Electronic device including speaker unit

Abstract

An electronic device according to an embodiment of the present disclosure may include: a housing located at a front portion of the electronic device and including a first portion made of a non-metallic material; a first support member disposed in the housing and including a first opening at least partially facing the first portion; a speaker unit disposed in the housing and facing the first opening of the first support member; a sound hole formed in the housing to release sound output from the speaker unit; a first sealing member disposed between the first support member and the speaker unit and surrounding a sound outlet of the speaker unit and a first opening of the first support member; a first sound conduit formed to be surrounded by the first sealing member and connecting the first opening and the speaker unit; and a second sound conduit disposed between the first support member and the first portion and connecting the first opening and the sound hole. Various other embodiments are possible.

Description

Technical Field

[0001] The various embodiments disclosed in this document relate to electronic devices including speaker units. Background Technology

[0002] The audio output module used for sound reproduction can be included in electronic devices. As electronic devices reproduce more and more content, users are paying increasing attention to sound performance. That is, as electronic devices are used to output more content, users are becoming more concerned about the sound performance of these devices.

[0003] Considering design factors, a sound hole can be designed at the center of the electronic device to radiate the sound output from the speaker module to the outside of the electronic device.

[0004] The above information may be provided as relevant technology for the purpose of aiding understanding of this disclosure. No statement or determination is made as to whether any of the foregoing content can be applied as prior art in connection with this disclosure. Summary of the Invention

[0005] Technical issues

[0006] Various types of loudspeakers for sound output can be incorporated into an electronic device. The electronic device may include a sound channel for radiating sound output from the front surface of the loudspeaker to a sound hole communicating with the outside of the electronic device. Furthermore, the electronic device may include a resonant space in which sound output from the loudspeaker can resonate by sealing the rear surface of the loudspeaker. The aforementioned sound channel, resonant space, and loudspeaker can be modularized and incorporated into the electronic device. For example, a loudspeaker module, in which a device object formed by the loudspeaker, sound channel, and resonant space is assembled as a set, can be incorporated into the electronic device. The sound channel and resonant space can be formed by a step between the loudspeaker and the device object.

[0007] The required sound channel and resonant space conditions can vary depending on the type of electronic device. That is, different types of electronic devices may have different requirements for sound channel and resonant space conditions. In this case, the production cost of the electronic device will increase when a new speaker module is manufactured based on its type.

[0008] Furthermore, with the recent preference for thin electronic devices, it has become necessary to reduce the size, number, or thickness of electronic components housed within these devices. Therefore, it is necessary to incorporate only speaker modules within the electronic device and to create a resonant space and sound channel using the necessary components housed within the device.

[0009] According to embodiments of this disclosure, an electronic device may contain only a speaker unit that performs the sound output function, rather than a speaker module type. That is, the electronic device may contain only a speaker component that outputs sound, rather than an entire speaker module. Other components within the electronic device may be arranged or configured to perform one or more functions typically performed by other components of a conventional or typical speaker module. Sound output from the speaker unit can be transmitted to a sound hole via a sound channel formed by a device object and housing disposed adjacent to the speaker unit. Furthermore, the speaker unit may be located in a sealed resonant space formed by a printed circuit board and a bracket (e.g., a shield).

[0010] The technical problems to be solved in this document are not limited to those mentioned above. Other technical problems not described will be clearly understood by those skilled in the art from the following description.

[0011] Solution to the problem

[0012] According to embodiments of this disclosure, an electronic device may include: a housing including a first portion located on the front surface of the electronic device and made of a non-metallic material; a first support member disposed in the housing and including a first opening having at least a portion facing the first portion; a speaker unit disposed in the housing and configured to face the first opening of the first support member; a sound hole formed in the housing to release sound output by the speaker unit; a first sealing member disposed between the first support member and the speaker unit and configured to surround the sound release port of the speaker unit and the first opening of the first support member; a first sound channel formed by being surrounded by the first sealing member and configured to connect the first opening and the speaker unit; and a second sound channel located between the first support member and the first portion and configured to connect the first opening and the sound hole.

[0013] According to embodiments of this disclosure, a speaker structure disposed in the housing of an electronic device may include: a first support member including a first opening facing a first portion of the housing located on the front surface of the electronic device and made of a non-metallic material; a speaker unit configured to face the first opening of the first support member; a first sealing member disposed between the first support member and the speaker unit and configured to surround the sound release port of the speaker unit and the first opening of the first support member; a first sound channel formed by being surrounded by the first sealing member and configured to connect the first opening and the speaker unit; and a second sound channel located between the first support member and the first portion and configured to connect the first opening and a sound hole formed in the housing.

[0014] Beneficial effects of the invention

[0015] According to embodiments of this disclosure, the speaker unit may be located in the injection region of the housing. When the speaker unit is located in the injection region of the housing, a first support member 450 and separate support members are disposed between the injection region and the speaker unit, thereby ensuring that sound output from the speaker unit is transmitted to a sound channel communicating with a sound hole outside the electronic device. For example, the sound channel may be a space formed by the support members being spaced apart from each other at regular intervals relative to the injection region of the housing.

[0016] Furthermore, in this embodiment, the speaker unit can be disposed within a sealed resonant space via a printed circuit board and a bracket (e.g., a shield). The speaker unit can improve sound flatness and sound quality in the bass range by ensuring the resonant space. Moreover, since the resonant space is ensured by components disposed within the electronic device (such as printed circuit boards and brackets), a separate device object (e.g., a speaker housing) is not required to form the resonant space; therefore, production costs of the electronic device can be reduced.

[0017] Furthermore, in the embodiments, the electronic device can ensure stereo performance and a predetermined level of sound performance by providing speaker units at the upper and lower ends, respectively.

[0018] The effects that can be obtained from this disclosure are not limited to those described above, and other effects not described will be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0019] Regarding the description of the accompanying drawings, the same or similar reference numerals may be used for the same or similar parts.

[0020] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments of the present disclosure.

[0021] Figure 2a This is a perspective view showing the front surface of an electronic device according to an embodiment of the present disclosure.

[0022] Figure 2b This illustrates an embodiment according to the present disclosure. Figure 2a A perspective view of the rear surface of the electronic device.

[0023] Figure 3 This illustrates an embodiment according to the present disclosure. Figure 2a An exploded perspective view of the electronic device.

[0024] Figure 4 This is a diagram illustrating a portion of an electronic device according to an embodiment disclosed in this document.

[0025] Figure 5aThis is a diagram showing the housing of an electronic device as seen from the front surface of the electronic device according to an embodiment disclosed in this document.

[0026] Figure 5b This is a diagram showing the housing of the electronic device as seen from the rear surface of the electronic device according to an embodiment disclosed in this document.

[0027] Figure 6 It is according to the embodiments of this disclosure along Figure 2a The cross-sectional view taken from line AA.

