Composite substrate and method for manufacturing the same, housing, and electronic device

Abstract

The present disclosure relates to a composite substrate and a preparation method thereof, a shell and an electronic device, and belongs to the technical field of composite materials. The composite substrate comprises a substrate layer, a conductive layer and a texture layer arranged between the substrate layer and the conductive layer; and the texture layer is provided with a texture structure with a preset depth on the side away from the substrate layer. By arranging the texture layer between the substrate layer and the conductive layer and arranging the texture structure with the preset depth on the texture layer, the present disclosure can realize the close combination between the texture layer and the substrate layer and the texture layer and the conductive layer respectively, so as to improve the bonding strength between the conductive layer and the substrate layer and reduce the risk of falling off of the conductive layer during use.

Description

Technical Field

[0001] This disclosure relates to the field of composite materials technology, and in particular to a composite matrix and its preparation method, a housing, and an electronic device. Background Technology

[0002] With the rapid development of mobile phones and other communication devices in recent years, consumers are increasingly inclined towards thinner and lighter electronic devices. Fiber-reinforced resin matrix composites possess characteristics such as high specific modulus, high specific strength, excellent heat resistance, and fatigue resistance, enabling them to replace commonly used metal materials such as aluminum alloys and stainless steel. Therefore, they are widely used in the automotive, power generation, aerospace, and communications industries to meet the demand for lightweighting. Unlike traditional composite material applications, the ultra-thin dimensions and functional requirements of consumer electronics place higher demands on composite material design and processing technologies. However, since the resin and fibers in conventional composite materials are poor conductors, their poor conductivity affects the antenna signals and radio frequency efficiency of electronic devices, leading to problems such as spurious radiation. Therefore, metallizing the surface of composite materials to achieve conductivity is particularly important.

[0003] Because fiber-reinforced resin matrix composites have low surface energy and low reactivity, if metallization is performed directly on the surface of the substrate layer made of composite material, the adhesion between the metallized conductive layer and the substrate layer will be low, resulting in a very high risk of the conductive layer falling off during use. Summary of the Invention

[0004] To overcome the problems existing in related technologies, this disclosure provides a composite matrix and its preparation method, a housing, and an electronic device.

[0005] According to a first aspect of the present disclosure, a composite matrix is ​​provided, the composite matrix comprising:

[0006] A substrate layer, a conductive layer, and a textured layer disposed between the substrate layer and the conductive layer;

[0007] The texture layer has a texture structure with a preset depth on the side opposite to the substrate layer.

[0008] In some embodiments of this disclosure, the texture layer is formed by imprinting with an imprinting solution, the imprinting solution comprising acrylic resin.

[0009] In some embodiments of this disclosure, the composite substrate further includes a transition layer disposed between the textured layer and the conductive layer, the transition layer comprising a bridging metal material, the bridging metal material comprising one or more of nickel and molybdenum.

[0010] In some embodiments of this disclosure, the composite substrate further includes a protective layer disposed on the side of the conductive layer opposite to the textured layer, the protective layer comprising a wear-resistant metal material, the wear-resistant metal material comprising one or more of nickel, chromium, and titanium.

[0011] In some embodiments of this disclosure, the substrate layer includes at least one fiber reinforcement layer, and the at least one fiber reinforcement layer includes a resin matrix and a continuous fiber layer;

[0012] The resin matrix fills the interior of the continuous fiber layer.

[0013] In some embodiments of this disclosure, when the substrate layer includes multiple fiber reinforcement layers, the multiple fiber reinforcement layers are stacked at a preset angle.

[0014] According to a second aspect of the present disclosure, a method for preparing a composite matrix is ​​provided, comprising:

[0015] Provide a substrate layer;

[0016] A printing liquid is sprayed onto the surface of the substrate layer to form a textured structure with a preset depth, which is then cured under a first preset condition to form a textured layer.

[0017] Under the second preset condition, a conductive layer is formed by coating on the side of the textured layer where the textured structure is provided.

