Split laser measuring device, system and management platform

Abstract

The present disclosure provides a split laser measuring device, system and management platform, wherein the split laser measuring device comprises a signal processing unit, a first laser adaptation unit and a second laser adaptation unit; the first laser adaptation unit is respectively connected with the signal processing unit and the second laser adaptation unit by optical fiber; the signal processing unit and the first laser adaptation unit are both arranged outside the radiation environment, and the second laser adaptation unit is arranged in the radiation environment; by arranging the signal processing unit and the first laser adaptation unit outside the radiation environment, the sensitive electronic elements in the signal processing unit are isolated from the harsh environment, and at the same time, high-precision and rapid vibration measurement of the target to be measured is realized, and the radiation resistance, reliability and stability of the split laser measuring device are improved.

Description

Technical Field

[0001] This disclosure relates to the field of signal acquisition and processing in nuclear power plants, and in particular to a split-type laser measurement device, system and management platform. Background Technology

[0002] Numerous electrical devices are used within a reactor, and these devices are crucial for reactor operation, control, and safety. Normally, electrical motors vibrate minimally during normal operation. However, when abnormalities or malfunctions occur, abnormal vibrations and increased amplitude appear. Extracting characteristic vibration signals from these motors is a common and effective method for monitoring their operational health. Therefore, to ensure the normal operation of a reactor, high-temperature resistant, radiation-resistant, and vibration-resistant motor vibration testing equipment is required.

[0003] However, traditional laser vibration meters are integrated units, encapsulating optical sensor components (emitting and receiving light), data processing components, computing components, and communication unit components together to form a compact and small vibration measurement system.

[0004] However, integrating electronic components into a laser-integrated vibration measurement unit makes traditional laser vibration measurement, like vibration measurement based on the piezoelectric effect, susceptible to damage due to the aging of electronic components caused by high temperatures and radiation. Summary of the Invention

[0005] The technical problem to be solved by this disclosure is to overcome the shortcomings of the prior art, which encapsulates optical sensor components (emitting and receiving light), data processing components, computing processing components and communication unit components together, making them extremely susceptible to damage due to aging of electronic devices under high temperature and irradiation environments. The disclosure provides a split-type laser measurement device, system and management platform.

[0006] This disclosure solves the above-mentioned technical problems through the following technical solution:

[0007] According to a first aspect of this disclosure, a split-type laser measuring device is provided, the laser measuring device comprising:

[0008] Signal processing unit, first laser adapter unit and second laser adapter unit;

[0009] The first laser adapter unit is communicatively connected to both the signal processing unit and the second laser adapter unit.

[0010] The signal processing unit and the first laser adapter unit are both located outside the radiation environment, while the second laser adapter unit is located in the radiation environment.

[0011] The signal processing unit is used to send test light signals to the first laser adapter unit;

[0012] The first laser adapter unit is used to send the received test optical signal to the second laser adapter unit;

[0013] The second laser adapter unit is used to receive the test light signal and send the test light signal to the object under test in the radiation environment;

[0014] The second laser adapter unit is also used to receive the actual light signal reflected by the surface of the object under test based on the test light signal, and to send the actual light signal to the signal processing unit through the first laser adapter unit;

[0015] The signal processing unit is also used to obtain the actual parameter information of the object under test based on the actual optical signal.

[0016] Optionally, the first laser adapter unit includes a first laser adapter and a first focusing lens;

[0017] The second laser adapter unit includes a second laser adapter and a second collimating lens;

[0018] The first focusing lens is disposed between the signal processing unit and the first laser adapter unit;

[0019] The second collimating lens is positioned between the second laser adapter unit and the object to be tested;

[0020] The first laser adapter and the second laser adapter are connected via optical fiber;

[0021] The first focusing lens is used to focus the test light signal onto the first laser adapter, or to focus the actual light signal onto the signal processing unit;

[0022] The first laser adapter is used to couple the test optical signal to the optical fiber, or to export the actual optical signal to the first focusing lens;

[0023] The second laser adapter is used to export the test optical signal in the optical fiber to the second collimating lens, or to couple the actual optical signal to the optical fiber;

[0024] The second collimating lens is used to focus the test light signal onto the object under test, or to focus the light signal actually reflected from the surface of the object under test onto the second laser adapter.

