High-thermal-conductivity phase-change integrated heat dissipation assembly for phased-array antenna and manufacturing method of high-thermal-conductivity phase-change integrated heat dissipation assembly

Abstract

The invention relates to a high-thermal-conductivity phase-change integrated heat dissipation assembly for a phased-array antenna and a manufacturing method thereof, the assembly is composed of a plurality of high-thermal-conductivity phase-change integrated temperature-uniforming plates with different channel numbers, each temperature-uniforming plate structure is divided into a cavity and a side cover, the cavity is divided into a hot end and a cold end, the hot end is provided with a solid-state high-thermal-conductivity core material penetrating to the cold end, and the cold end is provided with a solid-state high-thermal-conductivity core material penetrating to the side cover. The cold end is provided with a kidney-shaped hole penetrating through the base body and used for being interconnected with a phased-array antenna assembly circuit, the cold end is filled with a phase-change material with high volume enthalpy variables to serve as a heat sink and packaged by the side cover through welding, and the phase-change material and the high-thermal-conductivity core material are in direct contact in a cold end cavity. According to the uniform temperature plate, an integrated machining mode is adopted, the cavity forming mode is improved, the cold end and the hot end are machined into a whole, the problem that a stress concentration point and a mechanical weak point coincide is solved, the mechanical risk is reduced, and the uniform temperature plate can be well applied to the missile-borne environment condition.

Description

Technical Field

[0001] This invention belongs to the field of thermal management, specifically relating to a high thermal conductivity phase change integrated heat dissipation component for phased array antennas. Background Technology

[0002] Heat dissipation of high-power chips on the TR module in a phased array antenna is a key factor in the development of weaponry. In order to meet the requirements of modern warfare, aircraft, missiles and other weapons are developing towards miniaturization and lightweighting, while also taking into account more accurate positioning and longer guidance time. Therefore, the power of the chips on the TR module in the phased array antenna will increase significantly, and greater power will inevitably lead to greater heat generation.

[0003] The invention patent with publication number CN117638448A proposes a heat dissipation component and its manufacturing method for thermal management of phased array antennas (TR). It adopts a co-cavity form of high thermal conductivity core material and phase change material, as well as an integrated structure of phase change and high thermal conductivity, to reduce contact thermal resistance and improve the phase change response rate. The hot and cold ends of the substrate are connected by welding, which results in poor mechanical properties of the heat spreader, making it unable to withstand long-term impact and vibration. For non-ground-fixed equipment, the threat of resonance is more serious. This solution modifies the original design.

[0004] To meet the operational requirements in missile-borne environments, a phase-change high thermal conductivity vapor chamber heat dissipation component that combines rapid heat transfer and rapid heat absorption is proposed. This component can be widely used in modern combat systems and weapons. The heat dissipation component should meet the following conditions: (1) The heat dissipation component should have a smaller thermal resistance and temperature gradient, which helps to achieve chip temperature control; (2) By changing the cavity forming method, it can maintain a certain structural stability under impact and vibration, and has good overall mechanical properties, and can adapt to the mechanical environment of various weapons and equipment. (3) In a limited space, increase the phase change reaction rate to ensure that the phase change material is used to its fullest potential within a unit of combat time and avoid temperature rise caused by the sluggish reaction of the phase change material. Summary of the Invention

[0005] Objective of the Invention: To address the problems mentioned in the background art, this invention provides a high thermal conductivity phase change integrated heat dissipation component for phased array antennas. The integrated high thermal conductivity phase change vapor chamber in this heat dissipation component not only enables rapid heat transfer, absorption, and response, significantly reducing contact thermal resistance during heat transfer, but also, through the combined action of a phase change material with high volume enthalpy change, makes the heat dissipation component more miniaturized and lightweight. The vapor chamber is manufactured using an integrated process, improving the substrate molding method and making the mechanical properties of the component more stable.

[0006] To solve the above problems, the technical solution of the present invention is: This solution indicates a high thermal conductivity phase change integrated heat dissipation component for a phased array antenna, which consists of multiple high thermal conductivity phase change integrated heat dissipation plates with different numbers of channels. Each heat dissipation plate is divided into a cavity and a side cover. The cavity is divided into a hot end and a cold end, and the hot and cold ends are integrally formed.

