Distributed micro-region intelligent thermal control system
By utilizing a distributed micro-region intelligent thermal control system, which employs distributed, editable microchannels and dynamically controllable air sources, the problem of traditional radiators being unable to handle dynamic hot spots is solved, achieving efficient and low-power thermal management.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NANJING BOHAI MICROSYSTEM CO LTD
- Filing Date
- 2025-12-11
- Publication Date
- 2026-05-08
AI Technical Summary
Traditional phased array heat sinks cannot effectively cope with dynamically changing hotspot locations and intensities, resulting in uneven heat dissipation, excessive energy consumption, and difficulty in meeting the thermal control requirements of miniaturization, precision, and low power consumption.
A distributed micro-region intelligent thermal control system is adopted, which uses distributed editable micro-channels and dynamically controllable air sources, combined with an information acquisition and processing unit, to achieve on-demand allocation and precise control of heat dissipation resources.
It achieves precise heat dissipation for high-heat components, reduces heat dissipation power consumption, improves thermal control efficiency and system reliability, and meets the requirements of miniaturization and low power consumption.
Smart Images
Figure CN122000658A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of phased array radar technology, and more specifically, to a distributed micro-area intelligent thermal control system. Background Technology
[0002] High-performance, miniaturized, and integrated phased array systems are increasingly being used. While high-density integration brings advantages such as miniaturization, lightweight design, and low cost, it also places higher demands on the system's thermal control. Traditional heat sinks typically treat the entire device or cavity as a uniform heat source, aiming to reduce overall temperature and achieve uniform heat dissipation. However, in actual phased array systems, heat dissipation is dynamic, and the location and intensity of hotspots change rapidly, posing greater challenges to thermal control.
[0003] Traditional phased array cooling structures primarily consist of a combination of a fan and a metal conductive surface. While they offer broad airflow coverage, they cannot concentrate cooling capacity on one or more specific hot spots like liquid cooling or micro-area thermal control, nor can they specifically optimize the heat dissipation of high-heat components. This design is suitable for everyday or routine applications, but it lacks solutions for large-scale, miniaturized, and integrated scenarios with non-uniform heat source distribution. Such solutions often require significantly larger dimensions and higher power consumption, failing to meet the current demands for miniaturized, refined, and low-power thermal control.
[0004] Traditional centralized thermal control systems need to cover the entire system. To meet the high heat dissipation demands of certain areas, it is often necessary to excessively increase the overall heat dissipation power, such as by increasing fan speed and water cooling flow rate. This leads to problems such as excessive energy consumption and low heat dissipation efficiency. At the same time, during the operation of a phased array, some areas, such as the power amplifier area and the power supply area, experience even higher heat dissipation. There is uneven heat dissipation within the system, which traditional cooling methods cannot cover completely, and often solve these problems by consuming even more energy. Summary of the Invention
[0005] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, the objective of this invention is to propose a distributed micro-region intelligent thermal control system that allocates heat dissipation resources on demand through a distributed micro-region intelligent thermal control design, thereby reducing heat dissipation power consumption.
[0006] To achieve the above and other related objectives, the present invention provides a distributed micro-region intelligent thermal control system, comprising: A distributed, programmable microchannel is connected to a phased array system, and the distributed, programmable microchannel is used to realize distributed control of the entire channel; A dynamically controllable air source is connected to the distributed editable microchannel, and the dynamically controllable air source is used to provide thermal control airflow to the distributed editable microchannel; The information acquisition and processing unit has its input end connected to the output end of the phased array system. The output end of the information acquisition and processing unit is connected to the input end of the distributed editable microchannel and the dynamically controllable air source. The information acquisition and processing unit is used to acquire the real-time voltage, current and temperature information of the phased array system and output control information to the distributed editable microchannel and the dynamically controllable air source.
[0007] In one embodiment of the present invention, the front side of the distributed programmable microchannel is connected to the heat dissipation area of the phased array system by means of direct bonding through a local metal protrusion.
[0008] In one embodiment of the present invention, the back of the distributed editable microchannel is designed with distributed columnar heat dissipation teeth, and the entire back area includes a microchannel control area in the upper left, a microchannel control area in the lower left, a microchannel control area in the upper right, and a microchannel control area in the lower right.
[0009] In one embodiment of the present invention, the upper left microchannel control region, the lower left microchannel control region, the upper right microchannel control region, and the lower right microchannel control region are flow channel control ports, and the number of flow channel control ports is at least 100, and the diameter is 1 mm.
[0010] In one embodiment of the present invention, the distributed programmable microchannel further includes an electronically controlled switch, which is used to control the on / off state of the upper left microchannel control region, the lower left microchannel control region, the upper right microchannel control region, and the lower right microchannel control region.
