SMT (Surface Mount Technology) packaging tape with low throwing rate and self-adaptive adjustment method for stripping force of cover tape of SMT packaging tape

Abstract

The invention relates to the technical field of SMT packaging winding tapes, and discloses a low-throwing-rate SMT packaging winding tape and a cover tape stripping force self-adaptive adjusting method thereof.The low-throwing-rate SMT packaging winding tape comprises a battery pack bottom shell and outer shells, the outer shells are installed at the two ends of the top of the battery pack bottom shell through fasteners, and a partition pressing plate is arranged at the position, close to the upper end, in the battery pack bottom shell; a high-voltage wire harness is arranged above the partition pressing plate, a high-voltage controller is installed at one end of the high-voltage wire harness, a partition mounting frame is arranged at the bottom of the partition pressing plate, a plurality of lithium batteries are arranged on the partition mounting frame, and cooling fins are tightly attached to one sides of the lithium batteries. The battery pack can be divided into a plurality of independent modules by arranging the partition pressing plate, the partition mounting frame, the cooling fins and the fastening bolts and utilizing the mutual matching effect among the partition pressing plate, the partition mounting frame, the cooling fins and the fastening bolts, the aluminum cooling fins are attached to a shell of each module, and the cooling fins are connected through the fastening bolts and can be independently detached to be cleaned or replaced, so that the battery pack is convenient to maintain and replace.

Description

Technical Field

[0001] This invention relates to the field of SMT packaging reel technology, specifically to an SMT packaging reel with low rejection rate and a method for adaptive adjustment of the cap tape peel force. Background Technology

[0002] As electronic products evolve towards miniaturization, high density, and high reliability, surface mount technology (SMT) has become the mainstream production method in the electronics manufacturing industry. To achieve high-speed, high-precision placement of electronic components on automated pick-and-place machines, a reel packaging method combining carrier tape and cover tape is typically used for encapsulation, transportation, and feeding. Existing SMT packaging reels usually consist of a carrier tape body and a cover tape covering it. The carrier tape body has multiple slots for accommodating electronic components, and the cover tape is sealed to the carrier tape by heat sealing or adhesive bonding to prevent component displacement or loss during transportation and storage. During the placement process, the pick-and-place machine peels off the cover tape using a peeling mechanism, and the nozzle picks up the electronic components from the slots and places them. However, in existing technologies, the cover tape peel force is usually a fixed value, primarily determined by process parameters such as the cover tape material, adhesive type, heat sealing temperature, pressure, and time. Once the reel is encapsulated, its peel force characteristics are essentially fixed and cannot be dynamically adjusted according to the pick-and-place machine's operating status, environmental changes, or component characteristics. This fixed peel force design has many shortcomings in practical applications. First, excessive peel force generates a large instantaneous impact during the peeling process, easily causing components in the tray to jump or even be ejected, resulting in a phenomenon known as "discarding." Discarding not only leads to component waste but also triggers the placement machine's shutdown alarm, severely impacting production cycle time and equipment utilization. Second, insufficient peel force results in inadequate sealing of the cover tape, making components prone to displacement, flipping, or overlapping during transport and vibration, leading to pick-up failures or placement errors, which also reduces production yield. Furthermore, electronic components of different sizes, weights, and package types have significantly different peel force requirements. For example, micro-sized passive devices (such as 0402 and 0201) are extremely sensitive to changes in peel force, while larger packaged integrated circuits require higher sealing strength to prevent displacement during transport. Existing technologies typically adapt to different components by changing different types of carrier tapes and cover tapes or adjusting packaging process parameters, but this approach lacks flexibility and makes precise control difficult. On the other hand, changes in ambient temperature and humidity also affect the performance of the cover tape adhesive layer, causing peel force to fluctuate with environmental conditions. Especially in high-temperature and high-humidity environments or after prolonged storage, the cap tape peel force can drift, affecting the stability of the placement process. Current technologies lack methods for real-time compensation for environmental changes. Furthermore, with the development of smart manufacturing and the Industrial Internet, SMT production lines are gradually upgrading towards intelligence and digitalization. However, existing reel packaging systems are essentially passive structures, lacking sensing and feedback capabilities, and cannot coordinate with the placement machine control system, making it difficult to achieve closed-loop optimization control of the production process. Therefore, there is an urgent need for an intelligent SMT packaging reel structure and its adaptive peel force adjustment method that can dynamically adjust the cap tape peel force, reduce the rejection rate, and adapt to different components and environmental conditions, in order to improve the stability, reliability, and production efficiency of the placement process. Summary of the Invention

