Electronic equipment

Abstract

The embodiment of the invention discloses electronic equipment, an elastic sealing part is arranged between two opposite side surfaces of a middle plate and a sound production assembly of the electronic equipment along the thickness direction z of the middle plate, and the side surfaces of the middle plate and the sound production assembly abut against each other through the elastic sealing part to seal a through hole. The connecting line can be located on one side of the elastic sealing component or partially located in the elastic sealing component, through hole sealing and connecting line penetrating are both considered, and the sealing mode can reduce occupation of the internal space of the electronic equipment, so that the performance of the electronic equipment is optimized, and the thickness of the electronic equipment is reduced. Moreover, the through hole in the middle plate in the electronic equipment is sealed, so that the sealing requirement at the opening position of the frame of the electronic equipment can be reduced to a certain extent, and the manufacturing cost of the electronic equipment can be reduced.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0002] Electronic devices consist of a housing containing several electronic components. To protect these components from external environmental influences, electronic devices typically employ a sealed structure. The primary purpose of this seal is to prevent humid gases or liquids from entering the housing, thus protecting the electronic components. The performance of the seal directly impacts the lifespan of the electronic device and its application environment. With increasing user demands for waterproofing ratings, the sealing and waterproofing performance of electronic devices has become a crucial indicator of their overall performance. Summary of the Invention

[0003] This application provides an electronic device with a sealing method that offers high sealing reliability, occupies less space, and is beneficial for improving the sealing level of electronic devices.

[0004] This application provides an electronic device, including:

[0005] The middle frame includes a middle plate having a first side and a second side along its thickness direction, and a through hole penetrating the first side and the second side is provided on the middle plate;

[0006] The first component, at least a portion of which is located on the first side of the middle plate;

[0007] Functional modules are located on the first or second side of the middle plate;

[0008] The circuit board is located on the side of the middle board that is different from the functional modules;

[0009] A connecting wire passes through a through hole, and the end of the connecting wire is provided with a first electrical connection part and a second electrical connection part. The first electrical connection part is electrically connected to a functional module, and the second electrical connection part is electrically connected to a circuit board.

[0010] The elastic sealing component is pressed between the first component and the side of the middle plate on the first side to seal the through hole; the connecting line is located between the elastic sealing component and the middle plate, or between the elastic sealing component and the first component, or passes through the interior of the elastic sealing component.

[0011] In this embodiment, an elastic sealing component is provided between the two opposite sides of the middle plate and the sound-generating component along the thickness direction z of the middle plate. The sides of the two components abut against each other through the elastic sealing component to seal the through hole. The connecting wire can be located on one side of the elastic sealing component or a portion of the connecting wire can be located inside the elastic sealing component. In this way, the sealing of the through hole does not affect the passage of the connecting wire. Because of the elastic sealing component, the connecting wire can be embedded in the elastic sealing component at the point where the connecting wire passes through, and this position can also have good sealing. That is, the connecting wire will not affect the sealing of the through hole. Compared with the current technology of thickening the middle plate to open the through hole, in this embodiment, the connecting wire is in direct or indirect contact with the side of the middle plate, resulting in a larger contact area. Under the same sealing pressure, the pressure on the connecting wire is smaller, which can reduce the probability of damage to the connecting wire. The thickness of the middle plate can be relatively thin, reducing the space occupied by the middle plate inside the electronic device. This is beneficial for optimizing the arrangement of electronic components inside the electronic device, thereby improving the space utilization of the small board area, optimizing the performance of the electronic device, and reducing the thickness of the electronic device. Furthermore, in this embodiment, the through holes on the inner plate of the electronic device are sealed, which can reduce the sealing requirements at the opening positions of the electronic device frame to a certain extent, thus helping to reduce the manufacturing cost of the electronic device.

[0012] In one example, the resilient sealing component includes a first resilient sealing component, which is an annular member surrounding the through hole. The specific outline of the annular member can be determined according to the specific shape at the through hole port. The annular member can be a one-piece structure, or it can be formed by splicing multiple segments to form a ring. The annular member has a simple structure, which can reduce the weight of electronic devices and help meet the lightweight design requirements of electronic devices. When the annular member is bonded to the middle frame, the installation position is relatively easy to determine, and assembly is relatively convenient.

[0013] In one example, the resilient sealing component includes a first resilient sealing component, which includes a central portion covering the through hole and an annular portion connected circumferentially to the central portion. The annular portion is pressed between the first component and the middle plate. The first resilient sealing component with an integral structure is simple to manufacture and can completely cover one end of the through hole, thus providing a good sealing effect.

[0014] In one example, one side of the connecting wire abuts against the first elastic sealing component, and the other side abuts against the middle plate or the first component. The rigidity of the middle plate and the first component is greater than that of the first elastic sealing component. In this embodiment, the clamping force received by the connecting wire abutting against the middle plate or the first component is relatively large, which is conducive to the connecting wire being completely embedded in the first elastic sealing component, thereby achieving a seal at the point where the connecting wire exits.

[0015] In one example, the elastic sealing component further includes a second elastic sealing component. The first and second elastic sealing components are located on opposite sides of the connecting line, respectively. Along the thickness direction of the middle plate, the first elastic sealing component, the connecting line, and the second elastic sealing component are stacked. In the width direction of the connecting line, the second elastic sealing component covers the connecting line. In this embodiment, the connecting line is clamped between the first and second elastic sealing components, and the connecting line is completely embedded inside the elastic sealing component, facilitating sealing. The second elastic sealing component can be an annular piece, allowing it to maintain close contact with the first elastic sealing component in the circumferential direction, resulting in a high level of waterproof sealing.