[0018] In some embodiments of this disclosure, the first preset condition includes:

[0019] In the first stage, level the surface at a temperature of 20-30℃ for 3-6 minutes;

[0020] The second stage involves drying at 50-60℃ for 5-8 minutes.

[0021] The third stage, at 750-1000 mJ / cm 2 Curing is performed under the curing energy;

[0022] And / or, the second preset condition includes:

[0023] At a vacuum degree of 10 -3 -10 -4 Under the condition of Pa, maintain for 4-10 minutes.

[0024] In some embodiments of this disclosure, before depositing a film on the side of the textured layer where the textured structure is provided, under a second preset condition, to form a conductive layer, the preparation method further includes:

[0025] Under the third preset condition, a coating is applied to the side of the textured layer where the textured structure is provided to form a transition layer.

[0026] In some embodiments of this disclosure, the preparation method further includes:

[0027] Under the fourth preset condition, a protective layer is formed by coating the conductive layer on the side opposite to the textured layer.

[0028] According to a third aspect of the present disclosure, a housing is provided, the housing being prepared from a composite matrix as described above or a composite matrix prepared by the method described above.

[0029] According to a fourth aspect of the present disclosure, an electronic device is provided, the electronic device including the housing as described above.

[0030] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0031] This disclosure provides a textured layer between the substrate layer and the conductive layer, and a textured structure with a preset depth on the textured layer. This enables a tight bond between the textured layer and the substrate layer and the conductive layer, thereby improving the bonding strength between the conductive layer and the substrate layer and reducing the risk of the conductive layer falling off during use.

[0032] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0033] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0034] Figure 1 This is a schematic diagram of the layer structure of a composite matrix according to an exemplary embodiment;

[0035] Figure 2 This is a schematic diagram of the layer structure of a composite matrix according to an exemplary embodiment;

[0036] Figure 3 This is a schematic flowchart illustrating a method for preparing a composite matrix according to an exemplary embodiment. Detailed Implementation

[0037] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0038] In related technologies, to reduce the risk of conductive layer detachment during use, the surface of the substrate layer is usually roughened before metallization. Currently, surface roughening treatments for the substrate layer mainly include acid etching and laser engraving. Acid etching involves placing the substrate layer in an acidic solution, allowing the acid to corrode the substrate layer and roughen its surface to form a roughened layer. However, this method is difficult to control the depth of the roughened layer. If the roughened layer is too shallow, the adhesion between the substrate layer and the conductive layer may be low; if the roughened layer is too deep, the reinforcing fibers in the substrate layer may be exposed, affecting the adhesion between the substrate layer and the conductive layer and leading to a decrease in the overall mechanical properties of the composite material. Furthermore, acid etching generates acidic wastewater, making the process environmentally unfriendly.

[0039] Laser engraving involves first forming a transition layer on the surface of the substrate layer, and then performing laser engraving on the transition layer to achieve surface roughening. However, this method requires the transition layer to have a certain thickness. If the transition layer is too thin, it will be penetrated during the laser engraving process, exposing the reinforcing fibers in the substrate layer. This affects the adhesion between the substrate layer and the conductive layer, and leads to a decrease in the overall mechanical properties of the composite material.

[0040] To address the aforementioned technical problems, this disclosure provides a composite substrate comprising: a substrate layer, a conductive layer, and a textured layer disposed between the substrate layer and the conductive layer; the textured layer has a textured structure of a predetermined depth on its side facing away from the substrate layer. By providing a textured layer between the substrate layer and the conductive layer, and by providing a textured structure of a predetermined depth on the textured layer, this disclosure achieves a tight bond between the textured layer and both the substrate layer and the conductive layer, thereby improving the bonding strength between the conductive layer and the substrate layer and reducing the risk of the conductive layer detaching during use.

[0041] This disclosure provides a composite matrix, such as Figure 1 As shown, the composite matrix includes:

[0042] The substrate layer 1, the conductive layer 2, and the texture layer 3 disposed between the substrate layer 1 and the conductive layer 2; wherein, the texture layer 3 has a texture structure with a preset depth on the side facing away from the substrate layer 1.