[0025] Optionally, the first laser adapter and the second laser adapter include an FC / APC adapter (a precision device for connecting fiber optic connectors).

[0026] Optionally, the signal processing unit includes: a laser sensor assembly and a data processing assembly;

[0027] The laser sensor assembly is communicatively connected to the data processing assembly; the laser sensor assembly is used to emit the test light signal to the first laser adapter unit and receive the actual light signal, and send the actual light signal to the data processing assembly.

[0028] The data processing component is used to receive the actual optical signal and obtain the actual vibration parameter information of the object under test based on the actual optical signal.

[0029] Optionally, the data processing component includes a signal acquisition subunit and a parameter calculation subunit;

[0030] The signal acquisition subunit is communicatively connected to the parameter calculation subunit.

[0031] The signal acquisition subunit is used to acquire beat frequency signal information and interference fringe shift quantity information based on the test optical signal and the actual optical signal;

[0032] The parameter calculation subunit is used to receive the beat frequency signal and the number of interference fringe movements, and to calculate and process the information of the beat frequency signal and the number of interference fringe movements to obtain the actual vibration parameter information of the object under test.

[0033] Optionally, the actual parameter information includes vibration displacement information;

[0034] The parameter calculation subunit is used to perform calculation processing on the beat frequency signal based on Fourier transform to obtain the frequency information during vibration;

[0035] Based on the information on the number of interference fringes shifted during the vibration process, the vibration displacement of the object is obtained.

[0036] Optionally, the actual parameter information may also include vibration displacement information, vibration velocity information, and vibration acceleration information;

[0037] The data processing component includes a time acquisition subunit;

[0038] The time acquisition subunit is communicatively connected to the parameter calculation subunit;

[0039] The time acquisition subunit is used to acquire the beat frequency information after the incident light and reflected light interfere after the object vibrates, and send the beat frequency information to the parameter calculation subunit;

[0040] The parameter calculation subunit is used to obtain the beat frequency information and to obtain the vibration velocity information of the object under test based on the vibration displacement and the beat frequency information.

[0041] Optionally, the signal processing unit further includes a communication unit component;

[0042] The communication unit component is communicatively connected to the data processing component;

[0043] The communication unit component is used to receive the actual parameter information and send the actual vibration parameter information to an external terminal device.

[0044] According to a second aspect of this disclosure, a split-type laser measurement system is provided, the split-type laser measurement system including the split-type laser measurement device described in the first aspect of this disclosure.

[0045] According to a third aspect of this disclosure, a management platform is provided, the management platform including the split-type laser measurement system and the interactive interface described in the second aspect of this disclosure.

[0046] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of this disclosure.

[0047] The positive and progressive effects of this disclosure are as follows:

[0048] In the split-type laser measurement device provided in this disclosure, by placing both the signal processing unit and the first laser adapter unit outside the radiation environment, the sensitive electronic components in the signal processing unit are isolated from the harsh environment, while high-precision and rapid vibration measurement of the target object is achieved, thus improving the reliability and stability of the split-type laser measurement device. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the piezoelectric vibration measurement sensor provided in Embodiment 1 of this disclosure;

[0050] Figure 2 This is a schematic diagram of the conventional laser vibration measurement principle provided in Embodiment 1 of this disclosure;

[0051] Figure 3 This is a schematic diagram of the split-type laser measurement device provided in Embodiment 1 of this disclosure;

[0052] Figure 4 This is a schematic diagram of the signal processing unit provided in Embodiment 1 of this disclosure;

[0053] Figure 5 This is a schematic diagram of the measurement principle of the split-type laser measurement device provided in Embodiment 1 of this disclosure;

[0054] Figure 6 This is a structural diagram of the actual scene layout provided in Embodiment 1 of this disclosure. Detailed Implementation

[0055] The present disclosure is further illustrated below by way of embodiments, but the present disclosure is not limited to the scope of the embodiments described herein.

[0056] The prefixes such as "first" and "second" used in this disclosure are merely for distinguishing different descriptive objects and do not limit the position, order, priority, quantity, or content of the described objects. The use of ordinal numbers and other prefixes used to distinguish descriptive objects in this disclosure does not constitute a limitation on the described objects. The description of the described objects is given in the claims or the context of the embodiments, and should not be construed as an unnecessary limitation. Furthermore, in the description of this embodiment, unless otherwise stated, "multiple" means two or more.

