Inert atmosphere protection device and laser annealing equipment

Abstract

The invention provides an inert atmosphere protection device and laser annealing equipment. The inert atmosphere protection device comprises a main body part, the main body part is provided with a main cavity and a plurality of flow uniformizing structures which are arranged at intervals in the axial direction of the main cavity, and each flow uniformizing structure comprises a plurality of purging openings which are sequentially arranged in the circumferential direction of the main cavity and communicate with the main cavity; at least one uniform flow structure is a first type of uniform flow structure; and the axes of all the purging openings of the same first-type uniform flow structure are positioned on a plane perpendicular to the axial direction of the main body part and are inclined relative to the normal of the main body part along the same direction. The inert atmosphere protection device is applied to the laser annealing equipment, and when the axial direction of the main body part extends in the vertical direction, while foreign gas in the main cavity is discharged and a protective gas jet area is constructed for an exposure area, protective gas entering from the first type of uniform flow structure forms a horizontal vortex rotating around the axis of the main cavity, so that the laser annealing equipment is protected. Pollutants generated in the exposure process of the wafer are prevented from rising, so that pollution to the exposure lens group is reduced.

Description

Technical Field

[0001] This invention belongs to the field of laser annealing technology, specifically relating to an inert atmosphere protection device and a laser annealing equipment. Background Technology

[0002] Laser annealing uses a laser pulser to provide a laser source. The laser light from this source is shaped into a long, narrow rectangular beam after passing through an optical system (a series of lenses), which then irradiates the film layers on the wafer. The purpose of using laser annealing on wafers is to crystallize or increase crystallinity, transforming amorphous materials into polycrystalline or monocrystalline states. This allows the incorporated impurities to arrange themselves in an orderly manner with the atoms in the film layer after ion implantation, thereby improving the electrical properties of the materials on the wafer's chip cells.

[0003] To prevent the formation of impurities such as high-resistivity silicon dioxide and nickel oxide during annealing in an oxygen atmosphere, laser annealing must be performed under the protection of an inert gas such as nitrogen to improve its performance. Therefore, providing a device capable of effectively creating an inert atmosphere is of great significance. Summary of the Invention

[0004] The purpose of this invention is to provide an inert atmosphere protection device and a laser annealing equipment, which are designed to provide an inert atmosphere when performing laser annealing operations on wafers.

[0005] To achieve the above objectives, the present invention provides an inert atmosphere protection device, comprising a main body;

[0006] The main body has a main cavity extending through it along its own axis; the main body is also provided with a plurality of flow equalization structures arranged at intervals along its own axis; each flow equalization structure includes a plurality of purge ports arranged sequentially along the circumference of the main cavity and communicating with the main cavity.

[0007] At least one of the flow-uniform structures is a first-type flow-uniform structure;

[0008] The axis of the purge port of the first type of flow uniform structure is located on a plane perpendicular to the axial direction of the main body, and the axes of all the purge ports of the same first type of flow uniform structure are inclined relative to the normal of the main body in the same direction.

[0009] Optionally, the angle formed by the axis of any of the purge ports of the first type of uniform flow structure and the normal of the main body at the corresponding position is not less than 10° and not greater than 60°.

[0010] Optionally, the plurality of the flow-equalizing structures are divided into a first combination and a second combination, wherein the first combination and the second combination are spaced apart in the axial direction of the main body.

[0011] The first combination and the second combination each include at least two of the aforementioned flow-uniforming structures.

[0012] Optionally, the flow uniform structure that is closest to the second combination in the first combination is the first type of flow uniform structure.

[0013] Optionally, all of the flow-uniforming structures in the first combination are of the first type of flow-uniforming structure.

[0014] Optionally, the flow equalization structure closest to the first combination in the second combination is a second type of flow equalization structure; the axis of the purge port of the second type of flow equalization structure is inclined relative to the axis of the main body, and the projection of the axis of any purge port of the second type of flow equalization structure onto a plane perpendicular to the axis of the main body coincides with or is parallel to the normal of the main body at the corresponding position; the outflow end of the purge port of the second type of flow equalization structure in the second combination is closer to the first combination than the inflow end.

[0015] Optionally, the acute angle formed by the axis of the purge port of the second type of uniform flow structure and its projection onto a plane perpendicular to the axis of the main body is not greater than 80°.

[0016] Optionally, the flow uniform structure in the second combination that is furthest from the first combination is the first type of flow uniform structure.

[0017] Optionally, the flow equalization structure closest to the first combination in the second combination is a second type of flow equalization structure; the axis of the purge port of the second type of flow equalization structure is inclined relative to the axis of the main body, and the projection of the axis of any purge port of the second type of flow equalization structure onto a plane perpendicular to the axis of the main body coincides with or is parallel to the normal of the main body at the corresponding position; the outflow end of the purge port of the second type of flow equalization structure in the second combination is closer to the first combination than the inflow end;

[0018] The flow equalization structure furthest from the second combination in the first combination is a third type of flow equalization structure; the axis of the purge port of the third type of flow equalization structure is inclined relative to the axis of the main body, and the inflow end of the purge port of the third type of flow equalization structure is closer to the second combination than the outflow end, and the projection of the axis of all the purge ports of the same third type of flow equalization structure onto a plane perpendicular to the axis of the main body is inclined in the same direction relative to the normal of the main body.

