Sputtering method

Abstract

The application discloses a sputtering method, and relates to the chip sputtering technical field, wherein the sputtering method comprises the following steps: fixing a product through a fixing jig, and covering a pasting film on a module mounting area on the product and a side wall area adjacent to the module mounting area and connected with each other; then controlling a film covering equipment to paste the pasting film on the module mounting area and the side wall area; and then controlling a sputtering equipment to sputter the product, so that no plating layer appears on the module mounting area and the side wall area in the process of sputtering the product, and the process of cutting off the plating layer on the side wall surface through a cutting process is omitted, and the sputtering process of the product is simplified.

Description

Technical Field

[0001] This invention relates to the field of chip sputtering technology, and in particular to a sputtering method. Background Technology

[0002] As the design complexity of electronic device chips and the differences in EMI (Electromagnetic Interference) shielding areas increase, the antenna module area on the chip needs to be free of plating on its surface and adjacent sidewalls, while the remaining areas need to be plated. Currently, the sputtering process in the industry results in plating on the sidewalls after sputtering, requiring a cutting process to remove the plating from the sidewalls, making the entire processing process quite cumbersome. Summary of the Invention

[0003] The main objective of this invention is to propose a sputtering method that aims to solve the problem of preventing coating from appearing on the sidewalls after sputtering.

[0004] To achieve the above objectives, the present invention proposes a sputtering method, which includes the following steps:

[0005] Control the fixing fixture to fix the product; The adhesive film is applied to the module mounting area and the side wall area adjacent to and connected to the module mounting area on the product. The control laminating equipment applies the adhesive film to the module mounting area and the sidewall area; Control the sputtering equipment to sputter the product; Separate the adhesive film from the product.

[0006] In one embodiment, the laminating device includes a hot press head, and the step of controlling the laminating device to adhere the adhesive film to the module mounting area and the sidewall area includes: The hot press head is controlled to press and adhere the adhesive film to the module mounting area and the side wall area; Adjust the temperature of the hot press head until the temperature of the adhesive film reaches its softening point; The hot press head is controlled to apply pressure to the adhesive film for a preset holding time; Control the separation of the hot pressing head from the adhesive film.

[0007] In one embodiment, the hot-press head is provided with an opening groove, the opening groove having an interconnected bottom wall and side walls, the adhesive film including an interconnected end face film and a side wall film, the end face film covering the module mounting area, and the side wall film covering the side wall area; the step of controlling the hot-press head to press and adhere the adhesive film to the module mounting area and the side wall area includes: Control the movement of the hot pressing head until the bottom wall of the groove presses the end face film tightly and adheres it to the module mounting area, and the side wall of the groove presses the side wall film tightly and adheres it to the side wall area.

[0008] In one embodiment, the shape of the bottom wall of the groove is adapted to the shape of the module mounting area; And / or, the shape of the groove sidewall is adapted to the shape of the sidewall region.

[0009] In one embodiment, the adhesive film includes a substrate layer and an adhesive layer stacked together, wherein the side of the adhesive layer away from the substrate layer is used to adhere to the module mounting area and the sidewall area; The substrate layer is a polyethylene terephthalate substrate layer; And / or, the adhesive layer is a UV-curable adhesive layer; And / or, if the preset pressure holding time is defined as t, then 5s≤t≤10s; And / or, the softening point of the adhesive layer is greater than the temperature inside the sputtering chamber of the sputtering equipment. The softening point of the adhesive layer is defined as T, then 165℃≤T≤175℃.

[0010] In one embodiment, the coating equipment further includes a coating assembly, which is detachably connected to the hot press head.

[0011] In one embodiment, the area where the hot-press head abuts against the adhesive film is adapted to the shape of the module mounting area and the sidewall area.

[0012] In one embodiment, the step of controlling the sputtering equipment to sputter the product includes: Determine whether the adhesive film is in a solid state; If so, then control the sputtering equipment to sputter the product.

[0013] In one embodiment, the laminating device includes a vacuum laminating head, and the step of controlling the laminating device to adhere the adhesive film to the module mounting area and the sidewall area includes: The vacuum coating head is controlled to adhere the adhesive film to the module mounting area and the side wall area.