[0011] In one embodiment of the present invention, the rotational speed of the dynamically controllable air source is matched in real time with the heat load of the intelligent thermal control system.
[0012] In one embodiment of the present invention, the dynamically controllable air source is used to operate at rest, low speed, and high speed by receiving heat consumption information fed back by the information acquisition and processing unit.
[0013] In one embodiment of the present invention, the information acquisition and processing unit includes a multi-data fusion processor and a power consumption information calculation and analysis unit. The multi-data fusion processor is used to receive the real-time voltage, current, and temperature information and send the real-time voltage, current, and temperature information to the power consumption information calculation and analysis unit. The power consumption information calculation and analysis unit is used to perform fusion calibration on the real-time voltage, current, and temperature information and output control information to the distributed editable microchannel and the dynamically controllable air source.
[0014] In one embodiment of the present invention, the information acquisition and processing unit further includes a thermal control database, the output of which is connected to the output of the power consumption information calculation and analysis unit.
[0015] In one embodiment of the present invention, the multi-data fusion processor is an MCU.
[0016] As described above, the distributed micro-region intelligent thermal control system of the present invention has the following beneficial effects: The present invention discloses a distributed micro-region intelligent thermal control system, which adopts a distributed editable microchannel design. It not only has the characteristics of traditional metal heat conduction, but also has advanced technology of intelligent thermal control linked with the air source. It can perform key thermal control and adjustment for key areas, and close the flow channels or rely solely on conduction for heat dissipation in non-key areas.
[0017] This invention discloses a distributed micro-region intelligent thermal control system, featuring distributed, editable microchannels and a dynamically controllable air source. This system enables precise control of distributed hotspots. External fans assess heat output based on control information fed back from the information acquisition unit, operating at full power during high-power periods and at low power during low-power periods, significantly improving thermal control efficiency. Simultaneously, the distributed, editable microchannels can also focus on monitoring high-heat areas, enabling precise control and achieving regionalized, categorized thermal control management.
[0018] The present invention discloses a distributed micro-region intelligent thermal control system, which achieves precise thermal control through advanced intelligent information design. The information acquisition and processing unit collects and summarizes the collected voltage, temperature and other information, compares and analyzes it with the built-in thermal control database, and outputs control commands for distributed, editable microchannels and dynamically controllable air sources, thereby realizing precise, intelligent and miniaturized thermal control. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention; Figure 2 This is a structural block diagram of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the distributed, editable microchannel structure of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention; Figure 4 This is a block diagram of a distributed, editable microchannel structure of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention; Figure 5 This is a schematic diagram of a dynamically controllable air source for a distributed micro-region intelligent thermal control system according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the information acquisition and processing unit of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention.
[0020] The components include: 1. Distributed editable microchannels; 2. Dynamically controllable air source; and 3. Information acquisition and processing unit. Detailed Implementation
[0021] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.
[0022] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.
[0023] Terms such as "first" or "second" may be used to describe various components, but these components are not limited by the terms described above. The terms described above are used to distinguish one component from another; for example, without departing from the scope of the concept according to this disclosure, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component.
[0024] Furthermore, "connected / linked" indicates that one component is directly electrically connected to another component or indirectly electrically connected through another component. Unless otherwise explicitly stated in the sentence, the singular form may include the plural form. Additionally, the terms "comprising / including" or "containing / including" as used in this specification indicate the presence or addition of one or more components, steps, operations, and elements. Specific structural or functional descriptions of examples of embodiments of the concepts disclosed in this specification are merely illustrative to describe examples of embodiments of the concepts, and examples of embodiments of the concepts can be implemented in various forms, but these descriptions are not limited to the examples of embodiments described in this specification.
[0025] Based on the concept, various modifications and changes can be applied to examples of embodiments, such that examples of embodiments will be illustrated in the accompanying drawings and described in the specification. However, examples of embodiments based on the concept are not limited to specific embodiments, but include all changes, equivalents, or substitutions included within the spirit and scope of this disclosure.
[0026] It should be understood that when describing an element as "connected" or "linked" to another element, the element may be directly connected or linked to the other element, or it may be connected or linked to the other element via a third element. Conversely, it should be understood that when an element is described as "directly connected to" or "directly linked to" another element, no other element is placed between them. Other expressions describing relationships between components (i.e., "between" and "directly between" or "adjacent to" and "directly adjacent to") need to be interpreted in the same way.
