Sound-absorbing structure and server

Abstract

This invention provides a sound-absorbing structure comprising at least one sound-absorbing unit. The sound-absorbing unit includes multiple sub-units arranged in an array and interconnected to form a sound-permeable groove. Each of these sub-units includes a connected sound-absorbing chamber and a connecting channel. The sound-absorbing chamber is a polygonal chamber, and the connecting channel is located at a corner of the sound-absorbing chamber. At least one sub-unit's sound-absorbing chamber is connected to the sound-permeable groove via the connecting channel. The sound-absorbing structure provided by this invention can effectively reduce noise transmitted from the fan module to the hard drive module, thereby preventing noise from affecting the performance of the hard drive module.

Description

Technical Field

[0001] This invention relates to a sound-absorbing structure and a server. Background Technology

[0002] To cope with the ever-increasing computing demands, server hardware performance is constantly improving, which also brings considerable heat dissipation. As a common solution in cooling systems, the increased cooling efficiency of cooling fans is accompanied by increased fan noise, and noise at certain frequencies can affect the performance of storage devices.

[0003] Currently, most noise reduction methods involve attaching low-cost passive noise-reducing components to the inside of the chassis and the backplate of the storage device to reduce the impact of noise on the performance of the storage device. However, the noise reduction effect of these components is often unsatisfactory and cannot effectively reduce noise in specific frequency bands, especially sensitive frequency bands that can easily affect hard drive read and write performance. Therefore, researchers in this field are currently working to solve the aforementioned problems. Summary of the Invention

[0004] The present invention provides a sound-absorbing structure and server that can effectively prevent noise generated by the fan from affecting the storage device.

[0005] An embodiment of the present invention discloses a sound-absorbing structure comprising at least one sound-absorbing unit. The sound-absorbing unit comprises multiple sub-units arranged in an array and interconnected to form a sound-permeable groove. Each of these sub-units includes a communicating sound-absorbing chamber and a connecting channel. The sound-absorbing chamber is a polygonal chamber, and the connecting channel is located at a corner of the sound-absorbing chamber. At least one of these sub-units has its sound-absorbing chamber connected to the sound-permeable groove via the connecting channel.

[0006] Another embodiment of the present invention discloses a server comprising a chassis, a hard disk module, a fan module, and a sound-absorbing structure. The chassis includes a hard disk housing area and a fan housing area. The hard disk module is disposed in the hard disk housing area. The fan module is disposed in the fan housing area. The sound-absorbing structure is disposed between the hard disk housing area and the fan housing area and includes at least one sound-absorbing unit. The sound-absorbing unit includes multiple sub-units arranged in an array and interconnected to form a sound-permeable groove. Each of these sub-units includes a communicating sound-absorbing chamber and a connecting channel. The sound-absorbing chamber is a polygonal chamber, and the connecting channel is located at a corner of the sound-absorbing chamber. At least one of these sub-units has its sound-absorbing chamber connected to the sound-permeable groove via the connecting channel.

[0007] According to the sound-absorbing structure and server disclosed in the above embodiments, the sound-absorbing structure is disposed between the hard disk storage area and the fan storage area. The sub-units of the sound-absorbing unit of the sound-absorbing structure are arranged in an array and connected to each other to form a sound-permeable groove. The sound-absorbing chamber of each sub-unit is a polygonal chamber, and the connecting channel is located at the corner of the sound-absorbing chamber and connects to the sound-absorbing chamber. The arrangement that at least one of these sub-units has its sound-absorbing chamber connected to the sound-permeable groove through the connecting channel allows the sound generated by the fan module to enter the sound-absorbing chamber through the connecting channel of the sub-unit and dissipate. Therefore, the noise transmitted from the fan module to the hard disk module is effectively reduced to avoid the noise affecting the performance of the hard disk module.

[0008] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0009] Figure 1 This is a plan view of a server disclosed according to a first embodiment of the present invention.

[0010] Figure 2 for Figure 1 A partial planar schematic diagram of the sound-absorbing structure.

[0011] Figure 3 for Figure 2 A planar schematic diagram of the sound-absorbing unit of the sound-absorbing structure.

[0012] Figure 4 for Figure 3 A planar schematic diagram of the deformation of the sound-absorbing unit.

[0013] Figure 5 This is a plan view of the sound-absorbing unit of the sound-absorbing structure disclosed in the second embodiment of the present invention.