[0028] Figure 7a This is a diagram illustrating a mounting groove, as seen from the rear surface of an electronic device, in which a first portion, a second portion, and a first support member of a housing are disposed, according to an embodiment of the present disclosure.

[0029] Figure 7b This is a top plan view showing a first support member according to an embodiment of the present disclosure.

[0030] Figure 7c It shows the setting Figure 7a A diagram of the first support member in the mounting slot.

[0031] Figure 8a This is a top plan view showing a second support member according to an embodiment of the present disclosure.

[0032] Figure 8b It shows the setting Figure 7c A diagram of the second support member in a portion of the first support member shown.

[0033] Figure 9a This is a top plan view showing a second sealing member according to an embodiment of the present disclosure.

[0034] Figure 9b It shows the setting Figure 8b A diagram of the second sealing member in a portion of the second support member.

[0035] Figure 9c It shows that it is arranged in the housing to face Figure 9b A diagram of a speaker unit with a first opening in the first support member. Detailed Implementation

[0036] In the following description, various embodiments of this document are described with reference to the accompanying drawings. It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various modifications, equivalents, or substitutions of the corresponding embodiments.

[0037] Regarding the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the singular form of a noun corresponding to an item may include one or more things, unless the relevant context clearly indicates otherwise.

[0038] As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” can include any one or all possible combinations of the items listed together in the corresponding phrase of these phrases. As used herein, terms such as “first” and “second” or “first” and “second” can be used simply to distinguish corresponding parts from one other part and do not limit the parts in other respects (e.g., importance or order). It will be understood that, whether or not the terms “operational location” or “communication location” are used, if an element (e.g., a first element) is referred to as being “connected” to, “linked to”, “connected to”, or “attached to” another element (e.g., a second element), it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0039] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0040] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0041] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0042] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0043] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0044] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0045] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0046] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0047] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0048] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0049] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0050] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0052] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0053] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0054] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0055] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0056] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0057] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0058] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0059] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0060] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0061] Figure 2a This is a front perspective view of an electronic device according to various embodiments of the present disclosure. Figure 2b Various embodiments according to this disclosure Figure 2a Rear perspective view of the electronic device.

[0062] The electronic device 200 described below may include the above reference. Figure 1 At least one of the components of the described electronic device 101.

[0063] Reference Figure 2a and Figure 2bThe electronic device 200 according to an embodiment may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. According to an embodiment (not shown), the housing 210 may refer to a structure formed... Figure 2a The structure comprises a portion of a first surface 210A, a second surface 210B, and a side surface 210C. According to an embodiment, the first surface 210A may be formed from a front panel 202 (e.g., a glass or polymer panel including various coatings), wherein at least a portion of the front panel is substantially transparent. The second surface 210B may be formed from a substantially opaque rear panel 211. The rear panel 211 may be formed from, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these. The side surface 210C may be formed from a side frame structure (or “side member”) 218 ​​that is coupled to the front panel 202 and the rear panel 211 and comprises metal and / or polymer. In one embodiment, the rear panel 211 and the side frame structure 218 may be integrally formed and comprise the same material (e.g., a metallic material such as aluminum) (i.e., made of the same material (e.g., a metallic material such as aluminum), contain the same material (e.g., a metallic material such as aluminum), etc.).

[0064] In the illustrated embodiment, the front panel 202 may include a first region 210D at the opposite ends of its longer edges, which curves and extends seamlessly from the first surface 210A toward the rear panel. (See illustrated embodiment) Figure 2b In the embodiment, the rear panel 211 may include a second region 210E at opposite ends of its longer edges, curving seamlessly from the second surface 210B toward the front panel 202. In one embodiment, the front panel 202 or the rear panel 211 may include only one of the first region 210D and the second region 210E. In another embodiment, the front panel 202 may not include the first and second regions, but may only include a flat surface disposed parallel to the second surface 210B. In the above embodiments, when the electronic device is viewed from the side, the side frame structure 218 may have a first thickness (or width) on the side excluding the first region 210D or the second region 210E, and may have a second thickness thinner than the first thickness on the side including the first region 210D or the second region 210E.

[0065] According to embodiments, electronic device 200 may include at least one or more of a display 201, an input device 203, sound output devices 207 and 214, sensor modules 204 and 219, camera modules 205 and 212, a key input device 217, an indicator (not shown), or a connector 208. In some embodiments, at least one element (e.g., key input device 217 or indicator) may be omitted from electronic device 200, or another element may be added to electronic device 200.

[0066] Display 201 may be exposed, for example, through a substantial portion of front panel 202. In one embodiment, at least a portion of display 201 may be exposed through front panel 202 forming a first region 210D of first surface 210A and side surface 210C. Display 201 may be coupled to touch sensing circuitry, a pressure sensor capable of measuring the intensity (pressure) of touch, and / or a digitizer capable of detecting a magnetic field stylus, or disposed adjacent to touch sensing circuitry, a pressure sensor capable of measuring the intensity (pressure) of touch, and / or a digitizer capable of detecting a magnetic field stylus. In one embodiment, at least some of sensor modules 204 and 219 and / or at least some of key input devices 217 may be disposed on the first region 210D and / or the second region 210E.

[0067] Input device 203 may include microphone 203. In one embodiment, input device 203 may include a plurality of microphones 203 arranged to detect the direction of sound. Sound output devices 207 and 214 may include speakers 207 and 214. Speakers 207 and 214 may include an external speaker 207 and a call receiver 214. In one embodiment, microphone 203, speakers 207 and 214, and connector 208 may be at least partially disposed within the internal space of electronic device 200 and exposed to the external environment through at least one aperture formed in housing 210. In one embodiment, the aperture formed in housing 210 may be shared for microphone 203 and speakers 207 and 214. In one embodiment, sound output devices 207 and 214 may include speakers (e.g., piezoelectric speakers) that operate isolated from the aperture formed in housing 210.

[0068] Sensor modules 204 and 219 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 200. For example, sensor modules 204 and 219 may include: a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 210A of the housing 210; and / or a third sensor module 219 (e.g., an HRM (heart rate monitor) sensor) disposed on a second surface 210B of the housing 210. The fingerprint sensor may be disposed on the first surface 210A of the housing 210 (e.g., a home button), on a portion of the second surface 210B, and / or below the display 201. The electronic device 200 may further include sensor modules not shown, such as at least one of a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, proximity sensor, or illuminance sensor.

[0069] Camera modules 205 and 212 may include a first camera module 205 disposed on a first surface 210A of the electronic device 200, a second camera module 212 disposed on a second surface 210B, and / or a flash 213. Camera modules 205 and 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and an image sensor may be arranged on one surface of the electronic device 200.

[0070] Key input device 217 may be arranged in the side surface 210C of housing 210. According to an embodiment, electronic device 200 may not include some or all of the aforementioned key input device 217, and the un-included key input device 217 may be implemented on display 201 in different forms such as soft keys. According to an embodiment, key input device 217 may be implemented using a pressure sensor included in display 201.