[0043] In this embodiment, by setting a textured layer 3 between the substrate layer 1 and the conductive layer 2, and setting a textured structure with a preset depth on the textured layer 3, the surface roughening of the composite substrate can be achieved, enabling the textured layer 3 to be tightly bonded to both the substrate layer 1 and the conductive layer 2, thereby improving the bonding strength between the conductive layer 2 and the substrate layer 1 and reducing the risk of the conductive layer 2 detaching during use. The textured structure can be arranged according to a preset rule, and its shape is not limited, as long as it achieves the purpose of this disclosure. For example, the shape of the textured structure can be any shape set according to the bonding requirements, such as one or more of spherical, polygonal prism, and polygonal pyramid shapes.

[0044] In one exemplary embodiment, the preset depth is 1-8 μm.

[0045] Both excessively low and excessively high texture depths can affect the adhesion between the substrate layer 1 and the conductive layer 2. In this embodiment, a preset depth of 1-8 μm can effectively reduce the separation problem between the conductive layer 2 and the substrate layer 1. For example, the preset depths are 1 μm, 4 μm, 6 μm, and 8 μm. The preset depth can also be any value between the exemplary depth values; for example, the preset depth can be any value between 4 and 8 μm.

[0046] In one exemplary embodiment, the texture layer 3 is formed by imprinting with an imprinting solution, which includes an acrylic resin.

[0047] In this embodiment, the texture layer 3 is formed by imprinting, which allows for more precise control of the texture depth and facilitates a tight bond between the substrate layer 1 and the conductive layer 2. The imprinting solution includes acrylic resin, which ensures that the texture layer 3 has good adhesion strength to both the substrate layer 1 and the conductive layer 2. Furthermore, acrylic resin possesses excellent mechanical properties and a fast drying speed, which can shorten the imprinting time and improve production efficiency.

[0048] In an exemplary embodiment, the percentage of each component of the printing ink by mass relative to the total mass of the printing ink is as follows:

[0049] Acrylic resin 40-60%;

[0050] Solvent 30-55%;

[0051] Additives: 0.1-10%.

[0052] In this embodiment, adding a solvent to the printing solution can improve the coating uniformity of the printing solution, thereby enhancing the bonding strength between the texture layer and the conductive layer. The solvent can be one or more of ester solvents, alcohol solvents, benzene solvents, and ether solvents. For example, the solvent includes multiple organic solvents listed below. When multiple organic solvents are selected, the following percentages of each organic solvent's mass relative to the total mass of the printing solution can be used:

[0053] Butyl acetate 2-6%; ethyl acetate 10-18%; sec-butyl acetate 5-15%; isopropanol 2-6%; propylene glycol methyl ether acetate 5-10%; n-butanol 2-6%; xylene 3-7%; ethylene glycol monotert-butyl ether 1-5%.

[0054] For example, organic solvents may include 2-6% butyl acetate; 5-15% sec-butyl acetate; 2-6% isopropanol; 5-10% propylene glycol methyl ether acetate; 2-6% n-butanol; or

[0055] sec-butyl acetate 5-15%; isopropanol 2-6%; n-butanol 2-6%; xylene 3-7%; ethylene glycol monotert-butyl ether 1-5%; or

[0056] Butyl acetate 2-6%; isopropanol 2-6%; propylene glycol methyl ether acetate 5-10%; n-butanol 2-6%; xylene 3-7%;

[0057] The above is merely an example illustrating possible combinations of organic solvents that can be selected; any other combination of solvents that can achieve the functions of this disclosure is also possible.

[0058] Additives can improve the processing performance, mechanical properties, and durability of printing inks. Examples of additives include one or more of antioxidants, adhesion promoters, leveling agents, viscosity modifiers, and photoinitiators.

[0059] For example, in one embodiment, the percentage of each component of the printing ink by mass relative to the total mass of the printing ink is as follows:

[0060] 40% acrylic resin;

[0061] Solvent 55%;

[0062] 5% additives;

[0063] The solvents include 6% butyl acetate; 15% ethyl acetate; 11% sec-butyl acetate; 5% isopropanol; 6% propylene glycol methyl ether acetate; 3% n-butanol; 5% xylene; and 4% ethylene glycol monotert-butyl ether.