[0007] The technical solution steps of this invention regarding the heat spreader are as follows: 1. Select the base blank 2 and the top cover blank 1, and use CNC precision machining to create two inner cavities 3; the inner cavities are divided into two parts: hot end 4 and cold end 5. The hot end part is mainly used to fix the graphene core material, and the cold end part is machined into a curved surface with a waist-shaped hole 8. 2. Select one or more carbon-based heat-conducting sheets according to the cavity size, and form a carbon-based heat-conducting core layer with a certain thickness by hot pressing. The hot pressing temperature shall not be lower than 500℃ and the pressure shall not be lower than 20MPa. 3. The graphene core layer is sequentially placed into boiling NaOH solution for degreasing and cleaning. The cleaned thermally conductive core layer is then placed into a prepared electroplating solution to achieve thermal interface treatment of the core layer surface through electroplating. The coating thickness is 0.001-0.004 mm. The metal coating includes, but is not limited to, silver, silver-copper, tin, nickel and their combinations. 4. Remove the thermally conductive core layer after thermal interface treatment, perform ultrasonic cleaning, use a laser perforation machine to form micropores at predetermined positions, fill the micropores of the core layer with nano copper powder, and then put it into a tube furnace for sintering to achieve high conductivity modification in the thickness direction of the graphene core layer. 5. Place the modified high thermal conductivity core material into the processing cavity, and perform low thermal resistance pressure bonding between the high thermal conductivity core material and the substrate. Then, snap the bottom base and top cover together and heat-press weld them together. 6. A heat spreader blank is machined into a CNC machined blank. 7. The dimensions of the cold end phase change cavity are machined to the required position, with a machining allowance reserved for the outer layer. The outer dimensions of the cold end, the outer dimensions of the hot end, the dimensions of the waist-shaped holes on both sides inside the phase change cavity, and the dimensions of the side cover are machined to the required position. Protective material is applied to the inside of the phase change cavity. 7. Divide the phase change material into two components, A and B. Heat component A in an oil bath and stir to mix it evenly. Add component B of the phase change material and stir to mix it evenly. 8. Fill the phase change material in the molten state into the phase change cavity, leaving an enthalpy change height in the cavity. After the material is filled, seal the side cover and the temperature distribution plate cavity by laser welding. 9. Finally, perform CNC finishing to remove machining allowance. Beneficial effects

[0008] 1) This invention is a high thermal conductivity phase change integrated heat dissipation component for phased array antennas. The structure of the phase change high thermal conductivity integrated heat dissipation plate gives it a lower thermal resistance and temperature gradient, enabling it to metabolize more heat. The structure of the phase change high thermal conductivity integrated heat dissipation plate makes the heat dissipation components smaller in size and weight, which is suitable for the design requirements of miniaturization and lightweight of weapons and equipment. 3) The cold and hot ends of the heat spreader are integrated into a single structure, reducing mechanical risks and making the component more stable; the laser welding sealing process ensures that the phase change material will not leak during use. 4) Within a limited space, phase change materials can directly contact highly conductive materials, and heat can be quickly conducted to the phase change materials, which improves the reaction rate of the phase change materials and is more conducive to the temperature control of the chip.

[0009] Advantages of this invention compared to existing technologies: 1) Compared with traditional heat dissipation components, the overall surface thermal conductivity of this heat dissipation component is ≥1000W / mk. -1 During the chip's operating cycle, the temperature does not exceed 130℃; 2) In traditional heat dissipation structures, there is a screw connection between the heat spreader and the phase change cold plate, which increases the overall weight of the structure. At the same time, the presence of screws occupies the volume of the phase change cold plate. The phase change high thermal conductivity integrated structure proposed in this invention eliminates the weight of screws, increases the available space for phase change, and makes the structure lighter and smaller in size. 3) This invention improves the cavity forming method, making the cold end and hot end processed as a whole, solving the problem of stress concentration points and mechanical weak points coinciding, and reducing mechanical risks. Attached Figure Description

