Cutting fluid and application and device of cutting fluid in cutting of chip-scale packaged LED (light-emitting diode)
By using fluorocarbon liquid instead of traditional water medium, combined with nitrogen purging and heating baking processes, the hydrolysis reaction problem of phosphor in chip-level packaged LED cutting was solved, achieving high cutting precision and improved optical performance, and adapting to continuous production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHINEON (NANCHANG) TECH CO
- Filing Date
- 2025-12-30
- Publication Date
- 2026-05-26
AI Technical Summary
In existing technologies, when cutting chip-scale packaged LEDs, fluoride phosphors are prone to hydrolysis when they come into contact with water, leading to luminous performance degradation and appearance defects, and the generation of corrosive byproducts is difficult to avoid.
Using a fluorocarbon liquid that is immiscible with water as the cutting medium, combined with nitrogen purging and heating baking processes, the hydrolysis reaction is completely isolated to prevent phosphor deterioration, and the cutting accuracy and optical performance are improved through cooling and lubrication.
It effectively prevents the hydrolysis reaction of phosphors and the generation of corrosive byproducts, improves the long-term reliability and optical performance of chip-level packaged LEDs, reduces the scrap rate of defective products, and adapts to the needs of continuous mass production.
Smart Images

Figure CN122080985A_ABST