[0016] In one example, the second resilient sealing member is a non-closed structure and extends a predetermined length circumferentially along the through hole. In this embodiment, the second resilient sealing member has a simple structure and is lightweight.

[0017] In one example, the resilient sealing component includes closed-cell foam; this reduces the probability of liquid passing through the interior of the closed-cell foam, resulting in high waterproof performance. While meeting the waterproof performance requirements of electronic devices, other types of foam can also be used for the resilient sealing component, such as open-cell foam with a high proportion of closed-cell structures, which offers lower manufacturing costs.

[0018] Alternatively, the elastic sealing component may include silicone, which offers higher strength.

[0019] In one example, the resilient sealing component is bonded to the first member and / or the middle plate by an adhesive component. The resilient sealing component is pre-positioned by the adhesive component, which facilitates assembly efficiency and makes it less prone to displacement after installation.

[0020] In one example, the adhesive component includes a backing adhesive, which has a simple structure and is easy to handle. Alternatively, an adhesive layer formed by curing a liquid adhesive can be directly applied to the surface of the mid-plate or sound-generating component, offering high application flexibility.

[0021] In one example, the first component includes an extension extending from the resilient sealing member toward the circuit board. A channel for a connecting wire to pass through is provided between the extension and the middle plate. A gap communicating with the channel is also provided between the extension and the circuit board. The connecting wire passes through the gap to connect to the side of the circuit board opposite to the middle plate. In this way, the extension and the middle plate define the position of the connecting wire, preventing it from shifting and ensuring the safety of electronic devices near the connecting wire.

[0022] In one example, the middle plate also has a first boss and a second boss, with a limiting groove formed between the first boss and the second boss. The channel includes the limiting groove, and the connecting line portion is located inside the limiting groove. Using bosses on the middle plate to limit the connecting line is a simple and easy method.

[0023] In one example, along the length of the connecting line, the connecting line includes at least two sequentially electrically connected segments, defined as the first segment to the Nth segment, respectively. The first electrical connection is disposed in the first segment, and the second electrical connection is disposed in the Nth segment; where N is an integer greater than or equal to 2. Dividing the connecting line into N segments allows for flexible arrangement of the connecting line's direction according to the spatial shape, resulting in higher assembly flexibility and preventing an excessively long connecting line from bumping into other components in the electronic device.

[0024] In one example, the functional module includes a fingerprint recognition module, and the electronic device also includes a display screen mounted on the second side of the mid-plate. The fingerprint recognition module is integrated into the display screen, or the fingerprint recognition module is located between the display screen and the mid-plate.

[0025] In one example, the fingerprint recognition module includes a fingerprint sensor and a fingerprint processor. The fingerprint processor is integrated into a connecting cable, the fingerprint sensor is electrically connected to a first electrical connection, and the fingerprint processor receives signals from the fingerprint sensor through the connecting cable. In this embodiment, the fingerprint sensor and fingerprint processor can be arranged side-by-side in a non-overlapping configuration within the plane of the display screen (the plane defined by the x-axis and y-axis), which can reduce the thickness of the electronic device.

[0026] In one example, the first component includes a sound-generating assembly, which is located on the same side of the middle plate and at the bottom of the electronic device as the circuit board. The sound-generating assembly is electrically connected to the circuit board. In this embodiment, the resilient sealing component is installed using a sound-generating assembly mounted near the through-hole, resulting in a simple structure.

[0027] In one example, the sound-generating component is located inside the through-hole, which helps to reduce the thickness of the electronic device.

[0028] In one example, the mid-frame has a battery compartment located on the second side of the mid-plate, and through-holes are formed in the area of ​​the mid-plate outside the battery compartment. The circuit board and the through-holes are located on the same side of the battery compartment. The location of the through-holes does not occupy battery compartment space, minimizing the impact on the battery.

[0029] In one example, the mid-frame further includes a border surrounding the mid-plate. The border has at least one of the following on its outer wall on the side of the circuit board away from the battery compartment: a sound outlet, a USB port, or a card tray mounting hole. The sound outlet is fitted with sealing foam, and / or the USB port is fitted with a sealing sleeve, and / or the card tray mounting hole is fitted with a sealing sleeve. In this embodiment, the electronic device has two seals, resulting in a relatively high sealing level. Furthermore, the sealing level of the sound outlet and various ports on the electronic device's frame can be relatively simple, reducing the manufacturing cost of the electronic device. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0031] Figure 2 for Figure 1 Top view of the electronic device shown;

[0032] Figure 3 for Figure 2 A partial schematic diagram at point A in the middle, where the display screen is not shown;

[0033] Figure 4 for Figure 3 Top view of the structure shown;

[0034] Figure 5 for Figure 3 A partial rear-view schematic diagram of the structure shown, in which only the middle frame, circuit board, and sound-generating components are shown;

[0035] Figure 6 for Figure 5 A schematic diagram of the cross-section at point M of the structure shown.

[0036] Figure 7 for Figure 5 The diagram shown is a structural schematic excluding the sound-generating component.