[0019] Optionally, the flow uniform structure closest to the first combination in the second combination and the flow uniform structure farthest from the second combination in the first combination are both third-type flow uniform structures;

[0020] The axis of the purge port of the third type of flow equalization structure is inclined relative to the axis of the main body. The projection of the axis of all the purge ports of the same third type of flow equalization structure onto a plane perpendicular to the axis of the main body is inclined in the same direction relative to the normal of the main body. The outflow end of the purge port of the third type of flow equalization structure in the second combination is closer to the first combination than the inflow end, and the inflow end of the purge port of the third type of flow equalization structure in the first combination is closer to the second combination than the outflow end.

[0021] Optionally, the acute angle formed by the axis of the purge port of the second type of uniform flow structure and its projection onto a plane perpendicular to the axis of the main body is not greater than 80°.

[0022] Optionally, the acute angle formed by the axis of the purge port of the third type of flow uniform structure and its projection on a plane perpendicular to the axial direction of the main body is not greater than 80°; and the angle formed by the projection of the axis of any purge port of the third type of flow uniform structure on a plane perpendicular to the axial direction of the main body and the normal of the main body at the corresponding position is not less than 10° and not greater than 60°.

[0023] To achieve the above objectives, the present invention also provides a laser annealing apparatus, including a workpiece stage, an exposure lens assembly, and an inert atmosphere protection device as described above; the exposure lens assembly, the inert atmosphere protection device, and the workpiece stage are arranged in sequence.

[0024] Compared with the prior art, the inert atmosphere protection device and laser annealing equipment of the present invention have the following advantages:

[0025] The inert atmosphere protection device includes a main body; the main body has a main cavity extending through it along its own axial direction; the main body is also provided with a plurality of flow equalization structures arranged at intervals along its own axial direction, each flow equalization structure including a plurality of purge ports arranged sequentially along the circumference of the main cavity and communicating with the main cavity; at least one of the flow equalization structures is a first type of flow equalization structure; the axis of the purge port of the first type of flow equalization structure is located on a plane perpendicular to the axial direction of the main body, and the axes of all the purge ports of the same first type of flow equalization structure are inclined relative to the normal of the main body in the same direction. When the inert atmosphere protection device is applied to a laser annealing equipment, the axial direction of the main body extends vertically. The uniform flow structure near the upper end of the main body discharges impurity gases from the top of the main cavity to avoid dead zones, preventing the continuous introduction of impurities into the high-purity protective gas during subsequent operation. The uniform flow structure near the lower end of the main body allows the main cavity to construct a protective gas jet region from the bottom to the exposure area, directly supplying gas to protect the exposure area. Furthermore, by configuring at least one of the uniform flow structures as the first type of uniform flow structure, the protective gas entering the main cavity from the first type of uniform flow structure forms a horizontal vortex rotating around the axis of the main cavity, thereby preventing contaminants generated during wafer exposure from rising and reducing contamination of the exposure lens assembly. Attached Figure Description

[0026] The accompanying drawings are provided to better understand the invention and are not intended to unduly limit the scope of the invention. Wherein:

[0027] Figure 1 This is a schematic diagram of the structure of an inert atmosphere protection device according to an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the inert atmosphere protection device provided by the present invention according to an embodiment. Figure 2 and Figure 1 The difference lies in the number of uniform flow structures;

[0029] Figure 3 A schematic diagram showing the normal of an inert atmosphere protection device;

[0030] Figure 4 This is a schematic diagram of the first type of uniform flow structure of the inert atmosphere protection device provided according to an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of the first type of uniform flow structure of the inert atmosphere protection device provided by the present invention according to an embodiment, with only one purge port shown in the figure;

[0032] Figure 6This is a schematic diagram of a flow uniform structure of an inert atmosphere protection device according to an embodiment of the present invention. The flow uniform structure shown in the diagram is a second type of flow uniform structure.

[0033] Figure 7 This is a schematic diagram of a uniform flow structure of an inert atmosphere protection device according to an embodiment of the present invention. Figure 7 and Figure 6 The difference lies in the direction of observation;

[0034] Figure 8 This is a schematic diagram of a flow uniform structure of an inert atmosphere protection device according to an embodiment of the present invention. The flow uniform structure shown in the diagram is a third type of flow uniform structure.

[0035] Figure 9 This is a schematic diagram of a uniform flow structure of an inert atmosphere protection device according to an embodiment of the present invention. Figure 9 and Figure 8 The difference lies in the direction of observation;

[0036] Figure 10 This is a schematic diagram of the structure of the laser annealing equipment provided in an embodiment of the present invention;

[0037] Figure 11 This is a schematic diagram of the contamination simulation results of a longitudinal section of the inert atmosphere protection device for the laser annealing equipment provided in Embodiment 1 of the present invention;

[0038] Figure 12 This is a schematic diagram of the contamination simulation results of a cross-section of the inert atmosphere protection device of the laser annealing equipment provided in Embodiment 1 of the present invention.