[0071] An indicator may be disposed, for example, on a first surface 210A of housing 210. The indicator may provide status information, for example, of electronic device 200, in the form of light (e.g., a light-emitting element). According to embodiments, the light-emitting element may provide a light source for operational interaction with, for example, camera module 205. The indicator may include, for example, LEDs (light-emitting diodes), IR (infrared) LEDs, and / or xenon lamps.

[0072] The connector hole 208 may include: a first connector hole 208 capable of receiving a connector (e.g., a Universal Serial Bus (USB) connector) for transmitting power and / or data to and from an external electronic device; and / or a second connector hole (e.g., a headphone jack) (not shown) capable of receiving a connector for transmitting audio signals to and from an external electronic device.

[0073] Some of camera modules 205 and 212, some of sensor modules 204 and 219, or indicators may be configured to be exposed through display 201. For example, camera module 205, sensor module 204, or indicators may be arranged within the internal space of electronic device 200 to contact the external environment through perforations in display 201 to openings or transmissive areas of front panel 202. According to an embodiment, the areas of display 201 and camera module 205 facing each other may be formed as transmissive areas with a preset transmittance, as part of the content display area. According to an embodiment, the transmissive area may be formed with a transmittance in the range of about 5% to about 20%. This transmissive area may include an area overlapping with the effective area (e.g., viewing angle area) of camera module 205 through which light passes for image generation using an image formed by an image sensor. For example, the transmissive area of ​​display 201 may include an area with a lower pixel density than the surrounding area. For example, the transmissive area may replace an opening. For example, camera module 205 may include an under-display camera (UDC). According to an embodiment, a sensor module 204 can be disposed within the internal space of the electronic device to perform its function without being visually exposed through the front panel 202. For example, in this case, the area of ​​the display 201 facing the sensor module may not require a perforated opening.

[0074] According to embodiments, the electronic device 200 has a strip-shaped or plate-shaped appearance, but this disclosure is not limited thereto. For example, the illustrated electronic device 200 may be a portion of a foldable electronic device, a sliding electronic device, a stretchable electronic device, and / or a rollable electronic device. "Foldable electronic device," "sliding electronic device," "stretchable electronic device," and / or "rollable electronic device" can mean an electronic device in which at least a portion of the display is folded, rolled, or curled, in which the area of ​​the display is at least partially expanded, and / or in which the display can be housed in a housing (e.g., Figure 2a and Figure 2b Inside the housing 210, because the display (e.g., Figure 3The display (330) can be bent. Foldable, sliding, stretchable and / or rollable electronic devices can expand and utilize the screen display area as needed by unfolding the display or exposing a larger area of ​​the display to the outside.

[0075] Figure 3 Various embodiments according to this disclosure Figure 2a Exploded perspective view of electronic device 200.

[0076] Figure 3 The electronic device 300 can be at least partially similar to Figure 2a and Figure 2b The electronic device 200, or other embodiments that may include the electronic device.

[0077] Reference Figure 3 Electronic device 300 (e.g., Figure 2a or Figure 2b The electronic device 200 may include a side member 310 (e.g., a side frame structure), a first support member 311 (e.g., a bracket or support structure), and a front panel 320 (e.g., a front cover). Figure 2a Front panel 202), display 330 (e.g., Figure 2a The display 201), board 340 (e.g., printed circuit board (PCB), flexible PCB (FPCB) or rigid-flexible PCB (RFPCB)), battery 350, second support member 360 (e.g., rear cover), antenna 370 and rear plate 380 (e.g., rear cover) (e.g., Figure 2b (The rear plate 211 in the middle). In one embodiment, at least one component (e.g., the first support member 311 or the second support member 360) may be omitted from the electronic device 300, or other components may be additionally included in the electronic device 300. At least one component of the electronic device 300 may be with Figure 2a or Figure 2b At least one component of the electronic device 200 is the same as or similar to that of the other component, and repeated descriptions will be omitted below.

[0078] The first support member 311 may be disposed inside the electronic device 300 and may be connected to the side member 310, or may be integrally formed with the side member 310. The first support member 311 may be made of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The first support member 311 may have one surface coupled to the display 330 and another surface coupled to the board 340. Processor (e.g., Figure 1 The processor 120 in the memory (e.g., Figure 1 The memory 130 in the memory) and / or interface (e.g., Figure 1Interface 177 can be mounted on board 340. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, and a communication processor.

[0079] The memory may include, for example, volatile memory or non-volatile memory.

[0080] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD (Secure Digital) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect an electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC (Multimedia Card) connector, or an audio connector.

[0081] Battery 350 is a means for supplying power to at least one component of electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of battery 350 may be disposed substantially coplanar with plate 340. Battery 350 may be integrally disposed within electronic device 300. According to embodiments, battery 350 may be attached to and detachably disposed with electronic device 300 (i.e., fixed or removable).

[0082] Antenna 370 may be disposed between rear panel 380 and battery 350. Antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. Antenna 370 may, for example, perform short-range communication with external devices or wirelessly transmit and receive power required for charging. According to an embodiment, the antenna structure may be formed by a portion or combination of side frame structure 310 and / or a first support member 311.

[0083] Figure 4 This is a diagram illustrating a portion of an electronic device according to an embodiment disclosed in this document. Figure 5a This is a diagram showing the housing of an electronic device as seen from the front surface of the electronic device according to an embodiment disclosed in this document. Figure 5b This is a diagram showing the housing of the electronic device as seen from the rear surface of the electronic device according to an embodiment disclosed in this document. Figure 6 It is according to the embodiments of this disclosure along Figure 2a The cross-sectional view taken from line AA. Figure 7a This is a diagram illustrating a mounting groove, as seen from the rear surface of an electronic device, in which a first portion, a second portion, and a first support member of a housing are disposed, according to an embodiment of the present disclosure. Figure 7b This is a top plan view showing a first support member according to an embodiment of the present disclosure. Figure 7c It shows the setting Figure 7aA diagram of the first support member in the mounting slot. Figure 8a This is a top plan view showing a second support member according to an embodiment of the present disclosure. Figure 8b It shows the setting Figure 7c A diagram of the second support member in a portion of the first support member shown. Figure 9a This is a top plan view showing a second sealing member according to an embodiment of the present disclosure. Figure 9b It shows the setting Figure 8b A diagram of the second sealing member in a portion of the second support member. Figure 9c It shows that it is arranged in the housing to face Figure 9b A diagram of a speaker unit with a first opening in the first support member.

[0084] In the embodiments disclosed in this document, Figure 4 The electronic device 400 shown may be Figure 1 The electronic device 101 shown Figure 2a and Figure 2b The electronic device 200 and / or shown Figure 3 An example of electronic device 300 is shown. The electronic device 400 described below is based on… Figure 2a , Figure 2b and Figure 3 The electronic device 400 is described as a strip-shaped electronic device, but in some embodiments, it may be a part of a foldable, sliding, stretchable, and / or rollable electronic device. Furthermore, the same component designations are used with respect to… Figure 1 , Figure 2a , Figure 2b and Figure 3 All parts that are the same as or similar to those described herein, except where otherwise indicated.