[0037] Figure 8 for Figure 7 Top view of the structure shown;

[0038] Figure 9 This is a partial schematic diagram of an electronic device in another embodiment of this application, wherein the diagram is consistent with... Figure 8 The directions shown are the same;

[0039] Figure 10 This is a partial schematic diagram of an electronic device in another embodiment of the present application, wherein the diagram is consistent with... Figure 8 The directions shown are the same;

[0040] Figure 11 This is a partial schematic diagram of an electronic device in another embodiment of this application, wherein the diagram is consistent with... Figure 8 The directions shown are the same;

[0041] Figure 12 for Figure 11 The diagram shows a cross-sectional view of the structure at position M1 after the addition of the sound-generating component. Position M1 is... Figure 5 The position of M is the same;

[0042] Figure 13 This is a partial schematic diagram of an electronic device in yet another embodiment of this application;

[0043] Figure 14 for Figure 13 The diagram shows a top view of the structure after the sound-generating components have been removed.

[0044] Figure 15 for Figure 14 A schematic cross-sectional view of the structure shown at point M2 after the addition of the sound-generating component;

[0045] Figure 16 This is a partial schematic diagram of an electronic device in yet another embodiment of this application;

[0046] Figure 17 This is a partial schematic diagram of an electronic device in yet another embodiment of this application;

[0047] Figure 18 for Figure 8 Sectional view of structure A_A shown;

[0048] Figure 19 for Figure 8 The B_B section view of the structure shown;

[0049] Figure 20 for Figure 8 The C_C section view of the structure shown.

[0050] in, Figures 1 to 20 The one-to-one correspondence between the reference numerals and component names in the attached figures is shown below:

[0051] 100 Electronic device; 1 Mid-frame; 1-1 Mid-plate; 1-11 Side; 1-2 Bezel; 2 Display; 3 Front camera; 101 Sound hole; 102 Sound hole; 103 USB interface; 104 Card tray; 105 Through hole; 106 Battery compartment; 107 First boss; 108 Second boss; 109 Partition; 41 Motherboard; 42 Circuit board (small board); 5 Connecting wire; 5-1 First segment; 5-2 Second segment; 6 Fingerprint recognition module; 61 Fingerprint sensor; 62 Fingerprint processor; 7 Sound-emitting component; 71 Mounting hole; 72 Extension; 1A Channel; 1B Gap; 8 Elastic sealing component; 9 First connector; 10 Second connector; 11 Sealing foam; 12 USB sealing sleeve; 13 Card tray sealing sleeve. Detailed Implementation

[0052] Regarding the sealing structures of electronic devices mentioned in the background art, the inventors of this application have conducted extensive research and found that the sealing structures in current electronic devices can be broadly divided into two types: the first type is the sealing of opening areas on the outside of the casing, such as charging ports and Universal Serial Bus (USB) interfaces, which typically have sealing structures; the second type is the sealing of opening areas inside the casing, where openings are used to meet the assembly requirements of electronic devices or the connection requirements of certain components. Currently, the opening areas inside the casing of electronic devices are directly sealed using Mylar or sealing sleeves.

[0053] For electronic devices with fingerprint recognition modules integrated into the display screen, the fingerprint recognition module is connected to the circuit board via a flexible printed circuit board (FPC). In some electronic devices, the FPC connects to the circuit board through an opening inside the housing. In this scenario, Mylar cannot be used to seal the opening inside the housing, otherwise the FPC cannot pass through. If a sealing sleeve is used to seal the opening, the FPC will be squeezed between the sealing sleeve and the inner wall of the opening. To avoid damaging the FPC, the wall thickness at the opening is usually relatively thick, and correspondingly, the thickness of the sealing sleeve is also relatively large. This requires a large amount of internal space in the housing, affecting the arrangement of internal components. In other words, traditional sealing methods are not suitable in these scenarios.

[0054] In addition, some electronic devices use a non-sealed method for openings with FPCs to improve the sealing level of the opening area on the outside of the housing. The processing technology of the sealing position of this electronic device is relatively advanced, and the production cost is also relatively high.

[0055] Therefore, overcoming one of the above-mentioned defects and improving the sealing performance of electronic devices is a technical problem that urgently needs to be solved by those skilled in the art.

[0056] Based on the above research findings, the inventors of this application propose an electronic device that can achieve a seal with an opening inside the housing through which connecting wires such as FPCs pass. This sealing method has high sealing reliability, occupies less space, and is beneficial to improving the sealing level of the electronic device.

[0057] To enable those skilled in the art to better understand the technical solutions of the embodiments of this application, the embodiments of this application will be further described in detail below with reference to the accompanying drawings and specific examples.

[0058] This application relates to an electronic device 100, which may include a handheld device, an in-vehicle device, a wearable device, a terminal device, or other processing devices connected to a wireless modem. It may also include cellular phones, smartphones, personal digital assistant (PDA) computers, tablets, laptops, laptop computers, cameras, video recorders, smartwatches, smart wristbands, augmented reality (AR) devices, virtual reality (VR) devices, in-vehicle computers, and other devices with imaging capabilities. This application does not impose special limitations on the specific form of the above-mentioned electronic device; for ease of understanding, the following description uses a mobile phone as an example.

[0059] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application.

[0060] The electronic device 100 provided in this application embodiment includes a display screen 2, a mid-frame 1, and a back cover (not shown). The mid-frame 1 mainly serves to support and protect the electronic components of the electronic device 100. Various electronic components of the electronic device 100 can be mounted on the mid-frame 1. The electronic device 100 may also include a back cover, with the display screen 2 and the back cover located on opposite sides of the mid-frame 1 along its thickness direction z. The display screen 2 is located on the front of the electronic device 100, and the back cover is located on the back of the electronic device 100. The material of the back cover is not limited here; in practice, those skilled in the art can choose according to actual needs. For example, the back cover can be made of metal, plastic, ceramic, or glass, etc.