[0057] Traditional vibration sensors based on the piezoelectric effect of quartz crystals and artificially polarized ceramics (PZT) using compression or shear-mounted patch designs require mounting on the device under test. These patch-mount vibration sensors have built-in data processing and computing units, making them suitable for vibration measurement in general industrial environments and well-suited for general industrial requirements. The principle of piezoelectric vibration measurement sensors is as follows: Figure 1 As shown.

[0058] Traditional vibration sensors based on the piezoelectric effect are simple in principle, small in size, and easy to install, and have been widely used in vibration measurement of industrial equipment.

[0059] However, since the reactor motor is typically installed in an environment with high temperature and high radiation, if the reactor motor vibration measurement uses traditional vibration sensors based on the piezoelectric effect, the electronic components inside the sensors are easily damaged by high temperature and radiation, which would affect the monitoring results of the vibration monitoring system. Therefore, traditional piezoelectric vibration monitoring equipment is not suitable for vibration monitoring in reactors and other environments with harsh conditions.

[0060] Traditional laser non-contact measurement equipment does not require installation on the equipment being monitored. It can be installed in areas far from the equipment, with relatively low temperatures and weak radiation intensity. It also offers advantages such as fast measurement speed, high accuracy, and non-contact operation. Compared to traditional piezoelectric vibration sensors, traditional laser non-contact vibration measurement is more suitable for harsh in-pile environments. The principle of traditional laser vibration measurement is described in [link to traditional laser vibration measurement principle]. Figure 2 As shown.

[0061] However, traditional laser vibrometers are integrated units, encapsulating optical sensor components (emitting and receiving light), data processing components, computing components, and communication units together to form a compact and small vibration measurement system. However, integrating electronic components into a single laser vibration measurement unit makes traditional laser vibration measurement, like vibration measurement based on the piezoelectric effect, highly susceptible to damage due to the aging of electronic components caused by high temperatures and radiation.

[0062] In view of this, the present disclosure provides a split-type laser measurement device, which isolates the sensitive electronic components in the signal processing unit from the harsh environment, while realizing high-precision and rapid vibration measurement of the target object, thereby improving the reliability and stability of the split-type laser measurement device.

[0063] Example 1

[0064] like Figure 3 As shown, in this embodiment, a split-type laser measurement device is provided, the laser measurement device including:

[0065] Signal processing unit 100, first laser adapter unit 200 and second laser adapter unit 300;

[0066] The first laser adapter unit 200 is communicatively connected to the signal processing unit 100 and the second laser adapter unit 300, respectively.

[0067] The signal processing unit 100 and the first laser adapter unit 200 are both located outside the radiation environment, while the second laser adapter unit 300 is located in the radiation environment.

[0068] The signal processing unit 100 is used to send a test light signal to the first laser adapter unit;

[0069] The first laser adapter unit 200 is used to send the received test optical signal to the second laser adapter unit 300;

[0070] The second laser adapter unit 300 is used to receive the test light signal and send the test light signal to the object under test in the radiation environment;

[0071] The second laser adapter unit 300 is also used to receive the actual light signal reflected from the surface of the object under test based on the test light signal, and send the actual light signal to the signal processing unit 100 through the first laser adapter unit 200;

[0072] The signal processing unit 100 is also used to acquire actual parameter information of the object under test based on the actual optical signal.

[0073] By placing the signal processing unit and the first laser adapter unit outside the radiation environment, and placing the second laser adapter unit in the radiation environment, the sensitive electronic components in the signal processing unit are isolated from the harsh environment, while high-precision and rapid vibration measurement of the target object is achieved, thus improving the reliability and stability of the split-type laser measurement device.

[0074] The first laser adapter unit 200 includes a first laser adapter and a first focusing lens;

[0075] The second laser adapter unit 300 includes a second laser adapter and a second collimating lens;

[0076] The first focusing lens is positioned between the signal processing unit and the first laser adapter unit; the second collimating lens is positioned between the second laser adapter unit and the object under test; the first laser adapter and the second laser adapter are connected via optical fiber.