[0085] According to an embodiment, the electronic device can support various device objects and electrical objects constituting the electronic device 400, and includes a housing 410 (e.g., Figure 2a The housing 210), wherein at least a portion of the housing 410 constitutes the appearance of the electronic device 400 (e.g., housing 210). Figure 2a The side frame structure 218 (i.e., forms the appearance of the electronic device 400) Figure 2a (part of the side frame structure 218). Here, "electric object" can be understood as a general term for a component that transmits or receives electrical signals. The housing 410 may consist of a single component or may be composed of multiple components joined together. For example, the housing 410 may include a device object made of a metallic material (e.g., second part 412) and a non-metallic device object (e.g., first part 411) joined to the device object made of a metallic material by an injection molding process.

[0086] In embodiments, the housing 410 can be made of various materials. For example, the housing 410 may include a first portion 411 made of a non-metallic material and / or a second portion 412 made of a metallic material. In embodiments, the first portion 411 is made of a non-metallic material and may refer to the concept of a device object constituting the housing 410. The second portion 412 is made of a metallic material and may refer to the concept of a device object constituting the housing 410. In embodiments, the first portion 411 can be attached to the second portion 412 made of a metallic material via an injection molding process. In embodiments, the metallic material may include alloys of aluminum, stainless steel (STS, SUS), iron, magnesium, and / or titanium. The non-metallic material may include synthetic resins, ceramics, and / or engineering plastics.

[0087] In the embodiments, reference is made to Figure 4 and Figure 5a The camera module 403 can be configured such that the camera module 403 (e.g., Figure 1 The lens unit 4031 of the camera module 180 is perpendicular to the width direction of the housing 410 (e.g., Figure 5a Align the center of the axis (in the X-axis direction). (Refer to...) Figure 4 Display 401 (e.g., Figure 1 Display module 160 Figure 2a The monitor 201 and Figure 3 The display (330) may include a camera aperture 403 facing the lens unit 4031 of the camera module 403. The camera aperture 403 may be a portion through which external light passes through the camera module 403 and enters the lens unit 4031 of the camera module 403. At least a portion of the portion corresponding to the camera aperture 403 may be transparent.

[0088] According to the embodiments, such as Figure 5a and Figure 5b As shown, a speaker unit 430 (e.g., Figure 1 Audio output module 155 and / or Figure 2a (Sound output device 214). In the embodiment, refer to Figure 5a and Figure 5b The speaker unit 430 can be disposed at the upper end of the housing 410 (e.g., based on...). Figure 5a (The portion located in the +Y direction). In an embodiment, speaker unit 430 may mean a component that outputs sound according to commands from processor 120 when an application is running. In an embodiment, speaker unit 430 may include a speaker that outputs sound when an application is running and / or a receiver that outputs a call sound. In an embodiment, speaker unit 430 may output receiver sound as a call sound when a call is made and output speaker sound when operating applications such as video or games.

[0089] In an embodiment, another speaker unit (e.g., Figure 2a The sound output device 207 can be disposed at the lower end of the housing 410 (e.g., based on...). Figure 2a (The portion located in the -Y direction). The electronic device 400 of this disclosure can provide synesthetic sound to the user by ensuring stereo performance through speaker units 430 respectively disposed at the upper and lower ends.

[0090] Reference Figure 5b In the various embodiments disclosed in this document, the speaker unit 430 of the electronic device 400 may be positioned relative to the camera module 403 in a first direction (e.g., Figure 5b and Figure 6 (in the -X direction of A) is set. When the lens unit 4031 of the camera module 403 is set to be aligned with the center in the width direction of the housing 410, the speaker unit 430 can be set off-center (i.e., offset) relative to the center in the width direction of the housing 410.

[0091] In the embodiments, reference is made to Figure 4 and Figure 6 The electronic device 400 may include a sound hole 420 for connecting its external and internal spaces (e.g., Figure 2a The sound hole 420 may include a slit-shaped slot located between the housing 410 and the display 401. For example, the sound hole 420 may be a side wall portion 471 of the side member 310 of the display 401 and the housing 410 or the rear housing 470 (e.g., Figure 3 The slit-shaped hole 420 is formed between the second support member 360. In an embodiment, the slit-shaped sound hole 420 may be formed in a predetermined direction (e.g., Figure 4 Extending along the X-axis direction. For example, the plurality of holes constituting the sound hole 420 may be arranged in a direction parallel to the width direction of the electronic device 400. In an embodiment, at least a portion of the housing 410 and the display 401 may be concave to form the slit-shaped sound hole 420. In some cases, the slit-shaped sound hole 420 may be provided by a step formed between the housing 410 and the display 401. In an embodiment, the sound hole 420 may be formed in a first portion 411 of the housing 410 and facing the front surface of the electronic device 400 (e.g., facing the X-axis direction of the electronic device 400). Figure 6 (The surface in the +Z direction). In an embodiment, the sound hole 420 may be formed in the display 401. For example, the sound hole 420 may be formed at the top of the display 401 so that sound output from the speaker unit 430 can be released to the outside of the electronic device 400.

[0092] In the embodiment, the sound hole 420 is in the width direction (e.g., Figure 4 The center of the sound hole 420 (in the X-axis direction) can be positioned to align with the camera hole 403. In other words, the sound hole 420 can be formed symmetrically with respect to the camera hole 403. Because the camera hole 403 can be aligned with the center of the housing 410, the sound hole 420, which is aligned with the camera hole 403, can also be aligned with the center of the housing 410.

[0093] In this embodiment, to prevent foreign objects from entering through the sound hole 420, a foreign object prevention component (not shown) including a mesh can be provided in the sound hole 420. The foreign object prevention component can be provided at the entrance portion of the sound hole 420 or inside the sound hole 420.

[0094] According to the embodiments disclosed in this document, sound radiated from speaker unit 430 can be released to the outside of electronic device 400 through sound spaces (e.g., first sound channel P1, second sound channel P2, and rear sound space P3), which are provided within housing 410 and / or device objects disposed within housing 410 (e.g., first support member 450, second support member 460, first sealing member 510, second sealing member 520, and printed circuit board 440 (e.g., ...). Figure 3 The substrate 340 and / or support 530 are formed. Here, "sound channel" or "sound space" can mean a pathway for the transmission of sound (sound waves, sound). For example, a sound channel or sound space can mean a physical space (area, region, volume, or gap). A sound channel or sound space may include a space filled with a medium capable of transmitting sound waves (e.g., air). In the following, sound transmission through a sound channel or sound space can mean sound transmission through a specific space.