[0061] In this embodiment of the application, the front of the electronic device 100 can be understood as the side facing the user when using the electronic device 100, that is... Figure 1 The side where the central display screen 2 is located, and the back of the electronic device 100 can be understood as the side facing away from the user when the user uses the electronic device 100.

[0062] A mounting cavity can be formed between the middle frame 1 and the back cover, and at least some of the electronic components of the electronic device 100 can be installed inside the mounting cavity. Some of the electronic components of the electronic device 100 can also be located between the middle frame 1 and the display screen 2.

[0063] The electronic device 100 includes electronic components such as circuit boards and various functional modules. These functional modules may include a battery module (not shown), a wireless communication module (not shown), a camera module 3, and a sound-generating component 7 (see details). Figure 5 and Figure 6 (as shown), fingerprint recognition module 6 (as shown) Figure 2 The arrangement and installation method of these electronic devices (as shown) are not specifically limited in this application. The sound-generating component 7 may include a handset, a speaker, or other sound-generating parts. Those skilled in the art should understand that the electronic device 100 may include one or more of the electronic devices listed above, and may also include components not limited to those listed herein, as well as other components.

[0064] In this embodiment, the middle frame 1 may include a metal body and a plastic body. For example, the middle frame 1 may be an integral structure formed by injection molding a plastic body with a metal body as the skeleton. The metal body may be made of aluminum alloy, stainless steel, titanium alloy, etc., and the plastic body may be made of polystyrene, polypropylene, polyethylene, etc. Of course, if the usage requirements are met, the middle frame 1 may also include only a plastic body, and the middle frame 1 may be formed by injection molding, or the middle frame 1 may also include only a metal body, and the middle frame 1 may be formed by machining.

[0065] In this embodiment, the display screen 2 includes a transparent cover and a display module. The display module can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a quantum dot light-emitting diode (QLED), or an electrophoretic display (E-Ink). As mentioned above, the display module includes several functional layers to realize image and video display. The number and specific structure of the functional layers can be referred to the above description and current technology, and will not be specifically described here. Currently, most display screens 2 of electronic devices 100 use OLEDs. The transparent cover covers the outside of the display module and serves to protect the display module. The transparent cover can be a glass cover, or other transparent materials that can provide protection, such as transparent polyimide. Display screen 2 can also have a touch function, that is, display screen 2 can be a touch screen.

[0066] In this embodiment, the fingerprint recognition module 6 is a technical means for identity authentication or access control applications by detecting and extracting biometric information from fingerprints. The fingerprint recognition module 6 typically includes a fingerprint sensor 61 and a fingerprint processor 62. The fingerprint sensor 61 is used to collect and detect fingerprints, and can be an optical fingerprint sensor 61, a capacitive fingerprint sensor 61, or an ultrasonic fingerprint sensor 61. The fingerprint processor 62 is used to process the fingerprint signal collected by the fingerprint sensor 61. Specifically, the fingerprint processor 62 may include a signal processing unit and an image processing algorithm unit. The signal processing unit is used to amplify, filter, and perform analog-to-digital conversion on the fingerprint signal collected by the fingerprint sensor 61 to convert the analog signal output by the fingerprint sensor 61 into a digital signal, and to preprocess and enhance the signal. The image processing algorithm unit is responsible for processing, extracting features, and comparing the collected fingerprint image.

[0067] Please combine Figure 3 Understanding the structure, the mid-frame 1 includes a border 1-2 and a mid-plate 1-1, with the border 1-2 circumferentially surrounding the mid-plate 1-1. The fingerprint recognition module 6 is installed on the side of the display 2 opposite to the display surface, and it can be located between the display 2 and the mid-plate 1-1 of the mid-frame 1. Furthermore, the fingerprint recognition module 6 can be installed on the display 2 or on the mid-plate 1-1. Alternatively, the fingerprint recognition module 6 can be integrated with the display 2, forming a single integrated structure.

[0068] Of course, the fingerprint recognition module 6 can also be installed on the side wall of the mid-frame 1. For example, the fingerprint recognition module 6 can be installed on the edge 1-2 of the mid-frame 1, or the fingerprint recognition module 6 can be installed on the side of the mid-frame 1 away from the display screen 2, that is, the fingerprint recognition module 6 can be located on the side of the back cover. The accompanying drawings of this application show specific examples of the fingerprint recognition module 6 located on the side of the display screen 2, whereby the user inputs fingerprints by touching the display screen 2.

[0069] Typically, electronic components are distributed at both the top and bottom of the electronic device 100. In this embodiment, "top" refers to the portion of the electronic device 100 located above it when in use. Typically, in addition to the earpiece, the front-facing camera 3 is also positioned near the top of the electronic device 100. The bottom of the electronic device 100 typically has openings or interfaces, such as a USB port or card tray opening. To facilitate electrical connections between the electronic components inside the electronic device 100, two or more circuit boards are usually provided. The number of circuit boards can be reasonably determined based on the specific structure of the electronic device 100. Please refer to [link to relevant documentation]. Figure 2In one example, there are two circuit boards, referred to as the main board and the small board, both mounted on the side of the mid-frame 1 away from the display screen 2. The main board 41 and the small board 42 are typically located on either side of the battery. The main board 41 is closer to the top of the mid-frame 1. The substrate of the main board 41 is primarily a printed circuit board (PCB). The main board mainly consists of three parts: a baseband section, a radio frequency (RF) section, and other parts. The baseband section includes a baseband chip and a power management chip, primarily responsible for encoding. The RF section includes an RF processor and an RF power amplifier, used for signal transmission and reception. Other parts include a central processing unit (CPU), memory, various controllers (including touchscreen, Bluetooth, WIFI, sensors, etc.), and interfaces for microphones, earpieces, cameras, and the display screen 2. The small board 42 is located on the bottom side of the mid-frame 1 and can also be a printed circuit board. Electronic components on the small board 42 include a HOME button, LED lights, a speaker and contacts, a microphone (MIC) and solder points, an antenna and contacts, USB ports and pad locations, an RF adapter, and connectors for connection to the main board.