[0077] The first focusing lens is used to focus the test light signal onto the first laser adapter, or to focus the actual light signal onto the signal processing unit;

[0078] The first laser adapter is used to couple the test optical signal to the optical fiber, or to export the actual optical signal to the first focusing lens;

[0079] The second laser adapter is used to export the test optical signal in the optical fiber to the second collimating lens, or to couple the actual optical signal to the optical fiber;

[0080] The second collimating lens is used to focus the test light signal onto the object under test, or to focus the light signal actually reflected from the surface of the object under test onto the second laser adapter.

[0081] The first focusing lens can be an achromatic doublet lens or an aspherical lens group to optimize the specific working wavelength; the second collimating lens can be a collimating objective lens to output parallel light with a very small beam divergence angle.

[0082] In one embodiment, a laser in the signal processing unit emits a test light signal, which illuminates the object under test through the aforementioned optical path. The actual light signal reflected / scattered returns along the original path and is received and analyzed by a detector in the signal processing unit to obtain the actual parameter information of the object under test in the radiation environment.

[0083] In this embodiment, the first focusing lens is optimized for fiber coupling, and the first laser adapter is precisely aligned to minimize insertion loss from the transmitter to the fiber. The second collimating lens ensures that the beam illuminating the object under test has an ideal shape (such as high parallelism or a specific shape), improving the accuracy of long-distance measurements.

[0084] like Figure 4As shown, the signal processing unit 100 in this embodiment includes: a laser sensor assembly 101 and a data processing assembly 102;

[0085] The laser sensor assembly 101 is communicatively connected to the data processing assembly 102; the laser sensor assembly 101 is used to transmit test light signals to the first laser adapter unit 200 and receive actual light signals, and send the actual light signals to the data processing assembly 102.

[0086] The data processing component 102 is used to receive the actual light signal and obtain the actual parameter information of the object under test based on the actual light signal.

[0087] The laser sensor assembly includes a laser source and a photodetector. The laser source can be a continuous wave frequency-modulated laser, a tunable wave laser, etc., thereby ensuring the temperature of the test optical signal while achieving controllable parameters.

[0088] The data processing component can be a chip or processor configured with the corresponding algorithm.

[0089] In one embodiment, the laser sensor assembly is further provided with a beam splitter to distinguish between the test optical signal and the actual optical signal, and then to perform corresponding optical path transmission based on the classified optical signal.

[0090] The first laser adapter and the second laser adapter in this embodiment include FC / APC adapters.

[0091] The FC / APC adapter serves to fix the fiber optic connector and ensure efficient coupling of optical signals during both transmission and reception. During reception, the returned light may be very weak, and reducing reflection can avoid stray light interference, further improving the accuracy of measurement of the object under test.

[0092] In this embodiment, the data processing component 102 includes a signal acquisition subunit and a parameter calculation subunit;

[0093] The signal acquisition subunit and the parameter calculation subunit are communicatively connected.

[0094] The signal acquisition subunit is used to acquire beat frequency signal information and interference fringe shift quantity information based on the test optical signal and the actual optical signal.

[0095] The parameter calculation subunit is used to receive the beat frequency signal and the number of interference fringe movements, and to calculate and process the information of the beat frequency signal and the number of interference fringe movements to obtain the actual vibration parameter information of the object under test.

[0096] The signal acquisition subunit generates a signal whose beat frequency is proportional to the target vibration frequency by interfering with the returned actual optical signal and the emitted test optical signal.

[0097] The actual parameter information in this embodiment includes vibration displacement information;

[0098] The parameter calculation subunit is used to calculate and process the beat frequency signal based on Fourier transform to obtain the frequency information during vibration;

[0099] Based on the information regarding the number of interference fringes shifted during vibration, the vibration displacement of the object is obtained. The actual parameter information in this embodiment also includes vibration information;

[0100] Data processing component 102 includes a time acquisition subunit;

[0101] The time acquisition subunit and the parameter calculation subunit are connected in communication.

[0102] The time acquisition subunit is used to acquire the beat frequency information after the incident light and reflected light interfere after the object vibrates, and send the beat frequency information to the parameter calculation subunit;

[0103] The parameter calculation subunit is used to obtain beat frequency information, and to obtain the vibration velocity information of the object under test based on the vibration displacement and beat frequency information.