[0039] Figure 13 This is a schematic diagram of the gas flow field simulation results of the main cavity of the inert atmosphere protection device of the laser annealing equipment provided in Embodiment 2 of the present invention, located below the second assembly.

[0040] Figure 14 This is a schematic diagram of the contamination simulation results of a longitudinal section of the inert atmosphere protection device for the laser annealing equipment provided in Embodiment 2 of the present invention.

[0041] Figure 15 This is a schematic diagram of the contamination simulation results of a cross-section of the inert atmosphere protection device for the laser annealing equipment provided in Embodiment 2 of the present invention;

[0042] Figure 16 This is a schematic diagram of the contamination simulation results on another cross-section of the inert atmosphere protection device of the laser annealing equipment provided in Embodiment 2 of the present invention;

[0043] Figure 17This is a schematic diagram of the contamination simulation results of a longitudinal section of the inert atmosphere protection device for the laser annealing equipment provided in Embodiment 3 of the present invention;

[0044] Figure 18 This is a schematic diagram of a cross-section of the contamination simulation structure of the inert atmosphere protection device for the laser annealing equipment provided in Embodiment 3 of the present invention. Figure 18 and Figure 17 Difference

[0045] Figure 19 This is a schematic diagram of the contamination simulation results of a longitudinal section of the inert atmosphere protection device for the laser annealing equipment provided in Embodiment 4 of the present invention.

[0046] Figure 20 This is a schematic diagram of a cross-section of the inert atmosphere protection device for the laser annealing equipment provided in Embodiment 4 of the present invention, showing a simulated contamination structure.

[0047] Figure 21 This is a schematic diagram of the gas flow field simulation results in the inert atmosphere protection device of the laser annealing equipment provided in Comparative Example 1;

[0048] Figure 22 This is a schematic diagram of the contamination simulation results of a longitudinal section of the inert atmosphere protection device for the laser annealing equipment provided in Comparative Example 1.

[0049] Figure 23 This is a schematic diagram of the contamination simulation results of a cross-section of the inert atmosphere protection device of the laser annealing equipment provided in Comparative Example 1.

[0050] [The annotations in the attached figures are explained below]:

[0051] 10-Inert atmosphere protection device, 100-Main body, 101-Main body cavity, 110a-First assembly, 110b-Second assembly, 111-Flow uniform structure, 1111-Purge port, 200-Guide plate, 300-Outer cover, 11-First flow channel, 12-Second flow channel, 13-First air inlet, 14-Second air inlet, 20-Exposure lens group, 30-Workpiece stage. Detailed Implementation

[0052] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show components related to the present invention and are not drawn according to the actual number, shape, and size of components in the actual implementation. In the actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0053] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of the present invention must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can, based on the disclosure of the present invention and depending on design specifications or implementation requirements, selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, thereby increasing the flexibility in implementing the present invention.

[0054] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “multiple” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “installed,” “connected,” and “linked” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can be internal communication between two elements or an interaction between two elements. Relational terms such as “first,” “second,” etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly specify the number of technical features indicated. It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0055] One of the objectives of this invention is to provide an inert atmosphere protection device that can be applied to a laser annealing equipment and is disposed between the exposure mirror assembly and the workpiece stage to create an inert gas flow field in the exposure area of ​​the workpiece stage.

[0056] To make the objectives, advantages, and features of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clearly illustrate the objectives of the embodiments of the present invention. The same or similar reference numerals in the drawings represent the same or similar parts.

[0057] Figure 1 and Figure 2 Schematic diagrams of the inert atmosphere protection device 10 provided in different embodiments are shown. Figure 1 and Figure 2 As shown, the inert atmosphere protection device 10 includes a main body 100. The main body 100 has a main cavity 101 extending through it along its own axial direction. Figure 1 and Figure 2 None of these are shown in the image; please refer to [link / reference]. Figures 3 to 5 (As shown). The main body 100 is also provided with two or more flow equalization structures 111, and all the flow equalization structures 111 are arranged at intervals along the axial direction of the main body 100. Each flow equalization structure 111 includes multiple purge ports 1111, the purge ports 1111 are connected to the main cavity 101, and the multiple purge ports 1111 of the same flow equalization structure 111 are arranged sequentially along the circumference of the main cavity 101.

[0058] The inert atmosphere protection device 10 is used in laser annealing equipment. For example... Figure 10 As shown, the laser annealing equipment further includes an exposure lens group 20 and a workpiece stage 30, which are arranged sequentially. In a specific embodiment, the exposure lens group 20, the inert atmosphere protection device 10, and the workpiece stage 30 are arranged sequentially from top to bottom, and the axial direction of the main body 100 of the inert atmosphere protection device 10 extends vertically.

