Semiconductor testing apparatus

Abstract

A semiconductor testing apparatus comprising: a chamber; at least one high temperature chuck located in the chamber; at least one low temperature chuck opposite the at least one high temperature chuck; at least one semiconductor testing board located between the at least one high temperature chuck and the at least one low temperature chuck; and a support configured to move the at least one semiconductor testing board within a space between the at least one high temperature chuck and the at least one low temperature chuck.

Description

Technical Field

[0001] Some exemplary embodiments of the present invention relate to test chambers, systems including the test chambers, and / or methods of operating the test chambers, and more specifically, to semiconductor testing equipment capable of controlling a test board configured to control the temperature in the test chamber to make the temperature uniform, improve the rate of temperature change of the internal temperature of the chamber rising to a high temperature or falling to a low temperature, and / or improve the rate of temperature transition between high and low temperatures expected and / or necessary for the test. Background Technology

[0002] Typically, functional tests can be performed to detect initial defects in semiconductor devices, such as integrated circuit (IC) chips. These functional tests include burn-in board tests that apply adverse conditions, such as adverse temperatures and / or adverse voltages.

[0003] Semiconductor devices can be functionally tested using semiconductor test equipment. Burn-in board testing, designed to detect initial semiconductor defects, may require extended test durations to maximize the productivity of the devices under test (DUTs) mounted on the board. For this purpose, multiple DUT boards can be stacked in multiple layers and tested simultaneously.

[0004] Semiconductor test equipment can test DUTs under harsher conditions than those encountered in normal operating environments (e.g., room temperature), enabling faster detection of errors that occur in semiconductor devices under normal operating conditions and prediction of potential defects that may appear in semiconductor devices after the DUTs are shipped.

[0005] Current semiconductor testing equipment can control the internal temperature of the chamber by utilizing thermal convection of air within the chamber via heaters or coolers.

[0006] Such semiconductor testing equipment can operate in temperatures ranging from -45°C to 125°C. Furthermore, when the internal temperature of the chamber is changed to a high or low temperature and / or transitions between high and low temperatures, temperature control via thermal convection may result in temperature variations across different areas of the cross-plate and / or between interlayer plates.

[0007] Furthermore, temperature control via air convection can lead to temperature non-uniformity throughout the chamber, including temperature non-uniformity between multilayer boards and / or between the locations of the DUT mounted on the boards in each layer. To achieve a uniform temperature distribution, this non-uniformity may necessitate extended and / or prolonged test durations. Summary of the Invention

[0008] At least one exemplary embodiment of the present invention provides a semiconductor testing apparatus for improving testing efficiency by reducing the rate of temperature change and / or temperature transition rate of a DUT (DUT) in a chamber.

[0009] At least one exemplary embodiment of the present invention provides a semiconductor testing apparatus that reduces and / or prevents temperature non-uniformity between different locations of a DUT mounted on a test board.

[0010] According to at least one exemplary embodiment of the present invention, a semiconductor testing apparatus is provided, the semiconductor testing apparatus comprising: a chamber; at least one high-temperature chuck located in the chamber; at least one low-temperature chuck opposite to the at least one high-temperature chuck; at least one semiconductor test plate located between the at least one high-temperature chuck and the at least one low-temperature chuck; and a support configured to move the at least one semiconductor test plate within the space between the at least one high-temperature chuck and the at least one low-temperature chuck.

[0011] According to at least one exemplary embodiment of the present invention, a semiconductor testing apparatus is provided for testing at least one device under test (DUT), the semiconductor testing apparatus comprising: a chamber having an internal space; a chuck assembly including at least one first chuck and at least one second chuck, the at least one first chuck and the at least one second chuck being alternately stacked in a vertical direction in the internal space, the chuck assembly being configured to conduct heat to the at least one DUT; at least one semiconductor test plate located between the at least one first chuck and the at least one second chuck, the at least one semiconductor test plate being configured to hold the at least one DUT; and a moving device configured to move at least one of the chuck assembly and the at least one semiconductor test plate such that the at least one semiconductor test plate is heated by at least one of the at least one first chuck and the at least one second chuck.

[0012] According to at least one exemplary embodiment of the present invention, a semiconductor testing apparatus is provided, the semiconductor testing apparatus comprising: a chamber having an internal space; at least one first chuck located in the internal space; a contact housing located on a lower surface of the at least one first chuck, the contact housing including a plurality of downwardly projecting contact protrusions; a semiconductor test board including a plurality of brackets configured to respectively accommodate a plurality of devices under test (DUTs), the semiconductor test board being configured to be electrically connected to the plurality of DUTs through the plurality of brackets; and a support configured to move the semiconductor test board such that the plurality of contact protrusions contact the plurality of DUTs.