[0010] Example 1: Figure 1 A schematic diagram of a heat dissipation plate blank in a high thermal conductivity phase change integrated heat dissipation component structure for a phased array antenna according to the present invention. The attached diagrams are detailed as follows: 1-Top cover blank; 2-Bottom base blank; 3-Inner cavity; 4-Hot end; 5-Cold end; Figure 2 This is a schematic diagram of a heat dissipation plate structure in a high thermal conductivity phase change integrated heat dissipation component for phased array antennas according to the present invention. The attached diagram details are as follows: 6-Side cover; 7-Cavity; 8-Oval hole; Figure 3 This is a schematic diagram of a solid-state high thermal conductivity core material and phase change material filling in a heat dissipation component structure for a phased array antenna with high thermal conductivity phase change. The attached diagram details are as follows: 9-Phase change material; 10 High thermal conductivity core material.

[0011] Example 2: Figure 4 A schematic diagram of the heat spreader blank in the second structure of a high thermal conductivity phase change integrated heat dissipation component for a phased array antenna according to the present invention. The attached drawings are detailed as follows: 11-Top cover blank, 12-Bottom base blank, 13-Inner cavity; Figure 5 This is a schematic diagram of the heat dissipation plate structure in the second structure of a high thermal conductivity phase change integrated heat dissipation component for phased array antennas according to the present invention. The attached diagram details are as follows: 14-Hot end, 15-Cold end, 16-Circular hole column; Figure 6 This is a schematic diagram of the solid high thermal conductivity core material and phase change material filling in structure two of the heat dissipation component for a phased array antenna with high thermal conductivity phase change integration according to the present invention. The attached diagram details are as follows: 17-High thermal conductivity core material, 18-Phase change material. Detailed Implementation Example 1

[0012] 1. As shown in Example 1 of the attached figure, 6063 aluminum alloy material is selected as the base blank and top cover blank, with dimensions of 20mm×100mm×100mm and 10mm×70mm×70mm respectively. Two inner cavity blanks are machined by CNC. The inner cavity dimensions are machined to the required size, while the outer layer is not machined for the time being. The inner cavity of the base blank is machined to a size of 12mm×70mm×70mm. 2. Select one or more carbon-based heat-conducting sheets according to the cavity size, and form a carbon-based heat-conducting core layer with a certain thickness by hot pressing. The hot pressing temperature is 500℃ and the pressure is 20MPa. 3. The graphene core layer is placed in boiling NaOH solution for degreasing and cleaning for 10 minutes, ultrasonic cleaning for 20 minutes, and then placed in the prepared electroplating solution. The current is 0.5A, and the thermal interface treatment of the graphene core layer surface is achieved through electroplating. The graphene core layer is then removed and ultrasonically cleaned for 30 minutes. 4. After cleaning, the graphene core layer is made into micropores at predetermined positions using a laser perforation machine. Nano copper powder is then filled into the micropores of the core layer. After that, it is placed in a tube furnace and sintered at 900°C to achieve high conductivity modification in the thickness direction of the graphene core layer. 5. Place the modified graphene core material into the processing cavity, and fasten and hot-press the bottom base and top cover together; 6. A cavity is carved out at the cold end of the heat spreader to form a phase change cavity. The waist-shaped holes on both sides of the phase change cavity are 3.2mm×3mm in size and 1.5mm in radius of the semicircle; the side cover thickness is 2mm. 7. Coat the inner cavity of the phase change cavity with a protective material evenly, and dry it at 120℃ for 40 minutes. The coating thickness is 60±20μm. 8. Divide the phase change material into two components, A and B. Heat phase change material component A: Heat component A in an oil bath at 110°C and stir magnetically for 30 minutes to mix evenly. Quickly add phase change material component B and stir rapidly mechanically for 3 minutes to mix evenly. 9. Fill the phase change chamber with the molten phase change material, leaving a 3mm enthalpy change height in the chamber. After the material is filled, seal the side cover and the heat exchanger chamber by laser welding. 10. Finally, perform CNC finishing to remove machining allowance. Example 2

