Multi-layer circuit board processing technology based on base plate combined structure

Abstract

The invention relates to the technical field of circuit board processing, and discloses a multi-layer circuit board processing technology based on a base plate combined structure, which comprises the following steps: S1, selecting a proper base plate according to the material and thickness of a circuit board, cutting a multi-layer circuit board, a cover plate and the base plate into proper sizes according to requirements, and ensuring that the edges are neat and free of burrs and impurities; and S2, cleaning the circuit board, and removing pollutants of oil stains on the surface of the circuit board. The multi-layer circuit board processing technology based on the base plate combined structure can effectively solve the problems that in the prior art, blind holes and buried holes in a multi-layer circuit board need to be manufactured before lamination, edges of a plurality of substrates, base plates and pressing plates need to be aligned manually before drilling of an unlaminated multi-layer circuit board, operation is tedious, production efficiency is low, and the production cost is high. The problem that the subsequent interlayer interconnection effect is affected due to the fact that manual alignment is difficult to achieve on a round special-shaped substrate is solved.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and more specifically to a multilayer circuit board processing technology based on a pad assembly structure. Background Technology

[0002] Multilayer circuit boards are core components in electronic devices that enable complex circuit connections. They are made by laminating multiple single-sided or double-sided boards with insulating layers, and feature high density, miniaturization, and high reliability. Multilayer circuit boards consist of multiple conductive and insulating layers stacked alternately, and circuit connections between layers are achieved through metallized vias. These metallized vias are classified as through-holes (through all layers), blind vias (from the surface layer to a specific inner layer), and buried vias (connecting only the inner layer and not exposing the surface layer). Interlayer conductivity is achieved through copper plating.

[0003] In the existing technology, the manufacturing of blind vias and buried vias in multilayer circuit boards needs to be carried out before lamination. However, before drilling, the edges of multiple substrates, pads and pressure plates in unlaminated multilayer circuit boards need to be manually aligned, which is cumbersome and has low production efficiency. Especially on circular irregular substrates, it is difficult to accurately align them manually, which leads to deviations in the hole positions and affects the interconnection effect between subsequent layers. Summary of the Invention

[0004] To address the aforementioned shortcomings of existing technologies, this invention provides a multilayer circuit board manufacturing process based on a pad assembly structure. This process effectively solves the problem that in existing technologies, the manufacturing of blind and buried vias in multilayer circuit boards needs to be carried out before lamination. Furthermore, before drilling holes in unlaminated multilayer circuit boards, it is necessary to manually align the edges of multiple substrates, pads, and pressure plates, which is cumbersome and inefficient. Especially on irregularly shaped circular substrates, it is difficult to accurately align them manually, leading to hole position deviations and affecting the subsequent interlayer interconnection effect.

[0005] To achieve the above objectives, the present invention provides the following technical solution: This invention provides a multilayer circuit board manufacturing process based on a pad assembly structure, comprising: S1. Select the appropriate backing plate according to the material and thickness of the circuit board. Cut the multi-layer circuit board, cover plate and backing plate to the appropriate size as required, ensuring that the edges are neat and free of burrs and impurities. S2. Clean the circuit board to remove surface oil and other contaminants; S3. Stack the pads, multi-layer unpressed circuit boards and cover plates in the combined structure from bottom to top. Accurately position the pads, cover plates and circuit boards to ensure that the overall structure is flat and without looseness, and to prevent displacement during drilling. S4. Set the drilling parameters reasonably based on the circuit board thickness, hole diameter, and backing material. S5. Remove the cover plate, circuit board and pad, clean the residual debris on the surface of the circuit board, and then inspect the drilled holes. Any unqualified holes should be marked and reworked. The combined structure described in S3 includes a rotary table; An alignment assembly includes a base fixedly connected to the outer surface of a rotary table, a bearing fixedly connected to the outer surface of the base, a rotating seat rotatably connected to the bearing via a rotating rod disposed therein, a fixed plate fixedly connected to the side of the rotating seat away from the base, two fixed plates are provided, the two fixed plates are designed to be adjacent to each other, the included angle between the two fixed plates is 90 degrees, and a positioning element is provided inside the rotating seat; The positioning component includes a sliding groove formed inside the rotating seat. Multiple sliding grooves are provided. The angle between the sliding groove and the fixed plate is 45 degrees. A sliding seat is slidably connected to the inner wall surface of the sliding groove. A lifting rod is slidably attached to the inner circumference of the sliding seat.

[0006] Furthermore, a torsion spring connected to the inner wall of the shaft seat is fitted on the outer circumference of the rotating rod, and a support foot that fits against the outer surface of the base is fixedly connected to the side of the rotating seat away from the fixed plate. The end of the support foot near the base is made of rubber.

[0007] Furthermore, a baffle is provided on the side of the rotating platform, and a pressing block is fixedly connected to the side of the baffle near the rotating platform. One end of the rotating rod is fixedly connected to a connecting rod that fits against the outer surface of the pressing block.