[0013] According to at least one exemplary embodiment of the present invention, a system is provided, the system comprising: a chamber configured to hold a plurality of chuck assemblies, each chuck assembly including a first chuck and a second chuck; and a support configured to hold a plurality of semiconductor test boards, each semiconductor test board including a plurality of supports configured to hold a plurality of devices under test (DUTs), the support being further configured to move such that the plurality of semiconductor test boards are inserted into open spaces in the plurality of chuck assemblies.

[0014] Some example embodiments provide that the support is further configured to move such that the plurality of semiconductor test boards are moved closer to the first chuck included in the plurality of chuck assemblies.

[0015] Some example embodiments provide that the support is further configured to move such that the plurality of semiconductor test boards are moved closer to the second chuck included in the plurality of chuck assemblies.

[0016] Some example embodiments provide that the first chuck includes a plurality of protrusions, and the first chuck is configured to transfer heat to the plurality of protrusions.

[0017] Some example embodiments provide that the plurality of protrusions are configured to heat the plurality of DUTs in response to contact of the plurality of protrusions with the plurality of DUTs. Attached Figure Description

[0018] The above and other aspects, features, and advantages of one or more exemplary embodiments of the inventive concept will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of a semiconductor testing apparatus according to at least one exemplary embodiment of the present invention; Figure 2 According to at least one example embodiment Figure 1 A schematic perspective view of the alternating states of high-temperature chucks and low-temperature chucks in semiconductor testing equipment; Figure 3 According to at least one example embodiment Figure 1 A schematic perspective view of a semiconductor test board to be functionally tested in a vertical support in a semiconductor test equipment. Figure 4 This is a schematic perspective view of a test plate according to at least one example embodiment being inserted into the space between a high-temperature chuck and a low-temperature chuck; Figure 5 This is a schematic perspective view of a test board according to at least one exemplary embodiment of the concept of the present invention; Figure 6 This is a schematic diagram of a semiconductor test device driven according to at least one exemplary embodiment of the present invention. Figure 7 This is a schematic diagram showing the state in which a test board and a cryogenic chuck are adjacent in a semiconductor test apparatus according to at least one exemplary embodiment of the present invention. Figure 8 This is a schematic diagram showing the state in which a test board is adjacent to a high-temperature chuck in a semiconductor test apparatus according to at least one exemplary embodiment of the present invention. Figure 9 This is a schematic diagram of a semiconductor testing apparatus including a contact module according to at least one exemplary embodiment of the present invention. Figure 10 This is a schematic perspective view of a contact module according to at least one exemplary embodiment of the concept of the present invention; Figure 11 This is a schematic top view of a contact module according to at least one embodiment of the present invention. Figure 12 This is a schematic cross-sectional view of the operation of a contact module according to at least one exemplary embodiment of the present invention; Figure 13 This is a schematic perspective view of a contact module according to at least one exemplary embodiment of the concept of the present invention; Figure 14 This is a schematic top view of a contact module according to at least one exemplary embodiment of the concept of the present invention; Figure 15 This is a schematic cross-sectional view of the operation of a contact module according to at least one exemplary embodiment of the present invention; Figure 16 This is a schematic perspective view of a contact module according to at least one exemplary embodiment of the concept of the present invention; Figure 17 This is a schematic top view of a contact module according to at least one exemplary embodiment of the present invention; and Figure 18 This is a schematic cross-sectional view of the operation of a contact module according to at least one exemplary embodiment of the present invention. Detailed Implementation

[0019] In the following description, some exemplary embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0020] This document describes some exemplary embodiments of the inventive concept to provide a description of the inventive concept to those skilled in the art. Therefore, for clarity of description, the shapes and dimensions of components in the drawings may be exaggerated, and components indicated by the same reference numerals in the drawings may be the same components. One or more exemplary embodiments of the inventive concept can be modified into many different forms and / or can be varied.

[0021] As used herein, the term "connection" can refer not only to "direct connection" but also to "indirect connection" via adhesive layers, etc. The term "electrical connection" can include both cases where components are "physically connected" and cases where components are "not physically connected".

[0022] As used herein, the terms "first," "second," etc., can be used to distinguish a component from other components and may not limit the order and / or importance associated with the components. In some cases, without departing from the scope of the exemplary embodiments, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component.

[0023] The terminology used herein describes specific example embodiments only, and the inventive concept is not limited thereto. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are also intended to include the plural forms.

[0024] Semiconductor testing equipment Figure 1 This is a schematic perspective view of a semiconductor testing apparatus according to at least one exemplary embodiment of the present invention. Figure 2 According to at least one example embodiment Figure 1 A schematic perspective view of the alternating states of high-temperature chucks and low-temperature chucks in a semiconductor testing device. Figure 3 According to at least one example embodiment Figure 1 A schematic perspective view of a semiconductor testing equipment in which a test board to be functionally tested is positioned in a vertical support. Figure 4 It is a schematic perspective view of a test plate according to at least one example embodiment being inserted into the space between a high-temperature chuck and a low-temperature chuck.

