Cutting fluid and application and device of cutting fluid in cutting of chip-scale packaged LED (light-emitting diode)

By using fluorocarbon liquid instead of traditional water medium, combined with nitrogen purging and heating baking processes, the hydrolysis reaction problem of phosphor in chip-level packaged LED cutting was solved, achieving high cutting precision and improved optical performance, and adapting to continuous production.

CN122080985APending Publication Date: 2026-05-26SHINEON (NANCHANG) TECH CO
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHINEON (NANCHANG) TECH CO
Filing Date
2025-12-30
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing technologies, when cutting chip-scale packaged LEDs, fluoride phosphors are prone to hydrolysis when they come into contact with water, leading to luminous performance degradation and appearance defects, and the generation of corrosive byproducts is difficult to avoid.

Method used

Using a fluorocarbon liquid that is immiscible with water as the cutting medium, combined with nitrogen purging and heating baking processes, the hydrolysis reaction is completely isolated to prevent phosphor deterioration, and the cutting accuracy and optical performance are improved through cooling and lubrication.

Benefits of technology

It effectively prevents the hydrolysis reaction of phosphors and the generation of corrosive byproducts, improves the long-term reliability and optical performance of chip-level packaged LEDs, reduces the scrap rate of defective products, and adapts to the needs of continuous mass production.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a cutting fluid and application and device thereof in chip scale packaging LED cutting, and relates to the technical field of LED packaging technologies, the cutting fluid is fluorocarbon liquid which is not mutually soluble with water, the cutting fluid serves as a cutting medium and is used for cutting a chip scale packaging LED of which a packaging body contains fluoride fluorescent powder, and the cutting fluid is used for cutting the chip scale packaging LED of which the packaging body contains fluoride fluorescent powder. The fluorocarbon liquid which is high in chemical inertness and is not mutually soluble with water is used as a cutting medium instead of pure water, so that the hydrolysis reaction of the fluorescent powder and the generation of corrosive byproducts are radically eradicated, the crystal structure of the fluorescent powder is effectively protected, and the long-term reliability and the service life of a device are improved.
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