[0095] In the following description, the sound space connected to the speaker unit 430 will be described by dividing the sound space connected to the speaker unit 430 into a front sound space (e.g., a first sound channel P1, a second sound channel P2) and a rear sound space P3. In an embodiment, the front sound space may be located on the front surface of the speaker unit 430 (e.g., based on...). Figure 6 (in the +Z direction), and can be a channel connecting the speaker unit 430 and the sound hole 420 to transmit sound output from the speaker unit 430 to the sound hole 420. In an embodiment, the rear sound space P3 may be partially located on the rear surface of the speaker unit 430 (e.g., based on the +Z direction). Figure 6 (in the -Z direction), and is the space that causes resonance of the sound (e.g., bass sound) output by the speaker unit 430.

[0096] According to the embodiments, such as Figure 6As shown, sound output from speaker unit 430 can be released to sound hole 420 through front sound space. In an embodiment, the front sound space connecting speaker unit 430 and sound hole 420 can be a space formed by housing 410, first support member 450 and first sealing member 510. In an embodiment, referring to... Figure 6 , Figure 7a , Figure 7b and Figure 7c The front sound space can be a space formed by stacking the speaker unit 430, the first sealing member 510, the first support member 450, and the first portion 411 of the housing 410 in that order. In an embodiment, the front sound space may include a first sound channel P1 and a second sound channel P2, which will be described later. Sound output from the speaker unit 430 can be released to the outside of the electronic device 400 through the first sound channel P1, the second sound channel P2, and the sound hole 420. A detailed description of the first sound channel P1 and the second sound channel P2 will be described below.

[0097] In the embodiments, reference is made to Figure 6 , Figure 7a , Figure 7b and Figure 7c At least a portion of the first support member 450 may be located within the first portion 411 of the housing 410. As described above, the first portion 411 may be an injection-molded portion of the housing 410 made of a non-metallic material. In an embodiment, the first support member 450 may be located within the first portion 411 of the housing 410. Figure 6 The space between the first support member 450 and the first portion 411 of the housing 410 is spaced apart by a predetermined distance in the -Z direction. The space between the first support member 450 and the first portion 411 of the housing 410 can be used as a channel (e.g., a second sound channel P2) for transmitting sound output from the speaker unit 430 to the sound hole 420. In an embodiment, the first support member 450 may include a first opening 451. Sound output from the speaker unit 430 can be transmitted to the sound hole 420 through the first opening 451—the space between the first support member 450 and the first portion 411 of the housing 410 (e.g., a second sound channel P2).

[0098] In embodiments, the first support member 450 can be made of various materials. For example, the first support member 450 can be made of metallic or non-metallic materials. In embodiments, metallic materials may include alloys of aluminum, stainless steel (STS, SUS), iron, magnesium, and / or titanium. Non-metallic materials may include synthetic resins, ceramics, and / or engineering plastics. Furthermore, the first support member 450 can be made of a variety of materials available to those skilled in the art.

[0099] In this embodiment, the speaker unit 430 can be based on Figure 6The speaker unit 430 is positioned in the -Z direction relative to the first support member 450. The speaker unit 430 may be disposed in the housing 410 such that the sound release port (not shown) is located in the first opening 451 of the first support member 450.

[0100] In the embodiments, reference is made to Figure 6 A first sealing member 510 may be disposed between the speaker unit 430 and the first support member 450. In an embodiment, the first sealing member 510 may be in a closed-loop form surrounding the sound outlet of the speaker unit 430 and the first opening 451 of the first support member 450. In an embodiment, the first sealing member 510 may be made of an elastic material or sound-insulating material such as rubber, urethane, and / or rubber. In an embodiment, the first sealing member 510 may be bonded to the speaker unit 430 and the first support member 450 when an adhesive material is applied to at least one surface of the first sealing member 510. In an embodiment, the sound outlet of the speaker unit 430 and the first opening 451 of the first support member 450 may be located inside the first sealing member 510. The internal space of the first sealing member 510 may be a first sound channel P1 connecting the sound outlet of the speaker unit 430 and the first opening 451 of the first support member 450. For example, the first sound channel P1 may be a space surrounded by the first sealing member 510. Because the first sealing member 510 is in close contact with the speaker unit 430 and the first support member 450, sound radiated from the sound outlet of the speaker unit 430 can be prevented from leaking into the space between the speaker unit 430 and the first support member 450. Therefore, the sound output from the speaker unit 430 can be transmitted through the first sound channel P1 to the first opening 451 of the first support member 450.

[0101] In the embodiments, reference is made to Figure 6 When the first support member 450 is spaced apart from the first portion 411 of the housing 410 by a predetermined distance, a space can be formed between the first support member 450 and the first portion 411. Hereinafter, the space surrounded by the first support member 450 and the housing 410 will be referred to as the second sound channel P2. In an embodiment, the second sound channel P2 can connect the first opening 451 of the first support member 450 and the sound hole 420 formed in the housing 410. In an embodiment, the sound hole 420 can be formed in the first portion 411 of the housing 410 to face the front surface of the electronic device 400 (e.g., facing the front surface of the device based on...). Figure 6 (Surface in the +Z direction). Therefore, the sound output from the speaker unit 430 can be released to the outside of the electronic device 400 through the first sound channel P1—the first opening 451 of the first support member 450—the second sound channel P2—the sound hole 420.

[0102] In the embodiments, reference is made to Figure 6 , Figure 7a , Figure 7b and Figure 7c The first support member 450 is disposed (supported, attached, contacted) therein, and a mounting groove 413 may be formed in the first portion 411 of the housing 410. In an embodiment, the mounting groove 413 may be a recess formed to accommodate the first support member 450 in the first portion 411. In an embodiment, the second sound channel P2 located between the first portion 411 of the housing 410 and the first support member 450 may be part of the mounting groove 413.

[0103] In one embodiment, a portion of the first support member 450 may be disposed in a first portion 411 of the housing 410, and another portion of the first support member 450 may be disposed in a second portion 412 of the housing 410. In another embodiment, at least a portion of the first support member 450 may be disposed in a latch jaw 415 formed in the housing 410. In another embodiment, the first support member 450 may be guided by a short jaw 414 formed in the housing 410 to be positioned on the latch jaw 415. As will be described later, a portion of the second sealing member 520 constituting the rear sound space P3 may be disposed in the short jaw 414. In another embodiment, the latch jaw 415 and the short jaw 414 may be part of the first portion 411 and / or the second portion 412 of the housing 410.

[0104] In one embodiment, the first support member 450 may be disposed only in the first portion 411 of the housing 410. In this case, a portion of the first support member 450 may be guided by a short jaw portion 414 located in the first portion 411 to be placed on a locking jaw portion 415 located in the first portion 411.