[0025] The semiconductor testing apparatus 1 according to at least one exemplary embodiment of the present invention includes a chamber 20, at least one high-temperature chuck 42, at least one low-temperature chuck 44, at least one semiconductor test plate 60 and / or at least one support 80, etc., but the exemplary embodiment is not limited thereto.

[0026] Semiconductor test equipment 1 may be a device capable of performing various semiconductor functional tests (including aging tests, etc.) to identify initial defects in semiconductor devices before supplying semiconductor integrated circuit (IC) devices, semiconductor packages, etc. to consumers and / or before installing the aforementioned devices, packages, etc. in a system.

[0027] Here, during aging tests, after semiconductor chips have been packaged and separated from wafers using assembly processes, specific stress environments can be created to identify defective and / or faulty devices. Aging tests can be, but are not limited to, inspections used to detect the presence of final defects in semiconductor packages manufactured in package form. Through aging tests, the reliability of semiconductors can be improved and / or ensured, thereby allowing electronic devices such as PCs, memory devices, and / or IT products in which semiconductors are installed to operate with reduced errors and / or without errors.

[0028] In at least one exemplary embodiment of the present invention, one or more devices (such as semiconductor chips and / or semiconductor packages) tested by semiconductor test equipment 1 are defined and described as devices under test (DUT).

[0029] The chamber 20 may have an internal space, and at least one high-temperature chuck 42 and / or at least one low-temperature chuck 44 may be located at intervals inside the chamber 20 so as to be opposite each other.

[0030] The high-temperature chuck 42 and the low-temperature chuck 44 can be attached, connected, and / or fixed by at least one slot and / or frame structure 45 formed in the wall of the chamber 20. In at least one example embodiment, the high-temperature chuck 42 and the low-temperature chuck 44 are vertically opposite each other. However, the example embodiments are not limited thereto, and for example, when the high-temperature chuck 42 and the low-temperature chuck 44 are configured to perform heat transfer using a heat conduction method, the high-temperature chuck 42 and the low-temperature chuck 44 can also be horizontally opposite each other, etc.

[0031] The semiconductor test board 60 may include at least one DUT u and may be located at the interval between the high-temperature chuck 42 and the low-temperature chuck 44, etc.

[0032] The high-temperature chuck 42 and / or the low-temperature chuck 44 may be heat conductors, but the example embodiment is not limited thereto, and for example, other types of functional chucks may be used for other functional tests, such as voltage tests. Therefore, the high-temperature chuck 42 and the low-temperature chuck 44 may be defined as a first chuck or a second chuck, respectively.

[0033] Here, the first chuck and the second chuck can perform different functions, but they can also perform the same function.

[0034] Furthermore, to test a relatively large number of devices simultaneously, multiple first chucks and second chucks can be configured. In aging tests, multiple pairs of first chucks and second chucks, in which high-temperature chucks 42 and low-temperature chucks 44 are positioned opposite each other, can be configured. In this case, a single semiconductor test board 60 can be inserted into each interval, or in other words, a semiconductor test board 60 can be inserted between each pair of high-temperature chucks 42 and low-temperature chucks 44, etc.

[0035] Burn-in board testing may be expected and / or require relatively long testing times, and therefore may be expected and / or required to increase and / or maximize the number of DUTs mounted on the semiconductor test board 60 to increase and / or improve productivity. For this purpose, multiple semiconductor test boards 60 can be stacked in multiple layers and tested simultaneously. For example, a 24-layer semiconductor test board 60 can be inserted into pairs of opposing high-temperature chucks 42 and low-temperature chucks 44 to perform testing, but the example embodiment is not limited to this.

[0036] The DUT u of the semiconductor test board 60 can be in contact with the high-temperature chuck 42 and the low-temperature chuck 44 and / or can be adjacent to the high-temperature chuck 42 and the low-temperature chuck 44 in order to receive high-temperature heat and / or low-temperature heat, so that the temperature of the DUT u can rise and / or fall rapidly.

[0037] The semiconductor test equipment 1 may include a moving module (e.g., a moving device, etc.) for adjusting the position of the DUT u of the semiconductor test board 60 to contact and / or be adjacent to the high-temperature chuck 42 and / or low-temperature chuck 44, etc.

[0038] First, when all the first and second chucks in chamber 20 are defined as chuck assemblies 40, the moving module can move at least one of the chuck assembly 40 and / or the semiconductor test board 60, etc., but is not limited thereto. Additionally, the moving module can move the chuck assembly 40 and / or move the first and second chucks to the frame structure 45 to which they are attached, connected, and / or fixed via slots, so that they are adjacent to the semiconductor test board 60, etc.

[0039] Furthermore, the moving module can move the semiconductor test board 60. In this case, the moving module may include a support 80 to which the semiconductor test board 60 is detachably attached, connected, and / or secured, but the example embodiment is not limited thereto.