[0008] Furthermore, the inner wall surface of the sliding seat is provided with a first inclined groove, and the outer circumferential surface of the lifting rod is provided with a second inclined groove that communicates with the interior of the first inclined groove. The first inclined groove and the second inclined groove have the same slope, and a limit post is slidably connected inside the second inclined groove. Furthermore, a pad, a base plate, and a cover plate are sequentially placed on the upper surface of the rotating seat, and a pressure plate that fits against the outer surface of the cover plate is fixedly connected to the outer end of the lifting rod.

[0009] Furthermore, a magnetic plate is embedded on the outer surface of the base, and a magnetic block that is magnetically connected to the lower surface of the magnetic plate is fixedly connected to the side of the lifting rod near the base.

[0010] Furthermore, a reset plate is fixedly connected to the upper surface of the baffle and magnetically connected to the upper surface of the pressure plate.

[0011] Furthermore, the side of the pressing block near the rotating platform includes a descending surface and a rising surface. The descending surface has a steeper slope, while the rising surface has a gentler slope. The descending surface near the rising surface is designed with an angle.

[0012] The technical solution provided by this invention has the following advantages compared with the prior art: This invention comprises a base, a rotating seat, a positioning component, and a pressing block. Initially, the positioning cavity formed by the fixed plate and the lifting rod is at its maximum, facilitating the placement of the pad, multi-layer circuit board, and cover plate. During the movement of the alignment assembly driven by the rotating table, the interaction between the connecting rod and the pressing block causes the rotating seat to tilt. This allows the multi-layer circuit board, cover plate, and pad to automatically slide towards the two fixed plates under gravity. Combined with the sliding of the sliding seat and the lifting rod within the groove, this achieves omnidirectional surrounding positioning of the circuit board, ensuring complete alignment of the side surfaces of the pad, multi-layer circuit board, and cover plate, guaranteeing the accuracy of subsequent drilling. After the connecting rod contacts the junction of the descending and ascending surfaces on the outer surface of the pressing block, under gravity, the limiting post moves into the inclined groove inside the sliding seat, releasing the lock on the sliding seat and the lifting rod. The lifting rod slides downwards, adhering to the side of the circuit board, causing the lower surface of the pressure plate to contact the upper surface of the cover plate. After the connecting rod separates from the rising surface, it returns to its initial state. The distance between the magnetic block at the lower end of the lifting rod and the magnetic plate decreases. Under the action of magnetic force, multiple lifting rods remain stationary in this position, ensuring stability and accuracy in subsequent processing, preventing circuit board displacement, and avoiding the problem of misalignment between layers of multi-layer circuit boards, pads, and covers, which can lead to offset holes on different layers during drilling and subsequent connection errors. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0014] Figure 1 This is a flowchart illustrating the multilayer circuit board manufacturing process based on a pad assembly structure, as described in an embodiment of the present invention. Figure 2 This is a three-dimensional structural diagram of an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the rotating platform, the pressing block, and the base according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the alignment component according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the separation structure of the alignment component according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the separation structure of the positioning component according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the state transformation structure of the positioning component according to an embodiment of the present invention; Figure 8This is a schematic cross-sectional view of the base according to an embodiment of the present invention; Figure 9 This is an embodiment of the present invention. Figure 8 A magnified structural diagram of part A in the middle; Figure 10 This is a schematic diagram of the structure of the pressing block and connecting rod in an embodiment of the present invention.

[0015] The labels in the diagram represent: 1. Rotary table; 11. Baffle; 111. Pressing block; 1111. Gradual descending surface; 1112. Gradual rising surface; 112. Connecting rod; 2. Alignment assembly; 21. Base; 211. Shaft seat; 212. Support foot; 22. Rotating rod; 221. Torsion spring; 23. Rotary seat; 24. Fixing plate; 25. Positioning component; 251. Slide groove; 252. Sliding seat; 2521. Inclined groove one; 253. Lifting rod; 2531. Inclined groove two; 254. Limiting post; 255. Pressure plate; 26. Magnetic plate; 261. Magnetic block; 262. Reset plate. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0017] The present invention will be further described below with reference to embodiments.

[0018] Example:

