Sensor chip

Abstract

Apparatus, systems, and methods are provided for sensor dies, particularly silicon-based polymer sensor dies. The sensor die can be configured to measure impedance changes via multiple interdigitated electrodes (IDEs) and a sensing layer to detect the presence of material (e.g., battery leakage). The sensor die may include a substrate composed of silicon oxide on a silicon wafer, multiple IDEs (e.g., composed of metal) disposed near the surface of the substrate, one or more retaining rings defining one or more regions configured to accommodate at least a volume of material therebetween, and a sensing layer (e.g., composed of solid polymer electrolyte (SPE)) disposed near the multiple IDEs.

Description

Technical Field

[0001] The embodiments disclosed herein generally relate to sensor chips, and more specifically to silicon-based solid polymer electrolyte sensor chips. Background Technology

[0002] Some sensor dies include interdigitated electrodes (IDEs) disposed on a glass substrate. The applicant has recognized the numerous technical challenges and difficulties associated with such sensor dies. Through effort, ingenuity, and innovation, many of these identified problems have been addressed by the developed solutions, including those described in the embodiments of this disclosure, many of which are illustrated in detail herein. Summary of the Invention

[0003] The various example implementations described herein relate to sensor dies, specifically silicon-based solid polymer electrolyte sensor dies.

[0004] According to various embodiments of this disclosure, an apparatus for detecting vapor is provided. The apparatus includes: (i) a substrate; (ii) a plurality of interdigitated electrodes (IDEs) composed of metal disposed near a surface of the substrate; and (iii) a solid polymer electrolyte (SPE) sensing layer disposed near the plurality of IDEs.

[0005] In some embodiments, the substrate is composed of bulk silicon having a silicon oxide thin film.

[0006] In some embodiments, the device further includes one or more retaining rings that define one or more regions therebetween, the regions being configured to accommodate at least a certain volume of SPE.

[0007] In some implementations, the plurality of IDEs includes one or more electrodes of a first width, wherein the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width.

[0008] In some implementations, the plurality of IDEs includes one or more electrodes of a second width, wherein the one or more electrodes of the second width are spaced apart from each other by a distance equal to the first width, and wherein the first width and the second width are different.

[0009] In some implementations, multiple IDEs include one or more electrodes electrically connected to one or more buses, wherein the one or more buses are configured to substantially surround at least one area including the one or more electrodes.

[0010] In some implementations, the device is configured to measure impedance changes via multiple IDEs and sensing layers to detect the presence of vapor.

[0011] According to various embodiments of this disclosure, a system is provided. The system includes: (i) a lithium-ion battery; and (ii) a sensor die for detecting vapor. The sensor die includes: (a) a substrate; (b) a plurality of interdigitated electrodes (IDEs) composed of metal disposed near a surface of the substrate; and (c) a solid polymer electrolyte (SPE) sensing layer disposed near the plurality of IDEs.

[0012] In some examples, the substrate consists of bulk silicon with a silicon oxide film.

[0013] In some embodiments, the sensor die also includes one or more retaining rings that define one or more regions therebetween, the regions being configured to accommodate at least a certain volume of SPE.

[0014] In some examples, multiple IDEs include one or more electrodes of a first width, wherein the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width.

[0015] In some examples, multiple IDEs include one or more electrodes of a second width, wherein the one or more electrodes of the second width are spaced apart from each other by a distance equal to the first width, wherein the first width and the second width are different.

[0016] In some examples, multiple IDEs include one or more electrodes electrically connected to one or more buses, wherein the one or more buses are configured to substantially surround at least one area including the one or more electrodes.

[0017] In some examples, the sensor die is configured to measure impedance changes via multiple IDEs and sensing layers to detect the presence of vapor.

[0018] According to various embodiments of this disclosure, a method for constructing a device for detecting vapor is provided. The method includes: (i) depositing a plurality of interdigitated electrodes (IDEs) made of metal onto a surface of a substrate; and (ii) depositing a sensing layer made of a solid polymer electrolyte (SPE) near the plurality of IDEs, such that the sensing layer at least covers the plurality of IDEs.

[0019] In some embodiments, the substrate is composed of bulk silicon having a silicon oxide thin film.

[0020] In some embodiments, the method further includes manufacturing one or more retaining rings that define one or more regions therebetween, the regions being configured to accommodate at least a certain volume of SPE.

[0021] In some implementations, the plurality of IDEs includes one or more electrodes of a first width, wherein the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width.

[0022] In some implementations, multiple IDEs include one or more electrodes electrically connected to one or more buses, wherein the one or more buses are configured to substantially surround at least one area including the one or more electrodes.