[0040] The support 80 can be configured such that the semiconductor test board 60 is positioned at an interval corresponding to the space between the pair of first and second chucks (i.e., high-temperature chuck 42 and low-temperature chuck 44, etc.).

[0041] High-temperature heat conduction can be performed when the DUT u and the high-temperature chuck 42 are brought into proximity or contact with each other by raising and / or lowering the semiconductor test plate 60. Low-temperature heat conduction can be performed when the DUT u and the low-temperature chuck 44 are brought into proximity or contact with each other by raising and / or lowering the semiconductor test plate 60.

[0042] Figure 5 This is a schematic perspective view of a test board according to at least one exemplary embodiment of the concept of the present invention.

[0043] Figure 5 The semiconductor test board 60 may include, but is not limited to, a test board 62 and / or at least one socket 65, etc.

[0044] Current and / or voltage (e.g., power, electricity, etc.) can flow through the DUT u via the test board 62. One or more DUT u can be housed in one or more of the brackets 65, and the DUT u can be electrically connected to the test board 62.

[0045] The bracket 65 may have a container shape with high sides to accommodate the DUT u, and the bracket 65 may have a lower surface that includes interconnect paths electrically connected to the test board 62, but the example embodiment is not limited thereto.

[0046] Figure 6 This is a schematic diagram of a semiconductor test device in a driven state according to at least one example embodiment of the present invention. Figure 7 This is a schematic diagram of a semiconductor testing apparatus according to at least one exemplary embodiment of the present invention, showing a state in which a test board and a cryogenic chuck are adjacent. Figure 8 This is a schematic diagram of a semiconductor testing apparatus according to at least one exemplary embodiment of the present invention, showing a state in which a test board is adjacent to a high-temperature chuck.

[0047] Reference Figure 6 and Figure 7 The state of the semiconductor test device 1 driven according to at least one example embodiment of the present invention is described in detail.

[0048] The holder 65, which houses the DUT u, can be mounted on the test board 62. Furthermore, the semiconductor test board 60 can be attached to and / or fixed to the bracket 80, and the semiconductor test board 60 can be positioned between a pair of high-temperature chucks 42 and low-temperature chucks 44.

[0049] When the semiconductor test board 60 is positioned between the high-temperature chuck 42 and the low-temperature chuck 44, the DUT u can be exposed through the portion of the bracket 65 facing the opening of the high-temperature chuck 42, and the test board 62 can be positioned oriented toward the low-temperature chuck 44, but the example embodiment is not limited thereto.

[0050] When performing a high-temperature conversion, the support 80 can be driven and / or moved to a position adjacent to the high-temperature chuck 42 of the DUT u. When performing a low-temperature conversion, the support 80 can be driven and / or moved to a position adjacent to the low-temperature chuck 44 of the DUT u.

[0051] The actuation (e.g., heating) of the high-temperature chuck 42 (e.g., a heat conductor) may be controlled by at least one of a high-temperature chiller, a thermoelectric device, and / or a heater, but is not limited thereto.

[0052] Now for reference Figure 6 In at least one example embodiment, high-temperature refrigerant may be allowed to flow via high-temperature cooler 70 to and / or through high-temperature chuck 42, thereby increasing the temperature of DUT u. In other words, high-temperature cooler 70 can heat the refrigerant to a desired high temperature and supply the heated refrigerant to high-temperature chuck 42, etc. Low-temperature refrigerant may be allowed to flow via low-temperature cooler 90 to and / or through low-temperature chuck 44, thereby decreasing the temperature of DUT u. In other words, low-temperature cooler 90 can cool and / or chill the refrigerant and supply the cooled and / or chilled refrigerant to low-temperature chuck 44, etc. However, the example embodiments are not limited thereto, and high-temperature chuck 42 and / or low-temperature chuck 44 may be heated and cooled separately by alternative methods (such as a refrigerant-free method, etc.).

[0053] like Figure 7 As shown, when the semiconductor test board 60 is lowered by driving and / or moving the support 80, the DUT u and the cryogenic chuck 44 can be adjacent to each other or can be in contact with each other, so that cryogenic heat conduction can be performed.

[0054] In this case, the low-temperature heat from the cryogenic chuck 44 can be conducted to the DUT u (e.g., heat from the relatively high temperature of the DUT u can be transferred to the relatively low-temperature cryogenic chuck 44), allowing the temperature of the DUT u to decrease and / or decrease rapidly.

[0055] In addition, such as Figure 8 As shown, when the semiconductor test board 60 is raised by driving and / or moving the support 80, the DUTu and the high-temperature chuck 42 can be adjacent to each other or can be in contact with each other, so that high-temperature heat conduction can be performed.

[0056] In this situation, the high temperature heat from the high temperature chuck 42 can be conducted to the DUT u (e.g., the relatively high temperature heat from the high temperature chuck 42 can be transferred to the relatively low temperature DUT u), causing the temperature of the DUT u to rise and / or rise rapidly.

