Substrate carrier, transport system, vacuum system, and method of operating substrate carrier
By placing a high-emissivity heat-absorbing sheet in the groove of the substrate carrier, the problem of temperature rise in heat-sensitive substrates during vacuum coating is solved, achieving efficient heat dissipation and reducing system complexity and cost.
Patent Information
- Application Number
- CN202610316577.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-16
- Publication Date
- 2026-05-29
AI Technical Summary
Existing technologies for vacuum coating heat-sensitive substrates involve unnecessary chemical or physical changes due to temperature increases, and active surface cooling increases system complexity and cost while reducing the coating rate.
A substrate carrier is designed, comprising a support frame and a heat-absorbing sheet in a groove on the bottom side of the substrate support surface. The emissivity of the heat-absorbing sheet is higher than that of the bottom surface of the groove. Effective heat dissipation is achieved through the surface design of different emissivity, avoiding the use of active cooling surfaces.
Effective heat dissipation of the substrate was achieved without reducing processing efficiency, simplifying the technology and reducing costs, while avoiding unnecessary changes caused by temperature rise.