[0023] In some implementations, the method also includes configuring the sensor die to measure impedance changes via multiple IDEs and sensing layers to detect the presence of vapor. Attached Figure Description

[0024] The description of the exemplary embodiments can be read in conjunction with the accompanying drawings. It should be understood that, for simplicity and clarity of illustration, the elements illustrated in the figures are not necessarily drawn to scale unless otherwise described. For example, unless otherwise described, the dimensions of some elements may be exaggerated relative to others. Embodiments incorporating the teachings of this disclosure are shown and described with reference to the accompanying drawings, in which:

[0025] Figure 1A A first perspective view of a sensor die according to one or more embodiments of the present disclosure is illustrated;

[0026] Figure 1B Examples Figure 1A A second perspective view of the sensor die;

[0027] Figure 2 Examples Figure 1B A cross-sectional view of the sensor die;

[0028] Figure 3A A top view of a sensor die according to one or more embodiments of the present disclosure is illustrated;

[0029] Figure 3B A top view of a sensor die according to one or more embodiments of the present disclosure is illustrated;

[0030] Figure 4 A top view of a sensor die with exemplary boundaries according to one or more embodiments of the present disclosure is illustrated;

[0031] Figure 5A A top view of a portion of a sensor die according to one or more embodiments of the present disclosure is illustrated;

[0032] Figure 5B A top view of a portion of a sensor die according to one or more embodiments of the present disclosure is illustrated;

[0033] Figure 5C A top view of a portion of a sensor die according to one or more embodiments of the present disclosure is illustrated; and

[0034] Figure 6 A flowchart illustrating an exemplary method of constructing a sensor die according to one or more embodiments of the present disclosure is provided. Detailed Implementation

[0035] Some embodiments of this disclosure will be described more fully below with reference to the accompanying drawings, which illustrate some, but not all, embodiments of this disclosure. In fact, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will meet applicable legal requirements. Similar reference numerals always refer to similar elements.

[0036] As used herein, terms such as “front,” “rear,” “top,” “bottom,” “left,” “right,” etc., in the examples provided below, are used for illustrative purposes to describe the relative positions of certain parts or portions of parts. Furthermore, as will be apparent to those skilled in the art based on this disclosure, the terms “substantially” and “approximately” indicate that the referenced element or associated description is accurate within applicable engineering tolerances.

[0037] As used herein, the term “comprising” means including but not limited to, and should be interpreted in the manner in which it is typically used in the patent context. The use of broader terms such as “comprising,” “including,” and “having” should be understood to provide support for narrower terms such as “consisting of,” “substantially composed of,” and “substantially constituted by.”

[0038] The phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally mean that the specific feature, structure, or characteristic following the phrase may be included in at least one embodiment of this disclosure, and may be included in more than one embodiment of this disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0039] The phrases “in one example,” “according to one example,” “in some examples,” etc. generally mean that the particular feature, structure, or characteristic following the phrase may be included in at least one example of this disclosure, and may be included in more than one example of this disclosure (importantly, such phrases do not necessarily refer to the same example).

[0040] If the specification states that a component or feature "may," "can," "should," "will," "preferably," "possibly," "usually," "optionally," "for example," "as an example," "in some examples," "often," or "may" (or other such language) be included or have that characteristic, then the specific component or feature is not required to be included or have that characteristic. Such a component or feature may be optionally included in some examples or excluded.

[0041] The terms “example” or “exemplary” as used herein mean “used as an example, instance, or illustration.” Any specific implementation described herein as an “example” or “exemplary” is not necessarily to be construed as preferred or advantageous over other specific implementations.

[0042] The terms “electrically coupled,” “electrically coupled,” “electrically connected,” “electrically connected,” “communicating with,” or “electronically communicating with” in this disclosure refer to two or more elements or components connected by wired and / or wireless components such that signals, voltages / currents, data, and / or information can be transmitted to and / or received from these elements or components.

[0043] The term "component" can refer to an article of writing, device, or apparatus that may include one or more surfaces, portions, layers, and / or elements. For example, an example component may include one or more substrates that may provide one or more underlying layers for the component, and may include one or more elements that may form a portion on top of the substrate and / or one or more elements that may be disposed on top of the substrate. In this disclosure, the term "element" can refer to an article of writing, device, or apparatus that can provide one or more functions.

[0044] Embodiments of this disclosure provide apparatus, systems, and methods for use in sensor dies. Various embodiments provide silicon-based solid polymer electrolyte sensor dies.

[0045] In various implementations, the sensor die can be used to detect vapor. The sensor die described herein can be used in a variety of applications. In an exemplary application, the battery of an electric vehicle may leak, which could generate vapor. The sensor die can be used to detect vapor generated from or originating from the battery.