[0019] Please see Figures 1-10 This invention provides a technical solution: a multilayer circuit board processing technology based on a pad assembly structure, comprising: S1. Select the appropriate backing plate according to the material and thickness of the circuit board. Cut the multi-layer circuit board, cover plate and backing plate to the appropriate size as required, ensuring that the edges are neat and free of burrs and impurities. S2. Clean the circuit board to remove surface oil and other contaminants; S3. Stack the pads, multi-layer unpressed circuit boards and cover plates in the combined structure from bottom to top. Accurately position the pads, cover plates and circuit boards to ensure that the overall structure is flat and without looseness, and to prevent displacement during drilling. S4. Set the drilling parameters reasonably based on the circuit board thickness, hole diameter, and backing material. S5. Remove the cover plate, circuit board and pad, clean the residual debris on the surface of the circuit board, and then inspect the drilled holes. Any unqualified holes should be marked and reworked. Among them, the combined structure in S3 includes a rotary table 1; Alignment assembly 2 includes a base 21 fixedly connected to the outer surface of the rotary table 1. A bearing 211 is fixedly connected to the outer surface of the base 21. A rotating seat 23 is rotatably connected to the bearing 211 via a rotating rod 22 disposed inside it. A fixing plate 24 is fixedly connected to the side of the rotating seat 23 away from the base 21. There are two fixing plates 24, which are designed to be adjacent to each other. The included angle between the two fixing plates 24 is 90 degrees. A positioning element 25 is disposed inside the rotating seat 23. The included angle between the rotating rod 22 and the fixing plate 24 is 45 degrees. The positioning component 25 includes a slide groove 251 inside the rotating seat 23. Multiple slide grooves 251 are provided. The included angle between the slide groove 251 and the fixed plate 24 is 45 degrees. A sliding seat 252 is slidably connected to the inner wall surface of the slide groove 251. A lifting rod 253 is slidably attached to the inner circumference of the sliding seat 252.

[0020] A torsion spring 221 connected to the inner wall of the shaft seat 211 is fitted on the outer circumference of the rotating rod 22. A support foot 212 that fits against the outer surface of the base 21 is fixedly connected to the side of the rotating seat 23 away from the fixed plate 24. The end of the support foot 212 near the base 21 is made of rubber. In the initial state, the rotating seat 23 is in a horizontal state and parallel to the upper surface of the base 21.

[0021] A baffle 11 is provided on the side of the rotating table 1. A pressing block 111 is fixedly connected to the side of the baffle 11 near the rotating table 1. A connecting rod 112 that fits against the outer surface of the pressing block 111 is fixedly connected to one end of the rotating rod 22.

[0022] The inner wall surface of the sliding seat 252 is provided with a first inclined groove 2521, and the outer circumferential surface of the lifting rod 253 is provided with a second inclined groove 2531 that communicates with the interior of the first inclined groove 2521. The first inclined groove 2521 and the second inclined groove 2531 have the same slope, and a limit post 254 is slidably connected inside the second inclined groove 2531. In the initial state, when the rotating seat 23 is in a horizontal state, the first inclined groove 2521 tilts at a large angle to the lower right. After the rotating seat 23 rotates around the rotating rod 22, as the tilt angle of the rotating seat 23 increases, the first inclined groove 2521 gradually tends to be horizontal. When it is about to reach the maximum tilt angle, the first inclined groove 2521 is in a horizontal state. As the rotating seat 23 continues to rotate, the first inclined groove 2521 changes to a state of tilting to the left. Under the action of gravity, the limit post 254 moves from the internal position where the second inclined groove 2531 and the first inclined groove 2521 are located to the interior of the first inclined groove 2521.

[0023] A pad, a base plate, and a cover plate are placed sequentially on the upper surface of the rotating seat 23, and a pressure plate 255 that fits against the outer surface of the cover plate is fixedly connected to the outer end of the lifting rod 253.

[0024] A magnetic plate 26 is embedded on the outer surface of the base 21, and a magnetic block 261 that is magnetically connected to the lower surface of the magnetic plate 26 is fixedly connected to the side of the lifting rod 253 near the base 21.

[0025] A reset plate 262 is fixedly connected to the upper surface of the baffle 11 and magnetically connected to the upper surface of the pressure plate 255. There are two reset plates 262. The upper reset plate 262 releases the locking of the pressure plate 255, and the magnetic force pulls the lifting rod 253 to rise. The left reset plate 262 can complete the reset of the alignment component 2.

[0026] The side of the pressure block 111 near the rotating table 1 includes a descending surface 1111 and a rising surface 1112. The descending surface 1111 has a steeper slope, while the rising surface 1112 has a gentler slope. The position of the descending surface 1111 near the rising surface 1112 adopts an angled design.

[0027] The base 21 is fixed to the upper surface of the rotary table 1, providing stable support for the entire alignment assembly 2. The rotating rod 22 inside the bearing seat 211 allows the rotating seat 23 to rotate flexibly, while the torsion spring 221 provides a restoring force for the rotating seat 23 after it rotates, ensuring that the rotating seat 23 can return to its initial horizontal position when not in operation.

[0028] In practical applications, the rotary table 1 can be a chain conveyor belt, and the rotary table 1 adopts intermittent motion. When the rotary table 1 stops, the external robotic arm sequentially feeds the pad, multi-layer unpressed circuit board and the top cover plate, and places them on the upper surface of the rotating seat 23 in sequence. After the rotary table 1 starts, it drives multiple sets of alignment components 2 to rotate cyclically on the surface of the rotary table 1, wherein the base 21 is fixed on the upper surface of the rotary table 1.