[0014] In one embodiment, the adhesive film includes an adhesive film; The step of separating the adhesive film from the product includes: The adhesive film is irradiated with ultraviolet light to reduce its adhesiveness; Separate the adhesive film from the product; Alternatively, the step of separating the adhesive film from the product includes: The heater is controlled to heat the adhesive film to reduce its stickiness; Separate the adhesive film from the product.

[0015] In the technical solution of this invention, the product is fixed by a fixing fixture, and then a film is applied to the module mounting area and the adjacent and interconnected side wall area of ​​the product. A film-coating device is then controlled to apply the film to the module mounting area and the side wall area. Finally, a sputtering device is controlled to sputter the product. Since the film is applied to both the side wall area and the module mounting area, no coating appears on either the module mounting area or the side wall area during the sputtering process. This eliminates the need for a cutting process to remove the coating from the side wall surface, simplifying the sputtering process. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a schematic flowchart of the first embodiment of the sputtering method provided by the present invention; Figure 2 This is a schematic flowchart of a second embodiment of the sputtering method provided by the present invention; Figure 3 This is a schematic flowchart of the third embodiment of the sputtering method provided by the present invention; Figure 4 This is a schematic flowchart of the fourth embodiment of the sputtering method provided by the present invention; Figure 5 This is a schematic flowchart of the fifth embodiment of the sputtering method provided by the present invention; Figure 6 This is a schematic flowchart of the sixth embodiment of the sputtering method provided by the present invention; Figure 7 This is a schematic flowchart of the seventh embodiment of the sputtering method provided by the present invention; Figure 8 This is a schematic diagram of the structure of the product before sputtering provided by the present invention; Figure 9 This is a schematic diagram of the structure provided by the present invention, showing the application film covering the installation module area and the side wall area; Figure 10 This is a partial structural schematic diagram from another perspective of the present invention, showing the adhesive film covering the installation module area and the side wall area. Figure 11 This is a partial structural diagram of the hot pressing head provided by the present invention for hot pressing the adhesive film. Figure 12 A partial structural diagram showing the adhesive film provided by the present invention tightly adhering to the module mounting area and the side wall area; Figure 13 This is a schematic diagram of the structure of the product after sputtering and the coated film provided by the present invention. Figure 14 A schematic diagram of the product structure provided by the present invention, showing the removal of the adhesive film after sputtering; Figure 15 for Figure 14 A structural diagram at point AA.

[0018] Explanation of icon numbers: 100. Hot pressing head; 1. Body part; 11. Groove bottom wall; 2. Side wall part; 21. Groove side wall; 3. Opening groove; 200. Adhesive film; 201. End face film; 202. Sidewall film; 300. Product; 301. Module installation area; 302. Side wall area; 400. Coating.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0023] As the design complexity of electronic device chips and the differences in EMI shielding areas increase, the antenna module area on the chip must be free of plating on its surface and adjacent sidewalls, while the remaining areas must be plating. Currently, the sputtering process in the industry results in plating on the sidewalls after sputtering, requiring a cutting process to remove the plating from the sidewalls, making the entire processing process quite cumbersome.

[0024] The inventors discovered that existing sputtering methods involve fixing the product with a fixture, where the bottom of the product contacts the fixture and the fixture contacts part of the product's sidewalls. Then, tape is applied to the surface of the antenna area before sputtering, and the tape is removed. Because the sidewalls adjacent to the antenna module area lack effective protection in the existing process, a coating appears on the sidewalls after sputtering, requiring a cutting process to remove this coating. This makes the entire sputtering process quite cumbersome.

[0025] This invention proposes a sputtering method aimed at solving the technical problem of preventing coating from appearing on the sidewalls after sputtering.