[0105] According to the embodiments, such as Figure 6 As shown, the electronic device 400 may include a printed circuit board 440 electrically connected to the speaker unit 430. In an embodiment, the printed circuit board 440 may be configured such that a first surface 4401 (e.g., facing a surface based on...) Figure 6 The surface in the +Z direction faces the first support member 450, and the second surface 4402 (e.g., facing the surface based on the +Z direction) .... Figure 6 The surface in the -Z direction faces the rear housing 470. In an embodiment, the printed circuit board 440 may surround a portion of the speaker unit 430. In an embodiment, the printed circuit board 440 may include a second opening 441 for receiving the speaker unit 430. The speaker unit 430 may be disposed in the second opening 441; therefore, its side regions may be surrounded by the printed circuit board 440.

[0106] In an embodiment, the bracket 530 covering the second opening 441 may be disposed on the second surface 4402 of the printed circuit board 440 (e.g., facing the surface based on the second surface 4402 of the printed circuit board 440). Figure 6 (Surface in the -Z direction). In an embodiment, the speaker unit 430 may be located in the space formed by the closing of the second opening 441 with the bracket 530 (e.g., rear sound space P3, resonant space). In an embodiment, the bracket 530 may be a shield (i.e., a shielding element) made of a metallic material. The shield may shield, reduce, or prevent the transmission of electromagnetic waves and / or noise generated in the electronic components, such that at least some of the electromagnetic waves and / or noise cannot penetrate the shield. For example, the shield may shield, reduce, or prevent the transmission of electromagnetic waves and / or noise generated in the electronic components disposed in the speaker unit 430 and the printed circuit board 440, such that at least some of the electromagnetic waves and / or noise cannot penetrate the shield. The shielding element may shield, prevent, or reduce the transmission of electromagnetic waves and / or noise generated by the speaker unit and the printed circuit board to other components in the electronic device, or to the outside of the electronic device. The shielding element may also shield, prevent, or reduce the transmission of electromagnetic waves and / or noise generated by components other than the speaker unit and the printed circuit board to the speaker unit and the printed circuit board. In an embodiment, the bracket 530 may be made of a non-metallic material such as synthetic resin, ceramic, and / or engineering plastic.

[0107] According to the embodiments, such as Figure 6 , Figure 9a , Figure 9b and Figure 9c As shown, on the first surface 4401 of the printed circuit board 440 (e.g., facing the surface based on...) Figure 6 A second sealing member 520 may be provided on the surface in the +Z direction. In an embodiment, the second sealing member 520 may have a closed-loop shape. In an embodiment, the second sealing member 520 may be made of an elastic material such as rubber, urethane, sound-insulating material, or combinations thereof. In an embodiment, the second sealing member 520 may be bonded to the printed circuit board 440 and the housing 410 by applying an adhesive material to at least one of its surfaces. In an embodiment, the second sealing member 520 may be bonded between the printed circuit board 440 and the housing 410 to surround the first sealing member 510 on the outside. In an embodiment, at least a portion of the second sealing member 520 may be located in a second portion 412 of the housing 410. Another portion of the second sealing member 520 may be located at a short jaw 414 that guides the first support member 450 to be disposed in a mounting groove 413.

[0108] According to the embodiments, such as Figure 6As shown, with the mounting groove 413 formed in the housing 410, a step may appear between the mounting groove 413 and another region of the housing 410 (e.g., the short jaw 414). In an embodiment, the first gap L1 between the first support member 450 and the printed circuit board 440 may be wider than the second gap L2 between the short jaw 414 and the printed circuit board 440. As described above, the second sealing member 520 may be disposed in the first surface 4401 of the printed circuit board 440, a portion of the second sealing member 520 may face the first support member 450, and another portion of the second sealing member 520 may be located at the short jaw 414 of the housing 410. In this case, the portion of the second sealing member 520 facing the first support member 450 may not be supported by the space corresponding to the difference between the first gap L1 and the second gap L2. According to embodiments of the present disclosure, as Figure 6 , Figure 8a and Figure 8b As shown, the electronic device 400 may include a second support member 460 to compensate for the difference between the first gap L1 and the second gap L2. In an embodiment, referring to... Figure 6 and Figures 8a to 9b The second support member 460 may be disposed between the first support member 450 and the printed circuit board 440. In an embodiment, the second support member 460 may be disposed within the first support member 450. In an embodiment, the thickness of the portion of the second support member 460 disposed within the first support member 450 (e.g., based on...) Figure 6 The length in the Z-axis direction can have a thickness equal to the difference between the first gap L1 and the second gap L2.

[0109] In embodiments, the second support member 460 can be made of various materials. For example, the second support member 460 can be made of metallic or non-metallic materials. In embodiments, metallic materials may include alloys of aluminum, stainless steel (STS, SUS), iron, magnesium, and / or titanium. Non-metallic materials may include synthetic resins, ceramics, and / or engineering plastics. Furthermore, the second support member 460 can be made of a variety of materials within the range available to those skilled in the art.

[0110] According to the embodiments, such as Figure 6As shown, the electronic device 400 may include a rear acoustic space P3 surrounded by a housing 410, a printed circuit board 440, a support 530, a first sealing member 510, and a second sealing member 520. In an embodiment, the second sealing member 520 may prevent sound output from the speaker unit 430 from being released into the space between the first support member 450 and the printed circuit board 440, and between the housing 410 and the printed circuit board 440. In an embodiment, the rear acoustic space P3 may be the space in which sound output from the speaker unit 430 is transmitted. In an embodiment, the rear acoustic space P3 may improve the sound performance of the speaker unit 430 by inducing resonance of sound output from the speaker unit 430 within the enclosed area. For example, low-frequency sound output from the speaker unit 430 may be radiated into a resonance space (e.g., the rear acoustic space P3) formed in the rearward direction of the speaker unit 430, thereby inducing resonance within the enclosed space and improving low-frequency sound performance.

[0111] According to embodiments of this disclosure, the rear sound space P3 of the electronic device 400 can be designed using components disposed within the electronic device 400 without requiring a separate space design. In embodiments, the rear sound space P3 formed by the printed circuit board 440, the bracket 530, the first sealing member 510, and the second sealing member 520 can induce resonance in the sound generated in the speaker unit 430. Therefore, the sound performance of the speaker unit 430 in the low-frequency range can be improved.

[0112] According to the embodiments, such as Figure 6 As shown, electronic device 400 may include a device disposed on its rear surface (e.g., facing a surface based on...). Figure 6 The rear shell 470 (the surface in the -Z direction) and the rear cover 480 (e.g., the rear surface of the rear shell 470) for covering the rear shell 470 and constituting its appearance. Figure 3 (Rear panel 380). In an embodiment, the rear housing 470 may include a sidewall portion 471 located on a side surface of the electronic device 400. In an embodiment, at least a portion of the second support member 460 may be disposed in the sidewall portion 471.