[0064] In another embodiment, the percentage of each component of the printing ink by mass relative to the total mass of the printing ink is as follows:

[0065] Acrylic resin 51.9%;

[0066] Solvent 48%;

[0067] Additives 0.1%;

[0068] The solvents include 6% butyl acetate; 17% ethyl acetate; 11% sec-butyl acetate; 5% isopropanol; 6% propylene glycol methyl ether acetate; and 3% n-butanol.

[0069] In another embodiment, the percentage of each component of the printing ink by mass relative to the total mass of the printing ink is as follows:

[0070] 48% acrylic resin;

[0071] Solvent 51%;

[0072] 1% additives;

[0073] The solvents include 18% ethyl acetate; 14% sec-butyl acetate; 6% isopropanol; 10% propylene glycol methyl ether acetate; and 3% ethylene glycol monotert-butyl ether.

[0074] In another embodiment, the percentage of each component of the printing ink by mass relative to the total mass of the printing ink is as follows:

[0075] 60% acrylic resin;

[0076] Solvent 30%;

[0077] 10% of the additives;

[0078] The solvents include 2% butyl acetate; 10% ethyl acetate; 5% sec-butyl acetate; 2% isopropanol; 5% propylene glycol methyl ether acetate; 2% n-butanol; 3% xylene; and 1% ethylene glycol monotert-butyl ether.

[0079] In one exemplary embodiment, the thickness of the conductive layer 2 is 10-80 nm.

[0080] In this embodiment, the thickness of the conductive layer 2 needs to be controlled within 10-80 nm to achieve good conductivity. For example, the thickness of the conductive layer 2 is 10 nm, 30 nm, 50 nm, 73 nm, or 80 nm. The thickness of the conductive layer 2 can also be any value within this range; for example, the thickness of the conductive layer 2 can be any value between 30 and 73 nm.

[0081] In one exemplary embodiment, the conductive layer 2 includes a conductive metal material, which includes one or more of silver, copper, and gold.

[0082] In this embodiment, the conductive layer 2 can be made of a metal material with good conductivity, such as silver, copper, gold, etc., to reduce the radiation effects caused by antennas and other components in electronic devices made of composite substrates.

[0083] In one exemplary embodiment, such as Figure 2 As shown, the composite substrate also includes a transition layer 4, which is disposed between the texture layer 3 and the conductive layer 2.

[0084] In this embodiment, by providing a transition layer 4 between the texture layer 3 and the conductive layer 2, the adhesion between the texture layer 3 and the conductive layer 2 can be further improved.

[0085] In one exemplary embodiment, the thickness of the transition layer 4 is 10-200 nm.

[0086] In this embodiment, the thickness of the transition layer 4 is controlled between 10-200 nm, which can improve the adhesion strength of each layer. For example, the thickness of the transition layer 4 is 10 nm, 50 nm, 120 nm, 160 nm, or 200 nm. The thickness of the transition layer 4 can also be any thickness between the exemplary values; for example, the thickness of the transition layer 4 can be any thickness value between 50-160 nm.

[0087] In one exemplary embodiment, the transition layer 4 includes a bridging metal material, which includes one or more of nickel and molybdenum.

[0088] In this embodiment, a bridging metal material is used to bridge the conductive layer and the textured layer, thereby improving the bonding strength between the layers. The bridging metal material can be either nickel or molybdenum.

[0089] In one exemplary embodiment, such as Figure 2 As shown, the composite substrate also includes a protective layer 5, which is disposed on the side of the conductive layer 2 away from the textured layer 3.

[0090] In one exemplary embodiment, the thickness of the protective layer 5 is 10-200 nm.

[0091] In this embodiment, the thickness of the protective layer 5 needs to be controlled between 10-200 nm. If the protective layer 5 is too thin, the protective effect will decrease; if it is too thick, the conductivity will be affected. For example, the thickness of the protective layer 5 is 10 nm, 50 nm, 120 nm, 160 nm, or 200 nm. The thickness of the protective layer 5 can also be any thickness between the exemplary values, for example, any thickness between 50-160 nm.