[0070] Please refer to Figures 2 to 6 In this embodiment, the electronic device 100 further includes a connecting line 5, which enables electrical connections between electronic devices, between electronic devices and circuit boards, and between circuit boards. The connecting line 5 can be a flexible connecting line, primarily using a flexible material as the substrate, which serves as the carrier for the circuit connection lines. For example, the connecting line 5 can be a flexible printed circuit board (FPC). FPCs offer good flexibility, flexible arrangement, and are small in size and lightweight, meeting the lightweight design requirements of the electronic device 100. Alternatively, the connecting line 5 can be a flat flexible cable (FFC), which offers simple connections and low production costs. Of course, the connecting line 5 is not limited to the two structures described above and can also be other structural forms.

[0071] The connecting line 5 has at least two electrical connection parts at its end for electrical connection with electronic devices or circuit boards. The electrical connection parts can be electrically connected to electronic devices or circuit boards by means of soldering or plugging, or they can be electrically connected to electronic devices or circuit boards through the first connector 9. For example, when the connecting line 5 is an FPC, the FPC can be electrically connected to the circuit board through a board to board (BTB) connector.

[0072] In this embodiment, the electronic device 100 is provided with a sound-generating component 7. Figure 5An example is shown where the sound-emitting component 7 is positioned near the bottom of the electronic device 100. The sound-emitting component 7 and the circuit board (small board 42) are both located on the same side of the middle board 1-1, and the sound-emitting component 7 is electrically connected to the small board 42. Of course, the sound-emitting component 7 can also be positioned in other locations within the electronic device 100, such as the top. Those skilled in the art typically refer to the sound-emitting component 7 positioned at the bottom of the electronic device 100 as a speaker, used for playing music, ringtones, and call sounds. Those skilled in the art typically refer to the sound-emitting component 7 positioned at the top of the electronic device 100 as a handset, used for receiving the voice signal from the other party during a call. Correspondingly, a sound outlet 102 is provided at the top of the electronic device 100.

[0073] Please refer to Figure 6 , Figure 6 for Figure 5 The diagram shows a cross-sectional view at point M of the structure. In this embodiment, the fingerprint recognition module 6 and the circuit board are located on opposite sides of the middle plate 1-1. The side of the middle plate 1-1 facing away from the display screen 2 is defined as the first side 1D, and the side of the middle plate 1-1 facing the display screen 2 is defined as the second side 1C. That is, the first side 1D and the second side 1C are the two sides of the middle plate 1-1 along its thickness direction. The display screen 2 and the fingerprint recognition module 6 are located on the second side 1C of the middle plate 1-1, and the circuit board and the sound-generating component 7 are located on the first side 1D of the middle plate 1-1. The fingerprint recognition module 6 is electrically connected to the circuit board via a connecting line 5. Therefore, a through hole 105 is provided on the middle plate 1-1 of the middle frame 1, and a first electrical connection part 51 and a second electrical connection part 52 are provided at both ends of the connecting line 5. The first electrical connection part 51 is electrically connected to the fingerprint recognition module 6, and the second electrical connection part 52 passes through the through hole 105 and is electrically connected to the circuit board, which is the aforementioned small board 42.

[0074] Please refer to this again. Figure 6 In this embodiment of the application, in order to seal the through hole 105 on the middle plate 1-1, the electronic device 100 further includes an elastic sealing member 8, which is pressed between the sound-generating component 7 and the side 1-11 of the middle plate 1-1 located on the first side 1D. The connecting wire 5 passes through the through hole 105 and is located between the elastic sealing member 8 and the sound-generating component 7, as shown below. Figure 6 As shown. Similarly, the connecting wire 5 can also be located between the elastic sealing component 8 and the middle plate 1-1, or inside the elastic sealing component 8, that is, the elastic sealing component 8 encloses a portion of the connecting wire 5. In this way, under the installation resistance of the sound-generating component 7 and the middle plate 1-1, the connecting wire 5 is simultaneously pressed between the elastic sealing component 8 and the middle plate 1-1, or between the elastic sealing component 8 and the sound-generating component 7, or the connecting wire 5 is pressed inside the elastic sealing component 8, achieving a sealing effect.

[0075] In this embodiment, an elastic sealing member 8 is provided between the two opposite sides of the middle plate 1-1 and the sound-generating component 7 along the thickness direction z of the middle plate 1-1. The sides of the two components abut against each other through the elastic sealing member 8 to seal the through hole 105. The connecting wire 5 can be located on one side of the elastic sealing member 8 or inside the elastic sealing member 8, so that the sealing of the through hole 105 does not affect the connecting wire 5 passing through the through hole 105. Because the elastic sealing member 8 is provided at the point where the connecting wire 5 passes through, the connecting wire 5 can be embedded in the elastic sealing member 8, and this position can also have a good seal, that is, the connecting wire 5 will not affect the sealing of the through hole 105. Compared with the current technology of thickening the middle plate 1-1 to open the through hole 105, in this embodiment, the connecting wire 5 is in direct or indirect contact with the side of the middle plate 1-1, so the contact area is larger. Under the same sealing pressure, the pressure on the connecting wire 5 is smaller, which can avoid damage to the connecting wire 5. Furthermore, the thickness of the middle plate 1-1 can be relatively thin, reducing its occupation of the internal space of the electronic device 100. This facilitates the optimization of the arrangement of electronic components inside the electronic device 100, thereby improving the space utilization of the small plate area, optimizing the performance of the electronic device 100, and reducing its thickness. In addition, in this embodiment, the through holes 105 on the middle plate 1-1 inside the electronic device 100 are sealed, which to some extent reduces the sealing requirements at the opening positions of the frame 1-2 of the electronic device 100, thus helping to reduce the manufacturing cost of the electronic device 100.