[0046] In various embodiments, the sensor die may include a substrate, multiple electrodes (e.g., interdigitated electrodes), one or more contact pads, one or more areas comprising a polymer, and / or other components. The substrate may be a silicon-based substrate composed of silicon oxide on silicon. The one or more contact pads are configured to be electrically connected to or electrically connected to one or more external devices, enabling measurements performed using the sensor die to be provided to the external devices. Examples of external devices include printed circuit board assemblies (PCBAs), processors, etc. In some examples, a solid polymer electrolyte is used in conjunction with interdigitated electrodes (IDEs) to measure one or more characteristics, such as impedance or impedance change. Measurements of impedance or impedance change may indicate the presence of vapor or other materials, such as the presence of leakage in a battery.

[0047] Figure 1A A first perspective view of a sensor die 100 according to one or more embodiments of the present disclosure is illustrated. Figure 1A The first perspective view of the sensor die 100 shown omits the sensing layer 110 composed of a solid polymer electrolyte (SPE), which... Figure 1B As shown in FIG1, the sensor die 100 includes a first substrate layer 102, a second substrate layer 104, one or more buses 106 (e.g., first bus 106A and second bus 106B) and one or more retaining rings 108 (e.g., first retaining ring 108A and second retaining ring 108B). Although Figure 1A The example illustrates a first substrate layer 102, a second substrate layer 104, two buses 106, two retaining rings 108, and a region for the sensing layer 110; however, it should be understood that any number of such components may be present in various embodiments of the sensor die 100. For example, another embodiment of this disclosure omits the retaining rings 108.

[0048] The first substrate layer 102 may be located beneath the second substrate layer 104. The first substrate layer 102 and the second substrate layer 104 may be collectively referred to as “substrate” 102+104. Substrate 102+104 may be composed of various materials, and the first substrate layer 102 may be a different material than the second substrate layer 104. For example, substrate 102+104 may be composed of an insulating material, including glass, Kapton, quartz, composite epoxy resin materials, ceramics (such as alumina), polytetrafluoroethylene (PTFE), and / or other insulating materials. In some examples, the substrate may be composed of a silicon-based material. For example, substrate 102+104 may be composed of a silicon oxide (e.g., SiO2) film on silicon (Si), wherein the first substrate layer 102 is composed of bulk silicon, and the second substrate layer 104 is composed of a silicon oxide film. The bulk silicon may be independent of the dopant level. In some examples, the substrate may be a Si / SiO2 wafer. In various embodiments, the first substrate layer 102 may be a metal or semiconductor layer, wherein the second substrate layer is an insulating or dielectric layer. In various embodiments, substrates 102+104 may be flexible and composed of a single material (e.g., Kapton), which may be referred to as a single substrate layer. Alternatively, a first substrate layer 102 of a first material may be present, and the second substrate layer 104 may be a film or foil (e.g., having a dielectric on the film). The substrates may be configured for the sensor die 100 to perform various operations and measurements, such as the measurement of impedance and / or impedance changes.

[0049] One or more buses 106 can be configured in various shapes, extending from one or more contact pads 120. For example, one or more buses 106 can extend from one or more contact pads 120 and form at least a portion of the perimeter surrounding a plurality of IDEs. In some examples, one or more buses 106 may include a first bus 106A and a second bus 106B configured in a semi-circular shape. Thus, two corresponding buses 106A, 106B form a substantially circular shape. The first bus 106A may extend from or be electrically connected to the first contact pad 120A. The second bus 106B may extend from or be electrically connected to the second contact pad 120B. In various examples, one or more gaps may exist in or between one or more buses 106. For example, the substantially circular shape of buses 106A and 106B may include one or more gaps. One or more buses 106 may be composed of metal, such as gold (Au), platinum (Pt), and / or other metals. The metal of one or more buses 106 may be deposited (e.g., photolithographically defined).

[0050] One or more retaining rings 108 are differently shaped and configured. For example, one or more retaining rings 108 may be substantially circular and / or other shapes. Figure 1A In the example, two retaining rings are shown: a first retaining ring 108A and a second retaining ring 108B. The first retaining ring 108A is located inside or within the second retaining ring 108B. The distance between the first retaining ring 108A and the second retaining ring 108B forms a gap 200 (in... Figure 2 (As shown in the diagram). Gap 200 may be referred to as a pool or external pool. In various embodiments, constructing sensor die 100 may include depositing a sensing layer 110 composed of a solid polymer electrolyte (SPE), which may be liquid or viscous. During this deposition, the SPE may be deposited into an internal pool defined by an inner first retaining ring 108A and may diffuse to fill the internal pool. In the event of any overflow during deposition, gap 200 between the inner first retaining ring 108A and the outer second retaining ring 108B forms an external pool, where any excess SPE (or other type of electrolyte) may overflow from the internal pool formed by the first retaining ring 108A. Thus, gap 200 or external pool may retain any additional electrolyte overflowing from the internal pool, which prevents electrolyte from coating other parts of sensor die 100 (e.g., contact pads 120).