[0057] According to the aging test using this heat conduction method, the test temperature transition range and transition time of DUT u can be, for example, between approximately -25°C and 90°C within 5 minutes, and between approximately -45°C and 125°C within 8 minutes, but the example embodiment is not limited thereto.

[0058] In this case, heat can be transferred by conduction, allowing the entire area of ​​the semiconductor test board 60 to have a temperature variation of ±3°C, and it can be maintained more uniformly compared to heat transfer methods via convection.

[0059] The DUT u can reduce and / or prevent direct contact with the high-temperature chuck 42 by avoiding heat conduction to the high-temperature chuck 42 due to the container shape of the bracket 65. Therefore, a contact module (e.g., contact housing, etc.) that can directly transfer heat from the high-temperature chuck 42 to the DUT u can be located between the high-temperature chuck 42 and the DUT u.

[0060] The contact module (e.g., contact housing, etc.) will be described in detail below.

[0061] Figure 9 This is a schematic diagram of a semiconductor testing apparatus including a contact module according to at least one exemplary embodiment of the present invention. Figure 10 This is a schematic perspective view of a contact module according to at least one exemplary embodiment of the present invention. Figure 11 This is a schematic top view of a contact module according to at least one exemplary embodiment of the present invention. Figure 12 This is a schematic cross-sectional view of the operation of a contact module according to at least one exemplary embodiment of the present invention.

[0062] refer to Figures 9 to 12 The semiconductor testing apparatus 1 may also include a contact module 120 located on the lower surface of the high-temperature chuck 42. Components other than the contact module 120 may be substantially the same as or similar to the components described above, and therefore their repeated descriptions will be omitted.

[0063] Depending on the type of test being performed, the cryogenic chuck 44 may not be used, but the example embodiment is not limited thereto.

[0064] like Figure 9 As shown, the semiconductor test board 60 can be raised by driving and / or moving the support 80, so that the DUT u and the high-temperature chuck 42 can come into direct contact with each other due to the contact module 120.

[0065] In this case, the high temperature heat from the high temperature chuck 42 can be conducted to the DUT u through the contact module 120, allowing the temperature of the DUT u to rise and / or rise more rapidly.

[0066] Figures 10 to 12 The shape of the contact module 120 according to at least one example embodiment is shown. Figures 10 to 12 The contact module 120 may include, but is not limited to, a heat transfer plate 122 and / or a plurality of contact protrusions 125.

[0067] The heat transfer plate 122 may be a heat conductor located on the lower surface of the high-temperature chuck 42, and may directly transfer the high-temperature heat of the high-temperature chuck 42 to the DUT u by conduction, but the example embodiment is not limited thereto.

[0068] Multiple contact protrusions 125 may each extend toward at least one corresponding DUT u at a position corresponding to at least one bracket 65 on the semiconductor test board 60, or in other words, multiple contact protrusions 125 may extend downward toward the semiconductor test board 60, and multiple contact protrusions 125 may be aligned with the positions of brackets 65 on the semiconductor test board 60.

[0069] When heat from the high-temperature chuck 42 is transferred to the plurality of contact protrusions 125, the plurality of contact protrusions 125 may extend and expand due to the heat transferred from the high-temperature chuck 42 and may come into contact with at least one DUT u, so that heat transfer and / or high-rate heat transfer can be performed in a direct conduction manner.

[0070] Figure 13 This is a schematic perspective view of a contact module according to at least one exemplary embodiment of the present invention. Figure 14 This is a schematic top view of a contact module according to at least one exemplary embodiment of the present invention. Figure 15 This is a schematic cross-sectional view of the operation of a contact module according to at least one exemplary embodiment of the present invention.

[0071] Figures 13 to 15 The shape of a contact module 140 (e.g., a contact housing, etc.) of at least one example embodiment is shown. Figures 13 to 15 The contact module 140 (e.g., contact device, etc.) may include, but is not limited to, an outer frame 142, a plurality of contact protrusions 145, a first connecting strip 146 and / or a second connecting strip 148, etc.

[0072] The outer frame 142 may be a frame attached to the high-temperature chuck 42 and / or fixed below the high-temperature chuck 42.

[0073] Multiple contact protrusions 145 may extend toward a semiconductor test board 60, which houses at least one DUT u stored in multiple holders 65.

[0074] Multiple first connecting bars 146 and multiple second connecting bars 148 can support multiple contact protrusions 145, so that the multiple contact protrusions 145 can be positioned inside the outer frame 142.

[0075] Multiple first connecting strips 146 may extend from the outer frame 142 and may be connected to multiple contact protrusions 145, and / or multiple second connecting strips 148 may be connected between two of the multiple contact protrusions 145, but the example embodiment is not limited thereto.

[0076] The first connecting strip 146 and the second connecting strip 148 may have a height equal to or less than the height of the outer frame 142, and thus may be connected to the lower and / or side positions of the plurality of contact protrusions 145. Furthermore, the first connecting strip 146 and / or the second connecting strip 148 may be formed of a material capable of transferring heat to the heat conductor (such as a thin metal strip), but are not limited thereto.