[0076] The preceding text uses the example of a sound-generating component 7 located near the through hole 105 on the middle plate 1-1 through which the connecting wire 5 passes to illustrate the sealing technology for the through hole 105. Without loss of generality, the sealing of the through hole 105 on the middle plate 1-1 is not limited to the sound-generating component 7 as the first component. It can be determined based on the first component located at the through hole 105. For example, when a camera module is located near the through hole 105, an elastic sealing component 8 can be pressed between the camera module and the middle plate 1-1. That is, the component that cooperates with the middle plate 1-1 to press the elastic sealing component 8 can be reasonably selected according to the layout of the specific electronic product. The following text continues with the example of the elastic sealing component 8 being pressed between the sound-generating component 7 and the middle plate 1-1 to introduce the technical solution and its technical effects.

[0077] Please refer to Figures 6 to 9In this embodiment, the elastic sealing component 8 includes a first elastic sealing component 81, which is an annular member surrounding the through hole 105. The annular member has a simple structure, which can reduce the weight of the electronic device 100 and is beneficial for meeting the lightweight design requirements of the electronic device 100. Before assembling the sound-generating component 7, the annular member can be glued to the side of the middle plate 1-1 using adhesive components, forming an integral structure. In this embodiment, the annular member is glued to the middle frame 1, making the installation position relatively easy to determine and assembly convenient. Of course, the annular member can also be glued to the sound-generating component 7 using adhesive components, forming an integral structure with the sound-generating component 7 beforehand.

[0078] In this embodiment, the adhesive component includes a backing adhesive, such as double-sided tape. The backing adhesive has a simple structure and is easy to operate. Alternatively, the adhesive component can be an adhesive layer formed by curing liquid adhesive, which can be directly applied to the surface of the middle plate 1-1 or the sound-generating component 7, providing high application flexibility.

[0079] In this embodiment, one side of the connecting wire 5 abuts against the first elastic seal 81, and the other side abuts against the first component, such as... Figure 6 As shown. In this embodiment, one side of the connecting wire 5 is in elastic contact with the first elastic seal 81, and the other side is in direct contact with the first component (sound-generating component 7). Since the rigidity of the first component is greater than that of the first elastic seal 81, the contact between the connecting wire 5 and the first component is a hard contact, and the contact force can be relatively large. The clamping force on the connecting wire 5 is relatively large, which is beneficial to clamping the connecting wire 5.

[0080] Please refer to Figure 9 The connecting line 5 abuts against the first elastic sealing component 81 on one side and against the middle plate 1-1 on the other side, which can also achieve the above-mentioned technical effect.

[0081] Please refer to Figure 10 , Figure 10 The dashed line at the midpoint outlines the contour of through hole 105. Figure 10 The dashed line represents the outline of the connecting line 5, which is obscured by the first elastic sealing member 81. In another embodiment of this application, the first elastic sealing member 81 may include a middle portion 811 covering the through hole 105, and an annular portion 812 connected circumferentially to the middle portion 811, the annular portion 812 being pressed between the first member and the middle plate 1-1. This configuration of the first elastic sealing member 81 is simple to manufacture and can completely cover one end of the through hole 105, thereby providing a good seal for the through hole 105.

[0082] Figure 10 Based on the embodiment shown, the connecting line 5 can abut against the first elastic seal 81 on one side and against the middle frame 1 on the other side. In this embodiment, the connecting line 5 is subjected to a relatively large clamping force.

[0083] Please refer to Figure 11 and Figure 12 In this embodiment, the elastic sealing component 8 further includes a second elastic sealing component 82. The first elastic sealing component 81 and the second elastic sealing component 82 are located on both sides of the connecting line 5, respectively. Along the thickness direction z of the middle plate 1-1, the first elastic sealing component 81, the connecting line 5, and the second elastic sealing component 82 are stacked. In the width direction of the connecting line 5, the second elastic sealing component 82 covers the connecting line 5. In this embodiment, the connecting line 5 is pressed between the first elastic sealing component 81 and the second elastic sealing component 82, and the connecting line 5 is completely located inside the elastic sealing component 8, which facilitates sealing. Similarly, the second elastic sealing component 82 can be an annular part, so that the second elastic sealing component 82 can be in close contact with the first elastic sealing component 81 in the circumferential direction, resulting in a better waterproof sealing effect.

[0084] Of course, the second elastic sealing component 8 can also be a non-ring-shaped component; please refer to [link / reference]. Figure 12 , Figure 12 A specific example of a non-annular second resilient sealing member 82 is shown. The second resilient sealing member 82 extends a predetermined length circumferentially along the through-hole 105. For example, the second resilient sealing member 82 can be a straight segment or an arc-shaped segment with curvature, as long as the second resilient sealing member 82 can cover the width direction of the connecting line 5. This configuration results in a simple structure and lightweight second resilient sealing member 8.

