Circuit printed board assembly, heating control circuit and control method thereof
By introducing heating resistors and conductive patterns into the circuit printed circuit board assembly, combined with over-temperature protection circuitry, the problem of electronic components failing to function properly in cold environments was solved, achieving efficient and low-cost heating control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GETAC TECH CORP
- Filing Date
- 2024-11-22
- Publication Date
- 2026-05-22
AI Technical Summary
In cold regions, the operating temperature of electronic components may be lower than their normal operating range, causing the components to malfunction. Existing heating solutions suffer from problems such as difficulty in alignment, fixing, high cost, and low heating efficiency.
A circuit printed circuit board assembly is designed, comprising a circuit board, a heating resistor, and a switch. The heat generated by the heating resistor is conducted to the conductive pattern through a via, and the conductive pattern is used to heat the component. The heating process is controlled by an over-temperature protection circuit to ensure that heating stops after the target temperature is reached.
It achieves effective heating of electronic components, solves the problem of components not working properly in cold environments, and at the same time reduces heating costs and improves heating efficiency.
Smart Images
Figure CN122073767A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a printed circuit board assembly, a heating control circuit, and a control method thereof, and particularly to a printed circuit board assembly with heating function, a heating control circuit, and a control method thereof. Background Technology
[0002] Today, electronic components typically operate within a certain temperature range. However, in some cold regions, extremely low temperatures may fall below the lower limit of the operating temperature range of electronic components, causing them to malfunction.
[0003] For small, scattered heating points in the component mounting area, there are often problems such as difficulty in alignment, fixing, high cost, and low heating efficiency. Therefore, how to provide a circuit board assembly to solve the above problems is an important issue in this field. Summary of the Invention
[0004] This disclosure provides a printed circuit board assembly including a circuit board, a heating resistor, and a switch. The circuit board includes a component layer, a signal layer, a conductive layer, and at least one via. The component layer has mounting areas for mounting components. The signal layer includes a first signal line and a second signal line. The conductive layer is disposed between the component layer and the signal layer and includes conductive patterns. The at least one via connects the first signal line to the conductive patterns. A first end of the heating resistor is electrically connected to the first signal line, and a second end of the heating resistor is electrically connected to the second signal line. The conductive patterns, the at least one via, the first signal line, the heating resistor, the switch, and the second signal line are electrically connected in series between a power supply voltage terminal and a ground terminal.
[0005] In some embodiments, when the switch is turned on according to a control signal, current flows from the power supply voltage terminal through the switch and the heating resistor to the ground terminal.
[0006] In some embodiments, when the switch is turned on according to a control signal, the heating resistor generates heat energy according to the current, and at least one via is used to conduct the heat energy generated by the heating resistor to the conductive pattern.
[0007] In some embodiments, the conductive pattern is a thermal conductor.
[0008] In some embodiments, the circuit board further includes a first insulating layer and at least one second insulating layer. The first insulating layer is disposed between the component layer and the conductive layer. At least the second insulating layer is disposed between the signal layer and the conductive layer.
[0009] In some embodiments, the switch is electrically connected between the second signal line and the ground terminal, and the conductive pattern is electrically connected to the power supply voltage terminal.
[0010] In some embodiments, when the switch is turned on according to a control signal, current flows from the power supply voltage terminal through a conductive pattern, at least one via, a first signal line, a heating resistor, a second signal line, and the switch to the ground terminal.
[0011] In some embodiments, the switch is electrically connected between the power supply voltage terminal and the second signal line, and the conductive pattern is electrically connected to the ground terminal.
[0012] In some embodiments, when the switch is turned on according to a control signal, current flows from the power supply voltage terminal through the switch, the second signal line, the heating resistor, the first signal line, at least one via and the conductive pattern to the ground terminal.
[0013] In some embodiments, the switch is electrically connected between the power supply voltage terminal and the conductive pattern, and the second signal line is electrically connected to the ground terminal.
[0014] In some embodiments, when the switch is turned on according to a control signal, current flows from the power supply voltage terminal through the switch, the conductive pattern, at least one via, the first signal line, the heating resistor, and the second signal line to the ground terminal.