[0014] Figure 6 for Figure 5 A planar schematic diagram of the deformation of the sound-absorbing unit.

[0015] Component designation explanation

[0016] 1: Server

[0017] 10: Chassis

[0018] 11: Hard drive storage area

[0019] 12: Fan housing area

[0020] 13: Motherboard storage area

[0021] 14: Power Supply Area

[0022] 20: Hard disk module

[0023] 30: Fan Module

[0024] 40, 40a: Sound-absorbing structure

[0025] 41, 41a: Sound-absorbing unit

[0026] 411, 411a: Subunits

[0027] 4111, 4111a: Sound-absorbing chamber

[0028] 4112, 4112a: Connecting channels

[0029] 4113: First Surface

[0030] 4114: Second Surface

[0031] 412: Connecting part

[0032] 413, 413a: Sound-permeable grooves

[0033] 4131: First side

[0034] 4132: Second side

[0035] 4133: Third side

[0036] 4134: Fourth side

[0037] 4135: End

[0038] 4136, 4136a: Central Department

[0039] 50: Motherboard

[0040] 60: Power Supply Module

[0041] L: Length direction

[0042] H: Height direction

[0043] W1, W2: Width

[0044] T: Thickness Detailed Implementation

[0045] Please see Figure 1 and Figure 2 , Figure 1 This is a plan view of a server disclosed according to a first embodiment of the present invention. Figure 2 for Figure 1 A partial planar schematic diagram of the sound-absorbing structure.

[0046] In this embodiment, server 1 includes a chassis 10, at least one hard disk module 20, a fan module 30, and a sound-absorbing structure 40. Furthermore, server 1 may also include, for example but not limited to, a motherboard 50 and a power supply module 60.

[0047] The chassis 10 includes a hard drive housing 11, a fan housing 12, a motherboard housing 13, and a power supply housing 14. The hard drive housing 11, fan housing 12, motherboard housing 13, and power supply housing 14 are arranged sequentially along the length of the chassis 10. The hard drive module 20, fan module 30, motherboard 50, and power supply module 60 are respectively disposed in the hard drive housing 11, fan housing 12, motherboard housing 13, and power supply housing 14. A sound-absorbing structure 40 is disposed within the chassis 10 and located between the hard drive housing 11 and the fan housing 12.

[0048] The sound-absorbing structure 40, for example, is a monolithic planar auxetic metamaterial. Through precisely designed microstructures, rather than relying on the chemical composition of ordinary materials, it can impart special physical properties (such as negative mass density, negative Poisson's ratio, and negative refractive index) to block sound waves of specific frequencies. The sound-absorbing structure 40 can elastically deform along its length L and height H, and its thickness T is, for example, greater than or equal to 5 mm and less than or equal to 10 mm. The sound-absorbing structure 40 comprises multiple sound-absorbing units 41, which are arranged in a matrix and connected to each other. This design allows the sound-absorbing structure 40 to adjust its sound absorption performance by applying different strains, effectively reducing noise at different frequencies. Since these sound-absorbing units 41 have identical structures, only one will be described in detail below.

[0049] Next, please refer to the following: Figure 2 and Figure 3 . Figure 3 for Figure 2 A planar schematic diagram of the sound-absorbing unit of the sound-absorbing structure.

[0050] The sound-absorbing unit 41 includes multiple sub-units 411 and multiple connecting portions 412. These sub-units 411 are arranged in an array and connected to each other through the connecting portions 412 to form a sound-permeable groove 413. For example, the sound-permeable groove 413 is rectangular and includes a first side 4131, a second side 4132, a third side 4133, a fourth side 4134, two ends 4135, and a central portion 4136. The first side 4131 and the second side 4132 are opposite to each other, and the third side 4133 and the fourth side 4134 are opposite to each other. The two ends 4135 and the central portion 4136 are located between the third side 4133 and the fourth side 4134, and the central portion 4136 is located between the two ends 4135. The sound-absorbing unit 41 is, for example, a 20mm × 20mm cube and includes four sub-units 411 and four connecting portions 412. The four sub-units 411 are arranged in a 2×2 array. Two of the four sub-units 411 and one of the four connecting parts 412 are located on the first side 4131 of the sound-permeable groove 413. The other two of the four sub-units 411 and the other of the four connecting parts 412 are located on the second side 4132 of the sound-permeable groove 413. The remaining two of the four connecting parts 412 are located on the third side 4133 and the fourth side 4134 of the sound-permeable groove 413, respectively.