[0029] Taking the alignment assembly 2 located on the left side of the upper surface of the rotary table 1 as an example, in the initial state, under the action of the torsion spring 221, the lower end of the support foot 212 on the lower surface of the rotary seat 23 is attracted to the upper surface of the magnetic plate 26, and the rotary seat 23 and the base 21 are parallel and in a horizontal state. Furthermore, the sliding seats 252 inside the slide groove 251 are all within their stroke range, on the side away from the fixed plate 24. The two fixed plates 24 and the lifting rods 253 inside the multiple sliding seats 252 together form a positioning cavity, which is at its maximum size at this time. The lifting rods 253 are mainly divided into two groups. In this state, the two groups of lifting rods 253 form a 90-degree angle, and the positioning cavity formed between the two lifting rods 253 and the two fixed plates 24 is rectangular, with an area larger than the area of ​​the circuit board substrate.

[0030] The lifting rod 253, located inside the sliding seat 252, is at its highest point within its stroke range. The interiors of inclined groove 1 2521 and inclined groove 2531 are connected. Both inclined groove 1 2521 and inclined groove 2531 adopt an L-shaped design, consisting of a short groove and a long groove. The short groove is closer to the right side. In this state, under the influence of gravity, the top of the inner wall of the short groove contacts the outer surface of the limiting post 254. The outer circumference of the limiting post 254 contacts the inner walls of inclined groove 1 2521 and inclined groove 2531. Under the action of the limiting post 254, the lifting rod 253 and the sliding seat 252 are in an engaged state, with the lifting rod 253 located at its highest point within its stroke range.

[0031] The process of assembling and positioning multilayer unlaminated circuit board, cover plate and pad: The pad, multi-layer unpressed circuit board, and cover plate are stacked sequentially on the upper surface of the rotating base 23 from bottom to top. Since the positioning cavity area is largest in the initial state, the pad, multi-layer unpressed circuit board, and cover plate can be placed smoothly without obstruction. The pad is in contact with the lower surface of the rotating base 23, and the pad, multi-layer unpressed circuit board, and cover plate are the same size. The rotating table 1 continues to operate, moving the alignment assembly 2 towards the drilling station above the rotating table 1. During this process, the alignment assembly 2 passes over the pressure block 111 located above it. The left and right ends of the pressure block 111 are designed with rounded corners, and the outer surface of the connecting rod 112 is also designed with rounded corners to ensure a smooth transition.

[0032] Initially, connecting rod 112 is tilted 45 degrees to the upper left. When connecting rod 112 passes the pressing block 111, the outer surface of connecting rod 112 contacts the left arc angle of the pressing block 111. As it continues to move, the outer surface of connecting rod 112 first comes into contact with the tapered surface 1111 in the pressing block 111. During the movement, connecting rod 112 rotates counterclockwise and gradually approaches a horizontal state. Connecting rod 112 is fixedly connected to rotating seat 23 through the outer end of rotating rod 22. When connecting rod 112 rotates, rotating seat 23 rotates around rotating rod 22 and gradually tilts. At this time, the junction of the two fixed plates 24 at rotating seat 23 is the lowest point, and the pad, multi-layer unpressed circuit board and cover gradually slide towards the junction of the two fixed plates 24. At this time, the long grooves in inclined groove 1 2521 and inclined groove 2 2531 gradually change from tilting to the lower right to a more horizontal state. The limiting post 254 no longer contacts the top of the inner wall of the short groove, but is in contact with the inner wall surface of inclined groove 1 2521 and inclined groove 2 2531. The limiting post 254 still holds the sliding seat 252 and the lifting rod 253 together as a whole. The pressure plate 255 is fixed at the top of the lifting rod 253 and is still at the highest point within its stroke range, without contacting the cover plate.

[0033] During this process, connecting rod 112 continues to move with the rotary table 1 until it reaches the bend of the descending surface 1111. Under the action of the torsion spring 221, connecting rod 112 always possesses a clockwise rotational torque. When the outer surface of connecting rod 112 comes into contact with the bend, under the combined influence of the torque of the torsion spring 221 and the force generated by the continuous movement of the rotary table 1, connecting rod 112 will first rotate rapidly and slightly clockwise. This is because the shape of the bend causes an instantaneous change in the constraint force on connecting rod 112, allowing the torque of the torsion spring 221 to be released quickly, causing connecting rod 112 to rotate clockwise. However, immediately afterwards, due to the obstruction at the bend and the reaction force of the pressing block 111, connecting rod 112 will rotate slightly counterclockwise. This process repeats twice, forming rapid, small-amplitude back-and-forth rotation.