[0013] 1. As shown in Example 2 of the attached figure, 6063 aluminum alloy material is selected as the base blank and top cover blank, with dimensions of 20mm×160mm×100mm and 10mm×122mm×90mm respectively. Two inner cavity blanks are machined by CNC. The internal cavity dimensions are machined to the required size, while the outer layer is not machined for the time being. The machined dimensions of the inner cavity of the base blank are 12mm×160mm×100mm. 2. Select one or more carbon-based heat-conducting sheets according to the cavity size, and form a carbon-based heat-conducting core layer with a certain thickness by hot pressing. The hot pressing temperature is 500℃ and the pressure is 20MPa. 3. The graphene core layer is placed in boiling NaOH solution for degreasing and cleaning for 10 minutes, ultrasonic cleaning for 20 minutes, and then placed in the prepared electroplating solution. The current is 0.5A, and the thermal interface treatment of the graphene core layer surface is achieved through electroplating. The graphene core layer is then removed and ultrasonically cleaned for 30 minutes. 4. After cleaning, the graphene core layer is made into micropores at predetermined positions using a laser perforation machine. Nano copper powder is then filled into the micropores of the core layer. After that, it is placed in a tube furnace and sintered at 900°C to achieve high conductivity modification in the thickness direction of the graphene core layer. 5. Place the modified graphene core material into the processing cavity, and fasten and hot-press the bottom base and top cover together; 6. A cavity is carved out at the cold end of the heat spreader to form a phase change cavity. The radius of the circular holes on both sides of the phase change cavity is 1.5mm, which are used to interconnect with the phased array antenna assembly circuit. 7. Coat the inner cavity of the phase change cavity with a protective material evenly, and dry it at 120℃ for 40 minutes. The coating thickness is 60±20μm. 8. Divide the phase change material into two components, A and B. Heat phase change material component A: Heat component A in an oil bath at 110°C and stir magnetically for 30 minutes to mix evenly. Quickly add phase change material component B and stir rapidly mechanically for 3 minutes to mix evenly. 9. The molten phase change material is filled into the phase change cavity by filling method, with a 3mm enthalpy change height reserved in the cavity. After the material is filled, the opening of the heat spreader is sealed by laser welding. 10. Finally, perform CNC finishing to remove machining allowance.

Claims

1. A high thermal conductivity phase change integrated heat dissipation component for phased array antennas, the component being composed of multiple high thermal conductivity phase change integrated heat spreaders with different numbers of channels, the heat spreader having a phase change cavity inside, the phase change cavity being filled with a phase change material with high volume enthalpy change to act as a heat sink, and a solid high thermal conductivity core material from the hot end penetrating through the center of the phase change cavity and directly contacting the phase change material.

2. The heat dissipation assembly according to claim 1, characterized in that, The heat spreader structure is divided into a cavity and a side cover. The cavity is divided into a hot end and a cold end. The heat spreader is made of metal materials, including aluminum alloy and its composite materials, and copper alloy and its composite materials.

3. The heat dissipation assembly according to claim 1, characterized in that, The cold-end phase-change cavity has through-holes on both sides for interconnection with the phased array antenna assembly circuitry.

4. The heat dissipation assembly according to claim 1, characterized in that, Phase change materials include organic phase change materials (paraffin-based phase change materials, sugar alcohol-based phase change materials, ester-based phase change materials) and inorganic phase change materials (crystalline hydrated salt phase change materials, molten salt phase change materials, metal or alloy-based phase change materials).

5. The heat dissipation assembly according to claim 1, characterized in that, The high thermal conductivity core material is a graphene pressed product, pyrolytic graphite or diamond product (bulk diamond product, particle bonded diamond product) that has undergone Z-direction thermal conductivity modification.

6. A method for fabricating a high thermal conductivity phase-change integrated heat dissipation component for a phased array antenna, characterized in that, The heat spreader is integrally formed, the modified high thermal conductivity core material is placed into the processed cavity, the cavity is then welded, the phase change cavity is removed at the cold end, a protective material is applied to the phase change cavity, the phase change material is filled into the phase change cavity from the cold end opening, and then the end cap is welded to the cavity for sealing.

7. The preparation method according to claim 6, characterized in that, Phase change material filling methods include open-top filling and infill filling.

8. The preparation method according to claim 6, characterized in that, The temperature distribution plate is integrally formed, with the cold and hot ends of the temperature distribution plate being processed into a single structure.

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