[0077] Here, the first connecting strip 146 and the second connecting strip 148 may be in a grid shape to form a space S between the first connecting strip 146 and the second connecting strip 148, but the example embodiment is not limited to this.

[0078] When heat transfer contact occurs in a high-temperature environment, the space S can provide elasticity, thereby further reducing the occurrence of cracks and / or thermal deformation in the contact module 140 compared to the case where the plate is used as a single medium for the heat of one or more DUTs.

[0079] The first connecting strip 146 and / or the second connecting strip 148 can be recovered and / or easily recovered after thermal deformation.

[0080] like Figure 15 As shown by the dashed lines, when the high-temperature chuck 42 contacts one or more DUTs u, the plurality of contact protrusions 145 may extend and / or expand due to the heat transferred from the high-temperature chuck 42 to one or more DUTs u, so that high-rate heat transfer can be performed in a direct conduction manner, but the example embodiment is not limited thereto.

[0081] Figure 16This is a schematic perspective view of a contact module according to at least one exemplary embodiment of the present invention. Figure 17 This is a schematic top view of a contact module according to at least one exemplary embodiment of the present invention. Figure 18 This is a schematic cross-sectional view of the operation of a contact module according to at least one exemplary embodiment of the present invention.

[0082] Figures 16 to 18 The shape of the contact module 160 according to at least one example embodiment is shown. Figures 16 to 18 The contact module 160 may include an outer frame 162, multiple contact protrusions 165, a first connecting strip 166 and / or a second connecting strip 168, etc., but is not limited thereto.

[0083] The outer frame 162 may be a frame attached to and / or fixed below the high-temperature chuck 42, but the example embodiment is not limited thereto.

[0084] Multiple contact protrusions 165 may extend toward the DUT u at positions corresponding to the bracket 65.

[0085] The first connecting bar 166 and the second connecting bar 168 can support multiple contact protrusions 165, so that the multiple contact protrusions 165 can be positioned in the outer frame 162.

[0086] The first connecting strip 166 can extend from the outer frame 162 and can be spirally connected to a plurality of contact protrusions 165, and the second connecting strip 168 can be spirally connected between the plurality of contact protrusions 165.

[0087] The first connecting strip 166 and the second connecting strip 168 may have a height equal to or less than the height of the outer frame 162, and therefore may be connected to the lower and / or side locations of the plurality of contact protrusions 165, but are not limited thereto. Furthermore, the first connecting strip 166 and the second connecting strip 168 may comprise materials capable of transferring heat to the heat conductor (such as thin metal strips), but the exemplary embodiments are not limited thereto.

[0088] Here, the first connecting bar 166 and / or the second connecting bar 168 may be connected in a spiral shape to form a space S between the first connecting bar 166 and the second connecting bar 168, etc.

[0089] When heat transfer contacts occur in a high-temperature environment, the space S can provide elasticity, thereby further reducing the occurrence of cracks and / or thermal deformation in the contact module 160 compared to the case where a single plate is used as the heat transfer medium.

[0090] In addition, due to the shape of the first connecting strip 166 and / or the second connecting strip 168, the first connecting strip 166 and / or the second connecting strip 168 can be more easily restored after thermal deformation.

[0091] like Figure 17 and Figure 18 As indicated by the arrows and dashed lines, multiple contact protrusions 165 can extend and / or expand during rotation due to heat transferred from the high-temperature chuck 42, and can contact the DUT u, thereby enabling improved heat transfer and / or high-rate heat transfer in a direct conduction manner.

[0092] According to some exemplary embodiments of the present invention, in a semiconductor testing apparatus, a semiconductor test board can move between a high-temperature chuck and a low-temperature chuck to reduce the rate of temperature change and / or the temperature transition rate of the DUT in the chamber, thereby improving the testing efficiency of the DUT and / or reducing the amount of time required to perform tests on the DUT.

[0093] In addition, the DUT can use a conduction method to transfer heat, in which a high-temperature chuck and / or a low-temperature chuck are in contact with each other and / or substantially in contact with each other, thereby performing a high-rate temperature conversion.

[0094] In addition, the heat transfer contact module on the lower surface of the high-temperature chuck allows heat to be directly transferred to the DUT mounted on the test board, thereby reducing and / or preventing temperature non-uniformity based on the location of the DUT mounted on the test board.

[0095] While some exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the inventive concept as defined by the appended claims.

Claims

1. A semiconductor testing apparatus, the semiconductor testing apparatus comprising: Chamber; At least one high-temperature chuck, said at least one high-temperature chuck being located in the chamber; At least one cryogenic chuck, the at least one cryogenic chuck being opposite to the at least one high-temperature chuck; At least one semiconductor test board, the at least one semiconductor test board being located between the at least one high-temperature chuck and the at least one low-temperature chuck; as well as A support is configured to move the at least one semiconductor test board within the space between the at least one high-temperature chuck and the at least one low-temperature chuck.