[0034] Correspondingly, the rotating rod 22, which is fixedly connected to the connecting rod 112, rotates synchronously with the rotation of the connecting rod 112, thereby driving the rotating seat 23 to rotate back and forth quickly and slightly twice around the rotating rod 22. During the back and forth rotation of the rotating seat 23, the pad, multi-layer unpressed circuit board, and cover plate placed on its surface will bounce on the surface of the rotating seat 23 due to inertia. The impact force generated by this bounce will overcome the large friction between the pad, circuit board, and cover plate and the surface of the rotating seat 23. The pad, circuit board, and cover plate, which were originally difficult to slide due to excessive friction, will become temporarily loosened under the action of the bounce, thereby accelerating their approach to the surface of the fixed plate 24. Through this movement, the situation where the pad, circuit board, and cover plate cannot slide smoothly into place due to excessive friction on the surface of the rotating seat 23 is effectively avoided, ensuring that they can fit tightly with the fixed plate 24, and further ensuring the positioning accuracy in subsequent processing.

[0035] During this process, the sliding seat 252 located inside the chute 251 is also affected by the tilted rotating seat 23, and moves closer to the side of the pad, circuit board and cover plate under the action of gravity. Until the outer circumferential surfaces of the multiple lifting rods 253 are in contact with the side of the pad, circuit board and cover plate, and with the help of the two fixing plates 24, the pad, circuit board and cover plate are surrounded. At this time, the size and area of ​​the positioning cavity are equal to the size and area of ​​the circuit board.

[0036] When the rotating seat 23 rotates, it drives multiple lifting rods 253 to move synchronously. The magnetic block 261 at the bottom of the lifting rod 253 is far from the magnetic plate 26, and the magnetic block 261 is no longer subject to the magnetic effect of the magnetic plate 26. At this time, the long grooves in the inclined groove 1 2521 and inclined groove 2 2531 are in a horizontal state and have a tendency to tilt downward to the left. At the same time, when the rotating seat 23 passes through the bend, it will rotate back and forth quickly with a small amplitude, generating a violent vibration impact force. This impact force is transmitted to the lifting rod 253, causing the lifting rod 253 to be subjected to an upward force along its axis inside the circumference of the sliding seat 252, and to displace downward slightly. The frictional force generated above the outer circumference of the limiting post 254 due to the gravity of the lifting rod 253 decreases, and in accordance with the slightly downward and leftward tilting of the inclined groove 2521 and inclined groove 2531, the limiting post 254 slides downward and leftward under the action of gravity until its outer surface completely detaches from the inclined groove 2531 opened inside the lifting rod 253 and reaches the inclined groove 2521.

[0037] The lifting rod 253 and the sliding seat 252 are no longer limited by the limiting post 254 and are in the unlocked state. After the lifting rod 253 and the sliding seat 252 are unlocked, the lifting rod 253 slides down along the inner wall surface of the sliding seat 252 under the action of gravity until the lower surface of the pressure plate 255 at its top is in contact with the upper surface of the cover plate. At this point, if the circuit board is rectangular, the lifting rods 253 can be divided into two groups, each group of lifting rods 253 arranged in a straight line, with the included angle between the two groups of lifting rods 253 being 90 degrees. The two groups of lifting rods 253 are respectively attached to one of the adjacent sides of the circuit board, and the fixing plate 24 is attached to the other two sides of the circuit board. If the circuit board is circular, two points on the outer surface of the circular circuit board are attached to the outer surfaces of the two fixing plates 24 to achieve positioning. Multiple lifting rods 253 slide synchronously through the sliding seat 252 during the tilting of the rotating seat 23, and are attached to the outer surface of the circular circuit board. Multiple lifting rods 253 form a circle, and the sliding grooves 251 are equally distributed so that the thrust of each lifting rod 253 is the same in magnitude and symmetrical in direction, with the resultant force pointing towards the center of the circle. This ensures that the circular circuit board is stably positioned without eccentric torque, surrounds the outer surface of the circular circuit board, and applies uniform constraint force to the circular circuit board from all directions, ensuring the stability and positioning accuracy of the circular circuit board during processing and avoiding positioning inaccuracies due to its special shape. It can be used for horizontal positioning of circuit boards of different shapes and sizes, and the pressure plate 255 can maintain some pressure on the cover plate, multi-layer unpressed circuit board and pad.

[0038] As the rotary table 1 continues to move the alignment assembly 2, the outer surface of the connecting rod 112 moves from the descending surface 1111 at the pressing block 111 to the ascending surface 1112. Since the connecting rod 112 is constantly subjected to the clockwise rotational torque of the torsion spring 221, after contacting the ascending surface 1112, it gradually recovers a small-amplitude clockwise rotation along the surface of the ascending surface 1112. The slope of the ascending surface 1112 is relatively small, which makes the rotation process of the connecting rod 112 smoother. During the gradual clockwise rotation, the connecting rod 112 drives the rotating seat 23 to slowly rotate clockwise around the rotating rod 22, and the tilt angle of the rotating seat 23 gradually decreases, slowly returning to its initial horizontal state.