[0051] One or more retaining rings 108 may be composed of polyimide, SU-8 (a negative photoresist material), and / or other materials. One or more retaining rings 108 may be defined by photolithography, etching, and / or other techniques. For example, one or more polyimide retaining rings 108 may be defined by: (i) depositing a polyimide layer on at least a portion of the surface of the sensor die 100; (ii) depositing a photoresist layer on the polyimide layer; (iii) photolithographically defining the area requiring polyimide (e.g., two substantially concentric rings); (iv) etching the polyimide to remove at least some (e.g., all) of the polyimide layer not covered by the remaining photoresist; (v) removing the photoresist covering the polyimide retaining rings; and / or other steps.

[0052] Alternatively, various embodiments do not include a retaining ring. For example, various embodiments may deposit SPE (or another electrolyte) such that the SPE does not diffuse or is not viscous enough to overflow. An example of such deposition operation is printing. Such embodiments may omit the retaining ring 108.

[0053] Figure 1B Examples Figure 1A Second perspective view of sensor die 100. Figure 1BAn example is illustrated of a sensing layer 110 composed of a solid polymer electrolyte (SPE). The SPE may be differently shaped and / or configured to conform to the shape of the interdigitated electrodes (IDEs) below. The SPE may be deposited such that it forms a substantially circular thin film. The ends and / or bases of the SPE may extend beyond one or more buses 106, such that one or more buses 106 (and multiple IDEs) are covered by the SPE. In some examples, the SPE is configured to operate in conjunction with multiple IDEs to provide measurements of one or more characteristics, such as impedance and / or impedance changes.

[0054] SPE can be deposited onto sensor die 100. The SPE can be ink, and deposition can be performed via inkjet printing, aerosol printing, and / or other techniques. In some examples, SPE deposition may rely on inks with viscosities outside the operating range of one or more corresponding printing techniques, which can lead to challenges in printing precise amounts of ink. In such examples with excess and / or overflowing ink, the SPE and / or other material can be trapped by one or more pools as described herein, such as pools defined by gaps between two or more retaining rings 108.

[0055] Figure 2 Examples Figure 1B A cross-sectional view of the sensor die 100. Figure 2 In the example, the sensor die 100 includes a first substrate layer 102, a second substrate layer 104, a first retaining ring 108A and a second retaining ring 108B forming a gap 200 or cell, a sensing layer 110 of solid polymer electrolyte (SPE), and a plurality of interdigitated electrodes (IDEs) (e.g., 202, 208). IDE 202 or 208 is further described herein. Although Figure 2 The sensor die 100 shows a first substrate layer 102, a second substrate layer 104, two retaining rings 108, an SPE sensing layer 110, a gap 200 or pool, and multiple IDEs 202, 208, but any number of such components may be present in the sensor die 100.

[0056] The SPE sensing layer 110 can be shaped and / or configured differently. For example, the SPE can be deposited such that it forms a substantially cylindrical shape or film. The height of the substantially cylindrical shape is less than the diameter of the substantially cylindrical shape. In various examples, this shape can be defined by a retaining ring 108 (e.g., a first retaining ring 108A). The SPE can extend beyond one or more buses 106 such that one or more buses 106 (and a plurality of IDEs 202, 208 surrounded by the buses 106) are covered by the SPE. In some examples, the SPE is configured to operate in conjunction with a plurality of IDEs 202, 208 to measure one or more characteristics, such as impedance and / or impedance change.

[0057] In some embodiments, a polymer layer is added in the opening above the IDE structure, above the electrode layer (e.g., 202, 208) and additionally in the opening region of the sensor die 100. This opening region can serve as an additional retention pool for material deposited above the IDE structure that may overflow the IDE area. Such a retention pool can accommodate additional volume of material without affecting the electrical characteristics of the sensor die 100 and / or the device including the sensor die 100.

[0058] Multiple IDEs 202 and 208 can be deposited on the substrate prior to the deposition of the SPE. This paper further describes the multiple IDEs and their various configurations.