[0092] In one exemplary embodiment, the protective layer 5 includes a wear-resistant metal material, which includes one or more of nickel, chromium, and titanium.

[0093] In this embodiment, the protective layer 5 can be made of a wear-resistant metal material, such as nickel, chromium, or titanium, all of which can effectively protect the composite substrate. Specifically, the protective layer 5 can be made of nickel. Using nickel as the material for the protective layer 5 not only significantly improves the hardness and wear resistance of the composite substrate, effectively reducing damage and destruction caused by scratches, friction, and abrasion, but also has good electrical conductivity, maintaining the electrical conductivity of the composite substrate.

[0094] Because the nickel layer of protective layer 5 is highly activated, it is easily oxidized in air, resulting in a rapid decline in the dyne value of the composite substrate. The dyne value is a parameter used to describe the surface tension of a material and can be used to evaluate the wettability and adhesion of a material surface. This disclosure, through the microstructure of the textured layer 3, can also improve the dyne value and retention time of the composite substrate, which is beneficial to improving the bonding strength between the composite substrate and other materials.

[0095] In an exemplary embodiment, the substrate layer 1 includes at least one fiber reinforcement layer, which includes a resin matrix and a continuous fiber layer; the resin matrix fills the interior of the continuous fiber layer.

[0096] In this embodiment, the substrate layer 1 may include a single fiber reinforcement layer or may be composed of multiple fiber reinforcement layers. The resin matrix may be a thermosetting resin or a thermoplastic resin; for example, the resin matrix may be one or more of epoxy resin, polyurethane resin, polyester resin, polyamide resin, polypropylene resin, polystyrene resin, polymethyl methacrylate resin, polycarbonate, polyoxymethylene, phenolic resin, and amino resin.

[0097] In an exemplary embodiment, when the substrate layer 1 includes multiple fiber reinforcement layers, the multiple fiber reinforcement layers are stacked at a preset angle.

[0098] In this embodiment, when the substrate layer 1 is a multi-layered fiber reinforcement layer, the multi-layered fiber reinforcement layers can be stacked at a preset angle. Taking a 5-layered fiber reinforcement layer as an example, the preset angle can be 0° / 90° / 0° / 90° / 0°, 45° / -45° / 0° / -45° / 45°, etc. During stacking, positioning grooves can be set to prevent the stacking angle from shifting during the stacking process, thus affecting the mechanical properties of the substrate layer 1.

[0099] like Figure 3 As shown, an exemplary embodiment of this disclosure provides a method for preparing a composite matrix, comprising:

[0100] S100, provides a substrate layer.

[0101] In step S100, the substrate layer 1 can be, for example, a multilayer carbon fiber reinforced resin. After the carbon fiber prepreg is cut into a preset shape, the multilayer carbon fiber prepreg is stacked at a preset angle to obtain a stack. Then, the stack is pressed and held at a pressure of 0.1-0.9 MPa and a temperature of 50-200°C for 1-20 minutes to cure and form a pretreated substrate. The pretreated substrate is then further cut and processed by laser cutting to obtain the substrate layer 1. The cutting speed can be 100-300 mm / min and the frequency can be 30-150 kHz.

[0102] S200: Spray a printing liquid onto the surface of the substrate layer to form a textured structure with a preset depth, and cure it under a first preset condition to form a textured layer.

[0103] In step S200, the thickness of the sprayed imprint liquid can be 3-10 μm, and then a texture structure with a depth of 1-8 μm is formed on the imprint liquid by using an imprint mold, and then cured by ultraviolet curing (UV).

[0104] S300, Under the second preset conditions, a conductive layer is formed by coating on the side of the textured layer where the textured structure is provided.

[0105] In step S300, physical vapor deposition (PVD) can be used to deposit conductive metal material onto the textured structure of textured layer 3 under vacuum conditions to form conductive layer 2. PVD includes vacuum evaporation deposition, vacuum sputtering deposition, and vacuum ion deposition; the appropriate method can be selected according to requirements. In step S300, the specific deposition method is not limited, as long as it achieves the purpose of this disclosure.

