Substrate carrier, transport system, vacuum system, and method of operating substrate carrier

By placing a high-emissivity heat-absorbing sheet in the groove of the substrate carrier, the problem of temperature rise in heat-sensitive substrates during vacuum coating is solved, achieving efficient heat dissipation and reducing system complexity and cost.

CN122105346APending Publication Date: 2026-05-29VON ARDENNE VACUUM EQUIPMENT (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202610316577.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-03-16
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing technologies for vacuum coating heat-sensitive substrates involve unnecessary chemical or physical changes due to temperature increases, and active surface cooling increases system complexity and cost while reducing the coating rate.

Method used

A substrate carrier is designed, comprising a support frame and a heat-absorbing sheet in a groove on the bottom side of the substrate support surface. The emissivity of the heat-absorbing sheet is higher than that of the bottom surface of the groove. Effective heat dissipation is achieved through the surface design of different emissivity, avoiding the use of active cooling surfaces.

Benefits of technology

Effective heat dissipation of the substrate was achieved without reducing processing efficiency, simplifying the technology and reducing costs, while avoiding unnecessary changes caused by temperature rise.

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Abstract

The invention provides a substrate carrier, a conveying system, a vacuum system and an operation method of the substrate carrier, the substrate carrier comprises a bearing frame, substrate bearing surfaces, grooves and heat absorption sheets, the substrate bearing surfaces are used for placing substrates, the bottom side of each substrate bearing surface is provided with the grooves, the bottom surfaces of the grooves are provided with the heat absorption sheets, and the heat absorption sheets are arranged on the bottom surfaces of the grooves. The emissivity of the first surface, facing the substrate bearing surface, of the heat absorption sheet is larger than the emissivity of the bottom surface of the groove and / or the second surface of the heat absorption sheet, under the condition, the low-emissivity surface can restrain heat loss, and the high-emissivity surface can allow heat to efficiently pass through. Therefore, the first surface of the heat absorption sheet can absorb heat radiation of the substrate again and transmit the heat radiation to the second surface or the bottom surface of the groove, and a good heat dissipation effect is achieved. The technology is simple and low in cost, the coating speed does not need to be reduced, and the temperature rise problem of the substrate can be effectively solved while the treatment efficiency is not reduced.
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