[0051] Each of these sub-units 411 includes a connected sound-absorbing chamber 4111 and a connecting channel 4112. The sound-absorbing chamber 4111 is a polygonal chamber, and the width W1 of the sound-absorbing chamber 4111 is greater than the width W2 of the connecting channel 4112. Taking one sub-unit 411 as an example, the sub-unit 411 is a hollow cube, and the sound-absorbing chamber 4111 it surrounds is a square chamber. The sub-unit 411 includes a first surface 4113 and a second surface 4114 facing each other. The first surface 4113 faces the sound-permeable groove 413, and the second surface 4114 faces away from the sound-permeable groove 413 and faces the sound-absorbing chamber 4111. The connecting channel 4112 is located at a corner of the sound-absorbing chamber 4111 and extends from the second surface 4114 to the first surface 4113. One of the connecting channels 4112 located on the first side 4131 and one of the connecting channels 4112 located on the second side 4132 are opposite each other. The sound-absorbing chambers 4111 of all sub-units 411 are connected to opposite ends 4135 of the same sound-permeable groove 413 via connecting channels 4112. These sub-units 411 are, for example, Helmholtz resonators. When sound waves pass through the sound-permeable groove 413 and enter the sound-absorbing chambers 4111 via the connecting channels 4112, the sound waves will resonate at a specific frequency, thereby absorbing and dissipating sound energy.

[0052] In this embodiment, a sound-absorbing structure 40 is disposed between the hard disk storage area 11 and the fan storage area 12. The sub-units 411 of the sound-absorbing unit 41 of the sound-absorbing structure 40 are arranged in an array and connected to each other to form a sound-permeable groove 413. The sound-absorbing chamber 4111 of each sub-unit 411 is a polygonal chamber. The connecting channel 4112 is located at the corner of the sound-absorbing chamber 4111 and connects to the sound-absorbing chamber 4111. At least one of these sub-units 411 has a sound-absorbing chamber 4111 connected to the sound-permeable groove 413 through the connecting channel 4112. When the sound generated by the fan module 30 enters the sound-absorbing chamber 4111 through the connecting channel 4112 of the sub-unit 411, the sound wave causes resonance in the sound-absorbing chamber 4111 and converts the sound energy into kinetic energy through resonance, thereby dissipating the sound. Therefore, the noise transmitted from the fan module 30 to the hard disk module 20 can be effectively reduced to avoid the noise affecting the performance of the hard disk module 20.

[0053] Furthermore, since the connecting channel 4112 is located at the corner of the sound-absorbing chamber 4111, which is an area with a large deformation of the sound-absorbing structure 40, and since one of the connecting channels 4112 on the first side 4131 and one of the connecting channels 4112 on the second side 4132 are arranged opposite to each other, the sound-absorbing structure 40 can reduce the resonant frequency and increase the range of resonant frequency that can be adjusted under different strains, thereby increasing the resonant frequency adjustment capability.

[0054] Furthermore, the connecting channel 4112 is located on one side of the sound-permeable groove 413, and the sound-absorbing chamber 4111 is designed as a square chamber, which can improve noise reduction capability. Moreover, the square chamber design of the sound-absorbing chamber 4111 can increase the utilization rate of structural space.