[0059] When the laser annealing equipment is in operation, a protective gas is supplied to the outer periphery of the main body 100 via an external gas supply device to supply all the uniform flow structures 111. The protective gas enters the main cavity 101 through the purge ports 1111 of each uniform flow structure 111. Specifically, the protective gas entering the main cavity 101 through the purge ports 1111 of the uniform flow structures 111 near the upper end of the main body 100 allows impurities to be expelled from the main cavity 101, preventing the formation of dead zones and avoiding the continuous introduction of impurities into the high-purity protective gas during subsequent operation. The protective gas entering the main cavity 101 through the purge ports 1111 of the uniform flow structures 111 near the lower end of the main body 100 can create a protective gas jet region from the bottom of the main cavity 101 onto the exposure area of ​​the workpiece stage 30, directly supplying gas protection to the exposure area. The protective gas here includes, but is not limited to, nitrogen, argon, or any other inert gas. It is understood that the protective gas enters the main cavity 101 from the outside of the main body 100 through the purge port 1111. Therefore, the end of the purge port 1111 farther from the axis of the main body 100 is the inflow end, and the end closer to the axis of the main body 100 is the outflow end. It is understood that the end of the inflow end is located on the outer surface of the main body 100, and the end of the outflow end is located on the inner surface of the main body 100.

[0060] It should be noted that the distance between the lower end of the inert atmosphere protection device 10 and the upper surface of the workpiece placed on the workpiece stage 30 is less than or equal to a preset value to ensure that a protective gas jet region can be constructed. In practice, the preset value is related to the flow rate of the protective gas entering the main cavity 101 from each of the uniform flow structures 111 of the inert atmosphere protection device 10. In a specific example, the flow rate of the protective gas entering the main cavity 101 from each of the uniform flow structures 111 of the inert atmosphere protection device 10 is 2.5 L / min to 60 L / min, and the preset value is less than 3 mm.

[0061] In this embodiment of the invention, at least one of the flow-uniforming structures 111 is configured as a first type of flow-uniforming structure. For example... Figure 4 and Figure 5 As shown, the axis S1 of the purge port 1111 of the first type of uniform flow structure is located on a plane perpendicular to the axial direction of the main body 100, and the axis S1 of all the purge ports 111 belonging to the same first type of uniform flow structure is inclined in the same direction relative to the normal S2 of the main body 100.

[0062] Please refer to Figure 3 The normal S2 of the main body 100 refers to a straight line that is perpendicular to and intersects the axis of the main cavity 101. In some examples, the cross-section of the main cavity 101 perpendicular to its axial direction is circular, then any normal S2 of the main body 100 is the straight line containing the diameter of the main cavity 101. It can be understood that the axial direction of the main body 100 is the same as the axial direction of the main cavity 101.

[0063] Additionally, when the inert gas protection device 10 is applied... Figure 10 When the main body 100 is extended vertically along the axis by the laser annealing equipment shown, the "plane perpendicular to the axis of the main body 100" is a horizontal plane. For ease of description, the following text will directly use the vertical arrangement of the inert atmosphere protection device 10 as an example. Thus, the term "horizontal plane" will be used to refer to "the plane perpendicular to the axis of the main body 100" in the following text.

[0064] In other words, in this embodiment of the invention, the axis S1 of any of the purge ports 1111 of the first type of flow uniform structure is on a horizontal plane, and is deflected by a predetermined angle along a preset direction relative to the normal S2 of the main body 100 at the corresponding position, so that the axis of the purge port 1111 of the first type of flow uniform structure is inclined relative to the normal S2 of the main body 100. The corresponding position here is, for example, the center O of the inflow end of the purge port 1111, but the corresponding position can also be other positions. Furthermore, the preset direction can be counterclockwise or clockwise, for example, for... Figure 4 and Figure 5 For the first type of uniform flow structure shown, the preset direction is counterclockwise. For different first type of uniform flow structures, the preset direction may be the same or different, but it is preferred that they are the same.

[0065] Thus, when the protective gas enters the main cavity 101 from the purge port 1111 of the first type of uniform flow structure, this portion of the protective gas forms a horizontal vortex. Contaminants generated during laser annealing of a workpiece, such as a wafer, located on the workpiece stage 30, flow upwards and, upon reaching the area of ​​the horizontal vortex, are entrained by the protective gas and rotate with it on the horizontal plane. This prevents the contaminants from rising further to the exposure lens group 20, thereby avoiding contamination of the exposure lens group 20.

[0066] In this embodiment of the invention, the deflection angle α formed by the axis S1 of any of the purge ports 1111 of the first type of flow uniform structure deflecting relative to the normal S2 of the main body 100 at the corresponding position on the horizontal plane is not less than 10° and not greater than 60°. Thus, the tilt angle of the axis S1 of any of the purge ports 1111 of the first type of flow uniform structure relative to the normal S2 of the main body 100 at the corresponding position is not less than 10° and not greater than 60°. This ensures that the protective gas entering the main cavity 101 through the purge ports 1111 of the first type of flow uniform structure can form a horizontal vortex.