2. The semiconductor testing equipment according to claim 1, wherein, The at least one high-temperature chuck may be multiple high-temperature chucks; The at least one cryogenic chuck may be multiple cryogenic chucks; The plurality of high-temperature chucks and the plurality of low-temperature chucks are stacked alternately in the vertical direction; The at least one semiconductor test board may be multiple semiconductor test boards; and A single semiconductor test board is located between a high-temperature chuck and a low-temperature chuck in a pair of high-temperature chucks.

3. The semiconductor testing equipment according to claim 1, further comprising: At least one heating device, the at least one heating device being configured to heat the heat conductor included in the at least one high-temperature chuck; and The heating device is at least one of a high-temperature cooler, a heater, or a thermoelectric device.

4. The semiconductor testing equipment according to claim 1, further comprising: At least one cooler, the at least one cooler being configured to cool the heat conductors included in the at least one cryogenic chuck.

5. The semiconductor testing equipment according to claim 1, wherein, The at least one semiconductor test board includes: Test board; and Multiple brackets electrically connected to the test board, the multiple brackets being configured to accommodate multiple devices under test.

6. The semiconductor testing equipment according to claim 5, wherein, The support is further configured to rise or fall, wherein rising of the support causes the plurality of devices under test to receive high-temperature heat from the at least one high-temperature chuck, and falling of the support causes the plurality of devices under test to receive low-temperature heat from the at least one low-temperature chuck.

7. The semiconductor testing apparatus according to claim 5, further comprising: A contact housing, located on the lower surface of the at least one high-temperature chuck, the contact housing comprising: A heat transfer plate, located on the lower surface of the at least one high-temperature chuck, is configured to transfer heat from the at least one high-temperature chuck to the plurality of devices under test. Multiple contact protrusions extend toward the test plate and are aligned with the multiple supports. The plurality of contact protrusions extend or expand due to the heat transferred from the heat transfer plate to the plurality of devices under test.

8. The semiconductor testing apparatus according to claim 5, further comprising: A contact housing, located on the lower surface of the high-temperature chuck, the contact housing comprising: outer frame; Multiple contact protrusions extend toward the test plate and are aligned with the multiple supports; A plurality of first connecting strips, the plurality of first connecting strips extending from the outer frame, the plurality of first connecting strips connecting to the plurality of contact protrusions; and A plurality of second connecting strips, each of the plurality of second connecting strips being connected between at least two of the plurality of contact protrusions. The height of the plurality of first connecting strips and the plurality of second connecting strips is less than or equal to the height of the outer frame. The plurality of first connecting strips, the plurality of second connecting strips, and the plurality of contact protrusions are connected to form a plurality of grid shapes with internal open spaces, and The plurality of contact protrusions extend or expand due to the heat transferred from the at least one high-temperature chuck.

9. The semiconductor testing apparatus according to claim 5, further comprising: A contact housing, located on the lower surface of the at least one high-temperature chuck, the contact housing comprising: outer frame; Multiple contact protrusions extend toward the test plate and are aligned with the multiple supports; A plurality of first connecting strips extending from the outer frame and spirally connected to the plurality of contact protrusions; and A plurality of second connecting strips are spirally connected between the plurality of contact protrusions. The height of the plurality of first connecting strips and the plurality of second connecting strips is less than or equal to the height of the outer frame. The plurality of first connecting strips, the plurality of second connecting strips, and the plurality of contact protrusions are interconnected to form an open space, and The plurality of contact protrusions extend or expand as they rotate due to the heat transferred from the at least one high-temperature chuck.

10. A semiconductor testing apparatus, the semiconductor testing apparatus being used to test at least one device under test, the semiconductor testing apparatus comprising: A chamber having an internal space; A chuck assembly comprising at least one first chuck and at least one second chuck, the at least one first chuck and the at least one second chuck being alternately stacked in the vertical direction in the internal space, the chuck assembly being configured to conduct heat to the at least one device under test; At least one semiconductor test board, the at least one semiconductor test board being located between the at least one first chuck and the at least one second chuck, the at least one semiconductor test board being configured to hold the at least one device under test; as well as A moving device configured to move at least one of the chuck assembly and the at least one semiconductor test plate, such that the at least one semiconductor test plate is heated by at least one of the at least one first chuck and the at least one second chuck.

11. The semiconductor testing apparatus according to claim 10, wherein, The mobile device includes a support frame; The bracket is configured as follows: Contains the semiconductor test board, and The semiconductor test board is moved between the at least one first chuck and the at least one second chuck; The at least one first chuck is configured to: apply high-temperature heat conduction to the at least one device under test in response to the at least one first chuck being adjacent to the at least one device under test, or in response to the at least one first chuck contacting the at least one device under test; and The at least one second chuck is configured to apply low-temperature heat conduction to the at least one device under test in response to the at least one second chuck being adjacent to the at least one device under test, or in response to the at least one second chuck being in contact with the at least one device under test.