[0003] The purpose of this invention is to provide a method for adaptively adjusting the peel force of SMT packaging tape with low material rejection rate and its cover tape, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: A low-explosion-rate SMT packaging reel includes: a carrier tape body, a cover tape layer, and an intelligent peel force adjustment layer disposed between the carrier tape body and the cover tape layer. It also includes a peel sensing unit and a data feedback module. The intelligent peel force adjustment layer is used to change the adhesion strength between the cover tape and the carrier tape according to a control signal to achieve adaptive adjustment of the cover tape peel force.

[0005] Preferably, the intelligent peel force adjustment layer includes at least one of a thermally responsive adhesive layer, an electrically controlled adhesion layer, or a microstructure adjustment layer.

[0006] Preferably, the peeling sensing unit is disposed in the edge region of the carrier tape and is used to detect the peeling force and peeling angle of the cover tape.

[0007] Preferably, the data feedback module communicates with the pick-and-place machine control system to achieve closed-loop control.

[0008] An adaptive adjustment method for the peel force of the cover tape in SMT packaging reels with low waste rate, the adaptive adjustment method being applicable to SMT packaging reels with low waste rate, the adaptive adjustment method comprising the following steps:

[0009] Step 1: Collect peel force data; Step 2: Collect the material rejection rate data; Step 3: Establish a model for peeling force and material rejection rate; Step 4: Calculate the target peel force parameters; Step 5: Adjust the smart peel force to adjust the adhesion strength of the adjustment layer.

[0010] Preferably, the model is a PID control model, a fuzzy control model, or a neural network model.

[0011] Preferably, the adjustment methods include changing the heat sealing temperature, the electronic control voltage, or the microstructure contact area.

[0012] Preferably, the carrier tape is made of PS, PET or paper-based composite material.

[0013] Preferably, the cover layer is a PET composite film structure.

[0014] Preferably, the peeling force adjustment forms a closed-loop feedback control system.

[0015] Compared with existing technologies, this invention has the following beneficial effects: Compared with existing technologies, the SMT packaging tape with low ejection rate and its cover tape peel force adaptive adjustment method provided by this invention have significant technical effects and industrial application value. First, this invention introduces an intelligent peel force adjustment layer between the carrier tape and the cover tape, so that the adhesion strength between the cover tape and the carrier tape is no longer fixed, but can be dynamically adjusted according to the control signal. By changing the temperature of the thermally responsive adhesive layer, the electric field strength of the electrically controlled adhesion layer, or the contact area of ​​the microstructure adjustment layer, the peel force can be continuously adjusted, thus keeping the peel force in the optimal range and effectively reducing the probability of ejection. Second, this invention sets up a peel sensing unit and a data feedback module to realize real-time monitoring of peel force and ejection rate, and forms a closed-loop feedback control system with the pick-and-place machine control system. By establishing a mathematical model or machine learning model between peel force and ejection rate, the system can automatically calculate the target peel force parameter and adjust the intelligent peel force adjustment layer in real time to achieve adaptive control. This closed-loop control mechanism upgrades the packaging system from a passive structure to an intelligent active adjustment system, significantly improving the stability and consistency of the production process. Third, this invention can adapt to electronic components of different sizes, weights, and packaging forms. By adaptively adjusting the peel force, optimal peel force ranges can be set for micro-miniature devices, precision devices, and large-size devices, enabling co-line production of multiple types of components, reducing the frequency of carrier tape and cover tape changes, and improving production line flexibility and equipment utilization. Fourth, this invention can automatically compensate for changes in environmental temperature and humidity. When environmental conditions cause changes in adhesive layer performance, the system detects changes in peel force through sensors and makes feedback adjustments to maintain stable peel force, avoiding increased rejection rates or decreased sealing performance due to environmental fluctuations. Fifth, this invention significantly improves placement yield and production efficiency. Due to the significantly reduced rejection rate, the number of placement machine shutdown alarms is reduced, the production cycle is more stable, and component waste is reduced, thereby reducing production costs and improving enterprise economic benefits. Sixth, this invention has strong structural compatibility and can be integrated and upgraded on existing SMT reel production lines and placement machine systems without large-scale modifications to the main structure of the placement machine, making it highly valuable for industrial promotion. Seventh, this invention can be expanded into a smart manufacturing data acquisition node, enabling digital management of tape peeling parameters. This provides fundamental data support for intelligent optimization, quality traceability, and big data analysis of SMT production lines, aligning with the development trends of Industry 4.0 and smart manufacturing. In summary, this invention, through a combination of structural and control method innovation, achieves intelligent adaptive adjustment of the cover tape peeling force, significantly reducing the rejection rate and improving placement stability and production efficiency. It demonstrates significant technological advancement and broad industrial application prospects. Detailed Implementation