[0015] In some embodiments, the switch is electrically connected between the conductive pattern and the ground terminal, and the second signal line is electrically connected to the power supply voltage terminal.
[0016] In some embodiments, when the switch is turned on according to a control signal, current flows from the second signal line, the heating resistor, the first signal line, at least one via, the conductive pattern, and the switch to the ground terminal.
[0017] In some embodiments, the conductive pattern and the element at least partially overlap in vertical projection.
[0018] Another embodiment of this disclosure provides a heating control circuit. The heating control circuit includes a heating resistor, a switch, and an over-temperature protection circuit. The switch and the heating resistor are electrically connected in series between a power supply voltage terminal and a ground terminal, and the switch is turned on according to a control signal. The over-temperature protection circuit is electrically connected between the heating resistor and the control terminal of the switch, and is used to control the switch to turn off when the temperature of the heating resistor reaches a threshold value.
[0019] Another embodiment of this disclosure provides a control method for a heating control circuit. The heating control circuit includes a heating resistor and a switch electrically connected in series between a power supply voltage terminal and a ground terminal, a temperature protection circuit electrically connected between the control terminals of the heating resistor and the switch, and a controller electrically connected to the control terminal of the switch. The control method includes the following steps: The controller turns on the switch based on temperature data, causing current to flow from the power supply voltage terminal, the heating resistor, and the switch to the ground terminal. The heating resistor generates heat based on the current. The temperature protection circuit turns off the switch when the temperature of the heating resistor reaches a threshold value.
[0020] In summary, the circuit board assembly disclosed herein conducts heat generated by the heating resistor through vias to the conductive patterns adjacent to the component layer, thereby heating the components. The heating control circuit and control method disclosed herein can provide heating functionality and pause heating when the target temperature is reached. Attached Figure Description
[0021] To make the above and other objects, features, advantages and embodiments of this disclosure more apparent and understandable, the accompanying drawings are described below:
[0022] Figure 1A and Figure 1B This is a schematic diagram of the front and back sides of a circuit printed circuit board assembly according to some embodiments of the present disclosure.
[0023] Figure 2 This is a schematic diagram of a printed circuit board assembly according to some embodiments of the present disclosure.
[0024] Figure 3A This is a schematic diagram of the functional blocks of a heating control circuit according to some embodiments of the present disclosure.
[0025] Figure 3B This is a schematic diagram of the functional blocks of a heating control circuit according to some embodiments of the present disclosure.
[0026] Figures 4A to 4D This is a schematic diagram of different architectures of circuit printed circuit board assemblies and control circuits according to some embodiments of the present disclosure.
[0027] Figure 5 This is a schematic diagram of a heating control circuit according to some embodiments of the present disclosure.
[0028] Figure 6 This is a schematic diagram of a control method for a heating control circuit according to some embodiments of the present disclosure.
[0029] Explanation of reference numerals in the attached figures:
[0030] To make the above and other objects, features, advantages and embodiments of this disclosure more apparent and understandable, the appended symbols are explained as follows:
[0031] 100, 200: Circuit board assembly
[0032] 102: Components
[0033] 104: Installation Area
[0034] 106: Circuit Board
[0035] 108: Top Plate
[0036] 110: Area
[0037] 112, 112a~112d: Heating resistors
[0038] 116: First signal line
[0039] 118: Second signal line
[0040] 120: Bottom Floor
[0041] 202: Component Layer
[0042] 204, 207, 210: Insulation layer
[0043] 206, 208, 209: Conductive layer
[0044] 207: Conductive Pattern
[0045] 212: Signal Layer
[0046] 214: Through hole
[0047] 300A, 300B: Heating control circuit
[0048] 310: Power supply
[0049] 320, 420: Switch
[0050] 325: Heating element
[0051] 330, 430: Over-temperature protection circuit
[0052] 500: Heating control circuit
[0053] 510: Heating element
[0054] 520: Switching Circuit
[0055] 530: Over-temperature protection circuit
[0056] 540: Controller
[0057] 550: Temperature sensor
[0058] 600: Control Method
[0059] C1: Capacitor
[0060] Dt: Temperature data
[0061] GND: Ground terminal
[0062] PMIC_HEAT: Control signal
[0063] PWR: Power supply voltage terminal
[0064] R1~R4: Heating resistors
[0065] R5~R11: Resistors
[0066] S1~S2: Switch
[0067] TR: Thermistor
[0068] V PWR Power supply voltage
[0069] +VBATA_PMIC: Power supply voltage
[0070] +V5A: Power supply voltage Detailed Implementation
[0071] The following detailed description provides examples in conjunction with the accompanying drawings. However, the provided examples are not intended to limit the scope of this disclosure, and the description of the structure's operation is not intended to limit its execution order. Any structure resulting from the recombination of elements, producing an apparatus with equivalent technical effects, falls within the scope of this disclosure. Furthermore, the illustrations are for illustrative purposes only and are not drawn to their original dimensions. For ease of understanding, the same or similar elements will be designated with the same symbols in the following description.