[0059] In some implementations, multiple IDEs 202, 208, one or more buses 106, contact pads 120, and one or more elongated paths and / or portions (e.g., leads) between buses 106 and contact pads 120 may be composed of the same deposited metal layer (e.g., Au, Pt, and / or other metals). This metal layer may be defined by photolithography. For example, the metal layer may be deposited on a sensor die, a photoresist layer may be deposited on the metal layer, and the photoresist layer may then be partially removed to define a desired area (e.g., defining multiple IDEs, one or more leads, one or more buses, and / or one or more contact pads). The metal layer may be etched such that only the area with remaining photoresist is not etched away, and / or the remaining photoresist may be removed.

[0060] Figure 3A A top view of a sensor die 300A according to one or more embodiments of the present disclosure is illustrated. The sensor die 300A can be configured to measure impedance and / or impedance changes, for example, to detect the presence of vapor. The sensor die 300A includes a substrate 102+104, one or more buses 106, and a plurality of interdigitated electrodes (IDEs) 202. As shown, the one or more buses 106 include a first bus 106A and a second bus 106B. The sensor die 300A may include other components not shown.

[0061] As described herein, one or more buses 106 can be shaped differently. Figure 3A In this configuration, the first bus 106A and the second bus 106B are each configured with a semi-circular shape to collectively form a circular shape. This circular shape has one or more gaps between the first bus 106A and the second bus 106B. Each of the two substantially semi-circular buses 106 extends from one or more contact pads via one or more elongated paths and / or portions thereof.

[0062] The plurality of IDEs 202, 208 may include a first plurality of elongated electrodes 202 and a second plurality of elongated electrodes 208. The first plurality of elongated electrodes 202 are electrically connected to and extend from a first bus 106A. The second plurality of elongated electrodes 208 are electrically connected to and extend from a second bus 106B. The first plurality of electrodes 202 and / or the second plurality of electrodes 208 may extend from one or more inner edges of one or more corresponding buses 106, wherein an “inner edge” of a corresponding bus 106 may be defined as the edge of an opposing bus (e.g., 106B) closer to one or more buses 106 (e.g., 106A). The first plurality of electrodes 202 and the second plurality of electrodes 208 each extend from opposing buses and are configured in an interlocking arrangement such that they form a plurality of interdigitated electrodes 202, 208. The electrodes of the plurality of IDEs 202, 208 may be composed of metal (such as a metal film). The metal film may be a gold film, a platinum film, and / or other types of metal film.

[0063] Figure 3B A top view of a sensor die 300B according to one or more embodiments of the present disclosure is illustrated. The sensor die 300B can be configured to measure impedance and / or impedance changes, for example, to detect the presence of vapor. The sensor die 300B includes a substrate 102+104, one or more buses 106, and a plurality of interdigitated electrodes (IDEs) 202, 208. As shown, the one or more buses 106 include a first bus 106A and a second bus 106B. The sensor die 300B may include other components not shown.

[0064] As described herein, one or more buses 106 can be shaped differently. Figure 3BIn this configuration, a first bus 106A and a second bus 106B are each configured to extend from a corresponding contact pad to form at least a portion of the perimeter surrounding the plurality of IDEs 202, 208. The first bus 106A and the second bus 106B are substantially semi-quadrilateral, such that the two corresponding buses form a substantially quadrilateral shape (e.g., a rectangle, a square, etc.). This substantially quadrilateral shape may include one or more gaps located between one or more buses 106 and / or other portions of the sensor die 300B.

[0065] Multiple IDEs 202, 208 may include a first plurality of elongated electrodes 202 and a second plurality of elongated electrodes 208. The first plurality of elongated electrodes 202 are electrically connected to and extend from a first bus 106A. The second plurality of elongated electrodes 208 are electrically connected to and extend from a second bus 106B. The first plurality of electrodes 202 and / or the second plurality of electrodes 208 may extend from one or more inner edges of one or more corresponding buses 106, are configured in an interlocking arrangement, and are composed of metal as described herein.

[0066] Figure 4 A top view of a sensor die 400 having a boundary 402 according to one or more embodiments of the present disclosure is illustrated. The sensor die 400 includes a substrate 102+104, two buses 106A, 106B, and a plurality of interdigitated electrodes 202, 208. An exemplary boundary 402 surrounds these components.

[0067] Boundary 402 defines a boundary 402 having an exemplary circular shape that surrounds the illustrated component of sensor die 400 and is substantially the same as or similar in shape to combination bus 106. For example, for a sensor die 400 having two semi-circular buses 106A, 106B, boundary 402 is circular. Boundary 402 may define an area thereon where SPE may be present. During the construction of sensor die 400, boundary 402 may define an area where SPE or another electrolyte is deposited.