[0106] The second preset condition includes: a vacuum degree of 10 -3 -10 -4 Under the condition of Pa, maintain for 4-10 minutes.

[0107] For example, in one embodiment, the second preset condition includes: a vacuum degree of 10 -3 Under the condition of Pa, maintain for 10 min.

[0108] In another embodiment, the second preset condition includes: a vacuum degree of 10 -3 Under the condition of Pa, maintain for 6 minutes.

[0109] In another embodiment, the second preset condition includes: a vacuum degree of 10 -4Under the condition of Pa, maintain for 4 minutes.

[0110] In one exemplary embodiment, the first preset condition includes:

[0111] In the first stage, level the surface at a temperature of 20-30℃ for 3-6 minutes;

[0112] The second stage involves drying at 50-60℃ for 5-8 minutes.

[0113] The third stage, at 750-1000 mJ / cm 2 Curing is performed under the curing energy.

[0114] In this embodiment, multi-stage curing can improve the uniformity of curing on the surface and inside of the texture layer 3, and can prevent the texture structure from changing shape due to inconsistent curing speeds on the surface and inside of the texture layer 3, thus affecting the bonding strength between the texture layer 3 and the conductive layer 2.

[0115] For example, in one embodiment, the first preset condition includes:

[0116] In the first stage, level the surface at 20°C for 6 minutes;

[0117] The second stage involves drying at 50°C for 8 minutes.

[0118] The third stage, at 750mj / cm 2 Curing is performed under the curing energy.

[0119] In another embodiment, the first preset condition includes:

[0120] In the first stage, level the surface at 25°C for 5 minutes;

[0121] The second stage involves drying at 55°C for 6 minutes.

[0122] The third stage, at 880mj / cm 2 Curing is performed under the curing energy.

[0123] In another embodiment, the first preset condition includes:

[0124] In the first stage, level the surface at 30°C for 3 minutes;

[0125] The second stage involves drying at 60°C for 5 minutes.

[0126] The third stage, at 1000mJ / cm 2 Curing is performed under the curing energy.

[0127] In an exemplary embodiment, before depositing a film on the side of the textured layer 3 where the textured structure is provided, and before forming the conductive layer 2, under the second preset conditions, the preparation method further includes:

[0128] Under the third preset condition, a coating is applied to the side of the texture layer 3 where the texture structure is provided to form a transition layer 4.

[0129] In this embodiment, the transition layer 4 can also be formed by PVD, and the third preset condition can also be a vacuum degree of 10. -3 -10 -4 Under the condition of Pa, maintain for 4-10 minutes.

[0130] For example, at a vacuum degree of 10 -4 Under the condition of Pa, nickel is plated on the side of the textured layer 3 where the textured structure is provided to form a transition layer 4; then copper is plated on the transition layer 4 to form a conductive layer 2.

[0131] In one exemplary embodiment, the preparation method further includes:

[0132] Under the fourth preset condition, a protective layer 5 is formed by coating on the side of the conductive layer 2 away from the textured layer 3.

[0133] In this embodiment, the protective layer 5 can also be formed by PVD, and the fourth preset condition can also be a vacuum degree of 10. -3 -10 -4 Under the condition of Pa, maintain for 4-10 minutes.

[0134] For example, at a vacuum degree of 10 -4 Under the condition of Pa, nickel is plated on the side of the conductive layer 2 away from the textured layer 3 to form a protective layer 5.

[0135] An exemplary embodiment of this disclosure provides a housing, which is made of the composite matrix as described above or a composite matrix prepared by the method described above.

[0136] An exemplary embodiment of this disclosure provides an electronic device, which includes the housing described above. The electronic device may be, for example, a mobile phone, a laptop computer, a tablet computer, or a wearable device.

[0137] To more clearly explain the technical solution of this disclosure, specific embodiments of the preparation method of the composite matrix are provided. The beneficial effects of selecting the above-mentioned range of process parameters will be explained by providing specific experimental data through specific embodiments.