[0072] Unless otherwise specified, the terms used throughout this specification and claims generally have their ordinary meaning in the context of this art, the disclosure, and the specific content. Furthermore, the terms “comprising,” “including,” “having,” “containing,” etc., as used herein, are open-ended terms, meaning “including but not limited to.” Additionally, the term “and / or” as used herein includes any one or more of the related listed items and all combinations thereof.
[0073] Please see Figure 1A and Figure 1B , Figure 1A and Figure 1B This is a schematic diagram of the front and back sides of a printed circuit board assembly 100 according to some embodiments of the present disclosure. In some embodiments, the printed circuit board assembly 100 includes a circuit board 106, components 102, and heating resistors 112a-112d. In some embodiments, component 102 may be a chip (e.g., a central processing unit, graphics processing unit, tensor processor), a single chip (e.g., a microcontroller), or other electronic components that need to be heated to a suitable operating temperature in cold climates. In some embodiments, heating resistors 112a-112d may be carbon film resistors, which have the advantage of low cost. Figure 1A As shown, component 102 is mounted in mounting area 104 of the top layer 108 of the printed circuit board assembly 100. As... Figure 1BAs shown, heating resistors 112a to 112d are mounted in region 110 of the bottom layer 120 of the printed circuit board assembly 100. The first terminals of each of the heating resistors 112a to 112d are electrically connected to a first signal line 116, and the second terminals of each of the heating resistors 112a to 112d are electrically connected to a second signal line 118. In some embodiments, region 110 of the bottom layer 120 overlaps with the mounting area 104 of the top layer 108 in vertical projection.
[0074] Please see Figure 2 , Figure 2 This is a schematic diagram of a printed circuit board assembly 200 according to some embodiments of the present disclosure. In some embodiments, the printed circuit board assembly 200 corresponds to... Figure 1A and Figure 1B A partial cross-section of the printed circuit board assembly 100. In some embodiments, the printed circuit board assembly 200 includes an element 102, an assembly layer 202, at least two insulating layers (e.g., at least one of insulating layers 204 and 207 and 210), one or more conductive layers 206, 208-209, and a signal layer 212. In some embodiments, the insulating layer 204 is disposed between the assembly layer 202 and the conductive layer 206, and one or more insulating layers (e.g., at least one of insulating layers 207 and 210) are disposed between the conductive layer 206 and the signal layer 212.
[0075] In some embodiments, element 102 is mounted on component layer 202 of circuit printed circuit board assembly 200, and component layer 202 of circuit printed circuit board assembly 200 corresponds to Figure 1A The top layer 108 of the circuit printed circuit board assembly 100.
[0076] In some embodiments, the heating resistor 112 corresponds to Figure 1B The heating resistors 112a to 112d (e.g., 112a to 112b or 112c to 112d) are mounted on the signal layer 212 of the printed circuit board assembly 200. In some embodiments, the signal layer 212 of the circuit board assembly 200 corresponds to... Figure 1B The circuit board assembly 100 has a bottom layer 120. In some embodiments, the first end of each heating resistor 112 is electrically connected to a first signal line 116 in the signal layer 212, and the second end of each heating resistor 112 is electrically connected to a second signal line 118 in the signal layer 212.