[0027] The terminology used in this specification is for the purpose of describing specific examples of implementations only and is not intended to limit this disclosure. The singular form may include the plural form unless there is an explicit contrary meaning in the context. It should be understood in this specification that the terms "comprising" or "having" indicate the presence of the features, quantities, steps, operations, components, parts, or combinations thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof.
[0028] Unless otherwise defined, all terms used herein (including technical or scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art. If a term is not clearly defined in a common dictionary in this specification, it shall be interpreted as having the same meaning as in the context of the relevant art, and not as an ideal or overly formal meaning.
[0029] Descriptions of known components and processing techniques may be omitted to avoid unnecessarily obscuring the embodiments of this disclosure.
[0030] Throughout this specification, the same reference numerals refer to the same elements. Therefore, even if a reference numeral is not mentioned or described with reference to one drawing, it may be mentioned or described with reference to another drawing. Furthermore, even if a reference numeral is not shown in one drawing, it may be mentioned or described with reference to another drawing.
[0031] Additionally, the logic level of a signal may be different from or opposite to the logic level described. For example, a signal described as having a logic "high" level may optionally have a logic "low" level, and a signal described as having a logic "low" level may optionally have a logic "high" level.
[0032] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this disclosure to facilitate a better understanding of the disclosure. However, the technical solutions claimed in this disclosure can be implemented even without these technical details and various variations and modifications based on the following embodiments.
[0033] Distributed Micro-region Intelligent Thermal Control Design: The integrated design offers higher integration and brings more concentrated thermal effects. This invention adopts a novel and advanced intelligent thermal control scheme, using a metal frame as the heat carrier. Corresponding bump structures are designed for the heat-generating areas of the micro-packages on the phased array surface to capture heat flow. A distributed topology layout of the metal frame is used to realize the distributed micro-region intelligent thermal control design. Simultaneously, multiple distributed voltage, current, and temperature sensors are deployed within the system, working collaboratively through intelligent algorithms to achieve "on-demand cooling" and "thermal energy scheduling." This ensures that local hotspots do not overheat while maintaining optimal overall energy efficiency, thereby constructing a more reliable thermal control management system.
[0034] This invention utilizes a distributed micro-region intelligent thermal control design to allocate heat dissipation resources on demand. Thermal control measures are applied only to high-heat areas, while low-heat areas employ passive cooling, thus reducing power consumption. Specifically, a distributed microfluidic design is employed to fully utilize internal system gaps for heat dissipation. Simultaneously, voltage, current, and temperature sensors are integrated into the system to identify system power consumption intensity and heat distribution, enabling different heat dissipation outputs for different power consumption levels. This approach ensures device reliability while balancing efficiency, size, and cost.
[0035] Please see Figure 1 , Figure 2 , Figure 1 This is a schematic diagram of the structure of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention; Figure 2 This is a structural block diagram of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention; This invention provides a distributed micro-area intelligent thermal control system, comprising: a distributed editable microchannel 1, a dynamically controllable air source 2, and an information acquisition and processing unit 3. The distributed editable microchannel 1 is connected to a phased array system and is used to realize distributed control of the entire channel. The dynamically controllable air source 2 is connected to the distributed editable microchannel 1 and is used to provide thermal control airflow to the distributed editable microchannel 1. The input end of the information acquisition and processing unit 3 is connected to the output end of the phased array system, and the output end of the information acquisition and processing unit 3 is connected to the input ends of the distributed editable microchannel 1 and the dynamically controllable air source 2. The information acquisition and processing unit 3 is used to acquire real-time voltage, current, and temperature information of the phased array system and output control information to the distributed editable microchannel 1 and the dynamically controllable air source 2.
[0036] Please see Figure 3 , Figure 4 , Figure 3 This is a schematic diagram of the distributed, editable microchannel structure of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention; Figure 4 This is a block diagram of a distributed, editable microchannel structure of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention.
[0037] Specifically, the front side of the distributed programmable microchannel 1 is connected to the heat dissipation area of the phased array system through a direct bonding method using a partially protruding metal part.
[0038] Specifically, the back of the distributed editable microchannel 1 has a distributed columnar heat dissipation tooth design, and the entire back area includes the upper left microchannel control area, the lower left microchannel control area, the upper right microchannel control area, and the lower right microchannel control area.
[0039] Specifically, the upper left microchannel control area, the lower left microchannel control area, the upper right microchannel control area, and the lower right microchannel control area are flow channel control ports, and the number of flow channel control ports is at least 100, with a diameter of 1 mm.
[0040] Specifically, the distributed editable microchannel 1 also includes an electronically controlled switch, which is used to control the on / off state of the upper left microchannel control area, the lower left microchannel control area, the upper right microchannel control area, and the lower right microchannel control area.