[0016] The present application will be further described in detail below with reference to embodiments. It is to be understood that the specific embodiments described herein are only for explaining the relevant invention and are not intended to limit the invention.

[0017] Please refer to the following: a low-explosion-rate SMT packaging reel includes: a carrier tape body, a cover tape layer, and an intelligent peel force adjustment layer disposed between the carrier tape body and the cover tape layer. It also includes a peel sensing unit and a data feedback module. The intelligent peel force adjustment layer is used to change the adhesion strength between the cover tape and the carrier tape according to a control signal to achieve adaptive adjustment of the cover tape peel force.

[0018] The intelligent peel force adjustment layer includes at least one of a thermally responsive adhesive layer, an electronically controlled adhesion layer, or a microstructure adjustment layer.

[0019] The peeling sensing unit is located at the edge of the carrier tape and is used to detect the peeling force and peeling angle of the cover tape.

[0020] The data feedback module communicates with the pick-and-place machine control system to achieve closed-loop control.

[0021] An adaptive adjustment method for the peel force of the cover tape in SMT packaging reels with low material rejection rate, the adaptive adjustment method being applicable to SMT packaging reels with low material rejection rate, the adaptive adjustment method comprising the following steps: Step 1: Collect peel force data; Step 2: Collect the material rejection rate data; Step 3: Establish a model for peeling force and material rejection rate; Step 4: Calculate the target peel force parameters; Step 5: Adjust the smart peel force to adjust the adhesion strength of the adjustment layer.

[0022] The model can be a PID control model, a fuzzy control model, or a neural network model.

[0023] The adjustment methods include changing the heat sealing temperature, electronic control voltage, or microstructure contact area.

[0024] The carrier tape is made of PS, PET or paper-based composite material.

[0025] The cover layer is a PET composite film structure.

[0026] Among them, the peeling force adjustment forms a closed-loop feedback control system.

[0027] The working principle and usage of this invention: This invention introduces an intelligent peel force adjustment layer and feedback control system into the traditional SMT packaging reel structure to achieve adaptive adjustment of the cover tape peel force, thereby reducing the rejection rate. During the placement process, the pick-and-place machine drives the reel forward and peels off the cover tape through the peeling mechanism. During peeling, the peeling sensor unit collects real-time data on the cover tape peel force, peeling angle, and peeling speed, and transmits this data to the data feedback module. Simultaneously, the pick-and-place machine detects component rejection using a vision system or vacuum nozzle pressure sensor, calculating the rejection rate per unit time. The control system calculates based on a peel force-rejection rate model. When the rejection rate exceeds a preset threshold, the control system adjusts the parameters of the intelligent peel force adjustment layer. For example, by changing the temperature of the thermal adhesive layer, changing the electric field strength of the electro-adhesive material, or adjusting the microstructure contact area, the adhesion strength between the cover tape and the carrier tape is increased or decreased, thereby achieving the optimal peel force. This system forms a closed-loop feedback adjustment, enabling the peel force to automatically adjust according to changes in component weight, size, ambient temperature and humidity, and pick-and-place machine speed, achieving adaptive control. Because the peel force is always kept within the optimal range, the components will not be ejected from the material tray due to the impact of the cover tape peeling, nor will they shake due to insufficient peel force, thereby significantly reducing the rejection rate and improving the stability and yield of the placement. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0028] Example 1: This embodiment provides a low-explosion-rate SMT packaging reel structure based on a thermo-responsive adhesive layer for automated placement and feeding of electronic components. The SMT packaging reel includes a carrier tape body, a cover tape layer, and an intelligent peel force adjustment layer disposed between the carrier tape body and the cover tape layer. The carrier tape body is made of PET or PS material and is formed using a vacuum forming process to create multiple grooves arranged along its length to accommodate electronic components such as resistors, capacitors, chip resistors, and integrated circuits. Drive holes are provided on both sides of the carrier tape body for engagement with the placement machine's drive mechanism. The cover tape layer is made of PET composite film material and is heat-sealed to the carrier tape body to form a sealed cavity. To achieve adjustable peel force, this embodiment provides a thermo-responsive adhesive layer between the cover tape layer and the carrier tape body. This thermo-responsive adhesive layer uses a temperature-sensitive hot melt adhesive or a thermo-reversible adhesive material, and its adhesion strength changes with temperature. A peel sensing unit is provided at the edge region of the carrier tape body. This peel sensing unit includes a miniature force sensor and an angle sensor to detect the peel force and peel angle data generated during the cover tape peeling process. The peel sensing unit is connected to the data feedback module via a flexible circuit board. The data feedback module, located at the edge of the tape reel or in the pick-and-place machine interface module, receives detection data from the peel sensing unit and communicates with the pick-and-place machine control system. Based on the peel force and ejection rate data, the pick-and-place machine control system sends control signals to the thermally responsive adhesive layer control module to adjust the local temperature of the thermally responsive adhesive layer. Specifically, a miniature heating unit, employing a thin-film heating element or a miniature resistance heater, is positioned in the cover tape peeling area to change the temperature of the thermally responsive adhesive layer, thereby altering the adhesion strength between the cover tape and the carrier tape. When excessive peel force or increased ejection rate is detected, the control system lowers the heating temperature to reduce adhesive adhesion strength, thus decreasing the peel force; conversely, when insufficient peel force or component movement is detected, the heating temperature is increased to enhance adhesive adhesion strength. Through this structure, this embodiment achieves dynamic adjustment of the cover tape peel force, ensuring it remains within the optimal range, thereby significantly reducing the ejection rate and improving placement stability.