[0026] Please see Figure 1 , Figure 1 This is a schematic flowchart of a first embodiment of the sputtering method provided by the present invention; in one embodiment of the present invention, the sputtering method includes the following steps: S100, controls the fixing fixture to fix the product; The fixing fixture (not shown in the figure) generally includes a fixed base and a movable base. The movable base is hinged to the fixed base. Both the movable base and the fixed base have an adhesive layer on the side facing the product 300. In the initial state, the top surfaces of the fixed base and the movable base are on the same plane. The product 300 is placed on the fixed base, and then the movable base is flipped upwards, so that the movable base abuts against the side wall of the lower half of the product 300 by the adhesive layer on it, thereby fixing and positioning the product 300. Other forms of fixtures can also be used for fixing fixtures. For example, the product 300 can be fixed and positioned by setting a receiving groove on the fixing fixture. Existing fixtures can be used for fixing fixtures, and there are no restrictions on the way the fixing fixture fixes the product 300.

[0027] S200, covering the module mounting area and the side wall area adjacent to and connected to the module mounting area on the product with an adhesive film; Please see Figure 8 , Figure 9 and Figure 10 The module mounting area 301 and side wall area 302 on the product 300 are covered by an adhesive film 200, wherein the side wall area 302 is adjacent to the module mounting area 301 and the two are connected to each other. The adhesive film 200 can be directly placed on the module mounting area 301 and the side wall area 302, or the adhesive film 200 can first contact the module mounting area 301 and then the other part of the adhesive film 200 that is not in contact with the module mounting area 301 can hang freely to cover the side wall area 302. The method of covering the module mounting area 301 and the side wall area 302 on the product 300 with the adhesive film 200 is not limited here.

[0028] S300, control the laminating equipment to apply the laminating film to the module mounting area and the side wall area; Please see Figure 11 and Figure 12 The coating film 200 is tightly adhered to the module mounting area 301 and the side wall area 302 using an encapsulation device, ensuring that there are no gaps between the coating film 200 and the module mounting area 301, and between the coating film 200 and the side wall area 302. This guarantees that no plating layer 400 will appear in the module mounting area 301 and the side wall area 302. The coating device can be a vacuum coating device or a hot pressing device. That is, the coating film 200 can be adhered to the module mounting area 301 and the side wall area 302 using a vacuum coating device or a hot pressing device. There is no limitation on this.

[0029] S400, controls the sputtering equipment to sputter the product; Please see Figure 13 When using existing sputtering equipment to sputter the product 300, the coating 400 will enter an extremely narrow gap due to the characteristics of the existing sputtering process. However, since this application tightly adheres the adhesive film 200 to the module mounting area 301 and the side wall area 302, there is no gap between the adhesive film 200 and the module mounting area 301 and the side wall area 302. Therefore, even when using the existing sputtering process, it is still possible to effectively avoid the coating 400 from appearing in the module mounting area 301 and the side wall area 302.

[0030] S500, the adhesive film is separated from the product.

[0031] Please see Figure 14 and Figure 15 After separating the adhesive film 200 from the product 300, the module installation area 301 and the side wall area 302 are exposed to facilitate the installation of the corresponding modules.

[0032] The technical solution of this invention involves fixing the product 300 using a fixing fixture, then covering the module mounting area 301 and the adjacent and interconnected sidewall area 302 of the product 300 with an adhesive film 200; then controlling a laminating device to tightly adhere the adhesive film 200 to the module mounting area 301 and the sidewall area 302, ensuring no gaps between the adhesive film 200 and the module mounting area 301 and the sidewall area 302; and finally controlling a sputtering device to sputter the product 300. In the sputtering process of product 300, since both the sidewall region 302 and the module mounting region 301 are fitted with a bonding film 200, and there are no gaps between the bonding film 200 and the module mounting region 301 and the sidewall region 302, the sputtering layer 400 will not appear in either the module mounting region 301 or the sidewall region 302. This eliminates the need for cutting the sidewall surface coating layer 400, simplifying the sputtering process of product 300 and reducing its cost. It should be noted that product 300 can be a chip in an electronic device, such as headphones, mobile phones, AR (Augmented Reality), VR (Virtual Reality) devices, etc., without limitation. The module mounting region 301 can be used to mount an antenna module or other existing modules, without limitation.