[0041] In one embodiment of the present invention, the core function of the distributed programmable microchannel 1 is to realize distributed control of the entire flow channel, including flow channel on / off control, flow channel path direction control, etc. The distributed programmable microchannel 1 forms an integral design and structural interconnection with the heat dissipation surface of the integrated phased array. Specifically, the integrated phased array generally has multiple core heat dissipation areas. The distributed programmable microchannel 1 is interconnected with the core heat dissipation area of the phased array through a direct metal protrusion, and the area where the internal microchannel is located is aligned with the core heat dissipation area of the phased array. This ensures that the airflow path after the distributed microchannel is activated can cover the core heat dissipation area of the phased array. The distributed programmable microchannel 1 receives the power supply voltage and the flow channel control information input by the information acquisition and processing unit through its own control socket. Figure 3 As shown, the distributed editable microchannel 1 includes an overall heat dissipation contact surface, precisely dissipating heat according to the different heat levels in hot and non-hot areas within the phased array. The back of the distributed editable microchannel 1 features a distributed columnar heat dissipation tooth design, containing four microchannel control areas: upper left, lower left, upper right, and lower right. Each area contains directionally designed flow channel control ports, resulting in hundreds of 1mm diameter flow channel ports. An electronically controlled switch, acting as a control switch, is built into the central thickness region of the distributed editable microchannel 1. This central region facilitates heat conduction while simultaneously controlling the flow channel opening and closing of the four microchannel areas electronically. Figure 4 As shown, the on / off control of each area is achieved through four electrically controlled metal plates in the central area. When on, the microchannel control port is opened to form a precise flow channel circulation; when off, it is blocked and closed to shut off the flow channel. The entire flow channel path control and regional thermal intensity control are realized through a distributed, editable microchannel approach.
[0042] Please see Figure 5 , Figure 5 This is a schematic diagram of a dynamically controllable air source in a distributed micro-region intelligent thermal control system according to an embodiment of the present invention; the rotational speed of the dynamically controllable air source 2 is matched with the heat load of the intelligent thermal control system in real time. The dynamically controllable air source 2 is used to operate at rest, low speed, and high speed by receiving heat consumption information fed back by the information acquisition and processing unit 3.
[0043] In one embodiment of the present invention, the dynamically controllable air source 2 is the heat dissipation source for realizing the distributed micro-region intelligent thermal control design, providing thermal control airflow for the precisely controlled editable microchannel 1 at the back end. Figure 5As shown, the speed of the dynamically controllable air source 2 is matched with the system's thermal load in real time. It operates at standby, low speed, and high speed by receiving heat dissipation information from the information acquisition and processing unit 3. It operates quietly at low speeds under low loads and provides strong cooling at high speeds under high loads. This avoids the power waste or overheating risks caused by insufficient speed in traditional fixed-speed fans. During installation, the dynamically controllable air source is secured to the metal casing of the distributed editable microchannels using top screws. It receives the operating voltage from the power module and the speed control information from the information acquisition and processing unit via its own control socket. By quickly responding to changes in information from the information acquisition and processing unit 3, it effectively suppresses instantaneous high temperatures, prevents overheating and frequency throttling, and ensures continuous high-performance operation of the phased array. Based on voltage, current, and temperature sensor data from different areas, the distributed editable microchannels are coordinated for start-stop operation, constructing an efficient and precise thermal control design.
[0044] Please see Figure 6 , Figure 6 This is a schematic diagram of the information acquisition and processing unit of a distributed micro-region intelligent thermal control system according to an embodiment of the present invention.
[0045] The information acquisition and processing unit 3 includes a multi-data fusion processor and a power consumption information calculation and analysis unit. The multi-data fusion processor receives the real-time voltage, current, and temperature information and sends it to the power consumption information calculation and analysis unit. The power consumption information calculation and analysis unit performs fusion calibration on the real-time voltage, current, and temperature information and outputs control information to the distributed programmable microchannel 1 and the dynamically controllable air source 2. The information acquisition and processing unit 3 also includes a thermal control database, the output of which is connected to the output of the power consumption information calculation and analysis unit. The multi-data fusion processor is an MCU.