12. The semiconductor testing apparatus according to claim 11, further comprising: A heating device configured to control the temperature of a first heat conductor included in the at least one first chuck, the heating device being at least one of a high-temperature cooler or a heater; as well as A cryogenic cooler configured to control the temperature of a second heat conductor included in the at least one second chuck.

13. The semiconductor testing apparatus according to claim 10, wherein, The semiconductor test board includes: Test board; and Multiple brackets electrically connected to the test board, the multiple brackets being configured to accommodate multiple devices under test, the multiple devices under test including the at least one device under test.

14. The semiconductor testing apparatus according to claim 13, further comprising: A contact housing, located on the lower surface of the at least one first chuck, the contact housing comprising: A heat transfer plate, located on the lower surface of the at least one first chuck, the heat transfer plate being configured to transfer heat from the at least one first chuck to a plurality of contact protrusions; and The plurality of contact protrusions extend toward the test plate and are aligned with the plurality of supports. The plurality of contact protrusions extend or expand due to the heat transferred from the heat transfer plate.

15. The semiconductor testing apparatus according to claim 13, further comprising: A contact housing, located on the lower surface of the first chuck, the contact housing comprising: outer frame; Multiple contact protrusions extend toward the test plate and are aligned with the multiple supports; A plurality of first connecting strips extending from the outer frame and spirally connected to the plurality of contact protrusions; and A plurality of second connecting strips are spirally connected between the plurality of contact protrusions. The height of the plurality of first connecting strips and the plurality of second connecting strips is less than or equal to the height of the outer frame. The plurality of first connecting strips, the plurality of second connecting strips, and the plurality of contact protrusions are connected to form a grid shape with an internal open space, and The plurality of contact protrusions extend or expand due to heat transferred from the at least one first chuck.

16. The semiconductor testing apparatus according to claim 13, further comprising: A contact housing, located on the lower surface of the first chuck, the contact housing comprising: outer frame; Multiple contact protrusions extend toward the test plate and are aligned with the multiple supports; A plurality of first connecting strips extending from the outer frame and spirally connected to the plurality of contact protrusions; and A plurality of second connecting strips are spirally connected between the plurality of contact protrusions. The height of the plurality of first connecting strips and the plurality of second connecting strips is less than or equal to the height of the outer frame. The plurality of first connecting strips, the plurality of second connecting strips, and the plurality of contact protrusions are spirally connected to each other and form an open space, and The plurality of contact protrusions extend or expand as they rotate due to heat transferred from the at least one first chuck.

17. A semiconductor testing apparatus, the semiconductor testing apparatus comprising: A chamber having an internal space; At least one first chuck, the at least one first chuck being located in the internal space; A contact housing located on the lower surface of the at least one first chuck, the contact housing including a plurality of downwardly projecting contact protrusions; A semiconductor test board, the semiconductor test board including a plurality of brackets configured to respectively accommodate a plurality of devices under test, the semiconductor test board being configured to be electrically connected to the plurality of devices under test through the plurality of brackets; as well as A support is configured to move the semiconductor test board such that the plurality of contact protrusions contact the plurality of devices under test.

18. The semiconductor testing apparatus according to claim 17, wherein, The contact housing includes a heat transfer plate configured to transfer heat from the at least one first chuck. The plurality of contact protrusions extend toward the semiconductor test plate, and the plurality of contact protrusions are aligned with the plurality of brackets; and The plurality of contact protrusions extend or expand due to the heat transferred from the heat transfer plate.

19. The semiconductor testing apparatus according to claim 18, wherein, The contact housing includes: outer frame; A plurality of first connecting strips, the plurality of first connecting strips extending from the outer frame, the plurality of first connecting strips connecting to the plurality of contact protrusions; and A plurality of second connecting strips are connected between the plurality of contact protrusions. The height of the plurality of first connecting strips and the plurality of second connecting strips is less than or equal to the height of the outer frame. The plurality of first connecting strips, the plurality of second connecting strips, and the plurality of contact protrusions are connected to form a plurality of grid shapes with internal open spaces, and The plurality of contact protrusions extend or expand due to the heat transferred from the heat transfer plate.

20. The semiconductor testing apparatus according to claim 18, wherein, The contact housing includes: outer frame; A plurality of first connecting strips extending from the outer frame and spirally connected to the plurality of contact protrusions; and A plurality of second connecting strips are spirally connected between the plurality of contact protrusions. The height of the plurality of first connecting strips and the plurality of second connecting strips is less than or equal to the height of the outer frame. The plurality of first connecting strips, the plurality of second connecting strips, and the plurality of contact protrusions are spirally connected to each other, and The plurality of contact protrusions extend or expand as they rotate due to the heat transferred from the heat transfer plate.

Images