[0033] It should also be noted that although the fixing fixture also clamps and shields part of the side wall of product 300, if the fixing fixture is improved to shield the side wall area 302, due to the positional tolerance of different products 300 placed on the fixing fixture, it cannot be guaranteed that there is zero gap between the side wall area 302 of each product 300 and the fixing fixture when relying on the fixing fixture to shield the side wall area 302. Once a gap exists, the plating layer 400 will appear on the side wall area 302, resulting in product 300 defects. The technical solution of the present invention uses the adhesive film 200 to fit tightly against the module mounting area 301 and the side wall area 302, so that there is no gap between the adhesive film 200 and the module mounting area 301 and the side wall area 302, effectively avoiding the appearance of plating layer 400 between the module mounting area 301 and the side wall area 302.

[0034] Furthermore, if the side wall area 302 is shielded by a fixture, an additional cleaning process for the fixture itself is required after sputtering, which increases the process flow and is not worthwhile. The technical solution of the present invention can tightly adhere to the module mounting area 301 and the side wall area 302 through the application film 200, effectively avoiding the formation of a plating layer 400 between the module mounting area 301 and the side wall area 302. After sputtering, the application film 200 can be removed as in the existing process without adding any additional process flow. It should be noted that existing sputtering processes also require the use of related equipment to adhere tape to the surface of the antenna area. However, existing sputtering processes do not cover the side wall area 302 during the process of adhering tape to the antenna area surface. This application achieves the same effect of tightly adhering the adhesive film 200 to the module mounting area 301 and the side wall area 302. Therefore, this application does not add any new steps compared to the existing sputtering process. Instead, it eliminates the process of cutting the coating 400 on the side wall area 302, making the entire process simpler and more economical.

[0035] Please see Figure 2 , Figure 2 This is a schematic flowchart of a second embodiment of the sputtering method provided by the present invention; in one embodiment, the coating equipment includes a hot pressing head, and step S300 includes: S310, control the hot pressing head to press the adhesive film tightly and adhere it to the module mounting area and the side wall area; S320, Adjust the temperature of the hot press head until the temperature of the adhesive film reaches the softening point; S330, control the hot pressing head to apply pressure to the adhesive film for a preset holding time; S340, control the separation of the hot pressing head from the adhesive film.

[0036] The hot press head 100 is controlled to move, pressing the adhesive film 200 tightly and adhering it to the module mounting area 301 and the side wall area 302. The temperature of the hot press head 100 is then increased so that the temperature of the adhesive film 200 in contact with the hot press head 100 rises to the softening point, i.e., the adhesive film 200 softens, so as to fill the pores. Then, the hot press head 100 applies pressure to the adhesive film 200 for a preset holding time, which helps to densify the adhesive film 200 and eliminate the pores between the adhesive film 200 and the module mounting area 301 and the side wall area 302, thereby ensuring that the plating layer 400 will not appear in the module mounting area 301 and the side wall area 302.

[0037] Please see Figure 3 , Figure 3 This is a schematic flowchart of a third embodiment of the sputtering method provided by the present invention; in one embodiment, the hot pressing head is provided with an opening groove, the opening groove having a bottom wall and a side wall connected to each other, the bonding film including an end face film and a side wall film connected to each other, the end face film being used to cover the module mounting area, the side wall film being used to cover the side wall area; step S310 includes: S311, control the movement of the hot pressing head until the bottom wall of the groove presses the end face film tightly and adheres it to the module installation area, and the side wall of the groove presses the side wall film tightly and adheres it to the side wall area.

[0038] By providing an opening groove 3 on the hot press head 100, a structure is provided to apply pressure to the side of the adhesive film 200 that is attached to the module mounting area 301 and the side wall area 302 away from the product 300, ensuring that the adhesive film 200 can be tightly attached to the module mounting area 301 and the side wall area 302; specifically, the end face film 201 is pressed and attached to the module mounting area 301 by the bottom wall 11 of the groove, and the side wall film 202 is pressed and attached to the side wall area 302 by the side wall 21 of the groove.

[0039] Please see Figure 11 In one embodiment, the shape of the bottom wall 11 of the groove is adapted to the shape of the module mounting area 301; wherein, the shape of the bottom wall 11 of the groove is adapted to the shape of the module mounting area 301, so that the end face film 201 in contact with the bottom wall 11 can be better pressed and adhered to the module mounting area 301 by the bottom wall 11 of the groove, thereby ensuring that there is no gap between the end face film 201 and the module mounting area 301.