[0068] The sensor die 400 may include other components not shown. Additionally or alternatively, and as... Figure 4 As shown in the embodiments described herein, the sensor die 400 may omit the retaining ring 108 described herein. Alternatively, in some embodiments, the boundary 402 may define a region within the first retaining ring 108.

[0069] Figure 5A A top view of a portion of a sensor die according to one or more embodiments of the present disclosure is illustrated. In various embodiments, Figure 5A The portion of the sensor die shown is Figure 3A The portion of the sensor die shown. Figure 5A The sensor die shown includes a portion of a substantially semi-circular bus 106 (e.g., 106A) and a portion of a first plurality of IDEs 202 and a portion of a second plurality of IDEs 208. The semi-circular bus 106 may have a width 502, which may be a uniform width. The first plurality of IDEs 202 are electrically connected to the bus 106. In various embodiments, the first plurality of IDEs 202 may include portions of one or more IEDs from the first plurality of IDEs 202 that overlap the bus 106 and / or are electrically connected to the bus 106 at the ends or edges of the IDEs 202. The second plurality of IDEs 208 are arranged with the first plurality of IDEs 202 in an interdigitated or interlocked arrangement. The second plurality of IDEs 208 are not electrically connected to the bus 106 shown. Instead, and as described herein, the second plurality of IDEs 208 are electrically connected to... Figure 5A The corresponding bus (e.g., 106B) is not shown. Each of the second plurality of IDEs 208 is spaced 504 from bus 106. Distance 504 is a consistent distance separating the second plurality of IDEs from bus 106 (and similarly separates the first plurality of IDEs from the second bus 106B, which is not shown). The spacing of distance 504 can allow for additional impedance variations when vapor is present. It should be understood that, even if not shown, the first plurality of IDEs 202 is also spaced a similar distance from the second bus (e.g., 106B).

[0070] Each electrode of the plurality of IDEs 202, 208 may have a first width W1. Each electrode may be spaced apart from each adjacent electrode by the same width W1. Alternatively, adjacent electrodes may have different lengths.

[0071] Figure 5B A top view of a portion of a sensor die according to one or more embodiments of the present disclosure is illustrated. In various embodiments, Figure 5B The portion of the sensor die shown is Figure 3B The portion of the sensor die shown. Figure 5BThe sensor die shown includes a portion of a substantially semi-quadrilateral bus 106 and a portion of a first plurality of IDEs 202 and a portion of a second plurality of IDEs 208. The bus 106 may have a width 502, which may be a uniform width. The first plurality of IDEs 202 are electrically connected to the bus 106. In various embodiments, the first plurality of IDEs 202 may include portions of one or more IEDs from the first plurality of IDEs 202 that overlap the bus 106 and / or are electrically connected to the bus 106 at the ends or edges of the IDEs 202. The second plurality of IDEs 208 are arranged with the first plurality of IDEs 202 in an interdigitated or interlocked arrangement. The second plurality of IDEs 208 are not electrically connected to the bus 106 shown. Instead, and as described herein, the second plurality of IDEs 208 are electrically connected to... Figure 5A The corresponding bus (e.g., 106B) is not shown. Each of the second plurality of IDEs 208 is spaced 504 from bus 106. It should be understood that, even if not shown, the first plurality of IDEs 202 is also spaced a similar distance from the second bus (e.g., 106B).

[0072] Figure 5C A top view of a portion of a sensor die according to one or more embodiments of the present disclosure is illustrated. In various embodiments, Figure 5C The portion of the sensor die shown is Figure 4 The portion of the sensor die shown. Figure 5C The portion of the sensing die shown includes a portion of a substantially semi-circular bus 106 (e.g., 106A) and a portion of a first plurality of IDEs 202 and a portion of a second plurality of IDEs 208. Figure 5C The multiple electrodes 202, 208 are similar to Figure 5A Multiple electrodes, but Figure 5C Each of the multiple IDEs 202, 208 can have a second width W2. The second width W2 can be smaller than the first width W1. Each electrode in the series can be spaced apart from each adjacent electrode by the second width W1.

[0073] Figure 6 A flowchart illustrating an exemplary method 600 for constructing a sensor die according to one or more embodiments of the present disclosure is provided. In some examples, the sensor die may be a silicon die, such as a silicon-based SPE sensor die.