[0113] In the above description, it has been described that the bracket 530 is disposed in the printed circuit board 440 to cover the second opening 441, but the present disclosure is not limited thereto. In embodiments, the bracket 530 can be formed in various shapes. In embodiments, the bracket 530 can be part of the rear housing 470. For example, the bracket 530 can extend from one surface of the rear housing 470 toward the printed circuit board 440 to surround the second opening 441 of the printed circuit board 440. In this configuration, the rear acoustic space P3 can be formed by being surrounded by the rear housing 470, the support portion, the printed circuit board 440, the first sealing member 510, and the second sealing member 520.

[0114] Furthermore, the above description assumes that the second support member 460 is disposed within the housing 410. However, if the first gap L1 between the first support member and the printed circuit board 440 is the same as the second gap L2 between the short jaw 414 of the housing 410 and the printed circuit board 440, then the second support member 460 may not be required separately to compensate for the difference between the first gap L1 and the second gap L2. In this case, the second sealing member 520 may be bonded to the first surface 4401 of the printed circuit board 440, the housing 410, and the first support member 450 to surround the second opening 441 of the printed circuit board 440 outside the first sealing member 510. In this case, the electronic device 400 may not include the second support member 460, but may form a rear acoustic space P3. For example, the electronic device 400 may form the rear acoustic space P3 by means of a bracket 530, a printed circuit board 440, a first support member 450, a first sealing member 510, and a second sealing member 520.

[0115] According to embodiments of this disclosure, the speaker unit 430 may be located at a first portion 411 of the housing 410 made of a non-metallic material. With the speaker unit 430 disposed within the first portion 411 of the housing 410, a first support member 450 and a first sealing member 510 are disposed between the first portion 411 and the speaker unit 430, thereby forming a first sound channel P1 that transmits sound output from the speaker unit 430 to a sound hole 420 communicating with the outside of the electronic device 400. Furthermore, in embodiments, the speaker unit 430 may be disposed within a resonant space sealed by a printed circuit board 440 and a bracket 530 (e.g., a shield). The speaker unit 430 can improve sound flatness and sound quality in the bass range by ensuring the resonant space. Moreover, since the resonant space is ensured by components disposed within the electronic device 400 (such as the printed circuit board 440 and the bracket 530), a separate device object (e.g., the speaker housing 410) for forming the resonant space is not required; therefore, production costs of the electronic device 400 can be saved. Furthermore, in the embodiments, the electronic device 400 can ensure stereo performance and a predetermined level of sound performance by respectively arranging the speaker unit 430 at the upper and lower ends.

[0116] According to embodiments of this disclosure, electronic device 400 (e.g., Figure 1 Electronic device 101 and / or Figure 2a The electronic device 200 may include: a housing 410 (e.g., Figure 2aThe housing 210 includes a first portion 411 located on the front surface of the electronic device 400 and made of a non-metallic material; a first support member 450 disposed in the housing and including a first opening 451 having at least a portion facing the first portion; and a speaker unit 440 (e.g., Figure 1 Audio output module 155 and / or Figure 2a The sound output device 214 is disposed in the housing and configured to face the first opening of the first support member; a sound hole 420 is formed in the housing to release the sound output by the speaker unit; a first sealing member 510 is disposed between the first support member and the speaker unit and configured to surround the sound release port of the speaker unit and the first opening of the first support member; a first sound channel P1 is formed by being surrounded by the first sealing member and configured to connect the first opening and the speaker unit; and a second sound channel P2 is located between the first support member and the first part and configured to connect the first opening and the sound hole.

[0117] Furthermore, the electronic device may further include: a printed circuit board 440 (e.g., Figure 3 The substrate 340 includes a second opening 441 and is electrically connected to a speaker unit, at least a portion of which is inserted into the second opening 441; and a second sealing member 520 is located outside the first sealing member and disposed between the first surface 4401 of the printed circuit board and the housing to surround the second opening of the printed circuit board.

[0118] Furthermore, the electronic device may further include a second support member 460 disposed in the first support member and bonded to the second sealing member.

[0119] Furthermore, in the second support member, the thickness of the portion located between the first support member and the second sealing member can be formed to be equal in length to the difference between the first gap L1 between the printed circuit board and the first support member and the second gap L2 between the portion of the housing in which the second sealing member is disposed and the printed circuit board.

[0120] In addition, the housing may include a second portion 412 adjacent to the first portion, and at least a portion of the second sealing member may be bonded to the second portion.

[0121] Furthermore, the electronic device may further include: a bracket 530 disposed on the second surface 4402 of the printed circuit board and configured to cover the speaker unit and shield the second opening of the printed circuit board; and a rear sound space P3 surrounded by the printed circuit board, the bracket, the first sealing member, and the second sealing member.

[0122] In addition, the support can be made of metal to block electromagnetic waves and noise.

[0123] In addition, the first part may include a mounting groove 413, in which the first support member is mounted.

[0124] In addition, the second sound channel can be part of the mounting slot.

[0125] In addition, the housing may include a second portion 412 adjacent to the first portion, a portion of the second sealing member may be bonded to the first portion, and another portion of the second sealing member may be bonded to the second portion.

[0126] In addition, a sound hole can be formed in the first part to be located on the front surface of the electronic device.

[0127] Furthermore, the electronic device may further include a rear housing 470, which includes a sidewall portion 471 positioned toward the side surface of the electronic device and has at least a portion located on the rear surface of the electronic device.

[0128] In addition, at least a portion of the second support member may be disposed in the side wall portion.

[0129] Furthermore, the electronic device may further include: a support portion extending from one surface of the rear housing toward a second surface of the printed circuit board to surround the second opening; and a rear acoustic space P3 surrounded by the rear housing, the support portion, the printed circuit board, the first sealing member, and the second sealing member.

[0130] According to embodiments of this disclosure, an electronic device 400 (e.g., Figure 1 Electronic device 101 Figure 2a The housing 410 of the electronic device 200 (e.g., Figure 2a The speaker structure in the housing 210 may include: a first support member 450, including a first opening 451, the first opening 451 facing a first portion 411 of the housing located on the front surface of the electronic device and made of a non-metallic material; a speaker unit 430 (e.g., Figure 1 Audio output module 155 and / or Figure 2a The sound output device 214 is configured to face the first opening of the first support member; the first sealing member 510 is disposed between the first support member and the speaker unit and is configured to surround the sound release port of the speaker unit and the first opening of the first support member; the first sound channel P1 is formed by being surrounded by the first sealing member and is configured to connect the first opening and the speaker unit; and the second sound channel P2 is located between the first support member and the first part and is configured to connect the first opening and the sound hole 420 formed in the housing.

[0131] Furthermore, the speaker structure may further include: a printed circuit board 340 or 440, including a second opening 441 and electrically connected to the speaker unit, wherein at least a portion of the speaker unit is inserted into the second opening; and

[0132] The second sealing member 520 is located outside the first sealing member and is disposed between the first surface 4401 of the printed circuit board and the housing to surround the second opening of the printed circuit board.

[0133] Furthermore, the speaker structure may further include a second support member 460 disposed in the first support member and bonded to the second sealing member.