[0055] Previous studies observed that the performance of the hard drive module 20 decreased most significantly at a noise level of 3000Hz. This is likely because noise at this frequency causes resonance within the hard drive, thus affecting its read / write performance. In this embodiment, the sound-absorbing structure 40, without deformation in its original state, achieves a sound transmission loss (STL) greater than 5dB for noise reduction, for example, at a frequency of approximately 3100Hz, with a frequency bandwidth of 99Hz. Furthermore, by utilizing the negative Poisson's ratio characteristic of planar tensile metamaterials, different strains are applied to cause elastic deformation of the sound-absorbing structure 40. This allows the sound-absorbing structure 40 to be slightly adjusted to suit different sound frequencies under stretching or compression conditions. For example, please refer to [further details omitted]. Figure 2 and Figure 4 , Figure 4 for Figure 3A planar schematic diagram of the deformation of the sound-absorbing unit is shown. Applying a strain of -0.1 to the sound-absorbing structure 40 compresses and deforms the shape of the sound-permeable groove 413 of the sound-absorbing unit 41, allowing the sound-absorbing structure 40 to reduce noise for sounds with a frequency of approximately 2900Hz, achieving an STL greater than 5dB, and extending its frequency bandwidth to 167Hz. Applying a strain of 0.1 to the sound-absorbing structure 40 stretches and deforms the shape of the sound-permeable groove 413 of the sound-absorbing unit 41, allowing the sound-absorbing structure 40 to reduce noise for sounds with a frequency of approximately 3000Hz, achieving an STL greater than 5dB, and reducing its frequency bandwidth to 71Hz. Specifically, the noise reduction performance of the sound-absorbing structure 40 changes after applying different strains. The sound-absorbing structure 40 can be configured to elastically deform along its length (L) and height (H). After compression deformation, the sound-absorbing structure 40 can provide broader noise reduction for lower frequency (2900Hz) sounds; after stretching deformation, it can provide more precise but narrower noise reduction for higher frequency (3066Hz) sounds. This flexibility allows the sound-absorbing structure 40 to adjust its noise reduction performance according to specific needs, thereby providing optimal noise reduction effects in different application scenarios.

[0056] In this embodiment, the design of the sound-absorbing structure 40 is performed using theoretical calculations, coupled with numerical simulations for verification. This allows for the rapid design of a sound-absorbing structure 40 that meets the requirements, thus reducing costs. In this embodiment, the sound-absorbing structure 40 utilizes a planar tensile metamaterial combined with a Helmholtz resonator, offering several advantages over conventional sound-absorbing structures, including resonant frequency modulation capabilities, adjustable noise reduction bandwidth, and equivalent stress required for strain. Furthermore, the sound-absorbing structure 40 is a monolithic structure, simplifying its assembly and further reducing costs.

[0057] In this embodiment, the sub-units 411 are configured to combine Helmholtz resonant units with planar tensile metamaterials with negative Poisson's ratio. The planar tensile metamaterials have the advantage of being more easily deformable than general structures, and their structure allows for adjustment of ventilation rate. Furthermore, the thickness of the structure is not affected by deformation, making it more suitable for use in the internal space of servers.

[0058] Next, please refer to Figure 5 . Figure 5 This is a plan view of the sound-absorbing unit of the sound-absorbing structure disclosed in the second embodiment of the present invention.

[0059] The sound-absorbing structure 40a in this embodiment is similar to the sound-absorbing structure 40 in the previous embodiment. The main difference between the two is the position of the connecting channel of the sub-unit of the sound-absorbing unit. Therefore, the following mainly describes the connecting channel 4112a of the sub-unit 411a of the sound-absorbing unit 41a in this embodiment. The same parts will not be described again.

[0060] In this embodiment, the sound-absorbing chambers 4111a of these subunits 411a of the sound-absorbing unit 41a are connected to the central part 4136a of the same sound-permeable groove 413a through the connecting channel 4112a.

[0061] In this embodiment, the sound-absorbing structure 40a performs noise reduction, for example, for a sound with a frequency of approximately 3160 Hz. Furthermore, by deforming the sound-absorbing structure 40a, the applicable sound frequency can be slightly adjusted. For example, please refer to... Figure 6 , Figure 6 for Figure 5 A planar schematic diagram of the deformation of the sound-absorbing unit. Applying a strain of -0.1 to the sound-absorbing structure 40a deforms the shape of the sound-transmitting groove 413a of the sound-absorbing unit 41a, allowing the sound-absorbing structure 40a to reduce noise for sounds with a frequency of approximately 2960Hz. This configuration, allowing the sound-absorbing structure 40a to elastically deform along both its length and height, enables it to provide noise reduction for sounds of different frequencies.

[0062] It should be noted that the sound-absorbing structures 40 and 40a in the above embodiments are not limited to being elastically deformable. In other embodiments, the sound-absorbing structure may be a non-deformable structure.

[0063] On the other hand, in the above embodiments, the sound-absorbing chambers 4111 and 4111a of the subunits 411 and 411a of the sound-absorbing units 41 and 41a are connected to the same sound-permeable grooves 413 and 413a, but this is not a limitation. In other embodiments, the sound-absorbing chambers of the subunits of the sound-absorbing unit may be connected to different sound-permeable grooves respectively.

[0064] Furthermore, the shapes of the sound-absorbing units 41 and 41a of the sound-absorbing structures 40 and 40a in the above embodiments are not intended to limit the present invention, but can be adjusted according to requirements.