[0074] At step / operation 602, at least one interdigitated electrode (IDE) 202, 208 may be fabricated onto the surface of substrate 102+104. In some examples, the at least one interdigitated electrode 202, 208 may be composed of a metal film. In some examples, the metal film may be composed of gold, platinum, and / or other materials. At least one IDE 202, 208 may include one or more electrodes 202, 208 of a first width, which are spaced apart from each other by a distance equal to the first width. Alternatively or additionally, at least one IDE 202, 208 may include one or more electrodes of a second width, which are spaced apart from each other by a distance equal to the first width. At least one IDE 202, 208 includes one or more electrodes electrically connected to one or more buses 106 (e.g., 106A or 106B). In some examples, the one or more buses 106 are configured to substantially surround at least one area including one or more electrodes 202, 208.

[0075] At step / operation 604, one or more retaining rings may be manufactured, defining one or more regions therebetween, the regions being configured to contain at least a certain volume of material. One or more retaining rings 108 may be manufactured to define a volume or region. In a subsequent step / operation, SPE or another electrolyte may be deposited into this volume, which will allow SPE or electrolyte to flow into and fill the volume.

[0076] In various embodiments, step / operation 604 may be omitted. For example, in embodiments where one or more retaining rings 108 are not required to define the volume of the SPE or electrolyte during deposition, the retaining rings 108 may be omitted, and step / operation 604 may be omitted. In such embodiments, step / operation 606 may follow step / operation 602.

[0077] At step / operation 606, a sensing layer may be disposed near at least one IDE 202, 208 such that the sensing layer covers at least one interdigital electrode. In some examples, the sensing layer 110 is composed of SPE and / or other materials.

[0078] At step / operation 608, the sensor die is configured to measure impedance changes via multiple IDEs 202, 208 and sensing layer 110, which detect the presence of material. In various embodiments, the material can be vapor, such as vapor leaking from the battery. The presence of vapor can cause a change in the impedance of the sensing layer, which can be measured at contact pad 120.

[0079] The operations and procedures described herein support combinations of components for performing specified functions and combinations of operations for performing specified functions. It should be understood that one or more operations, and combinations of operations, can be implemented by a computer system based on dedicated hardware or a combination of dedicated hardware and computer instructions to perform the specified functions.

[0080] In some example implementations, some of the operations described herein may be modified or further expanded as described below. Additionally, in some implementations, additional optional operations may be included. It should be understood that each of the modifications, optional additions, or expansions described herein may be included in the operations herein, either individually or in combination with any other feature described herein.

[0081] The foregoing description of methods and processes is provided as illustrative examples only and is not intended to require or imply that the steps of the various embodiments must be performed in the presented order. As those skilled in the art will understand, the order of steps in the above embodiments can be performed in any order. Words such as “after,” “then,” “next,” and similar terms are not intended to limit the order of steps; these words are merely used to guide the reader through the description of the method. Furthermore, any reference to singular claim elements, for example, using the articles “a,” “an,” or “the,” should not be construed as limiting the element to the singular and, in some cases, may be interpreted in the plural form.

[0082] Although various embodiments based on the principles disclosed herein have been shown and described above, modifications can be made by those skilled in the art without departing from the teachings of this disclosure. The embodiments described herein are representative only and not intended to be limiting. Many variations, combinations, and modifications are possible and are within the scope of this disclosure. Alternative embodiments resulting from the merging, integration, and / or omission of features of the embodiments are also within the scope of this disclosure. Therefore, the scope of protection is not limited by the description set forth above, but is defined by the following claims, which include all equivalents of the subject matter of the claims. Each claim is incorporated into the specification as further disclosure, and the claims are embodiments of this disclosure. Furthermore, any of the foregoing advantages and features may relate to specific embodiments, but the application of such published claims should not be limited to methods and structures that achieve any or all of the above advantages or have any or all of the above features.

[0083] Furthermore, the chapter titles used in this article are intended to correspond with 37 CFR. The recommendations in 1.77 are consistent with or provide organizational clues. These headings should not limit or characterize the disclosure set forth in any of the claims published in this disclosure. For example, the description of the technology in “Background Art” should not be interpreted as an admission that a certain technology is prior art to any disclosure in this disclosure. Nor should “Summary of the Invention” be considered a limiting characterization of the disclosure set forth in the published claims. Furthermore, any reference in this disclosure to the singular forms “Disclosure” or “Simplification” should not be used to prove that there is only one novel point in this disclosure. Multiple embodiments of this disclosure may be set forth according to the limitations of the multiple claims published in this disclosure, and such claims accordingly define the disclosure protected by them and its equivalents. In all cases, the scope of these claims should be considered in accordance with the advantages of the claims themselves, and should not be limited by the headings set forth herein.