[0104] That is, to obtain the displacement information, vibration frequency information, vibration information, and acceleration information of the object's vibration.

[0105] like Figure 4 As shown, the signal processing unit in this embodiment also includes a communication unit component 103;

[0106] Communication unit component 103 is communicatively connected to data processing component 102;

[0107] The communication unit component is used to receive actual parameter information and send the actual parameter information to external terminal devices.

[0108] The actual parameter information includes displacement information, vibration frequency information, vibration information, and acceleration information.

[0109] External terminal devices include, but are not limited to, display devices such as mobile phones, computers, and tablets.

[0110] Data transmission is achieved through communication unit components, which improves both practicality and user experience.

[0111] The implementation principle of the split-type laser measurement system in this disclosure is explained below with specific embodiments:

[0112] The fiber optic split-type laser vibration measurement technology adopts coherent measurement technology based on laser interferometry. After modulation, the laser is emitted to the target object through a laser focusing lens, an FC / APC adapter, an optical fiber, an FC / APC adapter, and a laser collimating lens. The echo from the target object is mixed with the local oscillator signal to generate a beat frequency signal, and the beat frequency signal characteristics related to the vibration frequency of the object are calculated.

[0113] Because in the measurement, the number of interference fringes moved by the vibration of an object is positively correlated with the displacement of the object. By calculating the number of interference fringes moved during vibration, the real-time vibration displacement of the target object can be obtained. The velocity information of the object can be obtained by differentiating the displacement with respect to the beat frequency (time). The change in velocity information can reflect the vibration characteristics of the target object.

[0114] Among them, the fiber optic split-type laser vibration measurement technology adopts a modular principle architecture, such as... Figure 5 As shown: The front end is a spatial light-to-fiber conversion component (laser focusing lens, FC / APC adapter, laser collimating lens), which integrates collimation and optical transmission / reception paths and transmits and receives laser signals through optical fiber. The back end is a laser sensor signal acquisition and processing unit component, which integrates a laser source, a transceiver optical module (laser sensor component), a data processing module, a communication interface module, etc.

[0115] Equipment layout schematic diagram as follows Figure 6 As shown, the test object, laser collimating lens, and FC / APC adapter are housed in a safety container in a high-temperature, high-irradiation environment. The safety container communicates with equipment in a normal-temperature, normal-irradiation environment via electrical penetrations. Specifically, the FC / APC in the normal-temperature, normal-irradiation environment is connected to the FC / APC in the high-temperature, high-irradiation environment via optical fiber. The signal acquisition and processing unit and the external terminal PC / embedded device are housed in the normal-temperature, normal-irradiation environment.

[0116] In the measurement, high-temperature and radiation-resistant components such as collimating lenses and FC / APC adapters are usually placed in the high-temperature and radiation environment of the reactor, while the sensitive electronic components in the signal acquisition and processing unit are isolated from the harsh environment. This enables high-precision and rapid vibration measurement of the target object, while improving the reliability and stability of the vibration measurement system, and can well meet the vibration measurement requirements of equipment under various harsh working conditions.

[0117] Example 2

[0118] This embodiment provides a split-type laser measurement system, which includes the split-type laser measurement device in Embodiment 1.

[0119] The split-type laser measurement system provided in this disclosure, by placing both the signal processing unit and the first laser adapter unit outside the radiation environment, not only isolates the sensitive electronic components in the signal processing unit from the harsh environment, but also achieves high-precision and rapid vibration measurement of the target object, thereby improving the reliability and stability of the split-type laser measurement device.

[0120] For the system embodiments, since they basically correspond to the method embodiments, the relevant parts can be referred to in the description of the method embodiments. The system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this disclosure according to actual needs.

[0121] Example 3

[0122] In this embodiment, a management platform is provided, which includes the split-type laser measurement system and the interactive interface in Embodiment 2 of this disclosure.

[0123] Laser measurement systems can acquire actual parameter information of the measured object set in high-temperature and high-irradiation environments, and display the actual parameter information through an interactive interface. Users can further set the corresponding processing flow through the interactive interface, thereby improving work efficiency and user experience.

[0124] While specific embodiments of this disclosure have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this disclosure is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this disclosure, but all such changes and modifications fall within the scope of protection of this disclosure.