[0039] This gentle rotational motion avoids severe impacts on the pads, multi-layered unpressed circuit boards, and covers on the surface of the rotating seat 23. Simultaneously, during the slow resetting of the rotating seat 23, it ensures that the pads, circuit boards, and covers do not shift during the resetting process, maintaining contact with the fixed plate 24. The lifting rod 253 and sliding seat 252 also maintain stability. As the rotating seat 23 gradually approaches a horizontal position, the distance between the magnetic block 261 at the bottom of the lifting rod 253 and the magnetic plate 26 embedded inside the base 21 decreases. Under the action of the magnetic plate 26, the stability of the lifting rod 253 and sliding seat 252 is ensured. After the rotating seat 23 returns to a horizontal position, the lower surface of the support foot 212 contacts the magnetic plate 26. Its bottom rubber design provides shock absorption and reduces wear. The outer surface of the connecting rod 112 gradually detaches from the pressing block 111, returning to its initial state of tilting 45 degrees to the upper left. The rotating seat 23 and base 21 are now in a horizontal position. Under the action of magnetic force, multiple lifting rods 253 can still cooperate with the fixing plate 24 to achieve the horizontal positioning of the pad, circuit board and cover plate. Through magnetic attraction, the lower surface of the pressure plate 255 can be pressed against the upper surface of the cover plate to achieve vertical fixation.

[0040] After the rotating seat 23 returns to a horizontal state, the interiors of inclined groove 1 2521 and inclined groove 2 2531 are no longer connected. The limiting post 254 is still in inclined groove 1 2521. At this time, the long groove in inclined groove 1 2521 is tilted to the right and downward. Under the action of gravity, the limiting post 254 tilts and slides to the right and downward, and its outer surface is in contact with the outer surface of the lifting rod 253.

[0041] The process of resetting alignment component 2: After the pad, circuit board, and cover plate are positioned, the rotary table 1 continues to move the alignment component 2. After another intermittent stop, holes are drilled into the multilayer circuit board using a drilling device. After drilling, the rotary table 1 continues to move the alignment component 2 until it reaches below the reset plate 262. The upper surface of the pressure plate 255 is magnetically designed. The magnetic force between the reset plate 262 and the lower surface of the pressure plate 255 is greater than the magnetic force between the magnetic plate 26 and the magnetic block 261. Under the action of the reset plate 262, the pressure plate 255 drives the lifting rod 253 to move vertically upward and fit against the lower surface of the reset plate 262. During this process, the openings of the inclined slot 1 2521 and the inclined slot 2 2531 gradually overlap and are internally connected. Under the action of gravity, the limiting post 254 tilts and slides downward to the right. The limiting post 254 moves from the inside of the inclined groove 2521 near the two fixed plates 24 in the sliding seat 252 to the inside of the inclined groove 2521 away from the two fixed plates 24, and moves until its outer surface is in contact with the inner wall of the inclined groove 2521 and the inclined groove 2531, and is located in the inclined groove 2521 near the short groove.

[0042] After the alignment assembly 2 passes the reset plate 262, the pressure plate 255 is no longer subject to the magnetic force of the reset plate 262. The lifting rod 253 falls vertically downwards under gravity, and its inner upper surface adheres to the limiting post 254, pressing against it. At this point, the limiting post 254 is located at the short groove, thus re-engaging the sliding seat 252 with the lifting rod 253. The pressure plate 255 then detaches from the upper surface of the cover plate and ceases to press.

[0043] As the rotary table 1 continues to rotate, the alignment assembly 2 moves to the arc on the right side of the rotary table 1. The short groove in the inclined groove 2521 and the inclined groove 2531 is located below, and the limiting post 254 remains inside the lifting rod 253 under the action of gravity. When the alignment assembly 2 moves below the rotary table 1, the limiting post 254 engages with the inner wall surface of the short groove near the pressure plate 255, still inside the lifting rod 253. During this process, the alignment assembly 2 passes the pressing block 111 located below. The outer surface of the connecting rod 112 first comes into contact with the descending surface 1111 of the pressing block 111, causing the rotating seat 23 to rotate around the rotating rod 22. The distance between the magnetic block 261 at the outer end of the lifting rod 253 and the magnetic plate 26 increases again, and the magnetic force gradually decreases. In the rotating seat 23, the corner furthest from the junction of the two fixed plates 24 is the lowest. Under the action of gravity, the sliding seat 252 and the lifting rod 253 in the slide groove 251 slide away from the fixed plate 24 and move to their initial position. The positioning cavity formed by the multiple lifting rods 253 and the two fixed plates 24 has the largest area. With the help of an external auxiliary feeding device, the cover plate, multilayer circuit board and pad are fed under the action of gravity. After the outer surface of the connecting rod 112 moves to fit against the rising surface 1112 of the pressing block 111, the rotating seat 23 returns to parallel with the base 21. The distance between the magnetic block 261 at the outer end of the lifting rod 253 and the magnetic plate 26 decreases, and the lifting rod 253 is held in this position by the magnetic force.