[0067] Optionally, such as Figure 2 As shown, the main body 100 is provided with three or more flow equalization structures 111, for example, four or more flow equalization structures 111. The three or more flow equalization structures 111 are divided into two flow equalization structure groups. Specifically, a plurality of flow equalization structures 111 near the lower end of the main body 100 are divided into a first flow equalization structure group, and a plurality of flow equalization structures 111 near the upper end of the main body 100 are divided into a second flow equalization structure group. For ease of description, the first flow equalization structure group will be referred to as the first combination 110a and the second flow equalization structure group as the second combination 110b.

[0068] Thus, the first assembly 110a and the second assembly 110b are spaced apart axially on the main body 100, with the second assembly 110b positioned above the first assembly 110a and closer to the exposure lens group 20. Consequently, the protective gas entering the main cavity 101 from the purge port 1111 of the uniform flow structure 111 of the second assembly 110b is used to discharge impurities within the main cavity 101 from the top of the main body 101, and the protective gas entering the main cavity 101 from the purge port 1111 of the uniform flow structure 111 of the first assembly 110a is used to construct a protective gas jet region for the exposure area of ​​the workpiece stage 30.

[0069] Optionally, the first combination 110a includes at least two of the flow uniform structures 111.

[0070] Optionally, the second combination 110b includes at least two of the flow uniform structures 111.

[0071] Optionally, any one of the flow equalization structures 111 in the first combination 110a is configured as the first type of flow equalization structure. For example, the uppermost flow equalization structure 111 in the first combination 110a (i.e., the flow equalization structure 111 in the first combination 110a closest to the second combination 110b) is configured as the first type of flow equalization structure. In this way, the horizontal vortex generated by the protective gas is located in the lower part of the main cavity 101, so that contaminants generated by the workpiece during exposure will not rise to the upper part of the main cavity 101.

[0072] Optionally, all the flow equalization structures 111 in the first combination 110a are configured as the first type of flow equalization structure. This allows the protective gas to rotate sufficiently in the lower part of the main cavity 101 and form a stable horizontal vortex, effectively preventing pollutants from rising.

[0073] Optionally, the uppermost flow-equalizing structure 111 in the second assembly 110b (i.e., the flow-equalizing structure 111 in the second assembly 110b that is furthest from the first assembly 110a) is provided with the first type of flow-equalizing structure. One advantage of this arrangement is that it creates a horizontal vortex to prevent contaminants in the lower part of the main cavity 101 from rising. Another advantage is that it provides better exhaust, venting oxygen above the flow-equalizing structure 111 in the main cavity 101 and maintaining a certain concentration of clean protective gas within the main cavity 101.

[0074] Optionally, some of the flow uniform structures 111 in the embodiments of the present invention may also be configured as a second type of flow uniform structure or a third type of flow uniform structure.

[0075] like Figure 6 and Figure 7 As shown, the axis S3 of the purge port 1111 of the second type of flow equalization structure is not on the horizontal plane, but is inclined relative to the axis of the main body 100. Specifically, looking from the outside to the inside of the main body 100, the axis of the purge port 1111 of the second type of flow equalization structure is inclined downward, so that the inflow end of the purge port 1111 of the second type of flow equalization structure is higher than the outflow end, and the projection S4 of the axis S3 of any purge port 1111 of the second type of flow equalization structure on the horizontal plane is aligned with the normal of the main body 100 at the corresponding position. Here, "alignment" means coincidence or parallelism. Specifically, if the axis S3 of any of the purge ports 1111 of the second type of flow uniform structure is projected onto the horizontal plane where the normal of the main body 100 is located at the corresponding position, the projection S4 of the axis S3 of the purge port 1111 of the second type of flow uniform structure coincides with the corresponding normal S2. However, if the axis S3 of any of the purge ports 1111 of the second type of flow uniform structure is projected onto a horizontal plane that is parallel to the normal of the main body 100 at the corresponding position, the projection S4 of the axis S3 of the purge port 1111 of the second type of flow uniform structure is parallel to the corresponding normal S2.

[0076] like Figure 8 and Figure 9 As shown, the axis S5 of the purge port 1111 of the third type of flow equalization structure is not on the horizontal plane, but is inclined relative to the axis of the main body 100. Specifically, looking from the outside to the inside of the main body 100, the axis S5 of the purge port 1111 of the third type of flow equalization structure is inclined downward, so that the inflow end of the purge port 1111 of the second type of flow equalization structure is higher than the outflow end. Moreover, the projection S6 of the axis S5 of any purge port 1111 of the third type of flow equalization structure on the horizontal plane is inclined relative to the normal S2 of the main body 100.

[0077] The protective gas entering the main cavity 101 from the purge port 1111 of the second type of uniform flow structure blows downwards, which can also help prevent pollutants from rising to a certain extent. Optionally, the acute angle β formed by the axis of the purge port 1111 of the second type of uniform flow structure and its projection on the horizontal plane is not greater than 80°.