Claims

1. A split-type laser measurement device, characterized in that, The laser measurement device includes: Signal processing unit, first laser adapter unit and second laser adapter unit; The first laser adapter unit is communicatively connected to both the signal processing unit and the second laser adapter unit. The signal processing unit and the first laser adapter unit are both located outside the radiation environment, while the second laser adapter unit is located in the radiation environment. The signal processing unit is used to send test light signals to the first laser adapter unit; The first laser adapter unit is used to send the received test optical signal to the second laser adapter unit; The second laser adapter unit is used to receive the test light signal and send the test light signal to the object under test in the radiation environment; The second laser adapter unit is also used to receive the actual light signal reflected by the surface of the object under test based on the test light signal, and to send the actual light signal to the signal processing unit through the first laser adapter unit; The signal processing unit is also used to obtain the actual parameter information of the object under test based on the actual optical signal.

2. The split-type laser measuring device according to claim 1, characterized in that, The first laser adapter unit includes a first laser adapter and a first focusing lens; The second laser adapter unit includes a second laser adapter and a second collimating lens; The first focusing lens is disposed between the signal processing unit and the first laser adapter unit; The second collimating lens is positioned between the second laser adapter unit and the object to be tested; The first laser adapter and the second laser adapter are connected via optical fiber; The first focusing lens is used to focus the test light signal onto the first laser adapter, or to focus the actual light signal onto the signal processing unit; The first laser adapter is used to couple the test optical signal to the optical fiber, or to export the actual optical signal to the first focusing lens; The second laser adapter is used to export the test optical signal in the optical fiber to the second collimating lens, or to couple the actual optical signal to the optical fiber; The second collimating lens is used to focus the test light signal onto the object under test, or to focus the light signal actually reflected from the surface of the object under test onto the second laser adapter.

3. The split-type laser measuring device according to claim 2, characterized in that, The first laser adapter and the second laser adapter include FC / APC adapters.

4. The split-type laser measuring device according to any one of claims 1-3, characterized in that, The signal processing unit includes: a laser sensor assembly and a data processing assembly; The laser sensor assembly is communicatively connected to the data processing assembly; the laser sensor assembly is used to emit the test light signal to the first laser adapter unit and receive the actual light signal, and send the actual light signal to the data processing assembly. The data processing component is used to receive the actual optical signal and obtain the actual vibration parameter information of the object under test based on the actual optical signal.

5. The split-type laser measuring device according to claim 4, characterized in that, The data processing component includes a signal acquisition subunit and a parameter calculation subunit; The signal acquisition subunit is communicatively connected to the parameter calculation subunit. The signal acquisition subunit is used to acquire beat frequency signal information and interference fringe shift quantity information based on the test optical signal and the actual optical signal; The parameter calculation subunit is used to receive the beat frequency signal and the number of interference fringe movements, and to calculate and process the information of the beat frequency signal and the number of interference fringe movements to obtain the actual vibration parameter information of the object under test.

6. The split-type laser measuring device according to claim 5, characterized in that, The actual parameter information includes distance information; The parameter calculation subunit is used to perform calculation processing on the beat frequency signal based on Fourier transform to obtain the frequency information during vibration; Based on the information on the number of interference fringes shifted during the vibration process, the vibration displacement of the object is obtained.

7. The split-type laser measuring device according to claim 6, characterized in that, The actual parameter information also includes vibration information; The data processing component includes a time acquisition subunit; The time acquisition subunit is communicatively connected to the parameter calculation subunit; The time acquisition subunit is used to acquire the beat frequency information after the incident light and reflected light interfere after the object vibrates, and send the beat frequency information to the parameter calculation subunit; The parameter calculation subunit is used to obtain the beat frequency information and to obtain the vibration velocity information of the object under test based on the vibration displacement and the beat frequency information.

8. The split-type laser measuring device according to claim 4, characterized in that, The signal processing unit also includes a communication unit component; The communication unit component is communicatively connected to the data processing component; The communication unit component is used to receive the actual parameter information and send the actual vibration parameter information to an external terminal device.

9. A split-type laser measurement system, characterized in that, The split-type laser measurement system includes the split-type laser measurement device according to any one of claims 1-8.

10. A management platform, characterized in that, The management platform includes the split-type laser measurement system as described in claim 9 and an interactive interface.

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