[0077] In some embodiments, the printed circuit board assembly 200 includes a component layer 202, an insulating layer 204, a conductive layer 206, at least one insulating layer 207 and 210, and a signal layer 212. In some embodiments, the conductive layer 206 is adjacent to the component layer 202. In some embodiments, the conductive layer 206 may be the conductive layer other than the component layer 202 that is closest to the element 102.
[0078] In some embodiments, the conductive pattern 207 is formed on the conductive layer 206. In some embodiments, the conductive pattern 207 is a separate copper foil. In some embodiments, the conductive pattern 207 and... Figure 1A Installation area 104 and / or Figure 1B Region 110 overlaps in the vertical projection. In some embodiments, via 214 connects the conductive pattern 207 in conductive layer 206 to the first signal line 116. In some embodiments, the first signal line 116 and the second signal line 118 are formed in signal layer 212.
[0079] In some embodiments, the conductive portions of the circuit board assembly 100 (e.g., the conductive pattern 207, the first signal line 116, the second signal line 118, and the via 116 in the conductive layer 206) are made of a conductive material. In some embodiments, the conductive material is a metal. In some embodiments, the conductive material is copper. Since materials with good electrical conductivity also have good thermal conductivity, when the heating resistor generates heat, this thermal energy can be conducted to the conductive pattern 207 through the first signal line 116 and the via 214. In this case, the conductive pattern 207 can be considered a thermal conductor. How to supply power to the heating resistor 112 to generate heat will be described in detail in subsequent embodiments.
[0080] Please see Figure 2 and Figure 3A . Figure 3A This is a schematic diagram of the functional blocks of a heating control circuit 300A according to some embodiments of the present disclosure. Figure 3A In this embodiment, switch 320 is disposed between heating element 325 and ground terminal GND. Power supply 310 is connected to heating element 325 (which includes...) Figure 2 The heating resistor 112, the first signal line 116, the via 214, and the conductive pattern 207 are shown.
[0081] In some embodiments, when switch 320 is turned off according to a control signal, the potential of heating element 325 corresponds to the power supply voltage of power supply 310. In some embodiments, when switch 320 is turned on according to a control signal, power supply 310, heating element 325, and ground terminal GND form a loop, and current flows from power supply 310, heating element 325, and switch 320 to ground terminal GND, causing the heating resistor (e.g., in heating element 325) in heating element 325 to... Figure 2 The heating resistor 112 shown generates heat energy according to the current, and the heat energy is transferred to other elements in the heating element 325 (e.g., through thermal conduction) via the thermal conduction effect. Figure 2 The first signal line 116, the via 214, and the conductive pattern 207 are shown.
[0082] In some embodiments, the timing of the switch 320 transitioning from on to off is controlled by an over-temperature protection circuit 330. In some embodiments, the over-temperature protection circuit 330 changes the potential of the control terminal of the switch 320 based on whether the temperature of the heating element 325 (including the conductive pattern 207) exceeds a threshold, thereby controlling the timing of the switch 320's off based on the temperature.
[0083] Please see Figure 2 and Figure 3B . Figure 3B This is a schematic diagram of the functional blocks of a heating control circuit 300B according to some embodiments of the present disclosure. Figure 3B In this embodiment, switch 320 is disposed between heating element 325 and power supply 310. Heating element 325 (which includes...) Figure 2 The heating resistor 112, the first signal line 116, the through hole 214 and the conductive pattern 207 shown are electrically connected to the ground terminal GND.
