schematic diagram of the structure of a computer device according to an embodiment of the present invention. Figure 4 As shown, the computer device 30 includes a processor 31 and a memory 32 coupled to the processor 31. The memory 32 stores program instructions. When the program instructions are executed by the processor 31, the processor 31 performs the detection path planning method steps described in any of the above embodiments.

[0060] The processor 31 can also be referred to as a Central Processing Unit (CPU). The processor 31 may be an integrated circuit chip with signal processing capabilities. The processor 31 can also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor can be a microprocessor or any conventional processor.

[0061] See Figure 5 , Figure 5This is a schematic diagram of the structure of the storage medium according to an embodiment of the present invention. The storage medium of this embodiment stores program instructions 41 capable of implementing the above-described detection path planning method. These program instructions 41 can be stored in the storage medium in the form of a software product, including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks, or computer devices such as computers, servers, mobile phones, and tablets.

[0062] In the several embodiments provided in this application, it should be understood that the disclosed computer devices, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, or indirect coupling or communication connection between devices or units, and may be electrical, mechanical, or other forms.

[0063] Furthermore, the functional units in the various embodiments of this invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated units described above can be implemented in hardware or as software functional units. The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the description and drawings of this application, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method for detecting path planning, characterized in that, It includes: S1. Determine the coordinates of all measurement points, starting points, and ending points required for the semiconductor equipment to be tested; S2. Initialize a set of unvisited points containing all measurement points, and add the starting point as the current point to the planned path; S3. Calculate the total time taken to move from the current point to each measurement point in the set of unvisited points; S4. Select the measurement point with the shortest total time as the next target point; S5. Remove the next target point from the set of unvisited points and add it to the planned path, while updating the next target point to the new current point; Repeat steps S3 to S5 until the set of unvisited points is empty. Finally, add the end point to the planned path and output the optimal path.

2. The detection path planning method according to claim 1, characterized in that, The total time includes the motion time and the integration time required to measure each measurement point.

3. The detection path planning method according to claim 2, characterized in that, The motion time includes the path motion time of the semiconductor testing equipment and / or the synchronous compensation time of the rotating motor of the semiconductor testing equipment.

4. The detection path planning method according to claim 3, characterized in that, The calculation process for the path movement time of the semiconductor detection device includes: A trapezoidal acceleration / deceleration algorithm is used to calculate the stage time of the semiconductor detection device at each measurement point in the set of unvisited points from the current point, based on the maximum speed, maximum acceleration, and maximum jerk of the semiconductor detection device.

5. The detection path planning method according to claim 4, characterized in that, The calculation process for the time consumption of the aforementioned stage is expressed as follows: ； in, Indicates the current point, Indicates the number of unvisited points in the set. One measurement point, Indicates the distance from the current point to the th The time consumed at each measurement point in the process Indicates the maximum speed. Indicates the maximum acceleration. Indicates the maximum jerk. Indicates the distance from the current point to the th The distance between the measurement points This represents the trapezoidal acceleration function.

6. The detection path planning method according to claim 3, characterized in that, The calculation process for the synchronous compensation time of the rotary motor in the semiconductor testing equipment includes: Confirm the measurement angle of the semiconductor testing equipment corresponding to each measurement point; Calculate the target angle required for the motor to drive the semiconductor detection device to rotate based on the measured angle of the current point and the measured angle of each measured point in the set of unvisited points; The required angle adjustment time from the current point to each measurement point is calculated based on the preset rotational angular velocity of the motor and the target angle corresponding to each measurement point.

7. The detection path planning method according to claim 6, characterized in that, The calculation process for the angle adjustment time is expressed as follows: ； in, Indicates the first The angle adjustment time for each measurement point Indicates the first The measured angle at each measurement point Indicates the measured angle at the current point. This indicates the preset rotational angular velocity of the motor.

8. The detection path planning method according to claim 2, characterized in that, The integration time required to measure each measurement point is obtained by querying the pre-set integration time corresponding to each measurement point.

9. A path planning device based on a greedy algorithm, characterized in that, It includes: The determination module is used to determine the coordinate positions of all measurement points, start points, and end points that need to be detected by the semiconductor device. The initialization module is used to initialize a set of unvisited points containing all measurement points and add the starting point as the current point to the planned path. The calculation module is used to calculate the total time taken to move from the current point to each measurement point in the set of unvisited points; The selection module is used to select the measurement point with the shortest total time as the next target point; The path update module is used to remove the next target point from the set of unvisited points and add it to the planned path, while updating the next target point to the new current point; The calculation module, the selection module, and the path update module run in a loop until the set of unvisited points is empty. Finally, the end point is added to the planned path, and the optimal path is output.

10. A computer device, characterized in that, The computer device includes a processor and a memory coupled to the processor, the memory storing program instructions that, when executed by the processor, cause the processor to perform the steps of the detection path planning method as described in any one of claims 1-8.

11. A storage medium, characterized in that, It stores program instructions capable of implementing the detection path planning method as described in any one of claims 1-8.

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