[0085] The elastic sealing component 8 in this embodiment can be made of closed-cell foam (Super Low Density (Poor Rebound) Foam, SLD(PR)). In closed-cell foam, most or all of the pores are closed structures formed by foam walls and ridges, resulting in a complete structure where the pores are isolated from each other and do not communicate. This reduces the probability of liquid passing through the interior of the closed-cell foam, resulting in high waterproof performance.

[0086] Of course, provided that the electronic device meets the 100% waterproof performance requirement, the elastic sealing component 8 can also use other types of foam, such as open-cell foam with a high proportion of closed-cell structures, which has a lower manufacturing cost. Furthermore, the elastic sealing component 8 can also be made of silicone, which offers higher strength.

[0087] Please refer to Figures 13 to 16 The illustrated embodiment is similar to the one described above. Figures 5 to 12 The difference in the illustrated embodiment is that, Figures 13 to 16 The structure of the connecting line 5 in the illustrated embodiment is basically the same as other structures, so it will not be described in detail here. A detailed description follows. Figures 13 to 16The structure of the connecting line 5 is as follows. Along the length of the connecting line 5, the connecting line 5 includes a first segment 5-1 and a second segment 5-2, which are electrically connected through adjacent ends, i.e., electrically connected by the second connector 10. The type of the second connector 10 can refer to current technology; for example, the second connector 10 can be a plug-in connector or a solder connector, etc. The first electrical connection portion 51 is disposed at the end of the first segment 5-1 away from the second electrical connection portion 52, and the second electrical connection portion 52 is disposed at the end of the second segment 5-2 away from the first segment 5-1.

[0088] Of course, the connecting line 5 is not limited to being divided into two segments, but can also be divided into three or more segments. That is, the connecting line 5 includes at least two sequentially electrically connected segments along its length direction, which are respectively defined as the first segment 5-1 to the Nth segment. The first electrical connection part 51 is disposed in the first segment 5-1, and the second electrical connection part 52 is disposed in the Nth segment.

[0089] In this embodiment, the connecting line 5 is divided into N segments, which can flexibly arrange the direction of the connecting line 5 according to the spatial shape, resulting in high assembly flexibility and avoiding the possibility of a connecting line 5 being too long and bumping into other components in the electronic device 100.

[0090] Please refer to Figure 17 In this embodiment of the application, the fingerprint recognition module 6 includes a fingerprint sensor 61 and a fingerprint processor 62. The fingerprint processor 62 is connected to the connecting line 5. The fingerprint sensor 61 is electrically connected to the first electrical connection part 51. The fingerprint processor 62 receives the signal from the fingerprint sensor 61 through the connecting line 5. The fingerprint processor 62 processes the received signal and then transmits the processed data to the circuit board.

[0091] In this embodiment, the fingerprint sensor 61 and the fingerprint processor 62 can be arranged in a non-overlapping manner, and the two are arranged side by side in the plane where the display screen 2 is located (in the plane determined by the x-axis and y-axis), which can reduce the thickness of the electronic device 100.

[0092] Please refer to Figure 6 , Figure 12 and Figure 15 In this embodiment, the sound-generating component 7 may be partially located inside the through hole 105, which helps to reduce the installation height of the sound-generating component 7 and thus helps to reduce the thickness of the electronic device 100.

[0093] Please refer to this again. Figure 6 , Figure 12 and Figure 15The sound-generating component 7 may include an extension body 72, which extends from the self-elastic sealing component 8 toward the circuit board. There is a channel 1A between the extension body 72 and the middle plate 1-1 for the connecting wire 5 to pass through. There is a gap 1B between the extension body 72 and the circuit board that communicates with the channel 1A. The second electrical connection part 52 extends out from the gap 1B to connect to the side of the circuit board away from the middle plate 1-1. In this way, the extension body 72 and the middle plate 1-1 define the position of the connecting wire 5, prevent the connecting wire 5 from moving around, and ensure the safety of the electronic devices near the connecting wire 5.

[0094] Please refer to Figures 7 to 11 , Figure 13 , Figure 14 and Figure 16 The middle plate 1-1 can also be provided with a first boss 107 and a second boss 108, forming a limiting groove between the first boss 107 and the second boss 108, so that the channel 1A includes the limiting groove, and the connecting line 5 is located inside the limiting groove to prevent the connecting line 5 from moving. The method of setting bosses on the middle plate 1-1 to limit the connecting line 5 is simple and easy to implement.

[0095] Please refer to Figures 7 to 11 , Figure 13 , Figure 14 and Figure 16 In the above embodiments, the middle frame 1 has a battery compartment 106 located on the second side of the middle plate 1-1, and a through hole 105 is formed in the area of ​​the middle plate 1-1 outside the battery compartment 106. In one example, the mounting cavity on the second side of the middle plate 1-1 can be divided into a battery compartment 106 and a small plate mounting cavity by a partition 109, and the through hole is located on one side of the small plate mounting cavity. The frame 1-2 also has at least one of a sound outlet 101, a USB interface, or a card tray mounting hole on the outer wall of the small plate 42 on the side away from the battery compartment 106.

[0096] In the embodiments of this application, please refer to Figure 18 The sound outlet 101 is equipped with sealing foam 11. Please refer to [reference needed]. Figure 19 The USB port 103 is equipped with a USB sealing sleeve 12. Please refer to... Figure 20 The card tray 104 is provided with a card tray sealing sleeve 13. The sound outlet 101, the USB interface 103 and the card tray position are all provided with sealing components, which can prevent external liquids from entering the electronic device 100 from these positions, forming the first sealing barrier. Moreover, this sealing method has a simple structure and low manufacturing cost.