[0084] In some embodiments, when switch 320 is turned off according to a control signal, the potential of heating element 325 corresponds to the ground voltage of ground terminal GND. In some embodiments, when switch 320 is turned on according to a control signal, power supply 310, heating element 325, and ground terminal GND form a loop, and current flows from power supply 310, switch 320, heating element 325 to ground terminal GND, causing the heating resistor (e.g., in heating element 325) in the heating element 325 to... Figure 2 The heating resistor 112 shown generates heat energy according to the current, and the heat energy is transferred to other elements in the heating element 325 (e.g., through thermal conduction) via the thermal conduction effect. Figure 2 The first signal line 116, the via 214, and the conductive pattern 207 are shown.
[0085] In some embodiments, the timing of the switch 320 transitioning from on to off is controlled by an over-temperature protection circuit 330. In some embodiments, the over-temperature protection circuit 330 changes the potential of the control terminal of the switch 320 based on whether the temperature of the heating element 325 (including the conductive pattern 207) exceeds a threshold, thereby controlling the off time of the switch 320 according to the temperature.
[0086] Please see Figures 4A to 4D . Figures 4A to 4DThe diagrams are schematic representations of different architectures 400A to 400D composed of a circuit printed circuit board assembly 200 and a control circuit according to some embodiments of the present disclosure. For clarity, in... Figures 4A to 4D Not shown in the middle Figure 2 The components 102, component layer 202 and insulating layer 204 are included.
[0087] like Figure 4A As shown, switch 420 is electrically connected between the second signal line 118 and the ground terminal GND, and conductive pattern 207 is electrically connected to the power supply voltage terminal PWR, thereby receiving the power supply voltage V. PWR In some embodiments, when switch 420 is turned on according to control signal PMIC_HEAT, current flows from power supply voltage terminal PWR through conductive pattern 207, at least one via 214, first signal line 116, heating resistor 112, second signal line 118 and switch 420 to ground terminal GND.
[0088] like Figure 4B As shown, switch 420 is electrically connected between the power supply voltage terminal PWR and the second signal line 118, and conductive pattern 207 is electrically connected to the ground terminal GND, thereby receiving the power supply voltage V. PWR In some embodiments, when switch 420 is turned on according to control signal PMIC_HEAT, current flows from the power supply voltage PWR terminal through switch 420, second signal line 118, heating resistor 112, first signal line 116, at least one via 214 and conductive pattern 207 to ground terminal GND.
[0089] like Figure 4C As shown, switch 420 is electrically connected between the power supply voltage terminal PWR and the conductive pattern 207, and the second signal line 118 is electrically connected to the ground terminal GND. In some embodiments, when switch 420 is turned on according to the control signal PMIC_HEAT, current flows from the power supply voltage terminal PWR through switch 420, conductive pattern 207, at least one via 214, first signal line 116, heating resistor 112, and second signal line 118 to the ground terminal GND.
[0090] like Figure 4D As shown, switch 420 is electrically connected between conductive pattern 207 and ground terminal GND, and second signal line 118 is electrically connected to power supply voltage terminal PWR. In some embodiments, when switch 420 is turned on according to control signal PMIC_HEAT, current flows from second signal line 118, heating resistor 112, first signal line 116, at least one via 214, conductive pattern 207 and switch 420 to ground terminal GND.
[0091] Please see Figure 5 . Figure 5This is a schematic diagram of a heating control circuit 500 according to some embodiments of the present disclosure. Figure 5 As shown, the heating control circuit 500 includes a heating element 510, a switching circuit 520, an over-temperature protection circuit 530, a controller 540, and a temperature sensor 550. In some embodiments, Figure 5 The heating resistors R1 to R4, switch S1, and over-temperature protection circuit 530 respectively correspond to Figures 4A to 4D The heating resistor 112, switch 420, and over-temperature protection circuit 430 are included.
[0092] In some embodiments, the heating element 510 includes one or more heating resistors R1 to R4. In some embodiments, the heating element 500 also includes a via and a conductive pattern (not shown). Figure 5 In some embodiments, the first terminal of each of the heating resistors R1 to R4 is used to receive the power supply voltage +VBATA_PMIC from the battery (via resistors R7 and R5) or the power supply voltage +V5A from the power supply (via resistors R7 and R6).