[0040] Please see Figure 11In one embodiment, the shape of the groove sidewall 21 is adapted to the shape of the sidewall region 302. This adaptation allows the sidewall membrane 202, which contacts the groove sidewall 21, to be better pressed and adhered to the sidewall region 302, ensuring that there are no gaps between the sidewall membrane 202 and the sidewall region 302.

[0041] In one embodiment, the adhesive film includes a substrate layer and an adhesive layer stacked together. The side of the adhesive layer away from the substrate layer is used to adhere to the module mounting area and the sidewall area. The substrate layer is a polyethylene terephthalate substrate layer, which has good heat resistance and can remain solid when the temperature reaches the softening point of the adhesive layer.

[0042] In one embodiment, the adhesive layer is a UV-curable adhesive layer; the adhesive layer is a UV (Ultraviolet) adhesive, which has the characteristic of fast curing speed, thereby helping to shorten the time required for the adhesive layer to cure and improve the sputtering efficiency of the product.

[0043] In one embodiment, the softening point of the adhesive layer is defined as T, then 165℃≤T≤175℃; wherein, the softening point of the UV-curable adhesive layer is between 165℃ and 175℃, and the softening point can be 170℃. The temperature inside the sputtering chamber during the sputtering process is generally around 150℃. In order to avoid the adhesive layer softening during the sputtering process and causing the formation of a coating on the sidewall area, a UV-curable adhesive layer with a softening point between 165℃ and 175℃ is selected.

[0044] In one embodiment, the preset pressure holding time is defined as t, then 5s≤t≤10s; wherein, the preset pressure holding time is between 5 seconds and 10 seconds, which provides a guarantee for eliminating the gaps between the adhesive film 200 and the module mounting area 301, and also provides a guarantee for eliminating the gaps between the adhesive film 200 and the side wall area 302; the preset pressure holding time can be 5 seconds.

[0045] In one embodiment, the softening point of the adhesive film 200 is higher than the temperature inside the sputtering chamber of the sputtering equipment. Since heat is also generated during the sputtering process of the product 300, to prevent the adhesive film 200 from softening during sputtering and causing a coating 400 to appear on the sidewall region 302, the softening point of the adhesive film 200 is higher than the temperature inside the sputtering chamber of the sputtering equipment. This ensures that the adhesive film 200 remains in a rigid state during the sputtering process of the product 300, thereby guaranteeing that no coating 400 will appear on the sidewall region 302 and the module mounting region 301.

[0046] In one embodiment, the coating equipment further includes a coating assembly (not shown), which is detachably connected to the hot press head 100. Since the shapes of the module mounting area 301 and side wall area 302 differ among different products 300, this solution detachably connects the hot press head 100 to the coating assembly, allowing the user to select a suitable hot press head 100 based on the shape of the module mounting area 301 and side wall area 302 of the product being processed. This ensures a better fit between the shape of the tank bottom wall 11 and the shape of the module mounting area 301, and between the shape of the tank side wall 21 and the shape of the side wall area 302. This allows the hot press head 100 to better press the adhesive film 200 firmly against the module mounting area 301 and side wall area 302, preventing the coating 400 from appearing on the side wall area 302 and module mounting area 301. It should be noted that the coating assembly is an existing assembly. The coating assembly can be detachably connected to the hot press head 100 by bolts and nuts, or by the snap-fit ​​of a clip and a slot. There are no restrictions on the connection method between the coating assembly and the hot press head 100.