[0078] The protective gas entering the main cavity 101 from the purge port 1111 of the third type of uniform flow structure rotates and blows downwards, thus preventing pollutants from rising. Optionally, the acute angle γ formed by the axis of the purge port 1111 of the third type of uniform flow structure and its projection on the horizontal plane is not greater than 80°, and the angle θ formed by the projection of the axis of the purge port 1111 of the third type of uniform flow structure on the horizontal plane and the normal of the main body 100 at the corresponding position is not less than 10° and not greater than 60°.

[0079] Optionally, the lowermost flow equalization structure 111 in the second assembly 110b (i.e., the flow equalization structure 111 in the second assembly 110b that is closest to the first assembly 110a) is configured as the second type of flow equalization structure. It should be understood that for the second type of flow equalization structure in the second assembly 110b, the outflow end of its purge port 1111 is closer to the first assembly 110a than the inflow end.

[0080] Optionally, the flow uniform structure 111 located at the bottom in the second combination 110b is configured as the third type of flow uniform structure.

[0081] Optionally, the flow uniform structure 111 located at the bottom of the first combination 110a (i.e., the flow uniform structure 111 in the first combination 110a that is farthest from the second combination 110b) is set as the third type of flow uniform structure.

[0082] Furthermore, in this embodiment of the invention, a fourth type of flow equalization structure (not shown in the figure) can also be defined. The axis of the purge port of the fourth type of flow equalization structure is inclined relative to the axis of the main body 100. Specifically, along the direction from the inside to the outside of the main body 100, the axis of the purge port of the fourth type of flow equalization structure is inclined upward, so that the inflow end of the purge port is located below the outflow end. In practice, the fourth type of flow equalization structure should be located above the first type of flow equalization structure, the second type of flow equalization structure, and the third type of flow equalization structure. For example, if the first type of flow equalization structure exists, the flow equalization structure 111 located at the uppermost end in the second combination 110b can be set as the fourth type of flow equalization structure.

[0083] Optionally, such as Figure 1 and Figure 2As shown, the inert atmosphere protection device 10 also includes a guide plate 200, which is disposed at the lower end of the main body 100 and surrounds the main body 100. By providing the guide plate 200, on the one hand, the gas discharged from the bottom of the main body 100 can be guided to the outside atmosphere; on the other hand, it can also form a smaller space together with the upper surface of the workpiece, thereby increasing the flow resistance between the lower end of the main body 100 and the workpiece and preventing external contaminants from entering the main cavity 101 from the bottom of the main body 100.

[0084] Optionally, the inert atmosphere protection device 10 may further include an outer cover 300 (e.g., Figure 17 As shown, the outer cover 300 is located above the guide plate 200 and surrounds the outer periphery of the main body 100, forming an annular flow channel between the outer cover 300 and the main body 100. The annular flow channel includes a first flow channel 11 and a second flow channel 12 arranged along the axial direction of the main body 100. The first flow channel 11 is located above the second flow channel 12 and is correspondingly arranged with the second assembly 110a, and the first flow channel 11 also has a first air intake port 13. The second flow channel 12 is located below the first flow channel 11 and is correspondingly arranged with the first assembly 110b, and the second flow channel 12 also includes a second air intake port 14.

[0085] Protective gas introduced into the first flow channel 11 from the first air inlet 13 enters the main cavity 101 through the purge ports 1111 of each of the equalizing structures 111 of the second assembly 110a. Protective gas introduced into the second flow channel 12 from the second air inlet 14 enters the main cavity 101 through the purge ports 1111 of each of the equalizing structures 111 of the first assembly 110b.

[0086] In addition, the specific shape of the main cavity 101 is not particularly limited in the embodiments of the present invention. However, in a specific example, the cross-section of the main cavity 101 is circular, and the inner contour dimension of the main cavity 101 decreases along the direction from the top end to the bottom end, or has other streamlined shapes.

[0087] The following describes the application effect of the inert atmosphere protection device 10 provided by the present invention in the laser annealing equipment through several embodiments.

[0088] <Example 1>

[0089] The structure of the inert atmosphere protection device 10 provided in this embodiment is as follows: Figure 1 As shown, it includes two flow uniform structures 111. Among them, the upper flow uniform structure 111 is configured as the first type of flow uniform structure.

[0090] An application simulation was performed on the inert atmosphere protection device 10 provided in this embodiment. Figure 11 This diagram shows a simulation result of contamination in a longitudinal section within the main cavity 101. Figure 12 A schematic diagram showing the contamination simulation results of a cross-section of the main cavity 101 is provided. Figure 11 and Figure 12 As can be seen, after applying the inert atmosphere protection device 10 provided in this embodiment, the contaminant concentration on the bottom surface of the exposure lens group 20 is as low as 10. -5 It should be noted that the unit of pollutant concentration mentioned in this article is 1.

[0091] <Example 2>

[0092] The structure of the inert atmosphere protection device 10 provided in this embodiment is as follows: Figure 2 As shown, it includes four flow equalization structures 111. The two flow equalization structures 111 located at the upper end are divided into the second combination 110b, and the two flow equalization structures 111 located at the lower end are divided into the first combination 110a.