[0093] In some embodiments, the switching circuit 520 includes a switch S1 and resistors R9 and R10. In some embodiments, the first terminal of switch S1 is electrically connected to the second terminals of heating resistors R1 to R4 via resistor R8, and the second terminal of the switch is electrically connected to ground GND. In some embodiments, the control terminal of the switching circuit 520 is connected to a controller 540 via resistor R9 to receive the control signal PMIC_HEAT provided by the controller 540. In some embodiments, the controller 540 is a microcontroller.
[0094] In some embodiments, the temperature sensor 550 may be disposed on the circuit board of the printed circuit board assembly to sense the ambient temperature. In some embodiments, the controller 540 receives temperature data Dt sensed by the temperature sensor 550 to determine whether the temperature data Dt (ambient temperature) is below a threshold. In some embodiments, the threshold corresponds to a lower limit of the operating temperature of the element to be heated.
[0095] In some embodiments, when the controller 540 determines that the temperature data Dt (e.g., -20°C) is lower than the lower limit of the operating temperature of the component (e.g., -10°C or -0°C), the control signal PMIC_HEAT turns on the switch S1, causing current to flow from the power supply voltage terminal through resistors R1 to R4 and switch S1 to the ground terminal GND, thereby causing resistors R1 to R4 to generate heat according to the current, and then conducting the heat to the conductive pattern.
[0096] In some embodiments, the over-temperature protection circuit 530 includes a switch S2, a capacitor C1, a resistor R11, and a thermistor TR. In some embodiments, the capacitor C1 and the resistor R11 are connected in parallel between the control terminal of the switch S2 and the ground terminal GND.
[0097] In some embodiments, the thermistor TR may be located adjacent to the conductive pattern (e.g., conductive pattern 207). Thus, the resistance value of the thermistor TR changes with the temperature of the conductive pattern.
[0098] In some embodiments, the thermistor TR is electrically connected between the first terminal of the heating resistors R1 to R4 and the control terminal of the switch S2. In some embodiments, when the temperature of the conductive pattern (e.g., conductive pattern 207) reaches the lower limit of the element's operating temperature (e.g., -10°C or -0°C), the resistance value of the thermistor TR decreases, causing the potential at the control terminal of the switch S2 to rise, thereby turning on the switch S2.
[0099] In some embodiments, switch S2 is electrically connected between the control terminal of switch S1 and the ground terminal GND. When switch S2 is turned on, the potential of the control terminal of switch S1 is pulled down, thereby turning off switch S1. Thus, when the temperature of the conductive pattern (e.g., conductive pattern 207) reaches the lower limit of the component's operating temperature (e.g., -10°C or -0°C), the temperature protection circuit 530 turns off switch S1 to stop heating.
[0100] Please see Figure 6 , Figure 6 This is a schematic diagram of a control method 600 for a heating control circuit according to some embodiments of the present disclosure. In some embodiments, the control method 600 includes steps 610 to 630.
[0101] In step 610, the controller turns on the switch according to the temperature data, so that the current flows from the power supply voltage terminal, the heating resistor and the switch to the ground terminal.
[0102] In step 620, heat is generated by the heating resistor based on the current.
[0103] In step 630, the over-temperature protection circuit controls the switch to turn off when the temperature of the heating resistor reaches the threshold.
[0104] In summary, the circuit printed circuit board assembly 200 disclosed herein conducts heat generated by the heating resistor 112 through the via 214 to the conductive pattern 207 adjacent to the assembly layer 202, thereby heating the component 102. The heating control circuit 500 and its control method 600 disclosed herein can provide heating functionality and pause heating when the target temperature is reached.
[0105] Although this disclosure has been described above with reference to embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make various changes and modifications without departing from the concept and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the claims.
Claims
1. A printed circuit board assembly, characterized in that, Include: A circuit board comprising: A component layer has a mounting area for mounting a component; A signal layer, comprising a first signal line and a second signal line; A conductive layer, disposed between the component layer and the signal layer, includes a conductive pattern; and At least one via connecting the first signal line to the conductive pattern; a heating resistor having a first terminal electrically connected to the first signal line and a second terminal electrically connected to the second signal line; and A switch, wherein the conductive pattern, the at least one through hole, the first signal line, the heating resistor, the switch, and the second signal line are electrically connected in series between a power supply voltage terminal and a ground terminal.