[0134] Furthermore, in the second support member, the thickness of the portion located between the first support member and the second sealing member can be formed to be equal in length to the difference between the first gap L1 between the printed circuit board and the first support member and the second gap L2 between the portion of the housing in which the second sealing member is disposed and the printed circuit board.

[0135] Furthermore, the speaker structure may further include: a bracket 530 disposed on the second surface 4402 of the printed circuit board and configured to cover the speaker unit and shield the second opening of the printed circuit board; and a rear sound space P3 surrounded by the printed circuit board, the bracket, the first sealing member, and the second sealing member.

[0136] Furthermore, the speaker structure may further include: a rear housing 470 having at least a portion located on the rear surface of the electronic device; a support portion extending from one surface of the rear housing toward a second surface 4402 of the printed circuit board to surround the second opening; and a rear sound space P3 surrounded by the rear housing, the support portion, the printed circuit board, the first sealing member, and the second sealing member.

[0137] The electronic devices according to the various embodiments disclosed in this document can be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliance devices. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0138] It should be understood that the various embodiments and terminology used in this document are not intended to limit the technical features described in this document to the particular embodiments, but rather to include various modifications, equivalents, or substitutions of the embodiments. In conjunction with the description of the accompanying drawings, the same reference numerals may be used for similar or related parts. The singular form of a noun corresponding to an item may include one or more items unless the relevant context explicitly specifies otherwise. In this document, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any or all possible combinations of the items listed together in the corresponding one of the phrases. Terms such as “first” or “second” may be used simply to distinguish a corresponding part from other corresponding parts and do not limit the corresponding parts in other respects (e.g., importance or order). When the terms “functionally” or “communically” are used, or when one (e.g., the first) component is referred to as “connected” or “linked” to another (e.g., the second) component without using the terms “functionally” or “communically”, it means that the first component can be connected to the other component directly (e.g., wired), wirelessly, or via a third component.

[0139] The term "module" as used in the various embodiments of this document can include a unit implemented in hardware, software, or firmware, and can be used interchangeably with terms such as, for example, logic, logic block, section, or circuit. A module can be an integrally formed part or the smallest unit that performs one or more functions, or a portion of said part. For example, according to an embodiment, a module can be implemented as an application-specific integrated circuit (ASIC).

[0140] Various embodiments of this document can be implemented as software (e.g., program 140) including one or more instructions stored in a machine-readable storage medium (e.g., internal memory 136 or external memory 138). For example, a processor (e.g., processor 120) of the device (e.g., electronic device 101) can invoke and execute at least one of the one or more stored instructions from the storage medium. This allows the device to be operated to perform at least one function based on the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where data is temporarily stored.

[0141] According to embodiments, methods according to the various embodiments disclosed in this document can be provided as included in a computer program product. The computer program product can be traded as a commodity between a seller and a buyer. The computer program product can be in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product can be distributed online or directly between two user devices (e.g., smartphones) via a machine-readable storage medium (e.g., download or upload). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in the memory of a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a relay server).

[0142] According to various embodiments, each of the above-described components (e.g., a module or program) may include one or more entities, some of which may be separately disposed in other components. According to various embodiments, one or more of the corresponding components or operations may be omitted, or one or more other components or operations may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as the corresponding components among the multiple components performed before integration. According to various embodiments, operations performed by modules, programs, or other components may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

[0143] It will be understood that, in addition to the embodiments disclosed above, this disclosure also contemplates and includes embodiments based on any two or more combinations of the embodiments disclosed above, as well as embodiments including any combination of the above features. That is, the absence of an explicit indication that two features or two embodiments can be combined does not mean that such combinations are not contemplated, but rather that such combinations should be considered to be included herein.

Claims

1. An electronic device (101, 200, 400), comprising: The housing (210, 410) includes a first part (411) located on the front surface of the electronic device and comprising a non-metallic material. A first support member (450) is disposed in the housing and includes a first opening (451) having at least a portion facing the first portion (411); The speaker unit (155, 214, 440) is disposed in the housing and configured to face the first opening of the first support member. A sound hole (420) is provided in the housing to release the sound output by the speaker unit; A first sealing member (510) is disposed between the first support member and the speaker unit, and is configured to surround the sound release port of the speaker unit and the first opening of the first support member; The first sound channel (P1) is formed by being surrounded by the first sealing member and configured to connect the first opening and the speaker unit; as well as The second sound channel (P2) is located between the first support member and the first portion and is configured to connect the first opening and the sound hole.

2. The electronic device according to claim 1, further comprising: A printed circuit board (340, 440) includes a second opening (441) and is electrically connected to the speaker unit, at least a portion of the speaker unit being inserted into the second opening; as well as The second sealing member (520) is located outside the first sealing member and is disposed between the first surface (4401) of the printed circuit board and the housing to surround the second opening of the printed circuit board.

3. The electronic device according to claim 2, further comprising a second support member (460), the second support member being disposed in the first support member and bonded to the second sealing member.

4. The electronic device according to claim 3, wherein, In the second support member, the thickness of the portion located between the first support member and the second sealing member has a length equal to the difference between the first gap (L1) between the printed circuit board and the first support member and the second gap (L2) between the portion of the housing in which the second sealing member is disposed and the printed circuit board.

5. The electronic device according to claim 3, wherein, The housing includes a second portion (412) adjacent to the first portion, and At least a portion of the second sealing member is bonded to the second portion.

6. The electronic device according to claim 3, further comprising: A bracket (530) is disposed on the second surface (4402) of the printed circuit board and configured to cover the speaker unit and shield the second opening of the printed circuit board; as well as The rear acoustic space (P3) is surrounded by the printed circuit board, the bracket, the first sealing member, and the second sealing member.

7. The electronic device according to claim 6, wherein, The support is made of metal.

8. The electronic device according to claim 1, wherein, The first part includes a mounting groove (413) in which the first support member is mounted.

9. The electronic device according to claim 8, wherein, The second sound channel is part of the mounting groove.

10. The electronic device according to claim 2, wherein, The housing includes a second portion (412) adjacent to the first portion, and A portion of the second sealing member is bonded to the first portion, and another portion of the second sealing member is bonded to the second portion.

11. The electronic device according to claim 1, wherein, The sound hole is formed in the first portion and located on the front surface of the electronic device.

12. The electronic device of claim 3, further comprising a rear housing (470) including a sidewall portion (471) and having at least a portion located on the rear surface of the electronic device, the sidewall portion being positioned toward the side surface of the electronic device.

13. The electronic device according to claim 12, wherein, At least a portion of the second support member is disposed in the sidewall portion.

14. The electronic device of claim 12, further comprising: A support portion extends from one surface of the rear housing toward the second surface of the printed circuit board to surround the second opening; as well as The rear acoustic space (P3) is surrounded by the rear shell, the support portion, the printed circuit board, the first sealing member, and the second sealing member.

Images