[0044] When the alignment component 2 moves to the arc bend on the left side of the rotary table 1, the short grooves in the inclined groove 1 2521 and the inclined groove 2531 are in a horizontal state, and the baffle 11 at this position is also provided with a reset plate 262 that magnetically attracts the outer surface of the pressure plate 255. When it reaches below the reset plate 262, the pressure plate 255 attracts to the reset plate 262 and moves away from the surface of the rotary table 1 until the alignment component 2 moves to the upper surface of the rotary table 1 and restores its initial state.

[0045] In summary, this combined structure has the following advantages: Advantage 1: The rotary table 1 uses a chain conveyor belt and operates intermittently. Combined with an external robotic arm, it achieves automatic feeding. Once started, it drives multiple sets of alignment components 2 to rotate cyclically, forming a continuous production process. This reduces manual intervention, and the feeding, positioning, processing, and unloading processes are seamlessly connected, significantly shortening the processing cycle for a single batch of circuit boards. Multiple sets of alignment components 2 circulate on the surface of the rotary table 1. While one set is drilling, the next set can simultaneously complete feeding and positioning, improving equipment utilization.

[0046] Advantage 2: If the layers of the multilayer circuit board, pad, and cover are not properly aligned, drilling will result in offset holes on different layers, causing subsequent connection problems. The alignment component 2 ensures the accuracy of the multilayer circuit board alignment. In the initial state, the positioning cavity formed by the fixed plate 24 and the lifting rod 253 is at its maximum, facilitating the smooth placement of the pad, multilayer circuit board, and cover. During the movement of the alignment component 2 driven by the rotary table 1, the interaction between the connecting rod 112 and the pressing block 111 causes the rotating seat 23 to tilt. This allows the multilayer circuit board, cover, and pad to automatically slide towards the two fixed plates 24 under gravity. Combined with the sliding seat 252 and the sliding rod 253 within the groove 251, the circuit board is positioned in all directions, ensuring complete alignment of the side surfaces of the pad, multilayer circuit board, and cover, guaranteeing accuracy in subsequent drilling. After the connecting rod 112 contacts the junction of the descending surface 1111 and the ascending surface 1112 on the outer surface of the pressing block 111, under the action of gravity, the limiting post 254 moves into the inclined groove 2521 inside the sliding seat 252, releasing the lock on the sliding seat 252 and the lifting rod 253. The lifting rod 253 slides downward against the side of the circuit board, so that the lower surface of the pressure plate 255 contacts the upper surface of the cover plate. After the connecting rod 112 disengages from the ascending surface 1112, it returns to its initial state. The distance between the magnetic block 261 at the lower end of the lifting rod 253 and the magnetic plate 26 decreases. Under the action of magnetic force, multiple lifting rods 253 are kept in the same position, ensuring stability and accuracy in subsequent processing and preventing displacement.

[0047] Thirdly, it is applicable to the positioning of circuit boards of different shapes (rectangular and circular). For rectangular circuit boards, two sets of lifting rods 253 and two fixed plates 24 form a rectangular positioning cavity. The two sides of the circuit board are in contact with the outer surface of the fixed plates 24, and the other two sides are in contact with the surfaces of the vertically distributed lifting rods 253 (it is also suitable for processing circuit boards with different length-to-width ratios). For circular circuit boards, multiple lifting rods 253 form a circle to surround the circuit board, and the slide grooves 251 are evenly distributed to ensure uniform thrust of each lifting rod 253. The combination of lifting rods 253 and fixed plates 24 can flexibly adjust the shape of the positioning cavity, ensuring stable, non-eccentric torque-free surrounding positioning regardless of the shape of the board material. This is significantly better than the problem of poor adaptability of conventional rigid clamps to irregularly shaped boards. There is no need to change clamps or use pins, which improves convenience and further enhances the flexibility and applicability of the structure.

[0048] Fourthly, it is applicable to the positioning of circuit boards of different sizes. Multiple slides 251 are provided, with adjacent slides 251 being equidistantly distributed, resulting in a relatively long path length for each slide 251. For circuit boards of the same shape, when the circuit board is large, the sliding seat 252 and lifting rod 253 move a shorter distance within the slide 251; when the circuit board is small, the sliding seat 252 and lifting rod 253 move a longer distance within the slide 251. When the sliding seat 252 and lifting rod 253 located on the outer edge move to the top of the slide 251 within their inner edge, their outer surfaces contact the fixing plate 24 and no longer act on the circuit board. Positioning is then achieved by the sliding seat 252 and lifting rod 253 closer to the center. This structure is applicable to positioning circuit boards, pads, and covers of different sizes over a wide range, offering a wider range of applications than conventional positioning structures.