[0046] In one embodiment of the present invention, the information acquisition and processing unit 3 is the core processing unit of the entire distributed micro-area intelligent thermal control design. It can typically be designed as an independent information acquisition and processing module or integrated with the phased array substrate. The acquired and processed control information is simply fed back to the distributed programmable microchannel 1 and the dynamically controllable air source 2 via a socket. The power supply of the information acquisition and processing unit 3 also relies on its own socket to receive the operating voltage input from the external power module and various types of sensor information from the phased array, and then outputs control command information. For example... Figure 6As shown, through multi-source data synchronous acquisition, including the acquisition, analysis, fusion, and calibration of real-time voltage, current, and temperature information, control information is output to the distributed programmable microchannel 1 and the dynamically controllable air source 2. Essentially, the information acquisition and processing unit 3 is a real-time sensing fusion and physical modeling system running on a chip-based hardware and software platform. It uses electrical sensing, temperature perception, and task prediction, combined with thermal and data fusion algorithms, to reveal the power consumption within the phased array system, thus providing a precise control information map for the thermal control execution of the dynamically controllable air source 2. The fusion processor is a heterogeneous computing system with a real-time MCU as its control core. It completes the complex calculations from raw data to fusion results in a short time with minimal energy consumption. The power consumption information calculation and analysis compares the results processed by the MCU with the stored data in the thermal control database and selects the optimal control command to output to the distributed programmable microchannel 1 and the dynamically controllable air source 2.
[0047] In summary, the distributed micro-region intelligent thermal control system of the present invention adopts a distributed and editable microchannel design, which not only has the characteristics of traditional metal heat conduction, but also has advanced technology of intelligent thermal control linked with the air source. It can perform key thermal control and adjustment on key areas, and close the flow channels or rely solely on conduction for heat dissipation in non-key areas.
[0048] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.
Claims
1. A distributed micro-region intelligent thermal control system, characterized in that, include: A distributed, editable microchannel (1) is connected to a phased array system. The distributed, editable microchannel (1) is used to realize distributed control of the entire channel. A dynamic controllable air source (2) is connected to the distributed editable microchannel (1), and the dynamic controllable air source (2) is used to provide thermal control airflow to the distributed editable microchannel (1); The information acquisition and processing unit (3) has its input end connected to the output end of the phased array system. The output end of the information acquisition and processing unit (3) is connected to the input end of the distributed editable microchannel (1) and the dynamic controllable air source (2). The information acquisition and processing unit (3) is used to acquire the real-time voltage, current and temperature information of the phased array system and output control information to the distributed editable microchannel (1) and the dynamic controllable air source (2).
2. The distributed micro-region intelligent thermal control system according to claim 1, characterized in that: The front of the distributed editable microchannel (1) is connected to the heat dissipation area of the phased array system by means of direct bonding through a local metal protrusion.
3. The distributed micro-region intelligent thermal control system according to claim 2, characterized in that: The back of the distributed editable microchannel (1) is designed with distributed columnar heat dissipation teeth. The entire back area includes the upper left microchannel control area, the lower left microchannel control area, the upper right microchannel control area, and the lower right microchannel control area.
4. The distributed micro-region intelligent thermal control system according to claim 3, characterized in that: The upper left microfluidic control area, the lower left microfluidic control area, the upper right microfluidic control area, and the lower right microfluidic control area are flow channel control ports. The number of flow channel control ports is at least 100, and the diameter is 1 mm.
5. A distributed micro-region intelligent thermal control system according to any one of claims 1 to 4, characterized in that: The distributed editable microchannel (1) also includes an electronically controlled switch, which is used to control the on / off state of the upper left microchannel control area, the lower left microchannel control area, the upper right microchannel control area, and the lower right microchannel control area.
6. The distributed micro-region intelligent thermal control system according to claim 5, characterized in that: The rotational speed of the dynamically controllable air source (2) is matched with the heat load of the intelligent thermal control system in real time.
7. A distributed micro-region intelligent thermal control system according to claim 6, characterized in that: The dynamic controllable air source (2) is used to operate at rest, low speed, and high speed by receiving heat consumption information fed back by the information acquisition and processing unit (3).
8. A distributed micro-region intelligent thermal control system according to claim 7, characterized in that: The information acquisition and processing unit (3) includes a multi-data fusion processor and a power consumption information calculation and analysis unit. The multi-data fusion processor is used to receive the real-time voltage, current and temperature information and send the real-time voltage, current and temperature information to the power consumption information calculation and analysis unit. The power consumption information calculation and analysis unit is used to perform fusion calibration on the real-time voltage, current and temperature information and output control information to the distributed editable microchannel (1) and the dynamically controllable air source (2).
9. A distributed micro-region intelligent thermal control system according to claim 8, characterized in that: The information acquisition and processing unit (3) also includes a thermal control database, the output of which is connected to the output of the power consumption information calculation and analysis unit.
10. A distributed micro-region intelligent thermal control system according to claim 8, characterized in that: The multi-data fusion processor is an MCU.