[0047] Please see Figure 11 According to one embodiment of the present invention, the hot pressing head 100 includes a detachably connected body portion 1 and a sidewall portion 2. The body portion 1 is detachably connected to the coating assembly. The body portion 1 and the sidewall portion 2 form an opening groove 3. The body portion 1 forms the bottom wall 11 of the opening groove 3, and the sidewall portion 2 forms the sidewall 21 of the opening groove 3. Considering that some products 300 have the same shape for the sidewall region 302, with only the shape of the module mounting region 301 varying; or the module mounting region 301 has the same shape, with only the sidewall region 302 varying; in order to reduce the difficulty of adapting the hot pressing head 100 to different shaped module mounting regions 301 or sidewall regions 302... Regarding cost, this solution detachably connects the sidewall portion 2 to the main body portion 1. When the module mounting area 301 remains unchanged, but the shape of the sidewall area 302 changes, only the sidewall portion 2 can be removed and replaced with a sidewall portion 2 that matches the shape of the sidewall area 302, without having to replace the entire hot pressing head 100, thus reducing the cost of adapting the hot pressing head 100 to different shaped sidewall areas 302. When the sidewall area 302 remains unchanged, but the module mounting area 301 changes, the main body portion 1 can also be replaced separately, thus reducing the cost of adapting the hot pressing head 100 to different shaped module mounting areas 301. It should be noted that the main body portion 1 and the sidewall portion 2 can be detachably connected by bolts and nuts, or by a snap-fit ​​mechanism between a locking block and a locking slot. The connection method between the main body portion 1 and the sidewall portion 2 is not limited here.

[0048] Please see Figure 11In one embodiment, the area where the hot-press head 100 abuts against the adhesive film 200 is adapted to the shape of the module mounting area 301 and the sidewall area 302. Specifically, the shape of the groove bottom wall 11 is adapted to the shape of the module mounting area 301, and the shape of the groove sidewall 21 is adapted to the shape of the sidewall area 302. This allows the hot-press head 100 to better press the adhesive film 200 tightly against the module mounting area 301 and the sidewall area 302, ensuring that the plating layer 400 does not appear on the sidewall area 302 and the module mounting area 301.

[0049] Please see Figure 5 , Figure 5 This is a schematic flowchart of the fifth embodiment of the sputtering method provided by the present invention; in one embodiment, step S400 includes: S410, determine whether the adhesive film is in a solid state; S411, if so, then control the sputtering equipment to sputter the product.

[0050] Whether the adhesive film 200 is in a solid state can be determined by whether the separation time between the hot pressing head 100 and the adhesive film 200 reaches a preset time, or by detecting the temperature of the adhesive film 200. There are no restrictions on how to determine whether the adhesive film 200 is in a solid state. If the adhesive film 200 is in a solid state, sputtering can be performed on the product 300. If the adhesive film 200 is not in a solid state, the steps of S410 are repeated. If sputtering is performed on the side wall area 302 before the adhesive film 200 is in a solid state, a coating 400 may appear. Therefore, the product 300 needs to be sputtered after the adhesive film 200 has cured to ensure that a coating 400 does not appear on the side wall area 302.

[0051] Please see Figure 4 , Figure 4 This is a schematic flowchart of the fourth embodiment of the sputtering method provided by the present invention; in one embodiment, the coating equipment includes a vacuum coating head, and step S300 includes: S310', control the vacuum coating head to adhere the adhesive film to the module mounting area and the side wall area.

[0052] For products 300 with relatively regular shapes, such as module mounting area 301 and side wall area 302, a vacuum laminating head can be used to apply the laminating film 200 to the module mounting area 301 and side wall area 302. The vacuum laminating head is suitable for module mounting areas 301 and side wall areas 302 of various shapes, even those with regular shapes, such as a flat, concave, or convex surface for module mounting area 301, and a flat, concave, or convex surface for side wall area 302. In other words, a single vacuum laminating head can adhere the adhesive film 200 to the module mounting area 301 and side wall area 302 of these shapes without the need to replace the head. Compared with the hot pressing head 100, this eliminates the head replacement process and offers better adaptability. However, for cases where the shapes of the module mounting area 301 and side wall area 302 are more complex, such as when there are slits on the surface of the module mounting area 301, it is necessary to replace the hot pressing head 100 with one that matches the shape to effectively ensure that the adhesive film 200 is tightly adhered to the inner wall of the slit.

