A method for preparing a high-durability copper-clad ceramic substrate and the copper-clad ceramic substrate.
By adjusting the copper thickness on the back of the copper ceramic sheet according to the residual copper ratio and grinding it during the preparation process, the failure problem of DCB copper-clad ceramic substrate during thermal cycling was solved, and its thermal fatigue resistance and service life were improved.
CN122094034APending Publication Date: 2026-05-26四川富乐华半导体科技有限公司
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 四川富乐华半导体科技有限公司
- Filing Date
- 2026-02-26
- Publication Date
- 2026-05-26
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Abstract
This invention discloses a method for preparing a high-durability copper-clad ceramic substrate and the copper-clad ceramic substrate, belonging to the field of advanced ceramic preparation. The method includes the following steps: S1, sintering copper sheets onto the front and back sides of a ceramic sheet to form a copper-ceramic substrate; S2, confirming the mask pattern and calculating the residual copper rate, where residual copper rate = front copper-clad area / total area of the copper-clad ceramic substrate * 100%; S3, determining the copper thickness subtracted from the back side of the copper-ceramic substrate based on the residual copper rate, denoted as H. 减 S4, reduce copper thickness, thinning the copper on the back of the copper ceramic sheet in S1 by H. 减 S5, pattern transfer, etching, and cutting are performed using a mask to obtain the finished copper-clad ceramic substrate. This invention can improve the thermal fatigue resistance and service life of copper-clad ceramic substrates.
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