[0093] In this embodiment, both flow equalization structures 111 of the first combination 110a are configured as the first type of flow equalization structure, and the axes of the purge ports 1111 of the two first type of flow equalization structures are inclined in the same direction relative to the normal of the main body 100; in the second combination 110b, the flow equalization structure 111 located on the upper side is configured as the first type of flow equalization structure, and the flow equalization structure 111 located on the lower side is configured as the second type of flow equalization structure.

[0094] An application simulation was performed on the inert atmosphere protection device 10 provided in this embodiment. Figure 13 This diagram illustrates the simulation results of the gas flow field within the portion of the main cavity 101 located below the second assembly 110b. Figure 14 This diagram shows a simulation result of contamination in a longitudinal section within the main cavity 101. Figure 15 and Figure 16 The diagrams show the pollution simulation results of different cross sections of the main cavity 101.

[0095] Depend on Figure 13 As can be seen, the protective gas entering the main cavity 101 from the purge port 1111 of the first assembly 110a forms a horizontal vortex, which entrains the contaminants, causing them to rotate together in the horizontal plane. Figures 14 to 16As can be seen, the contaminants remain inside the main cavity 101 and do not rise to the exposure lens group 10, nor do they mix or entrain with the gas in the external environment. In this embodiment, the oxygen concentration in the exposure area of ​​the workpiece stage 30 is less than 100 ppm, and the contaminant concentration on the bottom surface of the lens of the exposure lens group 20 is as low as 10 ppm. -5 .

[0096] <Example 3>

[0097] The difference between this embodiment and embodiment two is that the flow uniform structure 111 located on the lower side in the first combination 110a is set as the third type of flow uniform structure.

[0098] Figure 17 and Figure 18 This diagram illustrates the pollution simulation results of the inert atmosphere protection device 10 provided in this embodiment. Figure 17 and Figure 18 As can be seen, compared with Embodiment 2, the inert atmosphere protection device 10 provided in this embodiment can better prevent pollutants from rising.

[0099] <Example 4>

[0100] The difference between this embodiment and embodiment three is that the flow uniform structure 111 located on the lower side in the second combination 110b is set as the third type of flow uniform structure.

[0101] Figure 19 and Figure 20 This diagram illustrates the pollution simulation results of the inert atmosphere protection device 10 provided in this embodiment. Figure 18 As can be seen, the application of the inert atmosphere protection device 10 provided in this embodiment reduces the contaminant concentration on the bottom surface of the exposure lens group 20 to 10. -6 .

[0102] Comparative Example 1

[0103] The difference between the inert atmosphere protection device provided in this comparative example and Embodiment 2 is that the first type of uniform flow structure in the inert atmosphere protection device provided in Embodiment 2 is replaced with a fifth type of uniform flow structure. The axis of the purge port of the fifth type of uniform flow structure is located on a horizontal plane and extends along the normal of the main body at the corresponding position.

[0104] Figure 21 This diagram shows the simulation results of the gas flow field inside the main cavity of the inert atmosphere protection device provided in this comparative example. Figure 22 and Figure 23 This diagram illustrates the pollution simulation structure of the inert atmosphere protection device provided in this comparative example. Figure 21As can be seen, in this embodiment, airflow turbulence results from collisions within the main cavity. Figure 22 and Figure 23 As can be seen, after applying the inert atmosphere protection device provided by this comparative example, the contaminant concentration on the bottom surface of the exposure lens group is as high as 0.0059.

[0105] Furthermore, this embodiment of the invention also provides a laser annealing apparatus, including a workpiece stage 30, an exposure lens group 20, and the aforementioned inert atmosphere protection device 10. The exposure lens group 20, the inert atmosphere protection device 10, and the workpiece stage 30 are arranged sequentially, for example, in a top-to-bottom direction.

[0106] The working principle of the laser annealing equipment is explained by taking the inert atmosphere protection device 10, which includes the outer cover 300, such that the outer periphery of the main body 100 forms the annular flow channel, as an example. The details are as follows:

[0107] First, high-purity protective gas is introduced into the first flow channel 11 and the second flow channel 12 from the first air inlet 13 and the second air inlet 14, respectively, filling the flow channels and homogenizing them; this stage is the first homogenization. Next, the airflow flows from the purge ports 1111 of each of the homogenizing structures into the main cavity 101 of the main body 100. This continues until the oxygen concentration on the upper surface of the workpiece stage 30 decreases to the required level, and a protective atmosphere meeting the requirements of the laser annealing process is formed in the exposure area of ​​the workpiece stage 30.

[0108] Then, the workpiece is transferred to the workpiece stage 30.

[0109] Then, a laser annealing process is performed.

[0110] It should be understood that the supply of protective gas should be maintained continuously during the transfer of the workpiece to the workpiece stage 30 and the execution of the laser annealing process to prevent the protective atmosphere from being destroyed due to the movement of the workpiece stage 30 and to prevent contaminants generated during the exposure process from rising to the bottom surface of the lens group 20.