[0049] Fifthly, during the movement of the rotating seat 23, when the connecting rod 112 on its outer surface comes into contact with the descending surface 1111 on the lower surface of the pressing block 111, the descending surface 1111 near the ascending surface 1112 adopts an angled design. When the connecting rod 112 passes by, it will cause the rotating seat 23 to rotate and bounce back and forth slightly. This dynamic impact can effectively overcome the static friction between the pad and the rotating seat 23, prevent the pad and circuit board from getting stuck due to excessive friction, ensure that the pad and circuit board can slide smoothly into place, and ensure that the circuit board and the fixing plate 24 are tightly attached. Conventional processing relies on manual tapping or pushing to eliminate friction and jamming, which is not only labor-intensive but also difficult to control, easily leading to damage to the circuit board edges or positional displacement. However, the angle design in the descending surface 1111 automatically generates high-frequency, small-amplitude vibrations through a mechanical structure, and the impact force is evenly applied to the entire stack. This not only eliminates static friction but also avoids mechanical damage to the circuit board, thus improving the sliding positioning rate. The curvature of the angle of the descending surface 1111 and the arc angle design of the connecting rod 112 achieve a smooth transition of vibration, avoiding fatigue damage to the positioning component 25 caused by rigid impact.

[0050] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multilayer circuit board processing technology based on a pad assembly structure, characterized in that, include: S1. Select the appropriate backing plate according to the material and thickness of the circuit board. Cut the multi-layer circuit board, cover plate and backing plate to the appropriate size as required, ensuring that the edges are neat and free of burrs and impurities. S2. Clean the circuit board to remove surface oil and other contaminants; S3. Stack the pads, multi-layer unpressed circuit boards and cover plates in the combined structure from bottom to top. Accurately position the pads, cover plates and circuit boards to ensure that the overall structure is flat and without looseness, and to prevent displacement during drilling. S4. Set the drilling parameters reasonably based on the circuit board thickness, hole diameter, and backing material. S5. Remove the cover plate, circuit board and pad, clean the residual debris on the surface of the circuit board, and then inspect the drilled holes. Any unqualified holes should be marked and reworked. The combined structure described in S3 includes a rotary table (1). Alignment assembly (2), the alignment assembly (2) includes a base (21) fixedly connected to the outer surface of the rotary table (1), a bearing seat (211) fixedly connected to the outer surface of the base (21), a rotating seat (23) rotatably connected to the bearing seat (211) via a rotating rod (22) disposed inside it, a fixing plate (24) fixedly connected to the side of the rotating seat (23) away from the base (21), two fixing plates (24) are provided, the two fixing plates (24) are designed to be adjacent, the included angle between the two fixing plates (24) is 90 degrees, and a positioning element (25) is provided inside the rotating seat (23). The positioning component (25) includes a slide groove (251) inside the rotating seat (23). Multiple slide grooves (251) are provided. The included angle between the slide groove (251) and the fixed plate (24) is 45 degrees. A sliding seat (252) is slidably connected to the inner wall surface of the slide groove (251). A lifting rod (253) is slidably attached to the inner circumference of the sliding seat (252).

2. The multilayer circuit board processing technology based on a pad assembly structure according to claim 1, characterized in that: The outer circumferential surface of the rotating rod (22) is fitted with a torsion spring (221) connected to the inner wall of the shaft seat (211), and the rotating seat (23) is fixedly connected to a support foot (212) that fits against the outer surface of the base (21) on the side away from the fixed plate (24).

3. The multilayer circuit board processing technology based on a pad assembly structure according to claim 2, characterized in that: A baffle (11) is provided on the side of the rotating platform (1). A pressing block (111) is fixedly connected to the side of the baffle (11) near the rotating platform (1). A connecting rod (112) that fits against the outer surface of the pressing block (111) is fixedly connected to one end of the rotating rod (22).

4. The multilayer circuit board processing technology based on a pad assembly structure according to claim 1, characterized in that: The inner wall surface of the sliding seat (252) is provided with a first inclined groove (2521), and the outer circumferential surface of the lifting rod (253) is provided with a second inclined groove (2531) that communicates with the inside of the first inclined groove (2521). The first inclined groove (2521) and the second inclined groove (2531) have the same slope. The inside of the second inclined groove (2531) is slidably connected to a limit post (254).

5. The multilayer circuit board processing technology based on a pad assembly structure according to claim 4, characterized in that: The upper surface of the rotating seat (23) is provided with a pad, a base plate and a cover plate, and the outer end of the lifting rod (253) is fixedly connected to a pressure plate (255) that fits against the outer surface of the cover plate.

6. The multilayer circuit board processing technology based on a pad assembly structure according to claim 5, characterized in that: A magnetic plate (26) is embedded on the outer surface of the base (21), and a magnetic block (261) is fixedly connected to the side of the lifting rod (253) near the base (21) and magnetically connected to the lower surface of the magnetic plate (26).

7. The multilayer circuit board processing technology based on a pad assembly structure according to claim 3, characterized in that: The upper surface of the baffle (11) is fixedly connected to a reset plate (262) which is magnetically connected to the upper surface of the pressure plate (255).

8. The multilayer circuit board processing technology based on a pad assembly structure according to claim 3, characterized in that: The side of the pressing block (111) near the rotating table (1) includes a descending surface (1111) and a rising surface (1112), and the descending surface (1111) near the rising surface (1112) adopts a bend design.

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