[0097] As described above, the sealing of the through hole position of the connecting line 5 provided in the embodiments of this application can be used in multiple scenarios. For example, the through hole of the FPC in a folding machine can also use the technical solution provided in this application.

[0098] For other structures of the electronic device 100, please refer to current technology.

[0099] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0100] The directional terms mentioned in the embodiments of this application, such as "inner" and "outer", are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0101] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0102] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0103] The above are merely preferred embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. An electronic device, characterized in that, include: The middle frame includes a middle plate having a first side and a second side along its thickness direction, and the middle plate is provided with a through hole penetrating the first side and the second side; A first component, at least a portion of which is located on a first side of the middle plate; Functional modules are located on the first or second side of the middle plate; The circuit board is located on the side of the middle plate that is different from the functional module; A connecting wire passes through the through hole, and the end of the connecting wire is provided with a first electrical connection part and a second electrical connection part. The first electrical connection part is electrically connected to the functional module, and the second electrical connection part is electrically connected to the circuit board. An elastic sealing component is pressed between the first component and the side of the middle plate on the first side to seal the through hole; the connecting line is located between the elastic sealing component and the middle plate, or between the elastic sealing component and the first component, or passes through the interior of the elastic sealing component.

2. The electronic device according to claim 1, characterized in that, The elastic sealing component includes a first elastic sealing component, which is an annular member disposed around the through hole.

3. The electronic device according to claim 1, characterized in that, The elastic sealing component includes a first elastic sealing component, which includes a middle portion covering the through hole and an annular portion connected circumferentially to the middle portion, the annular portion being pressed between the first component and the middle plate.

4. The electronic device according to claim 2 or 3, characterized in that, One side of the connecting line abuts against the first elastic sealing component, and the other side abuts against the middle plate or the first component.

5. The electronic device according to claim 2 or 3, characterized in that, The elastic sealing component further includes a second elastic sealing component. The first elastic sealing component and the second elastic sealing component are respectively located on both sides of the connecting line. Along the thickness direction of the middle plate, the first elastic sealing component, the connecting line and the second elastic sealing component are stacked. In the width direction of the connecting line, the second elastic sealing component covers the connecting line.

6. The electronic device according to claim 5, characterized in that, The second elastic sealing component is a non-closed structure and extends a predetermined length circumferentially along the through hole.

7. The electronic device according to any one of claims 1 to 6, characterized in that, The elastic sealing component includes closed-cell foam; Alternatively, the resilient sealing component may include silicone.

8. The electronic device according to any one of claims 1 to 7, characterized in that, The elastic sealing component is bonded to the first component and / or the middle plate by an adhesive component.

9. The electronic device according to claim 8, characterized in that, The adhesive component includes a backing adhesive or an adhesive layer formed by curing liquid adhesive.

10. The electronic device according to any one of claims 1 to 9, characterized in that, The first component includes an extension extending from the resilient sealing member toward the circuit board. A channel is provided between the extension and the middle plate for the connecting wire to pass through. A gap communicating with the channel is provided between the extension and the circuit board. The connecting wire passes through the gap to connect to the side of the circuit board opposite to the middle plate.

11. The electronic device according to claim 10, characterized in that, The middle plate is also provided with a first boss and a second boss, and a limiting groove is formed between the first boss and the second boss. The channel includes the limiting groove, and the connecting line portion is located inside the limiting groove.

12. The electronic device according to any one of claims 1 to 11, characterized in that, Along the length of the connecting line, the connecting line includes at least two sequentially electrically connected segments, defined as a first segment to an Nth segment, wherein the first electrical connection is disposed in the first segment and the second electrical connection is disposed in the Nth segment; wherein N is an integer greater than or equal to 2.

13. The electronic device according to any one of claims 1 to 12, characterized in that, The functional module includes a fingerprint recognition module, and the electronic device also includes a display screen mounted on the second side of the middle plate. The fingerprint recognition module is integrated into the display screen, or the fingerprint recognition module is located between the display screen and the middle plate.

14. The electronic device according to claim 13, characterized in that, The fingerprint recognition module includes a fingerprint sensor and a fingerprint processor. The fingerprint processor is integrated into the connecting line. The fingerprint sensor is electrically connected to the first electrical connection part. The fingerprint processor receives the signal from the fingerprint sensor through the connecting line.

15. The electronic device according to any one of claims 1 to 14, characterized in that, The first component includes a sound-generating assembly, which is located on the same side of the middle plate as the circuit board and is also located at the bottom of the electronic device. The sound-generating assembly is electrically connected to the circuit board.

16. The electronic device according to claim 14, characterized in that, The sound-generating component is located inside the through hole.

17. The electronic device according to any one of claims 1 to 16, characterized in that, The middle frame has a battery compartment located on the second side of the middle plate, and the through hole is opened in the area of ​​the middle plate outside the battery compartment. The circuit board and the through hole are located on the same side of the battery compartment.

18. The electronic device according to claim 17, wherein the middle frame further includes a frame, the frame being arranged circumferentially around the middle plate, and the frame further having at least one of a sound outlet, a USB interface, or a card tray mounting hole on the outer wall of the circuit board on the side away from the battery compartment, wherein, The sound outlet is provided with sealing foam, and / or the USB interface is provided with a sealing sleeve, and / or the card tray mounting hole is provided with a sealing sleeve.

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