[0111] While the present invention has been disclosed above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims and their equivalents, the present invention also intends to include such modifications and variations.

Claims

1. An inert atmosphere protection device, characterized in that, Including the main body; The main body has a main cavity extending through it along its own axis; the main body is also provided with a plurality of flow equalization structures arranged at intervals along its own axis; each flow equalization structure includes a plurality of purge ports arranged sequentially along the circumference of the main cavity and communicating with the main cavity. At least one of the flow equalization structures is a first type of flow equalization structure; the axis of the purge port of the first type of flow equalization structure is located on a plane perpendicular to the axial direction of the main body, and the axes of all the purge ports of the same first type of flow equalization structure are inclined relative to the normal of the main body in the same direction.

2. The inert atmosphere protection device according to claim 1, characterized in that, The angle formed by the axis of any of the purge ports of the first type of uniform flow structure and the normal of the main body at the corresponding position is not less than 10° and not greater than 60°.

3. The inert atmosphere protection device according to claim 1, characterized in that, The plurality of flow-equalizing structures are divided into a first group and a second group, wherein the first group and the second group are spaced apart in the axial direction of the main body; The first combination and the second combination each include at least two of the aforementioned flow-uniforming structures.

4. The inert atmosphere protection device according to claim 3, characterized in that, The flow uniform structure that is closest to the second combination in the first combination is the first type of flow uniform structure.

5. The inert atmosphere protection device according to claim 3, characterized in that, All of the flow uniform structures in the first combination are of the first type of flow uniform structure.

6. The inert atmosphere protection device according to claim 4 or 5, characterized in that, The flow uniform structure closest to the first combination in the second combination is a second type of flow uniform structure; The axis of the purge port of the second type of uniform flow structure is inclined relative to the axis of the main body, and the projection of the axis of any purge port of the second type of uniform flow structure onto a plane perpendicular to the axis of the main body coincides with or is parallel to the normal of the main body at the corresponding position; the outflow end of the purge port of the second type of uniform flow structure in the second combination is closer to the first combination than the inflow end.

7. The inert atmosphere protection device according to claim 6, characterized in that, The acute angle formed by the axis of the purge port of the second type of uniform flow structure and its projection on a plane perpendicular to the axis of the main body is no greater than 80°.

8. The inert atmosphere protection device according to claim 3 or 4, characterized in that, The flow uniform structure in the second combination that is furthest from the first combination is the first type of flow uniform structure.

9. The inert atmosphere protection device according to claim 8, characterized in that, In the second combination, the flow equalization structure closest to the first combination is a second type of flow equalization structure; the axis of the purge port of the second type of flow equalization structure is inclined relative to the axis of the main body, and the projection of the axis of any purge port of the second type of flow equalization structure onto a plane perpendicular to the axis of the main body coincides with or is parallel to the normal of the main body at the corresponding position; the outflow end of the purge port of the second type of flow equalization structure in the second combination is closer to the first combination than the inflow end; The flow equalization structure furthest from the second combination in the first combination is a third type of flow equalization structure; the axis of the purge port of the third type of flow equalization structure is inclined relative to the axis of the main body, and the inflow end of the purge port of the third type of flow equalization structure is closer to the second combination than the outflow end, and the projection of the axis of all the purge ports of the same third type of flow equalization structure onto a plane perpendicular to the axis of the main body is inclined in the same direction relative to the normal of the main body.

10. The inert atmosphere protection device according to claim 8, characterized in that, The flow uniform structure closest to the first combination in the second combination and the flow uniform structure farthest from the second combination in the first combination are both third-type flow uniform structures; The axis of the purge port of the third type of flow equalization structure is inclined relative to the axis of the main body. The projection of the axis of all the purge ports of the same third type of flow equalization structure onto a plane perpendicular to the axis of the main body is inclined in the same direction relative to the normal of the main body. The outflow end of the purge port of the third type of flow equalization structure in the second combination is closer to the first combination than the inflow end, and the inflow end of the purge port of the third type of flow equalization structure in the first combination is closer to the second combination than the outflow end.

11. The inert atmosphere protection device according to claim 9, characterized in that, The acute angle formed by the axis of the purge port of the second type of uniform flow structure and its projection on a plane perpendicular to the axis of the main body is no greater than 80°.

12. The inert atmosphere protection device according to claim 9 or 10, characterized in that, The acute angle formed by the axis of the purge port of the third type of uniform flow structure and its projection on a plane perpendicular to the axial direction of the main body is not greater than 80°; and the angle formed by the projection of the axis of any purge port of the third type of uniform flow structure on a plane perpendicular to the axial direction of the main body and the normal of the main body at the corresponding position is not less than 10° and not greater than 60°.

13. A laser annealing apparatus, characterized in that, It includes a workpiece stage, an exposure lens assembly, and an inert atmosphere protection device as described in any one of claims 1-12; the exposure lens assembly, the inert atmosphere protection device, and the workpiece stage are arranged in sequence.

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