2. The circuit printed circuit board assembly as claimed in claim 1, characterized in that, When the switch is turned on according to a control signal, a current flows from the power supply voltage terminal through the switch and the heating resistor to the ground terminal.
3. The circuit printed circuit board assembly as described in claim 1, characterized in that, When the switch is turned on according to a control signal, the heating resistor generates heat energy according to a current, and the at least one through hole is used to conduct the heat energy generated by the heating resistor to the conductive pattern.
4. The circuit printed circuit board assembly as claimed in claim 1, characterized in that, The conductive pattern is a thermal conductor.
5. The circuit printed circuit board assembly as claimed in claim 1, characterized in that, The circuit board also includes: A first insulating layer is disposed between the component layer and the conductive layer; and At least one second insulating layer is disposed between the signal layer and the conductive layer.
6. The printed circuit board assembly as claimed in claim 1, characterized in that, The switch is electrically connected between the second signal line and the ground terminal, and the conductive pattern is electrically connected to the power supply voltage terminal.
7. The circuit printed circuit board assembly as claimed in claim 6, characterized in that, When the switch is turned on according to a control signal, a current flows from the power supply voltage terminal through the conductive pattern, the at least one via, the first signal line, the heating resistor, the second signal line, and the switch to the ground terminal.
8. The printed circuit board assembly as claimed in claim 1, characterized in that, The switch is electrically connected between the power supply voltage terminal and the second signal line, and the conductive pattern is electrically connected to the ground terminal.
9. The printed circuit board assembly as claimed in claim 8, characterized in that, When the switch is turned on according to a control signal, a current flows from the power supply voltage terminal through the switch, the second signal line, the heating resistor, the first signal line, the at least one via and the conductive pattern to the ground terminal.
10. The circuit printed circuit board assembly as claimed in claim 1, characterized in that, The switch is electrically connected between the power supply voltage terminal and the conductive pattern, and the second signal line is electrically connected to the ground terminal.
11. The circuit printed circuit board assembly as claimed in claim 10, characterized in that, When the switch is turned on according to a control signal, a current flows from the power supply voltage terminal through the switch, the conductive pattern, the at least one via, the first signal line, the heating resistor, and the second signal line to the ground terminal.
12. The circuit printed circuit board assembly as claimed in claim 1, characterized in that, The switch is electrically connected between the conductive pattern and the ground terminal, and the second signal line is electrically connected to the power supply voltage terminal.
13. The circuit printed circuit board assembly as claimed in claim 12, characterized in that, When the switch is turned on according to a control signal, a current flows from the second signal line, the heating resistor, the first signal line, the at least one via, the conductive pattern, and the switch to the ground terminal.
14. The circuit printed circuit board assembly as claimed in claim 1, characterized in that, The conductive pattern at least partially overlaps with the element in its vertical projection.
15. A heating control circuit, characterized in that, Include: A heating resistor; A switch, electrically connected in series with the heating resistor between a power supply voltage terminal and a ground terminal, and the switch is turned on according to a control signal; and A temperature protection circuit is electrically connected between the heating resistor and the control terminal of the switch, used to control the switch to turn off when the temperature of the heating resistor reaches a threshold.
16. A control method for a heating control circuit, characterized in that, The heating control circuit includes a heating resistor and a switch electrically connected in series between a power supply voltage terminal and a ground terminal, an over-temperature protection circuit electrically connected between the heating resistor and a control terminal of the switch, and a controller electrically connected to the control terminal of the switch, wherein the control method includes: The controller turns on the switch based on the temperature data, so that a current flows from the power supply voltage terminal, the heating resistor and the switch to the ground terminal; Heat is generated by the heating resistor according to the current; and The over-temperature protection circuit controls the switch to turn off when the temperature of the heating resistor reaches a threshold.