[0029] Example 2: This embodiment provides an SMT packaging reel structure with adaptive adjustment of cover tape peel force based on an electrically controlled adhesive layer, suitable for smart manufacturing scenarios. The SMT packaging reel includes a carrier tape body, a cover tape layer, an electrically controlled adhesive layer, a peel sensing unit, and a control module. The carrier tape body adopts a multi-layer composite material structure, including a bottom PET layer, an intermediate reinforcing layer, and a surface antistatic layer to improve mechanical strength and antistatic performance. The electrically controlled adhesive layer is disposed between the carrier tape body and the cover tape layer, and uses an electro-adhesive material, such as a dielectric elastomer or an electrically controlled variable friction material. When an electric field is applied, the surface adhesion force and friction coefficient of the electrically controlled adhesive layer change, thereby achieving dynamic adjustment of the cover tape peel force. The peel sensing unit includes a force sensor, a displacement sensor, and a speed sensor, used to detect the cover tape tension, peel speed, and peel angle during the peeling process. The sensing unit is connected to the control module wirelessly or via a wired connection. The control module includes an embedded microprocessor, a drive circuit, and a communication interface. The control module establishes a peel force-scraping rate control model based on the data collected by the peel sensing unit and the scrap rate data fed back by the pick-and-place machine. The control model can employ PID control, fuzzy control, or neural network algorithms to achieve real-time adjustment of the voltage applied to the electronically controlled adhesion layer. During the placement process, when the control module detects that the rejection rate exceeds a preset threshold, it increases the applied voltage of the electronically controlled adhesion layer to increase the adhesion strength between the cover tape and the carrier tape, thereby reducing cover tape peeling speed fluctuations and minimizing component bounce. When excessive peeling force is detected, the applied voltage is reduced to decrease the adhesion strength, thereby reducing the peeling impact force. Furthermore, the control module can compensate for the electronically controlled adhesion layer parameters based on ambient temperature and humidity sensor data, achieving adaptive adjustment to environmental changes. Through an industrial communication interface, the control module can connect to a MES system to achieve digital management and remote monitoring of peeling parameters. Through the above embodiments, this invention achieves electronically adjustable and intelligent closed-loop control of peeling force, significantly reducing the rejection rate and improving the intelligence level of the SMT production line.