[0138] Preparation Example

[0139] It should be noted that, unless otherwise specified, the raw materials used in the following preparation examples are all commercially available.

[0140] Preparation Example 1: A method for preparing a printing ink, comprising the following steps:

[0141] The printing solution is prepared by mixing 40% acrylic resin, 6% butyl acetate, 15% ethyl acetate, 11% sec-butyl acetate, 5% isopropanol, 6% propylene glycol methyl ether acetate, 3% n-butanol, 5% xylene, 4% ethylene glycol monotert-butyl ether, and 5% photoinitiator.

[0142] Preparation Example 2: A method for preparing a printing ink, comprising the following steps:

[0143] The printing solution was prepared by mixing 44% acrylic resin, 6% butyl acetate, 18% ethyl acetate, 15% sec-butyl acetate, 5% isopropanol, 6% propylene glycol methyl ether acetate, 3% ethylene glycol monotert-butyl ether, and 3% photoinitiator.

[0144] Preparation Example 3: A method for preparing a printing ink, comprising the following steps:

[0145] The printing solution was prepared by mixing 48% acrylic resin, 4% butyl acetate, 13% ethyl acetate, 10% sec-butyl acetate, 5% isopropanol, 6% propylene glycol methyl ether acetate, 3% n-butanol, 5% xylene, 3% ethylene glycol monotert-butyl ether, and 3% photoinitiator.

[0146] Preparation Example 4: A method for preparing a printing ink, comprising the following steps:

[0147] The printing solution is prepared by mixing 52% acrylic resin, 3% butyl acetate, 10% ethyl acetate, 10% sec-butyl acetate, 5% isopropanol, 6% propylene glycol methyl ether acetate, 3% n-butanol, 5% xylene, 3% ethylene glycol monotert-butyl ether, and 3% photoinitiator.

[0148] Preparation Example 5: A method for preparing a printing ink, comprising the following steps:

[0149] The printing solution is prepared by mixing 60% acrylic resin, 12% ethyl acetate, 10% propylene glycol methyl ether acetate, 4% n-butanol, 3% xylene, 1% ethylene glycol monotert-butyl ether, and 10% photoinitiator.

[0150] Example

[0151] Example 1: A method for preparing a composite matrix, comprising the following steps:

[0152] (1) Provide a substrate layer; wherein the substrate layer is formed by stacking and pressing 5 layers of carbon fiber reinforced epoxy resin at an angle of 45° / -45° / 0° / -45° / 45°.

[0153] (2) Spray the imprinting liquid onto the surface of the substrate layer, and use an imprinting mold to imprint a textured structure with a depth of 5μm and a polygonal shape onto the imprinting liquid. Then, level it at 25℃ for 5min; pre-dry it at 55℃ for 6min; and then heat it at 850mj / cm 2 The texturing layer is obtained by curing under a certain curing energy. The printing solution is prepared in Preparation Example 1.

[0154] (3) Nickel is plated on the side of the textured layer where the texture structure is set to form a transition layer with a thickness of 100nm.

[0155] (4) Copper is plated on the side of the transition layer away from the texture layer to form a conductive layer with a thickness of 60 nm.

[0156] (5) Nickel is plated on the side of the conductive layer away from the transition layer to form a protective layer with a thickness of 120 nm.

[0157] To more clearly explain the technical solution of this disclosure, this disclosure also provides examples 2-10 of the preparation method of the composite matrix, wherein the parameters of examples 2-10 are shown in Table 1.

[0158] Table 1 shows specific embodiments of the method for preparing the composite matrix in this disclosure. It should be noted that, except for the parameters listed in Table 1, the other parameters of Examples 2-10 are basically the same as those of Example 1.

[0159] Table 1 Parameter settings for the composite matrix in the embodiments

[0160]

[0161] Comparative Example

[0162] Comparative Example 1: The main difference between this comparative example and Example 1 is that the composite substrate has no textured layer, that is, the composite substrate includes a substrate layer, a transition layer, a conductive layer and a protective layer stacked together.