[0053] Please see Figure 6 , Figure 6 This is a schematic flowchart of a sixth embodiment of the sputtering method provided by the present invention; in one embodiment, the bonding film includes a bonding film; The steps of S500 include: S510, control the ultraviolet lamp to irradiate the adhesive film to reduce the adhesiveness of the adhesive film; S520, Separate the adhesive film from the product; Alternatively, please see Figure 7 , Figure 7 This is a schematic flowchart of the seventh embodiment of the sputtering method provided by the present invention; step S500 includes: S510', Control the heater to heat the adhesive film to reduce the adhesiveness of the adhesive film; S520', Separate the adhesive film from the product.

[0054] If the adhesive film is a UV adhesive film, its viscosity will decrease when the adhesive film is irradiated with UV light, so as to separate the adhesive film from the product 300; the adhesive film can also be heated by a heater, and as the temperature rises, the viscosity of the adhesive film will decrease, so as to separate the adhesive film from the product 300.

[0055] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A sputtering method, characterized in that, The sputtering method includes the following steps: Control the fixing fixture to fix the product; The adhesive film is applied to the module mounting area and the side wall area adjacent to and connected to the module mounting area on the product. The control laminating equipment applies the adhesive film to the module mounting area and the sidewall area; Control the sputtering equipment to sputter the product; Separate the adhesive film from the product.

2. The sputtering method as described in claim 1, characterized in that, The laminating equipment includes a hot pressing head, and the step of controlling the laminating equipment to adhere the film to the module mounting area and the sidewall area includes: The hot press head is controlled to press and adhere the adhesive film to the module mounting area and the side wall area; Adjust the temperature of the hot press head until the temperature of the adhesive film reaches its softening point; The hot press head is controlled to apply pressure to the adhesive film for a preset holding time; Control the separation of the hot pressing head from the adhesive film.

3. The sputtering method as described in claim 2, characterized in that, The hot pressing head is provided with an opening groove, the opening groove having an interconnected bottom wall and side wall, the adhesive film including an interconnected end face film and side wall film, the end face film being used to cover the module mounting area, the side wall film being used to cover the side wall area; The step of controlling the hot pressing head to press and adhere the adhesive film to the module mounting area and the side wall area includes: Control the movement of the hot pressing head until the bottom wall of the groove presses the end face film tightly and adheres it to the module mounting area, and the side wall of the groove presses the side wall film tightly and adheres it to the side wall area.

4. The sputtering method as described in claim 3, characterized in that, The shape of the bottom wall of the groove is adapted to the shape of the module installation area; And / or, the shape of the groove sidewall is adapted to the shape of the sidewall region.

5. The sputtering method as described in claim 2, characterized in that, The adhesive film includes a substrate layer and an adhesive layer stacked together, and the side of the adhesive layer away from the substrate layer is used to adhere to the module mounting area and the sidewall area. The substrate layer is a polyethylene terephthalate substrate layer; And / or, the adhesive layer is a UV-curable adhesive layer; And / or, if the preset pressure holding time is defined as t, then 5s≤t≤10s; And / or, the softening point of the adhesive layer is greater than the temperature inside the sputtering chamber of the sputtering equipment. The softening point of the adhesive layer is defined as T, then 165℃≤T≤175℃.

6. The sputtering method as described in claim 2, characterized in that, The coating equipment also includes a coating assembly, which is detachably connected to the hot press head.

7. The sputtering method as described in claim 6, characterized in that, The area where the hot-press head abuts against the adhesive film is adapted to the shape of the module mounting area and the sidewall area.

8. The sputtering method as described in claim 2, characterized in that, The steps of controlling the sputtering equipment to sputter the product include: Determine whether the adhesive film is in a solid state; If so, then control the sputtering equipment to sputter the product.

9. The sputtering method as described in claim 1, characterized in that, The laminating equipment includes a vacuum laminating head, and the step of controlling the laminating equipment to adhere the film to the module mounting area and the sidewall area includes: The vacuum coating head is controlled to adhere the adhesive film to the module mounting area and the side wall area.

10. The sputtering method according to any one of claims 1 to 9, characterized in that, The step of separating the adhesive film from the product includes: The adhesive film is irradiated with ultraviolet light to reduce its adhesiveness; Separate the adhesive film from the product; Alternatively, the step of separating the adhesive film from the product includes: The heater is controlled to heat the adhesive film to reduce its stickiness; Separate the adhesive film from the product.

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