[0030] Example 3: This embodiment provides a low-explosion-rate SMT packaging tape and peel force adaptive adjustment system based on a microstructure adjustment layer and machine learning control algorithm. The SMT packaging tape includes a carrier tape body, a cover tape layer, a microstructure adjustment layer, a peel sensing unit, and an intelligent control system. The carrier tape body is made of biodegradable or recyclable polymer material, and its groove structure is formed through precision stamping or injection molding. The cover tape layer is made of high-transparency PET film with an antistatic coating. The microstructure adjustment layer is disposed between the carrier tape body and the cover tape layer, and includes a variable contact area microstructure array. This microstructure array is composed of micron-level bumps, grooves, or biomimetic structures, and the contact area is changed through mechanical adjustment or shape memory materials, thereby altering the adhesion strength between the cover tape and the carrier tape. The peel sensing unit includes a high-precision micro-strain gauge, fiber optic sensor, or MEMS force sensor for real-time detection of the peel force curve. The data from the peel sensing unit is preprocessed by an edge computing module and transmitted to the intelligent control system. The intelligent control system includes a data acquisition module, a machine learning model, and an execution control module. A machine learning model is trained using historical production data to predict peel force-scraping rate, forecasting optimal peel force parameters for different components, placement speeds, and environmental conditions. The execution control module controls the shape or contact area of ​​the microstructure adjustment layer based on the model output, for example, by altering the height or density of the microstructure array using micro-actuators, thermo-deformable materials, or piezoelectric actuators. During placement, the system collects peel force and scrapping rate data in real time and uses the machine learning model for prediction and decision-making, combining feedforward and feedback control of the peel force. When changes in component size or placement speed are detected, the system adjusts the microstructure contact area in advance to maintain a stable peel force. Furthermore, this embodiment also features self-learning capabilities, continuously updating model parameters by collecting production data to continuously optimize the peel control strategy and achieve intelligent evolutionary control. Through the above embodiments, this invention realizes a high-precision peel force adjustment system based on microstructure and artificial intelligence algorithms, significantly reducing the scrapping rate and enabling intelligent upgrades to SMT tape feeding systems.

[0031] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A low-discarding-rate SMT packaging reel, characterized in that: include: The carrier tape body, the cover tape layer, and the intelligent peel force adjustment layer disposed between the carrier tape body and the cover tape layer also include a peel sensing unit and a data feedback module. The intelligent peel force adjustment layer is used to change the adhesion strength between the cover tape and the carrier tape according to the control signal, so as to realize the adaptive adjustment of the peel force of the cover tape.

2. The SMT packaging tape with low material rejection rate according to claim 1, characterized in that: The intelligent peel force adjustment layer includes at least one of a thermally responsive adhesive layer, an electronically controlled adhesion layer, or a microstructure adjustment layer.

3. The SMT packaging reel with low material rejection rate according to claim 1, characterized in that: The peeling sensing unit is located at the edge region of the carrier tape and is used to detect the peeling force and peeling angle of the cover tape.

4. The SMT packaging tape with low material rejection rate according to claim 1, characterized in that: The data feedback module communicates with the pick-and-place machine control system to achieve closed-loop control.

5. An adaptive adjustment method for the peel force of the cover tape in SMT packaging reels with low waste rate, the adaptive adjustment method being applicable to SMT packaging reels with low waste rate, characterized in that: The adaptive adjustment method includes the following steps: Step 1: Collect peel force data; Step 2: Collect the material rejection rate data; Step 3: Establish a model for peeling force and material rejection rate; Step 4: Calculate the target peel force parameters; Step 5: Adjust the smart peel force to adjust the adhesion strength of the adjustment layer.

6. The adaptive adjustment method for the cap tape peel force of SMT packaging reel with low material rejection rate according to claim 5, characterized in that: The model can be a PID control model, a fuzzy control model, or a neural network model.

7. The adaptive adjustment method for the cap tape peel force of SMT packaging reel with low material rejection rate according to claim 5, characterized in that: Adjustment methods include changing the heat sealing temperature, electronic control voltage, or microstructure contact area.

8. The adaptive adjustment method for the cap tape peel force of SMT packaging reel with low material rejection rate according to claim 1, characterized in that: The carrier tape is made of PS, PET or paper-based composite material.

9. The adaptive adjustment method for the cap tape peel force of SMT packaging reel with low material rejection rate according to claim 1, characterized in that: The cover layer is a PET composite film structure.

10. The adaptive adjustment method for the cap tape peel force of SMT packaging reel with low material rejection rate according to claim 5, characterized in that: Peeling force adjustment forms a closed-loop feedback control system.