[0065] According to the sound-absorbing structure and server disclosed in the above embodiments, the sound-absorbing structure is disposed between the hard disk storage area and the fan storage area. The sub-units of the sound-absorbing unit of the sound-absorbing structure are arranged in an array and connected to each other to form a sound-permeable groove. The sound-absorbing chamber of each sub-unit is a polygonal chamber. The connecting channel is located at the corner of the sound-absorbing chamber and connects to the sound-absorbing chamber. The arrangement of at least one of these sub-units having its sound-absorbing chamber connected to the sound-permeable groove through the connecting channel allows the sound generated by the fan module to enter the sound-absorbing chamber through the connecting channel of the sub-unit and dissipate. Therefore, the noise transmitted from the fan module to the hard disk module is effectively reduced to avoid the noise affecting the performance of the hard disk module.

[0066] In addition, the sound-absorbing structure can be configured to elastically deform along the length and height directions, allowing it to provide noise reduction for sounds of different frequencies.

[0067] Furthermore, the design of the sound-absorbing structure utilizes theoretical calculations combined with numerical simulations for verification, enabling the rapid design of a suitable sound-absorbing structure and reducing costs. Additionally, the monolithic nature of the sound-absorbing structure facilitates assembly, further minimizing costs.

[0068] In one embodiment of the present invention, the server of the present invention can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, cloud server or vehicle networking server.

[0069] Although the present invention has been disclosed above with reference to the preferred embodiments described above, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the claims attached to this specification.

Claims

1. A sound absorbing structure, characterized by, The sound absorbing structure comprises: at least one sound absorbing unit comprising a plurality of sub-units arranged in an array and connected to each other to collectively surround a sound transmitting slot; wherein each of the plurality of sub-units comprises a sound absorbing chamber and a communication passage connected in communication, the sound absorbing chamber is a polygonal chamber, the communication passage is located at a corner of the sound absorbing chamber, and the sound absorbing chamber of at least one of the sub-units is connected to the sound transmitting slot through the communication passage.

2. The sound absorbing structure according to claim 1, characterized by The sound absorbing chambers of all the sub-units are connected to the sound transmitting slot through the communication passages respectively, the sound transmitting slot has a first side and a second side opposite to each other, and the communication passages of two of the sub-units are located at the first side and the second side of the sound transmitting slot respectively and opposite to each other.

3. The sound absorbing structure according to claim 2, wherein The number of the plurality of sub-units is four, the four sub-units are arranged in a 2x2 array, two of the four sub-units are located at the first side of the sound transmitting slot, and the other two of the four sub-units are located at the second side of the sound transmitting slot.

4. The sound absorbing structure according to claim 3, characterized by The sound absorbing chambers of the four sub-units are connected to the central part of the sound transmitting slot through the communication passages.

5. The sound absorbing structure according to claim 3, wherein The sound absorbing chambers of the four sub-units are connected to the two opposite end parts of the sound transmitting slot through the communication passages.

6. The sound absorbing structure according to claim 3, wherein Each of the four sub-units comprises a first surface and a second surface opposite to each other, the first surface faces the sound transmitting slot, the second surface is away from the sound transmitting slot and faces the sound absorbing chamber, and the communication passage extends from the second surface to the first surface.

7. The sound absorbing structure according to claim 1, wherein The plurality of sub-units are Helmholtz resonance units.

8. The sound absorbing structure according to claim 1, wherein The sound absorbing structure can be elastically deformed in the length direction and the height direction.

9. The sound absorbing structure according to claim 1, wherein The sound absorbing chamber is a square chamber.

10. A server, characterized by The sound absorbing structure comprises: a housing comprising a hard disk accommodating area and a fan accommodating area; a hard disk module arranged in the hard disk accommodating area; a fan module arranged in the fan accommodating area; and a sound absorbing structure arranged between the hard disk accommodating area and the fan accommodating area, and comprising: at least one sound absorbing unit comprising a plurality of sub-units arranged in an array and connected to each other to collectively surround a sound transmitting slot; wherein each of the plurality of sub-units comprises a sound absorbing chamber and a communication passage connected in communication, the sound absorbing chamber is a polygonal chamber, the communication passage is located at a corner of the sound absorbing chamber, and the sound absorbing chamber of at least one of the sub-units is connected to the sound transmitting slot through the communication passage.

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