[0163] Performance testing

[0164] The performance of the composite matrix of the embodiments and comparative examples was tested according to the following method, and the test results are recorded in Table 2.

[0165] 1. Adhesion Cross-Cut Test: The adhesion cross-cut test method is used to evaluate the bonding strength between each layer and the substrate layer. The evaluation grades, from low to high, are 0B, 1B, 2B, 3B, 4B, and 5B. The higher the number, the better the adhesion between each layer and the substrate layer.

[0166] 2. Dyne Value Test: The dyne value of the composite substrate surface is tested using a dyne pen to evaluate its surface wettability; and the dyne value of the composite substrate surface is measured after a certain time interval to determine the dyne value decay value of the composite substrate surface. The higher the dyne value, the better the surface wettability of the composite substrate.

[0167] Table 2 Performance test table for the embodiments and comparative examples

[0168]

[0169] As can be seen from the data in Tables 1 and 2, this disclosure can significantly improve the bonding strength between the layers of the composite matrix by setting the texture layer. Through the texture structure of the texture layer, the dyne value of the composite matrix surface can be increased and the decay of the dyne value can be reduced, which is beneficial to improving the bonding strength between the composite matrix and other materials.

[0170] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0171] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A composite matrix, characterized in that, The composite matrix includes: A substrate layer, a conductive layer, and a textured layer disposed between the substrate layer and the conductive layer; The texture layer has a texture structure with a preset depth on the side opposite to the substrate layer.

2. The composite matrix according to claim 1, characterized in that, The texture layer is formed by imprinting with an imprinting solution, which includes acrylic resin.

3. The composite matrix according to claim 1, characterized in that, The composite substrate further includes a transition layer disposed between the textured layer and the conductive layer, the transition layer comprising a bridging metal material, the bridging metal material comprising one or more of nickel and molybdenum.

4. The composite matrix according to claim 1, characterized in that, The composite substrate further includes a protective layer disposed on the side of the conductive layer opposite to the textured layer. The protective layer includes a wear-resistant metal material, which includes one or more of nickel, chromium, and titanium.

5. The composite matrix according to claim 1, characterized in that, The substrate layer includes at least one fiber reinforcement layer, and the at least one fiber reinforcement layer includes a resin matrix and a continuous fiber layer; The resin matrix fills the interior of the continuous fiber layer.

6. The composite matrix according to claim 5, characterized in that, When the substrate layer includes multiple fiber reinforcement layers, the multiple fiber reinforcement layers are stacked at a preset angle.

7. A method for preparing a composite matrix, characterized in that, include: Provide a substrate layer; A printing liquid is sprayed onto the surface of the substrate layer to form a textured structure with a preset depth, which is then cured under a first preset condition to form a textured layer. Under the second preset condition, a conductive layer is formed by coating on the side of the textured layer where the textured structure is provided.

8. The method for preparing the composite matrix according to claim 7, characterized in that, The first preset conditions include: In the first stage, level the surface at a temperature of 20-30℃ for 3-6 minutes; The second stage involves drying at 50-60℃ for 5-8 minutes. The third stage, at 750-1000 mJ / cm 2 Under the curing energy, the curing process is carried out; And / or, the second preset condition includes: At a vacuum degree of 10 -3 -10 -4 Under the condition of Pa, maintain for 4-10 minutes.

9. The method for preparing the composite matrix according to claim 7, characterized in that, Before depositing a conductive layer on the side of the textured layer where the textured structure is provided, under the second preset conditions, the preparation method further includes: Under the third preset condition, a coating is applied to the side of the textured layer where the texture structure is provided to form a transition layer.

10. The method for preparing the composite matrix according to claim 7, characterized in that, The preparation method further includes: Under the fourth preset condition, a protective layer is formed by coating the conductive layer on the side opposite to the textured layer.

11. A housing, characterized in that, The shell is prepared from a composite matrix prepared by any of the composite matrixes described in claims 1-6 or any of the composite matrixes described in claims 7-10.

12. An electronic device, characterized in that, The electronic device includes the housing as described in claim 11.

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