[0084] Furthermore, without departing from the scope of this disclosure, the systems, subsystems, apparatuses, technologies, and methods described and illustrated in various embodiments in a discrete or separate manner can be combined or integrated with other systems, modules, technologies, or methods. Other devices or components shown or discussed as coupled or communicating with each other may be indirectly coupled through some intermediate devices or components, whether such coupling is electrical, mechanical, or otherwise. Other examples of variations, substitutions, and modifications that can be identified by those skilled in the art without departing from the scope of this disclosure are also provided.

[0085] Those skilled in the art to which these embodiments pertain will recognize numerous modifications and other embodiments of the disclosure set forth herein, which benefit from the teachings presented in the foregoing description and associated drawings. Although the drawings show only certain components of the apparatuses and systems described herein, various other components may be used in conjunction with the components and structures disclosed herein. Therefore, it should be understood that this disclosure is not limited to the specific embodiments disclosed, and modifications and other embodiments are intended to be included within the scope of the appended claims. For example, various elements or components may be combined, rearranged, or integrated into another system, or certain features may be omitted or not implemented. Furthermore, the steps in any of the methods described above may not necessarily occur in the order depicted in the drawings, and in some cases, one or more of the depicted steps may occur substantially simultaneously, or additional steps may be involved. Although specific terms are used herein, they are used only in a general and descriptive sense and not for limiting purposes.

Claims

1. An apparatus for detecting a vapor, the apparatus comprising: a substrate; a plurality of interdigitated electrodes (IDEs) comprised of a metal disposed proximate a surface of the substrate; and a solid polymer electrolyte (SPE) sensing layer disposed proximate the plurality of IDEs.

2. The apparatus of claim 1, wherein the substrate is comprised of bulk silicon having a thin film of silicon oxide.

3. The apparatus of any one of claims 1 or 2, further comprising: one or more retaining rings defining one or more regions therebetween, the one or more regions configured to house at least a volume of SPE.

4. The apparatus of claim 1, wherein the plurality of IDEs comprises one or more electrodes of a first width, and wherein the one or more electrodes of the first width are spaced apart from one another by a distance equal to the first width.

5. The apparatus of any one of claims 1 or 4, wherein the plurality of IDEs comprises one or more electrodes of a second width, wherein the one or more electrodes of the second width are spaced apart from one another by a distance equal to the first width, and wherein the first width and the second width are different.

6. The apparatus of claim 1, wherein the plurality of IDEs comprises one or more electrodes in electrical connection with one or more buses, wherein the one or more buses are configured to substantially encircle at least one area encompassing the one or more electrodes.

7. The apparatus of any one of claims 1 or 6, wherein the apparatus is configured to measure a change in impedance via the plurality of IDEs and the sensing layer to detect a presence of the vapor.

8. A system for detecting a vapor, the system comprising: a lithium ion battery; and a sensor die for detecting a vapor, the sensor die comprising: a substrate comprised of bulk silicon having a thin film of silicon oxide; a plurality of interdigitated electrodes (IDEs) comprised of a metal disposed proximate a surface of the substrate; a solid polymer electrolyte (SPE) sensing layer disposed proximate the plurality of IDEs; one or more retaining rings defining one or more regions therebetween, the one or more regions configured to house at least a volume of SPE; and wherein the plurality of IDEs comprises one or more electrodes of a first width, and wherein the one or more electrodes of the first width are spaced apart from one another by a distance equal to the first width; wherein the plurality of IDEs comprises one or more electrodes of a second width, wherein the one or more electrodes of the second width are spaced apart from one another by a distance equal to the first width, and wherein the first width and the second width are different; and wherein the plurality of IDEs comprises one or more electrodes in electrical connection with one or more buses, wherein the one or more buses are configured to substantially encircle at least one area encompassing the one or more electrodes.

9. The system of claim 8, wherein the sensor die is configured to measure a change in impedance via the plurality of IDEs and the sensing layer to detect a presence of the vapor. ​ ​ 10. A method for constructing a device for detecting a vapor, the method comprising: depositing a plurality of interdigitated electrodes (IDEs) composed of metal onto a surface of a substrate, wherein the substrate is composed of bulk silicon with a thin film of silicon oxide; wherein the plurality of IDEs includes one or more electrodes of a first width, and wherein the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width; wherein the plurality of IDEs includes one or more electrodes electrically connected with one or more buses, and wherein the one or more buses are configured to substantially surround at least one area including the one or more electrodes; depositing a sensing layer composed of a solid polymer electrolyte (SPE) proximate to the plurality of IDEs such that the sensing layer covers at least the plurality of IDEs; fabricating one or more retaining rings that define one or more regions therebetween, the one or more regions configured to house at least a volume of the SPE; configuring a sensor die to measure a change in impedance via the plurality of IDEs and the sensing layer to detect the presence of the vapor.

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